US10937724B2 - Package structure applied to driving apparatus of display - Google Patents

Package structure applied to driving apparatus of display Download PDF

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Publication number
US10937724B2
US10937724B2 US16/386,533 US201916386533A US10937724B2 US 10937724 B2 US10937724 B2 US 10937724B2 US 201916386533 A US201916386533 A US 201916386533A US 10937724 B2 US10937724 B2 US 10937724B2
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Prior art keywords
package
unit
driving
driving unit
package structure
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US20190348358A1 (en
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Ching-Yung Chen
Wen-Tsung Lin
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Raydium Semiconductor Corp
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Raydium Semiconductor Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Definitions

  • the invention relates to package; in particular, to a package structure applied to a driving apparatus of a display.
  • the longitudinal direction of the wafer (for example, the second direction DL) may be only perpendicular to the moving direction (for example, the first direction DD) of the sprocket hole SH due to the limitation of the production equipment.
  • the above limitations may result in the width of the existing COF package structure being limited by the maximum effective width obtained by subtracting the range of the sprocket hole SH from the bandwidth of the transmission belt. For example, if the standard bandwidth of the transmission belt is 35 mm/48 mm/70 mm, the maximum effective width after subtracting the range of the sprocket hole SH is 29 mm/42.5 mm/63 mm respectively.
  • the invention provides a package structure applied to a driving apparatus of a display to solve the above-mentioned problems of the prior arts.
  • a preferred embodiment of the invention is a package structure applied to a driving apparatus of a display.
  • the driving apparatus includes at least one driving unit.
  • the package structure includes a substrate, a first connecting unit, a second connecting unit and at least one package unit.
  • the substrate is configured to carry the at least one driving unit.
  • the first connecting unit is disposed at a side of the substrate, wherein a longitudinal direction of the first connecting unit is parallel to a first direction.
  • the second connecting unit is disposed at another side of the substrate, wherein a longitudinal direction of the second connecting unit is parallel to the first direction.
  • the at least one package unit is configured to package the at least one driving unit to form at least one driving unit package object, wherein a longitudinal direction of the at least one driving unit package object is parallel to a second direction.
  • the first direction and the second direction are perpendicular to each other.
  • the package structure is a chip on film (COF) structure.
  • COF chip on film
  • the first connecting unit and the second connecting unit are coupled to a printed circuit board and a display panel respectively.
  • the package structure is carried by a belt, and a moving direction of the belt is parallel to the first direction.
  • a width direction of the at least one driving unit package object is parallel to the first direction, so that a width and a pitch of the at least one driving unit package object in the first direction has nothing to do with a width of the belt in the second direction.
  • each driving unit package object is coupled to the first connecting unit and the second connecting unit through its input channels and output channels respectively.
  • a total number of input channels of the driving apparatus equals to a sum of input channel numbers of all driving units.
  • a total number of output channels of the driving apparatus equals to a sum of output channel numbers of all driving units.
  • the at least one driving unit is a plurality of driving units providing different functions respectively.
  • the at least one driving unit is a plurality of driving units spaced the same distance from each other.
  • the at least one driving unit is a plurality of driving units spaced different distances from each other.
  • the driving apparatus is a source driver.
  • the width and the pitch of the driving unit package object are independent of the width of the transmission belt. Therefore, the width of the COF package structure of the invention is not limited by the maximum effective width of the transmission belt, so that the number of chips that can be placed in the COF package structure and the chip pitch are not limited, thereby the yield and the maximum output channel number of outer pin bonding (OLB) can be increased, and the difference between the longest path and the shortest path is not too large, and the original process can be maintained without change to avoid increasing process complexity and cost.
  • OLB outer pin bonding
  • FIG. 1 illustrates a schematic diagram of the width of the conventional COF package structure being limited by the maximum effective width of the transmission belt.
  • FIG. 2 illustrates a schematic diagram of the conventional one COF package structure having a high number of output channels.
  • FIG. 3A illustrates a schematic diagram of the conventional two COF package structures having a lower number of output channels.
  • FIG. 3B illustrates a schematic diagram of the conventional three COF package structures having a lower number of output channels.
  • FIG. 4 illustrates a schematic diagram of the package structure applied to the driving apparatus of the display in an embodiment of the invention.
  • FIG. 5 illustrates a schematic diagram of the package structure applied to the driving apparatus of the display in another embodiment of the invention.
  • FIG. 6 illustrates a schematic diagram of the first driving unit package object and the second driving unit package object being coupled to the first connecting unit and the second connecting unit through the input channel and the output channel respectively.
  • FIG. 7 illustrates a schematic diagram that the number of driving units can be placed in the package structure of the invention and the driving unit pitch are not limited by the maximum effective width of the transmission belt and each driving unit can have different functions.
  • a preferred embodiment of the invention is a package structure.
  • the package structure is used to package a driving apparatus of a display, such as to package a source driver of a display, but not limited to this.
  • the longitudinal direction of the input connecting unit and the output connecting unit will be perpendicular to the width direction of the transmission belt instead of being parallel to the width direction of the transmission belt in the prior art, so that the longitudinal direction of the input connecting unit and the output connecting unit is changed to be perpendicular to the longitudinal direction of the driving unit package object. Therefore, the width and pitch of the driving unit package object of the invention are only related to the length of the transmission belt and independent of the width of the transmission belt, and thus not limited by the maximum effective width of the transmission belt in the prior art.
  • FIG. 4 illustrates a schematic diagram of the package structure applied to the driving apparatus of the display in this embodiment.
  • the package structure 4 of this embodiment is a COF package structure and it only includes a driving unit package object P of a single driving unit A.
  • the driving unit A can be a single driving chip having a high output channel number (for example, 1440 output channels), but not limited to this.
  • the package structure 4 includes a substrate SUB, a first connecting unit OL 1 , a second connecting unit OL 2 and a package unit 41 .
  • the substrate SUB is used to carry the driving unit A.
  • the first connecting unit OL 1 is disposed at one side of the substrate SUB and the second connecting unit OL 2 is disposed at another side of the substrate SUB; that is to say, the first connecting unit OL 1 and the second connecting unit OL 2 are opposed to each other.
  • the package unit 41 is used to package the driving unit A to form the driving unit package object P.
  • the longitudinal direction of the first connecting unit OL 1 and the longitudinal direction of the second connecting unit OL 2 are both parallel to the first direction DD.
  • the longitudinal direction of the driving unit package object P is parallel to the second direction DL, and the second direction DL and the first direction DD are perpendicular to each other. That is to say, the longitudinal direction of the driving unit package object P is perpendicular to the longitudinal direction of the first connecting unit OL 1 and the second connecting unit OL 2 .
  • the moving direction of the sprocket hole SH on the transmission belt BT (that is, the transmission direction of the transmission belt BT) is parallel to the first direction DD, and the width direction of the transmission belt BT is parallel to the second direction DL.
  • the longitudinal direction (e.g., the first direction DD) of the first connecting unit OL 1 and the second connecting unit OL 2 is perpendicular to the width direction (e.g., the second direction DL) of the transmission belt and the longitudinal direction (e.g., the second direction DL) of the driving unit package object P, so that the width and pitch of the driving unit package object P are only related to the length of the transmission belt and independent of the width of the transmission belt, so it is not limited to the maximum effective width of the transmission belt. Therefore, the number and pitch of the driving unit package objects that can be placed in the package structure 4 of this embodiment are not particularly limited as long as the length of the transmission belt is long enough.
  • first connecting unit OL 1 and the second connecting unit OL 2 can be an input connecting unit and an output connecting unit respectively, which are coupled to the printed circuit board and the display panel respectively, but not limited to this.
  • FIG. 5 illustrates a schematic diagram of the package structure 5 applied to the driving apparatus of the display according to another embodiment of the invention.
  • the package structure 5 in this embodiment is a chip-on-film (COF) package structure and includes a first driving unit package object P 1 of the first driving unit A 1 and a second driving unit package object P 2 of the second driving unit A 2 .
  • the first driving unit A 1 and the second driving unit A 2 can be two driving chips having a lower number of output channels (for example, 720 output channels) respectively, but not limited to this.
  • the first driving unit A 1 and the second driving unit A 2 can be driving chips having different functions, but not limited to this.
  • the package structure 5 of this embodiment includes a substrate SUB, a first connecting unit OL 1 , a second connecting unit OL 2 , a first package unit 51 and a second package unit 52 .
  • the substrate SUB is configured to carry the first driving unit A 1 and the second driving unit A 2 separated from each other.
  • the first connecting unit OL 1 is disposed at one side of the substrate SUB and the second connecting unit OL 2 is disposed at another side of the substrate SUB; that is to say, the first connecting unit OL 1 and the second connecting unit OL 2 are opposed to each other.
  • the first package unit 51 is configured to package the first driving unit A 1 to form the first driving unit package object P 1 .
  • the second package unit 52 is configured to package the second driving unit A 2 to form the second driving unit package object P 2 .
  • the longitudinal direction of the first connecting unit OL 1 and the longitudinal direction of the second connecting unit OL 2 are both parallel to the first direction DD.
  • the longitudinal direction of the first driving unit package object P 1 and the longitudinal direction of the second driving unit package object P 2 are both parallel to the second direction DL, and the second direction DL and the first direction DD are perpendicular to each other. That is to say, the longitudinal direction of the first driving unit package object P 1 and the second driving unit package object P 2 is perpendicular to the longitudinal direction of the first connecting unit OL 1 and the second connecting unit OL 2 .
  • the moving direction of the sprocket hole SH on the transmission belt (that is, the longitudinal direction of the transmission belt) is parallel to the first direction DD, and the width direction of the transmission belt is parallel to the second direction DL.
  • the longitudinal direction (e.g., the first direction DD) of the first connecting unit OL 1 and the second connecting unit OL 2 is perpendicular to the width direction of the transmission belt (e.g., the second direction DL) and the longitudinal direction of the first driving unit package object P 1 and the second driving unit package object P 2 (e.g., the second direction DL), so that the width and the pitch of the first driving unit package object P 1 and the second driving unit package object P 2 are only related to the length of the transmission belt and independent of the width of the transmission belt, so it is not limited by the maximum effective width of the transmission belt. Therefore, as long as the length of the transmission belt is long enough, the number and pitch of the driving unit package objects can be placed in the package structure 5 of this embodiment are not particularly limited.
  • the first driving unit A 1 in the first driving unit package object P 1 and the second driving unit A 2 in the second driving unit package object P 2 can be coupled to the first connecting unit OL 1 and the second connecting unit OL 2 through the input channels CHIN and the output channels CHOUT respectively.
  • the first connecting unit OL 1 and the second connecting unit OL 2 can be an input connecting unit and an output connecting unit respectively, which are coupled to the printed circuit board and the display panel respectively, but not limited to this.
  • the total input channel number of the driving apparatus will be equal to the sum of the respective input channel numbers of all driving units and the total output channel number of the driving apparatus will be equal to the sum of the respective output channel numbers of all driving units. For example, if the number of input channels of the first driving unit A 1 and the number of input channels of the second driving unit A 2 in FIG. 6 are both 600, the total input channel number of the driving apparatus will be equal to 1200; if the number of output channels of the first driving unit A 1 and the number of input channels of the second driving unit A 2 are both 720, the total number of output channels of the driving device is equal to 1,440, but not limited to this.
  • FIG. 7 illustrates a schematic diagram that the number of driving units can be placed in the package structure 7 of the invention and the driving unit pitch are not limited by the maximum effective width of the transmission belt, and each driving unit can have different functions.
  • the package structure 7 of this embodiment includes a substrate SUB, a first connecting unit OL 1 , a second connecting unit OL 2 , a first package unit 71 , a second package unit 72 , a third package unit 73 and a fourth package unit 74 , a fifth package unit 75 and a sixth package unit 76 .
  • the substrate SUB is used to carry a plurality of driving units A 1 , B 1 ⁇ B 4 and C 1 separated from each other.
  • the plurality of driving units A 1 , B 1 ⁇ B 4 and C 1 can provide different functions respectively; for example, the driving unit A 1 can be used to provide the first function, the driving units B 1 ⁇ B 4 can be used to provide the second function and the driving unit C 1 can be used to provide a third function, but not limited to this.
  • the plurality of driving units A 1 , B 1 ⁇ B 4 , and C 1 can be spaced apart from each other by the same distance or by different distances, and the plurality of driving units A 1 , B 1 ⁇ B 4 and C 1 can have the same size or different sizes depending on actual needs without specific restrictions.
  • the first connecting unit OL 1 is disposed at one side of the substrate SUB and the second connecting unit OL 2 is disposed at another side of the substrate SUB; that is to say, the first connecting unit OL 1 and the second connecting unit OL 2 are opposed to each other.
  • the first package unit 71 is used to package the driving unit B 1 to form the first driving unit package object P 1 .
  • the second package unit 72 is configured to package the driving unit B 2 to form the second driving unit package object P 2 .
  • the third package unit 73 is configured to package the driving unit B 3 to form the third driving unit package object P 3 .
  • the fourth package unit 74 is used to package the driving unit B 4 to form the fourth driving unit package object P 4 .
  • the fifth package unit 75 is used to package the driving unit C 1 to form a fifth driving unit package object P 5 .
  • the sixth package unit 76 is used to package the driving unit A 1 to form a sixth driving unit package object P 6 .
  • the longitudinal direction of the first connecting unit OL 1 and the longitudinal direction of the second connecting unit OL 2 are both parallel to the first direction DD.
  • the longitudinal directions of the first driving unit package object P 1 ⁇ the sixth driving unit package object P 6 are all parallel to the second direction DL, and the second direction DL and the first direction DD are perpendicular to each other. That is to say, the longitudinal directions of the first driving unit package object P 1 ⁇ the sixth driving unit package object P 6 are perpendicular to the longitudinal direction of the first connecting unit OL 1 and the longitudinal direction of the second connecting unit OL 2 .
  • the moving direction of the sprocket hole SH on the transmission belt (that is, the longitudinal direction of the transmission belt) is parallel to the first direction DD, and the width direction of the transmission belt is parallel to the second direction DL.
  • the longitudinal direction (e.g., the first direction DD) of the first connecting unit OL 1 and the second connecting unit OL 2 in the invention is perpendicular to the width direction of the transmission belt (e.g., the second direction DL) and the longitudinal direction (e.g., the second direction DL) of the first driving unit package object P 1 ⁇ the sixth driving unit package object P 6 , so that the width and the pitch of the first driving unit package object P 1 ⁇ the sixth driving unit package object P 6 are only related to the length of the transmission belt and independent from the width of the transmission belt, so it is not limited by the maximum effective width of the transmission belt. Therefore, as long as the length of the transmission belt is long enough, the number of the driving unit package objects can be placed in the package structure 7 of this embodiment and the pitch driving unit package object are not particularly limited.
  • the width and the pitch of the driving unit package object are independent of the width of the transmission belt. Therefore, the width of the COF package structure of the invention is not limited by the maximum effective width of the transmission belt, so that the number of chips that can be placed in the COF package structure and the chip pitch are not limited, thereby the yield and the maximum output channel number of outer pin bonding (OLB) can be increased, and the difference between the longest path and the shortest path is not too large, and the original process can be maintained without change to avoid increasing process complexity and cost.
  • OLB outer pin bonding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
US16/386,533 2018-05-11 2019-04-17 Package structure applied to driving apparatus of display Active 2039-05-27 US10937724B2 (en)

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US16/386,533 US10937724B2 (en) 2018-05-11 2019-04-17 Package structure applied to driving apparatus of display

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CN111968525A (zh) * 2020-09-23 2020-11-20 京东方科技集团股份有限公司 一种覆晶薄膜、显示基板及显示装置

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US20070063951A1 (en) * 2005-09-20 2007-03-22 Wen-Tsung Lin Repairing a display signal line
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CN110473852B (zh) 2022-05-13
US20190348358A1 (en) 2019-11-14
TW201947558A (zh) 2019-12-16
CN110473852A (zh) 2019-11-19

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