WO2018101090A1 - Double-sided adhesive sheet and production method for semiconductor device - Google Patents

Double-sided adhesive sheet and production method for semiconductor device Download PDF

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Publication number
WO2018101090A1
WO2018101090A1 PCT/JP2017/041530 JP2017041530W WO2018101090A1 WO 2018101090 A1 WO2018101090 A1 WO 2018101090A1 JP 2017041530 W JP2017041530 W JP 2017041530W WO 2018101090 A1 WO2018101090 A1 WO 2018101090A1
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WO
WIPO (PCT)
Prior art keywords
sensitive adhesive
double
pressure
sheet
peeling
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PCT/JP2017/041530
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French (fr)
Japanese (ja)
Inventor
尚哉 佐伯
孝文 小笠原
美紗季 坂本
Original Assignee
リンテック株式会社
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Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP2018553784A priority Critical patent/JP7075893B2/en
Publication of WO2018101090A1 publication Critical patent/WO2018101090A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes

Definitions

  • the present invention relates to a double-sided pressure-sensitive adhesive sheet and a method for manufacturing a semiconductor device using the double-sided pressure-sensitive adhesive sheet.
  • solder bumps can be provided on the surface of the semiconductor package with excellent positional accuracy.
  • the double-sided pressure-sensitive adhesive sheet for fixing the part is required to have heat resistance as well as the adhesiveness that can favorably fix the part and the support.
  • the adhesive force to the adherend and the peeling when peeling the release sheet are performed.
  • the force may be set independently for both sides of the double-sided PSA sheet.
  • Patent Document 1 discloses a double-sided pressure-sensitive adhesive sheet that is adjusted so that the ratio of the adhesive strength on both sides is within a predetermined range from the viewpoint of peeling the double-sided pressure-sensitive adhesive sheet so that the adherend can be reused. It is disclosed.
  • Patent Document 2 discloses a double-sided pressure-sensitive adhesive sheet that is adjusted so that the ratio of the peeling force when peeling the release sheet on both sides is within a predetermined range from the viewpoint of improving the peelability of the release sheet. Yes.
  • a part constituting a semiconductor device a part having a member easily damaged such as a fine electrode or a terminal on its surface is manufactured.
  • the member may be damaged due to contact with the double-sided pressure-sensitive adhesive sheet. Therefore, development of the method of fixing the said part on a support body via a double-sided adhesive sheet, without making the said member contact a double-sided adhesive sheet is advanced.
  • a double-sided pressure-sensitive adhesive sheet a sheet having a lattice shape by having a plurality of holes aligned in the X-axis direction and the Y-axis direction in plan view is used.
  • a method of laminating components on a double-sided pressure-sensitive adhesive sheet so that the portion having the above structure fits in the hole is conceivable.
  • the double-sided pressure-sensitive adhesive sheet a plurality of tape-like double-sided pressure-sensitive adhesive sheets are used, and the double-sided pressure-sensitive adhesive sheets are pasted on the support in parallel with a distance from each other.
  • a method of laminating components on a double-sided pressure-sensitive adhesive sheet is conceivable so as to fit in an area where no sheet is attached.
  • the double-sided PSA sheet disclosed in Patent Documents 1 and 2 does not have heat resistance that can withstand heating when processing parts. For this reason, when heated, the component and the support cannot be properly fixed, pickup failure occurs when picking up the component from the double-sided PSA sheet, or when the used double-sided PSA sheet is peeled off from the support. In addition, there is a problem in that adhesive residue is generated on the support, thereby hindering reuse of the support.
  • the present invention has been made in view of such a situation, and a double-sided pressure-sensitive adhesive sheet that can be used without any problem in a method of manufacturing a semiconductor device including a process involving heating, and a semiconductor device excellent in productivity.
  • An object is to provide a manufacturing method.
  • the present invention includes a core material, a first pressure-sensitive adhesive layer laminated on one surface side of the core material, and a laminate on the other surface side of the core material.
  • the second pressure-sensitive adhesive layer, the first release sheet laminated on the surface opposite to the core material in the first pressure-sensitive adhesive layer, and the core material in the second pressure-sensitive adhesive layer A double-sided pressure-sensitive adhesive sheet comprising a second release sheet laminated on the opposite surface, wherein the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are each composed of a silicone-based pressure-sensitive adhesive,
  • the peeling force P2 when peeling the second release sheet from the second pressure-sensitive adhesive layer is 30 mN / 50 mm or more and 1000 mN / 50 mm or less, and the first release sheet is peeled from the double-sided pressure-sensitive adhesive sheet.
  • the exposed adhesive surface of the first adhesive layer is a stainless steel plate (
  • the adhesive strength A1 with respect to the peeling force P2 when the adhesive strength A1 is 180 ° peel-off adhesive strength to the stainless steel plate measured according to JIS Z0237: 2009 (A1 / P2) is 10 or more and 5000 or less
  • the adhesive surface of the first pressure-sensitive adhesive layer exposed by peeling the first release sheet from the double-sided pressure-sensitive adhesive sheet is a stainless steel plate (SUS304).
  • SUS304 stainless steel plate
  • the adhesive strength difference obtained by subtracting the adhesive strength B2 from the adhesive strength B1 is 1000 mN / 25 mm or more and 20000 mN, when the adhesive strength B2 is the 180 ° peeling adhesive strength with respect to the stainless steel plate.
  • a double-sided pressure-sensitive adhesive sheet characterized by being / 25 mm or less (Invention 1).
  • the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are each composed of a silicone-based pressure-sensitive adhesive, thereby having excellent heat resistance. Further, when using the double-sided pressure-sensitive adhesive sheet, first, the first release sheet is peeled from the first pressure-sensitive adhesive layer. At that time, the peel force P2 is within the above range, The peeling of the second release sheet from the second pressure-sensitive adhesive layer is suppressed. Subsequently, the second release sheet is peeled off from the second pressure-sensitive adhesive layer after the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer exposed by peeling of the first release sheet is pasted to the support.
  • the first peeling force P1 is preferably 50 mN / 50 mm or more and 2000 mN / 50 mm or less (Invention 3).
  • the adhesive force A1 is preferably 500 mN / 25 mm or more and 15000 mN / 25 mm or less (Invention 4).
  • the double-sided pressure-sensitive adhesive in which the adhesive surface of the second pressure-sensitive adhesive layer exposed by peeling the second release sheet from the double-sided pressure-sensitive adhesive sheet is attached to a stainless steel plate (SUS304)
  • SUS304 stainless steel plate
  • the 180 ° peeling adhesive strength A2 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is 100 mN / 25 mm or more and 15000 mN / 25 mm or less (Invention 5).
  • the adhesive force B2 is preferably 100 mN / 25 mm or more and 15000 mN / 25 mm or less (Invention 6).
  • the first release sheet is preferably peeled off before the second release sheet (Invention 9).
  • the present invention relates to the step of peeling the first release sheet from the double-sided pressure-sensitive adhesive sheet (Invention 1 to 9), the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer exposed by peeling the first release sheet.
  • the step of providing a region surrounded by or sandwiched by the double-sided pressure-sensitive adhesive sheet and not having the double-sided pressure-sensitive adhesive sheet, simultaneously with or after the sticking, on the support A step of peeling the second release sheet from the affixed double-sided pressure-sensitive adhesive sheet, and laminating a plurality of parts on the second pressure-sensitive adhesive layer so that each of the parts covers or spans the area
  • a method of manufacturing a semiconductor device comprising: a step of performing a process involving heating on the component; and a step of peeling the component from the second pressure-sensitive adhesive layer (Invention 10).
  • invention 10 it is preferable to further include a step of peeling the double-sided pressure-sensitive adhesive sheet from the support after the step of peeling the component from the second pressure-sensitive adhesive layer (Invention 11).
  • region is a lamination
  • region is provided by sticking the said tape-shaped double-sided adhesive sheet to the said support body at intervals mutually in parallel (invention). 13).
  • the double-sided pressure-sensitive adhesive sheet according to the present invention can be used without any problem in a method for manufacturing a semiconductor device including a process involving heating.
  • the method for manufacturing a semiconductor device according to the present invention is excellent in productivity.
  • FIG. 1 shows a cross-sectional view of a double-sided pressure-sensitive adhesive sheet 1 according to this embodiment.
  • the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment includes a core material 11, a first pressure-sensitive adhesive layer 12 laminated on one surface side of the core material 11, and a first material laminated on the other surface side of the core material 11.
  • the first pressure-sensitive adhesive layer 13, the first release sheet 14 laminated on the surface opposite to the core material 11 in the first pressure-sensitive adhesive layer 12, and the core material 11 in the second pressure-sensitive adhesive layer 13 are And a second release sheet 15 laminated on the opposite surface.
  • the surface in contact with the first release sheet 14 in the first pressure-sensitive adhesive layer 12 (surface to be adhered to the adherend) and the second release sheet 15 in the second pressure-sensitive adhesive layer 13 are contacted.
  • the surface to be bonded (the surface to be adhered to the adherend) is referred to as an adhesive surface
  • the surfaces in contact with the pressure-sensitive adhesive layer 13 are referred to as peeling surfaces.
  • the double-sided pressure-sensitive adhesive sheet 1 includes the first release sheet 14 and the second release sheet 15 as described above, so that the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 are bonded.
  • the surface is protected. Therefore, only one surface is protected by the release sheet, such as a double-sided pressure-sensitive adhesive sheet drawn out from a roll formed by winding a laminate of a double-sided pressure-sensitive adhesive sheet and a single release sheet on which both sides are peeled.
  • the release sheet such as a double-sided pressure-sensitive adhesive sheet drawn out from a roll formed by winding a laminate of a double-sided pressure-sensitive adhesive sheet and a single release sheet on which both sides are peeled.
  • the release sheet such as a double-sided pressure-sensitive adhesive sheet drawn out from a roll formed by winding a laminate of a double-sided pressure-sensitive adhesive sheet and a single release sheet on which both sides are peeled.
  • the release sheet such as a double-sided pressure-sensitive adhesive sheet drawn out from a roll
  • the peeling force P2 when peeling the second release sheet 15 from the second pressure-sensitive adhesive layer 13 is 30 mN / 50 mm or more, and 40 mN / 50 mm. Preferably, it is preferably 50 mN / 50 mm or more. Further, the peeling force P2 is 1000 mN / 50 mm or less, preferably 500 mN / 50 mm or less, and particularly preferably 300 mN / 50 mm or less.
  • the other release sheet is likely to peel off.
  • the light release sheet is very easily peeled when the heavy release sheet is peeled off.
  • the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment is used in a method for manufacturing a semiconductor device, first, the first release sheet is peeled from the double-sided pressure-sensitive adhesive sheet 1.
  • the peeling force P1 when peeling the first release sheet 14 is greater than the peeling force when peeling the second release sheet 15 for reasons described later. It tends to be larger than P2.
  • the release force P2 is in the above range. Is peeled off from the second pressure-sensitive adhesive layer 13.
  • the peel force P1 tends to be greater than the peel force P2, as described later, that the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 is 1000 mN / 25 mm or more. caused by.
  • the adhesive force B1 is greater than the adhesive force B2
  • such a magnitude relationship tends to be maintained even when the adhesive strength before heating is compared. That is, the above-described adhesive strength A1 is more likely to be maintained. It tends to be larger than the aforementioned adhesive strength A2.
  • the peeling force P1 when peeling the first release sheet 14 from the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer 12 that exhibits the pressure-sensitive adhesive force A1 is the second pressure-sensitive adhesive layer 13 that exhibits the pressure-sensitive adhesive force A2. It tends to be larger than the peeling force P2 when peeling the first release sheet 14 from the adhesive surface. Therefore, in the preferable aspect in the double-sided adhesive sheet 1 which concerns on this embodiment, the peeling force P1 is larger than the peeling force P2.
  • the peel force P1 when peeling the first release sheet 14 from the first pressure-sensitive adhesive layer 12 is preferably 50 mN / 50 mm or more, particularly 150 mN / 50 mm or more. It is preferable that it is 300 mN / 50 mm or more.
  • the peeling force P1 is preferably 2000 mN / 50 mm or less, particularly preferably 1000 mN / 50 mm or less, and more preferably 600 mN / 50 mm or less.
  • the peeling force P1 When the peeling force P1 is within the above range, the first release sheet 14 can be easily peeled from the first pressure-sensitive adhesive layer 12, and accordingly, the second release sheet 15 and the second release sheet 15 are peeled off at the time of peeling. The burden given to the adhesiveness with the pressure-sensitive adhesive layer 13 is reduced, and unintentional peeling of the second release sheet 15 from the second pressure-sensitive adhesive layer 13 can be effectively suppressed.
  • the detail of the measuring method of peeling force P1 is as showing to the test example mentioned later.
  • the double-sided pressure-sensitive adhesive layer in which the first pressure-sensitive adhesive layer 12 exposed by peeling the first release sheet 14 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304).
  • the adhesive strength A1 is defined as 180 ° peel adhesive strength (mN / 25 mm) to a stainless steel plate measured in accordance with JIS Z0237: 2009
  • the ratio of the adhesive strength A1 to the peel strength P2 is 10 or more, preferably 15 or more, and particularly preferably 20 or more. Further, the ratio is 5000 or less, preferably 1000 or less, and particularly preferably 500 or less.
  • the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer 12 is stuck to the support. Subsequently, the second release sheet 15 is released from the second pressure-sensitive adhesive layer 13. At this time, since the ratio (A1 / P2) of the adhesive force A1 to the peel force P2 is within the above range, the adhesive force A1 at the interface between the first adhesive layer 12 and the support is the second release sheet 15.
  • peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support when peeling the second release sheet 15 from the double-sided pressure-sensitive adhesive sheet 1 is suppressed.
  • peeling is particularly likely to occur when the double-sided pressure-sensitive adhesive sheet 1 is affixed to the surface of the support having unevenness, where the unevenness is present, but according to the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, Even if it is a case, peeling of the double-sided adhesive sheet 1 from a support body can be suppressed favorably.
  • the ratio (A1 / P2) of the adhesive force A1 to the peel force P2 is less than 10
  • the first adhesive layer 12 and the support are in close contact with the double-sided pressure-sensitive adhesive sheet 1 on the support.
  • the second release sheet 15 is peeled from the double-sided pressure-sensitive adhesive sheet 1
  • the adhesiveness becomes too small as compared with the adhesion between the second release sheet 15 and the second pressure-sensitive adhesive layer 13.
  • the ratio exceeds 5000, the adhesive force A1 becomes excessively large, and it becomes difficult to peel off the used double-sided pressure-sensitive adhesive sheet 1 from the support, and adhesive residue on the support is likely to occur.
  • the adhesive force A1 is measured in the unit mN / 25 mm
  • the peeling force P2 is measured in the unit mN / 50 mm.
  • the above-mentioned adhesive force A1 is preferably 500 mN / 25 mm or more, particularly preferably 1000 mN / 25 mm or more, and more preferably 5000 mN / 25 mm or more.
  • the adhesive force A1 is preferably 15000 mN / 25 mm or less, particularly preferably 14000 mN / 25 mm or less, and more preferably 13000 mN / 25 mm or less.
  • the ratio (A1 / P2) of the adhesive force A1 to the peel force P2 can be easily set to the above-described range, and the second adhesive sheet 1 stuck on the support is changed from the second adhesive sheet 1 to the second one.
  • peeling the release sheet 15 peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support can be effectively suppressed.
  • the detail of the measuring method of adhesive force A1 is as showing to the test example mentioned later.
  • the adhesive surface of the first pressure-sensitive adhesive layer 12 exposed by peeling the first release sheet 14 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304), 260 About the double-sided pressure-sensitive adhesive sheet 1 after being heated at 1 ° C. for 1 minute, the 180 ° peeling adhesive strength B1 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is 500 mN / 25 mm or more, and 1000 mN / 25 mm or more. It is preferable that it is 5000 mN / 25 mm or more.
  • the said adhesive force B1 is 15000 mN / 25 mm or less, it is preferable that it is 14000 mN / 25 mm or less, and it is especially preferable that it is 13000 mN / 25 mm or less.
  • the double-sided pressure-sensitive adhesive sheet 1 may be peeled off from the support after the component pickup is completed. At this time, the adhesive force B1 is in the above range. Thereby, the double-sided pressure-sensitive adhesive sheet 1 can be satisfactorily peeled from the support, and adhesive residue on the support can be suppressed. Therefore, it becomes easy to reuse the support.
  • the adhesive force B1 is in the above range, the difference in adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 can be easily adjusted to the range described later, and the components laminated on the double-sided adhesive sheet 1 When picking up, peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support can be effectively suppressed.
  • the adhesive force B1 exceeds 15000 mN / 25m
  • the adhesive residue to a support body will arise and it will become difficult to reuse a support body.
  • the adhesive force B1 is less than 500 mN / 25 mm
  • the double-sided pressure-sensitive adhesive sheet 1 is easily peeled off from the support when a process involving heating is performed on the component fixed on the double-sided pressure-sensitive adhesive sheet 1.
  • the semiconductor device cannot be properly manufactured.
  • the details of the measuring method of the adhesive strength B1 are as shown in the test examples described later.
  • the adhesive surface of the second pressure-sensitive adhesive layer 13 that is exposed by peeling the second release sheet 15 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304).
  • SUS304 stainless steel plate
  • the 180 ° peel adhesive strength (mN / 25 mm) to the stainless steel plate measured according to JIS Z0237: 2009 is the adhesive strength B2
  • the above adhesive The difference in adhesive force obtained by subtracting the adhesive force B2 from the force B1 is 1000 mN / 25 mm or more, preferably 1500 mN / 25 mm or more, and particularly preferably 2000 mN / 25 mm or more. Further, the difference is 20000 mN / 25 mm or less, preferably 15000 mN / 25 mm or less, and particularly preferably 13000 mN / 25 mm or less.
  • the part is subjected to a treatment with heating. Therefore, although the double-sided pressure-sensitive adhesive sheet 1 is also heated, the difference in the adhesive strength obtained by subtracting the adhesive strength B2 from the adhesive strength B1 is within the above range. Peeling of the sheet 1 from the support can be suppressed. Thereby, since the double-sided pressure-sensitive adhesive sheet 1 is not pulled by the components to be picked up, and the parts stuck on the double-sided pressure-sensitive adhesive sheet 1 do not collide with each other, damage to the parts is suppressed.
  • the double-sided pressure-sensitive adhesive sheet 1 is easily peeled off from the support when picking up components from the double-sided pressure-sensitive adhesive sheet 1. Thereby, the double-sided pressure-sensitive adhesive sheet 1 is pulled by the parts to be picked up, or the parts stuck on the double-sided pressure-sensitive adhesive sheet 1 collide with each other, and the parts are damaged.
  • the difference exceeds 20000 mN / 25 mm, the adhesive force B2 becomes extremely small, and the components cannot be sufficiently fixed on the double-sided pressure-sensitive adhesive sheet 1.
  • the above-described adhesive force B2 is preferably 100 mN / 25 mm or more, particularly preferably 150 mN / 25 mm or more, and more preferably 500 mN / 25 mm or more.
  • the adhesive force B2 is preferably 15000 mN / 25 mm or less, particularly preferably 10,000 mN / 25 mm or less, and more preferably 5000 mN / 25 mm or less.
  • the adhesive force B2 is in the above range, the difference in adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 can be easily adjusted to the above-described range, and components laminated on the double-sided adhesive sheet 1 are picked up. In that case, peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support can be effectively suppressed.
  • the detail of the measuring method of adhesive force B2 is as showing to the test example mentioned later.
  • the double-sided pressure-sensitive adhesive sheet in which the second pressure-sensitive adhesive layer 13 exposed by peeling the second release sheet 15 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304).
  • the 180 ° peel adhesive strength A2 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is preferably 100 mN / 25 mm or more, more preferably 150 mN / 25 mm or more. Is preferably 500 mN / 25 mm or more.
  • the adhesive strength A2 is preferably 15000 mN / 25 mm or less, particularly preferably 10,000 mN / 25 mm or less, and more preferably 5000 mN / 25 mm or less. Since the adhesive force A2 also affects the magnitude of the peeling force P2 when peeling the second release sheet 15, the peeling force P2 is described above because the adhesive force A2 is in the above range. It becomes easy to set to a range, and when peeling the 1st peeling sheet 14 from the double-sided adhesive sheet 1, peeling of the 2nd peeling sheet 15 from the double-sided adhesive sheet 1 can be suppressed effectively. In addition, the detail of the measuring method of adhesive force A2 is as showing to the test example mentioned later.
  • the difference in adhesive strength obtained by subtracting the adhesive strength A2 from the adhesive strength A1 is preferably 10 mN / 25 mm or more, particularly 300 mN / 25 mm or more. More preferably, it is 500 mN / 25 mm or more. Further, the difference is preferably 30000 mN / 25 mm or less, particularly preferably 20000 mN / 25 mm or less, and further preferably 15000 mN / 25 mm or less.
  • the difference between the adhesive strength A1 and the adhesive strength A2 before heating of the double-sided pressure-sensitive adhesive sheet 1 is in the above range, the difference between the adhesive strength B1 after heating and the adhesive strength B2 can be easily adjusted to the range described above.
  • peeling from the support body of the double-sided adhesive sheet 1 can be suppressed effectively.
  • the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer 12 exposed by peeling the first release sheet 14 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304).
  • the 180 ° peeling adhesive strength C1 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is preferably 1000 mN / 25 mm or more, particularly 1500 mN. / 25 mm or more, more preferably 2000 mN / 25 mm or more.
  • the adhesive strength C1 is preferably 21000 mN / 25 mm or less, particularly preferably 20000 mN / 25 mm or less, and more preferably 19000 mN / 25 mm or less.
  • the adhesive strength C1 is in the above range, even when the double-sided adhesive sheet 1 is exposed to heating conditions such as 24 hours at 125 ° C., it is possible to effectively suppress the occurrence of adhesive residue on the support. it can.
  • the detail of the measuring method of adhesive force C1 is as showing to the test example mentioned later.
  • the pressure-sensitive adhesive surface of the second pressure-sensitive adhesive layer 13 exposed by peeling the second release sheet 15 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304).
  • a stainless steel plate SUS304.
  • the 180 ° peeling adhesive strength C2 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is 100 mN / 25 mm or more, particularly 150 mN. / 25 mm or more, more preferably 500 mN / 25 mm or more.
  • the adhesive strength C2 is preferably 20000 mN / 25 mm or less, particularly preferably 15000 mN / 25 mm or less, and more preferably 13000 mN / 25 mm or less. Since the adhesive force C2 is in the above range, even when the double-sided pressure-sensitive adhesive sheet 1 is exposed to heating conditions such as 24 hours at 125 ° C., the fixing of parts on the double-sided pressure-sensitive adhesive sheet 1, The parts can be picked up satisfactorily. In addition, the detail of the measuring method of adhesive force C2 is as showing to the test example mentioned later.
  • the difference in adhesive strength obtained by subtracting the adhesive strength C2 from the adhesive strength C1 is preferably 10 mN / 25 mm or more, particularly 300 mN / 25 mm or more. More preferably, it is 500 mN / 25 mm or more. Further, the difference is preferably 30000 mN / 25 mm or less, particularly preferably 20000 mN / 25 mm or less, and further preferably 15000 mN / 25 mm or less. When the difference is within the above range, even when the double-sided pressure-sensitive adhesive sheet 1 is exposed to a heating condition such as 24 hours at 125 ° C., components can be well picked up from the double-sided pressure-sensitive adhesive sheet 1.
  • the core material 11 is not particularly limited as long as the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 can be laminated, but particularly has heat resistance. It is preferable to consist of materials.
  • the core material 11 examples include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polyolefin films such as polyethylene and polypropylene, cellulose films such as triacetyl cellulose, polyimide films, polyurethane films, polyurethane acrylate films, poly Plastic films such as vinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, acrylic resin film, norbornene resin film, cycloolefin resin film, liquid crystal polymer film; These 2 or more types of laminated bodies etc. are mentioned.
  • the plastic film may be uniaxially stretched or biaxially stretched.
  • a polyester film or a polyimide film such as a polyethylene terephthalate film or a polybutylene terephthalate film, and it is particularly preferable to use a polyimide film.
  • the core material 11 may be oxidized or roughened on one side or both sides as desired for the purpose of improving the adhesion with the first pressure-sensitive adhesive layer 12 or the second pressure-sensitive adhesive layer 13 provided on the surface thereof.
  • Surface treatment by a method or the like, or primer treatment can be performed.
  • the oxidation method include corona discharge treatment, plasma discharge treatment, chromium oxidation treatment (wet), flame treatment, hot air treatment, ozone, ultraviolet irradiation treatment, and the like.
  • Examples include a thermal spraying method. These surface treatment methods are appropriately selected according to the type of the base film, but generally, a corona discharge treatment method is preferably used from the viewpoints of effects and operability.
  • the thickness of the core material 11 is preferably 3 ⁇ m or more, particularly preferably 5 ⁇ m or more, and more preferably 15 ⁇ m or more.
  • the thickness is preferably 300 ⁇ m or less, particularly preferably 100 ⁇ m or less, and further preferably 50 ⁇ m or less.
  • the double-sided adhesive sheet 1 which concerns on this embodiment, the 1st adhesive layer 12 and the 2nd adhesive layer 13 are respectively comprised from a silicone type adhesive. Has been.
  • the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment has excellent heat resistance, and due to the heating of the double-sided pressure-sensitive adhesive sheet 1, the pressure-sensitive adhesive force on the component and the support is excessively reduced or the pressure-sensitive adhesive force is excessively improved. It is suppressed.
  • the component and the support can be fixed well, and the subsequent double-sided pressure-sensitive adhesive sheet 1
  • pick-up failure is suppressed, and further, when the used double-sided pressure-sensitive adhesive sheet 1 is peeled off from the support, adhesive residue on the support is suppressed. By suppressing the adhesive residue, the support can be easily reused.
  • the silicone-based pressure-sensitive adhesive constituting each of the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 is not particularly limited as long as the double-sided pressure-sensitive adhesive sheet 1 exhibits the above-described pressure-sensitive adhesive force and peeling force.
  • the silicone-based pressure-sensitive adhesive that constitutes the first pressure-sensitive adhesive layer 12 and the silicone-based pressure-sensitive adhesive that constitutes the second pressure-sensitive adhesive layer 13 may have the same composition, In order to easily cause a difference in adhesive force or peeling force between the first pressure-sensitive adhesive layer 12 side and the second pressure-sensitive adhesive layer 13 side, it is preferable to have different compositions.
  • the silicone-based pressure-sensitive adhesive preferably contains an organopolysiloxane, particularly an addition-type organopolysiloxane (cured product thereof).
  • an organopolysiloxane particularly an addition-type organopolysiloxane (cured product thereof).
  • Such a silicone-based pressure-sensitive adhesive easily satisfies the above-described pressure-sensitive adhesive force and is excellent in processability.
  • the addition-type organopolysiloxane is preferably obtained by reacting an organopolysiloxane having a siloxane bond as a main skeleton and an alkenyl group with an organohydrogenpolysiloxane.
  • the organopolysiloxane having a siloxane bond as the main skeleton and having an alkenyl group is preferably a compound represented by the following average unit formula (1) and having at least two alkenyl groups in the molecule.
  • R 1 is an unsubstituted or substituted monovalent hydrocarbon group having the same or different carbon number of 1 to 12, preferably 1 to 8, and a is 1.5 to 2.8, preferably 1 .8 to 2.5, more preferably a positive number in the range of 1.95 to 2.05.
  • Examples of the unsubstituted or substituted monovalent hydrocarbon group bonded to the silicon atom represented by R 1 include, for example, vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, hexenyl group, cyclohexenyl group, octenyl.
  • Groups such as alkenyl groups, methyl groups, ethyl groups, propyl groups, isopropyl groups, butyl groups, isobutyl groups, tert-butyl groups, pentyl groups, neopentyl groups, hexyl groups, cyclohexyl groups, octyl groups, nonyl groups, decyl groups, etc.
  • alkyl group a phenyl group, a tolyl group, an xylyl group, an aryl group such as a naphthyl group, an aralkyl group such as a benzyl group, a phenylethyl group, a phenylpropyl group, or a part or all of the hydrogen atoms of these groups, Substituted by halogen atoms such as bromine and chlorine, cyano groups, such as chloromethyl group, chloro A propyl group, a bromoethyl group, a trifluoropropyl group, a cyanoethyl group and the like can be mentioned.
  • the alkenyl group is preferably a vinyl group from the viewpoint of short curing time and productivity.
  • Organohydrogenpolysiloxane has SiH groups in the molecule.
  • the alkenyl group of the organopolysiloxane reacts with the SiH group of the organohydrogenpolysiloxane, both undergo an addition reaction to obtain an addition-type organopolysiloxane.
  • the silicone-based pressure-sensitive adhesive preferably contains a platinum catalyst.
  • the platinum catalyst include platinum black, secondary platinum chloride, chloroplatinic acid, a reaction product of chloroplatinic acid and a monohydric alcohol, a complex of chloroplatinic acid and olefins, platinum bisacetoacetate, and the like.
  • the content of the platinum catalyst in the silicone-based pressure-sensitive adhesive is preferably 0.01 parts by mass or more, particularly preferably 0.05 parts by mass or more, with respect to 100 parts by mass of the addition type organopolysiloxane. .
  • the content is preferably 3 parts by mass or less, particularly preferably 2 parts by mass or less, with respect to 100 parts by mass of the addition type organopolysiloxane.
  • the addition type organopolysiloxane can contain an organopolysiloxane (silicone resin) containing a trifunctional or tetrafunctional siloxane unit in the molecule from the viewpoint of adjusting the above-described peeling force and adhesive force.
  • the adhesive force by the adhesive layer made of the adhesive is increased, and the release force of the release sheet laminated on the adhesive layer Can be increased. Therefore, it is preferable to adjust the content of the silicone resin for each of the silicone pressure-sensitive adhesive constituting the first pressure-sensitive adhesive layer 12 and the silicone pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer 13.
  • the desired adhesive strength can be achieved by adjusting the crosslinking density in the silicone adhesive and the amount of catalyst in the silicone adhesive.
  • the thickness of the first pressure-sensitive adhesive layer 12 is preferably 1 ⁇ m or more, particularly preferably 3 ⁇ m or more, and further preferably 5 ⁇ m or more.
  • the thickness is preferably 100 ⁇ m or less, particularly preferably 50 ⁇ m or less, and further preferably 40 ⁇ m or less.
  • the thickness of the second pressure-sensitive adhesive layer 13 is preferably 1 ⁇ m or more, particularly preferably 5 ⁇ m or more, and further preferably 10 ⁇ m or more.
  • the thickness is preferably 100 ⁇ m or less, particularly preferably 50 ⁇ m or less, and further preferably 40 ⁇ m or less.
  • the first release sheet 14 is not particularly limited as long as the release surface can exhibit the release property to the first pressure-sensitive adhesive layer 12.
  • the 2nd peeling sheet 15 is not specifically limited as long as the peeling force P2 mentioned above can be exhibited.
  • the first release sheet 14 and the second release sheet 15 may be different release sheets or the same type of release sheet.
  • the configurations of the first release sheet 14 and the second release sheet 15 are arbitrary, for example, a plastic film such as a polyester film such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, or a polyolefin film such as polypropylene or polyethylene. Can be mentioned. These peeling surfaces are preferably subjected to a peeling treatment.
  • the release agent used for the release treatment include a silicone release agent, a fluorine release agent, a long-chain alkyl release agent, and the like.
  • a first adhesive layer made of a silicone adhesive is used.
  • a fluorine-based release agent that easily exhibits good release properties to the 12 and the second pressure-sensitive adhesive layer 13 is preferable.
  • the fluorine-based release agent examples include those composed of a release agent composition containing a compound containing a fluorine atom.
  • the compound is particularly preferably a polymer having a group containing a fluorine atom in the side chain.
  • the group containing a fluorine atom include a perfluoro group, and more specifically, a perfluoroalkyl group and a perfluoroalkylene group.
  • the polymer preferably contains a perfluoroalkyl group from the viewpoint of easy adjustment of the aforementioned peeling force.
  • perfluoroalkyl group examples include a CF 3 —CF 2 — group, a CF 3 —CF 2 —CF 2 — group, and the like.
  • the perfluoroalkyl group may be bonded to the main chain through another group (—O— group, —OCO— group, alkylene group, etc.).
  • each of the first release sheet 14 and the second release sheet 15 is not particularly limited, but is usually 20 ⁇ m or more and 250 ⁇ m or less, for example.
  • the double-sided adhesive sheet 1 according to this embodiment may have a lattice shape by having a plurality of holes.
  • the plurality of holes are preferably aligned in the X-axis direction and the Y-axis direction on the double-sided pressure-sensitive adhesive sheet 1.
  • the plurality of holes may be formed in advance or may be formed in the middle of the manufacturing method. In the method for manufacturing a semiconductor device, by stacking components so as to cover the holes, protrusions and the like existing on the surface of the components can be accommodated in the holes.
  • the width between two adjacent holes is preferably 0.001 mm or more, particularly 0.01 mm or more. It is preferable that it is 0.1 mm or more.
  • the width is preferably 10 mm or less, particularly preferably 5 mm or less, and further preferably 3 mm or less.
  • the ratio (A1 / P2) of the adhesive force A1 to the peeling force P2 and the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 are in the ranges described above.
  • the double-sided pressure-sensitive adhesive sheet 1 is peeled off from the support when the second release sheet 15 is peeled off or when parts are picked up from the double-sided pressure-sensitive adhesive sheet 1. Can be suppressed satisfactorily.
  • the shape and size of the holes are the size of the component laminated on the double-sided pressure-sensitive adhesive sheet 1 and members such as protrusions existing on the surface of the component.
  • the shape of the hole may be a square, a rectangle, or a circle.
  • the length of one side is preferably 1 mm or more, and particularly preferably 3 mm or more.
  • the length of one side is 20 mm or less, and it is especially preferable that it is 15 mm or less.
  • the length of the short side is preferably 1 mm or more, and particularly preferably 3 mm or more.
  • the length of the short side is preferably 20 mm or less, and particularly preferably 15 mm or less.
  • the length of the long side is preferably 3 mm or more, and particularly preferably 5 mm or more.
  • the length of the long side is preferably 25 mm or less, and particularly preferably 20 mm or less.
  • the length of the diameter of the circle is preferably 1 mm or more, and particularly preferably 3 mm or more.
  • the length of the circular diameter is preferably 25 mm or less, and particularly preferably 20 mm or less.
  • the double-sided pressure-sensitive adhesive sheet 1 may have a tape shape.
  • a plurality of the double-sided pressure-sensitive adhesive sheets 1 are affixed in parallel to each other with a space between them. .
  • channel which makes the side surface the end surface which exists along the length direction of the double-sided adhesive sheet 1 and makes a support body a bottom part can be formed.
  • projections and the like existing on the surface of the component can be accommodated in the groove.
  • the width is preferably 0.1 mm or more, particularly preferably 0.5 mm or more, and further preferably 1 mm or more.
  • the width is preferably 10 mm or less, particularly preferably 5 mm or less, and further preferably 3 mm or less.
  • the ratio (A1 / P2) of the adhesive force A1 to the peeling force P2 and the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 are in the ranges described above.
  • the double-sided pressure-sensitive adhesive sheet 1 is peeled off from the support when the second release sheet 15 is peeled off or when parts are picked up from the double-sided pressure-sensitive adhesive sheet 1. Can be suppressed satisfactorily.
  • the first pressure-sensitive adhesive layer 12 is formed on one surface of the core material 11 and then the first pressure-sensitive adhesive layer. 12, the first release sheet 14 is laminated on the surface opposite to the core material 11, and then the second pressure-sensitive adhesive layer 13 is formed on the other surface of the core material 11.
  • stacking the 2nd peeling sheet 15 on the surface on the opposite side to the core material 11 in the agent layer 13 is mentioned.
  • the second release sheet 15 is laminated on the surface of the second pressure-sensitive adhesive layer 13 opposite to the core material 11.
  • the first release sheet 14 is formed on the surface of the first pressure-sensitive adhesive layer 12 opposite to the core material 11.
  • the method of laminating is mentioned. According to these methods, the double-sided pressure-sensitive adhesive sheet 1 having excellent adhesion between the core material 11 and the first pressure-sensitive adhesive layer 12 and between the core material 11 and the second pressure-sensitive adhesive layer 13 is produced. Can do.
  • a component constituting the silicone-based pressure-sensitive adhesive is diluted with a solvent to prepare a coating liquid, The coating liquid is applied onto one surface of the core material 11, and the obtained coating film is heated and cured.
  • a solvent methyl ethyl ketone, toluene, ethyl acetate, xylene and the like can be used.
  • a coating method a roll knife coater, a die coater, a curtain coater, a spray coater, a slit coater, a knife coater, or the like can be used.
  • the said heating conditions can be made into 1 minute or more and 5 minutes or less at the temperature of 90 degreeC or more and 180 degrees C or less, for example.
  • the manufacturing method of the semiconductor device which concerns on one Embodiment of this invention is a method of manufacturing a semiconductor device using the double-sided adhesive sheet 1 mentioned above.
  • the method for manufacturing a semiconductor device includes a step of peeling the first release sheet 14 from the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment (hereinafter sometimes referred to as “first release step”), a first.
  • a step of sticking the adhesive surface of the first pressure-sensitive adhesive layer 12 exposed by peeling of the release sheet 14 on a support (hereinafter sometimes referred to as “sticking step”), simultaneously with the sticking or after the sticking, From the double-sided pressure-sensitive adhesive sheet 1 affixed on the support, a step of providing a region surrounded by or sandwiched by the double-sided pressure-sensitive adhesive sheet 1 where the double-sided pressure-sensitive adhesive sheet 1 does not exist (hereinafter sometimes referred to as “region forming step”).
  • a step of peeling the second release sheet 15 (hereinafter sometimes referred to as a “second peeling step”), a second adhesive so that each of the plurality of components covers or spans the region.
  • Agent layer 1 A process of laminating on top (hereinafter may be referred to as “component laminating process”), a process of performing a heating process on the part (hereinafter also referred to as “heating process”), A step of peeling from the pressure-sensitive adhesive layer 13 (hereinafter sometimes referred to as “component peeling step”) is provided.
  • the manufacturing method of the semiconductor device which concerns on this embodiment further includes the process (henceforth a "sheet peeling process") which peels the double-sided adhesive sheet 1 from a support body after a component peeling process. .
  • FIGS. 2 and 3 are cross-sectional views illustrating a method for manufacturing a semiconductor device according to a first embodiment. With reference to these figures, each process described above will be described below.
  • FIG. 2 (a) shows, the 1st peeling sheet 14 is peeled from the double-sided adhesive sheet 1 which concerns on this embodiment.
  • the adhesion between the second pressure-sensitive adhesive layer 13 and the second release sheet 15 becomes appropriate due to the above-described peeling force P2 being in the above-described range.
  • the support 2 is not limited as long as it can attach the double-sided pressure-sensitive adhesive sheet 1 and can support components, and can withstand heating in the heating process described later, and is, for example, a stainless steel plate, an aluminum plate, a copper plate, or the like. Is preferred.
  • Region Forming Step In the region forming step, as shown in FIG. 2C, a plurality of layers that pass through the laminated body with respect to the laminated body excluding the first release sheet 14 in the double-sided pressure-sensitive adhesive sheet 1.
  • the hole 3 is formed.
  • the hole 3 is an area surrounded by the double-sided pressure-sensitive adhesive sheet 1 where the double-sided pressure-sensitive adhesive sheet 1 does not exist.
  • the width between two adjacent holes 3 is preferably 0.1 mm or more, particularly preferably 0.3 mm or more, and more preferably 0.5 mm or more. It is preferable that The width is preferably 15 mm or less, particularly preferably 10 mm or less, and more preferably 5 mm or less.
  • the shape of the holes may be square or rectangular.
  • Formation of the hole 3 can be performed by cutting the double-sided pressure-sensitive adhesive sheet 1 into the shape of the hole 3 using a blade, laser, engraving blade, cutter, or the like, and removing unnecessary portions.
  • FIG. 3 (a) shows, the 2nd peeling sheet 15 is peeled from the double-sided adhesive sheet 1 stuck on the support body 2.
  • the ratio of the adhesive force A1 to the peel force P2 (A1 / P2) is in the above-described range, when the second release sheet 15 is peeled off, the support 2 Peeling of the double-sided PSA sheet 1 is suppressed.
  • the second peeling step may be performed before the region forming step.
  • a plurality of components 4 are laminated on the second pressure-sensitive adhesive layer 13 as shown in FIG. At this time, the components 4 are laminated so as to cover one hole 3. Thereby, even if the protrusion 41 which is easily damaged exists on the surface of the component 4, the protrusion 41 can be accommodated in the hole 3. The resulting damage to the protrusion 41 can be suppressed.
  • Heating step In the heating step, as shown in FIG. 3B, a process involving heating the component 4 in a state where the plurality of components 4 are stacked on the second pressure-sensitive adhesive layer 13.
  • the treatment include IR reflow, chemical treatment such as plating, vapor deposition treatment, surface coating treatment, baking treatment for drying, heat curing of the protective agent, and the like.
  • the heating temperature in the treatment involving heating may be 100 ° C. or higher, and particularly 150 ° C. or higher.
  • the said heating temperature may be 400 degrees C or less, and may be 300 degrees C or less especially.
  • the heating time in the treatment involving heating may be 1 minute or longer, and particularly 5 minutes or longer.
  • the said heating time may be 300 minutes or less, and may be 200 minutes or less especially.
  • the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 are each composed of a silicone-based pressure-sensitive adhesive, whereby the double-sided pressure-sensitive adhesive sheet 1 has excellent heat resistance. It will have. Thereby, even if it performs the process with the above heating, it is hard to produce a change in the adhesive force in the double-sided pressure-sensitive adhesive sheet 1, and the occurrence of pickup failure of the component 4 is suppressed in the subsequent component peeling process. In the peeling step, it is possible to favorably peel the double-sided pressure-sensitive adhesive sheet 1 from the support 2 while suppressing the adhesive residue on the support 2.
  • Component peeling step In the component peeling step, the component 4 is peeled from the second pressure-sensitive adhesive layer 13 as shown in FIG.
  • the peeling can be performed, for example, by picking up the components 4 individually using a pickup device.
  • the double-sided pressure-sensitive adhesive sheet 1 peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support 2 is suppressed because the difference in adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 is within the above-described range. The Thereby, the double-sided pressure-sensitive adhesive sheet 1 is not pulled by the component 4 to be picked up, and the parts 4 stuck on the double-sided pressure-sensitive adhesive sheet 1 do not collide with each other, so that damage to the component 4 is suppressed.
  • the double-sided pressure-sensitive adhesive sheet 1 from which all the components 4 have been peeled is peeled from the support 2.
  • the adhesive force B1 is in the above-described range, so that the adhesion between the second pressure-sensitive adhesive layer 13 and the support body 2 does not become excessively high.
  • the double-sided pressure-sensitive adhesive sheet 1 can be favorably peeled from the support 2 without causing adhesive residue on the support 2 due to the pressure-sensitive adhesive component of the second pressure-sensitive adhesive layer 13. Thereby, the support body 2 can be reused as it is without performing the process which removes the residue of an adhesive.
  • the double-sided pressure-sensitive adhesive sheet 1 having a lattice shape by having a plurality of holes as described above is used. Since the plurality of holes 3 are formed in advance in the double-sided pressure-sensitive adhesive sheet 1, the plurality of holes 3 penetrating the laminated body excluding the first release sheet 14 in the double-sided pressure-sensitive adhesive sheet 1 in the region forming step described above. There is no need to form.
  • the adhesive surface of the first pressure-sensitive adhesive layer 12 in the double-sided pressure-sensitive adhesive sheet 1 is supported as a sticking step. Affix to 2.
  • the some hole 3 previously formed in the double-sided adhesive sheet 1 becomes an area
  • the second release sheet 15 is peeled off from the second pressure-sensitive adhesive layer 13 in the first release step, as in the method for manufacturing the semiconductor device according to the first aspect.
  • the peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support 2 in the second peeling step can be suppressed, the change in the adhesive force of the double-sided pressure-sensitive adhesive sheet 1 in the heating step can be suppressed, and the component Peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support 2 in the peeling process can be suppressed, and adhesive residue on the support 2 in the sheet peeling process can be suppressed.
  • a plurality of the double-sided pressure-sensitive adhesive sheets 1 having the tape shape described above are used.
  • the double-sided pressure-sensitive adhesive sheet having a plurality of tape-like shapes with respect to the support 2 as a pasting step after performing the first peeling step in the same manner as in the method of manufacturing a semiconductor device according to the first aspect. 1 are affixed in parallel with a space between each other. Thereby, the area
  • the second peeling process, the component stacking process, the heating process, the component peeling process, and the sheet peeling process may be performed in the same manner as the semiconductor device manufacturing method according to the first aspect. it can.
  • the second release sheet 15 is peeled off from the second pressure-sensitive adhesive layer 13 in the first release step, as in the method for manufacturing the semiconductor device according to the first aspect.
  • the peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support 2 in the second peeling step can be suppressed, the change in the adhesive force of the double-sided pressure-sensitive adhesive sheet 1 in the heating step can be suppressed, and the component Peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support 2 in the peeling process can be suppressed, and adhesive residue on the support 2 in the sheet peeling process can be suppressed.
  • another layer may be provided between the core material 11 and the first pressure-sensitive adhesive layer 12 or between the core material 11 and the second pressure-sensitive adhesive layer 13.
  • Examples 1 to 3 and Comparative Examples 1 to 5 The components shown in Table 1 were mixed and diluted with methyl ethyl ketone to obtain a coating solution of the pressure-sensitive adhesive composition for the first pressure-sensitive adhesive layer having a solid content concentration of 20% by mass.
  • the coating solution is applied on one side of a polyimide film (manufactured by Toray DuPont, product name “Kapton 100H”, thickness: 25 ⁇ m) as a core material using a roll knife coater.
  • the film was cured by heating at 130 ° C. for 2 minutes to form a first pressure-sensitive adhesive layer.
  • a release film in which one side of a 38 ⁇ m-thick polyethylene terephthalate film as a first release sheet is peeled with a fluorine-based release agent on the surface opposite to the core material in the obtained first pressure-sensitive adhesive layer ( A laminated body in which a release surface of a product name “SP-PET 38E-0010YCS” manufactured by Lintec Co., Ltd. is pasted and a core material, a first adhesive layer, and a first release sheet are laminated in this order. Obtained.
  • the thickness of the first pressure-sensitive adhesive layer is shown in Table 1.
  • the components shown in Table 1 were mixed and diluted with methyl ethyl ketone to obtain a coating solution of the pressure-sensitive adhesive composition for the second pressure-sensitive adhesive layer having a solid content concentration of 20% by mass. .
  • the coating liquid is applied on the core-side surface of the laminate obtained as described above using a roll knife coater, and the resulting coating film is heated at 130 ° C. for 2 minutes to be cured, Two pressure-sensitive adhesive layers were formed. Further, on the surface opposite to the core material in the obtained second pressure-sensitive adhesive layer, peeling is performed by peeling one side of a 38 ⁇ m thick polyethylene terephthalate film as a second peeling sheet with a fluorine-based peeling agent.
  • a release surface of a film (product name “SP-PET 38E-0010YCS” manufactured by Lintec Corporation) is pasted, a second release sheet, a second adhesive layer, a core material, and a first adhesive layer
  • the thickness of the second pressure-sensitive adhesive layer is shown in Table 1.
  • Silicone pressure sensitive adhesive A Silicone pressure sensitive adhesive (manufactured by Dow Corning Toray, product name “SD 4587 L”) Silicone-based adhesive B: Silicone adhesive (manufactured by Dow Corning Toray, product name “SD 4580”) Silicone-based adhesive C: Silicone adhesive (manufactured by Dow Corning Toray, product name “SD 4584”) Primer: Primer (product name “BY24-712” manufactured by Toray Dow Corning) Platinum catalyst: Platinum catalyst (product name “SRX 212” manufactured by Toray Dow Corning)
  • the second release sheet When measuring the adhesive force on the adhesive surface of the first adhesive layer, the second release sheet was peeled from the double-sided adhesive sheet to expose the adhesive surface in the second adhesive layer. And the surface opposite to the peeling surface of the 2nd peeling sheet obtained by the said peeling was stuck on the said adhesion surface using the 2kg rubber roller in the environment of temperature 23 degreeC and 50% of relative humidity. .
  • the second release sheet when measuring the adhesive force on the adhesive surface of the first pressure-sensitive adhesive layer, the second release sheet is peeled off from the second pressure-sensitive adhesive layer, preventing accurate measurement of the adhesive force. This is done to avoid it.
  • the first release sheet is peeled off from the first pressure-sensitive adhesive layer, and the exposed pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer is used at a temperature of 23 ° C. and a relative humidity of 50% using a 2 kg rubber roller.
  • a stainless steel plate SUS304 mirror plate, arithmetic average roughness Ra: 0.05 ⁇ m
  • double-sided adhesive sheet excluding the first release sheet and stainless steel
  • Test Example 2 (Measurement of adhesive strength after heating) After obtaining the test laminate in the same manner as in Test Example 1, the test laminate was heated at 260 ° C. for 1 minute. The heating condition is referred to as heating condition 1. About the laminated body for a test after the heating, in the same manner as in Test Example 1, the adhesive strength (mN / 25 mm) for the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was measured. The obtained adhesive strengths were respectively determined as adhesive strength B1 (mN / 25 mm) in heating condition 1 for the first adhesive layer and adhesive strength B2 (mN / 25 mm) in heating condition 1 for the second adhesive layer. ). The results are shown in Table 2.
  • the test laminate was heated at 125 ° C. for 24 hours.
  • the heating condition is referred to as heating condition 2.
  • the adhesive strength (mN / 25 mm) for the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was measured.
  • the obtained adhesive strengths were determined as follows: adhesive strength C1 (mN / 25 mm) under heating condition 2 for the first adhesive layer and adhesive strength C2 (mN / 25 mm) under heating condition 2 for the second adhesive layer, respectively. ).
  • the results are shown in Table 2.
  • the second release sheet When measuring the peel strength of the first release sheet, the second release sheet is peeled from the double-sided pressure-sensitive adhesive sheet, and the pressure-sensitive adhesive surface of the exposed second pressure-sensitive adhesive layer is placed in an environment at a temperature of 23 ° C. and a relative humidity of 50%.
  • a 2 kg rubber roller was used to attach to a single side of a stainless steel plate (SUS304 mirror plate, arithmetic average roughness Ra: 0.05 ⁇ m) as a support.
  • Test Example 4 (Support sticking test) (1) Preparation of test semiconductor package After forming a circuit pattern on a copper foil in a copper foil-clad laminate (Mitsubishi Gas Chemical Co., Ltd., product name “CCL-HL830”, copper foil thickness: 18 ⁇ m), the pattern A substrate (product name “LN001E-001 PCB (Au) AUS303”, manufactured by Chino Giken Co., Ltd.), on which a solder resist (product name “PSR-4000 AUS303”) was laminated, was prepared.
  • a molding resin manufactured by Kyocera Chemical Co., product name “KE-1100AS3”
  • a sealing device manufactured by Apic Yamada Co., Ltd., product name “MPC-06M TriAl Press”.
  • the mold resin was cured by heating at 175 ° C. for 5 hours.
  • the sealed substrate is attached to a dicing tape (product name “Adwill D-510T” manufactured by Lintec Corporation), and then placed on a dicing apparatus (product name “DFD651” manufactured by Disco Corporation) for dicing.
  • a test semiconductor package having a size of 8 mm ⁇ 8 mm was obtained.
  • the first release sheet was peeled from the double-sided PSA sheet produced in the Examples and Comparative Examples, and the exposed adhesive surface of the first PSA layer was a stainless steel plate (SUS304 mirror plate). , Arithmetic average roughness Ra: 0.05 ⁇ m, dimensions: 15 cm ⁇ 7 cm ⁇ 0.5 mm).
  • the 2nd peeling sheet was peeled from the double-sided adhesive sheet, and the adhesive surface in the 2nd adhesive layer was exposed.
  • the semiconductor package manufactured in the above step (1) was placed on the adhesive surface using tweezers in an environment of a temperature of 23 ° C. and a relative humidity of 50%, and pressure-bonded using a 2 kg rubber roller. . At this time, it was placed so that the adhesive surface of the double-sided adhesive sheet and the sealed surface of the test semiconductor package were in contact. Moreover, it mounted so that the hole formed in the double-sided adhesive sheet might be covered with the semiconductor package for a test.
  • the obtained laminate is subjected to IR reflow once in a reflow furnace (product name “WL-15-20DNX type” manufactured by Sagami Riko Co., Ltd.) under the conditions of a maximum temperature of 240 ° C. and a heating time of 1 minute. I did it. Then, after taking out the laminated body from the reflow furnace and cooling to room temperature, the semiconductor package for a test was individually picked up from the double-sided adhesive sheet using tweezers. After the pickup of all the test semiconductor packages was completed, the double-sided adhesive sheet was peeled off from the stainless steel plate.
  • a reflow furnace product name “WL-15-20DNX type” manufactured by Sagami Riko Co., Ltd.
  • the double-sided PSA sheet obtained in the examples peels off the second PSA sheet from the second PSA layer when the first PSA sheet is peeled off. Neither peeling of the double-sided pressure-sensitive adhesive sheet from the support during peeling, nor peeling of the double-sided pressure-sensitive adhesive sheet from the support when picking up parts occurred. Furthermore, in the double-sided pressure-sensitive adhesive sheet obtained in the examples, when the used double-sided pressure-sensitive adhesive sheet was peeled from the support, adhesive residue on the support was hardly generated.
  • the double-sided pressure-sensitive adhesive sheet of the present invention can be suitably used in a method for producing a semiconductor device including a part having a fragile member on its surface.

Abstract

A double-sided adhesive sheet 1 having, layered in the following order, a second release sheet 15, a second adhesive agent layer 13, a core material 11, a first adhesive agent layer 12, and a first release sheet 14, wherein the first adhesive agent layer 12 and the second adhesive agent layer 13 are formed of a silicone adhesive agent, a release strength P2 when releasing the second release sheet 15 is 30-1000 mN/50 mm, the ratio of an adhesive strength A1 of an adhesive surface of the first adhesive agent layer 12 with respect to the release strength P2 is 10-5000, an adhesive strength B1 of the adhesive surface of the first adhesive agent layer 12 after being heated at 260°C for one minute is 500-15000 mN/25 mm, and the difference in adhesive strength obtained by subtracting, from the adhesive strength B1, an adhesive strength B2 of an adhesive surface of the second adhesive agent layer 13 after being heated at 260°C for one minute, is 1000-20000 mN/25 mm. The double-sided adhesive sheet 1 can be used, without causing any problem, in a production method for a semiconductor device including a step accompanied by heating.

Description

両面粘着シートおよび半導体装置の製造方法Double-sided pressure-sensitive adhesive sheet and method for manufacturing semiconductor device
　本発明は、両面粘着シート、および当該両面粘着シートを使用する半導体装置の製造方法に関するものである。 The present invention relates to a double-sided pressure-sensitive adhesive sheet and a method for manufacturing a semiconductor device using the double-sided pressure-sensitive adhesive sheet.
　半導体装置の製造方法では、半導体装置を構成する部品を、両面粘着シートを介して支持体上に固定した後、両面粘着シート上にて部品の加工を行うことがある。例えば、部品としての半導体パッケージを、両面粘着シートを介して支持体としてのステンレススチール板上に固定した後、当該半導体パッケージの表面における所定の位置にハンダバンプを搭載し、さらにＩＲリフローを行う。このような方法によれば、半導体パッケージの表面に、優れた位置精度でハンダバンプを設けることができる。 In the method for manufacturing a semiconductor device, there are cases where components constituting the semiconductor device are fixed on a support via a double-sided pressure-sensitive adhesive sheet, and then the components are processed on the double-sided pressure-sensitive adhesive sheet. For example, a semiconductor package as a component is fixed on a stainless steel plate as a support through a double-sided adhesive sheet, solder bumps are mounted at predetermined positions on the surface of the semiconductor package, and IR reflow is performed. According to such a method, solder bumps can be provided on the surface of the semiconductor package with excellent positional accuracy.
　また、上記のように両面粘着シートを介して支持体上に固定された部品に対して、メッキ等の薬液処理、蒸着処理、表面コート処理等を行うことも検討されている上述したような部品に対する加工の多くは加熱を伴う。そのため、当該部品を固定するための両面粘着シートには、部品と支持体とを良好に固定できる粘着性とともに、耐熱性も求められる。 In addition, as described above, parts that have been studied to perform chemical treatment such as plating, vapor deposition, surface coating, etc., on the parts fixed on the support through the double-sided adhesive sheet as described above. Many of the processes for the process involve heating. Therefore, the double-sided pressure-sensitive adhesive sheet for fixing the part is required to have heat resistance as well as the adhesiveness that can favorably fix the part and the support.
　ところで、両面粘着シートでは、一般的に、取り扱い性を向上する観点や、その両面粘着シートの用途に適したものとする観点等から、被着体に対する粘着力や剥離シートを剥離する際の剥離力を、両面粘着シートの両面についてそれぞれ独立に設定することがある。例えば、特許文献１には、被着体の再利用が可能となるように両面粘着シートを剥離する観点から、両面における粘着力の比が所定の範囲となるように調整された両面粘着シートが開示されている。また、特許文献２には、剥離シートの剥離性を向上させる観点から、両面における、剥離シートを剥離した際の剥離力の比が所定の範囲となるよう調整された両面粘着シートが開示されている。 By the way, in the double-sided pressure-sensitive adhesive sheet, in general, from the viewpoint of improving the handleability and from the viewpoint of making it suitable for the use of the double-sided pressure-sensitive adhesive sheet, the adhesive force to the adherend and the peeling when peeling the release sheet are performed. The force may be set independently for both sides of the double-sided PSA sheet. For example, Patent Document 1 discloses a double-sided pressure-sensitive adhesive sheet that is adjusted so that the ratio of the adhesive strength on both sides is within a predetermined range from the viewpoint of peeling the double-sided pressure-sensitive adhesive sheet so that the adherend can be reused. It is disclosed. Further, Patent Document 2 discloses a double-sided pressure-sensitive adhesive sheet that is adjusted so that the ratio of the peeling force when peeling the release sheet on both sides is within a predetermined range from the viewpoint of improving the peelability of the release sheet. Yes.
国際公開第２０１５／１５１２２２号International Publication No. 2015/151222 特開平１１－２９７５１JP-A-11-29751
　近年、半導体装置を構成する部品として、微細な電極や端子といった、破損し易い部材をその表面に有するものが製造されている。そのような部品を、上述したように、両面粘着シートを介して支持体上に固定した場合、当該部材が、両面粘着シートとの接触により破損する場合がある。そのため、当該部材を両面粘着シートに接触させることなく、当該部品を、両面粘着シートを介して支持体上に固定する方法の開発が進められている。 In recent years, as a part constituting a semiconductor device, a part having a member easily damaged such as a fine electrode or a terminal on its surface is manufactured. As described above, when such a component is fixed on a support via a double-sided pressure-sensitive adhesive sheet, the member may be damaged due to contact with the double-sided pressure-sensitive adhesive sheet. Therefore, development of the method of fixing the said part on a support body via a double-sided adhesive sheet, without making the said member contact a double-sided adhesive sheet is advanced.
　そのような方法の例としては、両面粘着シートとして、平面視でＸ軸方向およびＹ軸方向に整列した複数の孔を有することにより格子状の形状を有しているものを使用し、部品における上記構造の部分が当該孔に収まるように、部品を両面粘着シート上に積層する方法が考えられる。あるいは、両面粘着シートとして、テープ状の両面粘着シートを複数使用し、それらの両面粘着シートを支持体上に、互いに間隔をあけて平行に貼付した後、部品における上記構造の部分が、両面粘着シートが貼付されていない領域に収まるように、部品を両面粘着シート上に積層する方法が考えられる。 As an example of such a method, as a double-sided pressure-sensitive adhesive sheet, a sheet having a lattice shape by having a plurality of holes aligned in the X-axis direction and the Y-axis direction in plan view is used. A method of laminating components on a double-sided pressure-sensitive adhesive sheet so that the portion having the above structure fits in the hole is conceivable. Alternatively, as the double-sided pressure-sensitive adhesive sheet, a plurality of tape-like double-sided pressure-sensitive adhesive sheets are used, and the double-sided pressure-sensitive adhesive sheets are pasted on the support in parallel with a distance from each other. A method of laminating components on a double-sided pressure-sensitive adhesive sheet is conceivable so as to fit in an area where no sheet is attached.
　しかしながら、このような方法において、特許文献１および２に開示されるような従来の両面粘着シートを使用した場合、両面粘着シートが支持体から剥がれ易いといった問題が生じることがわかった。上記方法では、両面粘着シートを支持体上に積層した後に、両面粘着シートにおける支持体とは反対側の粘着面に積層されている剥離シートが剥離されるが、この剥離の際に、両面粘着シートが剥離シートに引っ張られ、両面粘着シートの支持体からの剥がれが生じ易い。また、両面粘着シート上において部品の加工が完了した後、当該部品が両面粘着シートからピックアップされるが、その際においても、両面粘着シートが部品に引っ張られ、両面粘着シートの支持体からの剥がれが生じ易い。 However, it has been found that in such a method, when a conventional double-sided PSA sheet as disclosed in Patent Documents 1 and 2 is used, there is a problem that the double-sided PSA sheet easily peels off from the support. In the above method, after the double-sided pressure-sensitive adhesive sheet is laminated on the support, the release sheet laminated on the pressure-sensitive adhesive surface opposite to the support in the double-sided pressure-sensitive adhesive sheet is peeled off. The sheet is pulled by the release sheet, and the double-sided pressure-sensitive adhesive sheet is easily peeled off from the support. In addition, after the processing of a part on the double-sided pressure-sensitive adhesive sheet is completed, the part is picked up from the double-sided pressure-sensitive adhesive sheet. Is likely to occur.
　また、特許文献１および２に開示される両面粘着シートは、部品を加工する際の加熱に耐えうる耐熱性を有しない。そのため、加熱された際に、部品と支持体とを適切に固定できなかったり、両面粘着シートから部品をピックアップする際にピックアップ不良となったり、使用済みの両面粘着シートを支持体から剥離する際に、支持体上に糊残りが生じ、それにより、支持体の再利用に支障が生じるという問題がある。 In addition, the double-sided PSA sheet disclosed in Patent Documents 1 and 2 does not have heat resistance that can withstand heating when processing parts. For this reason, when heated, the component and the support cannot be properly fixed, pickup failure occurs when picking up the component from the double-sided PSA sheet, or when the used double-sided PSA sheet is peeled off from the support. In addition, there is a problem in that adhesive residue is generated on the support, thereby hindering reuse of the support.
　本発明は、このような実状に鑑みてなされたものであり、加熱を伴う工程を含む半導体装置の製造方法にて問題無く使用することができる両面粘着シート、および生産性に優れた半導体装置の製造方法を提供することを目的とする。 The present invention has been made in view of such a situation, and a double-sided pressure-sensitive adhesive sheet that can be used without any problem in a method of manufacturing a semiconductor device including a process involving heating, and a semiconductor device excellent in productivity. An object is to provide a manufacturing method.
　上記目的を達成するために、第１に本発明は、芯材と、前記芯材の一方の面側に積層された第１の粘着剤層と、前記芯材の他方の面側に積層された第２の粘着剤層と、前記第１の粘着剤層における前記芯材とは反対の面上に積層された第１の剥離シートと、前記第２の粘着剤層における前記芯材とは反対の面上に積層された第２の剥離シートとを備える両面粘着シートであって、前記第１の粘着剤層および前記第２の粘着剤層が、それぞれシリコーン系粘着剤から構成され、前記第２の剥離シートを前記第２の粘着剤層から剥離する際の剥離力Ｐ２が、３０ｍＮ／５０ｍｍ以上、１０００ｍＮ／５０ｍｍ以下であり、前記両面粘着シートから前記第１の剥離シートを剥離して露出した前記第１の粘着剤層の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付した前記両面粘着シートについて、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定される前記ステンレススチール板に対する１８０°引きはがし粘着力を粘着力Ａ１としたとき、前記剥離力Ｐ２に対する前記粘着力Ａ１の比（Ａ１／Ｐ２）が、１０以上、５０００以下であり、前記両面粘着シートから前記第１の剥離シートを剥離して露出した前記第１の粘着剤層の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付し、２６０℃で１分間加熱した後における前記両面粘着シートについて、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定される前記ステンレススチール板に対する１８０°引きはがし粘着力Ｂ１が、５００ｍＮ／２５ｍｍ以上、１５０００ｍＮ／２５ｍｍ以下であり、前記両面粘着シートから前記第２の剥離シートを剥離して露出した前記第２の粘着剤層の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付し、２６０℃で１分間加熱した後における前記両面粘着シートについて、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定される前記ステンレススチール板に対する１８０°引きはがし粘着力を粘着力Ｂ２としたとき、前記粘着力Ｂ１から前記粘着力Ｂ２を減じて得られる粘着力の差が、１０００ｍＮ／２５ｍｍ以上、２００００ｍＮ／２５ｍｍ以下であることを特徴とする両面粘着シートを提供する（発明１）。 In order to achieve the above object, first, the present invention includes a core material, a first pressure-sensitive adhesive layer laminated on one surface side of the core material, and a laminate on the other surface side of the core material. The second pressure-sensitive adhesive layer, the first release sheet laminated on the surface opposite to the core material in the first pressure-sensitive adhesive layer, and the core material in the second pressure-sensitive adhesive layer A double-sided pressure-sensitive adhesive sheet comprising a second release sheet laminated on the opposite surface, wherein the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are each composed of a silicone-based pressure-sensitive adhesive, The peeling force P2 when peeling the second release sheet from the second pressure-sensitive adhesive layer is 30 mN / 50 mm or more and 1000 mN / 50 mm or less, and the first release sheet is peeled from the double-sided pressure-sensitive adhesive sheet. The exposed adhesive surface of the first adhesive layer is a stainless steel plate ( For the double-sided PSA sheet affixed to US304), the adhesive strength A1 with respect to the peeling force P2 when the adhesive strength A1 is 180 ° peel-off adhesive strength to the stainless steel plate measured according to JIS Z0237: 2009 (A1 / P2) is 10 or more and 5000 or less, and the adhesive surface of the first pressure-sensitive adhesive layer exposed by peeling the first release sheet from the double-sided pressure-sensitive adhesive sheet is a stainless steel plate (SUS304). ), And the double-sided PSA sheet after heating at 260 ° C. for 1 minute has a 180 ° peeling adhesive strength B1 of 500 mN / 25 mm or more with respect to the stainless steel plate measured according to JIS Z0237: 2009. 15000 mN / 25 mm or less, and from the double-sided pressure-sensitive adhesive sheet, the second The double-sided pressure-sensitive adhesive sheet after sticking the adhesive surface of the second pressure-sensitive adhesive layer exposed by peeling the release sheet on a stainless steel plate (SUS304) and heating at 260 ° C. for 1 minute conforms to JIS Z0237: 2009 The adhesive strength difference obtained by subtracting the adhesive strength B2 from the adhesive strength B1 is 1000 mN / 25 mm or more and 20000 mN, when the adhesive strength B2 is the 180 ° peeling adhesive strength with respect to the stainless steel plate. Provided is a double-sided pressure-sensitive adhesive sheet characterized by being / 25 mm or less (Invention 1).
　上記発明（発明１）に係る両面粘着シートでは、第１の粘着剤層および第２の粘着剤層がそれぞれシリコーン系粘着剤から構成されることにより、優れた耐熱性を有する。また、当該両面粘着シートの使用の際には、まず、第１の剥離シートが第１の粘着剤層から剥離されるが、その際に、上記剥離力Ｐ２が上記範囲であることで、第２の剥離シートの第２の粘着剤層からの剥がれが抑制される。続いて、第１の剥離シートの剥離により露出する第１の粘着剤層の粘着面を支持体に貼付した後に、第２の粘着剤層から第２の剥離シートが剥離されるが、上記剥離力Ｐ２に対する上記粘着力Ａ１の比（Ａ１／Ｐ２）が上記範囲であることで、第２の剥離シートの剥離の際に、両面粘着シートの支持体からの剥がれが抑制される。さらに、２６０℃で１分間加熱した後の粘着力に係る上記粘着力Ｂ１と上記粘着力Ｂ２との差が上記範囲であることで、部品の加工のために加熱を伴う処理を行った後、部品を両面粘着シートからピックアップする際に、両面粘着シートの支持体からの剥がれが抑制される。そして、上記粘着力Ｂ１が上記範囲であることで、両面粘着シートの使用後、当該シートを支持体から剥がすときの糊残りが抑制される。以上により、優れた生産性で半導体装置を製造することができる。 In the double-sided pressure-sensitive adhesive sheet according to the invention (Invention 1), the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are each composed of a silicone-based pressure-sensitive adhesive, thereby having excellent heat resistance. Further, when using the double-sided pressure-sensitive adhesive sheet, first, the first release sheet is peeled from the first pressure-sensitive adhesive layer. At that time, the peel force P2 is within the above range, The peeling of the second release sheet from the second pressure-sensitive adhesive layer is suppressed. Subsequently, the second release sheet is peeled off from the second pressure-sensitive adhesive layer after the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer exposed by peeling of the first release sheet is pasted to the support. When the ratio (A1 / P2) of the adhesive force A1 to the force P2 is within the above range, peeling of the double-sided pressure-sensitive adhesive sheet from the support is suppressed when the second release sheet is peeled off. Further, the difference between the adhesive force B1 and the adhesive force B2 related to the adhesive force after heating at 260 ° C. for 1 minute is in the above range, and after performing the treatment with heating for processing the component, When the component is picked up from the double-sided pressure-sensitive adhesive sheet, peeling of the double-sided pressure-sensitive adhesive sheet from the support is suppressed. And since the said adhesive force B1 is the said range, the adhesive residue when peeling the said sheet | seat from a support body after use of a double-sided adhesive sheet is suppressed. As described above, a semiconductor device can be manufactured with excellent productivity.
　上記発明（発明１）においては、前記第１の剥離シートを前記第１の粘着剤層から剥離する際の剥離力を剥離力Ｐ１としたとき、当該剥離力Ｐ１は前記剥離力Ｐ２よりも大きいことが好ましい（発明２）。 In the said invention (invention 1), when the peeling force at the time of peeling the said 1st peeling sheet from the said 1st adhesive layer is made into peeling force P1, the said peeling force P1 is larger than the said peeling force P2. It is preferable (Invention 2).
　上記発明（発明１，２）において、前記第剥離力Ｐ１は、５０ｍＮ／５０ｍｍ以上、２０００ｍＮ／５０ｍｍ以下であることが好ましい（発明３）。 In the above inventions (Inventions 1 and 2), the first peeling force P1 is preferably 50 mN / 50 mm or more and 2000 mN / 50 mm or less (Invention 3).
　上記発明（発明１～３）において、前記粘着力Ａ１は、５００ｍＮ／２５ｍｍ以上、１５０００ｍＮ／２５ｍｍ以下であることが好ましい（発明４）。 In the above inventions (Inventions 1 to 3), the adhesive force A1 is preferably 500 mN / 25 mm or more and 15000 mN / 25 mm or less (Invention 4).
　上記発明（発明１～４）において、前記両面粘着シートから前記第２の剥離シートを剥離して露出した前記第２の粘着剤層の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付した前記両面粘着シートについて、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定される前記ステンレススチール板に対する１８０°引きはがし粘着力Ａ２は、１００ｍＮ／２５ｍｍ以上、１５０００ｍＮ／２５ｍｍ以下であることが好ましい（発明５）。 In the above inventions (Inventions 1 to 4), the double-sided pressure-sensitive adhesive in which the adhesive surface of the second pressure-sensitive adhesive layer exposed by peeling the second release sheet from the double-sided pressure-sensitive adhesive sheet is attached to a stainless steel plate (SUS304) With respect to the sheet, it is preferable that the 180 ° peeling adhesive strength A2 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is 100 mN / 25 mm or more and 15000 mN / 25 mm or less (Invention 5).
　上記発明（発明１～５）において、前記粘着力Ｂ２は、１００ｍＮ／２５ｍｍ以上、１５０００ｍＮ／２５ｍｍ以下であることが好ましい（発明６）。 In the above inventions (Inventions 1 to 5), the adhesive force B2 is preferably 100 mN / 25 mm or more and 15000 mN / 25 mm or less (Invention 6).
　上記発明（発明１～６）においては、複数の孔を有することにより格子状の形状を有し、隣り合う２つの前記孔の間の幅が、０．００１ｍｍ以上、１０ｍｍ以下であることが好ましい（発明７）。 In the above inventions (Inventions 1 to 6), it preferably has a lattice shape by having a plurality of holes, and the width between two adjacent holes is preferably 0.001 mm or more and 10 mm or less. (Invention 7).
　上記発明（発明１～６）においては、０．１ｍｍ以上、５ｍｍ以下の幅を有するテープ状の形状を有することが好ましい（発明８）。 In the above inventions (Inventions 1 to 6), it is preferable to have a tape-like shape having a width of 0.1 mm or more and 5 mm or less (Invention 8).
　上記発明（発明１～８）において、前記第１の剥離シートは、前記第２の剥離シートよりも先に剥離されることが好ましい（発明９）。 In the above inventions (Inventions 1 to 8), the first release sheet is preferably peeled off before the second release sheet (Invention 9).
　第２に本発明は、前記両面粘着シート（発明１～９）から前記第１の剥離シートを剥離する工程、前記第１の剥離シートの剥離により露出した前記第１の粘着剤層の粘着面を、支持体上に貼付する工程、前記貼付と同時にまたは前記貼付の後に、前記両面粘着シートに囲まれたまたは挟まれた、前記両面粘着シートが存在しない領域を設ける工程、前記支持体上に貼付された前記両面粘着シートから前記第２の剥離シートを剥離する工程、複数の部品を、それぞれが前記領域を覆うようにまたは前記領域にまたがるように、前記第２の粘着剤層上に積層する工程、前記部品に対して、加熱を伴う処理を行う工程、および前記部品を前記第２の粘着剤層から剥離する工程を含むことを特徴とする半導体装置の製造方法を提供する（発明１０）。 Secondly, the present invention relates to the step of peeling the first release sheet from the double-sided pressure-sensitive adhesive sheet (Invention 1 to 9), the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer exposed by peeling the first release sheet. On the support, the step of providing a region surrounded by or sandwiched by the double-sided pressure-sensitive adhesive sheet and not having the double-sided pressure-sensitive adhesive sheet, simultaneously with or after the sticking, on the support A step of peeling the second release sheet from the affixed double-sided pressure-sensitive adhesive sheet, and laminating a plurality of parts on the second pressure-sensitive adhesive layer so that each of the parts covers or spans the area A method of manufacturing a semiconductor device, comprising: a step of performing a process involving heating on the component; and a step of peeling the component from the second pressure-sensitive adhesive layer (Invention 10). )
　上記発明（発明１０）においては、前記部品を前記第２の粘着剤層から剥離する工程の後に、前記両面粘着シートを前記支持体から剥離する工程をさらに備えることが好ましい（発明１１）。 In the above invention (Invention 10), it is preferable to further include a step of peeling the double-sided pressure-sensitive adhesive sheet from the support after the step of peeling the component from the second pressure-sensitive adhesive layer (Invention 11).
　上記発明（発明１０，１１）において、前記領域は、前記第１の粘着剤層の粘着面が前記支持体に貼付された後、前記両面粘着シートから前記第１の剥離シートを除いてなる積層体に対して、当該積層体を貫通する複数の孔を形成することで設けられることが好ましい（発明１２）。 In the said invention (invention 10 and 11), the said area | region is a lamination | stacking which removes the said 1st peeling sheet from the said double-sided adhesive sheet, after the adhesive surface of the said 1st adhesive layer is affixed on the said support body. It is preferable that the body is provided by forming a plurality of holes penetrating the laminate (Invention 12).
　上記発明（発明１０，１１）において、前記領域は、前記支持体に対して、複数のテープ状の前記両面粘着シートを、互いに間隔をあけて平行に貼付することで設けられることが好ましい（発明１３）。 In the said invention (invention 10 and 11), it is preferable that the said area | region is provided by sticking the said tape-shaped double-sided adhesive sheet to the said support body at intervals mutually in parallel (invention). 13).
　本発明に係る両面粘着シートは、加熱を伴う工程を含む半導体装置の製造方法にて問題無く使用することができる。また、本発明に係る半導体装置の製造方法は、生産性に優れる。 The double-sided pressure-sensitive adhesive sheet according to the present invention can be used without any problem in a method for manufacturing a semiconductor device including a process involving heating. The method for manufacturing a semiconductor device according to the present invention is excellent in productivity.
本実施形態に係る両面粘着シートの断面図である。It is sectional drawing of the double-sided adhesive sheet which concerns on this embodiment. 本実施形態に係る半導体装置の製造方法を説明する断面図である。It is sectional drawing explaining the manufacturing method of the semiconductor device which concerns on this embodiment. 本実施形態に係る半導体装置の製造方法を説明する断面図である。It is sectional drawing explaining the manufacturing method of the semiconductor device which concerns on this embodiment.
　以下、本発明の実施形態について説明する。
〔両面粘着シート〕
　図１には、本実施形態に係る両面粘着シート１の断面図が示される。本実施形態に係る両面粘着シート１は、芯材１１と、芯材１１の一方の面側に積層された第１の粘着剤層１２と、芯材１１の他方の面側に積層された第２の粘着剤層１３と、第１の粘着剤層１２における芯材１１とは反対の面上に積層された第１の剥離シート１４と、第２の粘着剤層１３における芯材１１とは反対の面上に積層された第２の剥離シート１５とを備える。 Hereinafter, embodiments of the present invention will be described.
[Double-sided adhesive sheet]
FIG. 1 shows a cross-sectional view of a double-sided pressure-sensitive adhesive sheet 1 according to this embodiment. The double-sided pressure-sensitive adhesive sheet 1 according to this embodiment includes a core material 11, a first pressure-sensitive adhesive layer 12 laminated on one surface side of the core material 11, and a first material laminated on the other surface side of the core material 11. The first pressure-sensitive adhesive layer 13, the first release sheet 14 laminated on the surface opposite to the core material 11 in the first pressure-sensitive adhesive layer 12, and the core material 11 in the second pressure-sensitive adhesive layer 13 are And a second release sheet 15 laminated on the opposite surface.
　ここで、第１の粘着剤層１２における第１の剥離シート１４と接触する面（被着体に貼着される面）、および第２の粘着剤層１３における第２の剥離シート１５と接触する面（被着体に貼着される面）を、それぞれ粘着面といい、第１の剥離シート１４における第１の粘着剤層１２と接触する面、および第２の剥離シート１５における第２の粘着剤層１３と接触する面を、それぞれ剥離面というものとする。 Here, the surface in contact with the first release sheet 14 in the first pressure-sensitive adhesive layer 12 (surface to be adhered to the adherend) and the second release sheet 15 in the second pressure-sensitive adhesive layer 13 are contacted. The surface to be bonded (the surface to be adhered to the adherend) is referred to as an adhesive surface, the surface in contact with the first adhesive layer 12 in the first release sheet 14, and the second in the second release sheet 15. The surfaces in contact with the pressure-sensitive adhesive layer 13 are referred to as peeling surfaces.
　本実施形態に係る両面粘着シート１は、上記のように第１の剥離シート１４および第２の剥離シート１５を備えることにより、第１の粘着剤層１２および第２の粘着剤層１３の粘着面が保護されている。そのため、両面粘着シートと両面が剥離処理された一枚の剥離シートとの積層体を巻き取ってなるロールから引き出された両面粘着シートのように、一方の面のみが剥離シートにより保護されている場合とは異なり、例えば一方の粘着面を被着体に貼付する際において、他方の粘着面に塵等の外部異物が付着することが防止される。 The double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment includes the first release sheet 14 and the second release sheet 15 as described above, so that the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 are bonded. The surface is protected. Therefore, only one surface is protected by the release sheet, such as a double-sided pressure-sensitive adhesive sheet drawn out from a roll formed by winding a laminate of a double-sided pressure-sensitive adhesive sheet and a single release sheet on which both sides are peeled. Unlike the case, for example, when one adhesive surface is affixed to an adherend, external foreign matters such as dust are prevented from adhering to the other adhesive surface.
１．両面粘着シートの物性
　本実施形態に係る両面粘着シート１では、第２の剥離シート１５を第２の粘着剤層１３から剥離する際の剥離力Ｐ２が、３０ｍＮ／５０ｍｍ以上であり、４０ｍＮ／５０ｍｍ以上であることが好ましく、特に５０ｍＮ／５０ｍｍ以上であることが好ましい。また、当該剥離力Ｐ２は、１０００ｍＮ／５０ｍｍ以下であり、５００ｍＮ／５０ｍｍ以下であることが好ましく、特に３００ｍＮ／５０ｍｍ以下であることが好ましい。 1. Physical properties of the double-sided pressure-sensitive adhesive sheet In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, the peeling force P2 when peeling the second release sheet 15 from the second pressure-sensitive adhesive layer 13 is 30 mN / 50 mm or more, and 40 mN / 50 mm. Preferably, it is preferably 50 mN / 50 mm or more. Further, the peeling force P2 is 1000 mN / 50 mm or less, preferably 500 mN / 50 mm or less, and particularly preferably 300 mN / 50 mm or less.
　一般的に、両面それぞれに剥離シートが積層されている両面粘着シートから一方の剥離シートを剥離する際、他方の剥離シートの剥がれが生じ易い。特に、剥離力の大きい重剥離シートを剥離力の小さい軽剥離シートよりも先に剥離する場合、重剥離シートを剥離する際における軽剥離シートの剥離が非常に生じ易い。 Generally, when one release sheet is peeled from a double-sided pressure-sensitive adhesive sheet having release sheets laminated on both sides, the other release sheet is likely to peel off. In particular, when a heavy release sheet having a large peel force is peeled before a light release sheet having a low peel force, the light release sheet is very easily peeled when the heavy release sheet is peeled off.
　本実施形態に係る両面粘着シート１を半導体装置の製造方法に使用する場合、最初に、両面粘着シート１から第１の剥離シートが剥離される。ここで、本実施形態に係る両面粘着シート１では、後述する理由により、第１の剥離シート１４を剥離する際の剥離力Ｐ１の方が、第２の剥離シート１５を剥離する際の剥離力Ｐ２よりも大きくなる傾向にある。この場合、重剥離シートを軽剥離シートよりも先に剥離することとなるものの、本実施形態に係る両面粘着シート１では、上記剥離力Ｐ２が上記範囲であることにより、第２の剥離シート１５が第２の粘着剤層１３から剥がれることが抑制される。その結果、第２の粘着剤層の粘着面に外部異物が付着することが抑制される。また、当該剥離力Ｐ２が上記範囲であることで、剥離力Ｐ２に対する粘着力Ａ１の比（Ａ１／Ｐ２）を後述する範囲に調整し易くなり、支持体上に貼付された両面粘着シート１から第２の剥離シート１５を剥離する際に、両面粘着シート１の支持体からの剥がれを効果的に抑制することができる。なお、剥離力Ｐ２の測定方法の詳細は後述する試験例に示す通りである。 When the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment is used in a method for manufacturing a semiconductor device, first, the first release sheet is peeled from the double-sided pressure-sensitive adhesive sheet 1. Here, in the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the peeling force P1 when peeling the first release sheet 14 is greater than the peeling force when peeling the second release sheet 15 for reasons described later. It tends to be larger than P2. In this case, although the heavy release sheet is peeled before the light release sheet, in the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, the release force P2 is in the above range. Is peeled off from the second pressure-sensitive adhesive layer 13. As a result, it is suppressed that an external foreign material adheres to the adhesive surface of a 2nd adhesive layer. Moreover, it becomes easy to adjust ratio (A1 / P2) of adhesive force A1 with respect to peeling force P2 to the range mentioned later because the said peeling force P2 is the said range, From double-sided adhesive sheet 1 stuck on the support body. When peeling the 2nd peeling sheet 15, the peeling from the support body of the double-sided adhesive sheet 1 can be suppressed effectively. In addition, the detail of the measuring method of peeling force P2 is as showing to the test example mentioned later.
　なお、剥離力Ｐ１の方が剥離力Ｐ２よりも大きくなる傾向にあることは、後述するように、粘着力Ｂ１から粘着力Ｂ２を減じて得られる粘着力の差が１０００ｍＮ／２５ｍｍ以上であることに起因する。このように粘着力Ｂ１の方が粘着力Ｂ２よりも大きい場合、加熱前の粘着力を比較した場合もそのような大小関係が維持される傾向にあり、すなわち、前述した粘着力Ａ１の方が前述した粘着力Ａ２よりも大きくなる傾向にある。そのため、粘着力Ａ１を発揮する第１の粘着剤層１２の粘着面から第１の剥離シート１４を剥離する際の剥離力Ｐ１の方が、粘着力Ａ２を発揮する第２の粘着剤層１３の粘着面から第１の剥離シート１４を剥離する際の剥離力Ｐ２よりも大きくなる傾向にある。そのため、本実施形態に係る両面粘着シート１における好ましい態様では、剥離力Ｐ１が剥離力Ｐ２よりも大きい。 Note that the peel force P1 tends to be greater than the peel force P2, as described later, that the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 is 1000 mN / 25 mm or more. caused by. Thus, when the adhesive force B1 is greater than the adhesive force B2, such a magnitude relationship tends to be maintained even when the adhesive strength before heating is compared. That is, the above-described adhesive strength A1 is more likely to be maintained. It tends to be larger than the aforementioned adhesive strength A2. Therefore, the peeling force P1 when peeling the first release sheet 14 from the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer 12 that exhibits the pressure-sensitive adhesive force A1 is the second pressure-sensitive adhesive layer 13 that exhibits the pressure-sensitive adhesive force A2. It tends to be larger than the peeling force P2 when peeling the first release sheet 14 from the adhesive surface. Therefore, in the preferable aspect in the double-sided adhesive sheet 1 which concerns on this embodiment, the peeling force P1 is larger than the peeling force P2.
　本実施形態に係る両面粘着シート１では、第１の剥離シート１４を第１の粘着剤層１２から剥離する際の剥離力Ｐ１が、５０ｍＮ／５０ｍｍ以上であることが好ましく、特に１５０ｍＮ／５０ｍｍ以上であることが好ましく、さらには３００ｍＮ／５０ｍｍ以上であることが好ましい。また、当該剥離力Ｐ１は２０００ｍＮ／５０ｍｍ以下であることが好ましく、特に１０００ｍＮ／５０ｍｍ以下であることが好ましく、さらには６００ｍＮ／５０ｍｍ以下であることが好ましい。上記剥離力Ｐ１が上記範囲であることで、第１の剥離シート１４を第１の粘着剤層１２から剥離し易くなり、それに伴い、当該剥離の際に、第２の剥離シート１５と第２の粘着剤層１３との密着性に対して与える負担が低下し、第２の剥離シート１５の第２の粘着剤層１３からの意図しない剥離を効果的に抑制することができる。なお、剥離力Ｐ１の測定方法の詳細は後述する試験例に示す通りである。 In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the peel force P1 when peeling the first release sheet 14 from the first pressure-sensitive adhesive layer 12 is preferably 50 mN / 50 mm or more, particularly 150 mN / 50 mm or more. It is preferable that it is 300 mN / 50 mm or more. The peeling force P1 is preferably 2000 mN / 50 mm or less, particularly preferably 1000 mN / 50 mm or less, and more preferably 600 mN / 50 mm or less. When the peeling force P1 is within the above range, the first release sheet 14 can be easily peeled from the first pressure-sensitive adhesive layer 12, and accordingly, the second release sheet 15 and the second release sheet 15 are peeled off at the time of peeling. The burden given to the adhesiveness with the pressure-sensitive adhesive layer 13 is reduced, and unintentional peeling of the second release sheet 15 from the second pressure-sensitive adhesive layer 13 can be effectively suppressed. In addition, the detail of the measuring method of peeling force P1 is as showing to the test example mentioned later.
　本実施形態に係る両面粘着シート１では、両面粘着シート１から第１の剥離シート１４を剥離して露出した第１の粘着剤層１２の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付した両面粘着シート１について、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定されるステンレススチール板に対する１８０°引きはがし粘着力（ｍＮ／２５ｍｍ）を粘着力Ａ１としたとき、上記剥離力Ｐ２に対する上記粘着力Ａ１の比（Ａ１／Ｐ２）が、１０以上であり、１５以上であることが好ましく、特に２０以上であることが好ましい。また、当該比は、５０００以下であり、１０００以下であることが好ましく、特に５００以下であることが好ましい。 In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the double-sided pressure-sensitive adhesive layer in which the first pressure-sensitive adhesive layer 12 exposed by peeling the first release sheet 14 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304). For sheet 1, when the adhesive strength A1 is defined as 180 ° peel adhesive strength (mN / 25 mm) to a stainless steel plate measured in accordance with JIS Z0237: 2009, the ratio of the adhesive strength A1 to the peel strength P2 ( A1 / P2) is 10 or more, preferably 15 or more, and particularly preferably 20 or more. Further, the ratio is 5000 or less, preferably 1000 or less, and particularly preferably 500 or less.
　両面粘着シート１を使用する半導体装置の製造方法では、両面粘着シート１から第１の剥離シート１４を剥離した後、第１の粘着剤層１２の粘着面を支持体に貼付する。それに続いて、第２の剥離シート１５を第２の粘着剤層１３から剥離する。このとき、剥離力Ｐ２に対する粘着力Ａ１の比（Ａ１／Ｐ２）が上記範囲であることで、第１の粘着剤層１２と支持体との界面における粘着力Ａ１が、第２の剥離シート１５を剥離する際の剥離力Ｐ２よりも十分に大きいものとなり、両面粘着シート１から第２の剥離シート１５を剥離する際における支持体からの両面粘着シート１の剥がれが抑制される。このような剥がれは、特に、凹凸を有する支持体における当該凹凸が存在する面に両面粘着シート１を貼付する場合に生じ易いものの、本実施形態に係る両面粘着シート１によれば、そのような場合であっても、支持体からの両面粘着シート１の剥がれを良好に抑制することができる。 In the manufacturing method of the semiconductor device using the double-sided pressure-sensitive adhesive sheet 1, after peeling the first release sheet 14 from the double-sided pressure-sensitive adhesive sheet 1, the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer 12 is stuck to the support. Subsequently, the second release sheet 15 is released from the second pressure-sensitive adhesive layer 13. At this time, since the ratio (A1 / P2) of the adhesive force A1 to the peel force P2 is within the above range, the adhesive force A1 at the interface between the first adhesive layer 12 and the support is the second release sheet 15. Is sufficiently larger than the peeling force P2 when peeling the film, and the peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support when peeling the second release sheet 15 from the double-sided pressure-sensitive adhesive sheet 1 is suppressed. Such peeling is particularly likely to occur when the double-sided pressure-sensitive adhesive sheet 1 is affixed to the surface of the support having unevenness, where the unevenness is present, but according to the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, Even if it is a case, peeling of the double-sided adhesive sheet 1 from a support body can be suppressed favorably.
　なお、剥離力Ｐ２に対する粘着力Ａ１の比（Ａ１／Ｐ２）が１０未満であると、支持体上に両面粘着シート１を貼付した状態における、第１の粘着剤層１２と支持体との密着性が、第２の剥離シート１５と第２の粘着剤層１３との密着性と比較して小さくなり過ぎ、両面粘着シート１から第２の剥離シート１５を剥離する際に、両面粘着シート１が支持体から剥がれ易くなる。また、当該比が５０００を超えると、上記粘着力Ａ１が過度に大きいものとなり、使用済みの両面粘着シート１を支持体から剥がしにくくなり、支持体への糊残りも生じ易くなる。また、前述の通り、粘着力Ａ１は単位ｍＮ／２５ｍｍで測定されており、剥離力Ｐ２は単位ｍＮ／５０ｍｍで測定されているが、上記比（Ａ１／Ｐ２）を算出する場合、これらの単位の相違は考慮せず、それぞれの数値から比を算出するものとする。 If the ratio (A1 / P2) of the adhesive force A1 to the peel force P2 is less than 10, the first adhesive layer 12 and the support are in close contact with the double-sided pressure-sensitive adhesive sheet 1 on the support. When the second release sheet 15 is peeled from the double-sided pressure-sensitive adhesive sheet 1, the adhesiveness becomes too small as compared with the adhesion between the second release sheet 15 and the second pressure-sensitive adhesive layer 13. Becomes easy to peel off from the support. On the other hand, when the ratio exceeds 5000, the adhesive force A1 becomes excessively large, and it becomes difficult to peel off the used double-sided pressure-sensitive adhesive sheet 1 from the support, and adhesive residue on the support is likely to occur. Further, as described above, the adhesive force A1 is measured in the unit mN / 25 mm, and the peeling force P2 is measured in the unit mN / 50 mm. When calculating the ratio (A1 / P2), these units are used. The ratio is calculated from each numerical value without considering the difference.
　本実施形態に係る両面粘着シート１では、前述した粘着力Ａ１が、５００ｍＮ／２５ｍｍ以上であることが好ましく、特に１０００ｍＮ／２５ｍｍ以上であることが好ましく、さらには５０００ｍＮ／２５ｍｍ以上であることが好ましい。また、当該粘着力Ａ１は、１５０００ｍＮ／２５ｍｍ以下であることが好ましく、特に１４０００ｍＮ／２５ｍｍ以下であることが好ましく、さらには１３０００ｍＮ／２５ｍｍ以下であることが好ましい。粘着力Ａ１が上記範囲であることで、剥離力Ｐ２に対する粘着力Ａ１の比（Ａ１／Ｐ２）を前述した範囲に設定し易くなり、支持体上に貼付された両面粘着シート１から第２の剥離シート１５を剥離する際に、両面粘着シート１の支持体からの剥がれを効果的に抑制することができる。なお、粘着力Ａ１の測定方法の詳細は後述する試験例に示す通りである。 In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, the above-mentioned adhesive force A1 is preferably 500 mN / 25 mm or more, particularly preferably 1000 mN / 25 mm or more, and more preferably 5000 mN / 25 mm or more. . Further, the adhesive force A1 is preferably 15000 mN / 25 mm or less, particularly preferably 14000 mN / 25 mm or less, and more preferably 13000 mN / 25 mm or less. When the adhesive force A1 is in the above range, the ratio (A1 / P2) of the adhesive force A1 to the peel force P2 can be easily set to the above-described range, and the second adhesive sheet 1 stuck on the support is changed from the second adhesive sheet 1 to the second one. When peeling the release sheet 15, peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support can be effectively suppressed. In addition, the detail of the measuring method of adhesive force A1 is as showing to the test example mentioned later.
　本実施形態に係る両面粘着シート１では、両面粘着シート１から第１の剥離シート１４を剥離して露出した第１の粘着剤層１２の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付し、２６０℃で１分間加熱した後における両面粘着シート１について、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定されるステンレススチール板に対する１８０°引きはがし粘着力Ｂ１が、５００ｍＮ／２５ｍｍ以上であり、１０００ｍＮ／２５ｍｍ以上であることが好ましく、特に５０００ｍＮ／２５ｍｍ以上であることが好ましい。また、当該粘着力Ｂ１は、１５０００ｍＮ／２５ｍｍ以下であり、１４０００ｍＮ／２５ｍｍ以下であることが好ましく、特に１３０００ｍＮ／２５ｍｍ以下であることが好ましい。 In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, the adhesive surface of the first pressure-sensitive adhesive layer 12 exposed by peeling the first release sheet 14 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304), 260 About the double-sided pressure-sensitive adhesive sheet 1 after being heated at 1 ° C. for 1 minute, the 180 ° peeling adhesive strength B1 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is 500 mN / 25 mm or more, and 1000 mN / 25 mm or more. It is preferable that it is 5000 mN / 25 mm or more. Moreover, the said adhesive force B1 is 15000 mN / 25 mm or less, it is preferable that it is 14000 mN / 25 mm or less, and it is especially preferable that it is 13000 mN / 25 mm or less.
　両面粘着シート１を使用する半導体装置の製造方法では、部品のピックアップが完了した後に、両面粘着シート１を支持体から剥離することがあるが、このときに、上記粘着力Ｂ１が上記範囲であることにより、両面粘着シート１を支持体から良好に剥離することができ、支持体への糊残りを抑制することができる。そのため、支持体を再利用し易いものとなる。また、当該粘着力Ｂ１が上記範囲であることで、粘着力Ｂ１から粘着力Ｂ２を減じて得られる粘着力の差を後述する範囲に調整し易くなり、両面粘着シート１上に積層された部品をピックアップする際に、両面粘着シート１の支持体からの剥がれを効果的に抑制することができる。 In the method of manufacturing a semiconductor device using the double-sided pressure-sensitive adhesive sheet 1, the double-sided pressure-sensitive adhesive sheet 1 may be peeled off from the support after the component pickup is completed. At this time, the adhesive force B1 is in the above range. Thereby, the double-sided pressure-sensitive adhesive sheet 1 can be satisfactorily peeled from the support, and adhesive residue on the support can be suppressed. Therefore, it becomes easy to reuse the support. In addition, since the adhesive force B1 is in the above range, the difference in adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 can be easily adjusted to the range described later, and the components laminated on the double-sided adhesive sheet 1 When picking up, peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support can be effectively suppressed.
　なお、当該粘着力Ｂ１が１５０００ｍＮ／２５ｍを超えると、使用済みの両面粘着シート１を支持体から剥離したときに、支持体への糊残りが生じてしまい、支持体を再利用し難くなる。また、当該粘着力Ｂ１が５００ｍＮ／２５ｍｍ未満であると、両面粘着シート１上に固定した部品に対して加熱を伴う処理を行った際に、両面粘着シート１が支持体から剥がれ易いものとなり、半導体装置を適切に製造できなくなる。粘着力Ｂ１の測定方法の詳細は後述する試験例に示す通りである。 In addition, when the said adhesive force B1 exceeds 15000 mN / 25m, when the used double-sided adhesive sheet 1 is peeled from a support body, the adhesive residue to a support body will arise and it will become difficult to reuse a support body. In addition, when the adhesive force B1 is less than 500 mN / 25 mm, the double-sided pressure-sensitive adhesive sheet 1 is easily peeled off from the support when a process involving heating is performed on the component fixed on the double-sided pressure-sensitive adhesive sheet 1. The semiconductor device cannot be properly manufactured. The details of the measuring method of the adhesive strength B1 are as shown in the test examples described later.
　本実施形態に係る両面粘着シート１では、両面粘着シート１から第２の剥離シート１５を剥離して露出した第２の粘着剤層１３の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付し、２６０℃で１分間加熱した後における両面粘着シート１について、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定されるステンレススチール板に対する１８０°引きはがし粘着力（ｍＮ／２５ｍｍ）を粘着力Ｂ２としたとき、上記粘着力Ｂ１から上記粘着力Ｂ２を減じて得られる粘着力の差が、１０００ｍＮ／２５ｍｍ以上であり、１５００ｍＮ／２５ｍｍ以上であることが好ましく、特に２０００ｍＮ／２５ｍｍ以上であることが好ましい。また、当該差は、２００００ｍＮ／２５ｍｍ以下であり、１５０００ｍＮ／２５ｍｍ以下であることが好ましく、特に１３０００ｍＮ／２５ｍｍ以下であることが好ましい。 In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, the adhesive surface of the second pressure-sensitive adhesive layer 13 that is exposed by peeling the second release sheet 15 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304). For the double-sided PSA sheet 1 after heating at ℃ for 1 minute, when the 180 ° peel adhesive strength (mN / 25 mm) to the stainless steel plate measured according to JIS Z0237: 2009 is the adhesive strength B2, the above adhesive The difference in adhesive force obtained by subtracting the adhesive force B2 from the force B1 is 1000 mN / 25 mm or more, preferably 1500 mN / 25 mm or more, and particularly preferably 2000 mN / 25 mm or more. Further, the difference is 20000 mN / 25 mm or less, preferably 15000 mN / 25 mm or less, and particularly preferably 13000 mN / 25 mm or less.
　両面粘着シート１を使用する半導体装置の製造方法では、両面粘着シート１を介して支持体上に部品を貼付した後、当該部品に対して加熱を伴う処理を行う。そのため、両面粘着シート１も加熱されるものの、粘着力Ｂ１から粘着力Ｂ２を減じて得られる粘着力の差が上記範囲であることにより、両面粘着シート１から部品をピックアップする際に、両面粘着シート１の支持体からの剥がれを抑制することができる。それにより、ピックアップされる部品に両面粘着シート１が引っ張られることがなく、また、両面粘着シート１上に貼付されている部品同士が衝突することもないため、部品の損傷が抑制される。 In the manufacturing method of the semiconductor device using the double-sided pressure-sensitive adhesive sheet 1, after attaching the part on the support via the double-sided pressure-sensitive adhesive sheet 1, the part is subjected to a treatment with heating. Therefore, although the double-sided pressure-sensitive adhesive sheet 1 is also heated, the difference in the adhesive strength obtained by subtracting the adhesive strength B2 from the adhesive strength B1 is within the above range. Peeling of the sheet 1 from the support can be suppressed. Thereby, since the double-sided pressure-sensitive adhesive sheet 1 is not pulled by the components to be picked up, and the parts stuck on the double-sided pressure-sensitive adhesive sheet 1 do not collide with each other, damage to the parts is suppressed.
　なお、上記差が１０００ｍＮ／２５ｍｍ未満であると、両面粘着シート１から部品をピックアップする際に、両面粘着シート１が支持体から剥がれ易くなる。それにより、ピックアップされる部品に両面粘着シート１が引っ張られたり、両面粘着シート１上に貼付されている部品同士が衝突してしまい、部品が損傷してしまう。また、上記差が２００００ｍＮ／２５ｍｍを超えると、上記粘着力Ｂ２が極端に小さいものとなってしまい、両面粘着シート１上に部品を十分に固定することができなくなる。 In addition, when the difference is less than 1000 mN / 25 mm, the double-sided pressure-sensitive adhesive sheet 1 is easily peeled off from the support when picking up components from the double-sided pressure-sensitive adhesive sheet 1. Thereby, the double-sided pressure-sensitive adhesive sheet 1 is pulled by the parts to be picked up, or the parts stuck on the double-sided pressure-sensitive adhesive sheet 1 collide with each other, and the parts are damaged. On the other hand, when the difference exceeds 20000 mN / 25 mm, the adhesive force B2 becomes extremely small, and the components cannot be sufficiently fixed on the double-sided pressure-sensitive adhesive sheet 1.
　本実施形態に係る両面粘着シート１では、前述した粘着力Ｂ２が、１００ｍＮ／２５ｍｍ以上であることが好ましく、特に１５０ｍＮ／２５ｍｍ以上であることが好ましく、さらには５００ｍＮ／２５ｍｍ以上であることが好ましい。また、当該粘着力Ｂ２は、１５０００ｍＮ／２５ｍｍ以下であることが好ましく、特に１００００ｍＮ／２５ｍｍ以下であることが好ましく、さらには５０００ｍＮ／２５ｍｍ以下であることが好ましい。粘着力Ｂ２が上記範囲であることで、粘着力Ｂ１から粘着力Ｂ２を減じて得られる粘着力の差を前述した範囲に調整し易くなり、両面粘着シート１上に積層された部品をピックアップする際に、両面粘着シート１の支持体からの剥がれを効果的に抑制することができる。なお、粘着力Ｂ２の測定方法の詳細は後述する試験例に示す通りである。 In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, the above-described adhesive force B2 is preferably 100 mN / 25 mm or more, particularly preferably 150 mN / 25 mm or more, and more preferably 500 mN / 25 mm or more. . The adhesive force B2 is preferably 15000 mN / 25 mm or less, particularly preferably 10,000 mN / 25 mm or less, and more preferably 5000 mN / 25 mm or less. When the adhesive force B2 is in the above range, the difference in adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 can be easily adjusted to the above-described range, and components laminated on the double-sided adhesive sheet 1 are picked up. In that case, peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support can be effectively suppressed. In addition, the detail of the measuring method of adhesive force B2 is as showing to the test example mentioned later.
　本実施形態に係る両面粘着シート１では、両面粘着シート１から第２の剥離シート１５を剥離して露出した第２の粘着剤層１３の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付した両面粘着シート１について、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定されるステンレススチール板に対する１８０°引きはがし粘着力Ａ２が、１００ｍＮ／２５ｍｍ以上であることが好ましく、特に１５０ｍＮ／２５ｍｍ以上であることが好ましく、さらには５００ｍＮ／２５ｍｍ以上であることが好ましい。また、当該粘着力Ａ２は、１５０００ｍＮ／２５ｍｍ以下であることが好ましく、特に１００００ｍＮ／２５ｍｍ以下であることが好ましく、さらには５０００ｍＮ／２５ｍｍ以下であることが好ましい。当該粘着力Ａ２は、第２の剥離シート１５を剥離する際の剥離力Ｐ２の大きさにも影響するものであるため、当該粘着力Ａ２が上記範囲であることで、剥離力Ｐ２を前述した範囲に設定し易くなり、両面粘着シート１から第１の剥離シート１４を剥離する際に、両面粘着シート１からの第２の剥離シート１５の剥がれを効果的に抑制することができる。なお、粘着力Ａ２の測定方法の詳細は後述する試験例に示す通りである。 In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, the double-sided pressure-sensitive adhesive sheet in which the second pressure-sensitive adhesive layer 13 exposed by peeling the second release sheet 15 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304). With respect to the sheet 1, the 180 ° peel adhesive strength A2 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is preferably 100 mN / 25 mm or more, more preferably 150 mN / 25 mm or more. Is preferably 500 mN / 25 mm or more. The adhesive strength A2 is preferably 15000 mN / 25 mm or less, particularly preferably 10,000 mN / 25 mm or less, and more preferably 5000 mN / 25 mm or less. Since the adhesive force A2 also affects the magnitude of the peeling force P2 when peeling the second release sheet 15, the peeling force P2 is described above because the adhesive force A2 is in the above range. It becomes easy to set to a range, and when peeling the 1st peeling sheet 14 from the double-sided adhesive sheet 1, peeling of the 2nd peeling sheet 15 from the double-sided adhesive sheet 1 can be suppressed effectively. In addition, the detail of the measuring method of adhesive force A2 is as showing to the test example mentioned later.
　本実施形態に係る両面粘着シート１では、上記粘着力Ａ１から上記粘着力Ａ２を減じて得られる粘着力の差が、１０ｍＮ／２５ｍｍ以上であることが好ましく、特に３００ｍＮ／２５ｍｍ以上であることが好ましく、さらには５００ｍＮ／２５ｍｍ以上であることが好ましい。また、当該差は、３００００ｍＮ／２５ｍｍ以下であることが好ましく、特に２００００ｍＮ／２５ｍｍ以下であることが好ましく、さらには１５０００ｍＮ／２５ｍｍ以下であることが好ましい。両面粘着シート１が加熱前における粘着力Ａ１と粘着力Ａ２との差が上記範囲であることで、加熱後の粘着力Ｂ１と粘着力Ｂ２との差を前述した範囲に調整し易くなり、両面粘着シート１上に積層された部品をピックアップする際に、両面粘着シート１の支持体からの剥がれを効果的に抑制することができる。 In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the difference in adhesive strength obtained by subtracting the adhesive strength A2 from the adhesive strength A1 is preferably 10 mN / 25 mm or more, particularly 300 mN / 25 mm or more. More preferably, it is 500 mN / 25 mm or more. Further, the difference is preferably 30000 mN / 25 mm or less, particularly preferably 20000 mN / 25 mm or less, and further preferably 15000 mN / 25 mm or less. Since the difference between the adhesive strength A1 and the adhesive strength A2 before heating of the double-sided pressure-sensitive adhesive sheet 1 is in the above range, the difference between the adhesive strength B1 after heating and the adhesive strength B2 can be easily adjusted to the range described above. When picking up the component laminated | stacked on the adhesive sheet 1, peeling from the support body of the double-sided adhesive sheet 1 can be suppressed effectively.
　本実施形態に係る両面粘着シート１では、両面粘着シート１から第１の剥離シート１４を剥離して露出した第１の粘着剤層１２の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付し、１２５℃で２４時間加熱した後における両面粘着シート１について、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定されるステンレススチール板に対する１８０°引きはがし粘着力Ｃ１が、１０００ｍＮ／２５ｍｍ以上であることが好ましく、特に１５００ｍＮ／２５ｍｍ以上であることが好ましく、さらには２０００ｍＮ／２５ｍｍ以上であることが好ましい。また、当該粘着力Ｃ１は、２１０００ｍＮ／２５ｍｍ以下であることが好ましく、特に２００００ｍＮ／２５ｍｍ以下であることが好ましく、さらには１９０００ｍＮ／２５ｍｍ以下であることが好ましい。粘着力Ｃ１が上記範囲であることで、両面粘着シート１が１２５℃で２４時間といった加熱条件に晒された場合であっても、支持体への糊残りの発生を効果的に抑制することができる。なお、粘着力Ｃ１の測定方法の詳細は後述する試験例に示す通りである。 In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer 12 exposed by peeling the first release sheet 14 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304). About the double-sided pressure-sensitive adhesive sheet 1 after being heated at ℃ for 24 hours, the 180 ° peeling adhesive strength C1 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is preferably 1000 mN / 25 mm or more, particularly 1500 mN. / 25 mm or more, more preferably 2000 mN / 25 mm or more. The adhesive strength C1 is preferably 21000 mN / 25 mm or less, particularly preferably 20000 mN / 25 mm or less, and more preferably 19000 mN / 25 mm or less. When the adhesive strength C1 is in the above range, even when the double-sided adhesive sheet 1 is exposed to heating conditions such as 24 hours at 125 ° C., it is possible to effectively suppress the occurrence of adhesive residue on the support. it can. In addition, the detail of the measuring method of adhesive force C1 is as showing to the test example mentioned later.
　本実施形態に係る両面粘着シート１では、両面粘着シート１から第２の剥離シート１５を剥離して露出した第２の粘着剤層１３の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付し、１２５℃で２４時間加熱した後における両面粘着シート１について、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定されるステンレススチール板に対する１８０°引きはがし粘着力Ｃ２が、１００ｍＮ／２５ｍｍ以上であることが好ましく、特に１５０ｍＮ／２５ｍｍ以上であることが好ましく、さらには５００ｍＮ／２５ｍｍ以上であることが好ましい。また、当該粘着力Ｃ２は、２００００ｍＮ／２５ｍｍ以下であることが好ましく、特に１５０００ｍＮ／２５ｍｍ以下であることが好ましく、さらには１３０００ｍＮ／２５ｍｍ以下であることが好ましい。粘着力Ｃ２が上記範囲であることで、両面粘着シート１が１２５℃で２４時間といった加熱条件に晒された場合であっても、両面粘着シート１上への部品の固定、両面粘着シート１からの部品のピックアップを良好に行うことができる。なお、粘着力Ｃ２の測定方法の詳細は後述する試験例に示す通りである。 In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, the pressure-sensitive adhesive surface of the second pressure-sensitive adhesive layer 13 exposed by peeling the second release sheet 15 from the double-sided pressure-sensitive adhesive sheet 1 is attached to a stainless steel plate (SUS304). About the double-sided pressure-sensitive adhesive sheet 1 after being heated for 24 hours at ℃, it is preferable that the 180 ° peeling adhesive strength C2 with respect to the stainless steel plate measured in accordance with JIS Z0237: 2009 is 100 mN / 25 mm or more, particularly 150 mN. / 25 mm or more, more preferably 500 mN / 25 mm or more. The adhesive strength C2 is preferably 20000 mN / 25 mm or less, particularly preferably 15000 mN / 25 mm or less, and more preferably 13000 mN / 25 mm or less. Since the adhesive force C2 is in the above range, even when the double-sided pressure-sensitive adhesive sheet 1 is exposed to heating conditions such as 24 hours at 125 ° C., the fixing of parts on the double-sided pressure-sensitive adhesive sheet 1, The parts can be picked up satisfactorily. In addition, the detail of the measuring method of adhesive force C2 is as showing to the test example mentioned later.
　本実施形態に係る両面粘着シート１では、上記粘着力Ｃ１から上記粘着力Ｃ２を減じて得られる粘着力の差が、１０ｍＮ／２５ｍｍ以上であることが好ましく、特に３００ｍＮ／２５ｍｍ以上であることが好ましく、さらには５００ｍＮ／２５ｍｍ以上であることが好ましい。また、当該差は、３００００ｍＮ／２５ｍｍ以下であることが好ましく、特に２００００ｍＮ／２５ｍｍ以下であることが好ましく、さらには１５０００ｍＮ／２５ｍｍ以下であることが好ましい。当該差が上記範囲であることで、両面粘着シート１が１２５℃で２４時間といった加熱条件に晒された場合であっても、両面粘着シート１からの部品のピックアップを良好に行うことができる。 In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the difference in adhesive strength obtained by subtracting the adhesive strength C2 from the adhesive strength C1 is preferably 10 mN / 25 mm or more, particularly 300 mN / 25 mm or more. More preferably, it is 500 mN / 25 mm or more. Further, the difference is preferably 30000 mN / 25 mm or less, particularly preferably 20000 mN / 25 mm or less, and further preferably 15000 mN / 25 mm or less. When the difference is within the above range, even when the double-sided pressure-sensitive adhesive sheet 1 is exposed to a heating condition such as 24 hours at 125 ° C., components can be well picked up from the double-sided pressure-sensitive adhesive sheet 1.
２．両面粘着シートの構成部材
（１）芯材
　芯材１１は、第１の粘着剤層１２および第２の粘着剤層１３を積層することが可能であれば限定されないものの、特に、耐熱性を有する材料からなることが好ましい。芯材１１としては、例えば、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステルフィルム、ポリエチレン、ポリプロピレン等のポリオレフィンフィルム、トリアセチルセルロース等のセルロースフィルム、ポリイミドフィルム、ポリウレタンフィルム、ポリウレタンアクリレートフィルム、ポリ塩化ビニルフィルム、ポリ塩化ビニリデンフィルム、ポリビニルアルコールフィルム、エチレン－酢酸ビニル共重合体フィルム、ポリスチレンフィルム、ポリカーボネートフィルム、アクリル樹脂フィルム、ノルボルネン系樹脂フィルム、シクロオレフィン樹脂フィルム、液晶ポリマーフィルムなどのプラスチックフィルム；これらの２種以上の積層体などが挙げられる。プラスチックフィルムは、一軸延伸または二軸延伸されたものでもよい。上述した中でも、耐熱性を有する観点から、ポリエチレンテレフタレートフィルム、ポリブチレンテレフタレートフィルム等のポリエステル系フィルムまたはポリイミドフィルムを使用することが好ましく、特にポリイミドフィルムを使用することが好ましい。 2. Constituent member of double-sided pressure-sensitive adhesive sheet (1) Core material The core material 11 is not particularly limited as long as the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 can be laminated, but particularly has heat resistance. It is preferable to consist of materials. Examples of the core material 11 include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polyolefin films such as polyethylene and polypropylene, cellulose films such as triacetyl cellulose, polyimide films, polyurethane films, polyurethane acrylate films, poly Plastic films such as vinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, acrylic resin film, norbornene resin film, cycloolefin resin film, liquid crystal polymer film; These 2 or more types of laminated bodies etc. are mentioned. The plastic film may be uniaxially stretched or biaxially stretched. Among the above, from the viewpoint of heat resistance, it is preferable to use a polyester film or a polyimide film such as a polyethylene terephthalate film or a polybutylene terephthalate film, and it is particularly preferable to use a polyimide film.
　また、芯材１１には、その表面に設けられる第１の粘着剤層１２または第２の粘着剤層１３との密着性を向上させる目的で、所望により片面または両面に、酸化法や凹凸化法などによる表面処理、あるいはプライマー処理を施すことができる。上記酸化法としては、例えばコロナ放電処理、プラズマ放電処理、クロム酸化処理（湿式）、火炎処理、熱風処理、オゾン、紫外線照射処理などが挙げられ、また、凹凸化法としては、例えばサンドブラスト法、溶射処理法などが挙げられる。これらの表面処理法は、基材フィルムの種類に応じて適宜選ばれるが、一般にコロナ放電処理法が効果および操作性の面から好ましく用いられる。 Further, the core material 11 may be oxidized or roughened on one side or both sides as desired for the purpose of improving the adhesion with the first pressure-sensitive adhesive layer 12 or the second pressure-sensitive adhesive layer 13 provided on the surface thereof. Surface treatment by a method or the like, or primer treatment can be performed. Examples of the oxidation method include corona discharge treatment, plasma discharge treatment, chromium oxidation treatment (wet), flame treatment, hot air treatment, ozone, ultraviolet irradiation treatment, and the like. Examples include a thermal spraying method. These surface treatment methods are appropriately selected according to the type of the base film, but generally, a corona discharge treatment method is preferably used from the viewpoints of effects and operability.
　芯材１１の厚さは、３μｍ以上であることが好ましく、特に５μｍ以上であることが好ましく、さらには１５μｍ以上であることが好ましい。また、当該厚さは、３００μｍ以下であることが好ましく、特に１００μｍ以下であることが好ましく、さらには５０μｍ以下であることが好ましい。 The thickness of the core material 11 is preferably 3 μm or more, particularly preferably 5 μm or more, and more preferably 15 μm or more. The thickness is preferably 300 μm or less, particularly preferably 100 μm or less, and further preferably 50 μm or less.
（２）第１の粘着剤層および第２の粘着剤層
　本実施形態に係る両面粘着シート１では、第１の粘着剤層１２および第２の粘着剤層１３がそれぞれシリコーン系粘着剤から構成されている。このため、本実施形態に係る両面粘着シート１は優れた耐熱性を有し、両面粘着シート１の加熱によって、部品および支持体に対する粘着力が過度に低下したり、当該粘着力が過度に向上したりすることが抑制される。その結果、両面粘着シート１を介して支持体上に固定された部品に対して加熱を伴う処理を行った際においても、部品と支持体とを良好に固定できるとともに、その後の両面粘着シート１から部品をピックアップする際にはピックアップ不良が抑制され、さらには、使用済みの両面粘着シート１を支持体から剥離する際に、支持体への糊残りが抑制される。当該糊残りが抑制されることで、支持体を再利用し易いものとなる。 (2) 1st adhesive layer and 2nd adhesive layer In the double-sided adhesive sheet 1 which concerns on this embodiment, the 1st adhesive layer 12 and the 2nd adhesive layer 13 are respectively comprised from a silicone type adhesive. Has been. For this reason, the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment has excellent heat resistance, and due to the heating of the double-sided pressure-sensitive adhesive sheet 1, the pressure-sensitive adhesive force on the component and the support is excessively reduced or the pressure-sensitive adhesive force is excessively improved. It is suppressed. As a result, even when a process involving heating is performed on the component fixed on the support via the double-sided pressure-sensitive adhesive sheet 1, the component and the support can be fixed well, and the subsequent double-sided pressure-sensitive adhesive sheet 1 When picking up a part from the substrate, pick-up failure is suppressed, and further, when the used double-sided pressure-sensitive adhesive sheet 1 is peeled off from the support, adhesive residue on the support is suppressed. By suppressing the adhesive residue, the support can be easily reused.
　第１の粘着剤層１２および第２の粘着剤層１３をそれぞれ構成するシリコーン系粘着剤は、両面粘着シート１が前述した粘着力および剥離力を発揮する限り特に限定されない。第１の粘着剤層１２を構成するシリコーン系粘着剤と、第２の粘着剤層１３を構成するシリコーン系粘着剤とは、同一の組成を有していてもよいものの、前述したような、第１の粘着剤層１２側と第２の粘着剤層１３側とにおける粘着力や剥離力の違いを生じさせやすくするために、異なる組成を有することが好ましい。 The silicone-based pressure-sensitive adhesive constituting each of the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 is not particularly limited as long as the double-sided pressure-sensitive adhesive sheet 1 exhibits the above-described pressure-sensitive adhesive force and peeling force. Although the silicone-based pressure-sensitive adhesive that constitutes the first pressure-sensitive adhesive layer 12 and the silicone-based pressure-sensitive adhesive that constitutes the second pressure-sensitive adhesive layer 13 may have the same composition, In order to easily cause a difference in adhesive force or peeling force between the first pressure-sensitive adhesive layer 12 side and the second pressure-sensitive adhesive layer 13 side, it is preferable to have different compositions.
　上記シリコーン系粘着剤は、オルガノポリシロキサン、特に付加型オルガノポリシロキサン（の硬化物）を含有することが好ましい。かかるシリコーン系粘着剤は、前述した粘着力を満たし易く、また、加工性にも優れる。 The silicone-based pressure-sensitive adhesive preferably contains an organopolysiloxane, particularly an addition-type organopolysiloxane (cured product thereof). Such a silicone-based pressure-sensitive adhesive easily satisfies the above-described pressure-sensitive adhesive force and is excellent in processability.
　付加型オルガノポリシロキサンは、シロキサン結合を主骨格としアルケニル基を有するオルガノポリシロキサンとオルガノハイドロジェンポリシロキサンとを反応させて得られるものであることが好ましい。 The addition-type organopolysiloxane is preferably obtained by reacting an organopolysiloxane having a siloxane bond as a main skeleton and an alkenyl group with an organohydrogenpolysiloxane.
　シロキサン結合を主骨格としアルケニル基を有するオルガノポリシロキサンは、次の平均単位式（１）で示される化合物であって、かつ分子中に少なくとも２個のアルケニル基を有する化合物であることが好ましい。
　Ｒ１ ａＳｉＯ（４－ａ）／２・・・（１）
（式中、Ｒ１は互いに同一または異種の炭素数１～１２、好ましくは１～８の非置換または置換の１価炭化水素基であり、ａは１．５～２．８、好ましくは１．８～２．５、より好ましくは１．９５～２．０５の範囲の正数である。） The organopolysiloxane having a siloxane bond as the main skeleton and having an alkenyl group is preferably a compound represented by the following average unit formula (1) and having at least two alkenyl groups in the molecule.
R 1 a SiO (4-a) / 2 (1)
Wherein R 1 is an unsubstituted or substituted monovalent hydrocarbon group having the same or different carbon number of 1 to 12, preferably 1 to 8, and a is 1.5 to 2.8, preferably 1 .8 to 2.5, more preferably a positive number in the range of 1.95 to 2.05.)
　上記Ｒ１で示される珪素原子に結合した非置換または置換の１価炭化水素基としては、例えば、ビニル基、アリル基、プロペニル基、イソプロペニル基、ブテニル基、ヘキセニル基、シクロヘキセニル基、オクテニル基等のアルケニル基、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、ｔｅｒｔ－ブチル基、ペンチル基、ネオペンチル基、ヘキシル基、シクロヘキシル基、オクチル基、ノニル基、デシル基等のアルキル基、フェニル基、トリル基、キシリル基、ナフチル基等のアリール基、ベンジル基、フェニルエチル基、フェニルプロピル基等のアラルキル基や、これらの基の水素原子の一部または全部をフッ素、臭素、塩素等のハロゲン原子、シアノ基等で置換したもの、例えばクロロメチル基、クロロプロピル基、ブロモエチル基、トリフルオロプロピル基、シアノエチル基等が挙げられる。アルケニル基としては、硬化時間の短さおよび生産性の点から、ビニル基が好ましい。 Examples of the unsubstituted or substituted monovalent hydrocarbon group bonded to the silicon atom represented by R 1 include, for example, vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, hexenyl group, cyclohexenyl group, octenyl. Groups such as alkenyl groups, methyl groups, ethyl groups, propyl groups, isopropyl groups, butyl groups, isobutyl groups, tert-butyl groups, pentyl groups, neopentyl groups, hexyl groups, cyclohexyl groups, octyl groups, nonyl groups, decyl groups, etc. An alkyl group, a phenyl group, a tolyl group, an xylyl group, an aryl group such as a naphthyl group, an aralkyl group such as a benzyl group, a phenylethyl group, a phenylpropyl group, or a part or all of the hydrogen atoms of these groups, Substituted by halogen atoms such as bromine and chlorine, cyano groups, such as chloromethyl group, chloro A propyl group, a bromoethyl group, a trifluoropropyl group, a cyanoethyl group and the like can be mentioned. The alkenyl group is preferably a vinyl group from the viewpoint of short curing time and productivity.
　オルガノハイドロジェンポリシロキサンは、分子中にＳｉＨ基を有する。上記オルガノポリシロキサンのアルケニル基と、オルガノハイドロジェンポリシロキサンのＳｉＨ基とが反応することにより、両者は付加反応し、付加型オルガノポリシロキサンが得られる。 Organohydrogenpolysiloxane has SiH groups in the molecule. When the alkenyl group of the organopolysiloxane reacts with the SiH group of the organohydrogenpolysiloxane, both undergo an addition reaction to obtain an addition-type organopolysiloxane.
　付加型オルガノポリシロキサンは、白金触媒の存在下で良好に硬化するため、上記シリコーン系粘着剤は、白金触媒を含有することが好ましい。白金触媒としては、白金黒、塩化第２白金、塩化白金酸、塩化白金酸と１価アルコールとの反応物、塩化白金酸とオレフェン類との錯体、白金ビスアセトアセテート等を例示することができる。 Since the addition type organopolysiloxane is cured well in the presence of a platinum catalyst, the silicone-based pressure-sensitive adhesive preferably contains a platinum catalyst. Examples of the platinum catalyst include platinum black, secondary platinum chloride, chloroplatinic acid, a reaction product of chloroplatinic acid and a monohydric alcohol, a complex of chloroplatinic acid and olefins, platinum bisacetoacetate, and the like. .
　上記シリコーン系粘着剤中における白金触媒の含有量は、付加型オルガノポリシロキサン１００質量部に対して、０．０１質量部以上であることが好ましく、特に０．０５質量部以上であることが好ましい。また、当該含有量は、付加型オルガノポリシロキサン１００質量部に対して、３質量部以下であることが好ましく、特に２質量部以下であることが好ましい。白金触媒の含有量が上記の範囲内にあることにより、塗工を妨げることなく、付加型オルガノポリシロキサンを硬化させ、第１の粘着剤層１２および第２の粘着剤層１３を形成することができる。 The content of the platinum catalyst in the silicone-based pressure-sensitive adhesive is preferably 0.01 parts by mass or more, particularly preferably 0.05 parts by mass or more, with respect to 100 parts by mass of the addition type organopolysiloxane. . In addition, the content is preferably 3 parts by mass or less, particularly preferably 2 parts by mass or less, with respect to 100 parts by mass of the addition type organopolysiloxane. When the platinum catalyst content is within the above range, the addition-type organopolysiloxane is cured and the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 are formed without interfering with the coating. Can do.
　付加型オルガノポリシロキサンには、前述した剥離力および粘着力を調整する観点から、分子中に３官能性又は４官能性のシロキサン単位を含むオルガノポリシロキサン（シリコーンレジン）を含有させることができる。 The addition type organopolysiloxane can contain an organopolysiloxane (silicone resin) containing a trifunctional or tetrafunctional siloxane unit in the molecule from the viewpoint of adjusting the above-described peeling force and adhesive force.
　一般的に、シリコーン系粘着剤中におけるシリコーンレジンの含有量を多くすることで、当該粘着剤からなる粘着剤層による粘着力を大きくするとともに、当該粘着剤層に積層された剥離シートの剥離力を大きくすることができる。そのため、第１の粘着剤層１２を構成するシリコーン系粘着剤および第２の粘着剤層１３を構成するシリコーン系粘着剤のそれぞれについて、シリコーンレジンの含有量を調整することが好ましい。 Generally, by increasing the content of silicone resin in the silicone-based adhesive, the adhesive force by the adhesive layer made of the adhesive is increased, and the release force of the release sheet laminated on the adhesive layer Can be increased. Therefore, it is preferable to adjust the content of the silicone resin for each of the silicone pressure-sensitive adhesive constituting the first pressure-sensitive adhesive layer 12 and the silicone pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer 13.
　また、シリコーン系粘着剤中の架橋密度や、シリコーン系粘着剤中の触媒量を調整することで、所望の粘着力を達成することもできる。 Also, the desired adhesive strength can be achieved by adjusting the crosslinking density in the silicone adhesive and the amount of catalyst in the silicone adhesive.
　第１の粘着剤層１２の厚さは、１μｍ以上であることが好ましく、特に３μｍ以上であることが好ましく、さらには５μｍ以上であることが好ましい。また、当該厚さは、１００μｍ以下であることが好ましく、特に５０μｍ以下であることが好ましく、さらには４０μｍ以下であることが好ましい。第１の粘着剤層１２の厚さが上記範囲であることで、前述した粘着力Ａ１、粘着力Ｂ１、粘着力Ｃ１および剥離力Ｐ１を、それぞれ前述した範囲に調整し易くなる。 The thickness of the first pressure-sensitive adhesive layer 12 is preferably 1 μm or more, particularly preferably 3 μm or more, and further preferably 5 μm or more. The thickness is preferably 100 μm or less, particularly preferably 50 μm or less, and further preferably 40 μm or less. When the thickness of the 1st adhesive layer 12 is the said range, it becomes easy to adjust adhesive force A1, adhesive force B1, adhesive force C1, and peeling force P1 mentioned above to the range mentioned above, respectively.
　第２の粘着剤層１３の厚さは、１μｍ以上であることが好ましく、特に５μｍ以上であることが好ましく、さらには１０μｍ以上であることが好ましい。また、当該厚さは、１００μｍ以下であることが好ましく、特に５０μｍ以下であることが好ましく、さらには４０μｍ以下であることが好ましい。第２の粘着剤層１２の厚さが上記範囲であることで、前述した粘着力Ａ２、粘着力Ｂ２、粘着力Ｃ２および剥離力Ｐ２を、それぞれ前述した範囲に調整し易くなる。 The thickness of the second pressure-sensitive adhesive layer 13 is preferably 1 μm or more, particularly preferably 5 μm or more, and further preferably 10 μm or more. The thickness is preferably 100 μm or less, particularly preferably 50 μm or less, and further preferably 40 μm or less. When the thickness of the second pressure-sensitive adhesive layer 12 is in the above range, the above-described adhesive force A2, adhesive force B2, adhesive force C2, and peeling force P2 can be easily adjusted to the above-described ranges.
（３）第１の剥離シートおよび第２の剥離シート
　第１の剥離シート１４は、その剥離面において、第１の粘着剤層１２に対する剥離性を発揮できる限り、特に限定されない。また、第２の剥離シート１５は、前述した剥離力Ｐ２を発揮できる限り、特に限定されない。第１の剥離シート１４および第２の剥離シート１５は、それぞれ異なる剥離シートであってもよく、同種の剥離シートであってもよい。 (3) First release sheet and second release sheet The first release sheet 14 is not particularly limited as long as the release surface can exhibit the release property to the first pressure-sensitive adhesive layer 12. Moreover, the 2nd peeling sheet 15 is not specifically limited as long as the peeling force P2 mentioned above can be exhibited. The first release sheet 14 and the second release sheet 15 may be different release sheets or the same type of release sheet.
　第１の剥離シート１４および第２の剥離シート１５の構成はそれぞれ任意であり、例えば、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステルフィルム、ポリプロピレン、ポリエチレン等のポリオレフィンフィルムなどのプラスチックフィルムが挙げられる。これらの剥離面には、剥離処理が施されていることが好ましい。剥離処理に使用される剥離剤としては、例えば、シリコーン系剥離剤、フッ素系剥離剤、長鎖アルキル系剥離剤等が挙げられ、これらの中でも、シリコーン系粘着剤からなる第１の粘着剤層１２および第２の粘着剤層１３に対して良好な剥離性を示し易い、フッ素系剥離剤が好ましい。 The configurations of the first release sheet 14 and the second release sheet 15 are arbitrary, for example, a plastic film such as a polyester film such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, or a polyolefin film such as polypropylene or polyethylene. Can be mentioned. These peeling surfaces are preferably subjected to a peeling treatment. Examples of the release agent used for the release treatment include a silicone release agent, a fluorine release agent, a long-chain alkyl release agent, and the like. Among these, a first adhesive layer made of a silicone adhesive is used. A fluorine-based release agent that easily exhibits good release properties to the 12 and the second pressure-sensitive adhesive layer 13 is preferable.
　フッ素系剥離剤としては、フッ素原子を含有する化合物を含む剥離剤組成物から構成されるものが挙げられる。当該化合物は、特に、側鎖にフッ素原子を含有する基を備えるポリマーであることが好ましい。フッ素原子を含有する基としては、パーフルオロ基が挙げられ、より具体的にはパーフルオロアルキル基、パーフルオロアルキレン基等が挙げられる。特に、上記ポリマーは、前述した剥離力を調整し易いという観点から、パーフルオロアルキル基を含有することが好ましい。 Examples of the fluorine-based release agent include those composed of a release agent composition containing a compound containing a fluorine atom. The compound is particularly preferably a polymer having a group containing a fluorine atom in the side chain. Examples of the group containing a fluorine atom include a perfluoro group, and more specifically, a perfluoroalkyl group and a perfluoroalkylene group. In particular, the polymer preferably contains a perfluoroalkyl group from the viewpoint of easy adjustment of the aforementioned peeling force.
　パーフルオロアルキル基の具体例としては、ＣＦ３－ＣＦ２－基、ＣＦ３－ＣＦ２－ＣＦ２－基等が挙げられる。また、パーフルオロアルキル基は、その他の基（－Ｏ－基、－ＯＣＯ－基、アルキレン基など）を介して主鎖に結合していてもよい。 Specific examples of the perfluoroalkyl group include a CF 3 —CF 2 — group, a CF 3 —CF 2 —CF 2 — group, and the like. In addition, the perfluoroalkyl group may be bonded to the main chain through another group (—O— group, —OCO— group, alkylene group, etc.).
　第１の剥離シート１４および第２の剥離シート１５のそれぞれの厚さは、特に制限がないものの、例えば、通常２０μｍ以上、２５０μｍ以下である。 The thickness of each of the first release sheet 14 and the second release sheet 15 is not particularly limited, but is usually 20 μm or more and 250 μm or less, for example.
３．両面粘着シートの形状
　本実施形態に係る両面粘着シート１は、複数の孔を有することにより格子状の形状を有していてもよい。当該複数の孔は、両面粘着シート１上において、Ｘ軸方向およびＹ軸方向に整列していることが好ましい。本実施形態に係る両面粘着シート１を半導体装置の製造方法に使用する際、当該複数の孔は、前もって形成されていてもよく、または、当該製造方法の途中で形成されてもよい。半導体装置の製造方法においては、上記孔を覆うように部品を積層することにより、当該孔に対して、部品の表面に存在する突起等を収めることができる。 3. Shape of Double-sided Adhesive Sheet The double-sided adhesive sheet 1 according to this embodiment may have a lattice shape by having a plurality of holes. The plurality of holes are preferably aligned in the X-axis direction and the Y-axis direction on the double-sided pressure-sensitive adhesive sheet 1. When the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment is used in a method for manufacturing a semiconductor device, the plurality of holes may be formed in advance or may be formed in the middle of the manufacturing method. In the method for manufacturing a semiconductor device, by stacking components so as to cover the holes, protrusions and the like existing on the surface of the components can be accommodated in the holes.
　上述した、複数の孔を有することにより格子状の形状を有する両面粘着シート１では、隣り合う２つの孔の間の幅が、０．００１ｍｍ以上であることが好ましく、特に０．０１ｍｍ以上であることが好ましく、さらには０．１ｍｍ以上であることが好ましい。また、当該幅は、１０ｍｍ以下であることが好ましく、特に５ｍｍ以下であることが好ましく、さらには３ｍｍ以下であることが好ましい。本実施形態に係る両面粘着シート１は、剥離力Ｐ２に対する粘着力Ａ１の比（Ａ１／Ｐ２）、および粘着力Ｂ１から粘着力Ｂ２を減じて得られる粘着力の差がそれぞれ前述した範囲であることにより、上記幅が上記範囲である場合であっても、第２の剥離シート１５を剥離する際や、両面粘着シート１から部品をピックアップする際において、支持体からの両面粘着シート１の剥がれを良好に抑制することができる。 In the double-sided pressure-sensitive adhesive sheet 1 having a lattice shape by having a plurality of holes as described above, the width between two adjacent holes is preferably 0.001 mm or more, particularly 0.01 mm or more. It is preferable that it is 0.1 mm or more. The width is preferably 10 mm or less, particularly preferably 5 mm or less, and further preferably 3 mm or less. In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the ratio (A1 / P2) of the adhesive force A1 to the peeling force P2 and the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 are in the ranges described above. Thus, even when the width is in the above range, the double-sided pressure-sensitive adhesive sheet 1 is peeled off from the support when the second release sheet 15 is peeled off or when parts are picked up from the double-sided pressure-sensitive adhesive sheet 1. Can be suppressed satisfactorily.
　複数の孔を有することにより格子状の形状を有する両面粘着シート１において、孔の形状および大きさは、両面粘着シート１に積層する部品の大きさや、当該部品の表面に存在する突起等の部材の大きさに応じて設定できる。例えば、当該孔の形状は正方形、長方形または円形であってよく、正方形である場合、一辺の長さは、１ｍｍ以上であることが好ましく、特に３ｍｍ以上であることが好ましい。また、正方形である場合、一辺の長さは、２０ｍｍ以下であることが好ましく、特に１５ｍｍ以下であることが好ましい。孔の形状が長方形である場合、短辺の長さは、１ｍｍ以上であることが好ましく、特に３ｍｍ以上であることが好ましい。また、当該短辺の長さは、２０ｍｍ以下であることが好ましく、特に１５ｍｍ以下であることが好ましい。一方、長辺の長さは、３ｍｍ以上であることが好ましく、特に５ｍｍ以上であることが好ましい。また、当該長辺の長さは、２５ｍｍ以下であることが好ましく、特に２０ｍｍ以下であることが好ましい。孔の形状が円形である場合、当該円形の直径の長さは、１ｍｍ以上であることが好ましく、特に３ｍｍ以上であることが好ましい。また、当該円形の直径の長さは、２５ｍｍ以下であることが好ましく、特に２０ｍｍ以下であることが好ましい。 In the double-sided pressure-sensitive adhesive sheet 1 having a lattice shape by having a plurality of holes, the shape and size of the holes are the size of the component laminated on the double-sided pressure-sensitive adhesive sheet 1 and members such as protrusions existing on the surface of the component. Can be set according to the size of For example, the shape of the hole may be a square, a rectangle, or a circle. In the case of a square, the length of one side is preferably 1 mm or more, and particularly preferably 3 mm or more. Moreover, when it is a square, it is preferable that the length of one side is 20 mm or less, and it is especially preferable that it is 15 mm or less. When the shape of the hole is a rectangle, the length of the short side is preferably 1 mm or more, and particularly preferably 3 mm or more. In addition, the length of the short side is preferably 20 mm or less, and particularly preferably 15 mm or less. On the other hand, the length of the long side is preferably 3 mm or more, and particularly preferably 5 mm or more. Further, the length of the long side is preferably 25 mm or less, and particularly preferably 20 mm or less. When the shape of the hole is a circle, the length of the diameter of the circle is preferably 1 mm or more, and particularly preferably 3 mm or more. The length of the circular diameter is preferably 25 mm or less, and particularly preferably 20 mm or less.
　本実施形態に係る両面粘着シート１は、テープ状の形状を有していてもよい。このようなテープ状の形状を有する両面粘着シート１を半導体装置の製造方法に使用する場合には、複数の当該両面粘着シート１を、支持体に対して、互いに間隔をあけて平行に貼付する。これにより、両面粘着シート１の長さ方向に沿って存在する端面を側面とし、支持体を底部とする複数の溝を形成することができる。そして、隣り合う両面粘着シート１にまたがるように部品を積層することにより、当該溝に対して、部品の表面に存在する突起等を収めることができる。 The double-sided pressure-sensitive adhesive sheet 1 according to this embodiment may have a tape shape. When the double-sided pressure-sensitive adhesive sheet 1 having such a tape-like shape is used in a method for manufacturing a semiconductor device, a plurality of the double-sided pressure-sensitive adhesive sheets 1 are affixed in parallel to each other with a space between them. . Thereby, the some groove | channel which makes the side surface the end surface which exists along the length direction of the double-sided adhesive sheet 1 and makes a support body a bottom part can be formed. Then, by stacking the components so as to straddle the adjacent double-sided pressure-sensitive adhesive sheet 1, projections and the like existing on the surface of the component can be accommodated in the groove.
　テープ状の形状を有する両面粘着シート１においては、その幅が０．１ｍｍ以上であることが好ましく、特に０．５ｍｍ以上であることが好ましく、さらには１ｍｍ以上であることが好ましい。また、当該幅は、１０ｍｍ以下であることが好ましく、特に５ｍｍ以下であることが好ましく、さらには３ｍｍ以下であることが好ましい。本実施形態に係る両面粘着シート１は、剥離力Ｐ２に対する粘着力Ａ１の比（Ａ１／Ｐ２）、および粘着力Ｂ１から粘着力Ｂ２を減じて得られる粘着力の差がそれぞれ前述した範囲であることにより、上記幅が上記範囲である場合であっても、第２の剥離シート１５を剥離する際や、両面粘着シート１から部品をピックアップする際において、支持体からの両面粘着シート１の剥がれを良好に抑制することができる。 In the double-sided pressure-sensitive adhesive sheet 1 having a tape shape, the width is preferably 0.1 mm or more, particularly preferably 0.5 mm or more, and further preferably 1 mm or more. The width is preferably 10 mm or less, particularly preferably 5 mm or less, and further preferably 3 mm or less. In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the ratio (A1 / P2) of the adhesive force A1 to the peeling force P2 and the difference in the adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 are in the ranges described above. Thus, even when the width is in the above range, the double-sided pressure-sensitive adhesive sheet 1 is peeled off from the support when the second release sheet 15 is peeled off or when parts are picked up from the double-sided pressure-sensitive adhesive sheet 1. Can be suppressed satisfactorily.
４．両面粘着シートの製造方法
　本実施形態に係る両面粘着シート１の製造方法の例としては、芯材１１の一方の面上に第１の粘着剤層１２を形成した後、第１の粘着剤層１２における芯材１１とは反対側の面に第１の剥離シート１４を積層し、続いて、芯材１１の他方の面上に第２の粘着剤層１３を形成した後、第２の粘着剤層１３における芯材１１とは反対側の面に第２の剥離シート１５を積層する方法が挙げられる。あるいは、芯材１１の一方の面上に第２の粘着剤層１３を形成した後、第２の粘着剤層１３における芯材１１とは反対側の面に第２の剥離シート１５を積層し、続いて、芯材１１の他方の面上に第１の粘着剤層１２を形成した後、第１の粘着剤層１２における芯材１１とは反対側の面に第１の剥離シート１４を積層する方法が挙げられる。これらの方法によれば、芯材１１と第１の粘着剤層１２との間および芯材１１と第２の粘着剤層１３との間における密着性に優れた両面粘着シート１を製造することができる。 4). Manufacturing method of double-sided pressure-sensitive adhesive sheet As an example of a manufacturing method of double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the first pressure-sensitive adhesive layer 12 is formed on one surface of the core material 11 and then the first pressure-sensitive adhesive layer. 12, the first release sheet 14 is laminated on the surface opposite to the core material 11, and then the second pressure-sensitive adhesive layer 13 is formed on the other surface of the core material 11. The method of laminating | stacking the 2nd peeling sheet 15 on the surface on the opposite side to the core material 11 in the agent layer 13 is mentioned. Alternatively, after forming the second pressure-sensitive adhesive layer 13 on one surface of the core material 11, the second release sheet 15 is laminated on the surface of the second pressure-sensitive adhesive layer 13 opposite to the core material 11. Subsequently, after forming the first pressure-sensitive adhesive layer 12 on the other surface of the core material 11, the first release sheet 14 is formed on the surface of the first pressure-sensitive adhesive layer 12 opposite to the core material 11. The method of laminating is mentioned. According to these methods, the double-sided pressure-sensitive adhesive sheet 1 having excellent adhesion between the core material 11 and the first pressure-sensitive adhesive layer 12 and between the core material 11 and the second pressure-sensitive adhesive layer 13 is produced. Can do.
　芯材１１の片面上に第１の粘着剤層１２または第２の粘着剤層１３を形成する場合、例えば、シリコーン系粘着剤を構成する成分を溶媒で希釈して塗工液を調製し、当該塗工液を芯材１１の片面上に塗工し、得られた塗膜を加熱して硬化する。溶媒としては、メチルエチルケトン、トルエン、酢酸エチル、キシレン等を使用することができる。また、塗工の方法としては、ロールナイフコーター、ダイコーター、カーテンコーター、スプレーコーター、スリットコーター、ナイフコーター等を用いることができる。上記加熱条件は、例えば、９０℃以上、１８０℃以下の温度で、１分以上、５分以下の時間とすることができる。 When forming the first pressure-sensitive adhesive layer 12 or the second pressure-sensitive adhesive layer 13 on one surface of the core material 11, for example, a component constituting the silicone-based pressure-sensitive adhesive is diluted with a solvent to prepare a coating liquid, The coating liquid is applied onto one surface of the core material 11, and the obtained coating film is heated and cured. As the solvent, methyl ethyl ketone, toluene, ethyl acetate, xylene and the like can be used. As a coating method, a roll knife coater, a die coater, a curtain coater, a spray coater, a slit coater, a knife coater, or the like can be used. The said heating conditions can be made into 1 minute or more and 5 minutes or less at the temperature of 90 degreeC or more and 180 degrees C or less, for example.
〔半導体装置の製造方法〕
　本発明の一実施形態に係る半導体装置の製造方法は、前述した両面粘着シート１を使用して、半導体装置を製造する方法である。 [Method of Manufacturing Semiconductor Device]
The manufacturing method of the semiconductor device which concerns on one Embodiment of this invention is a method of manufacturing a semiconductor device using the double-sided adhesive sheet 1 mentioned above.
　本実施形態に係る半導体装置の製造方法は、本実施形態に係る両面粘着シート１から第１の剥離シート１４を剥離する工程（以下「第１剥離工程」という場合がある。）、第１の剥離シート１４の剥離により露出した第１の粘着剤層１２の粘着面を、支持体上に貼付する工程（以下「貼付工程」という場合がある。）、当該貼付と同時にまたは当該貼付の後に、両面粘着シート１に囲まれたまたは挟まれた、両面粘着シート１が存在しない領域を設ける工程（以下「領域形成工程」という場合がある。）、支持体上に貼付された両面粘着シート１から第２の剥離シート１５を剥離する工程（以下「第２剥離工程」という場合がある。）、複数の部品を、それぞれが上記領域を覆うようにまたは上記領域にまたがるように、第２の粘着剤層１３上に積層する工程（以下「部品積層工程」という場合がある。）、部品に対して、加熱を伴う処理を行う工程（以下「加熱工程」という場合がある。）、および部品を第２の粘着剤層１３から剥離する工程（以下「部品剥離工程」という場合がある。）を備える。 The method for manufacturing a semiconductor device according to the present embodiment includes a step of peeling the first release sheet 14 from the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment (hereinafter sometimes referred to as “first release step”), a first. A step of sticking the adhesive surface of the first pressure-sensitive adhesive layer 12 exposed by peeling of the release sheet 14 on a support (hereinafter sometimes referred to as “sticking step”), simultaneously with the sticking or after the sticking, From the double-sided pressure-sensitive adhesive sheet 1 affixed on the support, a step of providing a region surrounded by or sandwiched by the double-sided pressure-sensitive adhesive sheet 1 where the double-sided pressure-sensitive adhesive sheet 1 does not exist (hereinafter sometimes referred to as “region forming step”). A step of peeling the second release sheet 15 (hereinafter sometimes referred to as a “second peeling step”), a second adhesive so that each of the plurality of components covers or spans the region. Agent layer 1 A process of laminating on top (hereinafter may be referred to as “component laminating process”), a process of performing a heating process on the part (hereinafter also referred to as “heating process”), A step of peeling from the pressure-sensitive adhesive layer 13 (hereinafter sometimes referred to as “component peeling step”) is provided.
　また、本実施形態に係る半導体装置の製造方法は、部品剥離工程の後に、両面粘着シート１を支持体から剥離する工程（以下「シート剥離工程」という場合がある。）をさらに含むことが好ましい。 Moreover, it is preferable that the manufacturing method of the semiconductor device which concerns on this embodiment further includes the process (henceforth a "sheet peeling process") which peels the double-sided adhesive sheet 1 from a support body after a component peeling process. .
　以下に、本実施形態に係る半導体装置の製造方法の例として、第１の態様、第２の態様および第３の態様に係る半導体装置の製造方法を説明する。 Hereinafter, as an example of a method for manufacturing a semiconductor device according to the present embodiment, a method for manufacturing a semiconductor device according to the first aspect, the second aspect, and the third aspect will be described.
１．第１の態様
　図２および図３は、第１の態様に係る半導体装置の製造方法を説明する断面図である。これらの図を参照して、上述した各工程を以下に説明する。 1. First Embodiment FIGS. 2 and 3 are cross-sectional views illustrating a method for manufacturing a semiconductor device according to a first embodiment. With reference to these figures, each process described above will be described below.
（１）第１剥離工程
　第１剥離工程では、図２（ａ）に示されるように、本実施形態に係る両面粘着シート１から第１の剥離シート１４を剥離する。本実施形態に係る両面粘着シート１では、前述した剥離力Ｐ２が前述した範囲であることにより、第２の粘着剤層１３と第２の剥離シート１５との間における密着性が適度なものとなり、第１の剥離シート１４を剥離する際に、第２の剥離シート１５の第２の粘着剤層１３の剥がれが抑制される。これにより、第２の粘着剤層１３の粘着面上に外部異物が付着することが抑制される。 (1) 1st peeling process In a 1st peeling process, as FIG. 2 (a) shows, the 1st peeling sheet 14 is peeled from the double-sided adhesive sheet 1 which concerns on this embodiment. In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the adhesion between the second pressure-sensitive adhesive layer 13 and the second release sheet 15 becomes appropriate due to the above-described peeling force P2 being in the above-described range. When peeling the 1st peeling sheet 14, peeling of the 2nd adhesive layer 13 of the 2nd peeling sheet 15 is suppressed. Thereby, it is suppressed that an external foreign material adheres on the adhesive surface of the 2nd adhesive layer 13. FIG.
（２）貼付工程
　貼付工程では、図２（ｂ）に示されるように、第１の剥離シート１４の剥離により露出した第１の粘着剤層１２の粘着面を、支持体２上に貼付する。支持体２は、両面粘着シート１を貼付できるとともに、部品を支持でき、後述する加熱工程において加熱に耐えうるものであれば限定されず、例えば、ステンレススチール板、アルミ板、銅板等であることが好ましい。 (2) Affixing process In the affixing process, as shown in FIG. 2 (b), the adhesive surface of the first adhesive layer 12 exposed by peeling of the first release sheet 14 is stuck on the support 2. . The support 2 is not limited as long as it can attach the double-sided pressure-sensitive adhesive sheet 1 and can support components, and can withstand heating in the heating process described later, and is, for example, a stainless steel plate, an aluminum plate, a copper plate, or the like. Is preferred.
（３）領域形成工程
　領域形成工程では、図２（ｃ）に示されるように、両面粘着シート１における第１の剥離シート１４を除いてなる積層体に対して、当該積層体を貫通する複数の孔３を形成する。第１の態様に係る半導体装置の製造方法では、当該孔３が、両面粘着シート１に囲まれた、両面粘着シート１が存在しない領域となる。 (3) Region Forming Step In the region forming step, as shown in FIG. 2C, a plurality of layers that pass through the laminated body with respect to the laminated body excluding the first release sheet 14 in the double-sided pressure-sensitive adhesive sheet 1. The hole 3 is formed. In the manufacturing method of the semiconductor device according to the first aspect, the hole 3 is an area surrounded by the double-sided pressure-sensitive adhesive sheet 1 where the double-sided pressure-sensitive adhesive sheet 1 does not exist.
　なお、複数の孔３を形成する際、隣り合う２つの孔３の間の幅は、０．１ｍｍ以上とすることが好ましく、特に０．３ｍｍ以上とすることが好ましく、さらには０．５ｍｍ以上とすることが好ましい。また、当該幅は、１５ｍｍ以下とすることが好ましく、特に１０ｍｍ以下とすることが好ましく、さらには５ｍｍ以下とすることが好ましい。孔の形状は、正方形または長方形であってよい。 When forming the plurality of holes 3, the width between two adjacent holes 3 is preferably 0.1 mm or more, particularly preferably 0.3 mm or more, and more preferably 0.5 mm or more. It is preferable that The width is preferably 15 mm or less, particularly preferably 10 mm or less, and more preferably 5 mm or less. The shape of the holes may be square or rectangular.
　孔３の形成は、ブレード、レーザー、彫刻刃、カッター等を用いて両面粘着シート１を孔３の形状に切断し、不要部分を除去することで行うことができる。 Formation of the hole 3 can be performed by cutting the double-sided pressure-sensitive adhesive sheet 1 into the shape of the hole 3 using a blade, laser, engraving blade, cutter, or the like, and removing unnecessary portions.
（４）第２剥離工程
　第２剥離工程では、図３（ａ）に示されるように、支持体２上に貼付された両面粘着シート１から第２の剥離シート１５を剥離する。本実施形態に係る両面粘着シート１では、剥離力Ｐ２に対する粘着力Ａ１の比（Ａ１／Ｐ２）が前述した範囲であることにより、第２の剥離シート１５を剥離する際に、支持体２からの両面粘着シート１の剥がれが抑制される。なお、第２剥離工程は、領域形成工程の前に行ってもよい。 (4) 2nd peeling process In a 2nd peeling process, as FIG. 3 (a) shows, the 2nd peeling sheet 15 is peeled from the double-sided adhesive sheet 1 stuck on the support body 2. As shown in FIG. In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, when the ratio of the adhesive force A1 to the peel force P2 (A1 / P2) is in the above-described range, when the second release sheet 15 is peeled off, the support 2 Peeling of the double-sided PSA sheet 1 is suppressed. Note that the second peeling step may be performed before the region forming step.
（５）部品積層工程
　部品積層工程では、図３（ｂ）に示されるように、複数の部品４を第２の粘着剤層１３上に積層する。このとき、部品４が、それぞれ１つの孔３を覆うように積層する。これにより、部品４の表面に、破損し易い突起４１が存在している場合であっても、当該突起４１を孔３内に収めることが可能となり、これにより、両面粘着シート１との接触に起因する当該突起４１の破損を抑制することができる。 (5) Component Lamination Step In the component lamination step, a plurality of components 4 are laminated on the second pressure-sensitive adhesive layer 13 as shown in FIG. At this time, the components 4 are laminated so as to cover one hole 3. Thereby, even if the protrusion 41 which is easily damaged exists on the surface of the component 4, the protrusion 41 can be accommodated in the hole 3. The resulting damage to the protrusion 41 can be suppressed.
（６）加熱工程
　加熱工程では、図３（ｂ）に示されるように、複数の部品４を第２の粘着剤層１３上に積層された状態で、部品４に対して、加熱を伴う処理を行う。当該処理の例としては、ＩＲリフロー、メッキ等の薬液処理、蒸着処理、表面コート処理、乾燥のためのベーク処理、保護剤の加熱硬化等が挙げられる。また、加熱を伴う処理における加熱温度は、１００℃以上であってよく、特に１５０℃以上であってよい。また、当該加熱温度は、４００℃以下であってよく、特に３００℃以下であってよい。さらに、加熱を伴う処理における加熱時間は、１分以上であってよく、特に５分以上であってよい。また、当該加熱時間は、３００分以下であってよく、特に２００分以下であってよい。 (6) Heating step In the heating step, as shown in FIG. 3B, a process involving heating the component 4 in a state where the plurality of components 4 are stacked on the second pressure-sensitive adhesive layer 13. I do. Examples of the treatment include IR reflow, chemical treatment such as plating, vapor deposition treatment, surface coating treatment, baking treatment for drying, heat curing of the protective agent, and the like. Further, the heating temperature in the treatment involving heating may be 100 ° C. or higher, and particularly 150 ° C. or higher. Moreover, the said heating temperature may be 400 degrees C or less, and may be 300 degrees C or less especially. Furthermore, the heating time in the treatment involving heating may be 1 minute or longer, and particularly 5 minutes or longer. Moreover, the said heating time may be 300 minutes or less, and may be 200 minutes or less especially.
　本実施形態に係る両面粘着シート１では、第１の粘着剤層１２および第２の粘着剤層１３がそれぞれシリコーン系粘着剤で構成されていることにより、両面粘着シート１が優れた耐熱性を有するものとなる。これにより、上記のような加熱を伴う処理を行ったとしても、両面粘着シート１における粘着力に変化が生じ難く、続く部品剥離工程において、部品４のピックアップ不良の発生が抑制され、また、シート剥離工程において、支持体２への糊残りを抑制して、両面粘着シート１を支持体２から良好に剥離することができる。 In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, the first pressure-sensitive adhesive layer 12 and the second pressure-sensitive adhesive layer 13 are each composed of a silicone-based pressure-sensitive adhesive, whereby the double-sided pressure-sensitive adhesive sheet 1 has excellent heat resistance. It will have. Thereby, even if it performs the process with the above heating, it is hard to produce a change in the adhesive force in the double-sided pressure-sensitive adhesive sheet 1, and the occurrence of pickup failure of the component 4 is suppressed in the subsequent component peeling process. In the peeling step, it is possible to favorably peel the double-sided pressure-sensitive adhesive sheet 1 from the support 2 while suppressing the adhesive residue on the support 2.
（７）部品剥離工程
　部品剥離工程では、図３（ｃ）に示されるように、部品４を第２の粘着剤層１３から剥離する。当該剥離は、例えば、ピックアップ装置を使用して、部品４を個々にピックアップすることで行うことができる。 (7) Component peeling step In the component peeling step, the component 4 is peeled from the second pressure-sensitive adhesive layer 13 as shown in FIG. The peeling can be performed, for example, by picking up the components 4 individually using a pickup device.
　本実施形態に係る両面粘着シート１では、粘着力Ｂ１から粘着力Ｂ２を減じて得られる粘着力の差が前述した範囲であることで、両面粘着シート１の支持体２からの剥がれが抑制される。それにより、ピックアップされる部品４に両面粘着シート１が引っ張られることがなく、また、両面粘着シート１上に貼付されている部品４同士が衝突することもないため、部品４の損傷が抑制される。 In the double-sided pressure-sensitive adhesive sheet 1 according to this embodiment, peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support 2 is suppressed because the difference in adhesive force obtained by subtracting the adhesive force B2 from the adhesive force B1 is within the above-described range. The Thereby, the double-sided pressure-sensitive adhesive sheet 1 is not pulled by the component 4 to be picked up, and the parts 4 stuck on the double-sided pressure-sensitive adhesive sheet 1 do not collide with each other, so that damage to the component 4 is suppressed. The
（８）シート剥離工程
　シート剥離工程では、全ての部品４が剥離された両面粘着シート１を支持体２から剥離する。本実施形態に係る両面粘着シート１では、粘着力Ｂ１が前述した範囲であることで、第２の粘着剤層１３と支持体２との間の密着性が過度に高くなることがなく、そのため、第２の粘着剤層１３の粘着剤成分による支持体２への糊残りを生じることなく、支持体２から両面粘着シート１を良好に剥離することができる。これにより、支持体２は、粘着剤の残渣を除去する処理を行う必要なく、そのまま再利用することができる。 (8) Sheet peeling process In the sheet peeling process, the double-sided pressure-sensitive adhesive sheet 1 from which all the components 4 have been peeled is peeled from the support 2. In the double-sided pressure-sensitive adhesive sheet 1 according to the present embodiment, the adhesive force B1 is in the above-described range, so that the adhesion between the second pressure-sensitive adhesive layer 13 and the support body 2 does not become excessively high. The double-sided pressure-sensitive adhesive sheet 1 can be favorably peeled from the support 2 without causing adhesive residue on the support 2 due to the pressure-sensitive adhesive component of the second pressure-sensitive adhesive layer 13. Thereby, the support body 2 can be reused as it is without performing the process which removes the residue of an adhesive.
２．第２の態様
　第２の態様に係る半導体装置の製造方法では、前述した、複数の孔を有することにより格子状の形状を有する両面粘着シート１を使用する。当該両面粘着シート１は、予め複数の孔３が形成されているため、前述した領域形成工程において、両面粘着シート１における第１の剥離シート１４を除いてなる積層体を貫通する複数の孔３を形成する必要がない。 2. Second Aspect In the method for manufacturing a semiconductor device according to the second aspect, the double-sided pressure-sensitive adhesive sheet 1 having a lattice shape by having a plurality of holes as described above is used. Since the plurality of holes 3 are formed in advance in the double-sided pressure-sensitive adhesive sheet 1, the plurality of holes 3 penetrating the laminated body excluding the first release sheet 14 in the double-sided pressure-sensitive adhesive sheet 1 in the region forming step described above. There is no need to form.
　具体的には、第１の態様に係る半導体装置の製造方法と同様に第１剥離工程を行った後、貼付工程として、両面粘着シート１における第１の粘着剤層１２の粘着面を支持体２に貼付する。これにより、両面粘着シート１に予め形成されていた複数の孔３が、両面粘着シート１に囲まれた、両面粘着シート１が存在しない領域となる。そのため、第２の態様に係る半導体装置の製造方法では、貼付工程が、領域形成工程を兼ねることとなる。その後、第１の態様に係る半導体装置の製造方法と同様に、第２剥離工程、部品積層工程、加熱工程、部品剥離工程およびシート剥離工程を行うことができる。 Specifically, after the first peeling step is performed in the same manner as in the semiconductor device manufacturing method according to the first aspect, the adhesive surface of the first pressure-sensitive adhesive layer 12 in the double-sided pressure-sensitive adhesive sheet 1 is supported as a sticking step. Affix to 2. Thereby, the some hole 3 previously formed in the double-sided adhesive sheet 1 becomes an area | region where the double-sided adhesive sheet 1 does not exist surrounded by the double-sided adhesive sheet 1. Therefore, in the semiconductor device manufacturing method according to the second aspect, the pasting step also serves as the region forming step. Then, the 2nd peeling process, a component lamination process, a heating process, a component peeling process, and a sheet peeling process can be performed similarly to the manufacturing method of the semiconductor device concerning the 1st mode.
　第２の態様に係る半導体装置の製造方法では、第１の態様に係る半導体装置の製造方法と同様に、第１剥離工程における第２の粘着剤層１３からの第２の剥離シート１５の剥がれを抑制することができ、第２剥離工程における支持体２からの両面粘着シート１の剥がれを抑制することができ、加熱工程における両面粘着シート１の粘着力の変化を抑制することができ、部品剥離工程における両面粘着シート１の支持体２からの剥がれを抑制することができ、シート剥離工程における支持体２への糊残りを抑制することができる。 In the method for manufacturing a semiconductor device according to the second aspect, the second release sheet 15 is peeled off from the second pressure-sensitive adhesive layer 13 in the first release step, as in the method for manufacturing the semiconductor device according to the first aspect. , The peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support 2 in the second peeling step can be suppressed, the change in the adhesive force of the double-sided pressure-sensitive adhesive sheet 1 in the heating step can be suppressed, and the component Peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support 2 in the peeling process can be suppressed, and adhesive residue on the support 2 in the sheet peeling process can be suppressed.
３．第３の態様
　第３の態様に係る半導体装置の製造方法では、前述した、テープ状の形状を有する両面粘着シート１を複数使用する。具体的には、第１の態様に係る半導体装置の製造方法と同様に第１剥離工程を行った後、貼付工程として、支持体２に対して、複数のテープ状の形状を有する両面粘着シート１を、互いに間隔をあけて平行に貼付する。これにより、支持体２上に、隣り合う両面粘着シート１に挟まれた、両面粘着シート１が存在しない領域が形成される。そのため、第３の態様に係る半導体装置の製造方法では、貼付工程が、領域形成工程を兼ねることとなる。なお、両面粘着シート１ごとに、第１の剥離シート１４を剥離し、その両面粘着シート１を支持体２に貼付する作業を必要回数繰り返すことが好ましく、特に、第１の剥離シート１４を剥離しながら、それにより露出する第１の粘着剤層１２の粘着面を支持体２に貼付することが好ましい。領域形成工程を兼ねた貼付工程の完了後、第１の態様に係る半導体装置の製造方法と同様に、第２剥離工程、部品積層工程、加熱工程、部品剥離工程およびシート剥離工程を行うことができる。 3. Third Aspect In the method for manufacturing a semiconductor device according to the third aspect, a plurality of the double-sided pressure-sensitive adhesive sheets 1 having the tape shape described above are used. Specifically, the double-sided pressure-sensitive adhesive sheet having a plurality of tape-like shapes with respect to the support 2 as a pasting step after performing the first peeling step in the same manner as in the method of manufacturing a semiconductor device according to the first aspect. 1 are affixed in parallel with a space between each other. Thereby, the area | region where the double-sided adhesive sheet 1 does not exist between the adjacent double-sided adhesive sheets 1 is formed on the support body 2. Therefore, in the method for manufacturing a semiconductor device according to the third aspect, the pasting step also serves as the region forming step. In addition, it is preferable to repeat the operation | work which peels the 1st peeling sheet 14 for every double-sided adhesive sheet 1, and affixes the double-sided adhesive sheet 1 to the support body 2 as many times as necessary, and especially peels off the 1st peeling sheet 14. However, it is preferable to stick the adhesive surface of the first adhesive layer 12 exposed thereby to the support 2. After the pasting process that also serves as the region forming process is completed, the second peeling process, the component stacking process, the heating process, the component peeling process, and the sheet peeling process may be performed in the same manner as the semiconductor device manufacturing method according to the first aspect. it can.
　第３の態様に係る半導体装置の製造方法では、第１の態様に係る半導体装置の製造方法と同様に、第１剥離工程における第２の粘着剤層１３からの第２の剥離シート１５の剥がれを抑制することができ、第２剥離工程における支持体２からの両面粘着シート１の剥がれを抑制することができ、加熱工程における両面粘着シート１の粘着力の変化を抑制することができ、部品剥離工程における両面粘着シート１の支持体２からの剥がれを抑制することができ、シート剥離工程における支持体２への糊残りを抑制することができる。 In the method for manufacturing a semiconductor device according to the third aspect, the second release sheet 15 is peeled off from the second pressure-sensitive adhesive layer 13 in the first release step, as in the method for manufacturing the semiconductor device according to the first aspect. , The peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support 2 in the second peeling step can be suppressed, the change in the adhesive force of the double-sided pressure-sensitive adhesive sheet 1 in the heating step can be suppressed, and the component Peeling of the double-sided pressure-sensitive adhesive sheet 1 from the support 2 in the peeling process can be suppressed, and adhesive residue on the support 2 in the sheet peeling process can be suppressed.
　以上説明した実施形態は、本発明の理解を容易にするために記載されたものであって、本発明を限定するために記載されたものではない。したがって、上記実施形態に開示された各要素は、本発明の技術的範囲に属する全ての設計変更や均等物をも含む趣旨である。 The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.
　例えば、芯材１１と第１の粘着剤層１２との間、または芯材１１と第２の粘着剤層１３との間には、その他の層が設けられてもよい。 For example, another layer may be provided between the core material 11 and the first pressure-sensitive adhesive layer 12 or between the core material 11 and the second pressure-sensitive adhesive layer 13.
　以下、実施例等により本発明をさらに具体的に説明するが、本発明の範囲はこれらの実施例等に限定されるものではない。 Hereinafter, the present invention will be described more specifically with reference to examples and the like, but the scope of the present invention is not limited to these examples and the like.
〔実施例１～３および比較例１～５〕
　表１に示す構成成分を混合し、メチルエチルケトンにて希釈して、固形分濃度が２０質量％である、第１の粘着剤層のための粘着剤組成物の塗工液を得た。当該塗工液を、芯材としての、ポリイミドフィルム（東レ・デュポン社製，製品名「カプトン１００Ｈ」，厚さ：２５μｍ）の片面上にロールナイフコーターを用いて塗工し、得られた塗膜を１３０℃で２分間加熱して硬化させ、第１の粘着剤層を形成した。得られた第１の粘着剤層における芯材とは反対の面に、第１の剥離シートとしての、厚さ３８μｍのポリエチレンテレフタレートフィルムの片面がフッ素系剥離剤により剥離処理されてなる剥離フィルム（リンテック社製，製品名「ＳＰ－ＰＥＴ　３８Ｅ－００１０ＹＣＳ」）の剥離面を貼付し、芯材と、第１の粘着剤層と、第１の剥離シートとがこの順に積層してなる積層体を得た。なお、第１の粘着剤層の厚さを表１に示す。 [Examples 1 to 3 and Comparative Examples 1 to 5]
The components shown in Table 1 were mixed and diluted with methyl ethyl ketone to obtain a coating solution of the pressure-sensitive adhesive composition for the first pressure-sensitive adhesive layer having a solid content concentration of 20% by mass. The coating solution is applied on one side of a polyimide film (manufactured by Toray DuPont, product name “Kapton 100H”, thickness: 25 μm) as a core material using a roll knife coater. The film was cured by heating at 130 ° C. for 2 minutes to form a first pressure-sensitive adhesive layer. A release film in which one side of a 38 μm-thick polyethylene terephthalate film as a first release sheet is peeled with a fluorine-based release agent on the surface opposite to the core material in the obtained first pressure-sensitive adhesive layer ( A laminated body in which a release surface of a product name “SP-PET 38E-0010YCS” manufactured by Lintec Co., Ltd. is pasted and a core material, a first adhesive layer, and a first release sheet are laminated in this order. Obtained. The thickness of the first pressure-sensitive adhesive layer is shown in Table 1.
　続いて、表１に示す構成成分を混合し、メチルエチルケトンにて希釈して、固形分濃度が２０質量％である、第２の粘着剤層のための粘着剤組成物の塗工液を得た。当該塗工液を、上述の通り得られた積層体における芯材側の面上にロールナイフコーターを用いて塗工し、得られた塗膜を１３０℃で２分間加熱して硬化させ、第２の粘着剤層を形成した。さらに、得られた第２の粘着剤層における芯材とは反対の面に、第２の剥離シートとしての、厚さ３８μｍのポリエチレンテレフタレートフィルムの片面がフッ素系剥離剤により剥離処理されてなる剥離フィルム（リンテック社製，製品名「ＳＰ－ＰＥＴ　３８Ｅ－００１０ＹＣＳ」）の剥離面を貼付し、第２の剥離シートと、第２の粘着剤層と、芯材と、第１の粘着剤層と、第１の剥離シートとがこの順に積層してなる両面粘着シートを得た。なお、第２の粘着剤層の厚さを表１に示す。 Subsequently, the components shown in Table 1 were mixed and diluted with methyl ethyl ketone to obtain a coating solution of the pressure-sensitive adhesive composition for the second pressure-sensitive adhesive layer having a solid content concentration of 20% by mass. . The coating liquid is applied on the core-side surface of the laminate obtained as described above using a roll knife coater, and the resulting coating film is heated at 130 ° C. for 2 minutes to be cured, Two pressure-sensitive adhesive layers were formed. Further, on the surface opposite to the core material in the obtained second pressure-sensitive adhesive layer, peeling is performed by peeling one side of a 38 μm thick polyethylene terephthalate film as a second peeling sheet with a fluorine-based peeling agent. A release surface of a film (product name “SP-PET 38E-0010YCS” manufactured by Lintec Corporation) is pasted, a second release sheet, a second adhesive layer, a core material, and a first adhesive layer The double-sided pressure-sensitive adhesive sheet obtained by laminating the first release sheet in this order was obtained. The thickness of the second pressure-sensitive adhesive layer is shown in Table 1.
　ここで、表１に示す構成成分の詳細は以下の通りである。
　シリコーン系粘着剤Ａ：シリコーン粘着剤（東レ・ダウコーニング社製，製品名「ＳＤ　４５８７　Ｌ」）
　シリコーン系粘着剤Ｂ：シリコーン粘着剤（東レ・ダウコーニング社製，製品名「ＳＤ　４５８０」）
　シリコーン系粘着剤Ｃ：シリコーン粘着剤（東レ・ダウコーニング社製，製品名「ＳＤ　４５８４」）
　プライマー：プライマー（東レ・ダウコーニング社製，製品名「ＢＹ２４－７１２」）
　白金触媒：白金触媒（東レ・ダウコーニング社製，製品名「ＳＲＸ　２１２」） Here, the detail of the component shown in Table 1 is as follows.
Silicone pressure sensitive adhesive A: Silicone pressure sensitive adhesive (manufactured by Dow Corning Toray, product name “SD 4587 L”)
Silicone-based adhesive B: Silicone adhesive (manufactured by Dow Corning Toray, product name “SD 4580”)
Silicone-based adhesive C: Silicone adhesive (manufactured by Dow Corning Toray, product name “SD 4584”)
Primer: Primer (product name “BY24-712” manufactured by Toray Dow Corning)
Platinum catalyst: Platinum catalyst (product name “SRX 212” manufactured by Toray Dow Corning)
〔試験例１〕（粘着力の測定）
　実施例および比較例にて製造した両面粘着シートを２５ｍｍ幅、１００ｍｍ長に裁断した後、第１の粘着剤層の粘着面および第２の粘着剤層の粘着面のそれぞれについての粘着力（ｍＮ／２５ｍｍ）を、ＪＩＳ　Ｚ０２３７に準じて以下に説明する通り測定した。 [Test Example 1] (Measurement of adhesive strength)
After the double-sided pressure-sensitive adhesive sheets produced in Examples and Comparative Examples were cut into a width of 25 mm and a length of 100 mm, the adhesive strength (mN) for each of the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer and the pressure-sensitive adhesive surface of the second pressure-sensitive adhesive layer / 25 mm) was measured according to JIS Z0237 as described below.
　第１の粘着剤層の粘着面について粘着力を測定する場合、両面粘着シートから第２の剥離シートを剥離し、第２の粘着剤層における粘着面を露出させた。そして、当該粘着面に対し、上記剥離によって得られた第２の剥離シートの剥離面とは反対の面を、温度２３℃および相対湿度５０％の環境下において、２ｋｇゴムローラーを用いて貼付した。この操作は、第１の粘着剤層の粘着面についての粘着力の測定時において、第２の剥離シートが第２の粘着剤層から剥離して、正確な粘着力の測定が妨げられることを回避するために行うものである。 When measuring the adhesive force on the adhesive surface of the first adhesive layer, the second release sheet was peeled from the double-sided adhesive sheet to expose the adhesive surface in the second adhesive layer. And the surface opposite to the peeling surface of the 2nd peeling sheet obtained by the said peeling was stuck on the said adhesion surface using the 2kg rubber roller in the environment of temperature 23 degreeC and 50% of relative humidity. . In this operation, when measuring the adhesive force on the adhesive surface of the first pressure-sensitive adhesive layer, the second release sheet is peeled off from the second pressure-sensitive adhesive layer, preventing accurate measurement of the adhesive force. This is done to avoid it.
　その後、第１の粘着剤層から第１の剥離シートを剥離して、露出した第１の粘着剤層における粘着面を、温度２３℃および相対湿度５０％の環境下において、２ｋｇゴムローラーを用いて、支持体としてのステンレススチール板（ＳＵＳ３０４鏡面板，算術平均粗さＲａ：０．０５μｍ）の片面に貼付し、２０分間放置して、第１の剥離シートを除いた両面粘着シートとステンレススチール板とからなる試験用積層体を得た。 Thereafter, the first release sheet is peeled off from the first pressure-sensitive adhesive layer, and the exposed pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer is used at a temperature of 23 ° C. and a relative humidity of 50% using a 2 kg rubber roller. Affixed to one side of a stainless steel plate (SUS304 mirror plate, arithmetic average roughness Ra: 0.05 μm) as a support, left for 20 minutes, and double-sided adhesive sheet excluding the first release sheet and stainless steel A test laminate comprising a plate was obtained.
　得られた試験用積層体について、万能型引張試験機（島津製作所製，製品名「オートグラフＡＧ－ＩＳ」）を用いて、剥離角度１８０°および剥離速度３００ｍｍ／ｍｉｎの条件で、両面粘着シートをステンレススチール板から剥がし、その時の粘着力（ｍＮ／２５ｍｍ）を測定した。この粘着力を、第１の粘着剤層についての粘着力Ａ１（ｍＮ／２５ｍｍ）とした。その結果を表２に示す。 About the obtained test laminate, using a universal tensile tester (manufactured by Shimadzu Corporation, product name “Autograph AG-IS”), at a peeling angle of 180 ° and a peeling speed of 300 mm / min, a double-sided pressure-sensitive adhesive sheet Was peeled from the stainless steel plate, and the adhesive strength (mN / 25 mm) at that time was measured. This adhesive strength was defined as the adhesive strength A1 (mN / 25 mm) for the first adhesive layer. The results are shown in Table 2.
　第２の粘着剤層の粘着面について粘着力を測定する場合には、両面粘着シートにおける、第１の剥離シートおよび第１の粘着剤層の側と、第２の剥離シートおよび第２の粘着剤層の側とを置き換える以外、上記粘着力Ａ１の測定方法と同様に測定し、得られた粘着力を、第２の粘着剤層についての粘着力Ａ２（ｍＮ／２５ｍｍ）とした。その結果を表２に示す。 When measuring adhesive force about the adhesive surface of a 2nd adhesive layer, in the double-sided adhesive sheet, the 1st peeling sheet and the 1st adhesive layer side, the 2nd peeling sheet, and the 2nd adhesion The adhesive force was measured in the same manner as the method for measuring the adhesive strength A1 except that the adhesive layer side was replaced, and the obtained adhesive strength was defined as the adhesive strength A2 (mN / 25 mm) for the second adhesive layer. The results are shown in Table 2.
　さらに、上述のように測定された粘着力Ａ１の値から粘着力Ａ２の値を減じ、これらの粘着力の差（Ａ１－Ａ２）（ｍＮ／２５ｍｍ）を算出した。その結果を表２に示す。 Furthermore, the value of the adhesive strength A2 was subtracted from the value of the adhesive strength A1 measured as described above, and the difference between these adhesive strengths (A1-A2) (mN / 25 mm) was calculated. The results are shown in Table 2.
〔試験例２〕（加熱後の粘着力の測定）
　試験例１と同様に試験用積層体を得た後、当該試験用積層体を、２６０℃で１分間加熱した。当該加熱条件を、加熱条件１とする。当該加熱後の試験用積層体について、試験例１と同様に、第１の粘着剤層および第２の粘着剤層についての粘着力（ｍＮ／２５ｍｍ）をそれぞれ測定した。得られた粘着力を、それぞれ、第１の粘着剤層についての加熱条件１における粘着力Ｂ１（ｍＮ／２５ｍｍ）、および第２の粘着剤層についての加熱条件１における粘着力Ｂ２（ｍＮ／２５ｍｍ）とした。その結果を表２に示す。 [Test Example 2] (Measurement of adhesive strength after heating)
After obtaining the test laminate in the same manner as in Test Example 1, the test laminate was heated at 260 ° C. for 1 minute. The heating condition is referred to as heating condition 1. About the laminated body for a test after the heating, in the same manner as in Test Example 1, the adhesive strength (mN / 25 mm) for the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was measured. The obtained adhesive strengths were respectively determined as adhesive strength B1 (mN / 25 mm) in heating condition 1 for the first adhesive layer and adhesive strength B2 (mN / 25 mm) in heating condition 1 for the second adhesive layer. ). The results are shown in Table 2.
　さらに、上述のように測定された粘着力Ｂ１の値から粘着力Ｂ２の値を減じ、これらの粘着力の差（Ｂ１－Ｂ２）（ｍＮ／２５ｍｍ）を算出した。その結果を表２に示す。 Furthermore, the value of the adhesive strength B2 was subtracted from the value of the adhesive strength B1 measured as described above, and the difference between these adhesive strengths (B1-B2) (mN / 25 mm) was calculated. The results are shown in Table 2.
　また、試験例１と同様に試験用積層体を得た後、当該試験用積層体を、１２５℃で２４時間加熱した。当該加熱条件を、加熱条件２とする。当該加熱後の試験用積層体について、試験例１と同様に、第１の粘着剤層および第２の粘着剤層についての粘着力（ｍＮ／２５ｍｍ）をそれぞれ測定した。得られた粘着力を、それぞれ、第１の粘着剤層についての加熱条件２における粘着力Ｃ１（ｍＮ／２５ｍｍ）、および第２の粘着剤層についての加熱条件２における粘着力Ｃ２（ｍＮ／２５ｍｍ）とした。その結果を表２に示す。 Moreover, after obtaining the test laminate as in Test Example 1, the test laminate was heated at 125 ° C. for 24 hours. The heating condition is referred to as heating condition 2. About the laminated body for a test after the heating, in the same manner as in Test Example 1, the adhesive strength (mN / 25 mm) for the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was measured. The obtained adhesive strengths were determined as follows: adhesive strength C1 (mN / 25 mm) under heating condition 2 for the first adhesive layer and adhesive strength C2 (mN / 25 mm) under heating condition 2 for the second adhesive layer, respectively. ). The results are shown in Table 2.
　さらに、上述のように測定された粘着力Ｃ１の値から粘着力Ｃ２の値を減じ、これらの粘着力の差（Ｃ１－Ｃ２）（ｍＮ／２５ｍｍ）を算出した。その結果を表２に示す。 Furthermore, the value of the adhesive strength C2 was subtracted from the value of the adhesive strength C1 measured as described above, and the difference between these adhesive strengths (C1-C2) (mN / 25 mm) was calculated. The results are shown in Table 2.
〔試験例３〕（剥離力の測定）
　実施例および比較例にて製造した両面粘着シートを５０ｍｍ幅、２００ｍｍ長に裁断した後、第１の剥離シートおよび第２の剥離シートのそれぞれについての剥離力（ｍＮ／５０ｍｍ）を、ＪＩＳ　Ｚ０２３７に準じて以下に説明する通り測定した。 [Test Example 3] (Measurement of peel force)
After the double-sided pressure-sensitive adhesive sheets produced in Examples and Comparative Examples are cut into a width of 50 mm and a length of 200 mm, the peeling force (mN / 50 mm) for each of the first release sheet and the second release sheet is applied to JIS Z0237. Accordingly, the measurement was performed as described below.
　第１の剥離シートについて剥離力を測定する場合、両面粘着シートから第２の剥離シートを剥離し、露出した第２の粘着剤層における粘着面を、温度２３℃および相対湿度５０％の環境下において、２ｋｇゴムローラーを用いて、支持体としてのステンレススチール板（ＳＵＳ３０４鏡面板，算術平均粗さＲａ：０．０５μｍ）の片面に貼付した。貼付から２０分経過後、万能型引張試験機（島津製作所製，製品名「オートグラフＡＧ－ＩＳ」）を用いて、剥離角度１８０°および剥離速度３００ｍｍ／ｍｉｎの条件で、第１の剥離シートを両面粘着シートにおける第１の粘着剤層から剥がし、その時の剥離力（ｍＮ／５０ｍｍ）を測定した。この剥離力を、第１の剥離シートについての剥離力Ｐ１（ｍＮ／５０ｍｍ）とした。その結果を表２に示す。 When measuring the peel strength of the first release sheet, the second release sheet is peeled from the double-sided pressure-sensitive adhesive sheet, and the pressure-sensitive adhesive surface of the exposed second pressure-sensitive adhesive layer is placed in an environment at a temperature of 23 ° C. and a relative humidity of 50%. In Example 2, a 2 kg rubber roller was used to attach to a single side of a stainless steel plate (SUS304 mirror plate, arithmetic average roughness Ra: 0.05 μm) as a support. 20 minutes after sticking, using a universal tensile tester (manufactured by Shimadzu Corporation, product name “Autograph AG-IS”) under the conditions of a peeling angle of 180 ° and a peeling speed of 300 mm / min, the first release sheet Was peeled from the first pressure-sensitive adhesive layer in the double-sided pressure-sensitive adhesive sheet, and the peel force (mN / 50 mm) at that time was measured. This peeling force was defined as a peeling force P1 (mN / 50 mm) for the first release sheet. The results are shown in Table 2.
　第２の剥離シートについて剥離力を測定する場合には、両面粘着シートにおける、第１の剥離シートおよび第１の粘着剤層の側と、第２の剥離シートおよび第２の粘着剤層の側とを置き換える以外、上記剥離力Ｐ１の測定方法と同様に測定し、得られた剥離力を、第２の剥離シートについての剥離力Ｐ２（ｍＮ／５０ｍｍ）とした。その結果を表２に示す。 When measuring peeling force about a 2nd peeling sheet, in the double-sided adhesive sheet, the 1st peeling sheet and the 1st adhesive layer side, the 2nd peeling sheet and the 2nd adhesive layer side Except for replacing, the measurement was performed in the same manner as the measurement method of the peel force P1, and the peel force thus obtained was defined as the peel force P2 (mN / 50 mm) for the second release sheet. The results are shown in Table 2.
　さらに、上述のように測定された剥離力Ｐ２に対する、試験例１において測定された粘着力Ａ１の比（Ａ１／Ｐ２）を算出した。その結果を表２に示す。 Furthermore, the ratio (A1 / P2) of the adhesive force A1 measured in Test Example 1 to the peel force P2 measured as described above was calculated. The results are shown in Table 2.
〔試験例４〕（支持体貼付試験）
（１）試験用半導体パッケージの作製
　銅箔張り積層板（三菱ガス化学社製，製品名「ＣＣＬ-ＨＬ８３０」，銅箔の厚さ：１８μｍ）における銅箔に回路パターンを形成した後、当該パターン上にソルダーレジスト（太陽インキ社製，製品名「ＰＳＲ-４０００　ＡＵＳ３０３」）を積層してなる基板(ちの技研社製，製品名「ＬＮ００１Ｅ－００１　ＰＣＢ（Ａｕ）ＡＵＳ３０３」)を用意した。 [Test Example 4] (Support sticking test)
(1) Preparation of test semiconductor package After forming a circuit pattern on a copper foil in a copper foil-clad laminate (Mitsubishi Gas Chemical Co., Ltd., product name “CCL-HL830”, copper foil thickness: 18 μm), the pattern A substrate (product name “LN001E-001 PCB (Au) AUS303”, manufactured by Chino Giken Co., Ltd.), on which a solder resist (product name “PSR-4000 AUS303”) was laminated, was prepared.
　上記基板に対して、チップを搭載することなく、封止装置(アピックヤマダ社製，製品名「ＭＰＣ-０６Ｍ ＴｒｉＡｌ Ｐｒｅｓｓ」)を用いて、モールド樹脂(京セラケミカル社製，製品名「ＫＥ-１１００ＡＳ３」)で、封止厚さ４００μｍとなるように封止した。その後、モールド樹脂を１７５℃で５時間加熱することで硬化させた。 Without mounting a chip on the above-mentioned substrate, a molding resin (manufactured by Kyocera Chemical Co., product name “KE-1100AS3”) using a sealing device (manufactured by Apic Yamada Co., Ltd., product name “MPC-06M TriAl Press”). ) Was sealed to a sealing thickness of 400 μm. Thereafter, the mold resin was cured by heating at 175 ° C. for 5 hours.
　続いて、封止された基板をダイシングテープ（リンテック社製，製品名「Ａｄｗｉｌｌ　Ｄ－５１０Ｔ」）に貼付した後、ダイシング装置（ディスコ社製，製品名「ＤＦＤ６５１」）に設置して、ダイシングを行うことで、８ｍｍ×８ｍｍのサイズを有する試験用半導体パッケージを得た。 Subsequently, the sealed substrate is attached to a dicing tape (product name “Adwill D-510T” manufactured by Lintec Corporation), and then placed on a dicing apparatus (product name “DFD651” manufactured by Disco Corporation) for dicing. As a result, a test semiconductor package having a size of 8 mm × 8 mm was obtained.
（２）支持体貼付試験の実施
　実施例および比較例にて製造した両面粘着シートから第１の剥離シートを剥離し、露出した第１の粘着剤層の粘着面をステンレススチール板（ＳＵＳ３０４鏡面板，算術平均粗さＲａ：０．０５μｍ，寸法：１５ｃｍ×７ｃｍ×０．５ｍｍ）の片面に貼付した。 (2) Implementation of support sticking test The first release sheet was peeled from the double-sided PSA sheet produced in the Examples and Comparative Examples, and the exposed adhesive surface of the first PSA layer was a stainless steel plate (SUS304 mirror plate). , Arithmetic average roughness Ra: 0.05 μm, dimensions: 15 cm × 7 cm × 0.5 mm).
　その後、ステンレススチール板上において、両面粘着シートが格子状となるように、両面粘着シートの不要部分を、カッターを用いて切除した。具体的には、両面粘着シートの縦方向および横方向に３ｍｍ間隔で整列する、それぞれ６ｍｍ×６ｍｍのサイズを有する複数の矩形の領域を、カッターを用いて切り抜いた。 Then, on the stainless steel plate, unnecessary portions of the double-sided pressure-sensitive adhesive sheet were cut out with a cutter so that the double-sided pressure-sensitive adhesive sheet was in a lattice shape. Specifically, a plurality of rectangular areas each having a size of 6 mm × 6 mm, which are aligned at intervals of 3 mm in the longitudinal and lateral directions of the double-sided pressure-sensitive adhesive sheet, were cut out using a cutter.
　続いて、両面粘着シートから第２の剥離シートを剥離し、第２の粘着剤層における粘着面を露出させた。その後、当該粘着面に対して、上記工程（１）において製造した半導体パッケージを、ピンセットを用いて、温度２３℃および相対湿度５０％の環境下で載置し、２ｋｇゴムローラーを用いて圧着した。このとき、両面粘着シートの粘着面と、試験用半導体パッケージにおける封止された面とが接触するように載置した。また、両面粘着シートに形成された孔を試験用半導体パッケージにより覆うように載置した。より具体的には、平面視において、試験用半導体パッケージの重心と、両面粘着シートに形成された孔の重心とが一致するように載置した。これにより、複数の試験用半導体パッケージが両面粘着シートを介してステンレススチール板に貼付された積層体を得た。 Then, the 2nd peeling sheet was peeled from the double-sided adhesive sheet, and the adhesive surface in the 2nd adhesive layer was exposed. Thereafter, the semiconductor package manufactured in the above step (1) was placed on the adhesive surface using tweezers in an environment of a temperature of 23 ° C. and a relative humidity of 50%, and pressure-bonded using a 2 kg rubber roller. . At this time, it was placed so that the adhesive surface of the double-sided adhesive sheet and the sealed surface of the test semiconductor package were in contact. Moreover, it mounted so that the hole formed in the double-sided adhesive sheet might be covered with the semiconductor package for a test. More specifically, it was placed so that the center of gravity of the test semiconductor package coincided with the center of gravity of the hole formed in the double-sided pressure-sensitive adhesive sheet in plan view. Thereby, the laminated body by which the several semiconductor package for a test was affixed on the stainless steel board via the double-sided adhesive sheet was obtained.
　次に、得られた積層体を、リフロー炉（相模理工社製，製品名「ＷＬ－１５－２０ＤＮＸ型」）内にて、最高温度２４０℃、加熱時間１分間の条件でＩＲリフローを１回行なった。その後、リフロー炉から積層体を取り出し、常温まで冷却した後に、ピンセットを用いて、両面粘着シートから試験用半導体パッケージを個々にピックアップした。全ての試験用半導体パッケージのピックアップが完了した後、両面粘着シートをステンレススチール板から剥離した。 Next, the obtained laminate is subjected to IR reflow once in a reflow furnace (product name “WL-15-20DNX type” manufactured by Sagami Riko Co., Ltd.) under the conditions of a maximum temperature of 240 ° C. and a heating time of 1 minute. I did it. Then, after taking out the laminated body from the reflow furnace and cooling to room temperature, the semiconductor package for a test was individually picked up from the double-sided adhesive sheet using tweezers. After the pickup of all the test semiconductor packages was completed, the double-sided adhesive sheet was peeled off from the stainless steel plate.
（３）評価
　上記工程（２）に記載される処理において、以下の４つの評価項目を確認し、後述する評価基準に基づいて「○」、「×」および「△」の３段階で評価した。結果を表２に示す。 (3) Evaluation In the process described in the above step (2), the following four evaluation items were confirmed and evaluated in three stages of “◯”, “×” and “Δ” based on the evaluation criteria described later. . The results are shown in Table 2.
（評価項目）
　項目１：両面粘着シートから第１の剥離シートを剥離する際における、第２の粘着剤層と第２の剥離シートとの界面における剥がれの有無
　項目２：ステンレススチール板上に貼付された両面粘着シートから第２の剥離シートを剥離する際における、ステンレススチール板と両面粘着シートとの界面における剥がれの有無
　項目３：両面粘着シートから試験用半導体パッケージをピックアップする際における、ステンレススチール板と両面粘着シートとの界面における剥がれの有無
　項目４：ステンレススチール板から両面粘着シートを剥離した後における、ステンレススチール板表面における第１の粘着剤層を構成していた粘着剤残渣の有無 (Evaluation item)
Item 1: Existence of peeling at the interface between the second pressure-sensitive adhesive layer and the second release sheet when the first release sheet is peeled from the double-sided pressure-sensitive adhesive sheet Item 2: Double-sided adhesive stuck on a stainless steel plate Existence of peeling at the interface between the stainless steel plate and the double-sided adhesive sheet when the second release sheet is peeled off from the sheet Item 3: Stainless steel plate and double-sided adhesive when picking up the test semiconductor package from the double-sided adhesive sheet Presence or absence of peeling at the interface with the sheet Item 4: Presence or absence of the adhesive residue constituting the first adhesive layer on the stainless steel plate surface after peeling the double-sided adhesive sheet from the stainless steel plate
（評価基準）
　○：目視により明確に「無」と判断できた。
　△：目視では明確に判断できなかったものの、ルーペを用いた場合に「無」と判断できた。
　×：目視により「有」と判断できた。 (Evaluation criteria)
○: It was clearly judged as “none” by visual observation.
(Triangle | delta): Although it was not able to judge clearly by visual observation, it was judged that it was "none" when using a loupe.
X: “Yes” was judged by visual observation.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
　表２から分かるように、実施例で得られた両面粘着シートは、第１の剥離シートの剥離の際における第２の粘着剤層からの第２の剥離シートの剥がれ、第２の剥離シートを剥離する際における両面粘着シートの支持体からの剥がれ、および、部品をピックアップする際における両面粘着シートの支持体からの剥がれが、いずれも生じなかった。さらに、実施例で得られた両面粘着シートでは、使用済みの両面粘着シートを支持体から剥離した際に、支持体への糊残りも生じ難かった。 As can be seen from Table 2, the double-sided PSA sheet obtained in the examples peels off the second PSA sheet from the second PSA layer when the first PSA sheet is peeled off. Neither peeling of the double-sided pressure-sensitive adhesive sheet from the support during peeling, nor peeling of the double-sided pressure-sensitive adhesive sheet from the support when picking up parts occurred. Furthermore, in the double-sided pressure-sensitive adhesive sheet obtained in the examples, when the used double-sided pressure-sensitive adhesive sheet was peeled from the support, adhesive residue on the support was hardly generated.
　本発明の両面粘着シートは、損傷し易い部材を表面に有する部品を備える半導体装置の製造方法に好適に使用することができる。 The double-sided pressure-sensitive adhesive sheet of the present invention can be suitably used in a method for producing a semiconductor device including a part having a fragile member on its surface.
１…両面粘着シート
　１１…芯材
　１２…第１の粘着剤層
　１３…第２の粘着剤層
　１４…第１の剥離シート
　１５…第２の剥離シート
２…支持体
３…孔
４…部品
　４１…突起 DESCRIPTION OF SYMBOLS 1 ... Double-sided adhesive sheet 11 ... Core material 12 ... 1st adhesive layer 13 ... 2nd adhesive layer 14 ... 1st peeling sheet 15 ... 2nd peeling sheet 2 ... Support body 3 ... Hole 4 ... Parts 41 ... protrusions

Claims (13)

  1. 　芯材と、前記芯材の一方の面側に積層された第１の粘着剤層と、前記芯材の他方の面側に積層された第２の粘着剤層と、前記第１の粘着剤層における前記芯材とは反対の面上に積層された第１の剥離シートと、前記第２の粘着剤層における前記芯材とは反対の面上に積層された第２の剥離シートとを備える両面粘着シートであって、
    　前記第１の粘着剤層および前記第２の粘着剤層が、それぞれシリコーン系粘着剤から構成され、
    　前記第２の剥離シートを前記第２の粘着剤層から剥離する際の剥離力Ｐ２が、３０ｍＮ／５０ｍｍ以上、１０００ｍＮ／５０ｍｍ以下であり、
    　前記両面粘着シートから前記第１の剥離シートを剥離して露出した前記第１の粘着剤層の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付した前記両面粘着シートについて、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定される前記ステンレススチール板に対する１８０°引きはがし粘着力を粘着力Ａ１としたとき、前記剥離力Ｐ２に対する前記粘着力Ａ１の比（Ａ１／Ｐ２）が、１０以上、５０００以下であり、
    　前記両面粘着シートから前記第１の剥離シートを剥離して露出した前記第１の粘着剤層の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付し、２６０℃で１分間加熱した後における前記両面粘着シートについて、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定される前記ステンレススチール板に対する１８０°引きはがし粘着力Ｂ１が、５００ｍＮ／２５ｍｍ以上、１５０００ｍＮ／２５ｍｍ以下であり、
    　前記両面粘着シートから前記第２の剥離シートを剥離して露出した前記第２の粘着剤層の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付し、２６０℃で１分間加熱した後における前記両面粘着シートについて、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定される前記ステンレススチール板に対する１８０°引きはがし粘着力を粘着力Ｂ２としたとき、前記粘着力Ｂ１から前記粘着力Ｂ２を減じて得られる粘着力の差が、１０００ｍＮ／２５ｍｍ以上、２００００ｍＮ／２５ｍｍ以下である
    ことを特徴とする両面粘着シート。     Core material, first pressure-sensitive adhesive layer laminated on one surface side of the core material, second pressure-sensitive adhesive layer laminated on the other surface side of the core material, and the first pressure-sensitive adhesive A first release sheet laminated on the surface of the layer opposite to the core material, and a second release sheet laminated on the surface of the second pressure-sensitive adhesive layer opposite to the core material. A double-sided pressure-sensitive adhesive sheet comprising:
    The first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are each composed of a silicone-based pressure-sensitive adhesive,
    The peeling force P2 when peeling the second release sheet from the second pressure-sensitive adhesive layer is 30 mN / 50 mm or more and 1000 mN / 50 mm or less,
    The double-sided pressure-sensitive adhesive sheet in which the adhesive surface of the first pressure-sensitive adhesive layer, which is exposed by peeling the first release sheet from the double-sided pressure-sensitive adhesive sheet, is attached to a stainless steel plate (SUS304), in accordance with JIS Z0237: 2009. When the 180 ° peel strength for the stainless steel plate measured is defined as adhesive strength A1, the ratio (A1 / P2) of the adhesive strength A1 to the peeling force P2 is 10 or more and 5000 or less,
    The double-sided pressure-sensitive adhesive layer after the first pressure-sensitive adhesive layer exposed by peeling the first release sheet from the double-sided pressure-sensitive adhesive sheet is attached to a stainless steel plate (SUS304) and heated at 260 ° C. for 1 minute. About the sheet, 180 ° peel adhesive strength B1 with respect to the stainless steel plate measured according to JIS Z0237: 2009 is 500 mN / 25 mm or more and 15000 mN / 25 mm or less,
    The double-sided adhesive after the adhesive layer of the second adhesive layer exposed by peeling the second release sheet from the double-sided adhesive sheet is attached to a stainless steel plate (SUS304) and heated at 260 ° C. for 1 minute. The adhesive strength obtained by subtracting the adhesive strength B2 from the adhesive strength B1 when the adhesive strength B2 is defined as the adhesive strength B2 for the stainless steel plate measured in accordance with JIS Z0237: 2009. The difference is 1000 mN / 25 mm or more and 20000 mN / 25 mm or less, The double-sided adhesive sheet characterized by the above-mentioned.
  2. 　前記第１の剥離シートを前記第１の粘着剤層から剥離する際の剥離力を剥離力Ｐ１としたとき、当該剥離力Ｐ１は前記剥離力Ｐ２よりも大きいことを特徴とする請求項１に記載の両面粘着シート。 The peeling force P1 is larger than the peeling force P2 when the peeling force when peeling the first release sheet from the first adhesive layer is defined as a peeling force P1. The double-sided pressure-sensitive adhesive sheet described.
  3. 　前記第剥離力Ｐ１は、５０ｍＮ／５０ｍｍ以上、２０００ｍＮ／５０ｍｍ以下であることを特徴とする請求項１または２に記載の両面粘着シート。 The double-sided pressure-sensitive adhesive sheet according to claim 1 or 2, wherein the first peeling force P1 is 50 mN / 50 mm or more and 2000 mN / 50 mm or less.
  4. 　前記粘着力Ａ１は、５００ｍＮ／２５ｍｍ以上、１５０００ｍＮ／２５ｍｍ以下であることを特徴とする請求項１～３のいずれか一項に記載の両面粘着シート。 The double-sided pressure-sensitive adhesive sheet according to any one of claims 1 to 3, wherein the adhesive strength A1 is 500 mN / 25 mm or more and 15000 mN / 25 mm or less.
  5. 　前記両面粘着シートから前記第２の剥離シートを剥離して露出した前記第２の粘着剤層の粘着面をステンレススチール板（ＳＵＳ３０４）に貼付した前記両面粘着シートについて、ＪＩＳ　Ｚ０２３７：２００９に準拠して測定される前記ステンレススチール板に対する１８０°引きはがし粘着力Ａ２は、１００ｍＮ／２５ｍｍ以上、１５０００ｍＮ／２５ｍｍ以下であることを特徴とする請求項１～４のいずれか一項に記載の両面粘着シート。 About the double-sided pressure-sensitive adhesive sheet in which the adhesive surface of the second pressure-sensitive adhesive layer exposed by peeling the second release sheet from the double-sided pressure-sensitive adhesive sheet is attached to a stainless steel plate (SUS304), in accordance with JIS Z0237: 2009. The double-sided pressure-sensitive adhesive sheet according to any one of claims 1 to 4, wherein the 180 ° peel adhesive strength A2 measured with respect to the stainless steel plate is 100 mN / 25 mm or more and 15000 mN / 25 mm or less. .
  6. 　前記粘着力Ｂ２は、１００ｍＮ／２５ｍｍ以上、１５０００ｍＮ／２５ｍｍ以下であることを特徴とする請求項１～５のいずれか一項に記載の両面粘着シート。 The double-sided pressure-sensitive adhesive sheet according to any one of claims 1 to 5, wherein the adhesive force B2 is 100 mN / 25 mm or more and 15000 mN / 25 mm or less.
  7. 　複数の孔を有することにより格子状の形状を有し、
    　隣り合う２つの前記孔の間の幅が、０．００１ｍｍ以上、１０ｍｍ以下である
    ことを特徴とする請求項１～６のいずれか一項に記載の両面粘着シート。     Having a lattice shape by having a plurality of holes,
    The double-sided pressure-sensitive adhesive sheet according to any one of claims 1 to 6, wherein a width between two adjacent holes is 0.001 mm or more and 10 mm or less.
  8. 　０．１ｍｍ以上、５ｍｍ以下の幅を有するテープ状の形状を有することを特徴とする請求項１～６のいずれか一項に記載の両面粘着シート。 The double-sided pressure-sensitive adhesive sheet according to any one of claims 1 to 6, which has a tape-like shape having a width of from 0.1 mm to 5 mm.
  9. 　前記第１の剥離シートは、前記第２の剥離シートよりも先に剥離されることを特徴とする請求項１～８のいずれか一項に記載の両面粘着シート。 The double-sided pressure-sensitive adhesive sheet according to any one of claims 1 to 8, wherein the first release sheet is released before the second release sheet.
  10. 　請求項１～９のいずれか一項に記載の両面粘着シートから前記第１の剥離シートを剥離する工程、
    　前記第１の剥離シートの剥離により露出した前記第１の粘着剤層の粘着面を、支持体上に貼付する工程、
    　前記貼付と同時にまたは前記貼付の後に、前記両面粘着シートに囲まれたまたは挟まれた、前記両面粘着シートが存在しない領域を設ける工程、
    　前記支持体上に貼付された前記両面粘着シートから前記第２の剥離シートを剥離する工程、
    　複数の部品を、それぞれが前記領域を覆うようにまたは前記領域にまたがるように、前記第２の粘着剤層上に積層する工程、
    　前記部品に対して、加熱を伴う処理を行う工程、および
    　前記部品を前記第２の粘着剤層から剥離する工程
    を含むことを特徴とする半導体装置の製造方法。     Peeling the first release sheet from the double-sided pressure-sensitive adhesive sheet according to any one of claims 1 to 9,
    A step of sticking the adhesive surface of the first pressure-sensitive adhesive layer exposed by peeling of the first release sheet on a support;
    A step of providing a region where the double-sided pressure-sensitive adhesive sheet does not exist, surrounded or sandwiched by the double-sided pressure-sensitive adhesive sheet, simultaneously with or after the sticking;
    Peeling the second release sheet from the double-sided pressure-sensitive adhesive sheet affixed on the support,
    Laminating a plurality of parts on the second pressure-sensitive adhesive layer so that each of the parts covers or straddles the region;
    A method of manufacturing a semiconductor device, comprising: performing a process with heating on the component; and peeling the component from the second pressure-sensitive adhesive layer.
  11. 　前記部品を前記第２の粘着剤層から剥離する工程の後に、前記両面粘着シートを前記支持体から剥離する工程をさらに備えることを特徴とする請求項１０に記載の半導体装置の製造方法。 The method for manufacturing a semiconductor device according to claim 10, further comprising a step of peeling the double-sided pressure-sensitive adhesive sheet from the support after the step of peeling the component from the second pressure-sensitive adhesive layer.
  12. 　前記領域は、前記第１の粘着剤層の粘着面が前記支持体に貼付された後、前記両面粘着シートから前記第１の剥離シートを除いてなる積層体に対して、当該積層体を貫通する複数の孔を形成することで設けられることを特徴とする請求項１０または１１に記載の半導体装置の製造方法。 The region penetrates the laminate with respect to the laminate obtained by removing the first release sheet from the double-sided adhesive sheet after the adhesive surface of the first adhesive layer is attached to the support. The method of manufacturing a semiconductor device according to claim 10, wherein the semiconductor device is provided by forming a plurality of holes.
  13. 　前記領域は、前記支持体に対して、複数のテープ状の前記両面粘着シートを、互いに間隔をあけて平行に貼付することで設けられることを特徴とする請求項１０または１１に記載の半導体装置の製造方法。 12. The semiconductor device according to claim 10, wherein the region is provided by attaching a plurality of tape-shaped double-sided pressure-sensitive adhesive sheets to the support in parallel with a gap therebetween. Manufacturing method.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200111309A (en) * 2019-03-18 2020-09-29 주식회사 모두테크 Adhesive tape for semicondoctor package manufacturing process and method for manufacturing the same
KR20200142808A (en) * 2019-06-13 2020-12-23 주식회사 모두테크 Adhesive tape for semicondoctor package manufacturing process and method for manufacturing the same
JP2021050266A (en) * 2019-09-24 2021-04-01 積水化学工業株式会社 Adhesive tape
WO2021246680A1 (en) * 2020-06-05 2021-12-09 주식회사 모두테크 Adhesive tape for semiconductor package manufacturing process and method for manufacturing same
WO2022009965A1 (en) * 2020-07-10 2022-01-13 日東電工株式会社 Silicone-based adhesive and adhesive tape

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119427A (en) * 2009-12-03 2011-06-16 Shin-Etsu Chemical Co Ltd Method of manufacturing stacked semiconductor integrated device
JP2016030804A (en) * 2014-07-29 2016-03-07 日本理化製紙株式会社 Anti-slip film

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5551568B2 (en) * 2009-11-12 2014-07-16 日東電工株式会社 Resin-sealing adhesive tape and method for manufacturing resin-sealed semiconductor device using the same
JP4902812B2 (en) * 2010-02-12 2012-03-21 積水化学工業株式会社 Manufacturing method of semiconductor chip with adhesive layer
SG184325A1 (en) * 2010-03-31 2012-11-29 Furukawa Electric Co Ltd Pressure-sensitive adhesive sheet for semiconductor wafer processing
WO2012036209A1 (en) * 2010-09-16 2012-03-22 積水化学工業株式会社 Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method
JP5883617B2 (en) * 2011-11-09 2016-03-15 日東電工株式会社 Adhesive sheet with separator
KR101985049B1 (en) * 2012-02-17 2019-05-31 후루카와 덴키 고교 가부시키가이샤 Semiconductor-wafer-surface-protective adhesive tape
JP5117630B1 (en) * 2012-07-06 2013-01-16 古河電気工業株式会社 Adhesive tape for protecting semiconductor wafer surface and method for producing semiconductor wafer using the same
JP5731080B2 (en) * 2013-03-28 2015-06-10 古河電気工業株式会社 Adhesive tape and wafer processing tape

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119427A (en) * 2009-12-03 2011-06-16 Shin-Etsu Chemical Co Ltd Method of manufacturing stacked semiconductor integrated device
JP2016030804A (en) * 2014-07-29 2016-03-07 日本理化製紙株式会社 Anti-slip film

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200111309A (en) * 2019-03-18 2020-09-29 주식회사 모두테크 Adhesive tape for semicondoctor package manufacturing process and method for manufacturing the same
KR102198323B1 (en) 2019-03-18 2021-01-05 주식회사 모두테크 Adhesive tape for semicondoctor package manufacturing process and method for manufacturing the same
KR20200142808A (en) * 2019-06-13 2020-12-23 주식회사 모두테크 Adhesive tape for semicondoctor package manufacturing process and method for manufacturing the same
KR102267636B1 (en) 2019-06-13 2021-06-21 주식회사 모두테크 Adhesive tape for semicondoctor package manufacturing process and method for manufacturing the same
JP2021050266A (en) * 2019-09-24 2021-04-01 積水化学工業株式会社 Adhesive tape
WO2021246680A1 (en) * 2020-06-05 2021-12-09 주식회사 모두테크 Adhesive tape for semiconductor package manufacturing process and method for manufacturing same
KR20210152062A (en) * 2020-06-05 2021-12-15 주식회사 모두테크 Adhesive tape for semicondoctor package manufacturing process and method for manufacturing the same
KR102427603B1 (en) * 2020-06-05 2022-08-02 주식회사 모두테크 Adhesive tape for semicondoctor package manufacturing process and method for manufacturing the same
CN115516053A (en) * 2020-06-05 2022-12-23 模度技术股份有限公司 Adhesive tape for semiconductor packaging manufacturing process and manufacturing method thereof
WO2022009965A1 (en) * 2020-07-10 2022-01-13 日東電工株式会社 Silicone-based adhesive and adhesive tape
JP7427552B2 (en) 2020-07-10 2024-02-05 日東電工株式会社 Silicone adhesive and adhesive tape

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