TWI821162B - 聚醯亞胺系高分子清漆的製造方法、聚醯亞胺系高分子膜的製造方法及透明聚醯亞胺系高分子膜 - Google Patents
聚醯亞胺系高分子清漆的製造方法、聚醯亞胺系高分子膜的製造方法及透明聚醯亞胺系高分子膜 Download PDFInfo
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- TWI821162B TWI821162B TW106133383A TW106133383A TWI821162B TW I821162 B TWI821162 B TW I821162B TW 106133383 A TW106133383 A TW 106133383A TW 106133383 A TW106133383 A TW 106133383A TW I821162 B TWI821162 B TW I821162B
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- polyimide
- based polymer
- solvent
- reaction vessel
- film
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- 150000003512 tertiary amines Chemical class 0.000 claims abstract description 60
- 239000000178 monomer Substances 0.000 claims abstract description 52
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- 238000006243 chemical reaction Methods 0.000 claims description 134
- 238000009835 boiling Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 15
- 238000005406 washing Methods 0.000 claims description 9
- 239000002243 precursor Substances 0.000 abstract description 23
- 230000000379 polymerizing effect Effects 0.000 abstract description 2
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- -1 tertiary amine compound Chemical class 0.000 description 50
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 46
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
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- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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JPWO2019189483A1 (ja) * | 2018-03-28 | 2021-05-13 | 住友化学株式会社 | 透明ポリイミド系高分子と溶媒とを含むワニス |
JP2019214657A (ja) * | 2018-06-12 | 2019-12-19 | 旭化成株式会社 | 透明ポリイミドワニス及びフィルム |
KR20210068394A (ko) * | 2018-09-29 | 2021-06-09 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 폴리이미드 전구체와 그것으로부터 생성되는 폴리이미드, 및 플렉시블 디바이스 |
JP6595080B1 (ja) * | 2018-12-19 | 2019-10-23 | 住友化学株式会社 | 光学フィルム、フレキシブル表示装置、及び樹脂組成物 |
JP2020111713A (ja) * | 2019-01-16 | 2020-07-27 | 旭化成株式会社 | ポリイミドワニス及びポリイミドフィルム、並びにこれらの製造方法 |
JP7277208B2 (ja) * | 2019-03-28 | 2023-05-18 | 日鉄ケミカル&マテリアル株式会社 | ポリイミドフィルムの製造方法及び金属張積層板の製造方法 |
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TW201531526A (zh) * | 2014-02-14 | 2015-08-16 | Asahi Kasei E Materials Corp | 聚醯亞胺前驅體及含有其之樹脂組合物 |
JP2015214680A (ja) * | 2014-04-24 | 2015-12-03 | Jfeケミカル株式会社 | ポリアミド酸組成物およびポリイミド組成物 |
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JP3493363B2 (ja) * | 1993-08-23 | 2004-02-03 | 鐘淵化学工業株式会社 | 新規な共重合体とその製造方法 |
JPH09197615A (ja) * | 1996-01-22 | 1997-07-31 | Toray Ind Inc | メモリ−素子 |
JPH09286858A (ja) * | 1996-04-24 | 1997-11-04 | Kanegafuchi Chem Ind Co Ltd | ポリイミド樹脂組成物とその製造方法 |
JPH09302091A (ja) * | 1996-05-10 | 1997-11-25 | Kanegafuchi Chem Ind Co Ltd | 新規な高弾性ポリイミド樹脂組成物 |
JP2000080272A (ja) | 1998-09-03 | 2000-03-21 | Toray Ind Inc | 低誘電率重合体組成物 |
JP2002088242A (ja) | 2000-09-13 | 2002-03-27 | Kanegafuchi Chem Ind Co Ltd | ポリイミド樹脂組成物及びポリイミドフィルム状成形体 |
JP2002241498A (ja) * | 2001-02-16 | 2002-08-28 | Sumitomo Bakelite Co Ltd | ポリイミド樹脂の製造方法 |
JP2002265600A (ja) * | 2001-03-14 | 2002-09-18 | Sumitomo Bakelite Co Ltd | ポリイミド樹脂の製造方法 |
JP2003246870A (ja) | 2001-12-17 | 2003-09-05 | Toray Ind Inc | 二軸配向ポリエステルフィルム |
US7348373B2 (en) | 2004-01-09 | 2008-03-25 | E.I. Du Pont De Nemours And Company | Polyimide compositions having resistance to water sorption, and methods relating thereto |
JP2006232911A (ja) | 2005-02-23 | 2006-09-07 | Toray Ind Inc | 熱可塑性ポリイミド前駆体組成物およびこれを用いた積層ポリイミドフィルムの製造方法 |
JP2009270023A (ja) | 2008-05-08 | 2009-11-19 | Kaneka Corp | ポリイミド前駆体の製造方法およびその製造方法を用いて得られるポリイミド |
CN103370359A (zh) | 2010-12-15 | 2013-10-23 | 宇部兴产株式会社 | 聚酰亚胺无缝带及其制备方法,及聚酰亚胺前体溶液组合物 |
SG2014013874A (en) * | 2011-08-18 | 2014-05-29 | Toray Industries | Polyamic acid resin composition, polyimide resin composition, polyimide oxazole resin composition, and flexible substrate containing same |
JP2014114429A (ja) | 2012-01-12 | 2014-06-26 | New Japan Chem Co Ltd | 溶剤可溶性ポリイミド樹脂 |
KR20150097472A (ko) * | 2012-12-17 | 2015-08-26 | 미쓰비시 가가꾸 가부시키가이샤 | 열가소성 폴리이미드 |
US9856399B2 (en) * | 2013-04-04 | 2018-01-02 | Mitsui Chemicals, Inc. | Polyamic acid, varnish containing same, and polyimide film |
JP6228399B2 (ja) | 2013-07-12 | 2017-11-08 | 株式会社日本触媒 | コーティング用含フッ素ポリイミド樹脂組成物、それから得られるフィルム及びコーティング膜 |
JP6681664B2 (ja) | 2014-09-05 | 2020-04-15 | 株式会社日本触媒 | 含フッ素ポリイミドを含む酸素ガス透過性の細胞培養用基材、該基材を備えた細胞培養用容器、及び、該基材を用いた細胞培養方法 |
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