WO2003106165A1 - シート及び電子部品包装容器 - Google Patents
シート及び電子部品包装容器 Download PDFInfo
- Publication number
- WO2003106165A1 WO2003106165A1 PCT/JP2002/005971 JP0205971W WO03106165A1 WO 2003106165 A1 WO2003106165 A1 WO 2003106165A1 JP 0205971 W JP0205971 W JP 0205971W WO 03106165 A1 WO03106165 A1 WO 03106165A1
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- WO
- WIPO (PCT)
- Prior art keywords
- layer
- surface layer
- sheet
- electronic component
- conductive layer
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
- Y10T428/31544—Addition polymer is perhalogenated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31935—Ester, halide or nitrile of addition polymer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon
Definitions
- the present invention relates to an electronic component packaging container, a sheet for a carrier tape, and an electronic component packaging container using the same.
- Packaging forms for electronic components such as ICs include injection trays, vacuum forming trays, magazines, and carrier tapes (embossed carrier tapes).
- Electronic components Packaging containers are used for transport and storage of electronic components.
- Container surface resistivity 1 0 4 ⁇ 1 0 8 ⁇ / cm 2 is generated static electricity is easily escape by grounding the container, prevents electrostatic breakdown of the electronic component.
- a method of applying an antistatic agent to the surface of the packaging container a method of applying a conductive paint, a method of dispersing an antistatic agent, a method of dispersing a conductive filler, and the like. It is known (JP-A-57-784439, etc.).
- the method of dispersing the conductive filler is often used.
- the conductive filler metal fine powder, carbon fiber, power pump rack and the like are used (Japanese Patent Laid-Open No. 60-83362). Carbon black can be dispersed uniformly, and stable surface resistivity can be easily obtained.
- a thermoplastic resin is used as a resin for dispersing the force pump rack. Examples include polyvinyl chloride resin, polypropylene resin, polyethylene terephthalate resin, polystyrene resin, ABS resin, polyphenylene ether resin, and polycarbonate resin.
- Polystyrene-based resin for general use and polyphenylene ether-based resin for heat resistance do not significantly reduce flowability and moldability even when a large amount of carbon black is added compared to other resins. Are better.
- the surface resistivity of the electronic parts packaging container can be prevented is the static failure in the range of 1 0 4 ⁇ 1 0 8 ⁇ / mouth, it can not be completely prevented. As electronic components become more highly integrated and wiring within electronic components becomes finer, electronic components become more integrated. Layers are more susceptible to electrostatic breakdown.
- an electronic component packaging container having a surface resistivity of, for static electricity generated by Ri to electronic component induction from friction or other charge of the electronic component and the container electron Discharge of the component packaging container may cause destruction of electronic components. It is said that the destruction of electronic components due to static electricity is caused by an instantaneous temperature rise inside the electronic components due to discharge from the electronic components to the surface of the electronic component packaging container in a very short time. Disclosure of the invention
- the surface layer of the container that comes into contact with the electronic component should have a relatively high surface resistivity, and a more conductive layer beneath it, and the surface of the surface layer The resistivity may be higher than the underlying conductive layer.
- the static electricity charged on the electronic component gradually discharges without causing a temporary discharge from the electronic component to the surface of the electronic component packaging container, which prevents electrostatic damage. it is conceivable that.
- the surface resistivity of the surface layer in contact with the electronic component (hereinafter referred to as “surface layer”) must be higher than that of the layer laminated below (hereinafter referred to as “conductive layer”).
- the surface layer ratio of the conductive layer is in a range of 10 2 to 10 12 ⁇ / port, preferably 10 4 to 10 1 ° ⁇ , and more preferably 10 4 to 10 8 ⁇ . is there.
- the surface resistivity of the surface layer is 1 0 9 ⁇ 1 0 1 4 ⁇ / mouth usually selected from, in the case of using the thermoplastic resin in the surface layer can be higher.
- the thickness of the surface layer is preferably not more than 2 0 m, particularly preferably preferably in the range of 0. 1 ⁇ 2 0 m. Further, it is preferable that the surface layer is formed of a material whose charging train is close to the charging train of the electronic component to be stored.
- Fig. 1 shows the test equipment used to measure the amount of charge on the IC due to the charge on the sheet and the IC. 1 is a slope, 2 is a sheet for measuring the charge amount, 3 is an IC, and 4 is a Faraday cage.
- Specific configurations of the electronic component packaging container and the sheet used for the container include, for example, a configuration of a surface layer and a Z conductive layer. Alternatively, there is a configuration called a surface layer Z conductive layer Z surface layer. There are a surface layer, a conductive layer / base layer, and a surface layer, a conductive layer / base layer / conductive layer / surface layer to which a base layer is added.
- the configuration of the electronic component packaging container and sheet is not limited to these, and it is sufficient that the electronic component packaging container and sheet have a conductive layer and a surface layer. It is preferable that the conductive layer and the surface layer are directly laminated, but another layer, for example, a layer having intermediate conductivity between the conductive layer and the surface layer may be provided between the conductive layer and the surface layer.
- the surface resistivity of the conductive layer is 10 2 to 10 12 ⁇ . Preferably 1 0 4 ⁇ 1 0 1 0 ⁇ opening, more preferably from 1 0 4 ⁇ 1 0 8 ⁇ port.
- the surface resistivity is a resistance per unit surface area and is specified in JIS II-6911.
- the conductive layer contains a thermoplastic resin and a conductive filler.
- the thermoplastic resin include, for example, GPPS (general-purpose polystyrene) or HIPS (impact-resistant polystyrene), or a polystyrene resin containing a mixture of these as a main component, a homopolymer of ethylene and propylene, and ethylene or propylene.
- Resin polyacryl-based resin, polyacrylonitrile-ponate-based resin, and acrylonitrile-butadiene-styrene-based copolymer mainly composed of copolymers
- Mainly acryl-based resin mainly composed of polyacrylate such as acid or polymethyl acrylate, polyamide-based resin, polyester-based resin mainly composed of polyester, and polyurethane Polyurethane-based resin, polyphenylene ether and their alloy resins Can be used.
- a conductive filler such as carbon fiber, metal fiber, metal powder, and carbon black is added to the thermoplastic resin in order to impart conductivity.
- Carbon black is a preferred conductive filler.
- As carbon black furnace black , Channel black, acetylene black and the like can be used.
- Conductive fillers surface resistivity of the conductive layer is 1 0 2 ⁇ 1 0 1 2 ⁇ / mouth, preferably 1 0 4 ⁇ 1 0 1 0 ⁇ b, more preferably 1 0 4 ⁇ 1 0 8 ⁇ / mouth It is added to be in the range. The addition amount varies depending on the carbon black, but is about 5 to 50 parts by weight based on 100 parts by weight of the thermoplastic resin.
- the conductive layer must have a lower surface gradient than the surface layer.
- the surface layer has a higher surface resistivity than the conductive layer.
- the surface resistivity of the surface layer may be in the range of 1 0 9 ⁇ 1 0 1 4 ⁇ / mouth, it may be higher.
- the surface layer preferably contains a resin.
- a resin containing an antistatic agent can be laminated on the surface of the conductive layer by a known method such as a multilayer coextrusion forming method, a coating method, or a laminating method to form a surface layer.
- the antistatic agent examples include a silicon compound antistatic agent, a surfactant such as a group of compounds having a sulfonic acid group, a vinyl copolymer and a polyetheramide copolymer containing hydrophilic and ionic groups. And high molecular type antistatic agents. Be in the range of surface resistivity 1 0 9 ⁇ 1 0 1 4 ⁇ Noro and polymeric antistatic agent, port rear diphosphate, polypyrrole Ichiru, Porichiofen, polyacrylonitrile, Poribe Li naphthalene, conductive, such as polyacetylene It is also possible to use a conductive resin as the surface layer. Alternatively, the resin may contain a conductive filler.
- thermoplastic resin As the resin used for the surface layer, a thermoplastic resin can be used.
- GPPS general polystyrene resin
- ⁇ IPS impact-resistant polystyrene resin
- a polystyrene-based resin containing a mixture thereof as a main component ethylene
- a propylene homopolymer a copolymer mainly composed of a copolymer mainly composed of ethylene or propylene
- a polycarbonate resin a copolymer mainly composed of three components of acrylonitrile-butadiene-styrene are mainly used.
- ABS resin as a component
- acryl-based resin based on polyacrylic acid ester such as polyacrylic acid and polymethyl acrylate
- polyamide-based resin based on polyamide such as 6-nylon Polyester containing polyester as the main component
- stell-based resins polyurethane-based resins containing polyurethane as a main component, and alloys thereof.
- the surface layer is preferably close to the charging line of the electronic component to be housed. In this case, it is considered that the amount of electric charge generated in the electronic component can be reduced due to friction with the electronic component container. As a result, it is suitable for electronic components that are sensitive to damage due to static electricity, for example, IC.
- a slope with a slope of 30 degrees and a slope length of 30 cm made of a film of the same composition as the surface layer is created, and the charge on the film is ionized air or alcohol.
- a water-soluble organic solvent such as acetone
- slide off the IC that has been neutralized with ionized air or a water-soluble organic solvent such as alcohol or acetone from the top of the slope and measure the amount of charge generated in the IC using a Faraday cage.
- the absolute value of the amount of charge generated in I C is 1 nanocoulomb or less, it can be said that the film constituting the slope and the charging sequence of I C are close. It is preferable that the absolute value of the charge amount is small.
- thermoplastic resin alloy comprising a mixture of an acrylate polymer and polyvinylidene fluoride is preferable because the charging sequence can be easily adjusted.
- the acrylate polymer and polyvinylidene fluoride can be easily mixed. Also, since the charging trains of both resins are greatly different, a resin composition having different charging trains can be obtained by changing the mixing ratio.
- the base layer is made of a single-layer or multilayer thermoplastic resin. Processing aids such as various fillers, reinforcing materials, modifiers, plasticizers and antioxidants can be added to the thermoplastic resin.
- the thermoplastic resin used for the base material layer includes polystyrene resin, polyolefin resin, polycarbonate resin, ABS resin, polyester resin, polyphenylene ether resin, acrylic resin, polyamide resin, and the like. Polyurethane resins and their alloy resins can be used.
- the thickness of the sheet or electronic component packaging container is preferably 0.1 to 5 mm.
- 2 0 im or less when the thickness of the surface layer is the surface resistivity of the surface layer is more than 1 0 1 4 Omega Zeta mouth, still more preferably 1 0 111 or less.
- the thickness of the surface layer is not particularly limited, but is preferably 200 ° or less, more preferably 100 im or less.
- the thickness of the base layer in the total thickness of the conductive layer and the base layer is preferably 20% or more.
- the method for producing the sheet is not particularly limited.
- a thermoplastic resin to be a surface layer, a conductive layer and a compound of a conductive filler, an antistatic agent or a conductive resin are kneaded by various kneading machines such as a twin-screw extruder and a continuous kneading machine. Be converted.
- the pellets are supplied to a plurality of extruders, and the base layer, the conductive layer, and the resin of the surface layer are respectively supplied thereto, and the pellets are formed by a multilayer coextrusion method such as a feed block method or a multi-manifold method. It is possible to manufacture laminated sheets.
- a method of sequentially coating and laminating a conductive layer and a surface layer on a base material layer formed using an extruder or a method of forming a surface layer on a sheet of a conductive layer formed using an extruder. Sheets can be manufactured by coating and laminating.
- the sheet can be used for an electronic component packaging container.
- Electronic component packaging containers are containers for electronic components such as ICs, LEDs, resistors, capacitors, inductors, transistors, and diodes. Particularly, it is suitable for IC which is easily affected by static electricity.
- Sheets can be vacuum-formed, compressed-air-formed, and hot-plated to produce electronic-form packaging containers such as vacuum-formed trays, magazine tubes, and carrier tapes (embossed carrier tapes).
- HIPS HI-E4, Toyo Styrene
- acetylene black Denki Kagaku Kogyo
- the mixture was kneaded using a ⁇ 45 mm vent-type twin screw extruder, and pelletized by a strand cutting method to obtain a resin composition constituting a conductive layer.
- Thickness was applied to obtain a four-layer sheet of surface layer / conductive layer base material layer / conductive layer.
- the surface resistivity of the surface layer was used 7. 4 X 1 0 1 ° ⁇ " was the mouth. Measurement of surface resistivity SI MC O Co. ST- 3 surface resistivity meter.
- HIPS HIPS
- acetylene black Denki Kagaku Kogyo
- a high-speed kneader 100 parts by weight of acetylene black (Denka Black granular, Denki Kagaku Kogyo) was weighed at a ratio of 24 parts by weight and uniformly mixed using a high-speed kneader. Then, it is kneaded using a ⁇ 45 mm vent type twin-screw extruder, and is pelletized by a strand cutting method to form a resin layer that forms a conductive layer. A product was obtained.
- AP T-310 antistatic agent kneading resin, Denki Kagaku Kogyo
- LZD 28
- a feed block method using a T die Lamination was performed to obtain a three-layer sheet of surface layer / conductive layer / surface layer having a total thickness of 0.3 mm and a layer thickness ratio of 90: 120: 90.
- the conductive layer is 1. a 5 ⁇ 1 0 6 ⁇ Noro,
- the surface resistivity of the surface layer 6. was 4 X 1 ⁇ ⁇ ⁇ / mouth.
- a carrier tape was prepared from the sheets of Examples 1 and 2 using a vacuum drum molding machine so that the surface layer was in contact with the inside, that is, with the IC. After being vibrated at 50 mm and a frequency of 450 rpm for 1 hour, the device was allowed to stand for 24 hours, and then the state of damage to the IC due to static electricity was confirmed. As a result of this evaluation, destruction of IC was not confirmed at all in 100,000 samples.
- Raw materials of 15 parts by weight of carbon black and 85 parts by weight of impact-resistant polystyrene resin were respectively weighed and uniformly mixed by a high-speed mixer, and then kneaded using a ⁇ 45 mm vent-type twin-screw extruder to obtain strands.
- the pellet was pelletized by a cutting method to obtain a conductive resin composition.
- Acrylic resin was applied to one side of the above sheet using Barco overnight to a thickness of 2, 5, and 10 xm, and the coated surface was evaluated for electrostatic attenuation and carbon desorption. .
- Table 1 shows the evaluation results. In each of the examples, an antistatic effect was confirmed, and there was no desorption of carbon black. table 1
- Acrylic resin was applied to one side of the sheet so as to have a thickness of 25 m each using the sheet as it was and using a barco overnight, and the static decay and carbon desorption were evaluated. Table 2 shows the evaluation results. In the sample to which the acrylic resin was not applied, desorption of the carbon black was confirmed, and there was no antistatic effect when the acrylic resin was applied in a thickness of 25 m. Table 2
- the electrostatic decay is in accordance with FTMS-101C, and after applying 500 V to the sample, the potential difference becomes 250 V (50), 500 V (10%), 0 The time until V (0%) was measured.
- the presence or absence of force-pon desorption is determined by reciprocating a QFP 14 mm X 20 mm / 64-pin IC on the surface of each sheet and plate sample 100 times with a stroke of 15011] 1 and then leading the IC.
- composition having a charging sequence close to that of an electronic component was used as a surface layer.
- Nanokuro down meter and Faraday cage, t Ionaiza one of measuring the charge amount of electronic components using the SIMCO Company AEROSTATPC.
- the shaker used was a cute mixer manufactured by Tokyo Rikakikaisha.
- Riichi Pump Rack (Product name: Denka Acetylene Black, manufactured by Denki Kagaku Kogyo) 20 parts by weight, HIPS (Toyo Styrene Product Name: Toyo Styrol HI — U 2-301 U) 70 parts by weight, styrene System Elastoma (Product name of JSR) TR 2 0 3) 10 parts by weight of the raw materials were weighed and uniformly mixed in a tumbler, then kneaded using a ⁇ 45 mm dia.45 mm co-rotating twin-screw extruder.
- a c this compound a that created the Konpaundo a serving as the conductive layer was again melt-kneaded by a single-screw extruder to prepare a sheet of 0. 2m m thickness by T-die.
- the surface resistivity of this sheet was 1 0 4 ⁇ / mouth.
- the resin constituting the surface layer 75 parts by weight of vinylidene fluoride polymer (product name: 720, manufactured by KYNAR) and polymethyl methacrylate (manufactured by Mitsubishi Rayon Co., Ltd.) as an acrylate polymer are used.
- Acrypet G 25 parts by weight were blended in a tumbler, and a compound B was prepared by melt-kneading and extruding with a 445 mm dia. This compound B was melt-kneaded again with a single screw extruder, and a 30-thick film was formed with a T-die.
- the film was stuck on a 30 cm slope with the angle shown in FIG. 1 set to 30 degrees, and ionized air was blown on the film surface to remove film charges. Then, similarly, after removing the charge of the IC (MQ FP type 28 mm square) which becomes an electronic component by using ionized air, the chip was slid off and the charge amount of the IC was measured. It was Coulomb.
- Compound A and Compound B are laminated by the feed block method using two ⁇ 45 mm extruders and extruded from the T die, so that the total thickness is 0.3 mm, and the surface layer thickness of Compound B on both sides of the sheet Thus, a three-layer sheet having a surface layer Z and a surface layer having a thickness of 15 zzm was obtained.
- the surface resistivity of this sheet was 10 12 ⁇ or more.
- the surface layer of this sheet was formed into a carrier tape shape by a vacuum forming machine so as to be in contact with the inside, that is, with the IC, and the IC, which is the contents of the pocket, was filled and attached to a shaker, and then rotated at 700 rpm. Shake for 1 hour. After that, the open short tester (Tokyo Denshi Trading Co., Ltd.) confirmed the destruction of the IC. As a result of this evaluation, no destruction of the IC was confirmed. (Example 7)
- ABS resin (trade name of Denka ABS) manufactured by Denki Kagaku Kogyo Co., Ltd. and a long-lasting antistatic agent (trade name of Sanyo Chemical Co., Ltd .: ⁇ Restat NC 63) 21 1): 15 parts by weight were blended in a tumbler, and a compound C was prepared by melt-kneading and extruding with a 445 mm co-rotating twin-screw extruder from Ikegai Machinery Co., Ltd. The compound C was melt-kneaded again with a single screw extruder, and a 30-m thick film was prepared with a T-die.
- ABS resin trade name of Denka ABS manufactured by Denki Kagaku Kogyo Co., Ltd.
- a long-lasting antistatic agent (trade name of Sanyo Chemical Co., Ltd .: ⁇ Restat NC 63) 21 1): 15 parts by weight were blended in a tumbler, and a compound C was prepared by melt-kneading and extrud
- the film was stuck on a 30 cm slope with the angle shown in FIG. 1 set to 30 degrees, and ionized air was blown onto the film surface to remove the film charge. Then, similarly, after removing the charge of the IC (MQ FP type 28 mm square) as an electronic component using ionized air, the charge was slid off and the charge amount of the IC was measured. It was Coulomb.
- Compound A and compound C were laminated by the feed block method using two ⁇ 45 mm extruders and then extruded from the T die, so that the total thickness was 0.3 mm, and the surface layer thickness of compound C on both sides of the sheet was reduced. A three-layer sheet having 15 im of the surface layer / conductive layer surface layer was obtained. The surface resistivity of the surface layer of this sheet was 1 ⁇ ⁇ ⁇ / mouth.
- the surface layer of this sheet was formed into a carrier tape shape with a vacuum forming machine so as to be in contact with the inside, that is, with the IC, and the pocket was filled with the IC, which was the content, and attached to a shaker. Shake at pm for 1 hour. After that, Yuichi Totes (Tokyo Denshi Trading Co., Ltd.) confirmed the destruction of the IC. As a result of this evaluation, no destruction of the IC was confirmed.
- Carbon black (Product name: Denka Acetylene Black manufactured by Denki Kagaku Kogyo)
- the resin constituting the surface layer 83 parts by weight of a low-density polyethylene resin (product name: Novatec LC612) manufactured by Nippon Polychem and a long-lasting antistatic agent (product name: Pelestat, manufactured by Sanyo Chemical Co., Ltd.) 300): 17 parts by weight were blended in a tumbler, and the mixture was melt-kneaded and extruded with a co-rotating twin-screw extruder with a diameter of 45 mm of Ikegai Machinery Co., Ltd. to prepare Compound E.
- This compound E was melt-kneaded again with a single screw extruder, and a film having a thickness of 30 im was formed using a T-die.
- a film was stuck on a slope of 30 cm with a slope length of 30 degrees, and ionized air was blown on the film surface to remove film charges. Then, similarly, after removing the charge of the IC (MQ FP type 28 mm square) as an electronic component using an ionization tool, the charge was slid off, and the charge amount of the IC was measured. It was nano-carbon.
- Compound D and Compound E are laminated by the feedblock method using two ⁇ 45 mm extruders and extruded from the T die to obtain a total thickness of 0.3 mm, and the thickness of the surface layer composed of Compound E on both sides of the sheet
- a three-layer sheet having a surface layer / conductive layer / surface layer configuration of 20 m was obtained.
- the surface resistivity of the surface layer of this sheet was 101 () ⁇ / port.
- the carrier was formed into a carrier tape shape, the contents of the pocket were filled with an IC, which was attached to a shaker, and then shaken at 700 rpm for 1 hour. After that, the IC's destruction status was confirmed at Open Short Tester I (Tokyo Denshi Trading Co., Ltd.). As a result of this evaluation, no destruction of the IC was confirmed.
- the resin constituting the surface layer 25 parts by weight of a polycarbonate resin (trade name: Panlite L1225) manufactured by Teijin Chemicals Co., Ltd., and ABS resin (trade name: Denka ABS) manufactured by Denki Kagaku Kogyo: 75
- a polycarbonate resin trade name: Panlite L1225) manufactured by Teijin Chemicals Co., Ltd.
- ABS resin trade name: Denka ABS
- Denki Kagaku Kogyo 75
- the mixture was blended with a weight part in a tumbler, and a compound E was prepared by melt-kneading and extruding using a co-rotating twin-screw extruder with a diameter of 45 mm by Ikegai Machinery Co., Ltd.
- This compound G was melt-kneaded again with a single screw extruder, and a 25-m thick film was formed with a T-die.
- a film was stuck on a 30 cm slope, and ionized air was blown on the film surface to remove film charges. After that, the charge of the IC (MQ FP type 28 mm square), which is to be an electronic component, was removed using ionized air in the same manner, and the chip was slid off. The charge amount of the IC was measured. Met. Compound F and Compound G are extruded from a multi-manifold die using two 5 mm extruders, so that the total thickness is 0.3 mm, and the surface layer composed of compound G on both sides of the sheet has a surface layer thickness of 2 ⁇ . A three-layer sheet having the structure of ⁇ conductive layer ⁇ surface layer was obtained.
- the surface resistivity of the surface layer of this sheet was 10 12 ⁇ opening or more.
- the surface layer of this sheet was formed into a carrier tape shape with a vacuum forming machine so as to be in contact with the inside, that is, with the IC, and the pocket was filled with the IC as a content, and attached to a shaker. Shake at rpm for 1 hour. After that, the open shot tester (manufactured by Tokyo Denshi Trading Co., Ltd.) confirmed the status of IC rupture. As a result of this evaluation, no destruction of the IC was confirmed.
- Car pump rack (Product name: Denka Acetylene Black, manufactured by Denki Kagaku Kogyo) 20 parts by weight, high impact polystyrene (Toyo Styrene, product name: Toyo Styrol HI—U2—301 U) 70 parts by weight, styrene-based elas Toma-I (JSR product name: TR 2 0 3) 10 parts by weight of the raw materials were weighed and mixed uniformly in a tumbler. Ikegai Machinery Co., Ltd. * 45 mm co-rotating twin-screw extruder The resulting mixture was kneaded, and the strand was cut by a pelletizer to prepare a compound A to be a conductive layer. The compound A was melted and kneaded again with a single screw extruder, and a sheet having a thickness of 0.25 mm was formed with a T die. The surface resistivity of this sheet was 104 ⁇ / cm2.
- a resin constituting the surface layer a graft copolymer resin having polyethylene main chain and polystyrene as side chains (trade name: MODIPER A110, manufactured by NOF Corporation) was used.
- the resin H constituting the surface layer was melt-kneaded with a single screw extruder, and a 25-thick film was formed with a T-die.
- a film was stuck on a 30 cm slope with the angle shown in FIG. 1 set to 30 degrees, and ionized air was blown on the film surface to remove film charges.
- the charge of the IC MQ FP type 28 mm square
- the chip was slid off.
- the charge amount of the IC was measured. It was a nanocoulomb.
- the total thickness is 0.3 mm, and the surface layer thickness of compound H on both sides of the sheet is 10 zm.
- a three-layer sheet having the structure of the surface layer, the conductive layer Z, and the surface layer was obtained.
- the surface resistivity of the surface layer of this sheet is 10 12 ⁇ / mouth was over.
- the surface layer of this sheet was formed into a carrier tape shape by a vacuum forming machine so as to be in contact with the inside, that is, with the IC, and the pocket was filled with the IC, which is the content, and attached to a shaker. Shake at rpm for 1 hour. Then, the open short tester (Tokyo Denshi Trading Co., Ltd.) confirmed the destruction of IC. As a result of this evaluation, no destruction of IC was confirmed.
- the present invention static electricity generated in the process of transporting and storing electronic components using an injection tray, a vacuum forming tray, a magazine, a carrier tape (embossed carrier tape), which is a packaging container for electronic components such as ICs, and the like.
- a carrier tape embssed carrier tape
- the present invention is also effective against static electricity damage to electronic components that are highly integrated, have fine wiring, and are extremely susceptible to electrostatic damage.
Landscapes
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Packages (AREA)
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002313243A AU2002313243A1 (en) | 2002-06-14 | 2002-06-14 | Sheet and electronic component packaging container |
JP2004513026A JP4209387B2 (ja) | 2002-06-14 | 2002-06-14 | 電子部品包装容器用積層シート及び電子部品包装容器 |
CNB028291255A CN1301854C (zh) | 2002-06-14 | 2002-06-14 | 片材和电子元件包装容器 |
US10/343,308 US7097900B2 (en) | 2002-06-14 | 2002-06-14 | Sheet and electronic component packaging container |
PCT/JP2002/005971 WO2003106165A1 (ja) | 2002-06-14 | 2002-06-14 | シート及び電子部品包装容器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2002/005971 WO2003106165A1 (ja) | 2002-06-14 | 2002-06-14 | シート及び電子部品包装容器 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003106165A1 true WO2003106165A1 (ja) | 2003-12-24 |
Family
ID=29727359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/005971 WO2003106165A1 (ja) | 2002-06-14 | 2002-06-14 | シート及び電子部品包装容器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7097900B2 (ja) |
JP (1) | JP4209387B2 (ja) |
CN (1) | CN1301854C (ja) |
AU (1) | AU2002313243A1 (ja) |
WO (1) | WO2003106165A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008260187A (ja) * | 2007-04-11 | 2008-10-30 | Yamato Esuron Kk | 導電性樹脂積層シート及び非帯電樹脂容器 |
JP2017071073A (ja) * | 2015-10-05 | 2017-04-13 | 住化プラステック株式会社 | 熱可塑性樹脂製多層シート及び熱可塑性樹脂製段ボール構造体 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US7390560B2 (en) * | 2004-04-02 | 2008-06-24 | Pel Associates | Smart coating systems |
US7794807B2 (en) * | 2004-09-07 | 2010-09-14 | Denki Kagaku Kogyo Kabushiki Kaisha | Conductive composite sheeting |
CN101500804B (zh) * | 2006-08-10 | 2013-07-31 | 电气化学工业株式会社 | 导电性片材 |
JP5554561B2 (ja) * | 2007-04-11 | 2014-07-23 | 住友ベークライト株式会社 | 電子部品包装体 |
US8167490B2 (en) | 2009-04-22 | 2012-05-01 | Reynolds Consumer Products Inc. | Multilayer stretchy drawstring |
US20130199961A1 (en) * | 2010-10-13 | 2013-08-08 | Denki Kagaku Kogyo Kabushiki Kaisha | Cover film |
CN102923385B (zh) * | 2012-11-05 | 2014-09-24 | 浦江亿通塑胶电子有限公司 | 用于电子元器件包装承载带的片材及其加工方法 |
CN103024104B (zh) * | 2012-11-19 | 2015-09-30 | 上海本朴科技发展有限公司 | 屏幕保护贴膜 |
CN108454206B (zh) * | 2017-02-17 | 2021-04-06 | 住化塑料技术株式会社 | 热塑性树脂制多层片材及热塑性树脂制瓦楞纸板结构体 |
CN109504016B (zh) * | 2018-10-30 | 2021-05-25 | 大连中比动力电池有限公司 | 一种ptc薄膜及其制备方法和热敏电阻器 |
CN110562603A (zh) * | 2019-09-16 | 2019-12-13 | 昆山新贝斯特电子包装材料有限公司 | 一种高强度载带及其制造方法 |
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- 2002-06-14 WO PCT/JP2002/005971 patent/WO2003106165A1/ja active Application Filing
- 2002-06-14 US US10/343,308 patent/US7097900B2/en not_active Expired - Lifetime
- 2002-06-14 AU AU2002313243A patent/AU2002313243A1/en not_active Abandoned
- 2002-06-14 JP JP2004513026A patent/JP4209387B2/ja not_active Expired - Fee Related
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US4699830A (en) * | 1986-06-30 | 1987-10-13 | Baxter Travenol Laboratories, Inc. | Laminated sheet material for packaging electronic components |
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JP2017071073A (ja) * | 2015-10-05 | 2017-04-13 | 住化プラステック株式会社 | 熱可塑性樹脂製多層シート及び熱可塑性樹脂製段ボール構造体 |
Also Published As
Publication number | Publication date |
---|---|
US7097900B2 (en) | 2006-08-29 |
CN1628027A (zh) | 2005-06-15 |
AU2002313243A1 (en) | 2003-12-31 |
JP4209387B2 (ja) | 2009-01-14 |
US20040005465A1 (en) | 2004-01-08 |
JPWO2003106165A1 (ja) | 2005-10-13 |
CN1301854C (zh) | 2007-02-28 |
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