WO2002060987A1 - Resine de moulage pour tamis utilise dans le nettoyage de pieces electroniques et tamis obtenu - Google Patents

Resine de moulage pour tamis utilise dans le nettoyage de pieces electroniques et tamis obtenu Download PDF

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Publication number
WO2002060987A1
WO2002060987A1 PCT/JP2002/000704 JP0200704W WO02060987A1 WO 2002060987 A1 WO2002060987 A1 WO 2002060987A1 JP 0200704 W JP0200704 W JP 0200704W WO 02060987 A1 WO02060987 A1 WO 02060987A1
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WO
WIPO (PCT)
Prior art keywords
jig
cleaning
molding material
fluororesin
electronic
Prior art date
Application number
PCT/JP2002/000704
Other languages
English (en)
Japanese (ja)
Inventor
Tatsuya Higuchi
Masaji Komori
Tsuyoshi Miyamori
Tetsuo Shimizu
Original Assignee
Daikin Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries, Ltd. filed Critical Daikin Industries, Ltd.
Publication of WO2002060987A1 publication Critical patent/WO2002060987A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms

Definitions

  • the present invention relates to a molding material suitable as a jig for cleaning electronic components, and a jig for cleaning electronic components formed by molding the same.
  • JP-A-6-103511 proposes cleaning by ultrasonic cleaning using an aqueous solution of a surfactant.
  • the object to be cleaned is immersed in an aqueous solution of a surfactant, and ultrasonic waves are emitted to remove contaminants attached to the object to be cleaned.
  • ABS and PBT are used as cleaning jigs for this purpose in terms of moldability and cost.
  • GMR giant magnetoresistive
  • Japanese Patent Laid-Open No. 11-256196 proposes cleaning by ultrasonic cleaning using an organic solvent-based cleaning agent.
  • the jigs used in the past have poor solvent resistance, and even solvent-resistant materials such as PPS and PEEK will generate particles and cracks in the jig after washing 1 to 3 times.
  • the present invention provides cleaning by ultrasonic cleaning using an organic solvent-based cleaning agent.
  • the present invention also provides a molding material that suppresses the generation of rust and reduces residual stress, and a jig for cleaning electronic components such as a magnetic head that requires a high degree of cleanability by molding the molding material. The purpose is to do so.
  • the present invention is a resin molding material for a jig for cleaning electronic parts, comprising a fluororesin, a thermoplastic resin other than the fluororesin, and a reinforcing filler.
  • the present invention is also a jig for cleaning electronic parts formed by molding the molding material.
  • FIG. 1 is a perspective view of an electronic component cleaning jig prepared in Example 8.
  • Figure 2 shows the shape of the bar flow cavity used in the perflow test.
  • the first component of the resin molding material for a jig for cleaning electronic parts of the present invention is a fluororesin.
  • the fluororesin is not particularly limited as long as it is a synthetic polymer containing a fluorine atom in the molecule, and a known polymer can be used. Examples of such materials include polytetrafluoroethylene / reo ethylene (PTFE), tetrafluoroethylene-perfluoroalkylvinyl ether copolymer (PFA), and tetrafluoroethylene-hexafluoro.
  • PTFE polytetrafluoroethylene / reo ethylene
  • PFA tetrafluoroethylene-perfluoroalkylvinyl ether copolymer
  • FEP polypropylene copolymer
  • ETFE tetrafluoroethylene-ethylene copolymer
  • the PFA is preferably composed of tetrafurfuryl O b Ethylene 99-92 wt 0/0 and full Ruo b alkyl Biel ether 1-8 wt 0/0 using.
  • the FEP is preferably tetrafurfuryl O b ethylene 99 to 80 weight 0/0 Toeki fully O b propylene 20 wt. / o.
  • the ETFE preferably comprises 90 to 74% by weight of tetrafluoroethylene; It consists of 10 to 26% by weight of ethylene.
  • the fluororesin may contain another monomer as long as the essential properties of the resin are not impaired.
  • Other monomers include tetrafluoroethylene (excluding PFA, FEP and ETFE.), Hexafluoropropylene (excluding FEP), perfluoroa ⁇ / kirubiel Ether (however, excluding PFA), perfluoroalkylethylene (alkyl group having 1 to 10 carbon atoms), perfluoronorky quinolearyl ether (alkyl group having 1 to 10 carbon atoms), and formula :
  • CF 2 CF [OCF 2 CF (CF 3 )] n OCF 2 (CF 2 ) p Y
  • ⁇ represents a halogen
  • II represents an integer of 0 to 5
  • ⁇ represents an integer of 0 to 2.
  • the amount of other monomers is up to 50% by weight of the polymer, preferably from 0.01 to 45% by weight.
  • the molecular weight of the fluororesin is not particularly limited, especially in the case of PTFE, melting viscosity is preferably from 10 7 poise or less at 3 80 ° C. These fluororesins may be used alone or in combination of two or more.
  • the second component of the resin molding material for a jig for cleaning electronic parts of the present invention is a thermoplastic resin other than a fluororesin.
  • the thermoplastic resin is not particularly limited, and known ones can be used. Examples thereof include polyphenylene sulfide (PPS), polyester ether ketone (PEEK), aromatic polyester, and thermoplastic polyester. Mid and polyamide imide (PAI) are preferred. More preferably, P P S, P
  • thermoplastic resin is not particularly limited. These thermoplastic resins may be used alone or in combination of two or more.
  • the third component of the resin molding material for an electronic component cleaning jig of the present invention is a reinforcing filler.
  • a reinforcing filler There is no particular limitation on the above-mentioned aggressive filler, and examples thereof include a powdery filler, a fiber-like filler, a flake-like filler, and the like. Among them, a fibrous filler is preferred in view of compatibility with resin.
  • the fibrous filler is not particularly limited, and may be, for example, glass fiber, carbon fiber, graphite fiber, ceramic fiber, rock wool, slag wool, titanate lithium whiskers, silicone carbide whiskers, sapphire whiskers,- Well-known aluminum borate whiskers, wollastonite, copper wires, steel wires, stainless steel wires, silicon carbide fibers; organic fibers such as aromatic polyamide fibers, rayon, phenolic resin, and polybenzimidazole fibers; Can be used.
  • glass fibers, carbon fibers, ceramic fibers, and organic fibers are preferable, and carbon fibers are particularly preferable, from the viewpoint of the moldability of the resin molding material for an electronic component cleaning jig of the present invention.
  • the carbon fibers may be any of PAN-based, pitch-based, cellulose-based and the like.
  • the fiber diameter of the carbon fiber is preferably 5 to 3 in order to meet the purpose of the present invention.
  • the shape of the carbon fiber has an aspect ratio of] L C! For the purpose of imparting good hardness. ⁇ 300 are preferred.
  • the fluororesin is 20 to 60% by weight based on the total amount of the fluororesin, the thermoplastic resin other than the fluororesin, and the reinforcing filler, and the thermoplastic resin other than the fluororesin is used. It is preferable that the resin is 30 to 75% by weight, and the content of the cohesive filter is 5 to 30% by weight.
  • the fluororesin is less than 20% by weight / o, a large internal distortion remains in the case of a molded article with a complicated shape, and erosion is generated by ultrasonic cleaning using an organic solvent-based cleaning agent. However, particles tend to be generated and the cleaning property tends to be impaired.
  • the content exceeds 60% by weight, the fluidity of the mixture becomes low, and it may be difficult to form a complicated molded product.
  • the content of the fluororesin is more preferably from 20 to 50% by weight. If the amount of the thermoplastic resin other than the fluororesin is less than 30% by weight, the fluidity of the mixture becomes low, and it may be difficult to form a molded article having a complicated shape.
  • the content of the thermoplastic resin other than the fluororesin is more preferably 30 to 65% by weight.
  • the content of the catching strong filler is more preferably 5 to 2 0 weight 0/0.
  • the resin molding material for a jig for washing electronic parts of the present invention is excellent in moldability, and a bar flow test flow distance can be used as a scale indicating the moldability.
  • the bar flow test is one of the test methods for evaluating moldability (fluidity) by injection molding using a bar flow mold. The longer the flow length, the better the moldability.
  • the molding material of the present invention preferably has a flow length (mm) of 50 or more, more preferably 60 or more, and even more preferably 70 or more.
  • the method for producing the resin molding material for a jig for cleaning electronic parts of the present invention is not particularly limited, and a known kneading method or the like can be employed.
  • it can be manufactured by preliminarily mixing a fluororesin and a thermoplastic resin other than the fluororesin with a mixer, a tumbler or the like, adding a reinforcing filler, and melt-kneading with a twin-screw extruder or the like.
  • components other than those described above can be contained within a range not impairing the present invention.
  • Such components include, for example, one or two of known antioxidants, heat stabilizers, ultraviolet absorbers, lubricants, release agents, dyes, pigments, flame retardants, flame retardant aids, and antistatic agents. More than species can be mentioned.
  • the method for manufacturing the electronic component cleaning jig by molding the resin molding material for an electronic component cleaning jig of the present invention is not particularly limited. It is possible to preferably employ a method of molding under the condition of 400, a mold temperature of about 100 to 200 ° C., etc., after obtaining an intermediate processed product by compression molding, extrusion molding, etc. A processing method can also be adopted.
  • the electronic component cleaning jig of the present invention is formed by molding the above resin molding material for electronic component cleaning jig.
  • the shape is not particularly limited as long as the electronic component can be held when the electronic component is washed and can be easily arranged or detached before or after the washing. Specifically, for example, the shape shown in FIG. In the jig of FIG. 1, the electronic components are cleaned while one electronic component is arranged in each recess. ,
  • the electronic component in the resin molding material for an electronic component cleaning jig or the electronic component cleaning jig of the present invention is preferably a magnetic head of a magnetic disk device, and particularly preferably a GMR.
  • the cleaning conditions that can exert the effect of the present invention are organic, This is based on ultrasonic cleaning using a solvent-based cleaning agent.
  • the organic solvent-based detergent include N-methylpyrrolidone, normal paraffin, isoparaffin, naphthene, and an aromatic solvent.
  • PPS manufactured by Toprene, melting point: 285 ° C
  • PTFE manufactured by Daikin Industries, L-5F
  • carbon fibers manufactured by Kureha Chemical
  • test piece was prepared and the flow length was measured under the following conditions. (Preparation of test piece)
  • the pellets obtained above were injection molded using an injection molding machine (Sumitomo Heavy Industries, SG50) at a cylinder temperature of 270 to 320 ° C and a mold temperature of 140 ° C to obtain test pieces.
  • the tensile strength, elongation and flexural modulus of this test piece were measured under the following conditions.
  • the test piece obtained above was subjected to a cleaning test as follows.
  • the cleaning of electronic component cleaning jigs using an organic solvent-based cleaning agent is usually carried out at about 30 to 60 ° C for only a few minutes, so the cleaning test shown below is an accelerated test. is there.
  • a cleaning agent NMP: N-methylpyrrolidone
  • NMP N-methylpyrrolidone
  • the cleaning liquid was indirectly heated to 55 ° C by heating the pure water in the cleaning tank to 55 ° C using a heater.
  • apply the test piece to the cleaning solution in the beaker. It was immersed and irradiated with ultrasonic waves for 6 hours for cleaning. Thereafter, the test piece was taken out, a washed test piece was obtained, and deformed warp and cracks in the appearance were visually observed.
  • Figure 2 shows the shape of the cavity.
  • the dimensions of the cavity are lmm in thickness and 2 Omm in width, and the gate is a film gate.
  • Nozzle temperature 3 20 ° C
  • the measurement was performed according to ASTM D790 using a universal testing machine manufactured by Orientec. 4. Appearance of test piece after washing ... After the washing test under the above conditions, it was visually observed according to the following criteria.
  • Example 8 From the results shown in Table 1, it was found that the molding material of Example 17 had a long flow length, and that even if the obtained test piece was washed under the above conditions, no deformation warpage occurred. On the other hand, since the molding material of Comparative Example 1 did not contain a fluororesin, deformation warpage and cracks were observed on the test piece. The test piece of Comparative Example 1 has high tensile strength and high flexural modulus. Therefore, it is considered that the internal distortion of the molded product is large.
  • Example 8 Example 8
  • Example 1 The composition of Example 1 was injection-molded using an injection molding machine (manufactured by Sumitomo Heavy Industries, Ltd., SG50) at a cylinder temperature of 270 to 320 ° C and a mold temperature of 140 ° C. Thus, a jig as shown in Fig. 1 was created. A jig with a well-defined shape was obtained. Industrial applicability
  • the resin molding material for cleaning electronic parts of the present invention has the above-described structure, so that it has good moldability, is excellent in molding a complicated shape, does not deform by cleaning, and is an extremely useful electronic part cleaning jig. Tools can be obtained.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

L'invention porte sur un matériau de moulage qui ne peut se déformer ou craqueler et dont la contrainte résiduelle est réduite lorsqu'il est utilisé dans le nettoyage ultrasonique avec un détergent à base de solvant organique. L'invention porte également sur un tamis de nettoyage obtenu par moulage du matériau, ce tamis étant utilisé dans le nettoyage de pièces électroniques telles que des têtes magnétiques qui nécessitent un nettoyage extrêmement profond. Le matériau de moulage pour les tamis de nettoyage des pièces électroniques comprend une fluorésine, une résine thermoplastique différente des fluorésines et une charge de renforcement.
PCT/JP2002/000704 2001-01-30 2002-01-30 Resine de moulage pour tamis utilise dans le nettoyage de pieces electroniques et tamis obtenu WO2002060987A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001021518A JP2002226660A (ja) 2001-01-30 2001-01-30 電子部品洗浄用治具用樹脂成形材料及びそれを用いた電子部品洗浄用治具
JP2001-21518 2001-01-30

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WO2002060987A1 true WO2002060987A1 (fr) 2002-08-08

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Publication number Priority date Publication date Assignee Title
CN101914255B (zh) * 2010-09-02 2011-10-26 中国工程物理研究院化工材料研究所 耐高温低介电常数聚苯硫醚复合材料及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02255751A (ja) * 1989-03-30 1990-10-16 Daikin Ind Ltd 帯電防止フッ素樹脂組成物
JPH07138440A (ja) * 1993-11-17 1995-05-30 Sumitomo Chem Co Ltd 熱可塑性フッ素樹脂組成物および半導体製造工程用冶具
JPH07142433A (ja) * 1993-11-19 1995-06-02 Ask:Kk ポリテトラフルオロエチレン製水系洗浄用治具
JPH10298430A (ja) * 1997-04-25 1998-11-10 Toray Ind Inc ポリフェニレンスルフィド樹脂組成物
JP2000072964A (ja) * 1998-08-07 2000-03-07 Mitsui Chemicals Inc 樹脂組成物及びそれを成形してなる耐熱性リタ―ナブルｉｃトレ―
EP1052272A2 (fr) * 1999-05-10 2000-11-15 Sumitomo Chemical Company, Limited Composition de résine de polyester cristallin liquide

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02255751A (ja) * 1989-03-30 1990-10-16 Daikin Ind Ltd 帯電防止フッ素樹脂組成物
JPH07138440A (ja) * 1993-11-17 1995-05-30 Sumitomo Chem Co Ltd 熱可塑性フッ素樹脂組成物および半導体製造工程用冶具
JPH07142433A (ja) * 1993-11-19 1995-06-02 Ask:Kk ポリテトラフルオロエチレン製水系洗浄用治具
JPH10298430A (ja) * 1997-04-25 1998-11-10 Toray Ind Inc ポリフェニレンスルフィド樹脂組成物
JP2000072964A (ja) * 1998-08-07 2000-03-07 Mitsui Chemicals Inc 樹脂組成物及びそれを成形してなる耐熱性リタ―ナブルｉｃトレ―
EP1052272A2 (fr) * 1999-05-10 2000-11-15 Sumitomo Chemical Company, Limited Composition de résine de polyester cristallin liquide

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