WO2005001456A1 - パターン比較検査方法およびパターン比較検査装置 - Google Patents
パターン比較検査方法およびパターン比較検査装置 Download PDFInfo
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- WO2005001456A1 WO2005001456A1 PCT/JP2004/009503 JP2004009503W WO2005001456A1 WO 2005001456 A1 WO2005001456 A1 WO 2005001456A1 JP 2004009503 W JP2004009503 W JP 2004009503W WO 2005001456 A1 WO2005001456 A1 WO 2005001456A1
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- area
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- image
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Definitions
- the present invention compares repetitive patterns with each other in patterns having repetitive patterns repeated at a predetermined period (pitch).
- the present invention relates to a pattern comparison inspection method and apparatus for detecting the presence or absence of a defect, etc.
- the present invention relates to an appearance inspection method and apparatus for sequentially comparing and inspecting.
- the formed pattern is imaged to generate image data, and the image data is analyzed to inspect the presence or absence of a defect in the pattern.
- a photomask inspection apparatus for inspecting a photomask and an appearance inspection apparatus for inspecting a pattern formed on a semiconductor wafer are widely used.
- the present invention is applicable to inspection of any pattern as long as a basic pattern such as a photo mask pattern is repeated, but in the following description, the pattern formed on the wafer is The description will be made by taking image data obtained by imaging optically as an example.
- FIG. 27 shows a state in which the semiconductor chip 20 1 is formed on the semiconductor wafer 200.
- a semiconductor chip 201 is called a die, so this term is also used here.
- the image data obtained by imaging the pattern formed in the middle process is analyzed, and the layer having the serious defect is removed and re-formed, or the defect information is fed-packed into the manufacturing process. It has been done to improve the yield.
- a visual inspection device (inspection machine) is used for this purpose.
- FIG. 28 is a diagram showing a schematic configuration of a conventional appearance inspection apparatus. As shown in FIG. 28 Ueno, 200 is held on stage 21 1. The illumination light from the light source 214 is converged by the condenser lens 125, reflected by the half mirror 213, and then passes through the objective lens 212 to illuminate the surface of the wafer 200. An optical image of the surface of the illuminated wafer 200 is projected onto the imaging device 216 by the objective lens 212 (for example, Japanese Patent Application Laid-Open No. 2002-324).
- the imaging device 216 converts an optical image into an image signal which is an electrical signal.
- the image signal is digitized, converted into image data, and stored in image memory 2 17.
- the image processing unit 2 1 8 processes the image data stored in the image memory 2 1 7 to check the presence or absence of a defect.
- the control unit 219 controls the respective units of the apparatus such as the stage 2 1 1, the image memory 2 1 7 and the image processing unit 2 1 8.
- the pattern of the semiconductor device is very fine, and the appearance inspection device is required to have a very high resolution. Therefore, a one-dimensional image sensor is used as an imaging device, and the stage 21 1 is moved (scanned) in one direction, and the image data is sampled by sampling the output of the imaging device in synchronization with the scanning. It has gained.
- the width H on the wafer capable of imaging is smaller than the width of the die 201, for example, as shown in FIG.
- another portion of each die is sequentially scanned to obtain image data of all portions of each die.
- scanning can be performed to obtain image data, and at the same time, the comparison with the image data of the corresponding part of the other die obtained in the previous scan can be performed simultaneously, thereby improving throughput.
- the method of scanning is not limited to this, and various proposals have been made.
- FIG. 29 is a diagram for explaining the operation of comparing image data between adjacent dies.
- dies A, B, C, and D are arranged as shown in FIG.
- Image data is expressed in units of pixels 210.
- image data (pixel data) of corresponding pixels of dies B and C are compared. For example, compare the pixel data of the first column of rows a of dies B and C.
- the comparison of pixel data between dies is as follows: A and B, B and C, and C, D, and so on. Pixel data is generated and stored sequentially from the end die, and pixel data of a newly generated die is generated immediately before. It is generally performed by comparison with the stored pixel data of the die. By comparing in this way, the dies in the central part other than the dies at both ends are compared twice with two adjacent dies, and if the comparison results do not match twice, it is judged as abnormal (with defects). Be done. Such comparison between dies is called die-to-die comparison.
- a semiconductor memory or the like has a configuration in which basic units called cells are repeated, and a pattern for that purpose also has a configuration in which basic patterns corresponding to cells are repeated.
- FIG. 30 is a diagram for explaining the cell, and as shown in the drawing, the cell 2 3 1 is repeatedly disposed in the die 2 0 1.
- defects are obtained by comparing pixel data of corresponding portions between adjacent cells without performing die-to-die comparison as described above. To determine the presence or absence of And will be done. This is called cell-to-cell comparison.
- pixel data is generated and stored sequentially from the end cell as in the die-to-die comparison described above, and pixel data of a newly generated cell is generated and stored immediately before. It is generally performed by comparison with pixel data. Disclosure of the invention
- the cell-to-cell comparison is performed only in the pattern in the inspection area 233, and the repetitive pattern outside the inspection area 233 is inspected by the die-die comparison.
- the repetitive pattern area 223 is formed with a high pattern density, and the peripheral circuit pattern outside the repetitive pattern area 223 is formed with a low pattern density, the pattern in the repetitive pattern area 223 is dark. The peripheral circuit pattern is detected brightly.
- the present invention provides a pattern comparison inspection method and apparatus for comparing repetitive patterns in a test pattern having repetitive pattern areas to inspect the presence or absence of a pattern defect. The purpose is to expand the inspection area to be compared as much as possible within the repetitive pattern area.
- an image signal of the position to be judged is selected by selecting the position to be judged whether to be included in the inspection I area. And an image signal at a position separated by an integer multiple of the pitch repeatedly from the position to be determined, and when the comparison result is within a predetermined threshold, an inspection area including the position to be determined within the inspection area It will be set.
- FIG. 1 is an explanatory view of the principle of the pattern comparison inspection method according to the present invention
- FIG. 2 is a flowchart of the pattern comparison inspection method according to the first embodiment of the present invention.
- a repetitive pattern 2 which is a cell is repeatedly formed at a predetermined repetitive pitch.
- an imaging means such as a one-dimensional image sensor is scanned to obtain image data of a region of the die 1.
- step S103 a position to be determined which determines whether or not to be included in the inspection area is selected from any position in the image data of the ABA 'B' area.
- the positions to be determined are selected at positions separated X 1 and X 2 respectively from the end of the die 1.
- step S105 the image signal (pixel block) at the determined position is compared with the image signal at a position separated by an integral multiple of the repetition pitch of the repetitive pattern inward from the determined position.
- comparison between pixel blocks is performed, for example, by setting the number of pixels whose difference in grayscale value between corresponding pixels in the pixel block is larger than a threshold for comparison between predetermined pixel values. It is a comparison result.
- the integer defining the interval between the position to be determined and the position separated by an integer multiple of the repetition pitch may not be the same as the integer defining the cell interval of the cell-cell comparison.
- steps S 1 07 and S 1 0 9 the value of the comparison result is determined while being repeatedly shifted in the predetermined direction of either the outer direction (or the inner direction) of the repetition region 3 repeatedly.
- a position X p which is larger (or smaller) than the pixel number of the threshold value t h is detected.
- the comparison value of the result is determined a region of small Kunar such determination target position than a predetermined threshold value t h, by setting it into the examination region, the pattern area 3 Repeat examination region Possible at It can be expanded as much as possible.
- the value of the comparison result is the boundary of the repetitive pattern area 3
- the position X p changes (increases) rapidly.
- the position to be judged to determine whether or not to be included in the inspection area is selected while being shifted by a predetermined distance in the pattern to be inspected.
- the image signal at the position is compared with the image signal at a position separated by an integer multiple of the pitch repeatedly from the position to be judged, and when the change in the comparison result is larger than a predetermined threshold value, the position to be judged Set as the boundary of the inspection area.
- FIG. 3 is a flowchart according to the second embodiment of the present invention.
- step S I14 the contents of the memory means for storing the previous comparison result are set to the initial values.
- This storage means is used to calculate the amount of change or the rate of change of the comparison result by comparing the previous comparison result with the current comparison result.
- the image data of the ABA and B 'regions of the die 1 are acquired in step S101, and the judgment is made in step S103.
- the position is selected from any position in the image data of ABA, B, area, and in step S105, the image signal (pixel block) of the determined position and the repeated pattern inward from the determined position. Repeatedly compare with an image signal at an integer multiple of the pitch.
- step S107 the amount of change or rate of change to the comparison result obtained in step S105 is calculated from the comparison result stored in the storage means, and the amount of change or rate of change in the comparison result is predetermined. to equal to or less than a threshold t v. If the change amount or change rate of the comparison result is predetermined If it is less than the threshold value t v , the comparison result obtained in step S 105 is stored in the storage means in step S 115 to calculate the next change amount or change rate.
- the position to be determined is repeatedly shifted in one of the predetermined directions in the outward direction (or inward direction) of the area 3. Thereafter, the process returns to step S 1 0 5 and repeats steps S 1 0 5, S 1 0 7, S 1 1 5 and S 1 0 9.
- step S 1 07 if the rate of change in the comparison result is not less than the predetermined threshold value t v , the current judgment position in step S 1 1 1 is regarded as the boundary of the inspection area. Set up and define the inspection area.
- the step S 1 0 comparison result in 7 variation or rate of change instead of to equal to or less than a predetermined threshold value t v the variation or the rate of change of the comparison result is maximum not If it is determined that the amount of change or the rate of change of the comparison result is the largest, the current judgment position may be set as the boundary of the inspection area in step S111.
- the comparison result of the previous loop S105, S107, S115, S109
- the amount of change in the comparison result or the maximum value of the rate of change may be stored.
- step S 115 when storing the comparison result acquired in S 105 in step S 115, the amount of change or the change rate of the comparison result calculated in step S 107 is stored in the storage means. If it exceeds the maximum value of the comparison result or the maximum value of the change rate, the maximum value of the change amount or the change rate of the comparison result stored in the storage means is updated. It is good.
- an image of an inspection pattern having a repetitive pattern area in which a repetitive pattern is repeatedly formed at a predetermined repetitive pitch is captured, and a repetitive pitch is obtained.
- a pattern comparison inspection method for detecting a defect of an inspection pattern by comparing image signals at positions separated by an integer multiple of 1 and separated by an integer number of pixels of an integer multiple of a repetition pitch of a captured image of the inspection pattern.
- a defect candidate map generation step of obtaining a defect candidate for each pixel of the captured image of the inspection pattern by the defect candidate detection step and generating a defect candidate map.
- a reference range selection step of selecting a reference range of a predetermined size in the defect candidate map, and the inspection range determination step includes the number of defect candidates included in the reference range or the selected reference range.
- the inspection range may be determined by including those in which the ratio of defect candidates occupying the reference range is less than a predetermined second threshold.
- an image of an inspection pattern having a repetitive pattern area in which a repetitive pattern is repeatedly formed at a predetermined repetitive pitch is captured,
- the reference range of the predetermined size of Of the selected reference ranges, the number of defect candidates included in the reference range or the proportion of defect candidates occupying the reference range is smaller than a predetermined second threshold value. It has an inspection range determination step of determining the position related to the direction in the inspection range, and a detection step of detecting a defect of the pattern to be inspected in the inspection range.
- a defect candidate map generation step of obtaining defect candidates for each pixel of the captured image of the inspection pattern in the defect candidate detection step and generating a defect candidate map.
- a reference range selection step of selecting a reference range of a predetermined size in the defect candidate map, and the inspection range determination step includes the number of defect candidates included in the reference range of the selected reference range.
- the pattern comparison inspection apparatus is a position determination means for selecting a position to be determined which determines whether or not to be included in the inspection area, from any of the patterns to be inspected.
- the image comparison means for comparing the image signal of the judgment position with the image signal of the position repeatedly separated by an integer multiple of the pitch from the judgment position, and the comparison result of the image comparison means is within a predetermined threshold.
- the inspection area setting means is included to set the inspection area by including the determined position in the inspection area.
- the pattern comparison inspection apparatus selects the position to be determined which determines whether or not to be included in the inspection area while shifting the predetermined position by a predetermined distance in the inspection pattern.
- An image acquired while the position to be determined is shifted by a predetermined distance, and the image comparing means for comparing the image signal of the position to be determined with the image signal of the position repeatedly separated from the position to be determined by an integer multiple of the pitch Comparison of comparison means
- the inspection area setting means sets the judgment position as the boundary of the inspection area when the change of the result becomes larger than the predetermined threshold.
- a pattern comparison inspection apparatus is an imaging means for imaging an image of an inspection pattern having a repetitive pattern area in which a repetitive pattern is repeatedly formed with a predetermined repetitive pitch, and imaged.
- pattern comparison means for comparing image signals at positions separated by integer multiples of repetitive pitches
- defect detection means for detecting a defect of the inspection pattern based on the comparison result
- a defect candidate map is generated by obtaining a defect candidate for each pixel of the captured image of the inspection pattern by the defect candidate detection means.
- the method may include: generating means; and reference range selecting means for selecting a reference range of a predetermined size in the defect candidate map.
- the inspection range determination means the number of defect candidates included in the reference range or the ratio of defect candidates included in the reference range out of the selected reference range is greater than a predetermined second threshold value. The few items may be included in the scope of inspection and decided.
- a pattern comparison inspection apparatus is an imaging means for imaging an image of an inspection pattern having a repetitive pattern area in which a repetitive pattern is repeatedly formed at a predetermined repetitive pitch, and imaged.
- pattern comparison means for comparing image signals at positions separated by integer multiples of repetitive pitches
- defect detection means for detecting a defect of the inspection pattern based on the comparison result
- imaging of the inspection pattern The difference between pixel values separated by the number of pixels of the integer multiple of the repetition pitch of the image is compared with a predetermined first threshold, and pixels exceeding the first threshold are determined as defect candidates.
- the defect candidate detection means to be detected and the reference range of the predetermined size in the captured image of the pattern to be inspected are selected while changing the position in the predetermined direction.
- the number of defect candidates included in the reference range or the percentage of defect candidates in the reference range is less than a predetermined second threshold, but the position in the predetermined direction is the inspection range.
- An inspection range determining means to be included and determined is provided, and the defect detection means performs defect detection of the inspection pattern within the inspection range.
- a defect candidate map is generated by obtaining a defect candidate for each pixel of the captured image of the inspection pattern by the defect candidate detection means.
- inspection range selection means for selecting a reference range of a predetermined size in the defect candidate map while changing the position in the predetermined direction, and the inspection range determination means comprises the selected reference range.
- the number of defect candidates included in the reference range or the proportion of defect candidates occupying the reference range is less than a predetermined second threshold, but the position in a predetermined direction is to be included in the inspection range and determined. Good.
- the cell area formed in the die is repeated.
- the pattern area is set as the pattern area, and the inspection range of the pattern comparison inspection in the cell area in the die is set.
- the pattern comparison inspection method and apparatus according to the present invention are repeated on the die area formed on the wafer.
- the pattern area may be used to set the inspection range of pattern comparison inspection of the die area.
- the present invention in a pattern comparison inspection in which repetitive patterns are compared with each other in a pattern to be inspected to inspect the presence or absence of a pattern defect, it is possible to enlarge the inspection area for comparing repetitive patterns as much as possible. it can.
- the inspection range is set using defect candidates detected for defect inspection. By making the determination, it is possible to save the amount of comparison calculation of the pixel values of the captured image performed to determine the inspection range, which contributes to the improvement of the inspection speed.
- FIG. 1 is a diagram for explaining the principle of the pattern comparison inspection method according to the present invention.
- FIG. 2 is a flowchart of the pattern comparison inspection method according to the first embodiment of the present invention.
- FIG. 3 is a flowchart of the pattern comparison inspection method according to the second embodiment of the present invention.
- FIG. 4 is a schematic block diagram of a pattern comparison inspection apparatus according to the first embodiment of the present invention.
- FIG. 5 is a flowchart (No. 1) of the pattern comparison inspection method according to the first embodiment of the present invention.
- FIG. 6 is a front view of a pattern comparison inspection method according to the first embodiment of the present invention.
- the graphic is an explanatory view of the setting state of the temporary area provided on the inspection pattern having the repetitive pattern area.
- FIG. 8 is an explanatory diagram of an imaging method of an inspection pattern having a repetitive pattern area.
- FIG. 9A and FIG. 9B are diagrams showing an image signal of a captured inspection pattern
- FIG. 9C is a graph showing changes in values of comparison results with movement of the determined position.
- FIGS. 10A and 10B are diagrams showing a state in which a defect image is included in the image signal of the imaged inspection pattern.
- FIG. 11 is a flowchart (No. 3) of the pattern comparison inspection method according to the first embodiment of the present invention.
- FIG. 12 is a flowchart (No. 4) of the pattern comparison inspection method according to the first embodiment of the present invention.
- Fig. 13 A, Fig. 13 B and Fig. 13 D show the image signal of the imaged examination pattern
- Fig. 13 C shows the value of the comparison result with the movement of the judgment position. It is a graph which shows change.
- FIG. 14 is an explanatory diagram of a storage method of a captured image of an inspection pattern.
- FIG. 15 is a flow chart (part 1) of the pattern comparison inspection method according to the second embodiment of the present invention.
- FIG. 16 is a flow chart (part 2) of the pattern comparison inspection method according to the second embodiment of the present invention.
- FIG. 17 is an explanatory diagram of the setting state of the temporary area provided on the inspection pattern in the second embodiment.
- FIG. 18 A and Fig. 18 B are diagrams showing the image signal of the imaged inspection pattern
- Fig. 18 C is a dalaff showing a change in the value of the comparison result with the movement of the determined position.
- FIG. 19A is a diagram showing a repetitive pattern area having a defect
- FIG. 19B is a graph showing changes in values of comparison results.
- FIG. 20 is a schematic block diagram of a pattern comparison inspection apparatus according to a third embodiment of the present invention.
- FIG. 21 is a flowchart of the pattern comparison inspection method according to the third embodiment of the present invention.
- Fig. 2 2A is a diagram showing an image signal of a captured inspection pattern
- Fig. 2 2B is a diagram showing an image signal delayed from Fig. 2 2A
- Fig. 2 2C is a diagram showing Fig. 2 2A
- FIG. 22 is a view showing a defect map image signal based on the difference of FIG. 2B
- FIG. 22 is a view showing an entire defect map image signal.
- FIG. 23A is a diagram showing a defect map image signal
- FIG. 23B is a graph showing a change in the number of defect candidates included in the reference range in the X direction.
- FIG. 24 is a schematic view of a pattern comparison inspection apparatus according to a fourth embodiment of the present invention.
- FIG. 25 is a flowchart of the pattern comparison inspection method according to the fourth embodiment of the present invention.
- FIG. 26 is an explanatory diagram of a pattern comparison inspection method according to a fourth embodiment of the present invention.
- FIG. 27 is a diagram showing an array of semiconductor chips (dies) formed on a semiconductor wafer and a locus at the time of inspection.
- FIG. 28 is a schematic block diagram of an appearance inspection apparatus for inspecting a die formed on a semiconductor wafer.
- FIG. 29 is a diagram for explaining die-to-die comparison.
- FIG. 30 is an explanatory view of the cells in the die, the repetitive pattern area, and the inspection area.
- BEST MODE FOR CARRYING OUT THE INVENTION hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
- FIG. 4 is a schematic configuration view of a pattern comparison inspection apparatus according to a first embodiment of the present invention.
- the pattern comparison and inspection apparatus 10 has a stage 21 for holding a wafer 22 on which a circuit pattern or the like including a repetitive pattern such as a memory cell is formed, and a one-dimensional image for imaging a pattern formed on the wafer 22.
- the stage 21 In order to image the pattern of the entire surface of the wafer 2 by the imaging means 20 such as a single sensor and the imaging means 20, the stage 21 is moved so that the imaging means 20 moves on the wafer 22.
- stage control unit 2 9.
- the pattern comparison inspection apparatus 10 also includes an AZD converter 23 that converts the captured analog image signal into a digital image signal, and an image memory 24 that stores the converted digital image signal pattern.
- a die comparing section 25 comparing the pattern formed on the wafer 22 based on the stored image signal pattern with a die comparing section 25 and a cell comparing section 26 comparing cells with a cell;
- a defect detection unit 2 7 for detecting a defect and a result output unit 2 8 for outputting the detected result are provided.
- the pattern comparison and inspection apparatus 10 is provided with means for setting an inspection area in which the cell comparison unit 26 performs cell-to-cell comparison in the captured pattern. It includes an area setting unit 40, a position to be determined selection unit 41, an image comparison unit 42, and an inspection area setting unit 43.
- the control unit 46 is also provided with position data indicating each position of the pattern formed on the wafer 22. Based on the position data, the control unit 46 controls the wafer on the repetitive pattern area 3 on the wafer. The position is calculated and supplied to the temporary area setting means 40.
- FIG. 5 is a flowchart of the pattern comparison inspection method according to the first embodiment of the present invention for explaining the operation of the pattern comparison inspection apparatus 10.
- step S 1 3 boundary lines 5 1 and 5 are applied to repetitive pattern area 3 in which repetitive pattern 2 is repetitively formed and included in die 1 formed on wafer 2 2 as shown in FIG. 7.
- X direction and Y direction are as shown in Fig.7.
- the position of the repetitive pattern area 3 calculated by the control unit 46 is calculated from the CAD data etc. used when forming the pattern on the wafer 22, the above-described apparatus Due to the influence of the error, an error may be generated with the imaging position on the image data imaged by the imaging means 20. Even if there is such an error, the X-direction temporary region is located inside the repeated pattern region 3 given by the control unit 46 so that the temporary region is always included in the repeated pattern region 3 and Set a margin at the end. This margin is determined according to the machine accuracy of stage 21 and so on.
- step S 13 3 the imaging means 20 is scanned to capture an image of the pattern formed on the die 1.
- the X axis is set in the scanning direction of the imaging means 20 on the wafer 2 2 plane
- the Y axis is set in the direction perpendicular to the scanning direction.
- the scanning by the imaging means 20 is the imaging size
- step S1305 a position to be determined for determining whether or not to be included in the inspection area is set in the X-direction temporary area.
- the determined position is the distance X from the end of die 1. It shall be provided at the position of
- step S137 the pixel array block 61 of the captured image at the determined position is compared with the pixel array block 62 at a position separated by an integral multiple of the repetition pitch ( X ⁇ ).
- the comparison between pixel blocks is, for example, to calculate the number of pixels whose difference between the drop scale values of corresponding pixels in the pixel block is larger than the threshold value for comparison between predetermined pixel values. It is a comparison result.
- step S 1 3 9 the value of the comparison result is compared with a predetermined threshold pixel number t h . Since the judgment position is currently in the X-direction temporary area (step S 1 3 7), the pixel row block 6 1 and the pixel row block 6 2 are both in the repetitive pattern region 3 and both are It is an image obtained by imaging the same part of repeat pattern 2. Therefore, the value of the comparison result decreases as shown in Fig. 9C, and falls below the predetermined threshold.
- step S 14 the position to be determined is repeatedly moved by ⁇ X in the outward direction of the pattern region 3 repeatedly, and the process moves to step S 1 37. Steps S 13 to S 14 1 are repeated because the value of the comparison result is less than or equal to the predetermined threshold value until the position to be determined reaches the position x p which is the boundary of the repetitive pattern area 3. .
- FIG. 9B is a diagram showing a state in which the to-be-determined position has reached the position X p which is the boundary of the repetitive pattern area 3.
- step S 1 37 comparing the pixel array block pattern 6 1 of the captured image at the determination position with the pixel array block 6 2 at a position separated by an integral multiple of the repetition pitch ( ⁇ ⁇ ), Since the position to be judged is at the boundary of the repetitive pattern area 3, the value of the comparison result sharply increases bordering on this boundary, as shown in FIG. Leading to more than a sea urchin predetermined threshold value t h by that shown in C.
- step S 1 3 9 it is determined that the value of the comparison result exceeds a predetermined threshold t h in step S 1 3 9, the (current determination target position likelihood first predetermined in FIG width delta X), the boundary of the inspection area And set (step S 1 4 3).
- the result of comparison between the pixel array block 6 1 of the captured image at the determination position and the pixel array block 6 2 at a position separated by an integral multiple of the repetition pitch ( ⁇ ⁇ ) is the threshold. Since the image of the pixel row block 61 may contain some noise at a position X p beyond the value t h , the inside of the pattern area 3 by a predetermined number of pixels from the position x P The position shifted in the direction may be reset as the boundary of the actual inspection area.
- step S145 the die comparison unit 25 and the cell comparison unit 26 perform die-to-die comparison based on the image signal outside the set inspection area, and the image signal in the set inspection area Make a cell-to-cell comparison based on
- the pixel row block of the captured image at the position to be judged before the position to be judged reaches the boundary of the pattern area 3 6
- the value of the comparison result between 1 and the pixel position block 6 2 at a position separated by an integer multiple of the judgment position and the repetition pitch exceeds a predetermined threshold value t h and is inside the boundary of the pattern area 3
- the boundary of the inspection area will be set by the position X d of.
- the boundary of the inspection area is determined by the scanning position of the imaging means 20 (in the example of FIG. 8, the scanning position is S l, S 2 or S 3
- the inspection area boundary position differs depending on whether it is any of the above, and the inspection area to be set will have asperities such as a continuous straight line 64 shown in FIG. there
- the boundary position between the set inspection area and the boundary position of the given pattern area 3 or the boundary position of the temporary area in the X direction and the ⁇ difference is possible to detect a defect 63 present at the boundary of the pattern area 3.
- the inspection area setting means 43 outputs the boundary position of the inspection area set for each scanning position by the inspection area output means 45 to the control unit 46 having the display device. Further, the inspection area setting means 4 3 determines the difference G x between the set inspection area boundary positions, the boundary position of the set inspection area and the boundary position of the given pattern area 3 or the boundary position of the X direction temporary area When the difference between the above and the above becomes equal to or greater than a predetermined value, the error output means 4 4 outputs a defect output signal to the result output unit 28.
- the inspection area setting means 4 3 is an image signal having a width of (the distance from the die 1 end to the temporary area boundary ⁇ 51 + the repetition pitch (X ⁇ ) of one repetition pattern) If there is, you can set the inspection area boundary on the cell-cell comparison start position side. Therefore, even before acquisition of one full run eyelid image 60 is completed, inspection area setting may be performed by the inspection area setting means 43 immediately after acquiring this necessary amount of image signals.
- the value of the comparison result is It rapidly changes (increases) at the boundary position x P.
- step S 1 3 9 it is determined in step S 1 3 9 that the value of the comparison result exceeds the predetermined threshold value t h, and the value of the comparison result is determined in step S 1 4 3.
- the judgment position may be set as the boundary of the inspection area.
- step S 14 7 the contents of the memory means for storing the previous comparison result are set to the initial values.
- This storage means is used to calculate the amount of change or the rate of change of the comparison result by comparing the previous comparison result with the current comparison result.
- the X direction temporary area is set in step S 1 31, and the imaging unit 20 is scanned in step S 1 3 3 to form the pattern on the die 1.
- An image is captured, and a determination position for determining whether or not the image should be included in the examination region in step S135 is set in the X-direction temporary region, and the determination position is determined in step S137.
- the pixel row block 6 1 is compared with the pixel row block 6 2 at a position separated by an integral multiple of the repetition pitch ( ⁇ ⁇ ) from the determined position.
- step S 1 48 the comparison result stored in the storage means (ie, the comparison result obtained in step S 1 37 in the previous loop) is obtained from step S 1 3 7 (of the current loop) calculating a change amount or rate of change of the comparison result, the change amount or the rate of change of the comparison result is equal to or less than a predetermined threshold t v. If the comparison result of the change amount or the change rate is below a predetermined threshold value t v, obtained in step S 1 3 7 for Oite succeeding calculation of the change amount or the change rate in step S 1 4 9 The comparison result is stored in the storage means, and the judgment position is repeatedly shifted in the outward direction of the area 3 in step S 14 1. After that Return to step S 13 7 and repeat the steps of steps S 13 7, steps S 14 8, steps S 14 9 and step S 11.
- step S 1 48 if the amount of change or the rate of change in the comparison result is not less than a predetermined threshold value t v , then in step S 1 4 3 the current determined position is the boundary of the inspection area. Set as and determine the inspection area. Thereafter, in step S145, the die comparison unit 25 and the cell comparison unit 26 perform die-to-die comparison based on the image signal outside the set inspection area, and use the image signal in the set inspection area as the image signal. Based on the cenorace cenoure comparison.
- FIG. 5 an attempt is made to enlarge the inspection area in the scanning direction (X direction) of the imaging means 20.
- an image acquired at the scanning position S.sub.1 or S.sub.3 shown in FIG. Like image data, when the image data acquired by the imaging device 20 includes the boundary position of the pattern area 3 in the Y direction, the same applies to the direction (Y direction) perpendicular to the scanning direction of the imaging device 20.
- the examination area can be expanded.
- Figure 1 1 shows the flowchart.
- step S 15 as shown in FIG. 7, a Y direction temporary area bounded by the boundary lines 5 3 and 5 4 is set for the repetitive pattern area 3. Similarly to the X-direction temporary area, the Y-direction temporary area is set inside the repeated pattern area 3 and with a margin at the end.
- step S 15 3 The boundary 64 of the inspection area to start the cell-cell comparison in the X direction is determined by the method of FIG. In this case, it may be determined after acquiring all of the scanned images 60 for one scan and storing them in the image memory 24.
- Area boundary When the image signal of width of 1 to distance of 1 + repeat pitch (one repetition pattern) is acquired, the inspection area boundary on the cell-cell comparison start position side is set, and the inspection throughput May be improved.
- Step S 1 3 from the boundary 6 4 in the X-direction detection ⁇ region starts Seruseru comparison, the image data having a predetermined pixel row width w s is waiting to be imaged to obtain image data.
- An image signal 60 of image data having a predetermined pixel row width w s is shown in FIG. 13A.
- the Y-direction inspection area is sequentially set for each pixel row width w s .
- step S135 a position to be determined for determining whether or not to be included in the inspection area is set in the Y-direction temporary area.
- the determined position is the distance y from the end of the die 1. It shall be provided at the position of
- step S137 the pixel row block 71 of the captured image at the determined position is compared with the pixel row block 72 at a position separated by an integer multiple of the repetition pitch ( y ⁇ ).
- step S 1 3 9 the comparison result value is compared with a predetermined threshold value t h .
- the position to be judged is in the Y-direction temporary area (step S 1 35)
- the value of the comparison result becomes less than a predetermined threshold value as shown in FIG.
- the position to be judged is repetitively moved by A y in the outward direction of the pattern area 3 repeatedly, and the process moves to step S 13. Steps S 13 to S 14 1 are repeated until the determined position reaches the position yp which is the boundary of the repetitive pattern region 3.
- Figure 1 3 B is a diagram showing a state that led to the position y p is a repeated pattern region 3 boundary determination target position.
- the determined position corresponds to the repetitive pattern area. Since the 3 boundary, the value of the comparison results increases rapidly with this as a boundary, as shown in FIG. 1 3 C leads to exceeding the predetermined threshold value t h.
- step S 1 3 9 it is determined that the value of the comparison result exceeds a predetermined threshold t h in step S 1 3 9, as shown in FIG. 1 3 D (current determination target position - a predetermined shift width delta y) Is set as the boundary 6 5 of the inspection area (step S 1 4 3).
- the threshold value is obtained by comparing the pixel row block 7 1 of the captured image at the determination position with the pixel row block 7 2 at a position separated by an integral multiple of the repetition pitch (y ⁇ ).
- the image of the pixel column block 7 1 may contain some noise, so a position shifted inward of the pattern area 3 by a predetermined number of pixels from the position y P It may be reset as the boundary of the actual inspection area.
- steps S 13 3 to S 14 3 are sequentially repeated to set a Y direction inspection area. To go. Or Steps S133 to S143 are performed only once for data of width w s from X direction inspection area boundary 64, and all other inspection areas that follow the Y direction inspection area obtained here It may be set as
- step S145 the die comparison unit 25 and the cell comparison unit 26 sequentially perform die-to-die comparison based on the image signal outside the set inspection area as soon as the image data necessary for comparison is captured. Perform cell-to-cell comparison sequentially based on the image signal in the set inspection area.
- the value of the comparison result is the boundary position of the repetitive pattern area 3. It rapidly changes (increases) on position yp.
- step S 14 3 the value of the comparison result exceeds the predetermined threshold value t h .
- the amount or rate of change from the comparison result of the previous loop to the comparison result of the current loop exceeds a predetermined threshold value. It may be determined whether or not the amount of change or the rate of change exceeds a predetermined threshold value, and the position to be determined may be set as the boundary of the inspection area.
- a flowchart of the pattern comparison inspection method according to the first embodiment of the present invention for explaining the operation of such a pattern comparison inspection apparatus 10 is shown in FIG.
- step S 14 7 the contents of the memory means for storing the previous comparison result are set to the initial values. This storage means is used to calculate the amount of change or the rate of change of the comparison result by comparing the previous comparison result with the current comparison result.
- step S 15 a Y-direction temporary area is set, and in step S 15 3, cell-cell comparison in the X direction is performed according to the method of FIG.
- the boundary 64 of the inspection area to start the process is determined, and the imaging means 20 is scanned in step S13 3 to capture an image of the pattern formed on the die 1, and the inspection area is determined in step S135.
- step S 1 37 the pixel array block 7 1 at the target position, the target position and the repetition pitch
- the pixel array block 7 2 at a position separated by an integer multiple of (y ⁇ ) is compared.
- step S 1 48 the comparison result stored in the storage means (ie, the comparison result obtained in step S 1 37 in the previous loop) is obtained from step S 1 3 7 (of the current loop) calculating a change amount or rate of change of the comparison result, the change amount or the rate of change of the comparison result is equal to or less than a predetermined threshold t v.
- Change amount of comparison result or The long change rate is less than a predetermined threshold value t v, stored in the storage means a comparison result obtained in step S 1 3 7 for the calculation of Oite next change rate step S 1 4 9
- the position to be judged is repeatedly shifted in the outward direction of the area 3 in step S 14 1. Thereafter, the process returns to step S 1 3 7 and repeats the steps of step S 1 3 7, step S 1 4 8, step S 1 4 9 and step S 1 4 1.
- step S 1 48 if the rate of change in the comparison result is not less than the predetermined threshold value t v , then the current position to be determined in step S 1 4 3 is determined as the boundary of the inspection area. Set and determine the inspection area. Thereafter, in step S145, the die comparison unit 25 and the cell comparison unit 26 perform die-to-die comparison based on the image signal outside the set inspection area, and the image signal in the set inspection area Make a cell-to-cell comparison based on
- the current determination position may be set as the boundary of the inspection area in step S14.
- the comparison calculated in the loop executed in the past The amount of change in the result or the maximum value of the rate of change may be stored.
- step S 14 7 when storing the comparison result obtained in step S 14 7 in step S 14 9, the amount of change or the rate of change of the comparison result calculated in step S 14 8 is stored in the storage means. If it exceeds the maximum value of the comparison result or the maximum value of the change rate, the maximum value of the change amount or the change rate of the comparison result stored in the storage means is updated. It is good.
- the setting of the Y direction inspection area requires a scan image having a certain width at the time of setting.
- a sensor capable of imaging an image of the width once as the imaging unit 20 a distance from a boundary 3 of a given repetitive pattern region to a temporary region boundary 5 3 + a repetitive pattern repetition distance (y T ) 1 to include an image of the width.
- the scan image of the scan width of Z 1 times may be simultaneously stored in the image memory 24.
- the scanning locations S 1 to S 4, S 5 to S 8 and S 9 to S 12 are stored for 4 times each.
- Image data M 1, M 2 and M 3 can be stored in the storage memory 24.
- FIG. 15 is a flowchart of the pattern comparison inspection method according to the second embodiment of the present invention.
- the boundaries 51 and 52 and 53 and 54 of the X-direction temporary region and the Y-direction temporary region respectively described above are placed outside the repetitive pattern region 3.
- Set The schematic configuration of a pattern comparison inspection apparatus for executing the pattern comparison inspection method according to the second embodiment of the present invention is the same as that of the pattern comparison inspection apparatus 10 shown in FIG. It will
- step S 1 6 for the repetitive pattern area 3, Set an X-direction temporary area bounded by boundaries 51 and 52 shown in Fig.17. A Y-direction temporary area bounded by boundary lines 5 3 and 5 4 is set to the repetitive pattern area 3. As described above, each direction temporary area is set outside the repetitive pattern area 3 given by the control unit 46 and with a margin at the end.
- step S 16 3 the imaging means 20 is scanned to capture an image of the pattern formed on the die 1. The captured image signal 60 is shown in FIG. 18A.
- step S165 the position to be determined for determining whether or not to be included in the inspection area is set outside the X, Y direction temporary area.
- the determined position in the X direction is the distance X from the end of the die 1. It shall be provided at the position of.
- step S 1 67 the pixel array block 6 1 of the captured image at the determination position is compared with the pixel array block 6 2 at a position separated by an integer multiple of the determination position and the repetition pitch ( ⁇ ⁇ ). Do. At this time, a multiple of the repetition pitch ( ⁇ ⁇ ) is determined in accordance with the margin so that the position of the pixel array block 62 is within the repetition pattern area 3.
- step S 1 6 9 the value of the comparison result is compared with a predetermined threshold pixel number t h . Since the current position to be determined is outside the X-direction tentative area (step S 1 65), the pixel array block 61 is outside the repetitive pattern area 3. Therefore, when the pixel array block 6 1 and the pixel array block 6 2 in the repetitive pattern area 3 are compared, the value of the comparison result becomes larger as shown in FIG. 18 C, and the predetermined threshold value is obtained. value t h Redirecting a Kikunaru.
- step S 1 71 the position to be determined is repeatedly moved by ⁇ inward of the pattern region 3 repeatedly, and the process moves to step S 1 6 7 Ru. Since the value of the comparison result indicates a value larger than a predetermined threshold until the position to be determined reaches the position x p which is the boundary of the repetitive pattern area 3, steps S 1 6 7 to S 1 7 1 are repeated. It will be.
- FIG. 18B is a diagram showing a state in which the to-be-judged position has reached position X p which is the boundary of the repetitive pattern region 3.
- step S 1 67 comparing the pixel array block 6 1 of the captured image at the determination position with the pixel array block 6 2 at a position separated by an integral multiple of the repetition pitch (( ⁇ ), because the object position determination is in the repeated pattern region 3 boundaries, which was a boundary decreases the comparison result value rapidly, leading to below a predetermined threshold value t h as shown in FIG. 1 8 C.
- comparison of the resulting value is determined to be below a predetermined threshold value t h, the (current determination target position one predetermined shift width delta X) ⁇ , be ⁇ sectional as the boundary of the inspection area it can.
- the pixel array block 6 1 of the captured image at the determination position is an integral multiple of the determination position and the repetition pitch (X ⁇ ) the position pixel column block 6 2 and the comparison result is shifted to the inner side direction of the threshold t h a position x P I Ri also for the number of predetermined pixels below the pattern region 3 positions, actual test It may be reset as the boundary of the area.
- FIG. 19A shows a state in which a defect 63 exists near the boundary of the repetitive pattern area 3.
- the inspection area is merely narrowed as described in FIGS. 10A to 10B.
- the inspection area is set up outside the pattern area 3 repeatedly by mistake.
- the position to be judged is moved by the predetermined movement amount w d as it is, and it is confirmed that the value of the comparison result does not exceed the threshold value t h (S 17 3 to S 17 9).
- the position to be judged when the value of the result falls below the predetermined threshold value t h is set as the boundary of the inspection area (S 18 1).
- the position to be judged is checked when the value of the comparison result falls below the predetermined threshold value t h.
- this time from the comparison result of the previous loop It is determined whether the amount of change or the rate of change to the comparison result performed in the loop of the loop exceeds a predetermined threshold, and when the amount of change or the rate of change exceeds the predetermined threshold It may be set as a boundary of A flowchart of a pattern comparison inspection method according to the second embodiment of the present invention for explaining the operation of such a pattern comparison inspection apparatus 10 is shown in FIG.
- step S 184 the contents of the storage means for storing the previous comparison result are set to initial values. This storage means is used to compare the previous comparison result with the current comparison result to calculate the change amount or change rate of the comparison result.
- step S 16 an X-direction temporary region and a Y-direction temporary region are set for the repetitive pattern region 3.
- the imaging hand Step 20 is scanned to capture an image of the pattern formed on the die 1.
- step S165 the position to be determined for determining whether or not to be included in the inspection area is set outside the X-direction and Y-direction temporary regions.
- the judgment position is a distance x from the end of the die 1. It shall be provided at the position of
- step S167 the pixel array block pattern 6 1 of the captured image at the determination position is compared with the pixel array block 6 2 at a position separated by an integral multiple of the repetition pitch ( ⁇ ⁇ ).
- step S185 the comparison result stored in the storage means (that is, the comparison result obtained in step S1670 in the previous loop) is obtained from step S167 (of the current loop)
- the amount of change or the rate of change to the comparison result is calculated, and it is determined whether the amount of change or the rate of change of the comparison result is less than or equal to a predetermined threshold value t v i ′. If the amount of change or the rate of change of the comparison result is a predetermined threshold value t v ! If it is the following, store the comparison result acquired in step S167 in step S1806 for the calculation of the next amount of change or rate of change in the storage means; Repeat the judgment position in the inward direction of area 3. Thereafter, the process returns to step S 1 6 7 and repeats the steps of step S 1 6 7, step S 1 8 5, step S 1 8 6 and step S 1 7 1.
- step S185 if the change rate of the comparison result is not less than or equal to the predetermined first threshold value t v i, the position to be determined is moved as it is by the predetermined movement amount w d (S 1 7 3) Compare the image signal at the unjudged position with the image signal at a position separated by an integer multiple of the repetition pitch (S 1 75).
- step S1.73 the amount of change or the rate of change between this comparison result and the comparison result stored in the storage means is determined, and the amount of change in the rate of change is the second threshold value t. Confirmed not to exceed v 2 Above (S 1 8 7, S 1 8 9 and S 1 7 9), the to-be-determined position at which the value of the comparison result reaches the more than a predetermined threshold value t v 1, and the boundary of the inspection area To set (S 18 1).
- step S183 the die comparison unit 25 and the cell comparison unit 26 perform die-to-die comparison based on the image signal outside the set inspection area, and the image signal within the set inspection area is used as the image signal. Make a cell-to-cell comparison.
- FIG. 20 is a schematic block diagram of a pattern comparison inspection apparatus according to a third embodiment of the present invention.
- a circuit pattern or the like including a repetitive area such as a memory cell area formed on the wafer 22 is imaged, and the integer multiple of the repetition pitch of the imaged image is taken.
- the difference between the pixel values at different positions is compared with a threshold.
- a defect candidate map is obtained, in which pixels having differences larger than this threshold value are regarded as defect candidates, and among the entire range of the defect candidate map, a region where the frequency of appearance of defect candidates is smaller than a certain amount is determined as a repeated region.
- a large area is repeatedly determined to be out of the area, and defect detection is performed only in the determined repetitive area.
- the pattern comparison inspection apparatus 10 includes a stage 21 holding a wafer 22 on which a circuit pattern or the like including a repetitive pattern such as a memory cell is formed, and a one-dimensional image for imaging a pattern formed on the wafer 22.
- the stage 21 In order to image the pattern of the entire surface of the wafer 2 by the imaging means 20 such as a single sensor and the imaging means 20, the stage 21 is moved so that the imaging means 20 scans over the wafer 22.
- stage control unit 2 9 The pattern comparison inspection apparatus 10 also includes an AZD converter 23 that converts the captured analog image signal into a digital image signal, and a die that forms the converted digital image signal on the wafer 22.
- the difference value between the delay memory 8 1 to be delayed by the repetition pitch, the image signal output from the A / D converter 23, and the image signal delayed by the delay memory 8 1 is determined, and the difference value Based on the result of detection of a defect candidate by the die comparison unit 25 that is a defect candidate detection unit that detects pixels with a value larger than a predetermined threshold as a defect candidate and the die comparison unit 25,
- a defect candidate map generation unit 8 2 which generates a defect comparison map for die comparison indicating at which position in the captured image a defect candidate exists, and a defect candidate map for storing the generated defect candidate map for die comparison Mori 8 3 And have.
- the pattern comparison and inspection apparatus 10 further includes a delay memory 8 4 for delaying the converted digital image signal by the repetitive pitch of the cell which is a repetitive pattern, and an image output from the AZD converter 2 3
- a cell comparison which is a defect candidate detecting means for finding a difference value between the signal and the image signal delayed by the delay memory 84 and detecting a pixel whose difference value is larger than a predetermined threshold value as a defect candidate
- a cell comparison defect candidate map indicating which position in the captured image of the wafer 2 2 the defect candidate exists is generated
- a defect candidate map memory 8 6 for storing the generated cell comparison defect candidate map.
- the pattern comparison / inspection apparatus 10 selects the reference range selection unit 8 7 which selects a reference range of a predetermined size in the defect candidate map for cell comparison, and the reference selected by the reference range selection unit 8 7.
- the number of defect candidates included in the reference range or the number of defect candidates occupying the area of the reference range The ratio of the area comprises a test area determination unit 8 8 that determines the inspection range, including those less Ri second good threshold V 2 given.
- the pattern comparison inspection apparatus 10 determines whether the defect candidate included in the range of the inspection range determined in the cell comparison defect candidate map is a true defect portion.
- the defect candidate included in the cell comparison defect detection unit 90 and the portion corresponding to the outside of the inspection range determined in the die comparison defect candidate map is a true defect portion or not
- FIG. 21 is a flowchart of the pattern comparison inspection method according to the third embodiment of the present invention.
- the imaging means 20 images the pattern formed on the wafer 22.
- An example of the image 60 captured by the imaging means 20 is shown in FIG.
- step S 202 the delay memory 84 delays the captured image 60 by the repetition pitch of the cell that is the repetitive pattern.
- An example of the image 67 delayed by the delay memory 84 is shown in Fig. 22B.
- the cell comparison unit 26 calculates the difference value between the image signal (each pixel value) output from the A / D converter 23 and the image signal delayed by the delay memory 84.
- step S203 the cell comparison unit 26 determines whether the calculated difference value is larger than a predetermined threshold value. If the value is larger than the threshold value, the defect candidate map generation unit 85 selects the value of the pixel in the cell comparison defect candidate map corresponding to the position of this pixel portion in the captured image of the wafer 22 as the defect candidate. Set to “1” to indicate that it is a location (S 2 0 4). On the other hand, if it is smaller than the threshold value, it corresponds to the position of this pixel portion in the captured image of wafer 2 2 Set the pixel value in the cell comparison defect candidate map to “0” (S 2 0 5).
- the candidate defect map is a map 9 1 in which the appearance frequency of defect candidates is obviously different between the cell area 9 3 and the area 9 2 outside the cell area 9 3.
- the delay memory 8 1 delays the captured image by the repeat pitch of the die which is the repeat pattern, and the die comparison unit 25 receives the AZD converter 2 3 The difference value between each pixel value of the image signal output from the circuit and the image signal delayed by the delay memory 81 is calculated. Then, the defect candidate map generation unit 82 generates a die comparison defect candidate map.
- the reference range selection unit 87 selects a reference range 94, 95 of a predetermined size in the cell comparison defect candidate map.
- the reference range 94 used to determine the X-direction boundary position of the inspection range may be a pixel array block having a predetermined length in the Y direction, or
- the reference range 95 used to define the Y-direction boundary position of the inspection range may be a pixel column block having a predetermined length in the X-direction.
- the reference range selection unit 8 7 sets a margin for the inside of the cell range boundary calculated in advance from CAD data or the like used for forming such a pixel array block on the wafer 2 2. Leave the selection.
- the number of defect candidates included in the pixel column block 9 4 or 9 5 or the ratio of the area of the defect candidate to the area of the reference range is a predetermined threshold value. Shift the pixel row block 94 along the X direction toward the outside of the cell range until it becomes V 2 or more, and point the pixel row block 95 along the Y direction toward the outside of the cell range. Shift. As described above, the number of defect candidates in the pixel row block 9 4 ′, 9 5 outside the cell range is the defect candidate in the pixel row blocks 9 4 9 5 inside the cell range.
- the inspection range determination unit 88 determines the number of defect candidates included in the pixel column block 94 or the defect candidate occupying the area of the reference range.
- the position in the X direction of the cell area boundary is defined as the position in the X direction of the cell area boundary where the ratio of the area is the threshold V 2 or more is the X direction position of the cell area boundary.
- the inspection range is determined with the Y-direction position of the pixel row block 9 4 in which the ratio of the area of the defect candidate occupying the threshold V 2 or more is the threshold V 2 or more as the Y-direction position of the cell area boundary.
- the cell comparison defect detection unit 90 performs defect detection in the cell area within the inspection range in the cell comparison defect candidate map determined as described above, and performs die comparison.
- the defect detection unit 89 for detecting defects outside the cell area in the portion corresponding to the outside of the inspection range determined as described above in the defect candidate map for die comparison.
- the reference range may be selected with a margin outside the cell range boundary calculated in advance from CAD data or the like used in forming the pattern on the wafer 2 2.
- the reference range selection unit 8 7 directs the reference range to the inside of the cell range and selects its selection position.
- the inspection range determination unit 88 selects the number of defect candidates included in the reference range or the ratio of the area of the defect candidate to the area of the reference range in steps S 2 0 8 and S 2 10 0 as the threshold V 2.
- the position of the reference range below may be determined as the cell area boundary position.
- the reference range selection unit 87 sets the entire length in the longitudinal direction of the reference range to the cell range dimension or less, and when the reference range is at a position within the cell range, the reference range includes only the cell range.
- the reference range may be selected as such, or the reference range may be selected so as to always include the range outside the cell range. An example of such a choice is shown in Figure 23A.
- the selection range 9 4 for determining the X-direction boundary is a pixel row that spans the entire width of the map 9 1 with the Y direction of the map 9 1 as the longitudinal direction. It consists of 9 4 1 and the ranges 9 4 2 and 9 4 3 which are parts outside the cell range 9 3. Considering this selection range 94 with shifting in the X direction, since there are always ranges 94 2 and 9 4 3 outside of the cell range, the number of defect candidates in this range is always included. Is detected. However, the width of the cell range 9 3 inside portion 9 4 1 and the cell range 9 3 outside portions 9 4 2 and 9 4 3 when the X direction coordinate of the selection range 9 4 is within the cell range 9 3 is constant respectively.
- the selection range 9 4 Since the width of the cell range 9 3 outside part 9 4 2 and 9 4 3 when the cell range 9 3 is out of the cell range 9 3 is constant, as shown in FIG. 2 3 B, the selection range 9 4 The number of defect candidates to be detected is distinctly different when the X-direction coordinate is within the cell range 93. Therefore, depending on the width of the cell range 9 3 inside part 9 4 1, the cell range 9 3 outside part 9 4 2 and 9 4 3 when the X direction coordinate of the selection range 9 4 is within the cell range 9 3 It is possible to determine the boundary of the inspection range by selecting the appropriate threshold V2.
- the reference range selector 8 7 selects the selection position in the inward direction of the cell area.
- the reference range is repeatedly selected while being shifted in any one direction of the outer direction, and at this time, the inspection range determination unit 88 determines the change rate of the defect complement number based on the change rate of the number of defect candidates included in the reference range. It is possible to determine a position where the value of V becomes larger than a predetermined threshold V 3 as the cell area boundary position and to determine the inspection range.
- FIG. 24 shows a schematic configuration of a pattern comparison inspection apparatus according to a fourth embodiment of the present invention.
- the pattern comparison and inspection apparatus 10 shown in FIG. 24 has a configuration similar to that of the pattern comparison and inspection apparatus shown in FIG. 20, and the same reference numerals are given to the same components, and the description is omitted. .
- the inspection range determination unit 88 counts the number of defect candidates detected by the cell comparison unit 26 for each X direction pixel row and Y direction pixel row of the captured image of the repetitive pattern area, Each of them is stored as a one-dimensional array for X direction and a one-dimensional array for Y direction. Then, of each pixel column, the position where the number of defect candidates is equal to or less than the predetermined threshold value V 2 is determined as within the inspection range, and the position where the number of defect candidates exceeds the predetermined threshold value V 2 is determined as outside the inspection area. .
- FIG. 25 is a flowchart of the pattern comparison inspection method according to the fourth embodiment of the present invention.
- the imaging means 20 images the pattern formed on the wafer 22.
- the imaging means 20 divides the die 1 into three times of S 1 to S 3 for imaging.
- step S 23 2 the cell comparison unit 26 has detected the inspection range determination unit 8 8, and the cell comparison unit 26 has received the image signal (each pixel value) output from the AZD converter 23 and the delay Image signal delayed by memory 84 If the calculated difference value is greater than a predetermined threshold value, it is detected as a defect candidate. Then, in parallel with the defect candidate map 85 creating the defect candidate map, the inspection range determination unit 88 detects the number of defect candidates detected by the cell comparison unit 26 as the number of the captured image of the die 1. The total number of each X-direction pixel column and each Y-direction pixel column is counted, and each of the one-dimensional array data 96 for X-direction and the one-dimensional array data 9 for Y-direction 9 7
- defect candidates included in the captured image can be obtained.
- the total number of each X-direction pixel column and each Y-direction pixel column is acquired as one-dimensional array data 9 6 and 9 7.
- calculation is made by totaling each total number of defect candidates detected when 11 image means 20 divides and scans S 1 to S 3. Do.
- step S234 the X direction position and the Y direction position where the number of defect candidates in each array data 96 is less than or equal to a predetermined threshold value V 2 are calculated, and the X direction range and the Y direction range are determined respectively.
- step S235 the cell comparison defect detection unit 90 detects defects in the cell area within the inspection range in the cell comparison defect candidate map determined as described above, and The defect detection unit 89 performs defect detection outside the cell region in a portion corresponding to the outside of the inspection range determined as described above in the defect comparison map for die comparison.
- the defect candidate is counted at the same time as imaging by the imaging device 20, but instead, captured images of all repetitive pattern areas are acquired, stored, and stored for each pixel row in X and Y directions.
- the number of defect candidates may be counted, and at this time, the number of defect candidates is extracted from the position inside the cell range boundary calculated in advance from CAD data etc.
- an X direction position and a Y direction position where the number of defect candidates for each pixel column exceeds a predetermined threshold V 2 may be determined as the inspection range boundary.
- the present invention can be used for visual inspection which inspects patterns of a pattern or photomask formed on a semiconductor wafer such as a semiconductor memory by sequentially comparing adjacent Senor patterns.
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JP2007078572A (ja) * | 2005-09-15 | 2007-03-29 | Tokyo Seimitsu Co Ltd | 画像欠陥検査装置及び画像欠陥検査方法 |
JP4703327B2 (ja) * | 2005-09-15 | 2011-06-15 | 株式会社東京精密 | 画像欠陥検査装置及び画像欠陥検査方法 |
KR100755667B1 (ko) * | 2006-02-13 | 2007-09-05 | 삼성전자주식회사 | 패턴 밀도가 조절된 반도체 소자의 패턴 데이터 형성방법 |
JP2010520622A (ja) * | 2007-02-28 | 2010-06-10 | ケーエルエー−テンカー・コーポレーション | ウェーハ上に形成されたアレイ領域のための検査領域のエッジを正確に識別する方法、及び、ウェーハ上に形成されたアレイ領域に検知された欠陥をビニングする方法 |
US7894659B2 (en) * | 2007-02-28 | 2011-02-22 | Kla-Tencor Technologies Corp. | Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer |
US8213705B2 (en) | 2007-02-28 | 2012-07-03 | Kla-Tencor Technologies Corp. | Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer |
JP2012059129A (ja) * | 2010-09-10 | 2012-03-22 | Bridgestone Corp | タイヤのマスター画像生成方法及びマスター画像生成装置 |
JP2014515859A (ja) * | 2011-04-26 | 2014-07-03 | ケーエルエー−テンカー コーポレイション | データベース駆動型のセルツーセルレチクル検査 |
JP2017096943A (ja) * | 2011-04-26 | 2017-06-01 | ケーエルエー−テンカー コーポレイション | 検査装置、コンピュータ装置および検査方法 |
JP2012178159A (ja) * | 2012-03-16 | 2012-09-13 | Hitachi High-Technologies Corp | 欠陥検査方法及び欠陥検査装置 |
WO2017154319A1 (ja) * | 2016-03-07 | 2017-09-14 | 東レエンジニアリング株式会社 | 欠陥検査装置 |
JP2018155600A (ja) * | 2017-03-17 | 2018-10-04 | 東レエンジニアリング株式会社 | 外観検査装置 |
Also Published As
Publication number | Publication date |
---|---|
US20060280358A1 (en) | 2006-12-14 |
KR100808653B1 (ko) | 2008-03-03 |
KR20060031649A (ko) | 2006-04-12 |
JPWO2005001456A1 (ja) | 2006-08-10 |
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