JP7030469B2 - テープ拡張装置及びテープ拡張方法 - Google Patents
テープ拡張装置及びテープ拡張方法 Download PDFInfo
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- JP7030469B2 JP7030469B2 JP2017192601A JP2017192601A JP7030469B2 JP 7030469 B2 JP7030469 B2 JP 7030469B2 JP 2017192601 A JP2017192601 A JP 2017192601A JP 2017192601 A JP2017192601 A JP 2017192601A JP 7030469 B2 JP7030469 B2 JP 7030469B2
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- tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Description
11 :環状フレーム
12 :エキスパンドテープ
13 :ウェーハ
15 :改質層
16 :チップ
17 :DAF
20 :テープ拡張装置
21 :基台
22 :フレーム保持手段
23 :押圧手段
24 :冷却テーブル
25 :仮置きステージ
26 :フレーム把持爪
27 :加熱手段
35 :ローラー
36 :上部支持体
37 :下部支持体
38 :板状メッシュ材
38a :吸引孔
39 :吸引溝
40 :吸引手段
41 :吸引手段
42 :冷却手段
43 :冷却伝達部
Claims (4)
- 複数の分割予定ラインによって区画された領域に複数のデバイスが形成されたウェーハが貼着されるとともに外周部が環状フレームに装着されたエキスパンドテープを拡張するためのテープ拡張装置であって、
該エキスパンドテープに貼着された該ウェーハが鉛直下向きに向いた状態で、該環状フレームを該テープ拡張装置に搬入する搬入出機構と、
該エキスパンドテープに貼着された該ウェーハが鉛直下向きに向いた状態で該環状フレームを上面に保持するフレーム保持手段と、
該フレーム保持手段と該ウェーハの外周縁との間で該エキスパンドテープを上方から環状に押圧して拡張し、分割起点に沿って該ウェーハを分割する押圧手段と、
環状の該押圧手段の内周側に昇降可能に配設され、該エキスパンドテープを介して該ウェーハ全面にわたって当接する当接面に吸引孔を有する冷却テーブルと、
該フレーム保持手段と該ウェーハの外周縁との間で伸長した該エキスパンドテープを加熱して収縮させる加熱手段と、を備えることを特徴とするテープ拡張装置。 - 請求項1記載のテープ拡張装置を用いるテープ拡張方法において、
該ウェーハが鉛直下向きに向いた状態で、該冷却テーブルの該当接面の下方に該エキスパンドテープの裏面が位置するように該環状フレームを保持する保持ステップと、
該保持ステップを実施した後に、該冷却テーブルの該当接面に該エキスパンドテープの裏面を当接させ、該吸引孔に吸引力を作用させ該エキスパンドテープを冷却するエキスパンドテープ冷却ステップと、
該フレーム保持手段と該押圧手段とを相対移動させて該エキスパンドテープを拡張するエキスパンドテープ拡張ステップと、
該冷却テーブルの該当接面を該エキスパンドテープ裏面に当接させて該吸引孔に吸引力を作用させた状態で、該フレーム保持手段と該ウェーハの外周縁との間で伸長した該エキスパンドテープを該加熱手段により加熱して収縮させる加熱ステップと、を有することを特徴とするテープ拡張方法。 - 該冷却テーブルを該エキスパンドテープから離間させて、該エキスパンドテープ拡張ステップを行い、
該冷却テーブルを該エキスパンドテープに向けて移動させ、該冷却テーブルの該当接面を該エキスパンドテープ裏面に当接させて、該加熱ステップを行うことを特徴とする、請求項2に記載のテープ拡張方法。 - 該エキスパンドテープ拡張ステップで、該冷却テーブルを移動させずに、該冷却テーブルの該当接面に該エキスパンドテープの裏面が当接する位置で該吸引孔から空気を噴出しながら、該エキスパンドテープを拡張することを特徴とする、請求項2に記載のテープ拡張方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017192601A JP7030469B2 (ja) | 2017-10-02 | 2017-10-02 | テープ拡張装置及びテープ拡張方法 |
TW107131065A TWI760558B (zh) | 2017-10-02 | 2018-09-05 | 膠帶擴張裝置及膠帶擴張方法 |
CN201811112958.4A CN109599352B (zh) | 2017-10-02 | 2018-09-25 | 带扩展装置和带扩展方法 |
KR1020180115964A KR102597940B1 (ko) | 2017-10-02 | 2018-09-28 | 테이프 확장 장치 및 테이프 확장 방법 |
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JP2017192601A JP7030469B2 (ja) | 2017-10-02 | 2017-10-02 | テープ拡張装置及びテープ拡張方法 |
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JP2019067945A JP2019067945A (ja) | 2019-04-25 |
JP7030469B2 true JP7030469B2 (ja) | 2022-03-07 |
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KR (1) | KR102597940B1 (ja) |
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TW (1) | TWI760558B (ja) |
Cited By (1)
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KR102576912B1 (ko) * | 2022-10-05 | 2023-09-11 | 제너셈(주) | 디태치 구조체 및 이를 포함하는 디태치 장치 |
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JP7325258B2 (ja) * | 2019-08-14 | 2023-08-14 | 株式会社ディスコ | エキスパンド装置 |
CN110729186A (zh) * | 2019-10-24 | 2020-01-24 | 东莞记忆存储科技有限公司 | 一种晶圆切割及分离的加工工艺方法 |
CN111267017B (zh) * | 2020-03-17 | 2022-05-13 | 华天慧创科技(西安)有限公司 | 一种避免晶圆镀膜时中间变形的支架工装及工作方法 |
JPWO2023042263A1 (ja) * | 2021-09-14 | 2023-03-23 | ||
WO2023209901A1 (ja) * | 2022-04-27 | 2023-11-02 | ヤマハ発動機株式会社 | エキスパンド装置、半導体チップの製造方法および半導体チップ |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007305687A (ja) | 2006-05-09 | 2007-11-22 | Disco Abrasive Syst Ltd | ウエーハの分割方法および分割装置 |
US20120009763A1 (en) | 2010-05-12 | 2012-01-12 | Stmicroelectronics (Tours) Sas | Semiconductor chip manufacturing method |
JP2012164844A (ja) | 2011-02-08 | 2012-08-30 | Toyota Motor Corp | エキスパンド方法、エキスパンド装置、粘着シート |
JP2013041967A (ja) | 2011-08-15 | 2013-02-28 | Disco Abrasive Syst Ltd | 分割装置 |
JP2013051368A (ja) | 2011-08-31 | 2013-03-14 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
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JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
JP4793128B2 (ja) * | 2006-06-23 | 2011-10-12 | 株式会社デンソー | 半導体装置の製造装置及び半導体装置の製造方法 |
JP5791866B2 (ja) | 2009-03-06 | 2015-10-07 | 株式会社ディスコ | ワーク分割装置 |
JP2011077482A (ja) * | 2009-10-02 | 2011-04-14 | Disco Abrasive Syst Ltd | テープ拡張装置 |
JP2015015359A (ja) * | 2013-07-04 | 2015-01-22 | 株式会社ディスコ | ウエーハの加工方法 |
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- 2017-10-02 JP JP2017192601A patent/JP7030469B2/ja active Active
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- 2018-09-05 TW TW107131065A patent/TWI760558B/zh active
- 2018-09-25 CN CN201811112958.4A patent/CN109599352B/zh active Active
- 2018-09-28 KR KR1020180115964A patent/KR102597940B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007305687A (ja) | 2006-05-09 | 2007-11-22 | Disco Abrasive Syst Ltd | ウエーハの分割方法および分割装置 |
US20120009763A1 (en) | 2010-05-12 | 2012-01-12 | Stmicroelectronics (Tours) Sas | Semiconductor chip manufacturing method |
JP2012164844A (ja) | 2011-02-08 | 2012-08-30 | Toyota Motor Corp | エキスパンド方法、エキスパンド装置、粘着シート |
JP2013041967A (ja) | 2011-08-15 | 2013-02-28 | Disco Abrasive Syst Ltd | 分割装置 |
JP2013051368A (ja) | 2011-08-31 | 2013-03-14 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102576912B1 (ko) * | 2022-10-05 | 2023-09-11 | 제너셈(주) | 디태치 구조체 및 이를 포함하는 디태치 장치 |
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Publication number | Publication date |
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CN109599352B (zh) | 2024-03-19 |
KR102597940B1 (ko) | 2023-11-02 |
KR20190039000A (ko) | 2019-04-10 |
TWI760558B (zh) | 2022-04-11 |
TW201929060A (zh) | 2019-07-16 |
CN109599352A (zh) | 2019-04-09 |
JP2019067945A (ja) | 2019-04-25 |
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