WO2004100364A1 - 音叉型圧電デバイスの製造方法および音叉型圧電デバイス - Google Patents
音叉型圧電デバイスの製造方法および音叉型圧電デバイス Download PDFInfo
- Publication number
- WO2004100364A1 WO2004100364A1 PCT/JP2004/006273 JP2004006273W WO2004100364A1 WO 2004100364 A1 WO2004100364 A1 WO 2004100364A1 JP 2004006273 W JP2004006273 W JP 2004006273W WO 2004100364 A1 WO2004100364 A1 WO 2004100364A1
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- WIPO (PCT)
- Prior art keywords
- type piezoelectric
- fork type
- tuning
- piezoelectric device
- tuning fork
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Definitions
- the present invention relates to a method for manufacturing a tuning fork type piezoelectric device and a tuning fork type piezoelectric device, and more particularly to a tuning fork type piezoelectric device suitable for vacuum-sealing a package without deteriorating the frequency characteristics of the tuning fork type piezoelectric vibrating reed.
- the present invention relates to a manufacturing method and a tuning fork type piezoelectric device.
- a tuning fork type piezoelectric device is known as a device that can easily obtain an accurate clock frequency.
- tuning-fork type piezoelectric devices have been used as detection elements of gyro sensors used for position detection and attitude control of an object.
- Such tuning-fork type piezoelectric devices have been reduced in size and thickness in response to the reduction in size and thickness of electronic devices, and so-called surface mount devices have been developed.
- the surface mount type tuning fork type piezoelectric device is mounted by supporting the tuning fork type piezoelectric vibrating reed in parallel with the bottom surface of the package base and in a cantilever manner on the bottom surface of the package base.
- a lid is joined via a low-melting glass to an upper portion of a package base in which a tuning-fork type piezoelectric vibrating piece is mounted. Since the joining of the lid is performed by heating to a temperature of 320 ° C. to 370 ° C., the inside of the package also becomes as high as the joining temperature. For this reason, the conductive adhesive for mounting the tuning-fork type piezoelectric vibrating piece on the package base cannot use a material having a heat-resistant temperature lower than the above-mentioned bonding temperature, and uses only a polyimide-based conductive adhesive having a high heat-resistant temperature. could not.
- the polyimide conductive adhesive has high hardness, and the base of the tuning-fork type piezoelectric vibrating piece is firmly adhered and fixed to the package base. Therefore, when the tuning fork-type piezoelectric vibrating piece bends and vibrates, it vibrates in the package via the base. Transmitted, degrading the frequency characteristics and increasing the crystal impedance value.
- the tuning fork type piezoelectric vibrating reed When quartz is used as the material of the piezoelectric vibrating reed, the tuning fork type piezoelectric vibrating reed is mainly used. It vibrates in the bending mode (32.768 kHz).
- This tuning-fork type piezoelectric vibrating reed uses a solder-based or epoxy-based conductive adhesive that is supported in a cantilever shape, and the Young's modulus of these conductive adhesives and the X-axis direction of the piezoelectric crystal axis The asymmetric mode (X-mode) is approaching. For this reason, the bending vibration of the tuning-fork type piezoelectric vibrating piece loses energy under the influence of the X-mode, and the frequency characteristics deteriorate.
- the bending vibration, the Young's modulus is used 1 X 1 0 one 2 GP a less conductive adhesive, not adversely affected by the other vibration such as X- mode.
- the Young's modulus of 1 X 1 0- 2 GP a less conductive adhesive include conductive silicone adhesive and butadiene.
- the lid When joining the lid to the package base, the lid is sufficiently separated from the package base, and the lid is heated to a temperature higher than the melting point of the low-melting glass in a nitrogen atmosphere. Are joined. According to the technology, the lid can be bonded to the package base using low-melting glass without deteriorating the silicone conductive adhesive.
- H10-2506409 discloses that even when the operation of heating the lid and the operation of sealing are performed in a vacuum instead of a nitrogen atmosphere, it is possible to use a low melting point glass or the like. Gas is generated. In this technique, when the lid and the package base are joined, gas generated from low-melting glass or the like remains in the package, and the package cannot be vacuum-sealed. Also, as a method of vacuum sealing the package, a gold-tin tin brazing material serving as a sealing material is preformed on a peripheral portion of the lid, and the melting point of the gold-tin sealing material or more (about 280 ° C.) ) There is a single sealing method in which the lid is heated and joined to the package base.
- the present invention has been made in order to solve the above problems, and even when a conductive adhesive suitable for mounting a tuning-fork type piezoelectric vibrating reed on a package base is used, a package base using a low melting point glass is used. It is intended to provide a method of manufacturing a tuning fork type piezoelectric device and a tuning fork type piezoelectric device which can join a package and a lid and vacuum seal a package. Disclosure of the invention
- a manufacturing method of the tuning fork type piezoelectric device has a Young's modulus in a package base having a seal hole by using the 1 X 1 0- 2 GP a less conductive adhesive fork Mounting a type piezoelectric vibrating reed, bonding a lid to the upper surface of the package base using low-melting glass, evacuating the inside of the package using the sealing holes, and sealing the package with a sealing material.
- the Young's modulus of 1 X 1 0- 2 GP a less conductive adhesive, butadiene based conductive adhesive was or can be a silicone-based conductive adhesive.
- the tuning fork type piezoelectric vibrating piece can absorb the vibration by a conductive adhesive also bending vibration. Also according to the present invention, since the frequency of the tuning fork type piezoelectric vibrating piece is adjusted after the package is vacuum-sealed, a tuning fork type piezoelectric device with high frequency accuracy can be realized.
- the material of the lid is glass. Since the lid made of glass transmits laser light for adjusting the frequency of the tuning fork type piezoelectric vibrating reed, the frequency of the tuning fork type piezoelectric vibrating reed can be adjusted after the lid is joined to the package base.
- the present invention is characterized in that the tuning-fork type piezoelectric vibrating reed has grooves along the longitudinal direction on both surfaces of a vibrating arm portion. According to the present invention, the efficiency of the bending vibration of the vibrating arm portion is improved, the crystal impedance (C I) value is reduced, and the size of the tuning-fork type piezoelectric vibrating piece can be reduced.
- the sealing hole includes a first hole and a second hole having an opening smaller than the first hole, and is characterized by being coated with a metal.
- the sealing material is placed in the first hole and melted, the sealing material is welded to the metal coating and the sealing hole can be sealed.
- the sealing material is a metal pole using any material of gold-tin, gold-germanium or silver brazing.
- a tuning fork type piezoelectric device is characterized by being manufactured by using the above-described method for manufacturing a tuning fork type piezoelectric device.
- the present invention is characterized in that in the above-described tuning fork type piezoelectric device, a semiconductor integrated circuit is mounted. Thus, a more stable tuning fork type piezoelectric device can be realized.
- FIG. 1 is a cross-sectional view of the acoustic piezoelectric device according to the present embodiment.
- FIG. 2 is a flow chart for explaining a manufacturing process of the acoustic piezoelectric device according to the present embodiment.
- FIG. 3 is a graph comparing the impedance values of the tuning fork type piezoelectric device according to the present embodiment and the tuning fork type piezoelectric device according to the prior art.
- FIG. 4 is a diagram showing a result of measuring vibration leakage of the tuning fork type piezoelectric device according to the present embodiment.
- FIG. 5 is a diagram showing the results of measuring the vibration leakage of the tuning fork type piezoelectric device due to the difference in the conductive adhesive.
- FIG. 6 is a diagram showing a metal film provided in the sealing hole of the present embodiment.
- FIG. 7 is a diagram showing another example of the metal film provided in the sealing hole.
- FIG. 8 is a plan view of a tuning-fork type piezoelectric vibrating reed according to another embodiment.
- FIG. 9 is a sectional view taken along line AA of FIG.
- FIG. 10 is a diagram illustrating a method of sealing a sealing hole.
- FIG. 1 is a sectional view of a tuning fork type piezoelectric device according to an embodiment.
- the tuning fork type piezoelectric device 10 has a tuning fork type piezoelectric vibrating reed 16 mounted mainly on a package base 12 via a conductive adhesive 14, and a lid 18 on top of the package base 12. Are joined.
- the package base 12 has a configuration in which a frame-shaped ceramic insulating substrate is laminated on a plurality of planar ceramic insulating substrates.
- This package base 12 is provided with a two-stage sealing hole 20 on the bottom surface.
- the sealing hole 20 is formed by press working or the like on a planar ceramic insulating substrate constituting the bottom surface of the package base 12.
- the sealing hole 20 includes a first hole 22 and a second hole 24. That is, the sealing hole 20 is formed on the ceramic insulating substrate of the third layer 12 c where the first hole 22 is the bottom surface of the package base 12, and the second hole 24 is formed on the package base 12. It is provided on the ceramic insulating substrate of the second layer 12 b serving as the inner surface.
- the opening of the second hole 24 is formed smaller than the opening of the first hole 22. The centers of the openings of the first hole 22 and the second hole 24 are approximately It is adjusted to be in the same position.
- the sealing hole 20 is provided with a metal coating 36 provided with nickel plating and gold plating on tungsten metallized.
- the metal coating 36 is formed on the bottom surface of the second layer 12 b serving as the bottom surface of the large-diameter first hole portion 22 and the side surface of the third layer 12 c serving as the peripheral surface of the first hole portion 22. It is formed in. However, the metal film 36 is not formed on the peripheral surface of the second hole 24. This is to prevent a sealing material made of metal, which will be described later, from dripping into the package 28.
- the sealing material made of a metal pole described later is melted. In some cases, the sealing material spreads along the metal film 36 and is welded, so that the sealing hole 20 can be sealed well. Note that the metal film 36 may be only on the bottom surface of the second layer 12b as shown in FIG.
- a package-side mount electrode (not shown) for mounting the tuning-fork type piezoelectric vibrating piece 16 is formed on the inner surface of the package base 12.
- the mount electrode is electrically connected to an external electrode (not shown) formed on the bottom surface of the package base 12.
- the tuning-fork type piezoelectric vibrating reed 16 includes a base 26 and a pair of vibrating arms 32, and connects a connection electrode (not shown) formed on the base 26 to the mount electrode with a conductive adhesive.
- a connection electrode (not shown) formed on the base 26 to the mount electrode with a conductive adhesive.
- the package 2 8 t the conductive adhesive 1 4 internal implemented in the following materials Young's modulus 1 X 1 0- 2 GP a, eg if butadiene based conductive adhesive Ya Silicone 3 ⁇ 4 A conductive adhesive can be used. Young's modulus of the butadiene based conductive adhesive is 1 X 1 0- 2 GP a extent, the Young's modulus of the silicone-based conductive adhesive is approximately 1 X 1 0- 3 GP a.
- a lid 18 is bonded to the upper surface of the package base 12, that is, on the frame-shaped first layer 12 a ceramic insulating substrate via a low-melting glass 30 serving as a sealing material.
- the cover 18 is made of a material that transmits laser light for adjusting the frequency of the sound-type piezoelectric vibrating reed 16, for example, a glass sapphire or the like.
- the package base 12 of the tuning fork type piezoelectric device 10 is formed by laminating a plurality of ceramic insulating substrates as described above, and forms the second layer 12 b and the third layer 1 forming the bottom surface of the package base 12.
- holes 22 and 24 having different openings are formed by press working or the like.
- the holes 22 and 24 constitute a sealing hole 20 for vacuum-sealing the package.
- the metal film 3 is formed on the bottom surface and the peripheral surface of the first hole 22 by thick-film printing or plating. 6 are provided (see Fig. 6).
- the package-side mount electrode is provided on the top surface of the second layer 12b, and the external electrode is provided on the bottom surface of the third layer 12c (both are not shown).
- These electrodes are formed by, for example, forming a tungsten layer by thick film printing or the like, and applying nickel plating and gold plating on the tungsten layer.
- the package base 12 is formed by laminating a frame-shaped ceramic insulating substrate serving as the first layer 12a on the ceramic insulating substrate of the second layer 12b, and by firing these, they are integrated. Yes (step 1 1 0).
- the tuning fork type piezoelectric vibrating piece 16 has an excitation electrode (not shown) provided on the vibrating arm portion 32 and is connected to this excitation electrode to form a base 26 of the tuning fork type piezoelectric vibrating piece 16.
- the connection electrodes thus formed are formed by film formation such as sputtering or vapor deposition (step 120). These electrodes are formed, for example, by laminating gold on chromium.
- Such package base 1 2 thus formed has a Young's modulus Ru is a tuning fork type piezoelectric resonator element 1 6 implemented by 1 X 1 0 one 2 GP a less conductive adhesive 1 4 (Step 1 3 0) .
- the tuning-fork type piezoelectric vibrating reed 16 has the connection electrode adhered and fixed to the mount electrode of the package base 12 and is supported in a cantilever shape.
- the Young's modulus as 1 X 1 0 _ 2 GP a less conductive adhesive 1 4 can Rukoto using butadiene based conductive adhesive or silicone-based conductive adhesive.
- the conductive adhesive 14 is heated and cured at 200 ° C. for about 1 hour.
- the lid 18 is joined to the upper part of the package base 12 on which the tuning fork type piezoelectric vibrating reed 16 is mounted using low melting point glass 30 (step 140). This and Then, the low-melting glass 30 is melted by heating at about 320 ° C. to 350 ° C., and the lid 18 is joined to the upper portion of the package base 1 to form the package 28.
- the package 28 is placed in a vacuum container, and the pressure in the container is reduced.
- the package 28 is arranged upside down as shown in FIG. Thereby, the pressure in the container is reduced, and the inside of the package 28 is also reduced in pressure through the sealing hole 20.
- a sealing material 50 made of a metal ball is arranged in the first hole portion 22 of the sealing hole 20, and the sealing material 50 is locally heated and melted by a laser or an electron beam. The melted sealing material 50 spreads and welds on the metal coating 36, and seals the sealing hole 20 by vacuum (step 150).
- the sealing material 50 a metal pole made of gold-tin, gold-germanium, silver brazing or the like is used, but a plate-like pellet may be used as the shape of the sealing material.
- the sealing material 50 is made of a gold-tin alloy, for example, gold (Au) 80 wt% and tin (Sn) 20 wt% can be used.
- the melting point of the sealing material made of gold-tin tin having such a composition is 278 ° C.
- the encapsulant 50 is gold-germanium (G e), Au 87.5 wt% and Ge 12.5 wt% can be used. Has a melting point of 361 ° C.
- the inside of the package 28 vacuum-sealed in the step 150 has a degree of vacuum of 0.13 Pa or less.
- the frequency of the tuning-fork type piezoelectric vibrating reed 16 mounted inside the package 12 is adjusted. That is, the weight (not shown) formed at the tip of the vibrating arm portion 32 of the tuning-fork type piezoelectric vibrating piece 16 is irradiated with laser light via the lid 18 to process the weight. The frequency is adjusted to the desired frequency (step 160), and a tuning fork type piezoelectric device 10 is formed.
- FIG. 3 shows the distribution of CI values.
- the horizontal axis in Fig. 3 is the CI value, and the vertical axis is the probability density. This figure shows that the lower the CI value, the better the characteristics.
- the solid line in the figure shows the measurement results of the tuning fork type piezoelectric device 10 manufactured by the above method, and the dotted line shows the measurement results of the tuning fork type piezoelectric device manufactured by the conventional single sealing method. . Note that these tuning fork types The same tuning fork type piezoelectric vibrating reed and the silicone conductive adhesive of the piezoelectric device are used.
- the tuning fork type piezoelectric device manufactured by the single encapsulation method has a large variation in CI value exceeding 80 k ⁇ . This is because the gas generated when the lid is joined to the package base remains in the package, and when the degree of vacuum deteriorates and the tuning fork-type piezoelectric vibrating piece bends and vibrates, this gas becomes a resistance. It depends. For this reason, tuning fork type piezoelectric devices manufactured by the single sealing method cannot be used as commercial products.
- the tuning-fork type piezoelectric device 10 manufactured by the method of the present embodiment has an average CI value of 50 k ⁇ and is stable with little variation. This is because even if gas is generated when the lid 18 is joined to the package base 12, the gas is exhausted from the sealing hole 20, so that the generated gas does not remain inside the package 28. After that, when the inside of the package 28 is vacuum-sealed by melting the sealing material 50 and sealing the sealing hole 20, only heat is applied around the sealing hole 20. The sealing can be performed with almost no generation of gas, and the tuning-fork type piezoelectric vibrating piece 16 can stably bend and vibrate without gas resistance. This indicates that the method of manufacturing the tuning fork type piezoelectric device 10 of the present embodiment is superior to the conventional single sealing method.
- the tuning fork type piezoelectric device 10 manufactured by the method of the present embodiment, vibration leakage due to the difference in the conductive adhesive 14 was measured.
- the tuning fork type piezoelectric device 10 is repeatedly set and reset in the measuring circuit a plurality of times, and the frequency and CI value are measured for each of the times, and the vibration leakage is measured.
- the variation in each subsequent measurement is evaluated.
- Fig. 4 shows the results of measuring the vibration leakage of the tuning fork type piezoelectric device 10 in which the tuning fork type piezoelectric vibrating reed 16 was mounted on the package base 12 with a silicone conductive adhesive
- Fig. 5 shows the polyimide conductive adhesive.
- Figures 4 (a) and 5 (a) show the variation in frequency for each number of measurements
- Figures 4 (b) and 5 (b) show the variation in CI values for each number of measurements.
- the Young's modulus of the polyimide conductive adhesive is about 3 GPa. Comparing the case where the silicone-based conductive adhesive is used and the case where the polyimide-based conductive adhesive is used, when the silicone-based conductive adhesive is used, the dispersion for each measurement is small in both frequency and CI value. While stable
- the polyimide conductive adhesive has a Young's modulus of about 3 GPa, it cannot absorb the bending vibration of the tuning-fork type piezoelectric vibrating reed, and the vibration leaks to the outside, causing variations at every measurement. I do. That is, since the vibration leaks to the outside, the energy of the vibration is lost, and the tuning fork type piezoelectric vibrating piece cannot perform stable bending vibration.
- the tuning fork type piezoelectric device 10 using the silicone-based conductive adhesive is , there is no loss of vibration compared to the tuning fork type piezoelectric device using a large listening conductive adhesive Young's modulus than 1 X 1 0 _ 2 GP a such polyimide-based conductive adhesive, to stably vibrate I understand.
- the conductive adhesive 14 for mounting the tuning-fork type piezoelectric vibrating reed 16 on the package base 12 may be a butadiene-based conductive adhesive or a silicon-based conductive adhesive.
- the conductive adhesive 14 has a Young's modulus of 1 XI 0 " 2 GPa or less. Therefore, even if the tuning fork type piezoelectric vibrating reed 16 bends and vibrates, the conductive adhesive 14 absorbs the vibration. As a result, a stable tuning-fork type piezoelectric device 10 that does not cause external vibration leakage can be realized.
- the lid 18 is joined to the upper portion of the package base 12 using the low-melting glass 30, gas is generated, but a sealing hole 20 for vacuum sealing is provided at the bottom of the package base 12. Therefore, gas is exhausted from the sealing hole 20 and no gas remains inside the package 28.
- the sealing hole 20 is vacuum-sealed, the sealing material 50 is locally heated and melted, so that the package 28 can be vacuum-sealed without affecting the heat.
- the tuning fork type piezoelectric vibrating piece 16 vibrates, the CI value is reduced without being affected by air resistance. Therefore, high accuracy and low cost A fixed tuning fork type piezoelectric device 10 can be realized.
- the cover 18 is made of a material that transmits laser light, such as glass or sapphire.
- the package is sealed after adjusting the frequency of the tuning-fork type piezoelectric vibrating reed. Therefore, the initial frequency was considerably widely distributed due to the effects of stress variation and heating variation.
- the lid 18 since the lid 18 transmits laser light, the frequency of the tuning-fork type piezoelectric vibrating piece 16 can be adjusted with high accuracy after the package 28 is vacuum-sealed, and a constant initial frequency can be adjusted.
- the tuning fork type piezoelectric device 10 can be realized.
- a semiconductor integrated circuit such as an oscillation circuit and a temperature compensation circuit can be mounted on the tuning fork type piezoelectric device 10 of the present embodiment. Thereby, a more stable tuning fork type piezoelectric device can be realized.
- a groove having an H-shaped cross section may be provided in the vibrating arm 32 extending from the base 26.
- 8 and 9 are explanatory diagrams of a tuning-fork type piezoelectric vibrating reed in which a groove is provided in a vibrating arm portion.
- the tuning-fork type piezoelectric vibrating piece 60 includes a base 62 and a pair of vibrating arms 32 extending from one end of the base 62.
- the tuning-fork type piezoelectric vibrating piece 60 is provided with a rectangular groove 40 on the base end side of the vibrating arm 32. As shown in FIG.
- the groove 40 is formed at a corresponding position on the front and back surfaces of the vibrating arm 32, and the cross section of the vibrating arm 32 is H-shaped.
- excitation electrodes (not shown) are formed on the opposing surface and the outer surface of each vibrating arm 32 and the inner surface of the groove 40. For this reason, in the vibrating piece 60, the vibration efficiency of the vibrating arm 32 is improved, and the CI value is smaller than before.
- the acoustic type piezoelectric vibrating piece 60 has rectangular grooves 42 formed on both sides of the base 26, and when the tuning fork type piezoelectric vibrating piece 60 is mounted, vibration leakage from the base 26 is prevented. It is to be reduced.
- the tuning fork type piezoelectric vibrating piece 60 since the groove 40 is formed and the vibrating arm 32 has an H-shaped structure, the CI value can be reduced.
- the CI value decreases as the depth of the groove 40 increases. Even if the vibrating arm 32 is formed thin, the CI value can be reduced by providing the groove 40 in the vibrating arm 32. Therefore, the tuning fork type piezoelectric vibrating reed can be downsized.
- Type piezoelectric devices can also be miniaturized.
- the outer dimensions of the tuning fork type piezoelectric device having the groove 40 are 3.2 mm x 1.5 mm x 0.8 mm, which is 60% or less that of the conventional tuning fork type piezoelectric device. it can.
- the present invention can be applied to the manufacture of a tuning fork type piezoelectric device used for various electronic devices such as communication devices and sensors.
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003129184A JP2006196932A (ja) | 2003-05-07 | 2003-05-07 | 音叉型圧電デバイスの製造方法および音叉型圧電デバイス |
JP2003-129184 | 2003-05-07 |
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WO2004100364A1 true WO2004100364A1 (ja) | 2004-11-18 |
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PCT/JP2004/006273 WO2004100364A1 (ja) | 2003-05-07 | 2004-04-30 | 音叉型圧電デバイスの製造方法および音叉型圧電デバイス |
Country Status (3)
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US (1) | US20050005411A1 (ja) |
JP (1) | JP2006196932A (ja) |
WO (1) | WO2004100364A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107564505A (zh) * | 2017-08-30 | 2018-01-09 | 上海材料研究所 | 一种压电振动发声模块 |
US10234328B2 (en) | 2014-05-09 | 2019-03-19 | Per-Axel UHLIN | Vibration sensor of magnetic type |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7579748B2 (en) | 2006-08-18 | 2009-08-25 | Epson Toyocom Corporation | Piezoelectric device and method for manufacturing thereof |
JP2009182924A (ja) * | 2008-02-01 | 2009-08-13 | Epson Toyocom Corp | 圧電デバイス及び圧電デバイスの製造方法 |
CN102227873A (zh) | 2008-11-28 | 2011-10-26 | 精工电子有限公司 | 压电振动器的制造方法、压电振动器、振荡器、电子设备及电波钟 |
JP5162675B2 (ja) | 2008-11-28 | 2013-03-13 | セイコーインスツル株式会社 | 圧電振動子の製造方法、並びに圧電振動子、発振器、電子機器及び電波時計 |
JP6167494B2 (ja) * | 2012-09-26 | 2017-07-26 | セイコーエプソン株式会社 | 電子デバイス用容器の製造方法、電子デバイスの製造方法、電子デバイス、電子機器及び移動体機器 |
JP2015097368A (ja) * | 2013-11-16 | 2015-05-21 | セイコーエプソン株式会社 | 振動子、発振器、電子機器および移動体 |
JP6287208B2 (ja) | 2013-12-27 | 2018-03-07 | セイコーエプソン株式会社 | 振動子、発振器、電子機器、物理量センサーおよび移動体 |
DE102018104279A1 (de) | 2018-02-26 | 2019-08-29 | Tdk Electronics Ag | Elektronische Vorrichtung |
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JPH08507429A (ja) * | 1993-12-23 | 1996-08-06 | モトローラ・インコーポレーテッド | 圧電装置を弾力的に実装する方法 |
JP2002076827A (ja) * | 2000-09-01 | 2002-03-15 | Seiko Epson Corp | 振動片、振動子、発振器及び携帯電話装置 |
JP2003008382A (ja) * | 2001-06-25 | 2003-01-10 | Seiko Epson Corp | 圧電振動子の製造方法および圧電振動子 |
Family Cites Families (1)
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US5585687A (en) * | 1994-02-23 | 1996-12-17 | Citizen Watch Co., Ltd. | Piezolelectric oscillator |
-
2003
- 2003-05-07 JP JP2003129184A patent/JP2006196932A/ja active Pending
-
2004
- 2004-04-28 US US10/833,006 patent/US20050005411A1/en not_active Abandoned
- 2004-04-30 WO PCT/JP2004/006273 patent/WO2004100364A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08507429A (ja) * | 1993-12-23 | 1996-08-06 | モトローラ・インコーポレーテッド | 圧電装置を弾力的に実装する方法 |
JP2002076827A (ja) * | 2000-09-01 | 2002-03-15 | Seiko Epson Corp | 振動片、振動子、発振器及び携帯電話装置 |
JP2003008382A (ja) * | 2001-06-25 | 2003-01-10 | Seiko Epson Corp | 圧電振動子の製造方法および圧電振動子 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10234328B2 (en) | 2014-05-09 | 2019-03-19 | Per-Axel UHLIN | Vibration sensor of magnetic type |
CN107564505A (zh) * | 2017-08-30 | 2018-01-09 | 上海材料研究所 | 一种压电振动发声模块 |
CN107564505B (zh) * | 2017-08-30 | 2020-10-16 | 上海材料研究所 | 一种压电振动发声模块 |
Also Published As
Publication number | Publication date |
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US20050005411A1 (en) | 2005-01-13 |
JP2006196932A (ja) | 2006-07-27 |
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