CN201626987U - Electroplating equipment - Google Patents
Electroplating equipment Download PDFInfo
- Publication number
- CN201626987U CN201626987U CN2009202923970U CN200920292397U CN201626987U CN 201626987 U CN201626987 U CN 201626987U CN 2009202923970 U CN2009202923970 U CN 2009202923970U CN 200920292397 U CN200920292397 U CN 200920292397U CN 201626987 U CN201626987 U CN 201626987U
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- Prior art keywords
- anode
- electroplating
- electroplating device
- electroplate liquid
- gloss
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/36—Hydrogen production from non-carbon containing sources, e.g. by water electrolysis
Abstract
The utility model discloses electroplating equipment which comprises an electroplating tank, at least one insoluble anode, at least one anode diaphragm and one cathode, wherein the electroplating tank is used for containing electroplating solution. The insoluble anode is arranged in the electroplating tank and immersed in the electroplating solution. The anode diaphragm is arranged between the cathode and the at least one insoluble anode and immersed in the electroplating solution. When the electroplating processing is carried out, the anode diaphragm is used for substantially isolating oxygen or ozone generated in electroplating processing or adverse sulfide molecules generated after a polishing material is cracked from moving from the cathode to the insoluble anode.
Description
Technical field
The utility model relates to a kind of electroplating device, being particularly related to a kind of macromole gloss-imparting agent that ought act on cathode surface of isolating moves near the insoluble anode, because of oxygen or the cracking of ozone institute that brine electrolysis produces becomes bad sulfide, moved to the electroplating device of cathode surface eutectoid when coating by the insoluble anode surface again.
Background technology
In the electroplating device of printed circuit board (PCB), galvanic anode can be divided into soluble anode and insoluble anode.Soluble anode is with titanium basket dress phosphor-copper piece, wherein several titanium baskets are positioned over both sides in the plating tank respectively, and negative electrode is positioned between two corresponding titanium baskets, when plating tank adding electroplate liquid and after to the anode and cathode energising, the phosphor-copper piece dissociates cupric ion, and reduces copper on negative electrode.
But, in electroplating process,, phosphor-copper piece dissolving makes volume and area dwindle gradually to fail to fill up the titanium basket because of constantly dissociateing cupric ion, and the speed of dissociating of each phosphor-copper piece differs, the phosphor-copper piece replenishes can not intensive at any time operation, this all causes different distribution of current, make the electric field distribution inequality, therefore can influence the homogeneity of electrolytic coating thickness.If electrolytic coating is in uneven thickness, to after processing have disadvantageous effect (for example after etch processes in, can produce the problem of excessive lateral erosion).And can produce copper sludge in the phosphor-copper piece dissolution process, must change bath solution at set intervals and take out copper sludge, increase much more very inconvenience.
Another kind of for insoluble anode is to do anode with titanium or titanium alloy, cupric ion is supplied by the outer mantoquita dissolving tank of plating tank, and the source of cupric ion can be cupric oxide powder and dissolves in the mantoquita dissolving tank and get.Insoluble anode is done and is reticulated flat board, and except that avoiding irregular geometric jacquard patterning unit surface to cause the electric field fringing effect skewness, insoluble anode itself does not participate in the dissolving of copper metal, and it acts on only control current being evenly distributed on cathode surface.Therefore the distribution of current of insoluble anode and electric field distribution manifest quite even with respect to soluble anode, and can produce more uniform electrolytic coating on the surface of the negative electrode parallel with insoluble anode.
Yet, in the electroplating processes of using insoluble anode, produce a large amount of oxygen or ozone on the insoluble anode surface because of the insoluble anode brine electrolysis, and the gloss-imparting agent of electroplate liquid contains a kind of sulfide (for example two sulphur diisopropyl sulfonate sodiums) with unsaturated link(age) usually, when oxygen or ozone touched this gloss-imparting agent, oxygen or ozone can the cracking gloss-imparting agents and produce bad sulfide and pollute electroplate liquid.Shortcomings such as therefore, oxygen or ozone are except that meeting consumes gloss-imparting agent, and the bad sulfide after the gloss-imparting agent cracking can be gone up between the as-reduced copper crystallization at negative electrode (being printed circuit board (PCB)) in eutectoid, and this copper layer that contains sulfide is more crisp, ductility and solderability are not good.
In order to reduce above-mentioned disappearance, in a known solution, be constantly to replenish gloss-imparting agent to electroplate liquid, and replace the electroplate liquid of whole groove at set intervals, yet, except the cost that makes gloss-imparting agent and electroplate liquid greatly improves, also will increase man-hour and produce the environmental issue of handling a large amount of waste liquids.
In another known solution, be that electrodialysis film (or claiming ion-selective membrane) is set between insoluble anode and negative electrode, the electrodialysis film only allows the less negatively charged ion of volume to pass through, and stop bigger positively charged ion or other macromole to pass through, the copper layer that can avoid oxygen or ozone-depleting gloss-imparting agent and infringement to restore thus, yet the price of electrodialysis film is very high, and the copper facing manufacturing cost will significantly be increased.
Therefore, be necessary to provide a kind of electroplating device, to improve the existing problem of prior art.
The utility model content
Main purpose of the present utility model provides a kind ofly to be avoided the oxide compound cracking gloss-imparting agent that anode produces and avoids the electroplating device of bad sulfide eutectoid on negative plate that produce.
For reaching above-mentioned purpose, the utility model provides a kind of electroplating device, comprises plating tank, at least one insoluble anode and at least one anode barrier film, negative electrode.Wherein plating tank is in order to place electroplate liquid.Insoluble anode is arranged in the plating tank, and soaks and place this electroplate liquid.The anode barrier film is arranged between this negative electrode and this insoluble anode, and soaks and place this electroplate liquid.When carrying out electroplating processes, the anode barrier film is in order to stop that in fact the macromole gloss-imparting agent moves to insoluble anode from negative electrode.
In an embodiment of the present utility model, the anode barrier film has vesicular structure, and vesicular structure comprises several holes.Macromole circulates the anode barrier film in these several holes mutually in the electroplate liquid in order to isolate in fact, and small molecules or positively charged ion still can circulate mutually, reach electroplating activity.
The size in several holes of the membranous vesicular structure of anode in the electroplating device described in the utility model is less than the oxygen that produces on the anode in the electroplating processes process, ozone or the equimolecular size of bad sulfide that produces thereupon, so, can avoid oxygen that insoluble anode produces when reaction or ozone and the bad sulfide in the positive column to enter the cathodic area and pollute electroplate liquid and destroy the metal of reduction on negative electrode by using electroplating device of the present utility model.
Because electroplating device structure described in the utility model is novel, can provide on the industry and utilize, and truly have the enhancement effect, so apply for novel patent in accordance with the law.
Description of drawings
Fig. 1 is the part sectioned view about an embodiment of electroplating device of the present utility model.
Fig. 2 is the part sectioned view about another angle of an embodiment of electroplating device of the present utility model.
Fig. 3 is for stopping the enlarged diagram of the embodiment that macromole passes through about several holes in the electroplating device of the present utility model.
[primary clustering nomenclature]
Electroplate liquid 11 positive columns 12
Insoluble anode anchor clamps 21 anode rods 22
Hole 41 shaking devices 50
Eddy current centrifuge separator 71 filters 72
Return line 73 macromole 81
Embodiment
For above-mentioned and other purpose, feature and advantage of the present utility model can be become apparent, cited below particularlyly go out preferred embodiment, and conjunction with figs., be described in detail below.
Below please in the lump with reference to figure 1 and Fig. 2 embodiment about electroplating device of the present utility model.
Fig. 1 is the part sectioned view of an embodiment of electroplating device of the present utility model.As shown in Figure 1, electroplating device 1 of the present utility model comprises plating tank 10, several insoluble anodes 20, negative electrode 30, two anode barrier films 40 and several shaking devices 50.Wherein, in an embodiment of the present utility model, each insoluble anode 20 is titanium nets, but the utility model is not as limit.For instance, insoluble anode 20 also can be titanium alloy net, the platinum plating of titanium net or the gold-plated and palladium of titanium net.
In an embodiment of the present utility model, plating tank 10 is in order to place electroplate liquid 11, and electroplate liquid 11 comprises the metal ion that will be plated on the negative electrode 30.As shown in Figure 1, several insoluble anodes 20 are separately positioned on the both sides of plating tank 10.In an embodiment of the present utility model, electroplating device 1 also comprises several insoluble anode anchor clamps 21 and several anode rods 22, and wherein each anode rod 22 is arranged on the top of plating tank 10.One end of each insoluble anode anchor clamps 21 is arranged on each anode rod 22, and the other end is in order to each insoluble anode 20 of clamping and make each insoluble anode 20 and corresponding anode rod 22 conductings, and makes in the insoluble anode 20 immersion plating liquid 11.
In an embodiment of the present utility model, electroplating device 1 also comprises cathode fixture 31 and cathode rod 32, and wherein cathode rod 32 is arranged on the top of plating tank 10.One end of cathode fixture 31 is arranged on the cathode rod 32, and the other end is in order to clamping negative electrode 30 and make negative electrode 30 and corresponding cathode rod 32 conductings, and makes in the negative electrode 30 immersion plating liquid 11.In an embodiment of the present utility model, negative electrode 30 is the printed circuit board (PCB) of electroplated, but the utility model is not as limit.In an embodiment of the present utility model, be provided with overflow port 15 in a side of plating tank 10.
In an embodiment of the present utility model, each anode barrier film 40 is separately positioned on the both sides of plating tank 10, and each anode barrier film 40 is arranged between negative electrode 30 and each insoluble anode 20, so plating tank 10 can form positive column 12 and cathodic area 13, but the utility model is not as limit.In an embodiment of the present utility model, plating tank 10 also comprises two anode barrier film sockets 14, and each anode barrier film 40 is fixed in each anode barrier film socket 14, but the utility model is not as limit.
In an embodiment of the present utility model, one of formation method of anode barrier film 40 is the kaolin that contains low carbon species to be made tabular embryo carry out biscuiting (biscuit firing) processing again, the condition that biscuiting is handled is the sintering that carries out the short period of time under 550 ℃ to 1050 ℃, but the utility model is not as limit.Anode barrier film 40 of the present utility model has vesicular structure, and vesicular structure comprises several holes.In another embodiment of the present utility model, anode barrier film 40 materials can be scrim or non-woven fabrics, but the utility model is not as limit.
In an embodiment of the present utility model, shaking device 50 is arranged on the anode rod 22 of plating tank 10, and shaking device 50 can produce vibrating effect, but the utility model is not as limit.In an embodiment of the present utility model, shaking device 50 is a ultrasonic unit, but the utility model is not as limit.As shown in Figure 1, in a preferred embodiment of the present utility model, shaking device 50 is arranged on the anode rod 22, is a pneumatic shaking device.
Fig. 2 is the part sectioned view of another angle of an embodiment of electroplating device of the present utility model.As shown in Figure 2, in an embodiment of the present utility model, electroplating device 1 also comprises collection device 60 and filtration unit 70.Wherein, be provided with overflow port 15 in a side of plating tank 10, collection device 60 is connected with overflow port 15, and filtration unit 70 is connected with collection device 60.In an embodiment of the present utility model, filtration unit 70 comprises cyclone separator 71 and filter 72, and filter 72 can be the active carbon filtration machine, but the utility model is not as limit.It is noted that cyclone separator 71 and filter 72 have been widely used in correlative technology field, except filtering particle, also filter microbubble, so do not repeat them here its detailed function mode in the function that the utility model will reach.In an embodiment of the present utility model, be provided with return line 73 between plating tank 10 and the filter 72 and link to each other.
In an embodiment of the present utility model, after electroplating processes begins (promptly to insoluble anode 20 and negative electrode 30 energising backs), each insoluble anode 20 is because of reacting with electroplate liquid 11, make electroplate liquid 11 be dissociated into negatively charged ion and positively charged ion, metallic cation has negative charge on the negative electrode 30, so can be attracted close by negative electrode 30 and be reduced into metal deposition on negative electrode 30.Can be simultaneously that electroplate liquid 11 is the contained water (H of each insoluble anode 20 wherein
2O) dissociate, (O therefore can produce oxygen around each insoluble anode 20
2) or ozone (O
3), oxygen or ozone are macromole (for negatively charged ion), and the size in several holes of the vesicular structure of anode barrier film 40 is less than oxygen or the equimolecular size of ozone, so macromole such as oxygen or ozone are isolated in the positive column 12 and can not enter cathodic area 13 by anode barrier film 40.But it is noted that, the gloss-imparting agent of the electroplate liquid 11 in positive column 12 still can be because of contact oxygen or ozone be cracked into bad sulfide, can not enter cathodic area 13 by anode barrier film 40 yet anode barrier film 40 also can be isolated in this bad sulfide in the positive column 12.Please refer to Fig. 3, Fig. 3 stops the enlarged diagram of the embodiment that macromole 81 (such as oxygen or ozone) passes through for several holes 41 of anode barrier film 40 of the present utility model, because the size in several holes 41 of the vesicular structure of anode barrier film 40 is less than the size of macromole 81, so macromole 81 can't pass through anode barrier film 40.
By using electroplating device 1 of the present utility model, can avoid oxygen that insoluble anode 20 produces in when reaction or ozone and the bad sulfide positive column 12 in to enter cathodic area 13 and pollute electroplate liquid 11 and destroy the metal that reduces on negative electrode 30.
As shown in Figures 1 and 2, when carrying out electroplating processes, the liquid level of electroplate liquid 11 is in fact a little more than overflow port 15, and the vibrating effect by shaking device 50 produces can reach following purpose: (1) makes the oxygen of each insoluble anode 20 generation or the liquid level that ozone moves to electroplate liquid 11; And (2) will be outside the electroplate liquid 11 overflow plating grooves 10 of the positive column 12 of plating tank 10, and enter in the collection device 60.
Wherein, oxygen that each insoluble anode 20 surface produces or ozone are attached on each insoluble anode 20, when the vibrations that produce by shaking device 50 are conveyed to each insoluble anode 20, can order about oxygen or ozone and break away from each insoluble anode 20 surface and move to the liquid level of electroplate liquid 11 and enter in the air and be removed.
In addition, the electroplate liquid 11 in the positive column 12 be because of may containing the bad sulfide after the gloss-imparting agent cracking, can be by filtration unit 70 from contaminated electroplate liquid 11 to remove this bad sulfide.
In an embodiment of the present utility model, the electroplate liquid 11 that filtration unit 70 overflows in order to filtration.Electroplate liquid 11 after filtering can be to reuse in return line 73 is got back to plating tank 10.
To sum up institute is old, and no matter the utility model all shows it totally different in the feature of known technology with regard to purpose, means and effect, earnestly asks your juror to perceive, and grants quasi patent early, and in order to do Jiahui society, the true feeling moral just.But it should be noted that above-mentioned many embodiment give an example for convenience of explanation, the interest field that the utility model is advocated should be as the criterion so that claim is described certainly, but not only limits to the foregoing description.
Claims (10)
1. electroplating device comprises:
One plating tank is in order to place an electroplate liquid;
At least one insoluble anode is arranged in this plating tank, and soaks and place this electroplate liquid;
One negative electrode is arranged in this plating tank, and soaks and place this electroplate liquid; And
At least one anode barrier film is arranged between this negative electrode and this at least one insoluble anode, and soaks and place this electroplate liquid;
When carrying out electroplating processes, described anode barrier film moves to insoluble anode in order to stop macromolecular gloss-imparting agent in fact from negative electrode, and the cracked gloss-imparting agent moves to this negative electrode from described insoluble anode.
2. electroplating device as claimed in claim 1, it is characterized in that, described anode barrier film has vesicular structure, this vesicular structure comprises several holes, the size in described several holes is less than the macromole gloss-imparting agent or the molecular dimension of cracked gloss-imparting agent, thus the macromole gloss-imparting agent or cracked gloss-imparting agent molecule be to pass through these several holes.
3. electroplating device as claimed in claim 2 is characterized in that, this anode barrier film be with a kaolin that contains low carbon species make tabular embryo again the short period of time biscuiting processing 550 ℃ to 1050 ℃ under form.
4. electroplating device as claimed in claim 2 is characterized in that, the membranous material of this anode is scrim or non-woven fabrics.
5. electroplating device as claimed in claim 2, it is characterized in that this electroplating device also comprises a shaking device, this shaking device is arranged on the anode rod of this plating tank, this shaking device can produce a vibrating effect, so that the gas that this insoluble anode produces moves to electroplate liquid or liquid level.
6. electroplating device as claimed in claim 5 is characterized in that, this shaking device comprises a vibration of ultrasonic wave device or a pneumatic shaking device.
7. electroplating device as claimed in claim 1 is characterized in that, this electroplating device also comprises:
One overflow port is arranged on a side of this plating tank;
One collection device is connected with this overflow port place, this electroplate liquid that overflows in order to collection; And
One filtration unit connects this collection device, this electroplate liquid that overflows in order to filtration.
8. electroplating device as claimed in claim 7 is characterized in that, this filtration unit comprises an activated carbon tower.
9. electroplating device as claimed in claim 7 is characterized in that this filtration unit comprises a cyclone separator.
10. electroplating device as claimed in claim 1 is characterized in that, this insoluble anode is a titanium net, a titanium alloy net or a titanium net platinum plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202923970U CN201626987U (en) | 2009-12-04 | 2009-12-04 | Electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202923970U CN201626987U (en) | 2009-12-04 | 2009-12-04 | Electroplating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201626987U true CN201626987U (en) | 2010-11-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202923970U Expired - Fee Related CN201626987U (en) | 2009-12-04 | 2009-12-04 | Electroplating equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN201626987U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102021638A (en) * | 2010-12-30 | 2011-04-20 | 东莞市宏德电子设备有限公司 | Anode for improving electroplating uniformity |
| CN102424979A (en) * | 2011-11-17 | 2012-04-25 | 深圳市锦瑞电子有限公司 | Acidic oxidation-reduction potential water generating device of endoscopic disinfection machine and generation method thereof |
| CN103184499A (en) * | 2013-03-12 | 2013-07-03 | 华夏新资源有限公司 | Underwater conductive anode structure |
| CN103898594A (en) * | 2012-12-25 | 2014-07-02 | 大连崇达电路有限公司 | Insoluble anode electroplating copper-tin plating tank |
| CN105019008A (en) * | 2014-04-30 | 2015-11-04 | 先丰通讯股份有限公司 | Electroplating device |
| CN110512242A (en) * | 2019-09-10 | 2019-11-29 | 江苏兴达钢帘线股份有限公司 | A kind of device reducing burnt copper electrolyte copper ion |
-
2009
- 2009-12-04 CN CN2009202923970U patent/CN201626987U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102021638A (en) * | 2010-12-30 | 2011-04-20 | 东莞市宏德电子设备有限公司 | Anode for improving electroplating uniformity |
| CN102021638B (en) * | 2010-12-30 | 2015-03-25 | 东莞市宏德电子设备有限公司 | Anode for improving electroplating uniformity |
| CN102424979A (en) * | 2011-11-17 | 2012-04-25 | 深圳市锦瑞电子有限公司 | Acidic oxidation-reduction potential water generating device of endoscopic disinfection machine and generation method thereof |
| CN103898594A (en) * | 2012-12-25 | 2014-07-02 | 大连崇达电路有限公司 | Insoluble anode electroplating copper-tin plating tank |
| CN103184499A (en) * | 2013-03-12 | 2013-07-03 | 华夏新资源有限公司 | Underwater conductive anode structure |
| CN103184499B (en) * | 2013-03-12 | 2015-06-17 | 华夏新资源有限公司 | Underwater conductive anode structure |
| CN105019008A (en) * | 2014-04-30 | 2015-11-04 | 先丰通讯股份有限公司 | Electroplating device |
| CN105019008B (en) * | 2014-04-30 | 2017-04-19 | 先丰通讯股份有限公司 | Electroplating device |
| CN110512242A (en) * | 2019-09-10 | 2019-11-29 | 江苏兴达钢帘线股份有限公司 | A kind of device reducing burnt copper electrolyte copper ion |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: JIANG DEXIN Free format text: FORMER OWNER: LIANDING ELECTRONIC TECHNOLOGY INC., TAIWAN Effective date: 20120106 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20120106 Address after: Taiwan, China Patentee after: Jiang Dexin Address before: China Taiwan Taoyuan County Patentee before: Lianding Electronic Technology Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101110 Termination date: 20121204 |