TWI826641B - 擴展裝置 - Google Patents

擴展裝置 Download PDF

Info

Publication number: TWI826641B
Authority: TW; Taiwan
Prior art keywords: unit; workpiece; expansion; frame; cooling
Prior art date: 2019-02-06

Application number

TW109103411A

Other languages

English (en)

Chinese (zh)

Other versions

TW202030832A (zh

Inventor

松田智人

川口吉洋

Original Assignee

日商迪思科股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-02-06

Filing date

2020-02-04

Publication date

2023-12-21

2020-02-04 Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司

2020-08-16 Publication of TW202030832A publication Critical patent/TW202030832A/zh

2023-12-21 Application granted granted Critical

2023-12-21 Publication of TWI826641B publication Critical patent/TWI826641B/zh

Links

238000001816 cooling Methods 0.000 claims abstract description 176
230000002093 peripheral effect Effects 0.000 claims abstract description 28
238000010438 heat treatment Methods 0.000 claims description 38
239000007921 spray Substances 0.000 claims 1
239000003570 air Substances 0.000 description 146
235000012431 wafers Nutrition 0.000 description 35
230000007246 mechanism Effects 0.000 description 12
101100386237 Caenorhabditis elegans daf-7 gene Proteins 0.000 description 7
238000000034 method Methods 0.000 description 5
239000000463 material Substances 0.000 description 4
230000000149 penetrating effect Effects 0.000 description 3
238000007789 sealing Methods 0.000 description 3
239000002699 waste material Substances 0.000 description 3
229910052782 aluminium Inorganic materials 0.000 description 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
230000004048 modification Effects 0.000 description 2
238000012986 modification Methods 0.000 description 2
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
229910010271 silicon carbide Inorganic materials 0.000 description 2
BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
239000012080 ambient air Substances 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
238000007664 blowing Methods 0.000 description 1
239000013078 crystal Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
239000010453 quartz Substances 0.000 description 1
229910052594 sapphire Inorganic materials 0.000 description 1
239000010980 sapphire Substances 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
238000000926 separation method Methods 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
229920002050 silicone resin Polymers 0.000 description 1
239000000758 substrate Substances 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Dicing (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

TW109103411A 2019-02-06 2020-02-04 擴展裝置 TWI826641B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2019019550A JP7242130B2 (ja)	2019-02-06	2019-02-06	エキスパンド装置
JP2019-019550		2019-02-06

Publications (2)

Publication Number	Publication Date
TW202030832A TW202030832A (zh)	2020-08-16
TWI826641B true TWI826641B (zh)	2023-12-21

Family

ID=71974866

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW109103411A TWI826641B (zh)	2019-02-06	2020-02-04	擴展裝置

Country Status (4)

Country	Link
JP (1)	JP7242130B2 (ja)
KR (1)	KR20200096879A (ja)
CN (1)	CN111540693A (ja)
TW (1)	TWI826641B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20240021309A (ko) *	2021-09-14	2024-02-16	야마하하쓰도키 가부시키가이샤	익스팬드 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2011077482A (ja) *	2009-10-02	2011-04-14	Disco Abrasive Syst Ltd	テープ拡張装置
JP2018019007A (ja) *	2016-07-29	2018-02-01	株式会社東京精密	ワーク分割装置及びワーク分割方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4851795B2 (ja)	2006-01-13	2012-01-11	株式会社ディスコ	ウエーハの分割装置
US8664089B1 (en) *	2012-08-20	2014-03-04	Semiconductor Components Industries, Llc	Semiconductor die singulation method
JP6494360B2 (ja)	2015-03-25	2019-04-03	株式会社ディスコ	拡張装置
JP6846205B2 (ja)	2017-01-12	2021-03-24	株式会社ディスコ	分割装置及び分割方法

2019
- 2019-02-06 JP JP2019019550A patent/JP7242130B2/ja active Active
2020
- 2020-02-04 CN CN202010079512.7A patent/CN111540693A/zh active Pending
- 2020-02-04 TW TW109103411A patent/TWI826641B/zh active
- 2020-02-05 KR KR1020200013823A patent/KR20200096879A/ko active Search and Examination

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2011077482A (ja) *	2009-10-02	2011-04-14	Disco Abrasive Syst Ltd	テープ拡張装置
JP2018019007A (ja) *	2016-07-29	2018-02-01	株式会社東京精密	ワーク分割装置及びワーク分割方法

Also Published As

Publication number	Publication date
KR20200096879A (ko)	2020-08-14
CN111540693A (zh)	2020-08-14
JP2020126960A (ja)	2020-08-20
TW202030832A (zh)	2020-08-16
JP7242130B2 (ja)	2023-03-20

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