US20180209745A1 - Loop heat pipe structure - Google Patents
Loop heat pipe structure Download PDFInfo
- Publication number
- US20180209745A1 US20180209745A1 US15/415,880 US201715415880A US2018209745A1 US 20180209745 A1 US20180209745 A1 US 20180209745A1 US 201715415880 A US201715415880 A US 201715415880A US 2018209745 A1 US2018209745 A1 US 2018209745A1
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- US
- United States
- Prior art keywords
- evaporation chamber
- working fluid
- wick structure
- pipe
- phase working
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Definitions
- the present invention relates to a loop heat pipe structure, and more particularly, to a loop heat pipe structure that enables upgraded vapor-liquid circulation efficiency in the loop heat pipe.
- the currently available electronic apparatus all have enhanced performance.
- electronic elements in the electronic apparatus for signal processing and computing also produce more heat than previous similar electronic elements.
- the most commonly used heat dissipation elements include heat pipe, heat sink, vapor chamber and so on. These heat dissipation elements are in direct contact with the heat-producing electronic elements to enable further enhanced heat dissipation performance of the electronic elements and prevent the same from burning out due to overheat.
- fans can be mounted in the electronic apparatus to enable forced heat dissipation to remove heat from the heat dissipation elements. While fans can indeed upgrade the heat dissipation performance of the electronic apparatus, they are not suitable for use in the electronic apparatus that have a very limited internal space. Therefore, space is also an important factor to be carefully considered when designing the heat dissipation elements.
- the loop heat pipe is formed by combining an evaporation chamber with a condensing unit using a pipe connected to between them.
- the advantage of the loop heat pipe is having its own heat dissipation unit to provide better evaporation and condensation circulation effect.
- the evaporation chamber has a wick structure disposed therein for storing the liquid-phase working fluid that flows back into the evaporation chamber.
- the wick structure is provided with a plurality of grooves, in and along which the vapor-phase working fluid flows.
- the evaporation chamber has at least one surface in contact with a heat source to absorb and transfer heat produced by the heat source to the working fluid stored in the wick structure, the working fluid in the wick structure is therefore heated and evaporated.
- the vapor-phase working fluid flows through the grooves into the pipe connected to between the evaporation chamber and the condensing unit to finally spread in the condensing unit.
- the vapor-phase working fluid passing through the condensing unit is then condensed into liquid-phase working fluid again and flows back into the evaporation chamber to complete one cycle of vapor-liquid circulation in the loop heat pipe.
- the compensation chamber and the vapor core i.e. the wick structure with vapor passages
- the compensation chamber and the vapor core are vertically positioned to overlap with each other.
- the compensation chamber and the vapor core are positioned at two horizontally spaced positions.
- the flat-type evaporator with overlapped compensation chamber and vapor core has a large height or thickness, and is therefore not suitable for a compact electronic apparatus that has very limited internal space.
- a primary object of the present invention is to provide an improved loop heat pipe structure, which overcomes the problem of dry-burning wick structure occurred in the conventional flat-type evaporator with horizontally spaced compensation chamber and wick structure.
- the loop heat pipe structure provided according to the present invention includes an evaporation chamber, a pipe and a condensing unit.
- the evaporation chamber has an outlet and an inlet and internally defines a receiving space.
- a wick structure, a compensation chamber and at least one vapor passage are provided in the receiving space, and the vapor passage has an end communicable with the outlet.
- the pipe has a first and a second end connected to the inlet and the outlet of the evaporation chamber, respectively, and the first end is located closely adjacent to the wick structure.
- the condensing unit includes a plurality of radiating fins externally mounted on the pipe between the first and the second end.
- the condensed working fluid can flow back to the wick structure more efficiently to avoid the problem of dry-burning wick structure as found in the conventional evaporation chamber caused by late compensation of working fluid to the wick structure.
- FIG. 1 is a partially exploded perspective view of a loop heat pipe structure according to a first embodiment of the present invention
- FIG. 2 is an assembled sectional view of the loop heat pipe structure of FIG. 1 ;
- FIG. 3 is an assembled sectional view of a loop heat pipe structure according to a second embodiment of the present invention.
- FIG. 4 is a sectional view showing the loop heat pipe structure according to the present invention in use.
- FIGS. 1 and 2 are partially exploded perspective view and assembled sectional view, respectively, of a loop heat pipe structure 1 according to a first embodiment of the present invention.
- the loop heat pipe structure 1 in the first embodiment includes an evaporation chamber 11 , a pipe 12 and a condensing unit 13 .
- the evaporation chamber 11 is a flat-type evaporation chamber having an outlet 111 and an inlet 112 and internally defines a receiving space 113 .
- a wick structure 114 In the receiving space 113 , there are a wick structure 114 , a compensation chamber 115 and at least one vapor passage 1141 .
- the vapor passage 1141 has an end communicable with the outlet 111 .
- the inlet 112 and the outlet 111 are not necessarily located at the same side on the evaporation chamber 11 , but can be located at two opposite sides of the evaporation chamber 11 .
- the compensation chamber 115 is defined by between the receiving space 113 and the wick structure 114 .
- the evaporation chamber 11 is assembled from an enclosure 11 a and a bottom plate 11 b, which are closed to each other to define the receiving space 113 between them.
- the compensation chamber 115 and the wick structure 114 are horizontally positioned in the receiving space 113 side by side.
- the vapor passage 1141 can be selectively provided on a wall surface of the evaporation chamber 11 facing toward the wick structure 114 , i.e. on an inner surface of the bottom plate 11 b, or be provided on one side of the wick structure 114 that faces toward a heat-absorbing side of the evaporation chamber 11 in contact with a heat source 3 .
- the vapor passage 1141 is provided on one side of the wick structure 114 facing toward the heat-absorbing side of the evaporation chamber 11 .
- the vapor passage 1141 can be otherwise provided on the inner surface of the bottom plate 11 b of the evaporation chamber 11 .
- the wick structure 114 is disposed in the receiving space 113 of the evaporation chamber 11 , such that the compensation chamber 115 is defined by between the wick structure 114 and the receiving space 113 .
- the inlet 112 and the outlet 111 are located in the vicinity of the wick structure 114 . More specifically, the wick structure 114 is located between the inlet 112 and the outlet 111 , while the inlet 112 is located above the outlet 111 .
- the outlet 111 and the inlet 112 can be provided on the evaporation chamber 11 at the same height, or the outlet 111 can be located higher than the inlet 112 , so long as the inlet 112 can be in direct contact with the wick structure 114 .
- the evaporation chamber 11 further has a liquid passage 116 provided therein.
- the liquid passage 116 has an end communicable with the inlet 112 , and is located at one side of the wick structure 114 . More specifically, the liquid passage 116 and the vapor passage 1141 are located at an upper and a lower side of the wick structure 114 , respectively.
- the pipe 12 has a first end 121 and a second end 122 , which are connected to the inlet 112 and the outlet 111 of the evaporation chamber 11 , respectively. And, the first end 121 is located closely adjacent to the wick structure 114 .
- the condensing unit 13 includes a plurality of radiating fins 131 , which are sequentially fixed on and spaced along the pipe 12 to be located between the first end 121 and the second end 122 of the pipe 12 .
- the working fluid 2 is filled in the evaporation chamber 11 or the pipe 12 and is changeable between a vapor phase and a liquid phase.
- the vapor-phase working fluid 21 in the evaporation chamber 11 flows through the vapor passage 1141 into the pipe 12 via the outlet 111 .
- the vapor-phase working fluid 21 spreads in the pipe 12 and flows through the section of the pipe 12 having the radiating fins 131 fitted thereon, the vapor-phase working fluid 21 is condensed into the liquid-phase working fluid 22 .
- the vapor-phase working fluid 21 and the liquid-phase working fluid 22 circulate in the entire loop heat pipe structure 1 .
- the condensing unit 13 is provided on the pipe 12 between the first end 121 and the second end 122 , and can include a plurality of radiating fins or a plurality of cooling pipes.
- FIG. 3 in which a loop heat pipe structure 1 according to a second embodiment of the present invention is shown.
- the second embodiment is generally structurally similar to the first embodiment, except that the outlet 111 and the inlet 112 in the second embodiment are provided at two opposite sides of the evaporation chamber 11 . More specifically, in the second embodiment, the outlet 111 and the inlet 112 are located at a left and a right side of the evaporation chamber 11 , respectively. Further, in the second embodiment, the first end 121 of the pipe 12 is extended into the evaporation chamber 11 via the inlet 112 to end at a position above the wick structure 114 and far away from the compensation chamber 115 .
- the liquid-phase working fluid 22 flowing into the evaporation chamber 11 is directly guided by the first end 121 of the pipe 12 to the wick structure 114 .
- the wick structure 114 is saturated with the liquid-phase working fluid 22 , any surplus of the liquid-phase working fluid 22 will flow into the compensation chamber 115 and be stored therein.
- the liquid-phase working fluid 22 can quickly flow back to the wick structure 114 and the problem of dry-burning wick structure due to insufficient water content can be improved.
- FIG. 4 shows the loop heat pipe structure 1 of the present invention in use.
- the evaporation chamber 11 has one side in contact with the heat source 3 and the wick structure 114 is correspondingly provided in the evaporation chamber 11 on the side in contact with the heat source 3 .
- the wick structure 114 in the evaporation chamber 11 is heated and the liquid-phase working fluid 22 adsorbed to the wick structure 114 is also heated and finally evaporated to form the vapor-phase working fluid 21 .
- the vapor-phase working fluid 21 flows through the vapor passage 1141 on the wick structure 114 to spread into the pipe 12 via the outlet 111 of the evaporation chamber 11 and the second end 122 of the pipe 12 .
- the vapor-phase working fluid 21 flowing in the pipe 12 passes the section of the pipe 12 having the condensing unit 13 provided thereat, the vapor-phase working fluid 21 is condensed into the liquid-phase working fluid 22 again. Then, the liquid-phase working fluid 22 flows back into the evaporation chamber 11 via the first end 121 of the pipe 12 and the inlet 112 of the evaporation chamber 11 .
- the provision of the inlet 112 above the wick structure 114 also enables the liquid-phase working fluid 22 to more quickly fall into the wick structure 114 due to the gravity to advantageously continue the vapor-liquid circulation in the loop heat pipe structure 1 .
- Any other type of heat dissipation element (not shown) facilitating increased condensing effect can also be externally connected to the pipe 12 to enable further improved condensing efficiency.
- the present invention changes the position of the outlet 111 and the inlet 112 of the evaporation chamber 11 relative to the wick structure 114 , such that the liquid-phase working fluid 22 flowing back into the evaporation chamber 11 is first guided to the wick structure 114 instead of the compensation chamber 115 . More specifically, since the wick structure 114 is located directly below the inlet 112 , the liquid-phase working fluid 22 flowing back into the evaporation chamber 11 via the inlet 112 will first reach the wick structure 114 to be stored therein. When the wick structure 114 is saturated with the liquid-phase working fluid 22 , only the surplus of the working fluid 22 will flow into the compensation chamber 115 and be stored therein.
Abstract
Description
- The present invention relates to a loop heat pipe structure, and more particularly, to a loop heat pipe structure that enables upgraded vapor-liquid circulation efficiency in the loop heat pipe.
- The currently available electronic apparatus all have enhanced performance. As a result, electronic elements in the electronic apparatus for signal processing and computing also produce more heat than previous similar electronic elements. The most commonly used heat dissipation elements include heat pipe, heat sink, vapor chamber and so on. These heat dissipation elements are in direct contact with the heat-producing electronic elements to enable further enhanced heat dissipation performance of the electronic elements and prevent the same from burning out due to overheat.
- Further, fans can be mounted in the electronic apparatus to enable forced heat dissipation to remove heat from the heat dissipation elements. While fans can indeed upgrade the heat dissipation performance of the electronic apparatus, they are not suitable for use in the electronic apparatus that have a very limited internal space. Therefore, space is also an important factor to be carefully considered when designing the heat dissipation elements.
- Based on the concept of vapor-liquid circulation in a heat pipe, a loop heat pipe structure in the form of a loop module has been developed. The loop heat pipe is formed by combining an evaporation chamber with a condensing unit using a pipe connected to between them. The advantage of the loop heat pipe is having its own heat dissipation unit to provide better evaporation and condensation circulation effect. The evaporation chamber has a wick structure disposed therein for storing the liquid-phase working fluid that flows back into the evaporation chamber. The wick structure is provided with a plurality of grooves, in and along which the vapor-phase working fluid flows. The evaporation chamber has at least one surface in contact with a heat source to absorb and transfer heat produced by the heat source to the working fluid stored in the wick structure, the working fluid in the wick structure is therefore heated and evaporated. The vapor-phase working fluid flows through the grooves into the pipe connected to between the evaporation chamber and the condensing unit to finally spread in the condensing unit. The vapor-phase working fluid passing through the condensing unit is then condensed into liquid-phase working fluid again and flows back into the evaporation chamber to complete one cycle of vapor-liquid circulation in the loop heat pipe.
- For the currently available flat-type evaporator used in the loop heat pipe, there are two ways for arranging the compensation chamber and the vapor core (i.e. the wick structure with vapor passages) in the evaporator. In the first way, the compensation chamber and the vapor core are vertically positioned to overlap with each other. In the second way, the compensation chamber and the vapor core are positioned at two horizontally spaced positions.
- The flat-type evaporator with overlapped compensation chamber and vapor core has a large height or thickness, and is therefore not suitable for a compact electronic apparatus that has very limited internal space.
- As to the flat-type evaporator with horizontally positioned compensation chamber and vapor core, since there is some distance between the working fluid in the compensation chamber and the vaporizing surface of the vapor core, there are times the working fluid could not be timely supplied to the vapor core to result in the problem of dry burning of the vapor core.
- Therefore, it is desirable to work out a way to overcome the disadvantages of flat-type evaporator in the conventional loop heat pipes.
- A primary object of the present invention is to provide an improved loop heat pipe structure, which overcomes the problem of dry-burning wick structure occurred in the conventional flat-type evaporator with horizontally spaced compensation chamber and wick structure.
- To achieve the above and other objects, the loop heat pipe structure provided according to the present invention includes an evaporation chamber, a pipe and a condensing unit.
- The evaporation chamber has an outlet and an inlet and internally defines a receiving space. A wick structure, a compensation chamber and at least one vapor passage are provided in the receiving space, and the vapor passage has an end communicable with the outlet. The pipe has a first and a second end connected to the inlet and the outlet of the evaporation chamber, respectively, and the first end is located closely adjacent to the wick structure.
- The condensing unit includes a plurality of radiating fins externally mounted on the pipe between the first and the second end.
- With the inlet of the evaporation chamber or the first end of the pipe being located closely adjacent to the wick structure, the condensed working fluid can flow back to the wick structure more efficiently to avoid the problem of dry-burning wick structure as found in the conventional evaporation chamber caused by late compensation of working fluid to the wick structure.
- The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
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FIG. 1 is a partially exploded perspective view of a loop heat pipe structure according to a first embodiment of the present invention; -
FIG. 2 is an assembled sectional view of the loop heat pipe structure ofFIG. 1 ; -
FIG. 3 is an assembled sectional view of a loop heat pipe structure according to a second embodiment of the present invention; and -
FIG. 4 is a sectional view showing the loop heat pipe structure according to the present invention in use. - The present invention will now be described with some preferred embodiments thereof and by referring to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
- Please refer to
FIGS. 1 and 2 , which are partially exploded perspective view and assembled sectional view, respectively, of a loop heat pipe structure 1 according to a first embodiment of the present invention. As shown, the loop heat pipe structure 1 in the first embodiment includes anevaporation chamber 11, apipe 12 and acondensing unit 13. - The
evaporation chamber 11 is a flat-type evaporation chamber having anoutlet 111 and aninlet 112 and internally defines areceiving space 113. In thereceiving space 113, there are awick structure 114, acompensation chamber 115 and at least onevapor passage 1141. Thevapor passage 1141 has an end communicable with theoutlet 111. According to the present invention, theinlet 112 and theoutlet 111 are not necessarily located at the same side on theevaporation chamber 11, but can be located at two opposite sides of theevaporation chamber 11. Thecompensation chamber 115 is defined by between thereceiving space 113 and thewick structure 114. Theevaporation chamber 11 is assembled from an enclosure 11 a and abottom plate 11 b, which are closed to each other to define thereceiving space 113 between them. Thecompensation chamber 115 and thewick structure 114 are horizontally positioned in thereceiving space 113 side by side. - The
vapor passage 1141 can be selectively provided on a wall surface of theevaporation chamber 11 facing toward thewick structure 114, i.e. on an inner surface of thebottom plate 11 b, or be provided on one side of thewick structure 114 that faces toward a heat-absorbing side of theevaporation chamber 11 in contact with aheat source 3. In the illustrated first embodiment, thevapor passage 1141 is provided on one side of thewick structure 114 facing toward the heat-absorbing side of theevaporation chamber 11. However, it is understood thevapor passage 1141 can be otherwise provided on the inner surface of thebottom plate 11 b of theevaporation chamber 11. - The
wick structure 114 is disposed in thereceiving space 113 of theevaporation chamber 11, such that thecompensation chamber 115 is defined by between thewick structure 114 and thereceiving space 113. Theinlet 112 and theoutlet 111 are located in the vicinity of thewick structure 114. More specifically, thewick structure 114 is located between theinlet 112 and theoutlet 111, while theinlet 112 is located above theoutlet 111. When a workingfluid 2 filled in the loop heat pipe structure 1 flows into theevaporation chamber 11 via theinlet 112, theworking fluid 2 will quickly fall into thewick structure 114 due to the gravity, so that the work fluid can flow back to thewick structure 114 more efficiently. When thewick structure 114 is saturated with the workingfluid 2, any surplus of the workingfluid 2 will flow into thecompensation chamber 115. In other operable embodiments, theoutlet 111 and theinlet 112 can be provided on theevaporation chamber 11 at the same height, or theoutlet 111 can be located higher than theinlet 112, so long as theinlet 112 can be in direct contact with thewick structure 114. - The
evaporation chamber 11 further has aliquid passage 116 provided therein. Theliquid passage 116 has an end communicable with theinlet 112, and is located at one side of thewick structure 114. More specifically, theliquid passage 116 and thevapor passage 1141 are located at an upper and a lower side of thewick structure 114, respectively. - The
pipe 12 has afirst end 121 and asecond end 122, which are connected to theinlet 112 and theoutlet 111 of theevaporation chamber 11, respectively. And, thefirst end 121 is located closely adjacent to thewick structure 114. - The
condensing unit 13 includes a plurality of radiatingfins 131, which are sequentially fixed on and spaced along thepipe 12 to be located between thefirst end 121 and thesecond end 122 of thepipe 12. - The working
fluid 2 is filled in theevaporation chamber 11 or thepipe 12 and is changeable between a vapor phase and a liquid phase. The vapor-phase working fluid 21 in theevaporation chamber 11 flows through thevapor passage 1141 into thepipe 12 via theoutlet 111. When the vapor-phase working fluid 21 spreads in thepipe 12 and flows through the section of thepipe 12 having the radiatingfins 131 fitted thereon, the vapor-phase working fluid 21 is condensed into the liquid-phase working fluid 22. The vapor-phase working fluid 21 and the liquid-phase working fluid 22 circulate in the entire loop heat pipe structure 1. - The condensing
unit 13 is provided on thepipe 12 between thefirst end 121 and thesecond end 122, and can include a plurality of radiating fins or a plurality of cooling pipes. - Please refer to
FIG. 3 , in which a loop heat pipe structure 1 according to a second embodiment of the present invention is shown. The second embodiment is generally structurally similar to the first embodiment, except that theoutlet 111 and theinlet 112 in the second embodiment are provided at two opposite sides of theevaporation chamber 11. More specifically, in the second embodiment, theoutlet 111 and theinlet 112 are located at a left and a right side of theevaporation chamber 11, respectively. Further, in the second embodiment, thefirst end 121 of thepipe 12 is extended into theevaporation chamber 11 via theinlet 112 to end at a position above thewick structure 114 and far away from thecompensation chamber 115. Therefore, in the second embodiment, the liquid-phase working fluid 22 flowing into theevaporation chamber 11 is directly guided by thefirst end 121 of thepipe 12 to thewick structure 114. When thewick structure 114 is saturated with the liquid-phase working fluid 22, any surplus of the liquid-phase working fluid 22 will flow into thecompensation chamber 115 and be stored therein. With these arrangements, the liquid-phase working fluid 22 can quickly flow back to thewick structure 114 and the problem of dry-burning wick structure due to insufficient water content can be improved. -
FIG. 4 shows the loop heat pipe structure 1 of the present invention in use. As shown, in the loop heat pipe structure 1 of the present invention, theevaporation chamber 11 has one side in contact with theheat source 3 and thewick structure 114 is correspondingly provided in theevaporation chamber 11 on the side in contact with theheat source 3. When theevaporation chamber 11 absorbs the heat produced by theheat source 3, thewick structure 114 in theevaporation chamber 11 is heated and the liquid-phase working fluid 22 adsorbed to thewick structure 114 is also heated and finally evaporated to form the vapor-phase working fluid 21. Since thevapor passage 1141 has an end directly connected to theoutlet 111 of theevaporation chamber 11, the vapor-phase working fluid 21 flows through thevapor passage 1141 on thewick structure 114 to spread into thepipe 12 via theoutlet 111 of theevaporation chamber 11 and thesecond end 122 of thepipe 12. When the vapor-phase working fluid 21 flowing in thepipe 12 passes the section of thepipe 12 having the condensingunit 13 provided thereat, the vapor-phase working fluid 21 is condensed into the liquid-phase working fluid 22 again. Then, the liquid-phase working fluid 22 flows back into theevaporation chamber 11 via thefirst end 121 of thepipe 12 and theinlet 112 of theevaporation chamber 11. While the liquid-phase working fluid 22 is guided back to thewick structure 114 due to a capillary action and a pressure difference existed during the phase transition of the workingfluid 2, the provision of theinlet 112 above thewick structure 114 also enables the liquid-phase working fluid 22 to more quickly fall into thewick structure 114 due to the gravity to advantageously continue the vapor-liquid circulation in the loop heat pipe structure 1. - Any other type of heat dissipation element (not shown) facilitating increased condensing effect can also be externally connected to the
pipe 12 to enable further improved condensing efficiency. - The present invention changes the position of the
outlet 111 and theinlet 112 of theevaporation chamber 11 relative to thewick structure 114, such that the liquid-phase working fluid 22 flowing back into theevaporation chamber 11 is first guided to thewick structure 114 instead of thecompensation chamber 115. More specifically, since thewick structure 114 is located directly below theinlet 112, the liquid-phase working fluid 22 flowing back into theevaporation chamber 11 via theinlet 112 will first reach thewick structure 114 to be stored therein. When thewick structure 114 is saturated with the liquid-phase working fluid 22, only the surplus of the workingfluid 22 will flow into thecompensation chamber 115 and be stored therein. With these arrangements, it is able to solve the problem of dry-burning wick structure occurred in the conventional flat-type evaporator, which has horizontally spaced compensation chamber and wick structure, due to a long distance between the workingfluid 2 stored in the compensation chamber and the surface of the evaporation chamber in contact with the heat source. - The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims (10)
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US15/415,880 US20180209745A1 (en) | 2017-01-26 | 2017-01-26 | Loop heat pipe structure |
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US15/415,880 US20180209745A1 (en) | 2017-01-26 | 2017-01-26 | Loop heat pipe structure |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114076531A (en) * | 2020-08-19 | 2022-02-22 | 华为技术有限公司 | Evaporator, condenser and heat dissipation device |
CN114245687A (en) * | 2021-12-28 | 2022-03-25 | 北京微焓科技有限公司 | Evaporator, condenser and loop heat pipe |
US11382238B2 (en) * | 2019-03-14 | 2022-07-05 | Seiko Epson Corporation | Cooling device and projector |
WO2023029429A1 (en) * | 2021-08-30 | 2023-03-09 | 中兴通讯股份有限公司 | Heat transfer plate |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6227288B1 (en) * | 2000-05-01 | 2001-05-08 | The United States Of America As Represented By The Secretary Of The Air Force | Multifunctional capillary system for loop heat pipe statement of government interest |
US20030051860A1 (en) * | 2001-09-20 | 2003-03-20 | Intel Corporation | Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component |
US20050067155A1 (en) * | 2003-09-02 | 2005-03-31 | Thayer John Gilbert | Heat pipe evaporator with porous valve |
US6892799B2 (en) * | 2001-08-09 | 2005-05-17 | Boris Revoldovich Sidorenko | Evaporation chamber for a loop heat pipe |
US7007746B2 (en) * | 2003-02-20 | 2006-03-07 | Delta Electronics, Inc. | Circulative cooling apparatus |
JP2008070058A (en) * | 2006-09-14 | 2008-03-27 | Fujikura Ltd | Loop type heat pipe |
US7543629B2 (en) * | 2006-02-14 | 2009-06-09 | Yeh-Chiang Technology Corp. | Type of loop heat conducting device |
US20090314472A1 (en) * | 2008-06-18 | 2009-12-24 | Chul Ju Kim | Evaporator For Loop Heat Pipe System |
KR20100003499A (en) * | 2008-07-01 | 2010-01-11 | 연세대학교 산학협력단 | Flat bifacial evaporator of loop heat pipe, loop heat pipe having the same and heat transfer method using the same |
JP2010107153A (en) * | 2008-10-31 | 2010-05-13 | Toshiba Corp | Evaporator and circulation type cooling device using the same |
US20100300656A1 (en) * | 2007-05-16 | 2010-12-02 | Sun Yat-Sen University | heat transfer device combined a flatten loop heat pipe and a vapor chamber |
US7980295B2 (en) * | 2007-05-08 | 2011-07-19 | Kabushiki Kaisha Toshiba | Evaporator and circulation type cooling equipment using the evaporator |
US20130160974A1 (en) * | 2010-10-14 | 2013-06-27 | Fujitsu Limited | Loop heat pipe and electronic apparatus |
US20140318167A1 (en) * | 2013-04-26 | 2014-10-30 | Fujitsu Limited | Evaporator, cooling device, and electronic apparatus |
US20160131438A1 (en) * | 2013-08-01 | 2016-05-12 | Calyos Sa | Evaporator with simplified assembly for diphasic loop |
-
2017
- 2017-01-26 US US15/415,880 patent/US20180209745A1/en not_active Abandoned
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6227288B1 (en) * | 2000-05-01 | 2001-05-08 | The United States Of America As Represented By The Secretary Of The Air Force | Multifunctional capillary system for loop heat pipe statement of government interest |
US6892799B2 (en) * | 2001-08-09 | 2005-05-17 | Boris Revoldovich Sidorenko | Evaporation chamber for a loop heat pipe |
US20030051860A1 (en) * | 2001-09-20 | 2003-03-20 | Intel Corporation | Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component |
US7007746B2 (en) * | 2003-02-20 | 2006-03-07 | Delta Electronics, Inc. | Circulative cooling apparatus |
US20050067155A1 (en) * | 2003-09-02 | 2005-03-31 | Thayer John Gilbert | Heat pipe evaporator with porous valve |
US7143818B2 (en) * | 2003-09-02 | 2006-12-05 | Thermal Corp. | Heat pipe evaporator with porous valve |
US7543629B2 (en) * | 2006-02-14 | 2009-06-09 | Yeh-Chiang Technology Corp. | Type of loop heat conducting device |
JP2008070058A (en) * | 2006-09-14 | 2008-03-27 | Fujikura Ltd | Loop type heat pipe |
US7980295B2 (en) * | 2007-05-08 | 2011-07-19 | Kabushiki Kaisha Toshiba | Evaporator and circulation type cooling equipment using the evaporator |
US20100300656A1 (en) * | 2007-05-16 | 2010-12-02 | Sun Yat-Sen University | heat transfer device combined a flatten loop heat pipe and a vapor chamber |
US20090314472A1 (en) * | 2008-06-18 | 2009-12-24 | Chul Ju Kim | Evaporator For Loop Heat Pipe System |
KR20100003499A (en) * | 2008-07-01 | 2010-01-11 | 연세대학교 산학협력단 | Flat bifacial evaporator of loop heat pipe, loop heat pipe having the same and heat transfer method using the same |
JP2010107153A (en) * | 2008-10-31 | 2010-05-13 | Toshiba Corp | Evaporator and circulation type cooling device using the same |
US20130160974A1 (en) * | 2010-10-14 | 2013-06-27 | Fujitsu Limited | Loop heat pipe and electronic apparatus |
US20140318167A1 (en) * | 2013-04-26 | 2014-10-30 | Fujitsu Limited | Evaporator, cooling device, and electronic apparatus |
US20160131438A1 (en) * | 2013-08-01 | 2016-05-12 | Calyos Sa | Evaporator with simplified assembly for diphasic loop |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11382238B2 (en) * | 2019-03-14 | 2022-07-05 | Seiko Epson Corporation | Cooling device and projector |
CN114076531A (en) * | 2020-08-19 | 2022-02-22 | 华为技术有限公司 | Evaporator, condenser and heat dissipation device |
WO2023029429A1 (en) * | 2021-08-30 | 2023-03-09 | 中兴通讯股份有限公司 | Heat transfer plate |
CN114245687A (en) * | 2021-12-28 | 2022-03-25 | 北京微焓科技有限公司 | Evaporator, condenser and loop heat pipe |
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