TWM354871U - Improvement of signal-filtering module structure - Google Patents
Improvement of signal-filtering module structure Download PDFInfo
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- TWM354871U TWM354871U TW097221975U TW97221975U TWM354871U TW M354871 U TWM354871 U TW M354871U TW 097221975 U TW097221975 U TW 097221975U TW 97221975 U TW97221975 U TW 97221975U TW M354871 U TWM354871 U TW M354871U
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- 230000006872 improvement Effects 0.000 title claims description 12
- 238000001914 filtration Methods 0.000 title claims description 6
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- 238000005476 soldering Methods 0.000 claims description 21
- 239000002689 soil Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 9
- 238000009413 insulation Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 210000002683 foot Anatomy 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 210000003423 ankle Anatomy 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 208000003251 Pruritus Diseases 0.000 description 1
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 1
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000009419 refurbishment Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6633—Structural association with built-in electrical component with built-in single component with inductive component, e.g. transformer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F17/062—Toroidal core with turns of coil around it
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/04—Arrangements of electric connections to coils, e.g. leads
- H01F2005/043—Arrangements of electric connections to coils, e.g. leads having multiple pin terminals, e.g. arranged in two parallel lines at both sides of the coil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0092—Inductor filters, i.e. inductors whose parasitic capacitance is of relevance to consider it as filter
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Description
M354871 * 五、新型說明: 【新型所屬之技術領域】 本創作為提供一種訊號濾波模組結構之改良,尤指晶片 型λ號;慮波松組結構,其具有容置複數濾、波元件之絕緣座體 二側壁上一體成型有複數連接端子,以利用連接端子設計在 側壁底部上之基部與延伸至外部的焊接腳結構方式,可具有 • 料、端子材料、使用量及成本之效果,並兼具線圈頭端方便 > 對位焊接、加工製程簡便及自動化加工作業之功效。 【先前技」街】 知:,隨著電子資訊產品走向精緻化,電子元件連結在印 刷電路板上的技術現今大多縣表雜著式(smd),其 中為以網路用之R;— 4 5連接器為範例而言,在R】_ 4 5連接器在進行訊賴财,均會_遭的電子元件或電路 ♦ 產生電軒擾,進而造成職傳輸發生錯誤,且上述電磁干 擾會再輕射到空氣中並干擾其它無線廣播接收機,進而影響 其它區域網路,是錢需錢接糾設置有濾波模組,秋而 此渡波模組為設計成以麵,且可翻焊接於各式訊號傳 輸裝置的電路板或介面卡之線路板上(並非偈限r 4 5 上使用),且制抑繼磁干擾及維持職的完整,如此, 即可將網路連接器所接收之外部網路信號進行遽波動作’進 一步齡不必要之雜訊,並保留實際有用的錢,以便將網 路域傳遞至外部控制電路介面等規格化之資料傳輸介面, 3 M354871 t « 且將此網路信賴換為㈣式料傳輸信號,最後便可於資 料處理系統内進行處理。 、請同時參_七、人騎示,縣制之域分解圖及 Wd面圖’由圖中可清楚看出,此類訊號遽波模組包括有 絕緣座體A、連接端子6、遽波組件c及絕緣上蓋d所組成 ’其中連接端子B是通過模具射出成型鑲鼓結合( 鲁 NSERT MOLDING)絕緣座體a二側壁a 1上 ’且連接端子B由繼A丨底部貫穿至頂部,喊波組件c 之導線C1為纏繞於側壁A丄頂部的連接端子B之纏線柱6 2上,再經由焊接來連接,另於連接端子B底部彎折有與電 路板E之銅翻面e1焊接的接腳B工,此訊號遽波模組另一 侧有對稱結構進行連接,最終實舰銳接魏,但其實際 加工作業時’為衍生下列缺失: % ()導線C1纏繞於連接端子B之纏線柱B 2上時非常費 日寸’必須將每根導線C1--捲繞於歡線柱B 2上進 行焊接連接,造成製程成本增加及作業過程複雜不易 〇 (二)連接端子B之接腳B1與纏線柱B 2分別貫穿位於側 土A 1上、下方,故其連接端子b必須設置高於絕緣 座體A高度之結構長度設置,進而造成連接端子6材 料成本提高之問題。 (二)纏線柱B 2與導線C1連接處為位於絕緣座體A之側 M354871 壁A 1上方’為滿足製程的f要其絕緣座體a 7鎮空狀,是叫須增加絕緣上蓋D來保證訊鮮 波模組外觀及魏峨不裸露喊成電氣不良,進 而增加組裝絕緣上蓋D的製程及成本問題。 是以,要如何設法解決上述習 不良率高及成本增加等瑕疵問題, 改善之方向所在者。 用所存在製程作業困難、 即為相關業者所亟欲研究 【新型内容】 緣此’有鑑於上述習知震置在設計上均未療理想,故, 創作人乃搜集相關資料,經由多方評估及考量,而以從事於 此行業累狀多年顯’縣著精益求精之精神,秉持不斷 之研究改良綱之理念,針對上述之不足之處再加以改良, 乃設計開發出本_「峨舰额結構之改良」。 本創作之主要目的乃在於設計—體細魏緣座體側壁 底部之複數連接端子結構,可_其外部焊接腳延伸連接至 側壁底面上之基部,供絕緣麵_概舰元件上線圏頭 端拉出進行定點详接,進而避免基㈣上下貫穿且露出於側 壁上頂端來與複數濾波元件上線圈頭端連接方式,可達到複 數連接端子材料用量大幅降低(長度值變小)、節省複數連 接端子材料、使用量及成本之功效。 本創作之次要目的乃在於一體成型於絕緣座體侧壁底部 之複數連接端子結構,可利用其外部焊接腳延伸連接至側壁 M354871 底面上之基部,來供絕緣座體内部複數濾波元件上線圈頭端 拉出進行定點焊接,進而在各種不同尺寸、規格之絕緣座體 ,亦利用相同之複數連接端子來適用及成型於側壁上,具有 減少模具生產、庫存成本及複數連接端子於二側壁上皆可共 用之功效。 本創作之再一目的乃在於線圈之頭端於複數連接端子之 基部上平面勒博接,喊端可經祕、賴及基部側端凹設 之過線切Π來充攸位’可具有減少作#製造程序、降低產
品不良率及方便製造程序作業的效果。 本創作之又一目的乃在於絕緣座體二側壁底部一體成型 有複數連接端子,以此簡化鑲礙射出模具的結構,可有效降 低複數連接端子與繼鑲嵌射出成财良率,進而減少作業 製程、降低製程成本之功效。 【貫施方式】 7為達成上述目的及功效,本創作所採用之目的、構造技 八_寺徵以及其雜,麟圖穌創作讀佳實施例詳加說明 其特徵與舰如下,俾觀全瞭解。 月H、二圖所不,係為本創作之立體外觀圖及立 :解圖’可_中清楚看出,本創作訊號濾顧組結構包 ^絕緣座體1及複滅波元件2所組構喊,故就本案之 要構件及其特徵詳述如后;其中: °亥絕緣座體1巾央如設有容置複紐波元件2定位之 6 M354871 凹=0,且嘴0二側簡2底面112上 數間隔且之間形成理線槽Η3之凸塊112,再於二側壁 1 1上型有複數連接端子2 2,且複數連接端子^ 皆設有可麵她罐纖_3 21,而此焊接腳i 2 i一側連續彎折有露出於底面⑴ 上,基部1 2 2,技部i 2 2設有與底面i i i呈平行面 狀態之焊接面12 21。 該複數觀元件2可由餘、f容或其他_元件及滅 波盗所組成’並於複數滤波元件2上纏繞有線圈2丄,而線 圈21缠燒後之頭端211為可拉出並穿過理線槽113而 定點焊接於基部1 2 2之焊接面2 2 1上。 、上述說明絕緣座體1之複數連接端子12的基部12 2 為可一體成型於側壁11之底面111位置,且由焊接腳i 21延伸至基部12 2後’亦可由基部12 2進-步向上斜 伸有相同—體成型於側壁11内部之干涉塊12 2 2,使干 ^ Μ 2 2 2可與趣1丨充分鑲|,在本創作訊號遽波模 、、、H/皿等環i兄因素或拆分等外力因素時,可確保複數 連接端子12與側壁11不會發纟滑脫分離 ,又於複數連接 端子12之干涉塊12 2 2上可增設-切 口或凸點,以可進 一步確保複數連接端子丄2與側壁工工不會發生滑脫分離的 情形。 1 再於本身基部12 2結構可設計寬度大於焊接腳12 M354871 結構寬度來相連,連接端子12基部i 2 2的寬度為大於連 接端子12焊接腳121的寬度以形成供線圈21頭端2 i 1繞設定位之寬度差,而凸•焊接腳1 2 1外之基部! 2 2側端則向_設有可供顧2 1頭端2丨2繞奴位之過 線切口 1 2 2 3,如此,可確保頭端21丄與焊接面122 1最大量的接_便於焊接製簡簡紐1複數連接端子 12j干涉塊1 2 2 2上的斜面為與基部i 2 2上表面相連 > ,而複數連接端子12分別相對向成型於二侧壁i i底部之 底面1 1 1上時,其結構職為呈相互交錯但不垂直型式。 俾當上述摘作訊麟波池結構於_時,為可將複 數滤波元件2依序擺設於絕緣麵i之凹槽丨⑽,再將複 數慮波兀件2上線圈21之頭端2 χ χ拉出進行理線作業, 其各頭端211可分別穿過側壁工丄底部複數對應的理線槽 113外,而達到交錯且導正頭端2 i i定位於基部丄2 2 > 之焊接面12 21上’之後進行焊接,如此辟—道加工程 序,便可雜複雜波元件2各觸端2丨丨全部—次與對 應複數連接端子12之基部122的焊接面1221相接觸 (如第三圖所示)’如此,即可完成本創作訊號渡波模組結 構之整體組裝配置。 請參閱第四圖所示,係為本創作使用時之側視剖面圖, 當上述訊麵波模祕組技錢,即可躺紐連接端子 12之焊接腳121來焊接於預定電路板3之接點3丄上, 8 M354871 以此模組化之組構設計,可節省加工的時間與流程,更可快 速大里的加工製造,並同時降低產品本身的瑕鱗,以適用 各式减傳輸裝置的主機板或介面卡上的各式電路板上(並 非侷限RJ-1 1或!^—45上),並在外部訊號藉由預 設線路與電路板3呈電性連接時,其訊號便由電路板3之接 點31傳遞至複數連接端子i 2,再由基部i 2 2之焊接面 鲁 12 21上所連接之頭端211將訊號傳送至複數遽波元件 2上’使外部訊號經複數紐元件2進行渡波動作,將不必 要的雜訊齡聽留實際有魏號,之後便可透過複數遽波 元件2之另-側將訊號傳送至預設電路板上輸出。 凊參閱第五、六圖所示’係為本創作另一較佳實施例之 立體分解圖及地剖_,可由圖巾清楚看出,本創作複數 連接端子12為可設計成另—種結構型式來—體成型於絕緣 # 座體1之側壁11上’其中複數連接端子12設有可與底部 預叹電路板3表面接點31連接之焊接腳丄2丄,而此焊接 腳121一側藉由基部12 2所設之連接段1 2 2 4來連續 ,彎折連接,其連接段1 2 2 4為呈倒11型來成型於側壁^ 内,且位於連接段12 2 4末端之基部12 2為位於底面丄 11上露出’且基部12 2亦設有與底面1χ χ呈平行面狀 態之底部焊接面1 2 2 1,此種結構亦可在側壁i i底啊 成有具焊接面12 21之基部工2 2,並使穿過理線槽u 3外之頭端21 1可焊接定位於焊接面i 2 2丄上。 9 M354871
是以,本創作之複數連接端子12結構主要只需具有焊 接腳121及基部!2 2,且連接焊接腳i 2 i之基部丄2 2可一體成型於側壁11之底面111位置,達到複數連接 端子12具有穩固結合於側壁i i上之結構即可,且使基部 122之焊接面1221可露出於底面111上供頭端21 1定點焊接’而不論前述基部丨2 2進—步向上斜伸有相同 一體成型於側壁11内部之干涉塊1 2 2 2,或焊接腳丄2 1與基部12 2之間具有設計呈倒u型連接幻2 2 4來一 體成型於側壁1 1内部的結構型式,來相有焊接腳i 2 1以及露出於底面lu之基部122結構 於本創作之專利範圍内,合予陳明。 均應同理包含 又’上述說明複數連接端子12之焊接面工2 2工可與 底面ill平行’焊接面1221及底面Ui可為丘面 切齊或不共面型式供頭端2 11定點焊接。 /、 而本創作之保護重點為針對於组裝複數渡波元件2之絕 緣座體1可呈U型訊號濾波模組結構,其絕緣座體i之 凹槽1◦二側側壁η_ιη上凸財複數間隔且之 間軸理線槽1 1 3之凸塊1 1 2,再於二側壁i i上一體 成型有複數連接端子12,且複數連接端子12由焊接腳1 21一側連接有露出於底面U1上之基部12 2,於複數 遽波70件2上纏繞線圈2 i之頭端2 1 !拉出,並依序穿過 理線槽1 1 3而定料接於基部2 2 2之痒接面! 2 2工上 M354871 時,即可絲複數元件2之、_ 2 i與複數連接端子丄 2連接,關壁i !底部基部i 2 2至延伸外部之焊接腳丄 2 1的複數賴軒丨2結構設計方式,可財節省端子材 料、使用罝及成本之效果,同時兼具線圈2工之頭端2 u 方便對位焊接、加工製程簡便及自動化加工作業之功效,是 以,凡運用本創作所採用之原理及等效結構變化,均應同^ 包含於本創作之專利範圍内,合予陳明。 是以’本創作之訊號遽波模組結構之改良為可改善習用 之技術關鍵在於: (-)本創作透過-體成型於絕緣座體1之側壁丄丄底部的 複數連接端子12結構,可利用外部焊接腳工2工延 伸連接之基部12 2位於側壁!χ之底面丄i1上來 供複數濾波元件2之線圈21焊接,進而避免基部工 2 2須上下貫穿且露出於側壁丄頂端來與複數、慮 波元件2之線圈2 1焊接的方式,達到複數連接料 12材料用量大幅降低(長度值變小)、節省複數連 接端子12材料、使用量及成本之功效。 (一)本創作透過—體成胁絕緣座體丄之側壁1 1底部的 複數連接端子12結構,可利用外部焊接腳丄2工延 伸連接之基部12 2位於側壁11之底面2工工上來 供複數濾波元件2之線圈21焊接,進而在各種不同 尺寸、規格之絕緣座體1下,亦利用複數連接端子工 11 M354871 2來適用及成型於側壁!!上,具有減少模具生產、 庫存成本及複數連接端子12於二側壁21上皆可共 用之功效。
三)本創作透過、_ 2 !之頭端2 i i於魏連接端子丄 2之基部12 2上平面進行焊接,而頭端2 i丄可經 由理線槽113及基部12 2側端凹設之過線切口工 2 2 3來充分定位,可具有減少作#製造程序、降低 產品不良率及方便製造程序作業的效果。 (四)本創作透過絕緣座體!二側壁工1底部—體成 數連接端子1 2,以此簡化職射出模具的結構,可 有效降低複數連接端Η 2與側壁丄i鑲嵌射出成型 不良率,進而減少作業製程、降低製程成本之功效。 惟’以上所賴為補作讀佳實_耐,非因此即
舰本創作之專利細,故舉凡本創作朗書及圖式内 容所叙㈣修飾及等麟機化,均朗理包含於本創作 之專利範圍内,合予陳明。 、·^上所述’糊作之訊賴顧崎叙以於使用時 具有顯著之舰料,崎合新鱗狀㈣縣,爰依去 提出申請,盼麵早日賜准本案,以保障創作人之辛錢 作,倘若釣局有任何稽疑,請轉來函指示,創作 竭力配合,實感德便。 疋田 12 M354871 【圖式簡單說明】 第一圖係為本創作之立體外觀圖。 第二圖係為本創作之立體分解圖。 第三圖係為本創作組裝後另一視角之立體外觀圖。 第四圖係為本創作使用時之側視剖面圖。 第五圖係為本創作另一較佳實施例之立體分解圖。 第六圖係為本創作另一較佳實施例之侧視剖面圖。 ►第七圖係為習用之立體分解圖。 第八圖係為習用之側視剖面圖。 【主要元件符號說明】 1、絕緣座體 1 0、凹槽 1 1、側壁 1 1 1、底面 1 1 2、凸塊 1 13、理線槽 12、連接端子 121、焊接腳 1 2 2、基部 1 2 21、焊接面 1 2 2 2、干涉塊 1 2 2 3、過線切口 1 2 2 4、連接段 2、複數濾波元件 21、線圈 21 1、頭端 13 M354871 3、電路板 3 1、接點 A、 絕緣座體 A 1、側壁 B、 連接端子 B 1、接腳 C、 濾波組件 C 1、導線 D、 絕緣上蓋
B 2、纏線柱 E、電路板 E 1、銅I白面 14
Claims (1)
- M354871 六、申請專利範圍: 1、 -種訊麟賴減構之改良,尤指晶#型職渡波模組 結構,係包括有絕緣座體及複數濾波元件所組成,其中: 該絕緣座體内凹設有雜複數舰元件定位之凹槽,且凹 槽二側壁的底面上凸設有複數形成理線槽之凸塊,再於二 ㈣土上體成型有複數連接端子’而各連接端子之焊接腳 —側為連續彎折奴位於繼底社之基部,而基部底部 设有露出於底面外之焊接面; 該複數濾波元件上纏繞有線圈,而線圈纏繞後之頭端為可 拉出並穿過理線槽而定點焊接於基部之焊接面上。 2、 如申請專利範圍第丨項所述之訊號濾波模組結構之改良, 〃、中該絶緣座體之連接端子的焊接腳為可與底部預設電路 板表面接點進行連接。 . 3、如申請專利範圍第χ酬述之訊號濾波模減構之改良, 射該複數驗元件可由電阻、電容及舰輯組成。 4、如申請專利範圍第丄項所述之訊號遽波模組結構之改良, 其中該絕緣座體之連接端子焊接腳為可延伸至基部後向上 斜伸有相同一體成型於側壁内部之干涉塊。 5如申清專利範圍料項所述之訊號濾、波模組結構之改良, 其中该緣座體之連接端子焊接腳及基部之間連接設有呈倒 U型之連接段來一體成型於側壁内。 6、如申凊專利範圍帛工項所述之訊號遽波模組結構之改良, 15 M354871 其令該絕緣座叙連接端子基部的寬料大於連接端子谭 接腳的寬度以形成供線圈頭端繞設定位之寬度差。 7、 如中請專利賴第“所述之訊號·模組結構之改良, 其中該絕緣座體之連接端子基部側端為可向内凹設有供線 圈頭端繞設定位之過線切口。 8、 如中請專利範圍第1項所述之職模域構之改良, 其中該絕緣座體之連接端子焊接面可與底面平行且共面切 齊。 9、 如申請專利範圍第1項所述之訊號濾波模組結構之改良, 其中該絕緣座體之連接端子焊接面可與底面平行但不共面 16
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TW097221975U TWM354871U (en) | 2008-12-08 | 2008-12-08 | Improvement of signal-filtering module structure |
US12/461,835 US20100142173A1 (en) | 2008-12-08 | 2009-08-26 | Signal filter module |
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TW097221975U TWM354871U (en) | 2008-12-08 | 2008-12-08 | Improvement of signal-filtering module structure |
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TWM354871U true TWM354871U (en) | 2009-04-11 |
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TW097221975U TWM354871U (en) | 2008-12-08 | 2008-12-08 | Improvement of signal-filtering module structure |
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TW (1) | TWM354871U (zh) |
Cited By (3)
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TWI394332B (zh) * | 2009-11-12 | 2013-04-21 | Delta Electronics Inc | 連接器 |
CN103904452A (zh) * | 2014-04-03 | 2014-07-02 | 东莞建冠塑胶电子有限公司 | 一种新型信号传输结构 |
TWI553677B (zh) * | 2015-04-08 | 2016-10-11 | Yun-Guang Fan | Thin inductive components embedded in the structure |
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TWI302430B (en) * | 2006-02-17 | 2008-10-21 | Delta Electronics Inc | Filter and its coils connecting frame |
CN201323122Y (zh) * | 2008-11-28 | 2009-10-07 | 富士康(昆山)电脑接插件有限公司 | 电子元件 |
US8203853B2 (en) * | 2009-08-26 | 2012-06-19 | U.D. Electronic Corp. | Chip filter and the related supplementary tool |
TWM395895U (en) * | 2010-08-04 | 2011-01-01 | Linkcom Mfg Co Ltd | Communication Network transformer |
CN201927601U (zh) * | 2010-11-05 | 2011-08-10 | 富士康(昆山)电脑接插件有限公司 | 电子元件 |
US20130194766A1 (en) * | 2012-01-31 | 2013-08-01 | U.D.Electronic Corp. | Signal filtering mounting sctructure |
TWI511260B (zh) * | 2013-07-02 | 2015-12-01 | Wistron Corp | 電氣訊號傳輸裝置及其積體電路 |
TWI640238B (zh) * | 2014-12-19 | 2018-11-01 | 帛漢股份有限公司 | Electronic device package |
TWI569697B (zh) * | 2015-07-30 | 2017-02-01 | Bothhand Entpr Inc | The electronic components of the ring structure |
CN105914540A (zh) * | 2016-05-04 | 2016-08-31 | 东莞建冠塑胶电子有限公司 | 新型滤波模组结构 |
TWI587325B (zh) * | 2016-08-15 | 2017-06-11 | Bothhand Entpr Inc | Electronic device package box |
US10531573B2 (en) * | 2016-10-28 | 2020-01-07 | Xfmrs, Inc. | Electrical component package with reinforced molded pins |
US11432407B2 (en) | 2016-10-28 | 2022-08-30 | Xfmrs, Inc. | Electrical component package with reinforced molded pins |
TWI616904B (zh) * | 2017-05-09 | 2018-03-01 | 帛漢股份有限公司 | Coil package module |
US20230178286A1 (en) * | 2020-06-19 | 2023-06-08 | Murata Manufacturing Co., Ltd. | Surface-mount-assembly z-shaped pin |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4975671A (en) * | 1988-08-31 | 1990-12-04 | Apple Computer, Inc. | Transformer for use with surface mounting technology |
US5656985A (en) * | 1995-08-10 | 1997-08-12 | Halo Electronics, Inc. | Electronic surface mount package |
US6297720B1 (en) * | 1995-08-10 | 2001-10-02 | Halo Electronics, Inc. | Electronic surface mount package |
US6225560B1 (en) * | 1997-11-25 | 2001-05-01 | Pulse Engineering, Inc. | Advanced electronic microminiature package and method |
US6395983B1 (en) * | 1999-05-18 | 2002-05-28 | Pulse Engineering, Inc. | Electronic packaging device and method |
US6593840B2 (en) * | 2000-01-31 | 2003-07-15 | Pulse Engineering, Inc. | Electronic packaging device with insertable leads and method of manufacturing |
-
2008
- 2008-12-08 TW TW097221975U patent/TWM354871U/zh unknown
-
2009
- 2009-08-26 US US12/461,835 patent/US20100142173A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI394332B (zh) * | 2009-11-12 | 2013-04-21 | Delta Electronics Inc | 連接器 |
CN103904452A (zh) * | 2014-04-03 | 2014-07-02 | 东莞建冠塑胶电子有限公司 | 一种新型信号传输结构 |
TWI553677B (zh) * | 2015-04-08 | 2016-10-11 | Yun-Guang Fan | Thin inductive components embedded in the structure |
Also Published As
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US20100142173A1 (en) | 2010-06-10 |
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