TWI815066B - Positioning method, device and application equipment for objects to be sputtered - Google Patents
Positioning method, device and application equipment for objects to be sputtered Download PDFInfo
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- TWI815066B TWI815066B TW109144144A TW109144144A TWI815066B TW I815066 B TWI815066 B TW I815066B TW 109144144 A TW109144144 A TW 109144144A TW 109144144 A TW109144144 A TW 109144144A TW I815066 B TWI815066 B TW I815066B
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- 238000004544 sputter deposition Methods 0.000 abstract description 30
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Abstract
本發明提供一種待濺鍍物件定位方法、裝置及施作設備，係提供使可撓性片狀的一底膜周圍設有一硬質的框體，該框體內的該底膜上表面具有黏性，使複數個待濺鍍物件以矩陣排列置於該框體內的該底膜上表面，並使載有該複數個待濺鍍物件的該底膜置於一載盤上形成一被搬送物；使該被搬送物被輸送至一載台與可撓性帶狀的一隔膜間，使一輥桿在該隔膜上作滾動，以使該複數個待濺鍍物件與下方該底膜黏附穩固定位的方法、裝置及施作設備；藉此以確保待濺鍍物件在濺鍍製程中的品質。 The invention provides a method, device and application equipment for positioning an object to be sputtered. It provides a flexible sheet-shaped base film with a hard frame around it, and the upper surface of the base film in the frame is sticky. A plurality of objects to be sputtered are arranged in a matrix on the upper surface of the base film in the frame, and the base film carrying the plurality of objects to be sputtered is placed on a carrier tray to form a conveyed object; The transported object is transported between a carrier and a flexible belt-shaped diaphragm, and a roller is rolled on the diaphragm, so that the plurality of objects to be sputtered adhere to the base film below and are firmly positioned. Methods, devices and application equipment; thereby ensuring the quality of objects to be sputtered during the sputtering process.
Description
本發明係有關於一種定位方法、裝置及設備，尤指一種將待濺鍍之物件進行定位的待濺鍍物件定位方法、裝置及施作設備。 The present invention relates to a positioning method, device and equipment, and in particular, to a positioning method, device and equipment for positioning an object to be sputtered.
隨著科技的蓬勃發展，濺鍍(Sputtering)技術在許多產業中扮演著不可或缺的角色，舉凡電子產品的按鍵、光學鏡片、導光板、電路板或晶片等物件，皆需對物件的表面進行濺鍍處理，以在物件的表面形成薄膜；然而在對物件進行濺鍍之前，依照物件大小、形狀及需濺鍍部位狀況需進行不同之前置作業，如：對物件的表面進行水洗清潔、對不需濺鍍之表面進行遮蔽…等。 With the vigorous development of science and technology, sputtering technology plays an indispensable role in many industries. For electronic products such as buttons, optical lenses, light guide plates, circuit boards or chips, the surface of the object must be polished. Perform sputtering treatment to form a thin film on the surface of the object; however, before sputtering the object, different preparatory operations are required according to the size, shape and condition of the area to be sputtered, such as: washing and cleaning the surface of the object. , shielding surfaces that do not require sputtering...etc.
一般對物件進行濺鍍前之前置作業，多採用人工方式來逐一處理大小、形狀及需濺鍍部位狀況不同的各個物件，但遇到大小、形狀及需濺鍍部位狀況一致，且體積小、數量大的物件，不僅耗費人力且需花相當多的處理時間成本，且在人工處理下亦不能維持各個物件處理品質皆相同一致；而在將大量待濺鍍物件進行濺鍍前，必須確保各待濺鍍物件在未來濺鍍製程中的品質，因此需要讓各待濺鍍物件在接受濺鍍製程時先作適當的定位處理。 Generally, before sputtering an object, manual methods are often used to process each object one by one with different sizes, shapes, and conditions of the parts to be sputtered. However, when the size, shape, and conditions of the parts to be sputtered are consistent, and the size is small, , A large number of objects not only consumes manpower and requires a considerable amount of processing time, but also cannot maintain the same processing quality of each object under manual processing; before sputtering a large number of objects to be sputtered, it must be ensured The quality of each object to be sputtered in the future sputtering process requires that each object to be sputtered be properly positioned before undergoing the sputtering process.
爰此，本發明之目的，在於提供一種待濺鍍物件在接受濺鍍製程前的待濺鍍物件定位方法。 Therefore, an object of the present invention is to provide a method for positioning an object to be sputtered before the object undergoes a sputtering process.
本發明的另一目的，在於提供一種待濺鍍物件在接受濺鍍製程前的待濺鍍物件定位裝置。 Another object of the present invention is to provide a device for positioning an object to be sputtered before the object undergoes a sputtering process.
本發明的又一目的，在於提供一種設有如所述待濺鍍物件定位裝置的待濺鍍物件施作設備。 Another object of the present invention is to provide an equipment for applying the object to be sputtered provided with the positioning device for the object to be sputtered.
本發明的再一目的，在於提供一種可用以執行如所述待濺鍍物件定位方法的設備。 Another object of the present invention is to provide a device that can be used to perform the method for positioning an object to be sputtered.
依據本發明之目的之待濺鍍物件定位方法，包括：使可撓性片狀的一底膜周圍設有一硬質的框體，該框體內的該底膜上表面具有黏性，使複數個待濺鍍物件以矩陣排列置於該框體內的該底膜上表面，並使載有該複數個待濺鍍物件的該底膜置於一載盤上形成一被搬送物；使該被搬送物被輸送至一載台與可撓性帶狀的一隔膜間，使一輥桿在該隔膜上作滾動，以使該複數個待濺鍍物件與下方該底膜黏附穩固定位。 According to the object of the present invention, a method for positioning objects to be sputtered includes: arranging a rigid frame around a flexible sheet-shaped base film, and the upper surface of the base film in the frame has viscosity, so that a plurality of objects to be sputtered can be positioned. The sputtering objects are arranged in a matrix on the upper surface of the bottom film in the frame, and the bottom film carrying the plurality of objects to be sputtered is placed on a carrier tray to form a transported object; It is transported between a carrier and a flexible belt-shaped diaphragm, and a roller is rolled on the diaphragm, so that the plurality of objects to be sputtered are adhered to the base film below and positioned stably.
依據本發明的另一目的之待濺鍍物件定位裝置，包括：一軌架，設有可供一被搬送物在其上進行位移的軌道；一治具，設於該軌道中，其設有提供該被搬送物留置其上的載台；一捲繞機構，設有被驅動繞轉位移經該載台上方的可撓性帶狀的一隔膜，及可進行滾動的輥桿；該被搬送物可位於該治具的該載台與該隔膜之間，該輥桿可經由該隔膜對該被搬送物進行輥壓。 According to another object of the present invention, a positioning device for objects to be sputtered includes: a rail frame provided with a rail on which an object to be transported can be displaced; a fixture located in the rail and provided with a Provide a carrier platform on which the transported object is placed; a winding mechanism provided with a flexible belt-shaped diaphragm that is driven to rotate and displace above the carrier platform, and a roller that can roll; the transported object is provided The object can be located between the stage of the fixture and the diaphragm, and the roller can roll the transported object through the diaphragm.
依據本發明又一目的之待濺鍍物件施作設備，設有如所述待濺鍍物件定位裝置，並設有一清潔裝置，該清潔裝置設有一清潔軌架及覆罩在該軌架上的一罩蓋，該清潔軌架設置供搬送該被搬送物之一清潔軌道，該罩蓋內設有噴嘴提供氣體。 According to another object of the present invention, equipment for applying objects to be sputtered is provided with a positioning device for objects to be sputtered as described above, and is provided with a cleaning device. The cleaning device is provided with a cleaning rail frame and a cleaning rail covered on the rail frame. Cover, the cleaning rail frame is provided with a cleaning track for transporting the transported object, and a nozzle is provided in the cover to provide gas.
依據本發明又一目的之另一待濺鍍物件施作設備，設有如所述待濺鍍物件定位裝置，並設有一覆蓋裝置，該覆蓋裝置設有一輸送軌架、一儲蓋機構、及一移載機構；其中，該輸送軌架設置供搬送該被搬送物之一輸送軌道；該儲蓋機構包括供複數個蓋體疊置的儲蓋架；該移載機構設 有一提取座往復位移於該儲蓋機構與該輸送軌架間，以提取蓋體覆於該輸送軌架上的該被搬送物上。 According to another object of the present invention, another equipment for applying objects to be sputtered is provided with the positioning device for the objects to be sputtered, and is provided with a covering device. The covering device is provided with a conveyor rail frame, a cover storage mechanism, and a Transfer mechanism; wherein, the transport rail frame is provided with a transport rail for transporting the transported object; the cover storage mechanism includes a cover storage rack for stacking a plurality of covers; the transfer mechanism is provided with There is an extraction seat that moves back and forth between the cover storage mechanism and the conveyor rail frame to extract the cover body and cover it on the conveyed object on the conveyor rail frame.
依據本發明又一目的之又一待濺鍍物件施作設備，設有如所述待濺鍍物件定位裝置，並設有一供料裝置以容置並供應該被搬送物輸入該待濺鍍物件定位裝置，另設置一收料裝置以容置並收納已完成定位的被搬送物。 According to another object of the present invention, another equipment for applying objects to be sputtered is provided with the positioning device for the objects to be sputtered, and is provided with a feeding device to accommodate and supply the transported objects to the positioning of the objects to be sputtered. device, and a collection device is also provided to accommodate and store the transported objects that have been positioned.
依據本發明再一目的之待濺鍍物件施作設備，包括：可用以執行如所述待濺鍍物件定位方法的設備。 According to yet another object of the present invention, equipment for applying objects to be sputtered includes: equipment that can be used to perform the positioning method for objects to be sputtered.
本發明實施例之待濺鍍物件定位方法、裝置及施作設備，藉由載有該複數個待濺鍍物件的該底膜置於該載盤所形成的該被搬送物被輸送至該載台與可撓性帶狀的該隔膜間，使該輥桿在該隔膜上作滾動，以使該複數個待濺鍍物件與下方該底膜黏附穩固定位，使各待濺鍍物件可以在未來濺鍍製程中取得一致的濺鍍品質；若佐以在同一機台台面設置該清潔裝置、覆蓋裝置或供料裝置、收料裝置而形成一施作設備，則不僅可同時完成待濺鍍物件的清潔、定位、覆蓋，更可有效率的搬送及完成整個待濺鍍物件的濺鍍前置作業，提昇待濺鍍物件的濺鍍品質及提高產能。 In the method, device and operating equipment for positioning the objects to be sputtered according to the embodiment of the present invention, the transported object formed by placing the bottom film carrying the plurality of objects to be sputtered on the carrier is transported to the carrier. Between the table and the flexible belt-shaped diaphragm, the roller is rolled on the diaphragm, so that the plurality of objects to be sputtered are adhered to the bottom film below and positioned stably, so that each object to be sputtered can be sputtered in the future. Achieve consistent sputtering quality during the sputtering process; if the cleaning device, covering device, feeding device, and material collecting device are installed on the same machine table to form an application equipment, not only can the objects to be sputtered be completed at the same time, Cleaning, positioning, and covering can efficiently transport and complete the entire sputtering pre-processing of the objects to be sputtered, thereby improving the sputtering quality of the objects to be sputtered and increasing productivity.
A:被搬送物 A:Object to be transported
A1:底膜 A1: Base film
A2:框體 A2: Frame
A21:短邊 A21: short side
A22:定位孔 A22: Positioning hole
A3:待濺鍍物件 A3: Objects to be sputtered
A31:待濺鍍表面 A31: Surface to be sputtered
A32:不作濺鍍表面 A32: No sputtering surface
A4:載盤 A4: loading disk
A41:承載面 A41: Loading surface
A42:邊框 A42: border
A43:銷體 A43: pin body
B:待濺鍍物件定位裝置 B: Positioning device for objects to be sputtered
B1:軌架 B1: Rail frame
B11:軌道 B11: Track
B12:側架 B12: Side stand
B13:皮帶 B13: Belt
B2:治具 B2: Jig
B21:載台 B21: Carrier platform
B22:昇降機構 B22:Lifting mechanism
B221:導座 B221: Guide seat
B222:滾輪 B222:Roller
B223:驅動件 B223:Driving parts
B3:捲繞機構 B3: Winding mechanism
B31:隔膜 B31: Diaphragm
B32:輥桿 B32:Roller rod
B321:滑軌 B321:Slide rail
B322:移動座 B322: Mobile base
B323:驅動件 B323:Driving parts
B324:荷重量測單元 B324: Load measuring unit
B33:機板 B33:Machine board
B34:釋放輪 B34: Release wheel
B341:第一方向輪組 B341: First direction wheel set
B342:第一定位輪 B342: first positioning wheel
B343:配重輪 B343: Counterweight wheel
B344:第一夾持機構 B344: First clamping mechanism
B3441:驅動件 B3441:Driving parts
B3442:壓抵件 B3442: Pressure parts
B3443:固定件 B3443: Fixing parts
B35:捲收輪 B35: Take-up wheel
B351:第二轉向輪組 B351: Second steering wheel set
B352:第二定位輪 B352: Second positioning wheel
B353:偵測輪 B353:Detection wheel
B354:第二夾持機構 B354: Second clamping mechanism
B3541:驅動件 B3541:Driving parts
B3542:壓抵件 B3542: Pressure parts
B3543:固定件 B3543: Fixing parts
C:機台台面 C:Machine table
D:清潔裝置 D:Cleaning device
D1:清潔軌架 D1: Clean rail frame
D11:側架 D11: Side stand
D12:皮帶 D12: Belt
D13:清潔軌道 D13: Clean track
D2:罩蓋 D2: cover
D21:入口 D21: Entrance
D22:出口 D22:Export
D23:噴嘴 D23:Nozzle
D24:噴嘴 D24:Nozzle
D25:排氣口 D25:Exhaust port
D26:排氣口 D26:Exhaust port
E:覆蓋裝置 E: covering device
E1:輸送軌架 E1: Conveyor rail frame
E11:側架 E11: Side stand
E12:皮帶 E12: Belt
E13:輸送軌道 E13:Conveyor track
E2:儲蓋機構 E2: Cap storage mechanism
E21:滑軌 E21: Slide rail
E22:儲蓋架 E22: Cover storage rack
E221:容置空間 E221: Accommodation space
E222:托頂機構 E222: Supporting mechanism
E3:移載機構 E3: Transfer mechanism
E31:龍門座架 E31: Gantry mount
E311:支柱 E311: Pillar
E312:橫樑 E312: Cross beam
E313:移載架 E313: Transfer rack
E314:驅動件 E314: drive parts
E315:吸附件 E315: Adsorption piece
E316:提取座 E316: Extraction seat
F:供料裝置 F: Feeding device
F1:容置架 F1: Storage rack
F2:軌架 F2: Rail frame
F3:側架 F3: Side stand
F4:皮帶 F4: belt
F5:軌道 F5: Orbit
F6:托頂機構 F6: Supporting mechanism
G:收料裝置 G: Receiving device
圖1係本發明實施例中被搬送物之立體分解示意圖。 Figure 1 is an exploded perspective view of an object to be transported in an embodiment of the present invention.
圖2係本發明實施例中該待濺鍍物件定位裝置之立體示意圖。 Figure 2 is a schematic three-dimensional view of the positioning device for the object to be sputtered in the embodiment of the present invention.
圖3係本發明實施例中該待濺鍍物件定位裝置捲繞隔膜之示意圖。 Figure 3 is a schematic diagram of the winding diaphragm of the positioning device for the object to be sputtered in an embodiment of the present invention.
圖4係本發明實施例中該待濺鍍物件定位施作設備同時設有供料裝置、清潔裝置、待濺鍍物件定位裝置、覆蓋裝置、收料裝置在同一機台台面之立體示意圖。 Figure 4 is a schematic three-dimensional view of the equipment for positioning objects to be sputtered in an embodiment of the present invention, which is equipped with a feeding device, a cleaning device, a positioning device for objects to be sputtered, a covering device, and a collecting device on the same machine table.
圖5係本發明實施例中該清潔裝置之立體分解示意圖。 Figure 5 is a three-dimensional exploded schematic view of the cleaning device in an embodiment of the present invention.
圖6係本發明實施例中該清潔裝置中氣體流動之示意圖。 Figure 6 is a schematic diagram of gas flow in the cleaning device according to an embodiment of the present invention.
請參閱圖1所示，本發明待濺鍍物件定位方法實施例，係使可撓性的矩形薄片狀之一底膜A1上表面周圍環繞圍設有一硬質的矩形之框體A2，該框體A2內的該底膜A1上表面具有黏性，使複數個待濺鍍物件A3以矩陣排列置於該框體A2內的該底膜A1上表面被黏附，並使載有該複數個待濺鍍物件A3的該底膜A1置於矩形的一載盤A4上形成一被搬送物A；其中，該待濺鍍物件A3可以包括一待濺鍍表面A31以及一不作濺鍍部位A32，或僅有該待濺鍍表面A31；該框體A2在該矩形周緣的短邊A21上設有定位孔A22，該載盤A4包括一平整的承載面A41及位於該承載面A41周緣並凸於該承載面A41表面高度的矩形之邊框A42，在鄰靠該邊框A42的該承載面A41表面設有凸起的銷體A43，所述該底膜A1置於該載盤A4之該承載面A41表面時，該框體A2的定位孔A22恰置套於該銷體A43，使該底膜A1獲得定位。 Referring to Figure 1, in an embodiment of the method for positioning an object to be sputtered according to the present invention, a rigid rectangular frame A2 is surrounded on the upper surface of a flexible rectangular sheet-shaped base film A1. The upper surface of the bottom film A1 in A2 is sticky, so that the plurality of objects A3 to be sputtered are adhered to the upper surface of the bottom film A1 arranged in a matrix in the frame A2, and the plurality of objects to be sputtered are loaded. The base film A1 of the plated object A3 is placed on a rectangular carrier plate A4 to form a conveyed object A; wherein the object to be sputtered A3 may include a surface to be sputtered A31 and a non-sputtering part A32, or only There is the surface A31 to be sputtered; the frame A2 is provided with a positioning hole A22 on the short side A21 of the rectangular periphery; the carrier A4 includes a flat bearing surface A41 and is located on the periphery of the bearing surface A41 and protrudes from the bearing A rectangular frame A42 with a height of surface A41 is provided with a protruding pin body A43 on the surface of the bearing surface A41 adjacent to the frame A42. When the base film A1 is placed on the surface of the bearing surface A41 of the carrier A4, , the positioning hole A22 of the frame A2 is just placed on the pin body A43, so that the base film A1 is positioned.
請參閱圖1、2、3所示，本發明實施例使用一待濺鍍物件定位裝置B將所述被搬送物A中的該待濺鍍物件更穩固地壓靠黏附定位於該底膜A1上表面，該待濺鍍物件定位裝置B設有：一軌架B1，其設有可供該被搬送物A在其上進行位移的軌道B11；一治具B2，設於軌道B11中，其設有提供該被搬送物A留置其上的載台B21；一捲繞機構B3，設有可被驅動繞轉位移經該載台B21上方的可撓性帶狀的一隔膜B31，及可被驅動在該隔膜B31上進行滾動的輥桿B32； 該被搬送物A可在該軌道B11上被搬送至該治具B2的該載台B21與該隔膜B31之間，該輥桿B32可經由該隔膜B31對該被搬送物A進行輥壓。 Please refer to Figures 1, 2, and 3. In the embodiment of the present invention, an object to be sputtered positioning device B is used to more firmly press and adhere the object to be sputtered in the transported object A to the base film A1. On the upper surface, the positioning device B for the object to be sputtered is provided with: a rail frame B1, which is provided with a rail B11 on which the transported object A can be displaced; a fixture B2, which is located in the rail B11. There is provided a carrier B21 on which the transported object A is placed; a winding mechanism B3 is provided with a flexible belt-shaped diaphragm B31 that can be driven to rotate and move through the carrier B21, and can be drive the roller B32 that rolls on the diaphragm B31; The object A can be transported on the track B11 between the stage B21 of the jig B2 and the diaphragm B31, and the roller B32 can roll the object A through the diaphragm B31.
該軌架B1係由相隔間距的兩側架B12相對應的內側設置可受驅動繞轉的皮帶B13，而在該皮帶B13上方形成供水平X軸向搬送該被搬送物A之該軌道B11；該治具B2設於該兩側架B12間，該載台B21受一昇降機構B22所驅動，而可承載停置於該載台B21上方之該皮帶B13上的該被搬送物A作上昇或下降，該昇降機構B22包括一組具斜面的導座B221以及設於該載台B21下方並與該載台B21連動的一組滾輪B222，該導座B221受一驅動件B223作X軸向水平驅動而使該滾輪B222相對在該導座B221斜面位移，而連動使該載台B21作上昇或下降；該捲繞機構B3係在一機板B33上設有相隔間距之供釋放該隔膜B31的釋放輪B34及供捲收該隔膜B31的捲收輪B35；該隔膜B31由該釋放輪B34經一第一方向輪組B341、該載台B21一側的一第一定位輪B342，而延伸過該載台B21另一側的一第二定位輪B352、一第二轉向輪組B351至該捲收輪B35被捲收；在該第一轉向輪組B341處設有一受該機板B33後一配重作用且可在一滑軌(配重及滑軌圖中未示)上作上下位移的配重輪B343；該第一轉向輪組B341與該第一定位輪B342間該隔膜B31輸送的路徑上設有一第一夾持機構B344，可藉受汽壓缸類之驅動件B3441驅動的壓抵件B3442壓夾輸經的該隔膜B31至該機板B33上一固定件B3443而使該隔膜B31的傳輸被止動；在該第二轉向輪組B351處設有一與該機板B33後一受偵測的分度盤(圖中未示)連動的偵測輪B353；該第二轉向輪組B351與該第二定位輪B352間該隔膜B31輸送的路徑上設有一第二夾持機構B354，可藉受汽壓缸類之驅動件B3541驅動的壓抵件B3542壓夾輸經的該隔膜B31至該機板B33上一固定件B3543而使該隔膜B31的傳輸被止動；該第一夾持機構B344、第二夾持機構B354分別位於該輥桿B32 滾動行程區間外兩端；該第一定位輪B342及第二定位輪B352間的該隔膜B31上方設該輥桿B32，該輥桿B32兩端分別各受可在一滑軌B321上位移的移動座B322所樞設支撐及連動，二個該移動座B322共同受一驅動件B323同步驅動，每一該移動座B322上各設有荷重量測單元B324，可對該輥桿B32兩端的下壓重力進行量測；該隔膜B31可被該捲收輪B35牽引位移，以改變該隔膜B31被該輥桿B32滾動接觸的部位，但該輥桿B32在該隔膜B31上欲作滾動時，先使該輥桿B32滾動行程區間外的該隔膜B31兩端被該第一夾持機構B344及該第二夾持機構B354作夾持固定。 The rail frame B1 is provided with a belt B13 that can be driven to rotate on the corresponding inner side of the two side frames B12 spaced apart, and a track B11 is formed above the belt B13 for horizontal X-axis transportation of the transported object A; The fixture B2 is disposed between the two side frames B12. The carrier B21 is driven by a lifting mechanism B22 and can carry the transported object A parked on the belt B13 above the carrier B21 for lifting or lifting. Descending, the lifting mechanism B22 includes a set of inclined guide seats B221 and a set of rollers B222 located below the carrier B21 and linked with the carrier B21. The guide B221 is driven horizontally in the X-axis direction by a driving member B223. The roller B222 is driven to move relative to the inclined plane of the guide B221, and in conjunction, the carrier B21 is raised or lowered; the winding mechanism B3 is provided with intervals on a machine plate B33 for releasing the diaphragm B31 The release wheel B34 and the rewinding wheel B35 for retracting the diaphragm B31; the diaphragm B31 extends from the release wheel B34 through a first direction wheel set B341 and a first positioning wheel B342 on one side of the carrier B21. A second positioning wheel B352 and a second steering wheel set B351 on the other side of the carrier B21 are rolled up to the retracting wheel B35; a receiving wheel behind the machine plate B33 is provided at the first steering wheel set B341. The counterweight wheel B343 acts as a counterweight and can move up and down on a slide rail (the counterweight and slide rail are not shown in the figure); the diaphragm B31 transports the first steering wheel set B341 and the first positioning wheel B342. A first clamping mechanism B344 is provided on the path, and the pressing member B3442 driven by the driving member B3441 of a pneumatic cylinder can press the diaphragm B31 passing through to a fixing member B3443 on the machine plate B33, so that the diaphragm The transmission of B31 is stopped; the second steering wheel set B351 is provided with a detection wheel B353 that is linked to a detected indexing plate (not shown in the figure) behind the machine plate B33; the second steering wheel A second clamping mechanism B354 is provided on the conveying path of the diaphragm B31 between the group B351 and the second positioning wheel B352, which can clamp the conveyed diaphragm by means of the pressing member B3542 driven by the driving member B3541 of a pneumatic cylinder. B31 to a fixing piece B3543 on the machine plate B33 to stop the transmission of the diaphragm B31; the first clamping mechanism B344 and the second clamping mechanism B354 are respectively located on the roller B32 The two ends outside the rolling stroke range; the roller B32 is provided above the diaphragm B31 between the first positioning wheel B342 and the second positioning wheel B352, and the two ends of the roller B32 are respectively moved by a slide rail B321. The base B322 is pivotally supported and linked. The two movable bases B322 are synchronously driven by a driving member B323. Each movable base B322 is provided with a load measuring unit B324, which can press down both ends of the roller bar B32. The gravity is measured; the diaphragm B31 can be pulled and displaced by the rewinding wheel B35 to change the rolling contact position of the diaphragm B31 by the roller B32. However, when the roller B32 wants to roll on the diaphragm B31, first use The two ends of the diaphragm B31 outside the rolling stroke range of the roller B32 are clamped and fixed by the first clamping mechanism B344 and the second clamping mechanism B354.
在實施上，使該被搬送物A被輸送至或被置於該載台B21，使該被搬送物A位於該載台與該可撓性帶狀的該隔膜B31間，再使該載台B21受該昇降機構B22驅動上移一預設高度貼靠於該隔膜B31下方，再使該輥桿B32受驅動以兩側的該移動座B322在該滑軌B321上位移，使該輥桿B32在該隔膜B31上作滾動，以間接使該複數個待濺鍍物件A3與下方該底膜A1間可能存在的氣泡被擠出，而使該待濺鍍物件A3與該底膜A1黏附穩固，並藉由該隔膜B31兩側分別所設之該移動座B322上的該荷重量測單元B324量測該輥桿B32兩端的荷重，以適時調控該輥桿B32兩端的下壓力道；完成輥壓操作後，該昇降機構B22驅動該載台B21下移，然後使該被搬送物A脫離該隔膜B31，並使該被搬送物A被移出該載台B21。 In practice, the object A is transported or placed on the stage B21, so that the object A is located between the stage and the flexible belt-shaped diaphragm B31, and then the stage is B21 is driven by the lifting mechanism B22 to move up to a preset height and close to the bottom of the diaphragm B31, and then the roller B32 is driven to displace the movable seats B322 on both sides on the slide rail B321, so that the roller B32 Roll on the diaphragm B31 to indirectly squeeze out the bubbles that may exist between the objects A3 to be sputtered and the base film A1 below, so that the objects A3 to be sputtered and the base film A1 are firmly adhered. And the load measuring unit B324 on the movable seat B322 provided on both sides of the diaphragm B31 measures the load at both ends of the roller B32 to timely adjust the downward pressure path at both ends of the roller B32 to complete the rolling process. After the operation, the lifting mechanism B22 drives the carrier B21 to move downward, and then causes the transported object A to break away from the diaphragm B31, and allows the transported object A to be moved out of the carrier B21.
請參閱圖2、3、4，為使待濺鍍物件的前置作業更完善及有效率，本發明提供一使用該待濺鍍物件定位裝置B的待濺鍍物件施作設備實施例，其在同一機台台面C上設置該待濺鍍物件定位裝置B，並在該待濺鍍物件A5壓合裝置B之一側設置一清潔裝置D，使該被搬送物A被輸送至該載台B21與該隔膜B31間前，執行對圖1中該被搬送物A上複數個待濺鍍物件A5吹送正壓氣體的清潔工作。 Please refer to Figures 2, 3, and 4. In order to make the preparatory work of the object to be sputtered more complete and efficient, the present invention provides an embodiment of equipment for applying the object to be sputtered using the positioning device B for the object to be sputtered. The object to be sputtered positioning device B is provided on the table C of the same machine, and a cleaning device D is provided on one side of the pressing device B for the object to be sputtered A5, so that the transported object A is transported to the stage. In front of the space between B21 and the diaphragm B31, the cleaning work of blowing positive pressure gas to the plurality of objects to be sputtered A5 on the transported object A in Figure 1 is performed.
請參閱圖5、6，該清潔裝置D設有一清潔軌架D1及覆罩在該軌架D1上的一罩蓋D2，該清潔軌架D1在相隔間距的兩側架D11相對應的內側設置可受驅動繞轉的皮帶D12，而在該皮帶D12上方形成供搬送該被搬送物A之一清潔軌道D13，該罩蓋D2內設有分別各位於兩側近入、出口D21、D22處呈相向朝內對應的二個噴嘴D23、D24，該罩蓋D2上方設有相隔間距的二個排氣口D25、D26；該清潔軌架D1的該清潔軌道D13與圖2中該待濺鍍物件定位裝置B的軌道B11對應並形成被搬送物A可輸送的搬送流路，該清潔軌架D1的該清潔軌道D13為該搬送流路的前端流路，被搬送物A在該清潔軌道D13上受該噴嘴D23、D24正壓氣體對圖1中該待濺鍍物件A3外表面吹噴，使該待濺鍍物件A3在進行壓合前排除污塵沾附以提高濺鍍品質，而該正壓氣體充斥該罩蓋D2內後由該排氣口D25、D26逸散排出。 Please refer to Figures 5 and 6. The cleaning device D is provided with a cleaning rail frame D1 and a cover D2 covering the rail frame D1. The cleaning rail frame D1 is provided on the corresponding inner side of the two sides of the spaced apart frame D11. A belt D12 can be driven to rotate, and a cleaning track D13 for transporting the transported object A is formed above the belt D12. The cover D2 is provided with inlets and outlets D21 and D22 facing each other on both sides. There are two corresponding nozzles D23 and D24 facing inward, and two exhaust ports D25 and D26 spaced apart above the cover D2; the cleaning rail D13 of the cleaning rail frame D1 is positioned with the object to be sputtered in Figure 2 The track B11 of the device B corresponds to and forms a conveying flow path that can convey the object A. The cleaning track D13 of the cleaning rail frame D1 is the front end flow path of the conveying path. The object A is received on the cleaning track D13. The positive pressure gas from the nozzles D23 and D24 blows on the outer surface of the object A3 to be sputtered in Figure 1, so that the object A3 to be sputtered can eliminate dust adhesion before lamination to improve the sputtering quality, and the positive pressure The gas fills the cover D2 and then escapes from the exhaust ports D25 and D26.
請參閱圖1、3、4，本發明該待濺鍍物件施作設備實施例中，若該待濺鍍物件A3設有一不作濺鍍部位A32，在移除該隔膜B31後，執行使一蓋體A5覆罩在該被搬送物A上，並遮蔽該不需濺鍍的部位A32上表面的製程，為實施覆罩該蓋體A5的製程，可在同一機台台面C上除設置該待濺鍍物件定位裝置B外，在該待濺鍍物件定位裝置B之一側另設置一覆蓋裝置E；該覆蓋裝置E設有一輸送軌架E1、一儲蓋機構E2、及一移載機構E3；其中，該輸送軌架E1在相隔間距的兩側架E11相對應的外側設置可受驅動繞轉的皮帶E12，而在該皮帶E12上方形成供搬送該被搬送物A之一輸送軌道E13；該輸送軌架E1的該輸送軌道E13與該待濺鍍物件定位裝置B的軌道B112對應並形成被搬送物A可輸送的搬送流路，該輸送軌架E1的該輸送軌道E13為該搬送流路的後端流路；該儲蓋機構E2設於被搬送物A輸送的搬送流路外，包括可在一組滑軌E21上作Y軸向位移的儲蓋架E22，該儲蓋架E22提供複數個蓋體A5可疊置其間的容置空間E221，該蓋體A5設有可遮蔽該 待濺鍍物件A3上不作濺鍍部位A32之部位的遮蔽部A51，該容置空間E221下方設有可托頂容置其中該蓋體A5作上下位移的托頂機構E222；該移載機構E3設有以二支柱E311跨於該被搬送物A輸送的該搬送流路兩側的龍門座架E31，該龍門座架E31的一Y軸向橫樑E312上設有一移載架E313，該移載架E313受一Y軸向驅動件E314及一Z軸向驅動件E314所驅動，可以該移載架E313下方的設有複數個個吸附件E315的一提取座E316往復位移於該儲蓋機構E2與該輸送軌架E1間，以提取蓋體A5覆於該輸送軌架E1上的該被搬送物A上。 Please refer to Figures 1, 3, and 4. In the embodiment of the equipment for sputtering the object to be sputtered according to the present invention, if the object to be sputtered A3 is provided with a non-sputtering part A32, after the diaphragm B31 is removed, a cover is The process of covering the body A5 on the conveyed object A and shielding the upper surface of the part A32 that does not require sputtering is carried out. In order to implement the process of covering the cover body A5, the waiting body A5 can be installed on the table C of the same machine. In addition to the sputtering object positioning device B, a covering device E is provided on one side of the sputtering object positioning device B; the covering device E is provided with a conveyor rail E1, a cover storage mechanism E2, and a transfer mechanism E3 ; Among them, the conveyor rail frame E1 is provided with a belt E12 that can be driven to rotate on the corresponding outside of the two side frames E11 spaced apart, and a conveyor track E13 is formed above the belt E12 for transporting the transported object A; The conveying track E13 of the conveying rail frame E1 corresponds to the track B112 of the object positioning device B to be sputtered and forms a conveying flow path through which the object A can be conveyed. The conveying track E13 of the conveying rail frame E1 is the conveying flow path. The rear end flow path of the path; the lid storage mechanism E2 is located outside the conveying flow path of the transported object A, and includes a lid storage rack E22 that can perform Y-axis displacement on a set of slide rails E21. The lid storage rack E22 Provide an accommodation space E221 in which a plurality of covers A5 can be stacked, and the cover A5 is provided with a structure that can shield the On the object A3 to be sputtered, there is a shielding part A51 of the part where the sputtering part A32 is not to be made. There is a supporting mechanism E222 below the accommodating space E221 that can hold the cover A5 and move it up and down; the transfer mechanism E3 A gantry frame E31 is provided with two pillars E311 spanning both sides of the conveying flow path for conveying the object A. A transfer rack E313 is provided on a Y-axis beam E312 of the gantry frame E31. The rack E313 is driven by a Y-axis driving member E314 and a Z-axis driving member E314. An extraction seat E316 provided with a plurality of adsorption pieces E315 below the transfer rack E313 can be reciprocally displaced on the cap storage mechanism E2. Between the conveyor rail E1 and the conveyor rail E1, an extraction cover A5 is used to cover the conveyed object A on the conveyor rail E1.
請參閱圖4，本發明該待濺鍍物件施作設備實施例中，另可以在同一機台台面C上該被搬送物A的直線搬送流路上，於該待濺鍍物件定位裝置B的一側設置一供料裝置F以容置該被搬送物A，並供應該被搬送物A到該搬送流路，使該被搬送物A直接被輸入該待濺鍍物件定位裝置B進行定位，或先在該清潔裝置D被進行清潔後再輸入該待濺鍍物件定位裝置B進行定位；本發明該待濺鍍物件施作設備實施例亦可以在該待濺鍍物件定位裝置B的另一側設置一收料裝置G以容置並收納已完成定位或定位後已覆上蓋體A5的被搬送物A，以進行疊置收集；該供料裝置F包括一容置架F1以及位於該容置架F1下方的一軌架F2，該軌架F2設有相隔間距的二個該側架F3及位於二個該側架F3內側由受驅動的皮帶F4所形成的軌道F5，該軌道中的該容置架F1下方設有一托頂機構F6以托頂該容置架F1中層層疊置的被搬送物A作上下位移。該收料裝置G同樣設有與收料裝置G大致相同的容置架F1、軌架F2、皮帶F4、軌道F5、托頂機構F6，茲不贅述。 Please refer to Figure 4. In the embodiment of the equipment for applying sputtering objects according to the present invention, one of the positioning devices B for the objects to be sputtered can also be placed on the linear conveying flow path of the conveyed object A on the same machine table C. A feeding device F is provided on the side to accommodate the transported object A, and supplies the transported object A to the transport flow path, so that the transported object A is directly input into the object to be sputtered positioning device B for positioning, or First, after the cleaning device D is cleaned, the object to be sputtered positioning device B is input for positioning; the embodiment of the device for applying the object to be sputtered according to the present invention can also be on the other side of the positioning device B for the object to be sputtered. A collecting device G is provided to accommodate and store the transported objects A that have been positioned or covered with the cover A5 after positioning, for stacking and collection; the feeding device F includes a storage rack F1 and a storage rack F1 located in the container. There is a rail frame F2 below the frame F1. The rail frame F2 is provided with two side frames F3 spaced apart from each other and a track F5 formed by a driven belt F4 located inside the two side frames F3. The track F5 in the track is A supporting mechanism F6 is provided below the storage rack F1 to support the stacked objects A in the storage rack F1 to move up and down. The material collecting device G is also provided with a receiving frame F1, a rail frame F2, a belt F4, a track F5, and a supporting mechanism F6 that are substantially the same as the material collecting device G, which will not be described in detail.
本發明實施例待濺鍍物件定位方法、裝置及施作設備，藉由載有該複數個待濺鍍物件A3的該底膜A1置於該載盤A4所形成的該被搬送物A被輸送至該載台B21與可撓性帶狀的該隔膜B31間，使該輥桿B32在該 隔膜B31上作滾動，以使該複數個待濺鍍物件A3與下方該底膜A1黏附穩固定位，使各待濺鍍物件A3可以在未來濺鍍製程中取得一致的濺鍍品質；若佐以在同一機台台面C上設置該清潔裝置D、覆蓋裝置E或供料裝置F、收料裝置G而形成一施作設備，則不僅可同時完成待濺鍍物件A3的清潔、定位、覆蓋，更可有效率的搬送及完成整個待濺鍍物件A3的濺鍍前置作業，提昇待濺鍍物件A3的濺鍍品質及提高產能。 According to the embodiment of the present invention, the object to be sputtered is positioned by the method, device and equipment for positioning the object to be sputtered. The object A is conveyed by placing the base film A1 carrying the objects to be sputtered A3 on the carrier tray A4. to the space between the stage B21 and the flexible belt-shaped diaphragm B31, so that the roller B32 is in the The diaphragm B31 is rolled so that the plurality of objects A3 to be sputtered are adhered to the bottom film A1 and firmly positioned, so that each object A3 to be sputtered can obtain consistent sputtering quality in the future sputtering process; The cleaning device D, the covering device E or the feeding device F and the collecting device G are arranged on the table C of the same machine to form a working equipment, which can not only complete the cleaning, positioning and covering of the object A3 to be sputtered at the same time, but also It can efficiently transport and complete the entire pre-sputtering operation of the object A3 to be sputtered, thereby improving the sputtering quality of the object A3 to be sputtered and increasing productivity.
惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 However, the above are only examples of the present invention, and should not be used to limit the scope of the present invention. All simple equivalent changes and modifications made based on the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by the patent of this invention.
B1:軌架 B1: Rail frame
B11:軌道 B11: Track
B12:側架 B12: Side stand
B13:皮帶 B13: Belt
B2:治具 B2: Jig
B21:載台 B21: Carrier platform
B3:捲繞機構 B3: Winding mechanism
B32:輥桿 B32:Roller rod
B321:滑軌 B321:Slide rail
B322:移動座 B322: Mobile base
B324:荷重量測單元 B324: Load measuring unit
Claims (10)
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| TW109144144A TWI815066B (en) | 2020-12-14 | 2020-12-14 | Positioning method, device and application equipment for objects to be sputtered |
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| TW109144144A TWI815066B (en) | 2020-12-14 | 2020-12-14 | Positioning method, device and application equipment for objects to be sputtered |
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| TW202223128A TW202223128A (en) | 2022-06-16 |
| TWI815066B true TWI815066B (en) | 2023-09-11 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030042115A1 (en) * | 2001-09-06 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Conveyor, method for conveying a semiconductor wafer, and method for manufacturing a semiconductor device |
| TW201318094A (en) * | 2011-09-20 | 2013-05-01 | Gen Electric | Apparatus and method for large area hermetic encapsulation of one or more organic light emitting diodes (OLEDs) |
| CN107452667A (en) * | 2016-05-31 | 2017-12-08 | 琳得科株式会社 | Sheet-adhesion device and adhesion method |
| US20200251453A1 (en) * | 2015-03-20 | 2020-08-06 | Rohinni, LLC | Apparatus and method for direct transfer of semiconductor devices from a substrate and stacking semiconductor devices on each other |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030042115A1 (en) * | 2001-09-06 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Conveyor, method for conveying a semiconductor wafer, and method for manufacturing a semiconductor device |
| TW201318094A (en) * | 2011-09-20 | 2013-05-01 | Gen Electric | Apparatus and method for large area hermetic encapsulation of one or more organic light emitting diodes (OLEDs) |
| US20200251453A1 (en) * | 2015-03-20 | 2020-08-06 | Rohinni, LLC | Apparatus and method for direct transfer of semiconductor devices from a substrate and stacking semiconductor devices on each other |
| CN107452667A (en) * | 2016-05-31 | 2017-12-08 | 琳得科株式会社 | Sheet-adhesion device and adhesion method |
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