TWM573119U - 抗蝕劑層的薄膜化裝置 - Google Patents

抗蝕劑層的薄膜化裝置 Download PDF

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Publication number
TWM573119U
TWM573119U TW107206435U TW107206435U TWM573119U TW M573119 U TWM573119 U TW M573119U TW 107206435 U TW107206435 U TW 107206435U TW 107206435 U TW107206435 U TW 107206435U TW M573119 U TWM573119 U TW M573119U
Authority
TW
Taiwan
Prior art keywords
thin film
processing liquid
film processing
resist layer
tank
Prior art date
Application number
TW107206435U
Other languages
English (en)
Chinese (zh)
Inventor
豊田裕二
田邉昌大
Original Assignee
日商三菱製紙股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱製紙股份有限公司 filed Critical 日商三菱製紙股份有限公司
Publication of TWM573119U publication Critical patent/TWM573119U/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW107206435U 2017-05-26 2018-05-17 抗蝕劑層的薄膜化裝置 TWM573119U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-104999 2017-05-26
JP2017104999A JP2018200392A (ja) 2017-05-26 2017-05-26 レジスト層の薄膜化装置

Publications (1)

Publication Number Publication Date
TWM573119U true TWM573119U (zh) 2019-01-11

Family

ID=64430936

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107206435U TWM573119U (zh) 2017-05-26 2018-05-17 抗蝕劑層的薄膜化裝置

Country Status (4)

Country Link
JP (1) JP2018200392A (ko)
KR (1) KR200494122Y1 (ko)
CN (1) CN208188581U (ko)
TW (1) TWM573119U (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102666399B1 (ko) 2021-12-31 2024-05-17 세메스 주식회사 액체 트랩 탱크 및 액체 트랩 탱크용 액체 공급 유닛

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176783A (ja) 1997-12-15 1999-07-02 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000091293A (ja) 1998-09-16 2000-03-31 Dainippon Screen Mfg Co Ltd 基板処理装置
EP2247170B1 (en) 2008-01-30 2014-10-22 Mitsubishi Paper Mills Limited Method for electroconductive pattern formation
JP5444050B2 (ja) 2010-03-12 2014-03-19 三菱製紙株式会社 ソルダーレジストパターンの形成方法
JP5498886B2 (ja) 2010-07-26 2014-05-21 三菱製紙株式会社 ドライフィルムレジストの薄膜化処理方法
KR101891949B1 (ko) 2010-09-28 2018-08-27 미쓰비시 세이시 가부시키가이샤 솔더 레지스트 패턴의 형성 방법
JP3182371U (ja) 2012-02-10 2013-03-21 三菱製紙株式会社 レジスト層の薄膜化処理装置
JP6203489B2 (ja) * 2012-11-29 2017-09-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及びその洗浄方法
KR101577682B1 (ko) * 2015-05-28 2015-12-15 한국지질자원연구원 지하수나 하천수 또는 해수의 시료 검사용 여과장치

Also Published As

Publication number Publication date
JP2018200392A (ja) 2018-12-20
KR200494122Y1 (ko) 2021-08-05
KR20180003402U (ko) 2018-12-05
CN208188581U (zh) 2018-12-04

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees