Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/50—Working by transmitting the laser beam through or within the workpiece
  • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Manufacturing & Machinery (AREA)
• General Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Power Engineering (AREA)
• Oil, Petroleum & Natural Gas (AREA)
• Plasma & Fusion (AREA)
• Mechanical Engineering (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Chemical & Material Sciences (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• General Chemical & Material Sciences (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
• Preparing Plates And Mask In Photomechanical Process (AREA)
• Microwave Amplifiers (AREA)
• Paper (AREA)
• Massaging Devices (AREA)
• Seal Device For Vehicle (AREA)

Applications Claiming Priority (2)

Publications (2)

Family

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Family Applications (5)

Family Applications Before (3)

Family Applications After (1)

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Citations (2)

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• 2018
  • 2018-06-26 WO PCT/JP2018/024113 patent/WO2019244362A1/en active Application Filing
  • 2018-06-26 CN CN201880094255.5A patent/CN112272966B/en active Active
  • 2018-06-26 CN CN202410036703.3A patent/CN117715492A/en active Pending
  • 2018-06-27 TW TW112145274A patent/TW202412360A/en unknown
  • 2018-06-27 TW TW112111310A patent/TWI827492B/en active
  • 2018-06-27 TW TW111119187A patent/TWI784911B/en active
  • 2018-06-27 TW TW111131169A patent/TWI801309B/en active
  • 2018-06-27 TW TW107122157A patent/TWI768072B/en active

Patent Citations (2)

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