JP2015206862A - 感光性ポリイミドパターンの形成方法 - Google Patents
感光性ポリイミドパターンの形成方法 Download PDFInfo
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- photosensitive polyimide
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 144
- 239000004642 Polyimide Substances 0.000 title claims abstract description 137
- 238000000034 method Methods 0.000 title claims abstract description 84
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000007864 aqueous solution Substances 0.000 claims abstract description 26
- 239000009719 polyimide resin Substances 0.000 claims abstract description 7
- 239000003513 alkali Substances 0.000 claims description 7
- 239000000243 solution Substances 0.000 abstract description 18
- 239000000693 micelle Substances 0.000 description 20
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 15
- 239000007788 liquid Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 7
- 239000007921 spray Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910000288 alkali metal carbonate Inorganic materials 0.000 description 3
- 150000008041 alkali metal carbonates Chemical class 0.000 description 3
- 229910000318 alkali metal phosphate Inorganic materials 0.000 description 3
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 150000003384 small molecules Chemical class 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 2
- 229960001231 choline Drugs 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000008235 industrial water Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- -1 krypton ion Chemical class 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- RJFMDYQCCOOZHJ-UHFFFAOYSA-L 2-hydroxyethyl(trimethyl)azanium dihydroxide Chemical compound [OH-].[OH-].C[N+](C)(C)CCO.C[N+](C)(C)CCO RJFMDYQCCOOZHJ-UHFFFAOYSA-L 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 229910052936 alkali metal sulfate Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- ZRIUUUJAJJNDSS-UHFFFAOYSA-N ammonium phosphates Chemical class [NH4+].[NH4+].[NH4+].[O-]P([O-])([O-])=O ZRIUUUJAJJNDSS-UHFFFAOYSA-N 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010094 polymer processing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
【解決手段】基板の表面に感光性ポリイミド樹脂層を形成する工程、感光性ポリイミド層にパターン露光する工程、アルカリ水溶液によってアルカリ水溶液可溶部の感光性ポリイミド層を薄膜化する工程をこの順に含むことを特徴とする感光性ポリイミドの形成方法であり、薄膜化する肯定の後に感光性ポリイミド層を硬化する工程を含んでも良く、さらに、アルカリ水溶液の濃度が5〜25質量%であることが好ましい。
【選択図】図1
Description
(2)基板の表面に感光性ポリイミド樹脂層を形成する工程、感光性ポリイミド層にパターン露光する工程、アルカリ水溶液によってアルカリ水溶液可溶部の感光性ポリイミド層を薄膜化する工程をこの順に含むことを特徴とする感光性ポリイミドの形成方法。
(3)アルカリ水溶液の濃度が5〜25質量%である請求項1又は2記載の感光性ポリイミドパターンの形成方法。
硬化処理を行わないこと以外は本発明の感光性ポリイミドパターンの形成方法(1)と同様である。硬化処理を行っていない上に未露光部である感光性ポリイミド層2の開口部5底部は、さらに薄膜化処理を行うことが可能であるため、パターン露光と薄膜化処理を追加し、又はさらに繰り返すことで、図2a及びbに示すような多段形状の感光性ポリイミドパターンを形成することが可能である。
エポキシ樹脂ガラス布基材銅張積層板(面積170mm×255mm、銅箔厚み12μm、基材厚み0.1mm、三菱ガス化学(株)製、商品名:CCL−E170)を基板1として、感光性ポリイミドである東レ社製フォトニース(登録商標)PW−1270をスピンコーターで塗布した後、125℃で3分間加熱して溶媒を除去し、膜厚10μmの感光性ポリイミド層2を形成した。
露光量を250mJ/cm2で行い、薄膜化処理の代わりに2.38%TMAH水溶液を現像液としたシャワー現像を20秒間行う以外は実施例1と同様の方法により、開口部を形成した感光性ポリイミドパターンを得た。
薄膜化処理の代わりに2.38%TMAH水溶液を現像液としたシャワー現像を20秒間行う以外は実施例1〜16と同様の方法により、開口部を形成した感光性ポリイミドパターンを得た。
2 感光性ポリイミド層
3 活性光線
4 フォトマスク
5 開口部
Claims (3)
- 基板の表面に感光性ポリイミド樹脂層を形成する工程、感光性ポリイミド層にパターン露光する工程、アルカリ水溶液によってアルカリ水溶液可溶部の感光性ポリイミド層を薄膜化する工程、感光性ポリイミド層を硬化する工程をこの順に含むことを特徴とする感光性ポリイミドの形成方法。
- 基板の表面に感光性ポリイミド樹脂層を形成する工程、感光性ポリイミド層にパターン露光する工程、アルカリ水溶液によってアルカリ水溶液可溶部の感光性ポリイミド層を薄膜化する工程をこの順に含むことを特徴とする感光性ポリイミドの形成方法。
- アルカリ水溶液の濃度が5〜25質量%である請求項1又は2記載の感光性ポリイミドパターンの形成方法。
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JP2015206862A5 JP2015206862A5 (ja) | 2016-03-10 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11075183B2 (en) | 2018-07-05 | 2021-07-27 | Samsung Electronics Co., Ltd. | Semiconductor chip and semiconductor package including the same |
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JP2001042319A (ja) * | 1999-07-30 | 2001-02-16 | Optrex Corp | 光反射性基板の製造方法および反射型液晶表示素子 |
JP2002341169A (ja) * | 2001-03-15 | 2002-11-27 | Sumitomo Bakelite Co Ltd | プラスチック光導波路の製造方法 |
JP2003266486A (ja) * | 2002-03-18 | 2003-09-24 | Sumitomo Chem Co Ltd | 光学パネル成形用型並びにその製造及び使用 |
JP2010276775A (ja) * | 2009-05-27 | 2010-12-09 | Nitto Denko Corp | ネガ型感光性材料およびそれを用いた感光性基材、ならびにネガ型パターン形成方法 |
JP3182371U (ja) * | 2012-02-10 | 2013-03-21 | 三菱製紙株式会社 | レジスト層の薄膜化処理装置 |
-
2014
- 2014-04-18 JP JP2014086393A patent/JP2015206862A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001042319A (ja) * | 1999-07-30 | 2001-02-16 | Optrex Corp | 光反射性基板の製造方法および反射型液晶表示素子 |
JP2002341169A (ja) * | 2001-03-15 | 2002-11-27 | Sumitomo Bakelite Co Ltd | プラスチック光導波路の製造方法 |
JP2003266486A (ja) * | 2002-03-18 | 2003-09-24 | Sumitomo Chem Co Ltd | 光学パネル成形用型並びにその製造及び使用 |
JP2010276775A (ja) * | 2009-05-27 | 2010-12-09 | Nitto Denko Corp | ネガ型感光性材料およびそれを用いた感光性基材、ならびにネガ型パターン形成方法 |
JP3182371U (ja) * | 2012-02-10 | 2013-03-21 | 三菱製紙株式会社 | レジスト層の薄膜化処理装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11075183B2 (en) | 2018-07-05 | 2021-07-27 | Samsung Electronics Co., Ltd. | Semiconductor chip and semiconductor package including the same |
US11764180B2 (en) | 2018-07-05 | 2023-09-19 | Samsung Electronics Co., Ltd. | Semiconductor device including base pillar, connection pad, and insulation layer disposed on a substrate |
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Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20170418 |