US20100300656A1 - heat transfer device combined a flatten loop heat pipe and a vapor chamber - Google Patents

heat transfer device combined a flatten loop heat pipe and a vapor chamber Download PDF

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Publication number
US20100300656A1
US20100300656A1 US12/599,786 US59978608A US2010300656A1 US 20100300656 A1 US20100300656 A1 US 20100300656A1 US 59978608 A US59978608 A US 59978608A US 2010300656 A1 US2010300656 A1 US 2010300656A1
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Prior art keywords
condensing
vapor chamber
fins
heat transfer
heat pipe
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US12/599,786
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Shu-Shen Lu
Chi-Te Chin
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Sun Yat Sen University
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Sun Yat Sen University
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Publication of US20100300656A1 publication Critical patent/US20100300656A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/124—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and being formed of pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to the general heat transfer and electronic cooling field, and more particularly to a heat transfer device combined a flatten loop heat pipe and a vapor chamber.
  • Loop heat pipe is a new type of two-phase high efficient heat transfer device, which is driven by the capillary force from the wick material, and inside which the heat is transferred by phase change, therefore the loop heat pipe can transfer large heat from a long distance with small temperature difference.
  • the evaporator of the loop heat pipe locates on the heat source, and with a primary wick inside it.
  • the compensation chamber is connected with the evaporator by a secondary wick.
  • the condenser is attached on a heat sink.
  • the evaporator and the condenser pipe are connected by the vapor pipe, and the condenser pipe and the compensation chamber are connected by the liquid pipe.
  • the wick will dry out when the mass flow rate of evaporation is larger than that of returning. Besides, the large thermal conductivity of the wick leads to the large heat leak from the evaporator to the compensation chamber, results in high temperature in the compensation chamber and then high operation temperature of the loop heat pipe.
  • a Chinese patent named High Efficient Flatten Loop Heat Pipe (No. 200510035406.4) reveals a flatten loop heat pipe, which comprising two wicks, the primary wick for evaporation and the secondary wick for compensation.
  • the primary wick consists horizontal and vertical grooves, which are advanced for evaporation, and the vapor can flow via the grooves with a lower pressure drop, leads to a lower total pressure drop of the loop and a better performance of the loop.
  • the purpose of this invention is to overcome the disadvantages of the existing loop heat pipes, and invent a new device combined a flatten loop heat pipe and a vapor chamber for high heat flux chips cooling.
  • a heat transfer device combined a flatten loop heat pipe with a vapor chamber, in which the loop heat pipe has an evaporator and a condenser, and the vapor chamber is on the evaporation part of the loop heat pipe.
  • Mesh material is coating on the inside surface of the vapor chamber, and coating a metal plate with vent holes on it and with supports on the both side. The metal plate with vent holes can be replaced by metal mesh.
  • Working fluid is filled into the vapor chamber.
  • temperature control fins can be located into the heat transfer device combined a flatten loop heat pipe and a vapor chamber.
  • the condenser of the heat transfer device combined a flatten loop heat pipe and a vapor chamber can comprise a condensing clip ring and condensing fins, where the condensing fins locate on the outside surface of the condensing clip ring.
  • the condenser of the heat transfer device combined a flatten loop heat pipe and a vapor chamber can comprise a condensing clip pate and condensing fins, where the condensing fins locate on the outside surface of the condensing clip plate which can be one-side or double-side clip plate.
  • the condensing clip pate in such a heat transfer device combine a flatten loop heat pipe and a vapor chamber can be extended to the whole device, and both the temperature control fins and the condensing fins locate on the other side of the condensing clip plate.
  • the present invention has the following advantages.
  • the improvement in heat transfer capability is obviously. Besides the advanced heat transfer performance of the loop heat pipes, the present invention has an additional advantage from the vapor chamber, which could spread the high heat flux hot spot on the chips quickly to reduce the temperature of the chips and give the chips an advantage with higher density of integration and higher running speed.
  • FIG. 1 is the structural sketch of the heat transfer device combined a flatten loop heat pipe and a vapor chamber
  • FIG. 2 is the structural sketch of the clip ring condenser
  • FIG. 3 is the structural sketch of the clip plate condenser
  • FIG. 4 is the structural sketch of such heat transfer device with both the condensing fins and the temperature control fins
  • a heat transfer device combined a flatten loop heat pipe and a vapor camber, comprises an evaporator ( 1 ), a compensation chamber ( 2 ) and a vapor chamber ( 3 ); both the evaporator ( 1 ) and the compensation chamber ( 2 ) are in the same container ( 7 ); the cold side ( 11 ) of the evaporator ( 1 ) is connect to the compensation chamber ( 2 ), and the hot side ( 12 ) of the evaporator ( 1 ) is connect to the condensing side ( 35 ) of the vapor chamber ( 3 ); the wick ( 4 ) is installed in the evaporator ( 1 ); the bottom of the wick ( 4 ) and the evaporator ( 1 ) form the vapor grooves ( 41 ); the vapor grooves ( 41 ) is connected to the transport pipe ( 5 ), and condenser locates on the outside surface of the transport pipe ( 5 ), the returning part of the transport pipe ( 5 ) is connected to the compensation chamber
  • the outside surface of the container ( 7 ) has the temperature control fins ( 8 ).
  • the bottom of the wick ( 4 ) has both horizontal and vertical grooves.
  • the metal mesh ( 31 ) is larger than 100 mesh.
  • the condenser ( 6 ) comprises condensing clip ring ( 61 ) and condensing fins ( 62 ), and the condensing fins ( 62 ) locate on the outside surface of the condensing clip rings ( 61 ), as shown in FIG. 2 .
  • the evaporation part ( 36 ) of the vapor chamber ( 3 ) is attached on the heat load Q (chips), and the working fluid inside the vapor chamber ( 3 ) will evaporate, then the saturated vapor will go through the vent holes in the metal plate ( 32 ) and transfer the heat to the condense part ( 35 ) to condense into the liquid, which will attached on the metal mesh ( 31 ), and then flows back to the bottom of the evaporation part ( 36 ) of the vapor chamber ( 3 ) driven by the capillary force from the metal mesh ( 31 ).
  • the evaporator ( 1 ) For the evaporator ( 1 ), its evaporation part ( 12 ) is connect with the condensation part ( 35 ) of the vapor chamber ( 3 ), and the wick ( 44 ) is inside the evaporator ( 1 ).
  • the evaporator ( 1 ) When the evaporator ( 1 ) is heated by the vapor chamber ( 3 ), the liquid in the wick ( 4 ) will evaporate, and the vapor flows through the grooves ( 41 ) to the transfer pipe ( 5 ), then condense in the condenser ( 6 ) to become the liquid again, and finally back to the compensation chamber ( 2 ) and the wick ( 4 ).
  • FIG. 3 is the structural sketch of the clip plate condenser.
  • the condenser ( 6 ) comprises a condensing clip plate ( 63 ) and condensing fins ( 62 ), and the condensing fins ( 62 ) locate on the outside surface of the condensing clip plate ( 63 ) which can be one-side or double-side clip plate.
  • FIG. 4 is the structural sketch of such a heat transfer device with both the condensing fins and the temperature control fins.
  • the condensing clip plate ( 63 ) is extended to the whole device, and both the temperature control fins ( 8 ) and the condensing fins ( 62 ) locate on the other side of the condensing clip plate ( 63 ).

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This invention declares a heat transfer device combined a flatten loop heat pipe with a vapor chamber, in which the loop heat pipe has an evaporator and a condenser, and the vapor chamber is on the evaporation part of the loop heat pipe evaporator. Metal mesh is coating on the inside surface of the vapor chamber, and coating a metal plate with vent holes on it and with supports on the both side. Working fluid is filled into the vapor chamber. Besides the advanced heat transfer characteristics of the flatten loop heat pipe, this invention has an additional advantage from the vapor chamber, which could spread the high heat flux hot spot on the chips quickly to reduce the temperature of the chips and give the chips an advantage of higher density of integration and higher running speed. Based on the combination of the loop heat pipe and the vapor chamber, changing the cooling method, using both the temperature control fins and the condenser fins, this new device could increase the temperature control accuracy and the flexibility.

Description

    TECHNICAL AREA
  • The present invention relates to the general heat transfer and electronic cooling field, and more particularly to a heat transfer device combined a flatten loop heat pipe and a vapor chamber.
    • BACKGROUND
  • Loop heat pipe is a new type of two-phase high efficient heat transfer device, which is driven by the capillary force from the wick material, and inside which the heat is transferred by phase change, therefore the loop heat pipe can transfer large heat from a long distance with small temperature difference.
  • The evaporator of the loop heat pipe locates on the heat source, and with a primary wick inside it. The compensation chamber is connected with the evaporator by a secondary wick. The condenser is attached on a heat sink. The evaporator and the condenser pipe are connected by the vapor pipe, and the condenser pipe and the compensation chamber are connected by the liquid pipe. When the evaporator is heated, the liquid in the primary wick absorbs heat and becomes vapor, then the vapor transports to the condenser pipe via the vapor pipe, and condense to the liquid in the condenser to release the heat, finally the liquid flows into the compensation chamber and the wick part.
  • For the common loop heat pipe, the wick will dry out when the mass flow rate of evaporation is larger than that of returning. Besides, the large thermal conductivity of the wick leads to the large heat leak from the evaporator to the compensation chamber, results in high temperature in the compensation chamber and then high operation temperature of the loop heat pipe.
  • A Chinese patent named High Efficient Flatten Loop Heat Pipe (No. 200510035406.4) reveals a flatten loop heat pipe, which comprising two wicks, the primary wick for evaporation and the secondary wick for compensation. The primary wick consists horizontal and vertical grooves, which are advanced for evaporation, and the vapor can flow via the grooves with a lower pressure drop, leads to a lower total pressure drop of the loop and a better performance of the loop.
  • Anyway, the loop heat pipes applied in high heat flux chips doesn't show perfect effect at its present status.
    • Contents of the Invention
  • The purpose of this invention is to overcome the disadvantages of the existing loop heat pipes, and invent a new device combined a flatten loop heat pipe and a vapor chamber for high heat flux chips cooling.
  • To achieve this purpose, this invention follows these technical designations:
  • A heat transfer device combined a flatten loop heat pipe with a vapor chamber, in which the loop heat pipe has an evaporator and a condenser, and the vapor chamber is on the evaporation part of the loop heat pipe. Mesh material is coating on the inside surface of the vapor chamber, and coating a metal plate with vent holes on it and with supports on the both side. The metal plate with vent holes can be replaced by metal mesh. Working fluid is filled into the vapor chamber.
  • To control the system temperature, temperature control fins can be located into the heat transfer device combined a flatten loop heat pipe and a vapor chamber.
  • To increase the cooling effects, the condenser of the heat transfer device combined a flatten loop heat pipe and a vapor chamber can comprise a condensing clip ring and condensing fins, where the condensing fins locate on the outside surface of the condensing clip ring.
  • To increase the cooling effects, the condenser of the heat transfer device combined a flatten loop heat pipe and a vapor chamber can comprise a condensing clip pate and condensing fins, where the condensing fins locate on the outside surface of the condensing clip plate which can be one-side or double-side clip plate.
  • To increase the flexibility and the accuracy of the temperature control, the condensing clip pate in such a heat transfer device combine a flatten loop heat pipe and a vapor chamber can be extended to the whole device, and both the temperature control fins and the condensing fins locate on the other side of the condensing clip plate.
  • Compared with the exiting technology, the present invention has the following advantages.
  • (1) The improvement in heat transfer capability is obviously. Besides the advanced heat transfer performance of the loop heat pipes, the present invention has an additional advantage from the vapor chamber, which could spread the high heat flux hot spot on the chips quickly to reduce the temperature of the chips and give the chips an advantage with higher density of integration and higher running speed.
  • (2) The improvement in the flexibility and the accuracy of the temperature control is obviously. Based on the combination of the loop heat pipe and the vapor chamber, changing the cooling method by using both the temperature control fins and the condensing fins could increase the temperature control accuracy and the flexibility.
    • DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is the structural sketch of the heat transfer device combined a flatten loop heat pipe and a vapor chamber
  • FIG. 2 is the structural sketch of the clip ring condenser
  • FIG. 3 is the structural sketch of the clip plate condenser
  • FIG. 4 is the structural sketch of such heat transfer device with both the condensing fins and the temperature control fins
    •  DETAILED EXECUTIONS Example 1
  • As shown in FIG. 1, a heat transfer device combined a flatten loop heat pipe and a vapor camber, comprises an evaporator (1), a compensation chamber (2) and a vapor chamber (3); both the evaporator (1) and the compensation chamber (2) are in the same container (7); the cold side (11) of the evaporator (1) is connect to the compensation chamber (2), and the hot side (12) of the evaporator (1) is connect to the condensing side (35) of the vapor chamber (3); the wick (4) is installed in the evaporator (1); the bottom of the wick (4) and the evaporator (1) form the vapor grooves (41); the vapor grooves (41) is connected to the transport pipe (5), and condenser locates on the outside surface of the transport pipe (5), the returning part of the transport pipe (5) is connected to the compensation chamber (2); the metal mesh (31) is attached on the inside surface of the vapor chamber (3); the metal mesh coats a metal plate (32) with vent holes, and with supports on the both sides (34); both of the compensation chamber (2) and the vapor chamber (3) are filled with working fluid. The outside surface of the container (7) has the temperature control fins (8). The bottom of the wick (4) has both horizontal and vertical grooves. The metal mesh (31) is larger than 100 mesh. The condenser (6) comprises condensing clip ring (61) and condensing fins (62), and the condensing fins (62) locate on the outside surface of the condensing clip rings (61), as shown in FIG. 2.
  • During the operation, the evaporation part (36) of the vapor chamber (3) is attached on the heat load Q (chips), and the working fluid inside the vapor chamber (3) will evaporate, then the saturated vapor will go through the vent holes in the metal plate (32) and transfer the heat to the condense part (35) to condense into the liquid, which will attached on the metal mesh (31), and then flows back to the bottom of the evaporation part (36) of the vapor chamber (3) driven by the capillary force from the metal mesh (31).
  • For the evaporator (1), its evaporation part (12) is connect with the condensation part (35) of the vapor chamber (3), and the wick (44) is inside the evaporator (1). When the evaporator (1) is heated by the vapor chamber (3), the liquid in the wick (4) will evaporate, and the vapor flows through the grooves (41) to the transfer pipe (5), then condense in the condenser (6) to become the liquid again, and finally back to the compensation chamber (2) and the wick (4).
    • Example 2 Flexible Heat Transfer Modular
  • FIG. 3 is the structural sketch of the clip plate condenser. The condenser (6) comprises a condensing clip plate (63) and condensing fins (62), and the condensing fins (62) locate on the outside surface of the condensing clip plate (63) which can be one-side or double-side clip plate.
  • FIG. 4 is the structural sketch of such a heat transfer device with both the condensing fins and the temperature control fins. In order to improve the flexibility and the accuracy of the temperature control, the condensing clip plate (63) is extended to the whole device, and both the temperature control fins (8) and the condensing fins (62) locate on the other side of the condensing clip plate (63).

Claims (8)

1. A heat transfer device comprising:
a flattened loop heat pipe and a vapor chamber,
wherein the loop heat pipe has an evaporator (1) and a condenser (2), and the vapor chamber (3) is on an evaporation part (12) of the loop heat pipe evaporator (1);
wherein a metal mesh (31) is disposed on an inside surface of the vapor chamber (3), and is also disposed on a metal plate (32) with vent holes, and has supports (34) on both sides; and
wherein a working fluid is in the vapor chamber (3).
2. The heat transfer device recited in claim 1 further comprising temperature control fins (8).
3. The heat transfer device recited in claim 1 wherein the condenser (6) comprises a condensing clip ring (61) and condensing fins (62), and the condensing fins (62) are located on the outside surface of the condensing clip ring (61).
4. The heat transfer device recited in claim 1 wherein the condenser (6) comprises a condensing clip plate (63) and condensing fins (62), and the condensing fins (62) are located on an outside surface of the condensing clip plate (63), which can be a one-side or double-side clip plate.
5. The heat transfer device recited in claim 4 wherein the condensing clip plate (63) is extended to the whole device, and both the temperature control fins (8) and condensing fins (62) are located on an other side of the condensing clip plates (63).
6. The heat transfer device recited in claim 2, wherein the condenser (6) comprises a condensing clip ring (61) and condensing fins (62), and the condensing fins (62) are located on an outside surface of the condensing clip ring (61).
7. The heat transfer device recited in claim 2, wherein the condenser (6) comprises a condensing clip plate (63) and condensing fins (62), and the condensing fins (62) are located on an outside surface of the condensing clip plate (63), which can be a one-side or double-side clip plate.
8. The heat transfer device recited in claim 7, wherein the condensing clip plate (63) is extended to the whole device, and both the temperature control fins (8) and condensing fins (62) are located on an other side of the condensing clip plates (63).
US12/599,786 2007-05-16 2008-05-05 heat transfer device combined a flatten loop heat pipe and a vapor chamber Abandoned US20100300656A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CNB2007100280445A CN100460798C (en) 2007-05-16 2007-05-16 Temperature-evenness loop heat pipe device
CN200710028044.5 2007-05-16
PCT/CN2008/000898 WO2008138216A1 (en) 2007-05-16 2008-05-05 Uniform temperature loop heat pipe device

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US20100300656A1 true US20100300656A1 (en) 2010-12-02

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EP (1) EP2154461A1 (en)
JP (1) JP2010527432A (en)
CN (1) CN100460798C (en)
AU (1) AU2008250879B2 (en)
CA (1) CA2687005C (en)
WO (1) WO2008138216A1 (en)

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US20110088875A1 (en) * 2009-10-16 2011-04-21 Foxconn Technology Co., Ltd. Loop heat pipe
US20120273167A1 (en) * 2011-04-29 2012-11-01 Asia Vital Components (Shen Zhen) Co., Ltd. Loop heat pipe structure with low-profile evaporator
RU2474780C1 (en) * 2011-10-18 2013-02-10 Федеральное государственное унитарное предприятие "Научно-производственное объединение им. С.А. Лавочкина" Thermal control device based on wraparound heat tube
US20130206369A1 (en) * 2012-02-13 2013-08-15 Wei-I Lin Heat dissipating device
CN103256841A (en) * 2013-04-25 2013-08-21 上海卫星工程研究所 Novel energy storage cooling device
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JP2010527432A (en) 2010-08-12
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WO2008138216A1 (en) 2008-11-20
AU2008250879B2 (en) 2010-03-04

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