WO2004079192A1 - Dispositif sous vide et pompe sous vide - Google Patents

Dispositif sous vide et pompe sous vide Download PDF

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Publication number
WO2004079192A1
WO2004079192A1 PCT/JP2004/002484 JP2004002484W WO2004079192A1 WO 2004079192 A1 WO2004079192 A1 WO 2004079192A1 JP 2004002484 W JP2004002484 W JP 2004002484W WO 2004079192 A1 WO2004079192 A1 WO 2004079192A1
Authority
WO
WIPO (PCT)
Prior art keywords
pump
vacuum
vacuum pump
ejector
pumps
Prior art date
Application number
PCT/JP2004/002484
Other languages
English (en)
Japanese (ja)
Inventor
Tadahiro Ohmi
Original Assignee
Tadahiro Ohmi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tadahiro Ohmi filed Critical Tadahiro Ohmi
Priority to DE602004022519T priority Critical patent/DE602004022519D1/de
Priority to EP04716009A priority patent/EP1609990B1/fr
Priority to US10/548,225 priority patent/US20060182638A1/en
Publication of WO2004079192A1 publication Critical patent/WO2004079192A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/005—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of dissimilar working principle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F04D19/046—Combinations of two or more different types of pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
    • F04F5/00—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow
    • F04F5/14—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid
    • F04F5/16—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids
    • F04F5/20—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids for evacuating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
    • F04F5/00—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow
    • F04F5/54—Installations characterised by use of jet pumps, e.g. combinations of two or more jet pumps of different type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C18/00—Rotary-piston pumps specially adapted for elastic fluids
    • F04C18/08—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing
    • F04C18/12—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type
    • F04C18/14—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type with toothed rotary pistons
    • F04C18/16—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type with toothed rotary pistons with helical teeth, e.g. chevron-shaped, screw type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00—Application
    • F04C2220/10—Vacuum
    • F04C2220/12—Dry running

Definitions

  • the present invention relates to a vacuum device, and more particularly, to a vacuum device used in a semiconductor manufacturing field and the like and a vacuum pump used for the vacuum device.
  • Vacuum equipment is used in many industrial fields in addition to the semiconductor manufacturing field.
  • the vacuum apparatus generally includes a vacuum vessel and a vacuum pump that keeps the inside of the vacuum vessel in a vacuum or reduced pressure.
  • the vacuum device is arranged in a clean room and configured to perform a predetermined process while introducing and exhausting a predetermined process gas into and from the vacuum vessel.
  • An example of a conventional vacuum apparatus used in a semiconductor manufacturing apparatus will be described with reference to FIG.
  • the vacuum apparatus includes a plurality of reaction chambers (vacuum vessels) 10, 11, and 12, and a reaction chamber 10 for reducing the pressure inside or inside the reaction chambers 10, 11, 11, and 12. , 1 1 and 1 2
  • High vacuum pumps 1, 2, and 3 as the first vacuum pumps
  • booster pumps 4a, 5a, and 6a as the second vacuum pumps disposed after the high vacuum pumps
  • third vacuum Back pumps 4b, 5b, and 6b are provided as pumps.
  • Valves 22, 23, and 24 are provided between the high vacuum pumps 1, 2, and 3, and the booth pumps 4a, 5a, and 6a.
  • load lock chambers 13 and 14 for carrying a workpiece such as a wafer into the reaction chambers 10, 11, and 12, and a workpiece loaded into the mouthpiece chamber 13.
  • a transfer chamber 15 accommodating a unit (transport device) is provided.
  • a booster pump 8 a and a back pump 8 b are connected to the load lock champ 13, a booster pump 7 a and a back pump 7 b are connected to the mouth lock chamber 14, and a transfer chamber 1.
  • a booth evening pump 9a and a back pump 9b are connected to 5, and are configured to be able to reduce the pressure or create a vacuum.
  • reaction chambers 10, 11, and 12 are provided with heating means such as a gas inlet and a heater, and a film is formed while introducing a predetermined gas under heating. And the like.
  • reference numeral A1 indicates a pipe between the high vacuum pumps 1, 2, and 3 and the booster pumps 4a, 5a, and 6a
  • reference numeral A2 indicates a reaction chamber 10, 0, 1 1 , And 12 and the piping between high vacuum pumps 1, 2, and 3 are shown.
  • the symbol R indicates a clean room.
  • the transfer chamber 15 and the reaction chambers 10, 11, and 12 are kept under reduced pressure or vacuum. Then, a cassette containing a plurality of objects to be processed, such as a plurality of wafers, is carried into the load lock chamber 13 from the atmosphere outside the apparatus, and the load lock chamber 13 is evacuated.
  • a gate valve (not shown) between the load lock chamber 13 and the transfer chamber 15 is opened, and the workpiece transfer robot uses the transfer arm to move one piece of the workpiece in the cassette. Take it out and move it to Transferyaba 15.
  • a gate valve (not shown) between the reaction chamber 10 and the transfer chamber 15 is opened, and the workpiece is placed on the stage in the reaction chamber 10 by the transfer arm.
  • the processed object is transferred to another reaction chamber 11 or 12 or a load lock chamber 14 by a transfer arm.
  • the wafer is finally transported from the load lock chamber 14 to the outside.
  • a high vacuum Bonn flop operating in the molecular area of the ultimate vacuum (1 0- 7 torr or less) as a high vacuum pump I have.
  • a high-vacuum pump a general-purpose molecular pump or a thread groove pump is generally used.
  • turbomolecular pumps and thread groove pumps although small in size, have a high pumping speed, but have an allowable back pressure of 1 t0 rr or less (specifically, 0.5 t0 rr or less, more specifically, Is about 0.4 torr). For this reason, one or two low-vacuum pumps are provided downstream of the high-vacuum pump while operating at a relatively low back pressure, although the ultimate vacuum degree is relatively low.
  • a booster pump or the like will be provided as a medium vacuum pump after the high vacuum pump, and the ultimate vacuum degree will be provided after the booster pump.
  • Roots pumps are provided as low vacuum pumps that operate at relatively low back pressure, albeit low.
  • vacuum apparatus used for manufacturing a semiconductor device
  • two or three vacuum pumps are used in multiple stages for one reaction chamber (vacuum vessel).
  • these vacuum pumps often have different structures, but generally all are driven by an electric motor. For this reason, power consumption increases in this type of vacuum apparatus that uses a large number of vacuum pumps. Since the power consumption of a vacuum device affects the manufacturing cost of a semiconductor device as a result, it is desired to reduce the power consumption.
  • the last low vacuum pump (back pump) of the multi-stage vacuum pump requires a large capacity, its power consumption is also large. Therefore, reducing the power of the back pump is effective and desirable for reducing the power consumption of the entire vacuum apparatus and, consequently, the manufacturing cost of the semiconductor device.
  • an object of the present invention is to provide a vacuum device capable of suppressing power consumption. And to provide a vacuum pump.
  • a vacuum vessel provided with a gas inlet and a gas outlet, and a multi-stage vacuum pump connected to the vacuum vessel and having a mechanical structure for reducing the pressure inside the vacuum vessel and maintaining a reduced pressure state
  • a vacuum device connected to a discharge port of the last one of the vacuum pumps to assist the pressure reducing operation of the last vacuum pump and to suppress back diffusion from the discharge port.
  • a vacuum device characterized by having an ejector pump is obtained.
  • the vacuum device wherein the auxiliary pump is an ejector pump additionally attached to the discharge port of the last-stage pump.
  • the vacuum device as the ejector pump, wherein the auxiliary pump is incorporated in the last-stage pump and provided so as to be integrated with the last-stage pump.
  • a vacuum container having a gas inlet and a gas outlet, and a plurality of stages of a mechanical structure connected to the vacuum container and configured to reduce the pressure inside the vacuum container and maintain the reduced pressure.
  • a vacuum device having a vacuum pump a vacuum device characterized by having an ejector pump connected to a discharge port of a vacuum pump at a last stage of the vacuum pump is obtained.
  • a vacuum vessel provided with a gas inlet and a gas outlet, a first vacuum pump for keeping the inside of the vacuum vessel at reduced pressure, and a stage connected to the latter stage of the first vacuum pump
  • a second vacuum pump and a third vacuum pump connected downstream of the second vacuum pump, wherein the first vacuum pump is an evening molecular pump or a screw groove pump.
  • the second vacuum pump is a booster pump
  • the third vacuum pump is a dry pump
  • an ejector pump is added inside or outside the third vacuum pump.
  • a vacuum pump is provided in which an ejector pump section is provided at a discharge port facing the atmosphere side.
  • the vacuum pump in which the ejector pump section is additionally attached to the outside of the vacuum pump. Further, according to the present invention, the vacuum pump incorporated in the vacuum pump can be obtained in the ejector pump section.
  • the vacuum pump is a screw pump or a roots pump.
  • the power consumption of a vacuum pump can be suppressed compared with the former, and as a result, the manufacturing cost of a semiconductor device can be reduced.
  • FIG. 1 is a schematic view showing a vacuum apparatus for manufacturing a semiconductor to which the present invention is applied.
  • FIGS. 2A and 2B show a vacuum pump at the last stage in a vacuum apparatus according to Embodiment 1 of the present invention. It is a sectional view showing a screw pump of
  • FIG. 3 is a sectional view showing an ejector pump in the vacuum apparatus according to Embodiment 1 of the present invention
  • FIGS. 4 (a) and 4 (b) are cross-sectional views showing a screw pump as a last vacuum pump in a vacuum apparatus according to Embodiment 2 of the present invention.
  • FIG. 5 is a diagram illustrating the relationship between the suction pressure and the power consumption of the pump, together with a comparative example, for explaining the operation and effect of the present invention.
  • the vacuum apparatus according to the embodiment of the present invention is similar in system to the vacuum apparatus shown in FIG. Therefore, the description of the same configuration as in FIG. 1 is omitted.
  • the present invention is particularly characterized by the back pumps 4b, 5b, and 6b, which are the last (third) vacuum pumps in FIG.
  • the back pumps 4b, 5b, and 6b each have an ejector that can mainly assist the pressure reducing operation of these back pumps or suppress back diffusion from the discharge port, as described later in detail. Evening pumps are provided.
  • a screw pump A is provided as each of the back pumps 4b, 5b, and 6b in FIG.
  • male rotor 25 and female rotor 26 of screw pump A are housed in main casing 42, and one end of main case 42 is connected to main rotor 42. It is rotatably supported by bearings 35 and 36 attached to the sealing end plate 43 and bearings 37 and 38 attached to the sub-casing 46.
  • Timing gears 31 and 32 housed in a sub-casing 46 are attached to the rotating shafts 27 and 28 of the male rotor 25 and the female rotor 26, respectively.
  • the gap between the female mouth and the female mouth is adjusted so that they do not touch each other.
  • a motor M is attached to the rotating shaft of the male rotor 25 via a coupling or a gear for shifting. The rotation of the motor M is transmitted to the male rotor 25 and the timing gear 31 And 32 are configured to rotate the female rotor 26.
  • a suction boat 56 is provided, and a sub casing 55 is attached.
  • the end plate 43 of the main casing 42 is provided with a discharge port 57 for discharging the gas compressed by the male rotor 25 and the female rotor 26.
  • a cooling jacket 33 is formed outside the main casing 42, and the cooling jacket 33 is formed inside the cooling jacket 33.
  • a coolant such as water is circulated to cool the main casing 42 and the compressed gas.
  • this vacuum device connect to discharge port 57 of screw pump A
  • an ejector pump 60 for suppressing back diffusion from the outside of the atmospheric pressure through the discharge port 57 is provided.
  • the ejector pump 60 is additionally attached to the discharge port 57 of the screw pump A as a separate part from the screw pump A.
  • the ejector pump 60 includes a suction port 62, a gas inlet port 63, a diffuser 64, and a discharge port 65.
  • the pressures near the suction port 62 and the discharge port 57 of the screw pump A are expressed by the following formulas: 100 Pa Pa to 100 Pa Pa It becomes.
  • the principle of the ejector pump such as the generation of a wake and the generation of a shock wave in a differential user, is already known, and therefore the description thereof is omitted here.
  • the back diffusion from the outside of the atmospheric pressure to the suction port 56 through the discharge port 65 and the suction port 62 of the ejector pump 60 and the discharge port 57 of the screw pump A is significantly reduced. .
  • the pumps 4b, 5b and 6b operate efficiently and their power consumption can be greatly reduced.
  • the back pressure (atmospheric pressure) of the discharge port 65 can be reduced to about 300 torr at the suction port 62 by the ejector pump 60.
  • FIG. 5 shows the pressure at the suction port 56 of the screw pump A when the screw pump A is applied as the back pumps 4b, 5b, and 6b in the vacuum apparatus shown in FIG.
  • the results of verifying the relationship between the power consumption of screw pump A and that of screw pump A are shown.
  • a pump having the same structure as the screw pump A except that no ejector pump was provided was also used in the vacuum device in Fig. 1. Similar measurements were made with back pumps 4b, 5b, and 6b applied.
  • the screw pump A having the ejector pump 60 generally consumes less power than the screw pump without the ejector pump regardless of the suction pressure value.
  • the suction pressure is less than 10 t0 rr
  • the power consumption of the screw pump A with the ejector pump 60 is reduced by about 50% compared to the power consumption of the screw pump without the ejector pump.
  • the reaction chambers 10, 11, and 12 FIG. 1
  • a screw pump B is provided as each of the back pumps 4b, 5b, and 6b in FIG.
  • screw pump B has male rotor 25 and female rotor 26 as in screw pump A shown in FIGS. 2 (a) and (b).
  • Screw pump B has male rotor 25 and female rotor 26 as in screw pump A shown in FIGS. 2 (a) and (b).
  • the bearings 37 and 38 are rotatably supported.
  • Timing gears 31 and 32 housed in a sub-casing 46 are attached to the rotating shafts 27 and 28 of the male rotor 25 and the female rotor 26, respectively.
  • the gap between the two openings is adjusted so that the female rotor 26 and the female rotor 26 do not contact each other.
  • a motor M is attached to the rotary shaft of the male mouth 25 via a force coupling or a gear for shifting. The rotation of the motor M is transmitted to the male mouth 25 and the timing gear It is configured to rotate the female rotor 26 via 31 and 32.
  • a suction port 56 is provided, and a sub casing 55 is attached. Further, a discharge port 57 for discharging the gas compressed by the male rotor 25 and the female rotor 26 is formed in the end plate 43 of the main casing 42.
  • a cooling jacket 33 is formed outside the main casing 42, and a coolant such as water is circulated in the cooling jacket 33 to cool the main casing 42 and the compressed gas. It has become.
  • the screw pump B thus configured, when the male mouth 25 is rotationally driven by the motor M, the female rotor 26 is rotationally driven by the timing gears 31 and 32. Then, as the male mouth 25 and the female rotor 26 rotate, the gas from the upper booster pumps 4a, 5a, and 6a (Fig. 1) passes through the suction port 56, and the male Inhaled into the working chamber formed by mouth 25, female mouth 26, and main casing 42. The sucked gas is discharged through the discharge port 57 while being compressed as the male rotor 25 and the female rotor 26 rotate.
  • the screw pump B is connected to its discharge port 57, and has a built-in pump 60 for suppressing back diffusion from outside of the atmospheric pressure through the discharge port 57. are doing. That is, the ejector pump section 60 is incorporated in the discharge port 57 of the end plate 43 of the screw pump B as an integral part of the screw pump B.
  • the ejector pump section 60 includes a suction port 62, a gas introduction port 63, a differential user 64, and a discharge port 65.
  • the screw pump B having the ejector pump section 60 has lower power consumption as a whole than the screw pump without the ejector pump regardless of the suction pressure value. .
  • the power consumption of the screw pump B equipped with the ejector pump section 60 is reduced by about 50% compared to the power consumption of the screw pump without the ejector pump. .
  • the screw pump B when the screw pump B is applied as the back pumps 4b, 5b, and 6b of the vacuum apparatus as shown in FIG. 1, the reaction chambers 10, 11, and 12 (FIG. 1) It can be said that a higher effect is obtained when gas is not introduced into the inside. Since the screw pump according to the present embodiment has a built-in ejector pump section, it is more compact than the screw pump in which the ejector pump is externally attached as in the first embodiment. Therefore, when applied to a vacuum device having a plurality of back pumps, the space occupied by the entire vacuum device can be reduced.
  • the screw pump is used as an example of the back pump.
  • the vacuum pump according to the present invention to which the ejector pump is attached or built may be a loop pump or the like.
  • the vacuum pump according to the present invention can be used as a single-stage vacuum pump as well as a back pump in a multi-stage configuration, as long as the back pressure is within a pressure range in which the effect of the eject pump is exhibited. is there.
  • the application is not limited to a vacuum device for manufacturing a semiconductor device. Industrial applicability
  • the back pressure exerts the effect of the ejector pump.
  • the pressure is within the pressure range, it can be used not only as a back pump in a multistage configuration but also as a single-stage vacuum pump. Further, the application is not limited to a vacuum device for manufacturing a semiconductor device.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Jet Pumps And Other Pumps (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Non-Positive Displacement Air Blowers (AREA)

Abstract

L'invention concerne un dispositif sous vide présentant un conteneur sous vide ayant une entrée et une sorite de gaz, et une pompe sous vide présentant plusieurs étages de pompes sous vide mécaniquement structurées permettant de réduire la pression à l'intérieur du conteneur sous vide et de maintenir l'état de pression réduite. Le dispositif sous vide présente une pompe d'éjection (60) reliée à un orifice de décharge (57) d'une pompe à vis (A) qui est une pompe sous vide au dernier étage des pompes sous vide. Le dispositif sous vide est utilisé dans le domaine de la fabrication de semi-conducteurs, etc. et consomme moins d'électricité.
PCT/JP2004/002484 2003-03-03 2004-03-01 Dispositif sous vide et pompe sous vide WO2004079192A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE602004022519T DE602004022519D1 (de) 2003-03-03 2004-03-01 Vakuumvorrichtung und vakuumpumpe
EP04716009A EP1609990B1 (fr) 2003-03-03 2004-03-01 Dispositif sous vide et pompe sous vide
US10/548,225 US20060182638A1 (en) 2003-03-03 2004-03-01 Vacuum device and vacuum pump

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-055749 2003-03-03
JP2003055749A JP2004263635A (ja) 2003-03-03 2003-03-03 真空装置および真空ポンプ

Publications (1)

Publication Number Publication Date
WO2004079192A1 true WO2004079192A1 (fr) 2004-09-16

Family

ID=32958669

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/002484 WO2004079192A1 (fr) 2003-03-03 2004-03-01 Dispositif sous vide et pompe sous vide

Country Status (6)

Country Link
US (1) US20060182638A1 (fr)
EP (1) EP1609990B1 (fr)
JP (1) JP2004263635A (fr)
DE (1) DE602004022519D1 (fr)
TW (1) TW200506205A (fr)
WO (1) WO2004079192A1 (fr)

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EP2644264A1 (fr) * 2012-03-28 2013-10-02 Aurotec GmbH Système multiréacteur à pression régulée
DE102012220442A1 (de) * 2012-11-09 2014-05-15 Oerlikon Leybold Vacuum Gmbh Vakuumpumpensystem zur Evakuierung einer Kammer sowie Verfahren zur Steuerung eines Vakuumpumpensystems
FR3008145B1 (fr) * 2013-07-04 2015-08-07 Pfeiffer Vacuum Sas Pompe a vide primaire seche
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US10808730B2 (en) * 2014-10-02 2020-10-20 Ateliers Busch Sa Pumping system for generating a vacuum and method for pumping by means of this pumping system
US11209024B2 (en) * 2015-06-24 2021-12-28 Itt Manufacturing Enterprises Llc Discharge casing insert for pump performance characteristics control
US10155600B2 (en) * 2015-12-28 2018-12-18 Starvac Systems Pty Ltd Apparatus for vacuum sealing products
FR3077343B1 (fr) * 2018-01-29 2020-02-14 Norauto France Centrale d'aspiration pour la collecte de fluides uses d'un vehicule automobile, dispositif comprenant la centrale et procede de collecte

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EP1609990A1 (fr) 2005-12-28
EP1609990B1 (fr) 2009-08-12
TW200506205A (en) 2005-02-16
DE602004022519D1 (de) 2009-09-24
US20060182638A1 (en) 2006-08-17
EP1609990A4 (fr) 2007-07-18
JP2004263635A (ja) 2004-09-24

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