M381635 五、新型說明： 【新型所屬之技術領域】 [0001] 本新型涉及電路板製造設備，尤其涉及一用於夾持電路 板進行電鍍之電鍍掛架。. 【先前技術】 [0002] 隨著電子產業飛速發展，作為電子產品基本構件之電路 .板之製作技術顯得愈來愈重要，線路與孔之製作要求亦 越來越精細。電路板具有單面板、雙面板與多層板之分 ，均由覆銅基板經裁切、鑽孔、蝕刻、曝光、顯影等一 系列制程製作而成。具體可參閱C.H. Steer等人於Pro-ceedings of the IEEE, Vol.39， No.2 (2002年8 月）中發表之 “Dielectric characterization of printed circuit board substrates” 一文。 [0003] 電路板製作過程中，通常採用於電路板上之導通孔内壁 鍍銅之方式實現電路板各層間線路之連通，或者需要在 電路板外露之導電墊區域在鍍覆一層銅層以可與電子元 件貼裝。該鍍銅制程一般包括化學鍍銅與電鍍銅兩個工 序。一般地，先使用化學鍍銅方法在絕緣區域沈積一層 薄銅，然後再用電鍍銅之方法以該薄銅層為導電基底鍍 上一層較厚之銅層。 [0004] 電路板之電鍍銅工序一般需要使用到電鍍掛架。通常先 把電路板固定於電鍍掛架上，然後把電鍍掛架固定於電 鍍線行車上，電路板浸於鍍銅槽中與鍍銅槽中之陽極相 對，通電後由於電化學作用鍍銅槽液中之銅離子鍍覆於 表單编號A0101 第4頁/共22頁 M381635 電路板上，電鍍掛架於電鍍銅過程中起著導電與固定電 路板之作用。然而，目前之電鍍掛架中，將電路板電連 接至電鍍掛架之鍍銅節點之導電線依附在電鍍掛架上， 該導電線長期遭受到鍍銅槽液之侵蝕，導電線表層之絕 緣膠很容易破裂漏電，從而影響電路板電鍍銅之均勻性 ，甚至可能造成電路板報廢。 [0005] 有鑑於此，提供一種可有效防止導電線破裂漏電，提高 電路板電鍍銅之均勻性之電路板電鍍掛架實為必要。 【新型内容】 [0006] 以下以實施例為例說明一種可有效防止導電線破裂漏電 ，提高電路板電鍍銅之均勻性之電路板電鍍掛架。 [0007] 該電路板電鍍掛架，其包括掛鈎、框架主體、絕緣包覆 層、導電線以及多個鍍銅夾點。該掛鈎與框架主體為導 電體，該掛鈎上設置有導電節點。該框架主體連接在掛 鈎上並用於支撐待電鍍之電路板》該絕緣包覆層包覆在 框架主體外表面以使該框架主體與外界電絕緣。該多個 鍍銅夾點安設在框架主體上並位於該絕緣包覆層外側以 與框架主體電絕緣，該多個鍍銅夾點用於將待電鍍之電 路板夾持固定车框架主體上。該導電線之一端與掛鈎上 之導電節點電連接，另一端與該多個鍍銅夾點電連接。 該導電線與該框架主體均被包覆在該絕緣包覆層内，該 導電線與該框架主體電絕緣。該絕緣包覆層開設有與該 多個鍍銅夾點--相對之多個開孔，該導電線穿過該多 個開孔以分別與該多個鍍銅夾點電連接。 表單編號A0101 第5頁/共22頁 M381635 [0008] 優選地，該電路板電鍍掛架具有兩個掛鈎，該框架主體 包括兩根豎邊框與兩根橫邊框，該兩根豎邊框相互平行 ，該兩根豎邊框分別與上述兩個掛鈎相連接固定，該兩 根橫邊框相互平行，該兩根橫邊框分別垂直固定在兩根 豎邊框之兩端，該兩個掛鈎上分別設置有一個導電節點 ，該多個鍍銅夾點對稱安設在該兩根豎邊框上，該兩個 導電節點上分別連接有一根導電線’該兩根導電線分別 連接至其對應一側之豎邊框上之多個鍍銅夾點。 [0009] 優選地，該鍍銅夾點包括第一夾緊部與第二夾緊部，該 第一夾緊部固定在豎邊框上，該第二夾緊部具有一個導 電凸起，該第一夾緊部與第二夹緊部通過磁力相互吸附 以將待電鍍之電路板夾緊固定。 [0010] 優選地，該第一夾緊部上開設有一階梯形通孔，該階梯 形通孔包括大孔與小孔，其中·小孔位於靠近豎邊框之一 側，大孔位於遠離豎邊框之一側，該導電凸起與第一夾 緊部之大孔相配合。 [0011] 優選地，該開孔、小孔之直徑與導電線之大小相等，該 導電線穿過該開孔與小孔與該導電凸起電連接。 [0012] 優選地，該大孔具有底壁，該底壁上形成有一層導電層 ，該導電層與自第一夾緊部之小孔穿出之導電線電連接 ，該導'電凸起與該導電層電連接。 [0013] 優選地，該電路板電鍍掛架進一步包括多個遮電板，該 多個遮電板與該多個鍍銅夾點相對。 [0014] 優選地，該多個鍍銅夾點中之每一個鍍銅夾點對應設置 表單編號A0101 第6頁/共22頁 有兩個遮電板，該兩個遮電板分別位於該對應之鍍銅夾 點相對之兩側。 [0015]優選地，該遮電板上開設有多個通孔。 [㈤16]優選地，該多個通孔之大,卜相等，且等間距設置在遮電 板上。 [_優選地，該多個通孔之大小在遠_鋼夾點之方向上逐 漸變大，且該多個通孔中相鄰通孔之間之間距在遠離鍍 銅失點之方向上逐漸變小。 [0018] 本新型之電路板電鍍掛架利用絕緣包覆層將導電線與框 架主體包覆在絕緣包覆層内，並通過在絕緣包覆層上開 設與該多個鍍銅夾點一一相對之開孔使得導電線可穿過 該開孔與該多個鍍銅夾點實現電連接，從而使得該導電 線不會因長期浸在鍍銅槽液中而受到侵蝕，由此有效防 止導電線破裂漏電，提高導電線之使用壽命，節約更換 導電線之成本與時間；並且，還可提高電路板電鑛銅之 均勻性，提升電路板鍍銅品質。 【實施方式】 [0019] 以下結合附圖及實施例對本技術方案提供之電路板電鍵 掛架進行詳細說明。 [0020] 請參閱圖卜2，本技術方案第一實施例提供之電路板電鍍 掛架100包括掛鈎10 '框架主體2〇、絕緣包覆層30、多 個鍍銅夾點40、以及導電線50。該電路板電鍍掛架100用 於支撐固定待電鍍之電路板1〇2，將電路板102放置在電 鍍槽中並為該電路板102提供電流以進行電鍍。 表單编號A0101 第7頁/共22頁 M381635 [0021] 掛鈎10與框架主體20為導電體。掛鈎10上設置有導電節 點12。本實施例中，該掛鈎10之數量為兩個。該兩個掛 鈎10上分別設置有一個導電節點12。掛鈎10用於將電鍍 掛架100安裝於電鍍線行車（圖未示）上，以使該電鍍掛 架100可隨電鍍線行車一起相對電鍍槽體（圖未示）移動 進行電路板102之電鍍。 [0022] 框架主體20連接在掛鈎10上，框架主體20用於支撐待電 鍍之電路板102。本實施例中，該框架主體20包括兩根豎 邊框22與兩根橫邊框24。其中，該兩根豎邊框22相互平 行，該兩根豎邊框22分別與上述兩個掛鈎10相連接固定 。該兩根橫邊框24相互平行，兩根橫邊框24分別垂直固 定在兩根豎邊框22之兩端，從而圍合形成一個近似之矩 形框。 [0023] 掛鈎10、豎邊框22與橫邊框24之間可以通過焊接之方式 相互固定。在本實施例中，該兩個掛鈎10、兩根豎邊框 22與兩根橫邊框24為一體成型之。 [0024] 在一適於實用之優選方案中，該掛鈎10與框架主體20均 選用銅材料製作形成。這樣，掛鈎10可將電流引入到導 電節點12中；且，該框架主體20具有堅固、輕便、不易 變形等特性，使得框架主體20可在電鍍過程中更好地支 撐電路板102，使得電路板102不易折傷或因碰撞而掉落 電鍍槽體（圖未示）中。當然，該掛鈎10與框架主體20 還可選用紹、鐵、銅合金、銘合金、鐵合金等金屬材料 表單編號A0101 第8頁/共22頁 M381635 [0025] 該絕緣包覆層30包覆在框架主體20之外表面，以使該框 架主體20與外界電絕緣。具體地，該絕緣包覆層30包覆 住上述兩根豎邊框22與兩根橫邊框24。從而，當框架主 體20浸在電鍍槽體之電鍍槽液中時，由於框架主體20有 絕緣包覆層30包覆，其與電鍍槽體之陽極袋（圖未示） 之間並無電流產生，其中，該陽極袋為裝有銅球之鈦籃 。該絕緣包覆層30可選用橡膠、塑膠或者蠟等耐腐蝕之 絕緣材料製作形成。優選地，該絕緣包覆層30可為聚丙 烯（Polypropylene，簡稱PP)或聚氯乙稀（ Polyvinyl Chloride，簡稱PVC)。 [0026] 該多個鍍銅夾點40安設在框架主體20上並位於該絕緣包 覆層30外側以與框架主體20電絕緣。該多個鍍銅夾點40 用於將待電鍍之電路板102夾持固定在框架主體20上。多 個鍍銅夾點40對稱之設置在兩根豎邊框22上。一般地， 使用四個（每根豎邊框22上對稱設置兩個）鍍銅夾點40 或六個（每根豎邊框22上對稱設置三個）鍍銅夾點40即 可將一個電路板102夾持固定以進行電鍍銅。當然，為可 夾持固定多個電路板102，可以在豎邊框22上對稱設置夾 持該多個電路板102所對應需要之多個鍍銅夾點40。 [0027] 本實施例中，該鍍銅夾點40包括第一夾緊部41與第二夹 緊部42。第一夾緊部41固定在豎邊框22上，第一夾緊部 41上開設有一階梯形通孔412。該階梯形通孔412包括大 孔412a與小孔412b，其中小孔412b位於靠近豎邊框22之 一側，大孔412a位於遠離豎邊框22之一側。第二夾緊部 42具有一個導電凸起422，該導電凸起422與第一夾緊部 表單編號A0101 第9頁/共22頁 M381635 41之大孔412a相配合。該導電凸起422為導電體，優選 地導電凸起422之材質為銅。第一夾緊部41與第二夾緊部 42由極性相反之磁鐵製作而成，從而第一夾緊部41與第 二夾緊部42可通過磁力相互吸附以將待電鍍之電路板102 夾緊固定。 [0028] 該導電線50之一端與掛鈎10上之導電節點12電連接，另 一端與上述多個鍍銅夾點40電連接。具體地，.設置在兩 個掛鈎1 0上之兩個導電節點12上分別連接有一根導電線 50，該兩根導電線50分別連接至其對應一側之豎邊框22 上之多個鍍銅夾點40，以可將電流引入到該多個鍍銅夾 點40。 [0029] 該導電線50與該框架主體20均被包覆在絕緣包覆層30内 。該導電線50與該框架主體20電絕緣。導電線50—般之 外層為電絕緣層，從而導電線50可與框架主體20電絕緣 。當然，若該導電線50僅具有裸露之線芯，亦可通過在 框架主體20表面包裹一層膠層（圖未示）以可達到與導 電線50電絕緣之目的，然後再將該具有膠層之框架主體 20與導電線50使用絕緣包覆層30包覆住。 [0030] 該絕緣包覆層3 0開設有多個與上述多個鍍銅夾點4 0—— 相對之多個開孔32。該開孔32與上述第一夾緊部41之小 孔412b相對，從而導電線50穿過該開孔32與第一夾緊部 41之小孔412b以可與該鍍銅夾點40之導電凸起422電連 接，進而將電流引導至電路板上。該開孔32、小孔412b 之直徑大小與該導電線50之大小相等，以可使該開孔32 、小孔412b僅能允許該導電線50穿過，從而鍍銅槽液不 表單編號A0101 第10頁/共22頁 能通過该開孔32與小孔412b滲入到絕緣包覆層3〇内。所 以4導電線50可有效避免鐘銅槽液之侵钱，防止導電 線50外層之電絕緣層破裂漏電，提高導電線50之使用壽 命與電路板電鍍掛架100之鍍銅品質。 [0031] 此外，為使導電線50與第二夾緊部42之導電凸起422具有 良好之電連接’導電線50之端部可從小孔412b延伸至大 孔412a内，如圖2中所示。 [0032] β參閱圖3，本技術方案第二實施例提供之電路板電鑛樹 架200與第一實施例提供之電路板電鍍掛架100大致相同 ，其不同之處在於，鍍銅夾點24〇之第一夾緊部241之大 孔241a具有底壁，該底壁上形成有一層 導電層2412，該 導電層241 2與自第—夾緊部241之小孔241b穿出之導電 線250電連接，大孔241a之側壁形成有彈性凸起2414。 第一夾緊部242之導電凸起.2 422之側面具有一凹部2424 ，遠凹部2424與上述彈性凸起2414相配合，從而可將導 電凸起2422卡合固定至大孔24ia中並夾緊電路板1〇2， 且該導電凸起2422與導電層2412相電連接。從而，可有 效避免鍍銅槽液侵姓，防止導電線250外層之電絕緣層破 裂漏電。 [0033] 請參閱圖4，本技術方案第三實施例提供之電路板電鍍掛 架300與第一實施例提供之電路板電鍍掛架1〇〇大致相同 ，其不同乏處在於，電路板電鍍掛架3〇〇進一步包括多個 遮電板310，該多個遮電板31〇與該多個鍍銅夾點340相 對。本實施例中，每一個鍍鋼夾點34〇對應設置有一個遮 電板310 °當然’每一個鍍鋼夾點34〇亦可對應設置有兩 表單煸號A0101 第11頁/共22頁 M381635 個遮電板310，該兩個遮電板310分別位於該鍍銅夾點 3 4 0之前後相對兩側。 [0034] 具體地，該遮電板310上開設有多個通孔312。該通孔 312之形狀並不限.定，例如可為圓形、橢圓形、正方形、 矩形、三角形、多邊形等等。遮電板310可選用聚丙烯（ Polypropylene，簡稱PP)、聚氯乙稀（Polyvinyl Chloride，簡稱PVC)或者其他耐腐蝕之塑膠等絕緣材 料製作形成。本實施例中，該多個通孔312之大小相等， 且等間距設置在遮電板310上。 [0035] 遮電板31 0之一端連接在框架主體320之豎邊框322上， 另一端位於框架主體320内侧。在電鍍過程中，遮電板' 310所在平面與框架主體320所在平面平行。該遮電板 310可有效分散電流，使得作用在電路板上之電流之分佈 較為均勻，從而提高電路板電鍍銅之均勻性。 [0036] 此外，該遮電板310之多個通孔312之大小可以不相等， 亦可以不等間距設置。例如，該多個通孔312之大小在遠 離鍍銅夾點340之方向上逐漸變大，且該多個通孔312中 相鄰通孔312之間之間距在遠離鍍銅夾點340之方向上逐 漸變小。 [0037] 本新型之電路板電鍍掛架利用絕緣包覆層將導電線與框 架主體包覆在絕緣包覆層内，並通過在絕緣包覆層上開 ’設與該多個鍍銅夾點——相對之開孔使得導電線可穿過 該開孔與該多個鍍銅夾點實現電連接，從而使得該導電 線不會因長期浸在鍍銅槽液中而受到侵蝕，由此有效防 表單編號A0101 第12頁/共22頁 M381635 止導電線破裂漏電，提高導電線之使用壽命，節約更換 導電線之成本與時間；並且，還可提高電路板電鑛銅之 均勻性’提升電路板鍍銅品質。 圆本技财案之電純電騎架不㈣前述雜及結構， 本領域普通技術人員可做其他相應之改變及變形。舉例 而言，掛鈎與框架主體可採用不同之材質，遮電板可整 體地連接在兩根豎邊框之間，遮電板之一端與一根豎邊 框連接，另一端則可在夾持電路板後在扣合到另一根豎 邊框，此外，該多個鍍銅夾點亦並不必須嚴格對稱設置 ，掛鈎之形狀亦不僅限定為圖中所示之形狀。所有這些 改變及變形均應屬於本申請權利要求所請求保護之範圍 〇 圆綜上所述，本新型確已符合新型專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本新型之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本新型之精神所作之等效修飾或變化 ’皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0040] 圖1係本技術方案第一實施例提供之電路板電鍍掛架之示 意圖。 [0041] 圖2係圖1所示電路板電鍍掛架沿II-II方向之部分剖面示 意圖》 [0042] 圖3係本技術方案第二實施例提供之電路板電鍍掛架之部 分示意圖》 表單編號A0101 第13頁/共22頁 M381635 [0043] 圖4係本技術方案第三實施例提供之電路板電鍍掛架之示 意圖。 【主要元件符號說明】 [0044] 電鍍掛架：100、200、300 [0045] 掛鈎：10 [0046] 導電節點：12 [0047] 電路板：102 [0048] 框架主體：20、320 [0049] 豎邊框·· 22、322 [0050] 橫邊框：24 [0051] 絕緣包覆層：30 [0052] 開孔：32 [0053] 鍍銅夾點：40、240、340 [0054] 第一夾緊部：41、241 [0055] 第二夾緊部：42、242 [0056] 階梯形通孔：412 [0057] 大孔：412a、241a [0058] 小孔：412b、241b [0059] 導電凸起：422、2422 [0060] 導電線：50、250 表單編號A0101 第14頁/共22頁 Μ38Γ635 [0061] 導電層：2412 [0062] 彈性凸起：2414 [0063] 凹部：2424 [0064] 遮電板：310 [0065] 通孔：312 表單編號A0101 第15頁/共22頁M381635 V. New Description: [New Technology Field] [0001] The present invention relates to a circuit board manufacturing apparatus, and more particularly to a plating rack for holding a circuit board for electroplating. [Prior Art] [0002] With the rapid development of the electronics industry, as a basic component of electronic products, the production technology of boards has become more and more important, and the production requirements of lines and holes have become more and more fine. The circuit board has a single panel, a double panel and a multi-layer board, and is fabricated by a series of processes such as cutting, drilling, etching, exposing, and developing a copper-clad substrate. For details, see "Dielectric characterization of printed circuit board substrates" by C. H. Steer et al., Pro-ceedings of the IEEE, Vol. 39, No. 2 (August 2002). [0003] In the process of manufacturing a circuit board, copper is generally used in the inner wall of the via hole on the circuit board to realize the connection between the layers of the circuit board, or a copper layer is required to be plated on the exposed conductive pad area of the circuit board. Mounted with electronic components. The copper plating process generally includes two processes of electroless copper plating and copper plating. Generally, a thin layer of copper is deposited in the insulating region by electroless copper plating, and then a thick copper layer is plated with the thin copper layer as a conductive substrate by electroplating copper. [0004] The copper plating process of a circuit board generally requires the use of a plating rack. Usually, the circuit board is first fixed on the plating rack, and then the plating rack is fixed on the electroplating line, the circuit board is immersed in the copper plating tank and opposite to the anode in the copper plating tank, and the copper plating tank is electrolyzed after being energized. The copper ion in the liquid is plated on the circuit board No. A0101, page 4/22, M381635. The plating rack acts as a conductive and fixed circuit board in the process of electroplating copper. However, in the current electroplating rack, the conductive wire electrically connecting the circuit board to the copper plating node of the electroplating rack is attached to the electroplating rack, and the conductive wire is subjected to corrosion by the copper plating bath for a long time, and the surface of the conductive wire is insulated. The glue is easily broken and leaks, which affects the uniformity of the copper plating on the board and may even cause the board to be scrapped. In view of the above, it is necessary to provide a circuit board plating rack which can effectively prevent the leakage of the conductive wire and improve the uniformity of the copper plating on the circuit board. [New Content] [0006] Hereinafter, an embodiment will be described as an example of a circuit board plating rack which can effectively prevent the leakage of the conductive wire and improve the uniformity of the copper plating on the circuit board. [0007] The circuit board plating rack includes a hook, a frame body, an insulating coating, a conductive wire, and a plurality of copper plated pins. The hook and the frame body are electrically conductive bodies, and the hooks are provided with conductive nodes. The frame body is attached to the hook and is used to support the circuit board to be plated. The insulating coating is coated on the outer surface of the frame body to electrically insulate the frame body from the outside. The plurality of copper plating clips are disposed on the frame body and are outside the insulating coating layer to be electrically insulated from the frame body, and the plurality of copper plating clips are used for clamping the circuit board to be plated on the fixed vehicle frame body. . One end of the conductive line is electrically connected to the conductive node on the hook, and the other end is electrically connected to the plurality of copper plated contacts. The conductive wire and the frame body are both covered in the insulating coating layer, and the conductive wire is electrically insulated from the frame body. The insulating coating is provided with a plurality of openings opposite to the plurality of copper plating pins, and the conductive wires pass through the plurality of openings to be electrically connected to the plurality of copper plating pins, respectively. Form No. A0101 Page 5 of 22 M381635 [0008] Preferably, the circuit board plating rack has two hooks, and the frame body comprises two vertical frames and two horizontal frames, the two vertical frames are parallel to each other. The two vertical frames are respectively connected and fixed to the two hooks, and the two horizontal frames are parallel to each other. The two horizontal frames are respectively vertically fixed at two ends of the two vertical frames, and the two hooks are respectively provided with a conductive a plurality of copper-plated clips are symmetrically disposed on the two vertical frames, and the two conductive nodes are respectively connected with a conductive line. The two conductive lines are respectively connected to the vertical border of the corresponding side. Multiple copper plated pins. [0009] Preferably, the copper plating pinch includes a first clamping portion and a second clamping portion, the first clamping portion is fixed on the vertical frame, and the second clamping portion has a conductive protrusion, the first A clamping portion and a second clamping portion are magnetically attracted to each other to clamp and fix the circuit board to be plated. [0010] Preferably, the first clamping portion defines a stepped through hole, the stepped through hole includes a large hole and a small hole, wherein the small hole is located near one side of the vertical frame, and the large hole is located away from the vertical frame On one side, the conductive protrusion cooperates with the large hole of the first clamping portion. [0011] Preferably, the diameter of the opening and the small hole is equal to the size of the conductive wire, and the conductive wire is electrically connected to the conductive protrusion through the opening and the small hole. [0012] Preferably, the large hole has a bottom wall, and the bottom wall is formed with a conductive layer electrically connected to the conductive wire passing through the small hole of the first clamping portion, the conductive protrusion Electrically connected to the conductive layer. [0013] Preferably, the circuit board plating rack further comprises a plurality of shielding plates, the plurality of shielding plates being opposite to the plurality of copper plating pins. [0014] Preferably, each of the plurality of copper-plated clips has a copper-plated pin corresponding setting form number A0101, page 6 of 22 has two shielding plates, and the two shielding plates are respectively located in the corresponding The copper plated pinch is opposite to the sides. [0015] Preferably, the shielding plate is provided with a plurality of through holes. [(5) 16] Preferably, the plurality of through holes are large, equal, and equally spaced on the power shielding plate. [_ Preferably, the size of the plurality of through holes gradually becomes larger in the direction of the far_steel pinch point, and the distance between adjacent through holes in the plurality of through holes gradually increases in a direction away from the copper plating loss point. Become smaller. [0018] The circuit board plating rack of the present invention uses an insulating coating layer to coat the conductive wire and the frame body in the insulating coating layer, and opens a plurality of copper plating clips on the insulating coating layer. The opposite opening enables the conductive wire to be electrically connected to the plurality of copper plating clips through the opening, so that the conductive wire is not eroded by long-term immersion in the copper plating bath, thereby effectively preventing the conductive The wire breaks and leaks, improves the service life of the conductive wire, and saves the cost and time of replacing the conductive wire; and, it can also improve the uniformity of the electric copper of the circuit board and improve the copper plating quality of the circuit board. [Embodiment] The circuit board electric key cradle provided by the technical solution will be described in detail below with reference to the accompanying drawings and embodiments. [0020] Please refer to FIG. 2, the circuit board plating rack 100 provided by the first embodiment of the present technical solution includes a hook 10' frame body 2〇, an insulating coating layer 30, a plurality of copper plating pins 40, and a conductive line. 50. The circuit board plating rack 100 is used to support the fixed circuit board 1 2 to be plated, the circuit board 102 is placed in the plating bath and the circuit board 102 is supplied with current for plating. Form No. A0101 Page 7 of 22 M381635 [0021] The hook 10 and the frame body 20 are electrically conductive. A conductive node 12 is disposed on the hook 10. In this embodiment, the number of the hooks 10 is two. The two hooks 10 are respectively provided with a conductive node 12. The hook 10 is used to mount the plating rack 100 on the electroplating line (not shown), so that the plating rack 100 can be plated with the electroplating line to move the board 102 with respect to the plating tank (not shown). . [0022] The frame main body 20 is attached to the hook 10 for supporting the circuit board 102 to be electroplated. In this embodiment, the frame body 20 includes two vertical frames 22 and two horizontal frames 24. The two vertical frames 22 are parallel to each other, and the two vertical frames 22 are respectively fixedly connected to the two hooks 10. The two horizontal frames 24 are parallel to each other, and the two horizontal frames 24 are vertically fixed at two ends of the two vertical frames 22 to form an approximate rectangular frame. [0023] The hook 10, the vertical frame 22 and the horizontal frame 24 may be fixed to each other by welding. In this embodiment, the two hooks 10, the two vertical frames 22 and the two horizontal frames 24 are integrally formed. [0024] In a preferred embodiment, the hook 10 and the frame body 20 are both formed of a copper material. In this way, the hook 10 can introduce current into the conductive node 12; and the frame body 20 has characteristics of being strong, lightweight, and not easily deformed, so that the frame body 20 can better support the circuit board 102 during the plating process, so that the circuit board 102 is not easily broken or dropped into the plating tank (not shown) due to collision. Of course, the hook 10 and the frame body 20 may also be made of metal materials such as slag, iron, copper alloy, alloy, iron alloy, etc. Form No. A0101 Page 8 of 22 M381635 [0025] The insulating coating 30 is wrapped around the frame The outer surface of the body 20 is such that the frame body 20 is electrically insulated from the outside. Specifically, the insulating coating 30 covers the two vertical frames 22 and the two horizontal frames 24. Therefore, when the frame body 20 is immersed in the plating bath of the plating tank, since the frame body 20 is covered with the insulating coating 30, there is no current generated between the anode bag (not shown) of the plating tank. Wherein, the anode bag is a titanium basket filled with copper balls. The insulating coating 30 can be formed by using a corrosion-resistant insulating material such as rubber, plastic or wax. Preferably, the insulating coating layer 30 may be Polypropylene (PP) or Polyvinyl Chloride (PVC). The plurality of copper plated clips 40 are disposed on the frame body 20 and outside the insulating cover layer 30 to be electrically insulated from the frame body 20. The plurality of copper plated pins 40 are used to clamp and fix the circuit board 102 to be plated on the frame body 20. A plurality of copper plating pins 40 are symmetrically disposed on the two vertical frames 22. Generally, a circuit board 102 can be used by using four (two symmetrically placed on each vertical frame 22) copper-plated pinch 40 or six (three symmetrically placed on each vertical frame 22) copper-plated pinch 40. Clamping and fixing for electroplating copper. Of course, in order to clamp and fix the plurality of circuit boards 102, a plurality of copper plating clips 40 corresponding to the plurality of circuit boards 102 may be symmetrically disposed on the vertical frame 22. [0027] In the embodiment, the copper plating pinch 40 includes a first clamping portion 41 and a second clamping portion 42. The first clamping portion 41 is fixed to the vertical frame 22, and a stepped through hole 412 is defined in the first clamping portion 41. The stepped through hole 412 includes a large hole 412a and a small hole 412b, wherein the small hole 412b is located on a side close to the vertical frame 22, and the large hole 412a is located on a side away from the vertical frame 22. The second clamping portion 42 has a conductive projection 422 that cooperates with the large hole 412a of the first clamping portion form number A0101, page 9 of 22 M381635. The conductive bump 422 is an electrical conductor, and preferably the conductive bump 422 is made of copper. The first clamping portion 41 and the second clamping portion 42 are made of magnets of opposite polarities, so that the first clamping portion 41 and the second clamping portion 42 can be mutually attracted by magnetic force to clamp the circuit board 102 to be plated. Tightly fixed. [0028] One end of the conductive wire 50 is electrically connected to the conductive node 12 on the hook 10, and the other end is electrically connected to the plurality of copper plating clips 40. Specifically, a conductive line 50 is respectively connected to the two conductive nodes 12 disposed on the two hooks 10, and the two conductive lines 50 are respectively connected to a plurality of copper plating on the vertical frame 22 of the corresponding side thereof. A pinch 40 is applied to introduce current into the plurality of copper plated pins 40. [0029] The conductive wire 50 and the frame body 20 are both wrapped in the insulating coating 30. The conductive wire 50 is electrically insulated from the frame body 20. The conductive layer 50 is generally an electrically insulating layer such that the conductive line 50 is electrically insulated from the frame body 20. Of course, if the conductive wire 50 has only a bare wire core, a layer of glue (not shown) may be wrapped on the surface of the frame body 20 to electrically insulate the conductive wire 50, and then the adhesive layer is The frame body 20 and the conductive wire 50 are covered with an insulating coating 30. [0030] The insulating coating layer 30 is provided with a plurality of openings 32 opposite to the plurality of copper plating pins 40. The opening 32 is opposite to the small hole 412b of the first clamping portion 41, so that the conductive wire 50 passes through the opening 32 and the small hole 412b of the first clamping portion 41 to be electrically conductive with the copper plating pin 40. The bumps 422 are electrically connected to direct current to the board. The diameter of the opening 32 and the small hole 412b is equal to the size of the conductive wire 50, so that the opening 32 and the small hole 412b can only allow the conductive wire 50 to pass through, so that the copper plating bath is not in the form number A0101. Page 10 of 22 can penetrate into the insulating coating 3 through the opening 32 and the small hole 412b. Therefore, the 4 conductive wires 50 can effectively avoid the money intrusion of the copper bath, prevent the electrical insulation layer of the outer layer of the conductive wire 50 from being broken, and improve the service life of the conductive wire 50 and the copper plating quality of the circuit board plating rack 100. [0031] In addition, in order to make the conductive line 50 and the conductive protrusion 422 of the second clamping portion 42 have a good electrical connection, the end of the conductive line 50 may extend from the small hole 412b into the large hole 412a, as shown in FIG. Shown. [0032] β refers to FIG. 3, and the circuit board electric mine tree rack 200 provided by the second embodiment of the present technical solution is substantially the same as the circuit board plating rack 100 provided by the first embodiment, and the difference is that the copper plating pinch point is The large hole 241a of the first clamping portion 241 has a bottom wall, and a conductive layer 2412 is formed on the bottom wall, and the conductive layer 2412 and the conductive wire passing through the small hole 241b of the first clamping portion 241 250 is electrically connected, and a sidewall of the large hole 241a is formed with an elastic protrusion 2414. The side of the conductive protrusion .2 422 of the first clamping portion 242 has a recess 2424. The distal recess 2424 cooperates with the elastic protrusion 2414, so that the conductive protrusion 2422 can be snap-fitted into the large hole 24ia and clamped. The circuit board 1〇2, and the conductive bumps 2422 are electrically connected to the conductive layer 2412. Therefore, the copper plating bath can be effectively prevented from invading the surname, and the electrical insulating layer on the outer layer of the conductive wire 250 is prevented from being broken and leaking. [0033] Referring to FIG. 4, the circuit board plating rack 300 provided by the third embodiment of the present invention is substantially the same as the circuit board plating rack 1 provided by the first embodiment, and the difference is that the circuit board is plated. The pylon 3 further includes a plurality of shielding plates 310 that are opposite to the plurality of copper plating nips 340. In this embodiment, each of the plated steel clamps 34〇 is provided with a shielding plate 310°. Of course, each steel plated pinch 34〇 can also be correspondingly provided with two form numbers A0101 page 11 / total 22 pages M381635 The two shielding plates 310 are respectively located on opposite sides of the copper-plated clips before and after the 340. [0034] Specifically, the shielding plate 310 is provided with a plurality of through holes 312. The shape of the through hole 312 is not limited, and may be, for example, a circle, an ellipse, a square, a rectangle, a triangle, a polygon, or the like. The power shielding plate 310 can be formed by using an insulating material such as polypropylene (PP), polyvinyl chloride (PVC) or other corrosion-resistant plastic. In this embodiment, the plurality of through holes 312 are equal in size and are equally spaced on the shielding plate 310. [0035] One end of the power shielding plate 31 0 is connected to the vertical frame 322 of the frame main body 320, and the other end is located inside the frame main body 320. During the electroplating process, the plane of the shading plate '310 is parallel to the plane of the frame body 320. The shielding plate 310 can effectively disperse the current, so that the current distribution on the circuit board is relatively uniform, thereby improving the uniformity of copper plating on the circuit board. [0036] In addition, the plurality of through holes 312 of the shielding plate 310 may be unequal in size, or may be disposed at unequal intervals. For example, the size of the plurality of through holes 312 gradually increases in a direction away from the copper plating pin 340, and the distance between the adjacent through holes 312 of the plurality of through holes 312 is away from the copper plating pin 340. It gradually becomes smaller. [0037] The circuit board plating rack of the present invention utilizes an insulating coating layer to coat the conductive wire and the frame body in the insulating coating layer, and opens and closes the plurality of copper plating pins on the insulating coating layer. - the opposite opening enables the conductive wire to be electrically connected to the plurality of copper plating clips through the opening, so that the conductive wire is not eroded by long-term immersion in the copper plating bath, thereby being effective Anti-form No. A0101 Page 12 of 22 M381635 The conductive wire is broken and leaks, which improves the service life of the conductive wire and saves the cost and time of replacing the conductive wire. Moreover, it can also improve the uniformity of the electric copper of the circuit board. Plate copper plating quality. The electric pure electric riding frame of the present invention is not (four) the aforementioned miscellaneous structure, and other corresponding changes and modifications can be made by those skilled in the art. For example, the hook and the frame body can be made of different materials, and the shielding plate can be integrally connected between the two vertical frames, one end of the shielding plate is connected with one vertical frame, and the other end can be clamped on the circuit board. After that, it is fastened to another vertical frame. In addition, the plurality of copper-plated clips do not have to be strictly symmetrically arranged, and the shape of the hook is not limited to the shape shown in the drawing. All such changes and modifications are intended to fall within the scope of the claimed invention. 圆 In summary, the present invention has met the requirements of the new patent and has filed a patent application in accordance with the law. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by those who are familiar with the art of the present invention in accordance with the spirit of the present invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0040] FIG. 1 is a schematic view of a circuit board plating rack provided by a first embodiment of the present technical solution. 2 is a partial cross-sectional view of the circuit board plating rack of FIG. 1 along the II-II direction. [0042] FIG. 3 is a partial schematic view of a circuit board plating rack provided by the second embodiment of the present technical solution. No. A0101 Page 13 of 22 M381635 [0043] FIG. 4 is a schematic diagram of a circuit board plating rack provided by a third embodiment of the present technical solution. [Main component symbol description] [0044] Plating rack: 100, 200, 300 [0045] Hook: 10 [0046] Conductive node: 12 [0047] Circuit board: 102 [0048] Frame body: 20, 320 [0049] Vertical border ··· 22,322 [0050] Horizontal border: 24 [0051] Insulation coating: 30 [0052] Opening: 32 [0053] Copper-plated pinch: 40, 240, 340 [0054] First clamping Portion: 41, 241 [0055] Second clamping portion: 42, 242 [0056] Stepped through hole: 412 [0057] Large hole: 412a, 241a [0058] Small hole: 412b, 241b [0059] Conductive bulge : 422, 2422 [0060] Conductive wire: 50, 250 Form number A0101 Page 14 / Total 22 pages Μ 38Γ 635 [0061] Conductive layer: 2412 [0062] Elastic protrusion: 2414 [0063] Recess: 2424 [0064] Board: 310 [0065] Through Hole: 312 Form No. A0101 Page 15 of 22