WO1996042095A1 - Transformateur plat - Google Patents

Transformateur plat Download PDF

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Publication number
WO1996042095A1
WO1996042095A1 PCT/JP1996/001597 JP9601597W WO9642095A1 WO 1996042095 A1 WO1996042095 A1 WO 1996042095A1 JP 9601597 W JP9601597 W JP 9601597W WO 9642095 A1 WO9642095 A1 WO 9642095A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
coil
primary coil
hole
secondary coil
Prior art date
Application number
PCT/JP1996/001597
Other languages
English (en)
Japanese (ja)
Inventor
Norihiro Asada
Original Assignee
Nihon Shingo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Shingo Kabushiki Kaisha filed Critical Nihon Shingo Kabushiki Kaisha
Priority to EP96917657A priority Critical patent/EP0782154A4/fr
Priority to KR1019970700848A priority patent/KR970705156A/ko
Publication of WO1996042095A1 publication Critical patent/WO1996042095A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F19/00—Fixed transformers or mutual inductances of the signal type
    • H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
    • H01F30/10—Single-phase transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

Definitions

  • the present invention relates to a flat-shaped transformer having excellent withstand voltage and capable of arbitrarily setting the withstand voltage.
  • Japanese Utility Model Application Laid-Open No. 6-91110 discloses that a primary coil is formed on one side of a double-sided printed circuit board and a secondary coil is formed on the other side. A structure is disclosed in which a core is penetrated by making a hole in the inner part of the next coil.
  • Japanese Utility Model Publication No. 6-9-111 discloses that a primary coil is formed on one single-sided printed circuit board, and a secondary coil is formed on another single-sided printed circuit board. A configuration is disclosed in which a single-sided printed circuit board is superimposed and a core is penetrated inside the primary coil and the secondary coil.
  • HEI 5-3343245 discloses that a two-layer primary flat coil 73 is formed on one surface of an insulating substrate 74 as shown in FIG. A two-layer secondary planar coil 75 is formed on the surface of the coil, these coils 73 and 75 are sealed with an insulator layer 72, and the surrounding area is covered with a magnetic layer 71. Is disclosed.
  • a flat transformer can be provided.
  • a transformer using a printed circuit board it is difficult for a transformer using a printed circuit board to have a sufficient withstand voltage between the primary coil and the secondary coil.
  • the present invention has been made in order to solve such a problem, and provides a flat transformer which can set an isolation voltage arbitrarily and can be easily manufactured by an existing technology. It is an object of the present invention to provide a flat transformer in which a drawer end can be easily changed. Disclosure of the invention
  • an insulating plate is sandwiched between two printed boards on which a coil is formed, a core is penetrated inside the coil, or a coil is inserted between the two printed boards.
  • the core is pierced through the inside of the coil by sandwiching the intermediate printed board provided with the lead wire of the above.
  • the plate-shaped transformer is configured as shown in the following (1) to (8). .
  • a primary coil is formed on a print substrate, and a primary coil substrate having a hole formed in an inner portion of the primary coil is superimposed on the primary coil substrate.
  • An intermediate insulating plate having a hole at a position corresponding to the hole, and a printed circuit board superposed on the intermediate insulating plate, wherein a secondary coil is formed on the printed circuit board, and an inner portion of the secondary coil is formed.
  • a secondary coil substrate having a hole at a location corresponding to the hole of the intermediate insulating plate; and a core inserted into the hole of the primary coil substrate, the hole of the intermediate insulating plate, and the hole of the secondary coil substrate.
  • the intermediate insulating plate is a printed circuit board having a portion extending outside the primary coil substrate and the secondary coil substrate, wherein an element is mounted on the portion extending outside.
  • the flat transformer as described.
  • a primary coil is formed on a printed circuit board, a hole is drilled inside the primary coil, and a hole is formed on the primary coil board.
  • Printed circuit board with a hole in the area corresponding to A printed circuit board superimposed on the intermediate printed circuit board, a secondary coil is formed on the printed circuit board, and a hole is formed in a portion corresponding to the hole of the intermediate printed circuit board inside the secondary coil.
  • a plate-shaped transformer having a secondary coil substrate having a hole formed therein, and a core inserted into the hole of the primary coil substrate, the hole of the intermediate print substrate, and the hole of the secondary coil substrate.
  • a flat transformer with the above-mentioned primary coil and secondary coil lead wires provided on a substrate.
  • One terminal and the other terminal of the coil of the primary coil substrate and the secondary coil substrate each have an upper surface side connection terminal portion on the upper surface of the substrate and a lower surface side connection terminal portion on the lower surface of the substrate.
  • At least one of the primary coil substrate constituting the primary coil and the secondary coil substrate constituting the secondary coil is a plate-like transformer in which a plurality of sheets are laminated, and each of the laminated substrates is The flat transformer according to (4), wherein one terminal of the coil and the other terminal of the coil are connected by hangs.
  • At least one of the primary coil substrate constituting the primary coil and the secondary coil substrate constituting the secondary coil is a plate-shaped transformer in which a plurality of sheets are laminated, and the coil of each of the laminated substrates is formed.
  • the intermediate print substrate is a print substrate having a portion extending outward from the primary coil substrate and the secondary coil substrate, wherein an element is mounted on the outwardly extending portion.
  • the flat transformer according to any one of (7) to (7).
  • the dielectric strength between the primary coil and the secondary coil can be arbitrarily set, and the substrate can be easily manufactured by a normal processing technique for a printed circuit board. Further, in the configuration (2), related elements can be easily mounted.
  • the withstand voltage between the primary coil and the secondary coil can be set arbitrarily, and the ends of the lead wires of the primary coil and the secondary coil can be arbitrarily set on the intermediate printed circuit board. And it can be easily manufactured by a normal processing technique for a printed circuit board. Further, in the configuration (8), the related elements can be easily mounted on the intermediate print substrate.
  • FIG. 1 is a diagram showing the configuration of the first embodiment
  • FIG. 2 is a perspective view of the first embodiment
  • FIG. 3 is a diagram showing the essential parts of the first embodiment separated
  • FIG. FIG. 5 is a diagram showing a configuration of the second embodiment
  • FIG. 6 is a perspective view of the second embodiment
  • FIG. 7 is a diagram showing a configuration of the third embodiment
  • FIG. 8 is a diagram showing the configuration of the third embodiment.
  • FIG. 9 is a view showing the essential parts of the third embodiment separated
  • FIG. 10 is a view showing the manufacturing method of the essential parts of the third embodiment
  • FIG. 11 is the essential parts of the fourth embodiment.
  • FIG. 12 is a diagram showing the configuration of the fifth embodiment
  • FIG. 13 is a perspective view of the fifth embodiment
  • FIG. 14 is a diagram showing the configuration of a conventional example.
  • FIG. 1 is a cross-sectional view showing a configuration of a “flat transformer” according to a first embodiment
  • FIG. 2 is a perspective view of the first embodiment
  • the present embodiment has a schematic configuration. Note that FIGS. 1 to 13 showing the examples are all exaggerated in size for easy understanding, and are particularly thick.
  • FIGS. Figure 4 (a) shows a commercially available 0.1 mm thick, double-sided copper-clad printed circuit board with through holes made of glass epoxy.
  • 41 and 43 are copper layers
  • 42 is a glass epoxy layer
  • 44 is a through hole.
  • a resist ink is printed in a spiral coil pattern by a screen printing method, etched, and the resist is removed to form a coil 45.
  • Lead wires are formed on the lower surface of the print substrate by a similar processing method. Connect the end of the coil and the end of the lead wire with a through hole 44 (see 2, 4 and 4b in Fig. 3).
  • the primary coil substrate and secondary coil substrate shown in Figs. 1 and 5 are 0.2 mm thick glass epoxy upper and lower insulating plates, and 3 is a 0.5 mm thick glass epoxy intermediate insulating plate.
  • An adhesive sheet is sandwiched between each of the above-mentioned plates 1 to 5, pressed and heated to form a laminated plate, and punched into a shape suitable for the E-shaped core 7.
  • the E-shaped core 7 is inserted into the punched laminated plate, and the fastener 8 is attached as shown in Figs.
  • the flat transformer of this embodiment can be easily manufactured by the existing technology, and the withstand voltage depends on the material, thickness, etc. of the upper insulating plate, the lower insulating plate, and the intermediate insulating plate. Can be set arbitrarily.
  • FIG. 5 is a diagram showing a configuration of a “plate-shaped transformer” according to the second embodiment.
  • a printed circuit board is used as an intermediate insulating plate, and necessary elements such as ICs are mounted on the printed circuit board.
  • reference numeral 51 denotes a primary coil substrate, which is manufactured from a commercially available double-sided printed substrate by the same processing method as in the first embodiment.
  • the coil 46 is formed on the lower surface of the substrate by the same processing method.
  • 53 is a secondary coil substrate] It is manufactured by the same processing method as the next coil substrate 51.
  • Reference numeral 52 denotes an intermediate substrate corresponding to the intermediate insulating plate of the first embodiment. As shown in FIG. 6, the intermediate substrate has a portion extending further outward than the primary coil substrate 51 and the secondary coil substrate 53.
  • the required wiring pattern is formed on the intermediate substrate 52 by the same processing method as the coil substrates 51 and 53, and the terminal 62 is formed on a portion extending outward.
  • Each of the substrates 51, 52, 53 is laminated in the same manner as in the first embodiment, and a resin coating layer 55 for insulation is provided on the upper and lower surfaces of the laminate, and is punched into a required shape.
  • the E-shaped core 7 is fitted and the fastener 8 is attached.
  • An element 61 such as an IC is mounted on a portion of the transformer thus formed extending outside the intermediate substrate 52, and the flat transformer of the present embodiment is completed.
  • FIG. 7 is a cross-sectional view showing the configuration of a “plate-shaped transformer” according to the third embodiment
  • FIG. 8 is a perspective view of the third embodiment.
  • This embodiment has a schematic configuration.
  • FIG. 10 (a) shows a cross section of a commercially available double-sided copper-clad printed circuit board with a 0.1 mm thick glass epoxy through-hole.
  • 410 and 430 are copper layers
  • 420 is a glass epoxy layer
  • 440 is a through hole.
  • the coil pattern is printed by a screen printing method, etched, and the resist is removed to form the top surface of the coil 450 and the connection terminals 470 and 480.
  • the lower surface side of the lead wire 460 and the connection terminals 470 and 480 is formed on the lower surface of the printed circuit board by the same processing method.
  • the upper and lower sides of connection terminals 470 and 480 are electrically connected by through holes. These through holes are formed by a known through hole plating method.
  • the other end of the coil and one end of the lead wire 460 are electrically connected through a through hole 440, and the other end of the lead wire 460 is connected to a connection terminal 480. In this way, the primary coil substrate and the secondary coil substrate shown in FIGS.
  • Reference numerals 10 and 50 denote a 0.2 mm thick glass epoxy upper and lower insulating plate, and 30 denotes a 0.5 mm thick glass epoxy double-sided copper-clad intermediate printed circuit board.
  • This double-sided copper-clad intermediate printed circuit board 30 also has terminals 490, 500, lead wires 310, 320, and external terminals 90, 100 formed on the upper surface by the above-described processing method.
  • terminals 510, 520 are formed on the lower surface. Form lead wires and external terminals (not shown). Then, reflow solder is placed on terminals 490, 500, 510, and 520.
  • the adhesive sheet is sandwiched between the above-mentioned plates 10 to 50 except for the terminal portion, pressed and heated to form a laminated plate, and punched into a shape suitable for the E-shaped core 70. During this heating, terminals 470 and 490, 480 and 500, 510 and 530, and 520 and 540 are soldered by reflow soldering.
  • the E-shaped core 70 is inserted into the punched laminate, and the fasteners 80 are attached as shown in Figs.
  • the connection with the primary coil is made via external terminals 90 and 100 provided on the upper surface of the intermediate print substrate 30.
  • the connection with the secondary coil is made via an external terminal (not shown) provided on the lower surface of the intermediate print substrate 30.
  • the plate-shaped translator of this embodiment is the same as the existing print. It can be easily manufactured by substrate processing technology, and the insulation pressure can be set arbitrarily according to the material, thickness, etc. of the upper insulating plate, lower insulating plate, and intermediate print substrate.
  • the specifications such as the turn ratio can be changed.
  • the primary coil and the secondary coil can be pulled out. The position of the end can be arbitrarily changed on the intermediate printed circuit board.
  • FIG. 11A is an external perspective view of a main part
  • FIG. 11B is a cross-sectional view of the same taken along the line AA shown in FIG. 11A.
  • an insulating film 110 is formed on each substrate.
  • an epoxy-based organic insulating film is formed on a portion other than the connection terminals 470 and 480 by screen printing. Do this for both the top and bottom surfaces.
  • connection terminals 470 and 480 are aligned.
  • connection terminals 480 and the connection terminals 470 are soldered.
  • a hang may be poured into the hole 1000 to electrically connect the connection terminals.
  • the coils are connected in parallel in terms of the circuit, so that the copper loss I 2 r (r is the DC resistance of the coil) of the coil is the number of laminated layers when the n, l Z nl 2 r, and the energy loss and heat generation due to copper loss can blink class.
  • the same effect as that of the third embodiment can be obtained, and by connecting the connection terminal portions with the primary solder, a plurality of coil substrates can be easily laminated.
  • FIG. 12 is a diagram showing a configuration of a “plate-shaped transformer” according to the fifth embodiment.
  • required elements such as IC are mounted on an intermediate print substrate.
  • reference numeral 610 denotes a primary coil substrate, which is manufactured from a commercially available double-sided printed circuit board by the same processing method as in the third embodiment.
  • a coil 450-2 is formed on the lower surface of the substrate by the same processing method.
  • One end of the coil 450-1 formed on the upper surface is connected to the terminal 670 on the lower surface via a through hole 660, and the other end of the coil 450-1 is a lower surface via the through hole 680
  • the other end of the coil 450-0-2 is connected to the terminal 6900 on the lower surface.
  • 630 is a secondary coil substrate, which is manufactured by the same processing method as the primary coil substrate 610.
  • Reference numeral 620 denotes an intermediate printed board, which has a portion extending further outward than the primary coil board 610 and the secondary coil board 6300, as shown in FIG.
  • the intermediate print substrate 620 is formed by the same processing method as the coil substrates 610 and 630, in which the lead wire patterns of the primary coil and the secondary coil and the required wiring patterns are formed.
  • a number of terminals 720 of the device are formed.
  • Each of the substrates 6 10, 6 2 0, 6 3 0 is laminated in the same manner as in the third embodiment. It is punched out, the E-shaped core 70 is fitted, and the fastener 80 is removed. Is attached. An element 710 such as an IC is mounted on a portion of the transformer completed in this manner, which extends outside the intermediate print substrate 620, and the flat transformer of the present embodiment is completed.
  • the required external shape is formed by punching, and a hole for a core is formed.
  • the present invention is not limited to this. Is punched into the required external shape and a hole for the core is formed. Then, coils, lead wires, terminals, etc. are formed.
  • the primary printed board and the secondary printed board obtained in this way are mounted on a component printer. It can also be implemented by mounting it on an intermediate print substrate by using.
  • the present invention it is possible to provide a plate-shaped transformer that can be easily manufactured by existing technology and that can set the insulation pressure arbitrarily, and can set the insulation withstand voltage arbitrarily. It is possible to easily change the specifications such as the primary coil and the drawing end of the secondary coil, and to provide a flat transformer that can be easily manufactured using existing technology and that has low energy loss.
  • the flat transformer according to the present invention can be widely used for various switching power supplies, DC-DC converters, signal signal relay drivers, and the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)

Abstract

Un substrat de bobinage primaire (2) est formé par impression d'un motif en bobinage avec une matière de protection puis par gravure d'une plaquette de circuit imprimé à double face du commerce, et un substrat de bobinage secondaire (4) s'obtient par le même procédé. Des références (1, 3, 5) se rapportent à des plaquettes isolantes. On obtient un transformateur plat en interposant des feuilles adhésives entre ces plaquettes (1 à 5), en les comprimant et en les chauffant pour former une plaque stratifiée, en découpant celle-çi pour lui donner une forme souhaitée, en adaptant un noyau (7) à cette plaque stratifiée et découpée, puis en fixant ce noyau à l'aide de dispositifs de fixation (8). Ce transformateur peut présenter une résistance disruptive souhaitée, selon les matériaux utilisés et l'épaisseur des plaquettes isolantes (1, 3, 5).
PCT/JP1996/001597 1995-06-13 1996-06-12 Transformateur plat WO1996042095A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP96917657A EP0782154A4 (fr) 1995-06-13 1996-06-12 Transformateur plat
KR1019970700848A KR970705156A (ko) 1995-06-13 1996-06-12 평판상 트랜스(Flat Transformer)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7/5851U 1995-06-13
JP5585195 1995-06-13

Publications (1)

Publication Number Publication Date
WO1996042095A1 true WO1996042095A1 (fr) 1996-12-27

Family

ID=13010557

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1996/001597 WO1996042095A1 (fr) 1995-06-13 1996-06-12 Transformateur plat

Country Status (2)

Country Link
EP (1) EP0782154A4 (fr)
WO (1) WO1996042095A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009049035A (ja) * 2007-08-13 2009-03-05 Fuji Electric Device Technology Co Ltd 絶縁トランスおよび電力変換装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3615024B2 (ja) 1997-08-04 2005-01-26 株式会社村田製作所 コイル部品
TW388889B (en) * 1997-12-17 2000-05-01 Koninkl Philips Electronics Nv Planar transformer
DE19834615A1 (de) * 1998-07-31 2000-02-03 Thomson Brandt Gmbh Transformator
DE19805914A1 (de) * 1998-02-13 1999-08-19 Thomson Brandt Gmbh Transformator
TW410353B (en) * 1998-02-13 2000-11-01 Thomson Brandt Gmbh Transformer
FR2797089B1 (fr) 1999-07-29 2002-09-20 Cit Alcatel Procede pour l'obtention d'un module incluant un bobinage inductif et module correspondant
JP3620415B2 (ja) * 2000-06-30 2005-02-16 株式会社村田製作所 絶縁型コンバータ
DE10217580A1 (de) * 2002-04-19 2003-11-06 Eupec Gmbh & Co Kg Leistungshalbleitermodul
DE102006022785A1 (de) 2006-05-16 2007-11-22 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Induktives Bauelement und Verfahren zum Herstellen eines induktiven Bau-elements
US7352270B1 (en) 2006-10-27 2008-04-01 Itt Manufacturing Enterprises, Inc. Printed circuit board with magnetic assembly
US8378775B2 (en) 2007-04-26 2013-02-19 Koninklijke Philips Electronics N.V. Planar transformer with boards

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224209A (ja) * 1987-03-12 1988-09-19 Fuji Electric Co Ltd コア用コイル
JPH03183106A (ja) * 1989-12-12 1991-08-09 Sanken Electric Co Ltd プリント配線板
JPH04137602A (ja) * 1990-09-28 1992-05-12 Toshiba Lighting & Technol Corp チップコイル
JPH05275239A (ja) * 1992-03-24 1993-10-22 Murata Mfg Co Ltd 積層型コイル

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2409881C3 (de) * 1974-03-01 1978-12-21 Siemens Ag, 1000 Berlin Und 8000 Muenchen Schalenkernübertrager
JPS6175510A (ja) * 1984-09-21 1986-04-17 Kangiyou Denki Kiki Kk 小形トランス
GB2252208B (en) * 1991-01-24 1995-05-03 Burr Brown Corp Hybrid integrated circuit planar transformer
JPH0613251A (ja) * 1992-06-29 1994-01-21 Tokin Corp インダクタンス装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224209A (ja) * 1987-03-12 1988-09-19 Fuji Electric Co Ltd コア用コイル
JPH03183106A (ja) * 1989-12-12 1991-08-09 Sanken Electric Co Ltd プリント配線板
JPH04137602A (ja) * 1990-09-28 1992-05-12 Toshiba Lighting & Technol Corp チップコイル
JPH05275239A (ja) * 1992-03-24 1993-10-22 Murata Mfg Co Ltd 積層型コイル

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0782154A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009049035A (ja) * 2007-08-13 2009-03-05 Fuji Electric Device Technology Co Ltd 絶縁トランスおよび電力変換装置

Also Published As

Publication number Publication date
EP0782154A1 (fr) 1997-07-02
EP0782154A4 (fr) 1999-08-11

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