WO2023029429A1 - Heat transfer plate - Google Patents

Heat transfer plate Download PDF

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Publication number
WO2023029429A1
WO2023029429A1 PCT/CN2022/080222 CN2022080222W WO2023029429A1 WO 2023029429 A1 WO2023029429 A1 WO 2023029429A1 CN 2022080222 W CN2022080222 W CN 2022080222W WO 2023029429 A1 WO2023029429 A1 WO 2023029429A1
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WO
WIPO (PCT)
Prior art keywords
channel
pipeline
heat transfer
flow channel
transfer plate
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PCT/CN2022/080222
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French (fr)
Chinese (zh)
Inventor
汪艳
刘欣
李帅
段凯文
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中兴通讯股份有限公司
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Publication of WO2023029429A1 publication Critical patent/WO2023029429A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • Embodiments of the present invention relate to the technical field of thermal management of electronic devices, and in particular, relate to a heat transfer plate.
  • the heat transfer element is compounded with a pipeline structure on the surface of the substrate, and the inside of the pipeline is filled with refrigerant, and the heat is removed through the latent heat of the phase change of the refrigerant, so that the heat transfer performance is more prominent on the basis of maintaining a compact size, compared with ordinary Metal fins and heat transfer plates have higher thermal conductivity, better temperature uniformity than ordinary fins, lighter weight, and great application prospects.
  • the heat transfer plate and the base plate are combined into a heat sink in the form of cogs or sticking teeth. Structure, has been widely used in communication base stations, air conditioners, LED (Light Emitting Diode, light emitting diode) cooling industry.
  • Some manufacturers sinter the capillary structure inside the heat transfer plate in order to solve the problem of liquid accumulation at the bottom of the heat transfer plate and no liquid replenishment at the upper heat source. Since the heat transfer plate is made of aluminum alloy, the aluminum powder sintering process is difficult, and the pipeline height is average. If it is less than 2mm, the internal sintered capillary structure will block the pipeline and other phenomena, and the measured heat dissipation effect is poor.
  • Embodiments of the present invention provide a heat transfer plate to at least solve the problems of liquid accumulation at the bottom of the heat transfer plate and lack of liquid at the upper heat source in the related art.
  • the heat transfer plate includes a base plate and a pipe structure compounded on the surface of the base plate, wherein the pipe structure includes a first evaporation flow channel and a plurality of spaced partitioned pipes, and each partitioned pipe
  • the path includes a gas ascending passage and a liquid descending passage communicated with the first evaporating passage, the gas ascending passage is used for the rising gaseous refrigerant working medium in the first evaporating passage to enter the partition pipeline, the The liquid downflow channel is used for the liquid refrigerant working medium in the partition pipeline to return to the first evaporation channel.
  • each subdivision pipeline is arranged at a corresponding position of the corresponding heat source region, and the liquid downflow channel of each subdivision pipeline is lower than corresponding to the bottom of the heat source zone.
  • the partitioned pipeline is a single-circuit pipeline composed of a plurality of sequentially connected U-shaped pipes, one end of the single-circuit pipeline is a gas ascending channel, and the other end is a liquid descending channel .
  • the partitioned pipeline is composed of a plurality of parallel pipelines, one end of each parallel pipeline is connected to the first evaporation channel, and the other ends are connected to each other to form a condensation channel for the refrigerant working medium .
  • the straight pipe sections of the partitioned pipelines form a preset included angle with the horizontal direction.
  • the pipeline structure further includes a liquid storage chamber and a second evaporation flow channel, wherein the liquid storage chamber is arranged on a side close to the heat source area of the substrate, and is located at the first evaporation channel. Below the channel and the second evaporation channel, and communicate with the first evaporation channel and the second evaporation channel.
  • the inner diameter of the second evaporation channel is smaller than the following critical diameter:
  • ⁇ is the surface tension value of the refrigerant working medium
  • ⁇ l is the density of the liquid refrigerant working medium
  • ⁇ v is the gaseous refrigerant working medium density
  • g is the gravitational acceleration value
  • the inner diameter of the first evaporation channel is larger than the critical diameter.
  • the first evaporation channel and the second evaporation channel are spaced apart.
  • the first evaporating channel and the second evaporating channel are connected at positions of a plurality of heat source regions.
  • the pipeline structure is made by an inflation process or a brazing process.
  • the gas-liquid phase separation is realized through the partitioned pipeline structure design of the heat transfer plate, which avoids the increase of flow resistance caused by gas-liquid mixing, thereby improving the temperature uniformity of the entire plate; at the same time, it can avoid dryness of the top heat source
  • the burning phenomenon solves the problem of lack of liquid at the upper heat source.
  • Fig. 1 is a schematic plan view of a heat transfer plate pipeline according to the related art
  • Fig. 2 is a schematic structural view of a heat transfer plate according to an embodiment of the present invention.
  • Fig. 3 is a schematic diagram of a partitioned pipeline structure in a heat transfer plate according to an embodiment of the present invention
  • Fig. 4 is a schematic structural diagram of a composite pipeline in a heat transfer plate according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the flow path of gas and liquid in a composite pipeline structure according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of another pipeline structure of a heat transfer plate according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of the flow path of gas and liquid in the pipeline structure according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of another partitioned pipeline structure of a heat transfer plate according to an embodiment of the present invention.
  • Fig. 9 is a schematic diagram of a flow path of gas and liquid in a pipeline structure according to an embodiment of the present invention.
  • a heat transfer plate is provided in this embodiment.
  • the optimized design of the pipeline shape and structure is expected to solve the problem of liquid accumulation at the bottom of the heat transfer plate and lack of liquid at the upper heat source through the design of the pipeline structure.
  • the heat transfer plate provided in this embodiment may include a base plate and a piping structure compounded on the surface of the base plate, the piping structure includes a first evaporation flow channel and a plurality of spaced partitioned piping, and each partitioned piping includes A gas ascending channel and a liquid descending channel communicated with the first evaporating channel, the gas ascending channel is used for the rising gaseous refrigerant in the first evaporating channel to enter the partition pipeline, and the liquid descending The flow channel is used to return the liquid refrigerant working medium in the partition pipeline to the first evaporation flow channel.
  • the zonal design of the first evaporation flow channel and the condensation pipeline structure is designed to ensure that there is liquid in the position of the evaporation flow channel corresponding to the high power consumption heat source area, and to avoid dry burning in the top heat source area.
  • the first evaporating channel, the second evaporating channel, and the partitioned pipeline structure at the same time, and design the diameter of the second evaporating channel in the evaporating channel structure to be smaller than the equivalent diameter, and the remaining tube diameters It is larger than the equivalent diameter to ensure that the surface tension of the refrigerant can overcome the gravity when the refrigerant flows upward in the second evaporator channel, which can avoid the dry burning phenomenon of the top heat source and further solve the dry burning phenomenon of the top, thereby improving the temperature uniformity of the entire board.
  • Fig. 2 is a schematic structural diagram of a heat transfer plate according to an embodiment of the present invention.
  • the heat transfer plate may be a two-phase heat transfer plate for heat dissipation with a pipe structure 2 compounded on the surface 1 of the aluminum substrate.
  • the pipeline 2 can be processed by an inflation process or a brazing process.
  • the pipeline 2 can be a series structure as shown in Figure 2. Therefore, compared with the honeycomb pipeline structure used in the industry, the gas-liquid mixing flow is chaotic. In this embodiment, the gas-liquid phase can be realized through the series pipeline structure. Separation reduces flow resistance, thereby improving heat transfer efficiency and temperature uniformity of the entire heat transfer plate.
  • the pipeline 2 can also adopt other structural manners.
  • Q is the corresponding position of the high power consumption chip
  • 31, 32 and 33 are heat sources on the substrate
  • the side close to the heat source (31, 32 and 33) is the area near the heat source of the substrate
  • the pipeline structure 2 near the heat source area is defined as the evaporation area
  • the side away from the heat source is the far heat source area of the substrate
  • the pipeline structure 2 near the far heat source area is defined as the condensation area.
  • Pipeline structure 2 the inside of the pipeline is filled with refrigerant working fluid, and the heat Q is transferred to the remote heat source area through the phase change latent heat of the refrigerant working fluid, and the heat exchange with the air is natural, so as to realize the uniform temperature effect of the whole board.
  • the first evaporation channel 43 , the second channel 41 and the liquid storage chamber 4 can be designed in the evaporation area.
  • the first evaporation flow channel 43 and the second evaporation flow channel 41 are located above the liquid storage chamber 4 and communicate with the liquid storage chamber 4, the head end 241 and the tail end 201 of the series pipeline structure are connected with the first evaporation flow channel 43,
  • the middle part of the first evaporating channel 43 and the second evaporating channel 41 is separated by a physical spacer 42 .
  • the equivalent diameter of the second evaporating channel 41 is smaller than the critical diameter, and the remaining pipe diameters are larger than the critical diameter, so as to ensure that the surface tension of the refrigerant can overcome the gravity when the refrigerant flows upward in the second evaporating channel 41, and avoid dry burning at the top.
  • D is the equivalent diameter of the second evaporating channel 41
  • ⁇ is the surface tension value of the refrigerant working medium
  • ⁇ l is the liquid density of the refrigerant working medium
  • ⁇ v is the gas density of the refrigerant working medium
  • g is the value of the acceleration of gravity.
  • the characteristics of the pulsating heat pipe are adopted in the second evaporation channel in this embodiment.
  • the diameter of the channel in the condensation area is larger, which reduces the flow resistance and has higher heat transfer efficiency than the pulsating heat pipe. It should be noted that although the number of the first evaporating channel 43 shown in FIG. 2 is one, it can be understood that multiple first evaporating channels 43 can be provided as required.
  • FIG. 3 is a schematic diagram of the pipeline partition structure of the heat transfer plate according to an embodiment of the present invention.
  • the pipeline structure 2 of the heat transfer plate adopts a partition design. Specifically, as shown in FIG. 3 , the pipeline structure 2 is disconnected from oblique pipelines near the heat source position Q evaporation area, such as pipelines 211 and 212 near the heat source 31 and pipelines 221 and 222 near the heat source 32. , and the pipelines 231 and 232 near the heat source 32, which are directly connected to the evaporating channel, that is, in this way, the design of the pipeline partition structure is realized.
  • the partition structure design can be performed for all high power consumption chips as required, and the partition structure design can also be performed for some of the high power consumption chips, which is not limited to the number of partitions.
  • the divisional positions of the pipeline structure include gas ascending passages (211, 221 and 231) and liquid descending passages (212, 222 and 232), wherein the gas ascending passages (211 , 221 and 231) are gas inlets, and liquid downflow channels (212, 222 and 232) are liquid outlets.
  • the outlet height of the liquid downflow channel (212, 222 and 232) at the partition position should be lower than the bottom position of the corresponding heat source area, for example, the liquid downflow channel 222 is located at the lower part of the heat source area 32, for example, at 0-10 mm , so that there is backflow liquid at the heat source.
  • the top of the pipeline 2 is provided with a refrigerant filling port 5, and the top of the first evaporation channel communicates with the first end 241 of the partitioned pipeline structure of the pipeline 2 through the horizontal tube 22.
  • the bottom end of an evaporation channel communicates with the tail end 201 of the partitioned piping structure.
  • the oblique pipeline of each partition of the pipeline 2 forms a certain angle with the horizontal direction, for example, the angle can be between 30° and 60°, so that the gaseous refrigerant in the first evaporating channel can easily enter the partition pipe way, and facilitate the return of the liquid refrigerant working medium in the divisional pipeline to the first evaporator channel.
  • Fig. 4 is a schematic diagram of a composite pipeline structure of a heat transfer plate according to an embodiment of the present invention.
  • the first evaporation channel and the second evaporation channel and the partitioned pipeline structure are designed at the same time.
  • the heat transfer plate can be composed of a substrate 1 and a pipeline 2 compounded on the surface of the substrate, and a first evaporation channel 43 is provided on the side of the heat source (31, 32, 33) , the second evaporation channel 41 and the liquid storage chamber 4 .
  • the middle part of the first evaporating flow channel 43 and the second evaporating flow channel 41 is separated by a physical spacer 42 , and the width of the spacer 42 can generally be, for example, between 1 mm and 2 mm.
  • the liquid storage chamber 4 is located directly below the first evaporating channel 43 and the second evaporating channel 41 , and is connected to the lower outlet of the pipeline 2 .
  • the top of the pipeline 2 is provided with a refrigerant filling port 5 , and the top of the first evaporating channel communicates with the upper inlet of the partitioned pipeline structure of the pipeline 2 through a horizontal tube 22 .
  • the equivalent diameter of the second evaporating channel 41 is smaller than the critical diameter, therefore, the surface tension of the refrigerant can overcome the effect of gravity g when the refrigerant moves upward in the second evaporating channel 41 .
  • the second evaporation channel 41 and the liquid storage chamber 4 structure are used to realize the suction of the liquid, and at the same time, the partitioned pipeline structure is set at the heat source area, It can ensure that the position of the heat source area does not appear dry burning.
  • the pipeline 2 is arranged as a partitioned single-circuit pipeline structure near the heat source area.
  • the adjacent flow channels 211 and 212 are not directly connected, but only connected to the first evaporation flow channel 43, and each partition forms a single circuit.
  • the single-loop structure ensures phase separation during gas-liquid flow
  • a partitioned pipeline structure is set at the position of the high-power heat source Q to ensure that there is refrigerant backflow supplement near the heat source area, which greatly improves the temperature uniformity of the entire board. Specifically, as shown in FIG.
  • the pipeline structure 2 is composed of a plurality of oblique pipelines, and adjacent pipelines are connected in series, connected by 21 in the evaporation zone, and connected by 23 in the condensation zone. , the first end 241 and the tail end 201 of the series pipeline structure are connected to the first evaporation channel 43 .
  • the gas-liquid phase separation is realized by using the evaporation flow channel structure and the partitioned pipeline structure design, which avoids the increase of flow resistance caused by gas-liquid mixing and avoids the phenomenon of dry burning of the top heat source, and solves the lack of liquid at the upper heat source The problem of improving the temperature uniformity of the entire board.
  • Fig. 5 is a schematic diagram of the flow of gas and liquid in the composite pipeline structure according to an embodiment of the present invention.
  • the filling port is welded and sealed to ensure that the inside of the pipeline 2 is a vacuum-tight space.
  • the working process of the high-efficiency heat dissipation structure provided by this embodiment is as follows: the refrigerant is heated and evaporated in the first evaporating channel 43 and the second evaporating channel 41, driven by the internal pressure, it flows from the near heat source area 21 along the The gas ascending channel (upward position of the arrow) moves towards the heat source area 23 far away from the pipeline 2. During the movement, the gas continuously condenses into a liquid working medium.
  • the pipeline structure is a single-circuit structure
  • the liquid descends along the liquid under the push of high-temperature steam
  • the tube (downward arrow position) flows back to the near heat source area, and after being vaporized again at the corner of the near heat source area 21, the high-temperature steam moves along the gas ascending channel to the far heat source 23.
  • the heat Q is transferred to the remote heat source area 23 to realize the uniform temperature process of the whole board.
  • the gas-liquid phase separation is realized due to the single-circuit structure, which improves the two-phase heat exchange efficiency.
  • the refrigerant liquid in the liquid descending pipeline near the heat source ( 31 , 32 , 33 ) can flow into the first evaporator flow channel 43 due to the two-partition structure design of the pipeline.
  • the refrigerant liquid in the liquid descending flow 222 near the heat source 32 flows along the pipeline to the first evaporating channel 43, and the high-temperature steam in the first evaporating channel 43 moves upward along the first evaporating channel 43.
  • the high-temperature steam exerts a certain upward driving force on the liquid moving downward, and the liquid moves upward, taking away the heat of the heat source Q through the latent heat of vaporization, and the liquid phase changes into gas, and when the gas moves to the lower part of the upper heat source 32, the pressure is lower
  • the gas ascending flow (for example, 221, 241) enters the interior of the pipeline 2 and moves toward the far heat source area, and after continuous condensation, it moves along the liquid downpipe to the position of the heat source Q, realizing a cycle.
  • the liquid in the 201 liquid descending channel continuously moves to the liquid storage chamber 4, the liquid in the liquid storage chamber is pushed upward, and the inner diameter of the second evaporation channel 41 If the diameter is smaller than the critical diameter, the surface tension overcomes the gravity, the liquid moves upwards along the second evaporation channel 41, and turns into a gas, and the high-temperature steam flows along 22 to the pipeline structure 2, and finally condenses inside the pipeline 2 Enter the liquid storage chamber 4 again through 201 to realize a cycle and continuously take away the heat of the heat source area.
  • this embodiment further provides an internal pipeline structure of the heat transfer plate.
  • Fig. 6 is a schematic diagram of the internal pipeline structure of the heat transfer plate. As shown in FIG. 6 , in this embodiment, the pipeline 2 near the heat source Q adopts a partitioned structure design, which is the same as that of the above-mentioned embodiment 3.
  • the internal pipeline structure of the heat transfer plate of this embodiment is basically the same as that of Embodiment 3, the difference is that in the above-mentioned Embodiment 3, the first evaporating channel 43 and the second evaporating channel 41 are connected by entities 42
  • the first evaporating channel 43 and the second evaporating channel 41 are connected in the area of the heat source Q (411, 412 and 413), and the direction of the communication area is consistent with the direction of the gas ascending flow channel in the area of the heat source. is the intersection of the gas upflow channel and the solid area 42 .
  • This communication design can facilitate gas-liquid exchange at the intersection of the heat source Q area, so that there is liquid at the intersection.
  • Fig. 7 is the moving path of liquid and gas inside the heat transfer plate according to an embodiment of the present invention.
  • the working process of the high-efficiency heat dissipation structure of this embodiment is: the refrigerant liquid in the pipeline structure near the heat source area can flow to the first evaporation flow along the liquid descending channel (for example, the liquid descending channel 222) Road 43, the high-temperature steam in the first evaporation channel 43 moves upward along the channel, and the upward-moving high-temperature steam exerts a certain upward driving force on the downward-moving liquid, and the liquid moves upward, and the heat of the heat source Q is carried by the latent heat of vaporization Go, through the partitioned pipeline design at the heat source Q, so as to ensure that there is liquid at the position of the heat source Q, and at the same time, because the liquid in the liquid descending channel (for example, the liquid descending channel 222) continuously moves to the liquid storage chamber 4, it pushes the liquid storage chamber The internal liquid moves upwards, the inner diameter of the liquid
  • this embodiment further provides another internal pipeline structure of the heat transfer plate.
  • Fig. 8 is a schematic diagram of the internal piping structure of the heat transfer plate of this embodiment
  • Fig. 9 is a movement path of liquid and gas inside the heat transfer plate according to this embodiment.
  • the piping structure of this embodiment is basically the same as that of Embodiment 3, and the piping 2 is designed in partitions for the heat sources (31, 32, 32).
  • the pipelines are of a series structure, but in this embodiment, the adjacent pipelines of the pipeline 2 are multiple parallel pipelines.
  • the evaporation area and the remote heat source area are connected by a plurality of parallel pipeline structures, and the condensation channels (231, 232, 233, 234) of the corresponding channel to the heat source area Q are separated.
  • the condensation channels (231, 232, 233, 234) of the corresponding channel to the heat source area Q are separated.
  • the condensation channel 233 corresponding to the flow channel 212 and the condensation channel 234 corresponding to the flow channel 211 are physically separated at the condensation end to ensure that the refrigerant inside the condensation channel 233 can only flow into the first evaporation flow channel 43 through the flow channel 212 to realize The heat in the heat source area Q is transferred, but cannot flow to the bottom through the condensation channel 234 .
  • the heat dissipation is divided into several circulation structures through the division of the condensing pipeline to ensure that the upper liquid can flow back to the upper part instead of flowing to the bottom to accumulate, thereby improving the heat transfer efficiency of the entire plate.
  • the pipeline partition structure in this embodiment is only an example. It can be understood that based on the same principle, other partition structures can also be used in this embodiment, and the number of straight pipes in each partition , the connection method is not limited, as long as the same technical effect can be achieved.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

Provided in the embodiments of the present invention is a heat transfer plate. The heat transfer plate comprises a substrate (1) and a pipeline structure (2) compounded with a surface of the substrate (1), wherein the pipeline structure (2) comprises a first evaporation flow channel (43) and a plurality of spaced partition pipelines; each partition pipeline comprises a gas rising flow channel (211, 221, 231) and a liquid falling flow channel (212, 222, 232) which are in communication with the first evaporation flow channel (43); the gas rising flow channel (211, 221, 231) is used for a gaseous refrigerant rising in the first evaporation flow channel (43) to enter the partition pipeline; and the liquid falling flow channel (212, 222, 232) is used for a liquid refrigerant in the partition pipeline to flow back to the first evaporation flow channel (43). By means of the embodiments of the present invention, the problem of dry heating occurring in a heat source at the top of the heat transfer plate is solved, thereby achieving the effect of improving the temperature equalization capability of the whole plate.

Description

一种传热板a heat transfer plate 技术领域technical field
本发明实施例涉及电子器件热管理技术领域，具体而言，涉及一种传热板。Embodiments of the present invention relate to the technical field of thermal management of electronic devices, and in particular, relate to a heat transfer plate.
背景技术Background technique
在电子工业领域方面，设备的集成度越来越高，芯片或核心部件体积越来越小，性能越来越强。狭小空间内热量如不能及时有效的散出，轻则会导致芯片或核心部件在高温下性能大幅降低，能耗大幅上升；重则会导致仪器设备损毁。In the field of electronics industry, the integration of equipment is getting higher and higher, the size of chips or core components is getting smaller and smaller, and the performance is getting stronger. If the heat in a small space cannot be dissipated in a timely and effective manner, the performance of the chip or core components will be greatly reduced at high temperatures, and the energy consumption will increase significantly; if it is severe, it will cause damage to the equipment.
5G时代到来，通讯基站的热耗逐步增大，急需开发一种既能满足高热流密度、大功率模块的散热需求，又高效可靠、重量轻的高效散热结构，传热板作为一种新型强化传热元件，在基板表面复合有管路结构，管路内部充灌冷媒，通过冷媒相变的潜热带走热量，使其在保持体积紧凑的基础上，传热性能表现更加突出，比起一般金属翅片，传热板的导热系数更高，均温性优于一般翅片，重量更轻，有极大的应用前景，通过传热板和基板嵌齿或粘齿结构形式复合成散热器结构，已广泛应用于通讯基站、空调、LED(Light Emitting Diode，发光二极管)散热行业。With the advent of the 5G era, the heat consumption of communication base stations is gradually increasing, and it is urgent to develop a high-efficiency heat dissipation structure that can meet the heat dissipation requirements of high heat flux density and high-power modules, and is also efficient, reliable, and light in weight. The heat transfer element is compounded with a pipeline structure on the surface of the substrate, and the inside of the pipeline is filled with refrigerant, and the heat is removed through the latent heat of the phase change of the refrigerant, so that the heat transfer performance is more prominent on the basis of maintaining a compact size, compared with ordinary Metal fins and heat transfer plates have higher thermal conductivity, better temperature uniformity than ordinary fins, lighter weight, and great application prospects. The heat transfer plate and the base plate are combined into a heat sink in the form of cogs or sticking teeth. Structure, has been widely used in communication base stations, air conditioners, LED (Light Emitting Diode, light emitting diode) cooling industry.
如图1所示，目前传热板的管路形状多为复杂网状结构，由多个相同的形状单元共同拼接而成，这种互通式结构，单元之间管路互通，内部冷媒流动状态较为混乱，流动没有一定的方向性，由于常用的传热板内部毛细结构，冷媒在流动时受重力影响较大，竖直应用当上部有热源时，冷媒在重力的作用下积聚于管路底部位置，导致冷凝液体无法及时回流补充至上部热源处，上部热源处附近管路结构内部充满高温蒸汽，相对原铝板热性能更差，同时底部冷媒堆积，工质相变所需过热度大，难以达到相变点，无法充分发挥两相换热的优势。As shown in Figure 1, most of the pipes of the heat transfer plate are complex network structures, which are spliced together by multiple units of the same shape. In this interconnected structure, the pipes between the units communicate with each other, and the internal refrigerant flow state It is relatively chaotic, and the flow has no certain directionality. Due to the capillary structure inside the commonly used heat transfer plate, the refrigerant is greatly affected by gravity when flowing. When there is a heat source in the upper part of the vertical application, the refrigerant will accumulate at the bottom of the pipeline under the action of gravity. location, resulting in the condensed liquid unable to return to the upper heat source in time, and the pipeline structure near the upper heat source is filled with high-temperature steam, which has worse thermal performance than the original aluminum plate. When the phase change point is reached, the advantages of two-phase heat exchange cannot be fully utilized.
有些厂家为解决传热板内部底部液体堆积上部热源处无回流液体补充问题，在传热板内部烧结毛细结构，由于传热板板材为铝合金，铝粉烧结工艺难度大，且管路高度一般小于2mm，内部烧结毛细结构会出现堵塞管路等现象，实测散热效果较差。Some manufacturers sinter the capillary structure inside the heat transfer plate in order to solve the problem of liquid accumulation at the bottom of the heat transfer plate and no liquid replenishment at the upper heat source. Since the heat transfer plate is made of aluminum alloy, the aluminum powder sintering process is difficult, and the pipeline height is average. If it is less than 2mm, the internal sintered capillary structure will block the pipeline and other phenomena, and the measured heat dissipation effect is poor.
发明内容Contents of the invention
本发明实施例提供了一种传热板，以至少解决相关技术中传热板底部液体堆积以及上部热源处缺少液体的问题。Embodiments of the present invention provide a heat transfer plate to at least solve the problems of liquid accumulation at the bottom of the heat transfer plate and lack of liquid at the upper heat source in the related art.
在本实施例中，传热板包括基板和复合在所述基板表面的管路结构，其中，所述管路结构包括第一蒸发流道和多个相间隔的分区管路，每个分区管路包括与第一蒸发流道相通的气体上升流道和液体下降流道，所述气体上升流道用于所述第一蒸发流道中上升的气态冷媒工质进入所述分区管路，所述液体下降流道用于所述分区管路中的液体冷媒工质回流至所述第一蒸发流道。In this embodiment, the heat transfer plate includes a base plate and a pipe structure compounded on the surface of the base plate, wherein the pipe structure includes a first evaporation flow channel and a plurality of spaced partitioned pipes, and each partitioned pipe The path includes a gas ascending passage and a liquid descending passage communicated with the first evaporating passage, the gas ascending passage is used for the rising gaseous refrigerant working medium in the first evaporating passage to enter the partition pipeline, the The liquid downflow channel is used for the liquid refrigerant working medium in the partition pipeline to return to the first evaporation channel.
在一个示例性实施例中，其中，所述基板的一侧包括多个热源区，每个分区管路设置在对应的热源区的相应位置，并且每个分区管路的液体下降流道低于对应的热源区的底部。In an exemplary embodiment, wherein, one side of the substrate includes a plurality of heat source regions, each subdivision pipeline is arranged at a corresponding position of the corresponding heat source region, and the liquid downflow channel of each subdivision pipeline is lower than corresponding to the bottom of the heat source zone.
在一个示例性实施例中，所述分区管路为多个依次相连的U形管组成的单回路管路，所述单回路管路的一端为气体上升流道，另一端为液体下降流道。In an exemplary embodiment, the partitioned pipeline is a single-circuit pipeline composed of a plurality of sequentially connected U-shaped pipes, one end of the single-circuit pipeline is a gas ascending channel, and the other end is a liquid descending channel .
在一个示例性实施例中，所述分区管路由多条并行管路组成，每条并行管路的一端与所述第一蒸发流道相连，另一端相互连通形成所述冷媒工质的冷凝通道。In an exemplary embodiment, the partitioned pipeline is composed of a plurality of parallel pipelines, one end of each parallel pipeline is connected to the first evaporation channel, and the other ends are connected to each other to form a condensation channel for the refrigerant working medium .
在一个示例性实施例中，所述分区管路的直管路段与水平方向呈预设夹角。In an exemplary embodiment, the straight pipe sections of the partitioned pipelines form a preset included angle with the horizontal direction.
在一个示例性实施例中，所述管路结构还包括储液腔和第二蒸发流道，其中，储液腔设置在靠近所述基板的热源区的一侧，并且位于所述第一蒸发流道和第二蒸发流道的下方，并与所述第一蒸发流道和第二蒸发流道相通。In an exemplary embodiment, the pipeline structure further includes a liquid storage chamber and a second evaporation flow channel, wherein the liquid storage chamber is arranged on a side close to the heat source area of the substrate, and is located at the first evaporation channel. Below the channel and the second evaporation channel, and communicate with the first evaporation channel and the second evaporation channel.
在一个示例性实施例中，所述第二蒸发流道的内径小于如下临界直径：In an exemplary embodiment, the inner diameter of the second evaporation channel is smaller than the following critical diameter:
Figure PCTCN2022080222-appb-000001
Figure PCTCN2022080222-appb-000001
其中，σ为冷媒工质的表面张力数值，ρ l为液态的冷媒工质密度，ρ v为气态的冷媒工质密度，g为重力加速度数值。 Among them, σ is the surface tension value of the refrigerant working medium, ρ l is the density of the liquid refrigerant working medium, ρ v is the gaseous refrigerant working medium density, and g is the gravitational acceleration value.
在一个示例性实施例中，所述第一蒸发流道的内径大于所述临界直径。In an exemplary embodiment, the inner diameter of the first evaporation channel is larger than the critical diameter.
在一个示例性实施例中，其中，所述第一蒸发流道与第二蒸发流道之间相间隔。In an exemplary embodiment, wherein, the first evaporation channel and the second evaporation channel are spaced apart.
在一个示例性实施例中，其中，所述第一蒸发流道与第二蒸发流道之间在多个热源区的位置处相连通。In an exemplary embodiment, wherein, the first evaporating channel and the second evaporating channel are connected at positions of a plurality of heat source regions.
在一个示例性实施例中，其中，所述管路结构为采用吹胀工艺或钎焊工艺制成。In an exemplary embodiment, wherein, the pipeline structure is made by an inflation process or a brazing process.
在本发明上述实施例中，通过传热板的分区管路结构设计，实现气液相分离，避免气液掺混增加流动阻力，从而提升整板均温能力；同时，能够避免顶部热源出现干烧现象，解决了上部热源处缺少液体的问题。In the above-mentioned embodiments of the present invention, the gas-liquid phase separation is realized through the partitioned pipeline structure design of the heat transfer plate, which avoids the increase of flow resistance caused by gas-liquid mixing, thereby improving the temperature uniformity of the entire plate; at the same time, it can avoid dryness of the top heat source The burning phenomenon solves the problem of lack of liquid at the upper heat source.
附图说明Description of drawings
图1是根据相关技术的传热板管路的平面结构示意图；Fig. 1 is a schematic plan view of a heat transfer plate pipeline according to the related art;
图2是根据本发明实施例的一种传热板的结构示意图；Fig. 2 is a schematic structural view of a heat transfer plate according to an embodiment of the present invention;
图3是根据本发明实施例的传热板中的分区管路结构示意图；Fig. 3 is a schematic diagram of a partitioned pipeline structure in a heat transfer plate according to an embodiment of the present invention;
图4是根据本发明实施例的传热板中的复合管路结构示意图；Fig. 4 is a schematic structural diagram of a composite pipeline in a heat transfer plate according to an embodiment of the present invention;
图5是根据本发明实施例的气液在复合管路结构内的流动路径示意图；5 is a schematic diagram of the flow path of gas and liquid in a composite pipeline structure according to an embodiment of the present invention;
图6是根据本发明实施例的传热板的另一管路结构示意图；6 is a schematic diagram of another pipeline structure of a heat transfer plate according to an embodiment of the present invention;
图7是根据本发明实施例的气液在管路结构内的流动路径示意图；7 is a schematic diagram of the flow path of gas and liquid in the pipeline structure according to an embodiment of the present invention;
图8是根据本发明实施例的传热板的另一分区管路结构示意图；8 is a schematic diagram of another partitioned pipeline structure of a heat transfer plate according to an embodiment of the present invention;
图9是根据本发明实施例的气液在管路结构内的流动路径示意图。Fig. 9 is a schematic diagram of a flow path of gas and liquid in a pipeline structure according to an embodiment of the present invention.
具体实施方式Detailed ways
下文中将参考附图并结合实施例来详细说明本发明的实施例。Embodiments of the present invention will be described in detail below with reference to the drawings and in combination with the embodiments.
需要说明的是，本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence.
为了解决现有的传热板在散热管理上存在的技术问题，在本实施例中提供了一种传热板。在本实施例中，对管路形状结构进行优化设计，期望通过管路结构设计解决传热板底部液体堆积和上部热源处缺液问题。In order to solve the technical problems existing in heat dissipation management of existing heat transfer plates, a heat transfer plate is provided in this embodiment. In this embodiment, the optimized design of the pipeline shape and structure is expected to solve the problem of liquid accumulation at the bottom of the heat transfer plate and lack of liquid at the upper heat source through the design of the pipeline structure.
本实施例提供的传热板可包括基板和复合在所述基板表面的管路结构，所述管路结构包括第一蒸发流道和多个相间隔的分区管路，每个分区管路包括与第一蒸发流道相通的气体上升流道和液体下降流道，所述气体上升流道用于所述第一蒸发流道中上升的气态冷媒工质进入所述分区管路，所述液体下降流道用于所述分区管路中的液体冷媒工质回流至所述第一蒸发流道。在本实施例中，设计第一蒸发流道和冷凝管路结构的分区设计，保证大功耗热源区域对应的蒸发流道管路位置有液体存在，避免顶部热源区域出现干烧现象。The heat transfer plate provided in this embodiment may include a base plate and a piping structure compounded on the surface of the base plate, the piping structure includes a first evaporation flow channel and a plurality of spaced partitioned piping, and each partitioned piping includes A gas ascending channel and a liquid descending channel communicated with the first evaporating channel, the gas ascending channel is used for the rising gaseous refrigerant in the first evaporating channel to enter the partition pipeline, and the liquid descending The flow channel is used to return the liquid refrigerant working medium in the partition pipeline to the first evaporation flow channel. In this embodiment, the zonal design of the first evaporation flow channel and the condensation pipeline structure is designed to ensure that there is liquid in the position of the evaporation flow channel corresponding to the high power consumption heat source area, and to avoid dry burning in the top heat source area.
在本实施例中，还可以同时设计第一蒸发流道、第二蒸发流道和分区管路结构，将蒸发流道结构中的第二蒸发流道管径设计为小于当量直径，其余管径大于当量直径，保证冷媒在第二蒸发流道内向上流动时表面张力可以克服重力作用，可避免顶部热源出现干烧现象，进一步解顶部干烧现象，从而提升整板均温能力。In this embodiment, it is also possible to design the first evaporating channel, the second evaporating channel, and the partitioned pipeline structure at the same time, and design the diameter of the second evaporating channel in the evaporating channel structure to be smaller than the equivalent diameter, and the remaining tube diameters It is larger than the equivalent diameter to ensure that the surface tension of the refrigerant can overcome the gravity when the refrigerant flows upward in the second evaporator channel, which can avoid the dry burning phenomenon of the top heat source and further solve the dry burning phenomenon of the top, thereby improving the temperature uniformity of the entire board.
为了便于对本发明所提供的技术方案的理解，下面将结合具体场景的实施例进行详细描述。In order to facilitate the understanding of the technical solutions provided by the present invention, the following will describe in detail in conjunction with embodiments of specific scenarios.
实施例1Example 1
图2是根据本发明实施例的一种传热板的结构示意图。如图2所示，该传热板可以为铝基板表面1复合有管路结构2的两相散热传热板。其中所述管路2可通过吹胀工艺或者钎焊工艺加工而成。该管路2可以为如图2所示的串联结构，因此，相对业界在用的蜂窝管路结构内部气液掺混流动混乱，本实施例中，通过串联管路结构形式可实现气液相分离，减小流动阻力，从而提升传热效率及整个传热板的均温性。当然，该管路2也可以采用其他的结构方式。Fig. 2 is a schematic structural diagram of a heat transfer plate according to an embodiment of the present invention. As shown in FIG. 2 , the heat transfer plate may be a two-phase heat transfer plate for heat dissipation with a pipe structure 2 compounded on the surface 1 of the aluminum substrate. Wherein the pipeline 2 can be processed by an inflation process or a brazing process. The pipeline 2 can be a series structure as shown in Figure 2. Therefore, compared with the honeycomb pipeline structure used in the industry, the gas-liquid mixing flow is chaotic. In this embodiment, the gas-liquid phase can be realized through the series pipeline structure. Separation reduces flow resistance, thereby improving heat transfer efficiency and temperature uniformity of the entire heat transfer plate. Of course, the pipeline 2 can also adopt other structural manners.
如图2所示，在本实施例中，Q为大功耗芯片对应位置，31、32和33为基板上的热源，靠近热源(31、32和33)的一侧为基板近热源区，近热源区附近的管路结构2定义为蒸发区，远离热源的一侧为基板远热源区，远热源区附近的管路结构2定义为冷凝区，近热源区和远热源区之间设置有管路结构2，管路内部充灌有冷媒工质，通过冷媒工质相变潜热将热量Q传递至远热源区，和空气自然对流换热，实现整板的均温效果。As shown in Figure 2, in this embodiment, Q is the corresponding position of the high power consumption chip, 31, 32 and 33 are heat sources on the substrate, and the side close to the heat source (31, 32 and 33) is the area near the heat source of the substrate, The pipeline structure 2 near the heat source area is defined as the evaporation area, the side away from the heat source is the far heat source area of the substrate, and the pipeline structure 2 near the far heat source area is defined as the condensation area. Pipeline structure 2, the inside of the pipeline is filled with refrigerant working fluid, and the heat Q is transferred to the remote heat source area through the phase change latent heat of the refrigerant working fluid, and the heat exchange with the air is natural, so as to realize the uniform temperature effect of the whole board.
在本实施例中，为解决传统管路液体无法运动至顶部区域，可通过在蒸发区设计第一蒸发流道43及第二流道41和储液腔4。其中，第一蒸发流道43和第二蒸发流道41位于储液腔4的上方并与储液腔4相通，串联管路结构首端241和尾端201与第一蒸发流道43连接，第一蒸发流道43和第二蒸发流道41中部通过实体间隔区42分隔开。第二蒸发流道41的当量直径小于临界直径，其余管径大于临界直径，从而保证冷媒在第二蒸发流道41内向上流动时表面张力可以克服重力作用，避免顶部出现干烧现象。In this embodiment, in order to solve the problem that the liquid in the traditional pipeline cannot move to the top area, the first evaporation channel 43 , the second channel 41 and the liquid storage chamber 4 can be designed in the evaporation area. Wherein, the first evaporation flow channel 43 and the second evaporation flow channel 41 are located above the liquid storage chamber 4 and communicate with the liquid storage chamber 4, the head end 241 and the tail end 201 of the series pipeline structure are connected with the first evaporation flow channel 43, The middle part of the first evaporating channel 43 and the second evaporating channel 41 is separated by a physical spacer 42 . The equivalent diameter of the second evaporating channel 41 is smaller than the critical diameter, and the remaining pipe diameters are larger than the critical diameter, so as to ensure that the surface tension of the refrigerant can overcome the gravity when the refrigerant flows upward in the second evaporating channel 41, and avoid dry burning at the top.
例如，
Figure PCTCN2022080222-appb-000002
其中D为第二蒸发流道41的当量直径，σ为冷媒工质的表面张力数值，ρ l为冷媒工质液体密度，ρ v为冷媒工质气体密度，g为重力加速度数值。 For example,
Figure PCTCN2022080222-appb-000002
Where D is the equivalent diameter of the second evaporating channel 41, σ is the surface tension value of the refrigerant working medium, ρ l is the liquid density of the refrigerant working medium, ρ v is the gas density of the refrigerant working medium, and g is the value of the acceleration of gravity.
相对脉动热管管路结构，本实施例中在第二蒸发流道采用了脉动热管的特征，冷凝区流道管径较大，减小了流动阻力，相对脉动热管传热效率更高。需说明的是，虽然图2中所示出的第一蒸发流道43的数量为1条，但是可以理解，第一蒸发流道43可以根据需要设置多条。Compared with the pipeline structure of the pulsating heat pipe, the characteristics of the pulsating heat pipe are adopted in the second evaporation channel in this embodiment. The diameter of the channel in the condensation area is larger, which reduces the flow resistance and has higher heat transfer efficiency than the pulsating heat pipe. It should be noted that although the number of the first evaporating channel 43 shown in FIG. 2 is one, it can be understood that multiple first evaporating channels 43 can be provided as required.
实施例2Example 2
图3根据本发明实施例的传热板的管路分区结构示意图，在本实施例中，该传热板的管路结构2采用了分区设计。具体地，如图3所示，所述管路结构2在热源位置Q蒸发区附近斜向管路断开连接，如热源31附近的管路211和212，热源32附近的管路221和222，以及热源32附近的管路231和232，其直接与蒸发流道连接，即通过此方式实现管路分区结构设计。在本实施例中，可根据需要对所有大功耗进行分区结构设计，也可对其中一部分大功耗芯片进行分区结构设计，并不限于分区数量。FIG. 3 is a schematic diagram of the pipeline partition structure of the heat transfer plate according to an embodiment of the present invention. In this embodiment, the pipeline structure 2 of the heat transfer plate adopts a partition design. Specifically, as shown in FIG. 3 , the pipeline structure 2 is disconnected from oblique pipelines near the heat source position Q evaporation area, such as pipelines 211 and 212 near the heat source 31 and pipelines 221 and 222 near the heat source 32. , and the pipelines 231 and 232 near the heat source 32, which are directly connected to the evaporating channel, that is, in this way, the design of the pipeline partition structure is realized. In this embodiment, the partition structure design can be performed for all high power consumption chips as required, and the partition structure design can also be performed for some of the high power consumption chips, which is not limited to the number of partitions.
如图3所示，在本实施例，在管路结构的分区位置包含气体上升流道(211、221和231)和液体下降流道(212、222和232)，其中气体上升流道(211、221和231)为气体进口，液体下降流道(212、222和232)为液体出口。所述的分区位置处的液体下降流道(212、222和232)的出口高度应低于对应的热源区底部位置，例如，液体下降流道222位于热源区32下部，例如，0～10mm处，这样可保证该热源处有回流的液体存在。As shown in Figure 3, in this embodiment, the divisional positions of the pipeline structure include gas ascending passages (211, 221 and 231) and liquid descending passages (212, 222 and 232), wherein the gas ascending passages (211 , 221 and 231) are gas inlets, and liquid downflow channels (212, 222 and 232) are liquid outlets. The outlet height of the liquid downflow channel (212, 222 and 232) at the partition position should be lower than the bottom position of the corresponding heat source area, for example, the liquid downflow channel 222 is located at the lower part of the heat source area 32, for example, at 0-10 mm , so that there is backflow liquid at the heat source.
在本实施例中，所述管路2的顶部设置有冷媒工质的灌装口5，第一蒸发流道的顶端通过水平管22与管路2的分区管路结构首端241相通，第一蒸发流道的底端与分区管路结构尾端201相通。管路2的每个分区的斜向管路与水平方向呈一定的夹角，例如，该夹角可在30°～60°之间，这样便于第一蒸发流道气态冷媒工质进入分区管路，以及便于分区管路中的液体冷媒工质回流至所述第一蒸发流道。In this embodiment, the top of the pipeline 2 is provided with a refrigerant filling port 5, and the top of the first evaporation channel communicates with the first end 241 of the partitioned pipeline structure of the pipeline 2 through the horizontal tube 22. The bottom end of an evaporation channel communicates with the tail end 201 of the partitioned piping structure. The oblique pipeline of each partition of the pipeline 2 forms a certain angle with the horizontal direction, for example, the angle can be between 30° and 60°, so that the gaseous refrigerant in the first evaporating channel can easily enter the partition pipe way, and facilitate the return of the liquid refrigerant working medium in the divisional pipeline to the first evaporator channel.
在本实施例中，通过第一蒸发流道和冷凝管路的分区设计，保证大功耗热源区域对应的第一蒸发流道管路位置有液体存在，解决顶部干烧现象，进一步强化整板均温性。In this embodiment, through the partition design of the first evaporation flow channel and the condensation pipeline, it is ensured that there is liquid in the position of the first evaporation flow channel corresponding to the heat source area with high power consumption, which solves the phenomenon of dry burning at the top and further strengthens the whole board temperature uniformity.
实施例3Example 3
图4为根据本发明实施例的传热板的复合管路结构示意图，在实施例中，同时设计第一蒸发流道和第二蒸发流道以及分区管路结构。如图4所示，与上述实施例相同，该传热板可由基板1和复合在基板表面的管路2组合而成，在热源(31、32、33)侧设置有第一蒸发流道43、第二蒸发流道41和储液腔4。第一蒸发流道43和第二蒸发流道41中部通过实体间隔区42分隔开，所述间隔区42的宽度一般可在例如1mm～2mm之间。所述储液腔4位于第一蒸发流道43和第二蒸发流道41的正下方，与管路2的下部出口连接。Fig. 4 is a schematic diagram of a composite pipeline structure of a heat transfer plate according to an embodiment of the present invention. In the embodiment, the first evaporation channel and the second evaporation channel and the partitioned pipeline structure are designed at the same time. As shown in Figure 4, the same as the above-mentioned embodiment, the heat transfer plate can be composed of a substrate 1 and a pipeline 2 compounded on the surface of the substrate, and a first evaporation channel 43 is provided on the side of the heat source (31, 32, 33) , the second evaporation channel 41 and the liquid storage chamber 4 . The middle part of the first evaporating flow channel 43 and the second evaporating flow channel 41 is separated by a physical spacer 42 , and the width of the spacer 42 can generally be, for example, between 1 mm and 2 mm. The liquid storage chamber 4 is located directly below the first evaporating channel 43 and the second evaporating channel 41 , and is connected to the lower outlet of the pipeline 2 .
在本实施例中，所述管路2的顶部设置有冷媒工质的灌装口5，第一蒸发流道的顶端通过水平管22与管路2的分区管路结构的上部入口相通。第二蒸发流道41当量直径小于临界直径，因此，冷媒在第二蒸发流道41向上运动时表面张力能够克服重力g的作用。相对于在管路内部加毛细结构，在本实施例中，利用第二蒸发流道41和储液腔4结构实现了对液体的抽吸，同时还利用在热源区位置设置分区管路结构，能保证热源区位置不出现干烧现象。In this embodiment, the top of the pipeline 2 is provided with a refrigerant filling port 5 , and the top of the first evaporating channel communicates with the upper inlet of the partitioned pipeline structure of the pipeline 2 through a horizontal tube 22 . The equivalent diameter of the second evaporating channel 41 is smaller than the critical diameter, therefore, the surface tension of the refrigerant can overcome the effect of gravity g when the refrigerant moves upward in the second evaporating channel 41 . Compared with adding a capillary structure inside the pipeline, in this embodiment, the second evaporation channel 41 and the liquid storage chamber 4 structure are used to realize the suction of the liquid, and at the same time, the partitioned pipeline structure is set at the heat source area, It can ensure that the position of the heat source area does not appear dry burning.
在本实施例中，管路2在热源区域附近设置成分区单回路管路结构，如相邻流道211和 212不直接连通，仅和第一蒸发流道43连接，每个分区形成单回路结构，该单回路结构保证气液流动时实现相分离，在大功耗热源Q位置设置分区管路结构保证热源区域附近有冷媒回流补充，大大提升整板的均温性能。具体地，如图4所示，在本实施例中，所述管路结构2由多条斜向管路构成，相邻管路串联连接，在蒸发区通过21连接，在冷凝区通过23连接，串联管路结构首端241和尾端201与第一蒸发流道43连接。In this embodiment, the pipeline 2 is arranged as a partitioned single-circuit pipeline structure near the heat source area. For example, the adjacent flow channels 211 and 212 are not directly connected, but only connected to the first evaporation flow channel 43, and each partition forms a single circuit. Structure, the single-loop structure ensures phase separation during gas-liquid flow, and a partitioned pipeline structure is set at the position of the high-power heat source Q to ensure that there is refrigerant backflow supplement near the heat source area, which greatly improves the temperature uniformity of the entire board. Specifically, as shown in FIG. 4, in this embodiment, the pipeline structure 2 is composed of a plurality of oblique pipelines, and adjacent pipelines are connected in series, connected by 21 in the evaporation zone, and connected by 23 in the condensation zone. , the first end 241 and the tail end 201 of the series pipeline structure are connected to the first evaporation channel 43 .
在本实施例中，利用蒸发流道结构以及分区管路结构设计，实现气液相分离，避免了气液掺混增加流动阻力以及避免了顶部热源出现干烧现象，解决了上部热源处缺少液体的问题，提升了整板均温能力。In this embodiment, the gas-liquid phase separation is realized by using the evaporation flow channel structure and the partitioned pipeline structure design, which avoids the increase of flow resistance caused by gas-liquid mixing and avoids the phenomenon of dry burning of the top heat source, and solves the lack of liquid at the upper heat source The problem of improving the temperature uniformity of the entire board.
图5是根据本发明实施例的气液在复合管路结构内的流动示意图，如图5所示，在本实施例中，所述管路2内部充灌有冷媒工质，通过灌装口抽真空充灌后，在灌装口处进行焊接压封，保证管路2内部为一个真空密闭空间。如图5所示，本实施例提供的高效散热结构的工作过程为：冷媒在第一蒸发流道43和第二蒸发流道41内受热蒸发，在内部压力驱动下，由近热源区21沿气体上升流道(箭头向上位置)向管路2远热源区23运动，在运动过程中气体不断凝结成液体工质，由于管路结构为单回路结构，液体在高温蒸汽的推动下沿液体下降管(箭头向下位置)回流至近热源区，在近热源区21拐角处再次汽化后高温蒸汽沿着气体上升流道运动至远热源23处，运动过程中不断发生蒸发和冷凝相变过程，将热量Q传递至远热源区23处，实现整板的均温过程，同时由于单回路结构实现气液相分离，提升了两相换热效率。Fig. 5 is a schematic diagram of the flow of gas and liquid in the composite pipeline structure according to an embodiment of the present invention. After vacuum filling, the filling port is welded and sealed to ensure that the inside of the pipeline 2 is a vacuum-tight space. As shown in Figure 5, the working process of the high-efficiency heat dissipation structure provided by this embodiment is as follows: the refrigerant is heated and evaporated in the first evaporating channel 43 and the second evaporating channel 41, driven by the internal pressure, it flows from the near heat source area 21 along the The gas ascending channel (upward position of the arrow) moves towards the heat source area 23 far away from the pipeline 2. During the movement, the gas continuously condenses into a liquid working medium. Since the pipeline structure is a single-circuit structure, the liquid descends along the liquid under the push of high-temperature steam The tube (downward arrow position) flows back to the near heat source area, and after being vaporized again at the corner of the near heat source area 21, the high-temperature steam moves along the gas ascending channel to the far heat source 23. The heat Q is transferred to the remote heat source area 23 to realize the uniform temperature process of the whole board. At the same time, the gas-liquid phase separation is realized due to the single-circuit structure, which improves the two-phase heat exchange efficiency.
在热源Q附近由于管路2分区结构设计，热源(31、32、33)附近液体下降管路内的冷媒液体可以流入第一蒸发流道43。例如，热源32附近液体下降流动222内的冷媒液体沿着管路流动至第一蒸发流道43，而第一蒸发流道内43内高温蒸汽沿着第一蒸发流道43向上运动，向上运动的高温蒸汽对向下运动的液体施加一定向上的推动力，液体向上运动，通过汽化潜热将热源Q的热量带走，液体相变成气体，气体运动至上部热源32的下部时，从压力更低气体上升流动(例如，221、241)进入管路2内部向远热源区运动，不断冷凝后沿着液体下降管运动至热源Q位置，实现一个循环。通过在热源Q处分区管路设计，保证热源Q位置有液体存在，同时由于201液体下降流道内液体不断向储液腔4运动，推动储液腔内部液体向上运动，第二蒸发流道41内径小于临界直径，表面张力克服重力作用，液体沿着第二蒸发流道41不断向上运动，并相变成气体，高温蒸汽沿着22流动至管路结构2，最终在管路2内部发生冷凝后通过201再次进入储液腔4，实现一个循环，不断带走热源区热量。In the vicinity of the heat source Q, the refrigerant liquid in the liquid descending pipeline near the heat source ( 31 , 32 , 33 ) can flow into the first evaporator flow channel 43 due to the two-partition structure design of the pipeline. For example, the refrigerant liquid in the liquid descending flow 222 near the heat source 32 flows along the pipeline to the first evaporating channel 43, and the high-temperature steam in the first evaporating channel 43 moves upward along the first evaporating channel 43. The high-temperature steam exerts a certain upward driving force on the liquid moving downward, and the liquid moves upward, taking away the heat of the heat source Q through the latent heat of vaporization, and the liquid phase changes into gas, and when the gas moves to the lower part of the upper heat source 32, the pressure is lower The gas ascending flow (for example, 221, 241) enters the interior of the pipeline 2 and moves toward the far heat source area, and after continuous condensation, it moves along the liquid downpipe to the position of the heat source Q, realizing a cycle. Through the partitioned pipeline design at the heat source Q, it is ensured that there is liquid at the position of the heat source Q. At the same time, because the liquid in the 201 liquid descending channel continuously moves to the liquid storage chamber 4, the liquid in the liquid storage chamber is pushed upward, and the inner diameter of the second evaporation channel 41 If the diameter is smaller than the critical diameter, the surface tension overcomes the gravity, the liquid moves upwards along the second evaporation channel 41, and turns into a gas, and the high-temperature steam flows along 22 to the pipeline structure 2, and finally condenses inside the pipeline 2 Enter the liquid storage chamber 4 again through 201 to realize a cycle and continuously take away the heat of the heat source area.
在本实施例中，通过第二蒸发流道和分区管路结构设计，保证近热源区顶部有一定的液体存在，避免干烧现象，提升整板的均温能力。In this embodiment, through the structural design of the second evaporating channel and the partitioned pipeline, it is ensured that there is a certain amount of liquid at the top of the area near the heat source, so as to avoid dry burning and improve the temperature uniformity of the entire board.
实施例4Example 4
本实施例在上述实施例3的基础上，进一步提供了一种传热板的内部管路结构。图6是该传热板的内部管路结构示意图。如图6所示，本实施例中，在热源Q附近管路2采用分区结构设计，该分区结构设计与上述实施例3相同。本实施例的传热板的内部管路结构与实施例3的管路结构基本相同，区别在于，在上述实施例3中，第一蒸发流道43和第二蒸发流道41由实体42相隔离，而在本实施例中，第一蒸发流道43和第二蒸发流道41在热源Q区域实现连通(411、412和413)，该连通区域和热源区域的气体上升流道方向一致，为气体上升流道与实体区域42的交点。该连通设计可以便于气液在热源Q区域的交点处交换，使得交 点处有液体存在。On the basis of the above-mentioned embodiment 3, this embodiment further provides an internal pipeline structure of the heat transfer plate. Fig. 6 is a schematic diagram of the internal pipeline structure of the heat transfer plate. As shown in FIG. 6 , in this embodiment, the pipeline 2 near the heat source Q adopts a partitioned structure design, which is the same as that of the above-mentioned embodiment 3. The internal pipeline structure of the heat transfer plate of this embodiment is basically the same as that of Embodiment 3, the difference is that in the above-mentioned Embodiment 3, the first evaporating channel 43 and the second evaporating channel 41 are connected by entities 42 In this embodiment, the first evaporating channel 43 and the second evaporating channel 41 are connected in the area of the heat source Q (411, 412 and 413), and the direction of the communication area is consistent with the direction of the gas ascending flow channel in the area of the heat source. is the intersection of the gas upflow channel and the solid area 42 . This communication design can facilitate gas-liquid exchange at the intersection of the heat source Q area, so that there is liquid at the intersection.
图7是根据本发明实施例的液体与气体在该传热板内部的运动路径。如图7所示，本实施例的高效散热结构工作过程为：热源区附近的管路结构内的冷媒液体可沿着液体下降流道(例如，液体下降流道222)流动至第一蒸发流道43，第一蒸发流道内43内高温蒸汽沿着流道向上运动，向上运动的高温蒸汽对向下运动的液体施加一定向上的推动力，液体向上运动，通过汽化潜热将热源Q的热量带走，通过在热源Q处分区管路设计，从而保证热源Q位置有液体存在，同时由于液体下降流道(例如，液体下降流道222)内液体不断向储液腔4运动，推动储液腔内部液体向上运动，第二蒸发流道41内径小于临界直径，表面张力克服重力作用，液体沿着第二蒸发流道41不断向上运动，部分液体在运动过程中相变成气体，液体继续向上运动，气体在上升过程中沿着气体上升流道(411、412、413)向管路2的分区管路内运动，最终在管路2内部发生冷凝后通过液体下降流道201再次进入储液腔4，实现一个循环，不断带走热源区热量。Fig. 7 is the moving path of liquid and gas inside the heat transfer plate according to an embodiment of the present invention. As shown in Figure 7, the working process of the high-efficiency heat dissipation structure of this embodiment is: the refrigerant liquid in the pipeline structure near the heat source area can flow to the first evaporation flow along the liquid descending channel (for example, the liquid descending channel 222) Road 43, the high-temperature steam in the first evaporation channel 43 moves upward along the channel, and the upward-moving high-temperature steam exerts a certain upward driving force on the downward-moving liquid, and the liquid moves upward, and the heat of the heat source Q is carried by the latent heat of vaporization Go, through the partitioned pipeline design at the heat source Q, so as to ensure that there is liquid at the position of the heat source Q, and at the same time, because the liquid in the liquid descending channel (for example, the liquid descending channel 222) continuously moves to the liquid storage chamber 4, it pushes the liquid storage chamber The internal liquid moves upwards, the inner diameter of the second evaporating channel 41 is smaller than the critical diameter, the surface tension overcomes the action of gravity, the liquid moves upwards along the second evaporating channel 41, part of the liquid phase changes into gas during the movement, and the liquid continues to move upwards , the gas moves along the gas ascending channel (411, 412, 413) to the partitioned pipeline of pipeline 2 during the rising process, and finally condenses inside the pipeline 2 and enters the liquid storage chamber again through the liquid descending channel 201 4. Realize a cycle to continuously take away heat from the heat source area.
实施例5Example 5
在上述实施例3的基础上，本实施例进一步提供另一种传热板的内部管路结构。图8是本实施例的传热板的内部管路结构示意图，图9是根据本实施例的液体与气体在该传热板内部的运动路径。本实施例与实施例3的管路结构基本相同，分别针对热源(31、32、32)对管路2进行分区设计，不同之处在于，在上述实施例3中，管路2的相邻管路为串联结构，而在本实施例中，管路2的相邻管路为多条并联管路结构。如图8所示，在本实施例中，通过多条并行的管路结构将蒸发区和远热源区相连接，通过对热源区Q对应通道的冷凝通道(231、232、233、234)隔断设置实现液体流动分区功能。例如，流道212对应的冷凝通道233和流道211对应的冷凝通道234在冷凝端通过实体分割开，保证冷凝通道233内部冷媒仅可通过流道212流动至第一蒸发流道43中，实现热源区Q的热量传递，而无法通过冷凝流道234流动至底部。如图9所示，通过冷凝管路的分割将散热分割成几个循环结构，保证上部液体可以回流补充至上部，而不是流动至底部堆积，从而提升整板的换热效率。需要说明的是，本实施例的管路分区结构仅是作为示例，可以理解，基于同样的原理，在本实施例中，还可以采用其它的分区结构方式，而且每个分区的直管的数量，连接方式并不受限定，只要可以起到同样的技术效果即可。On the basis of the above-mentioned embodiment 3, this embodiment further provides another internal pipeline structure of the heat transfer plate. Fig. 8 is a schematic diagram of the internal piping structure of the heat transfer plate of this embodiment, and Fig. 9 is a movement path of liquid and gas inside the heat transfer plate according to this embodiment. The piping structure of this embodiment is basically the same as that of Embodiment 3, and the piping 2 is designed in partitions for the heat sources (31, 32, 32). The pipelines are of a series structure, but in this embodiment, the adjacent pipelines of the pipeline 2 are multiple parallel pipelines. As shown in Figure 8, in this embodiment, the evaporation area and the remote heat source area are connected by a plurality of parallel pipeline structures, and the condensation channels (231, 232, 233, 234) of the corresponding channel to the heat source area Q are separated. Set to realize the liquid flow partition function. For example, the condensation channel 233 corresponding to the flow channel 212 and the condensation channel 234 corresponding to the flow channel 211 are physically separated at the condensation end to ensure that the refrigerant inside the condensation channel 233 can only flow into the first evaporation flow channel 43 through the flow channel 212 to realize The heat in the heat source area Q is transferred, but cannot flow to the bottom through the condensation channel 234 . As shown in Figure 9, the heat dissipation is divided into several circulation structures through the division of the condensing pipeline to ensure that the upper liquid can flow back to the upper part instead of flowing to the bottom to accumulate, thereby improving the heat transfer efficiency of the entire plate. It should be noted that the pipeline partition structure in this embodiment is only an example. It can be understood that based on the same principle, other partition structures can also be used in this embodiment, and the number of straight pipes in each partition , the connection method is not limited, as long as the same technical effect can be achieved.
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the principle of the present invention shall be included in the protection scope of the present invention.

Claims (11)

  1. 一种传热板，包括基板和复合在所述基板表面的管路结构，其中，所述管路结构包括第一蒸发流道和多个相间隔的分区管路，每个分区管路包括与第一蒸发流道相通的气体上升流道和液体下降流道，所述气体上升流道用于所述第一蒸发流道中上升的气态冷媒工质进入所述分区管路，所述液体下降流道用于所述分区管路中的液体冷媒工质回流至所述第一蒸发流道。A heat transfer plate, comprising a base plate and a piping structure compounded on the surface of the base plate, wherein the piping structure includes a first evaporation flow channel and a plurality of spaced partitioned piping, and each partitioned piping includes a The first evaporating flow channel communicates with the gas ascending flow channel and the liquid descending flow channel, the gas rising flow channel is used for the rising gaseous refrigerant working medium in the first evaporating flow channel to enter the partition pipeline, and the liquid descending flow channel The channel is used to return the liquid refrigerant in the partition pipeline to the first evaporator flow channel.
  2. 根据权利要求1所述的传热板，其中，所述基板的一侧包括多个热源区，每个分区管路设置在对应的热源区的相应位置，并且每个分区管路的液体下降流道低于对应的热源区的底部。The heat transfer plate according to claim 1, wherein one side of the base plate includes a plurality of heat source regions, and each subdivision pipeline is arranged at a corresponding position of the corresponding heat source region, and the liquid of each subdivision pipeline flows down The channel is lower than the bottom of the corresponding heat source zone.
  3. 根据权利要求1所述的传热板，其中，所述分区管路为多个依次相连的U形管组成的单回路管路，所述单回路管路的一端为气体上升流道，另一端为液体下降流道。The heat transfer plate according to claim 1, wherein the partitioned pipeline is a single-circuit pipeline composed of a plurality of U-shaped pipes connected in sequence, one end of the single-circuit pipeline is a gas ascending flow channel, and the other end Downstream for liquid.
  4. 根据权利要求1所述的传热板，其中，所述分区管路由多条并行管路组成，每条并行管路的一端与所述第一蒸发流道相连，另一端相互连通形成所述冷媒工质的冷凝通道。The heat transfer plate according to claim 1, wherein the partitioned pipelines are composed of a plurality of parallel pipelines, one end of each parallel pipeline is connected to the first evaporation channel, and the other ends are connected to each other to form the refrigerant Condensation channel for working fluid.
  5. 根据权利要求1所述的传热板，其中，所述分区管路的直管路段与水平方向呈预设夹角。The heat transfer plate according to claim 1, wherein, the straight pipe section of the partitioned pipe forms a predetermined included angle with the horizontal direction.
  6. 根据权利要求1至5任一项所述的传热板，其中，所述管路结构还包括储液腔和第二蒸发流道，储液腔设置在靠近所述基板的热源区的一侧，并且位于所述第一蒸发流道和第二蒸发流道的下方，并与所述第一蒸发流道和第二蒸发流道相通。The heat transfer plate according to any one of claims 1 to 5, wherein the pipeline structure further includes a liquid storage cavity and a second evaporation channel, and the liquid storage cavity is arranged on a side close to the heat source area of the substrate , and is located below the first evaporation flow channel and the second evaporation flow channel, and communicates with the first evaporation flow channel and the second evaporation flow channel.
  7. 根据权利要求6所述的传热板，其中，所述第二蒸发流道的内径小于如下临界直径：The heat transfer plate according to claim 6, wherein the inner diameter of the second evaporation channel is smaller than the following critical diameter:
    Figure PCTCN2022080222-appb-100001
    Figure PCTCN2022080222-appb-100001
    其中，σ为冷媒工质的表面张力数值，ρ l为液态的冷媒工质密度，ρ v为气态的冷媒工质密度，g为重力加速度数值。 Among them, σ is the surface tension value of the refrigerant working medium, ρ l is the density of the liquid refrigerant working medium, ρ v is the gaseous refrigerant working medium density, and g is the gravitational acceleration value.
  8. 根据权利要求7所述的传热板，其中，所述第一蒸发流道的内径大于所述临界直径。The heat transfer plate according to claim 7, wherein the inner diameter of the first evaporation channel is larger than the critical diameter.
  9. 根据权利要求7所述的传热板，其中，所述第一蒸发流道与第二蒸发流道之间相间隔。The heat transfer plate according to claim 7, wherein the first evaporation channel is spaced apart from the second evaporation channel.
  10. 根据权利要求7所述的传热板，其中，所述第一蒸发流道与第二蒸发流道之间在多个热源区的位置处相连通。The heat transfer plate according to claim 7, wherein the first evaporating channel and the second evaporating channel are connected at positions of a plurality of heat source regions.
  11. 根据权利要求1所述的传热板，其中，所述管路结构为采用吹胀工艺或钎焊工艺制成。The heat transfer plate according to claim 1, wherein the pipeline structure is made by inflation process or brazing process.
PCT/CN2022/080222 2021-08-30 2022-03-10 Heat transfer plate WO2023029429A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101566748A (en) * 2008-04-22 2009-10-28 鸿富锦精密工业（深圳）有限公司 Radiating module and backlight module adopting same
US20100163212A1 (en) * 2008-12-26 2010-07-01 Chi-Te Chin Flat loop Heat pipe
CN201803624U (en) * 2010-10-09 2011-04-20 天津大学 Multichannel parallel-loop pulsating heat pipe
CN105571366A (en) * 2015-12-25 2016-05-11 南昌大学 Pulsating heat pipe with tilt-angle communicating pipe structure
CN107466195A (en) * 2017-09-14 2017-12-12 郭良安 Pulsating heat pipe and heat exchanger
US20180209745A1 (en) * 2017-01-26 2018-07-26 Asia Vital Components Co., Ltd. Loop heat pipe structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101566748A (en) * 2008-04-22 2009-10-28 鸿富锦精密工业（深圳）有限公司 Radiating module and backlight module adopting same
US20100163212A1 (en) * 2008-12-26 2010-07-01 Chi-Te Chin Flat loop Heat pipe
CN201803624U (en) * 2010-10-09 2011-04-20 天津大学 Multichannel parallel-loop pulsating heat pipe
CN105571366A (en) * 2015-12-25 2016-05-11 南昌大学 Pulsating heat pipe with tilt-angle communicating pipe structure
US20180209745A1 (en) * 2017-01-26 2018-07-26 Asia Vital Components Co., Ltd. Loop heat pipe structure
CN107466195A (en) * 2017-09-14 2017-12-12 郭良安 Pulsating heat pipe and heat exchanger

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