TWI801309B - 轉移裝置 - Google Patents
轉移裝置 Download PDFInfo
- Publication number
- TWI801309B TWI801309B TW111131169A TW111131169A TWI801309B TW I801309 B TWI801309 B TW I801309B TW 111131169 A TW111131169 A TW 111131169A TW 111131169 A TW111131169 A TW 111131169A TW I801309 B TWI801309 B TW I801309B
- Authority
- TW
- Taiwan
- Prior art keywords
- transfer device
- transfer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Seal Device For Vehicle (AREA)
- Massaging Devices (AREA)
- Microwave Amplifiers (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-116692 | 2018-06-20 | ||
JP2018116692 | 2018-06-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202301723A TW202301723A (zh) | 2023-01-01 |
TWI801309B true TWI801309B (zh) | 2023-05-01 |
Family
ID=68983359
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112111310A TWI827492B (zh) | 2018-06-20 | 2018-06-27 | 轉移方法及光罩 |
TW111131169A TWI801309B (zh) | 2018-06-20 | 2018-06-27 | 轉移裝置 |
TW107122157A TWI768072B (zh) | 2018-06-20 | 2018-06-27 | 轉移裝置、使用方法和調整方法 |
TW112145274A TW202412360A (zh) | 2018-06-20 | 2018-06-27 | 轉移方法、光罩及顯示器的製造方法 |
TW111119187A TWI784911B (zh) | 2018-06-20 | 2018-06-27 | 轉移裝置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112111310A TWI827492B (zh) | 2018-06-20 | 2018-06-27 | 轉移方法及光罩 |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107122157A TWI768072B (zh) | 2018-06-20 | 2018-06-27 | 轉移裝置、使用方法和調整方法 |
TW112145274A TW202412360A (zh) | 2018-06-20 | 2018-06-27 | 轉移方法、光罩及顯示器的製造方法 |
TW111119187A TWI784911B (zh) | 2018-06-20 | 2018-06-27 | 轉移裝置 |
Country Status (3)
Country | Link |
---|---|
CN (2) | CN117715492A (zh) |
TW (5) | TWI827492B (zh) |
WO (1) | WO2019244362A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7111916B1 (ja) * | 2021-07-20 | 2022-08-02 | 信越化学工業株式会社 | 再転写方法及びリフト方法 |
JP7255000B2 (ja) * | 2021-07-20 | 2023-04-10 | 信越化学工業株式会社 | 不良箇所の除去方法、リフト方法、フォトマスク及びリフトシステム |
CN113782650A (zh) * | 2021-09-07 | 2021-12-10 | 苏州奕格飞半导体技术有限公司 | 晶圆激光剥离装置及方法 |
JP7490848B2 (ja) | 2022-06-15 | 2024-05-27 | 信越化学工業株式会社 | レーザ加工方法、フォトマスク及びレーザ加工システム |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200400630A (en) * | 2002-04-25 | 2004-01-01 | Seiko Epson Corp | Manufacturing method and manufacturing apparatus of electronic device |
TW201528338A (zh) * | 2013-11-19 | 2015-07-16 | 柔芬新拿科技公司 | 藉由叢發超快雷射脈衝能量轉移在基材上正向沈積之方法及裝置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW448487B (en) * | 1997-11-22 | 2001-08-01 | Nippon Kogaku Kk | Exposure apparatus, exposure method and manufacturing method of device |
JP3511359B2 (ja) * | 1998-02-27 | 2004-03-29 | 三菱電機株式会社 | レーザ加工装置 |
US20030162108A1 (en) * | 2002-01-30 | 2003-08-28 | Eastman Kodak Company | Using spacer elements to make electroluminscent display devices |
EP3252533B1 (en) * | 2004-02-04 | 2019-04-10 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing a device |
KR100635579B1 (ko) * | 2004-12-20 | 2006-10-17 | 삼성에스디아이 주식회사 | 레이저 열 전사장치, 상기 장치를 사용하는 레이저 열전사법 및 상기 장치를 사용하는 유기전계발광표시장치제조방법 |
KR100793359B1 (ko) * | 2006-05-03 | 2008-01-11 | 삼성에스디아이 주식회사 | 레이저 조사 장치, 레이저 열 전사 장치 및 이를 사용한oled 어레이 기판의 제조방법 |
JP2009199856A (ja) * | 2008-02-21 | 2009-09-03 | Sony Corp | 有機薄膜製造装置及び有機薄膜製造方法 |
WO2009110202A1 (ja) * | 2008-03-07 | 2009-09-11 | 株式会社ニコン | 移動体装置及び露光装置 |
KR20100062595A (ko) * | 2008-12-02 | 2010-06-10 | 엘지디스플레이 주식회사 | 레이저 전사 장치와 이를 이용한 유기전계발광표시장치의 제조방법 |
JP2013020768A (ja) * | 2011-07-08 | 2013-01-31 | Ulvac Japan Ltd | レーザ転写装置 |
KR101340617B1 (ko) * | 2011-12-30 | 2013-12-11 | 엘아이지에이디피 주식회사 | 도너 필름 트레이 |
KR102001226B1 (ko) * | 2012-11-12 | 2019-07-25 | 삼성디스플레이 주식회사 | 레이저 열전사 장치 및 레이저 열전사 방법 |
KR20140133741A (ko) * | 2013-05-10 | 2014-11-20 | 삼성디스플레이 주식회사 | 레이저 열전사용 마스크 및 이를 포함하는 레이저 조사 장치 |
KR102078294B1 (ko) * | 2016-09-30 | 2020-02-17 | 코닝 인코포레이티드 | 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법 |
-
2018
- 2018-06-26 WO PCT/JP2018/024113 patent/WO2019244362A1/ja active Application Filing
- 2018-06-26 CN CN202410036703.3A patent/CN117715492A/zh active Pending
- 2018-06-26 CN CN201880094255.5A patent/CN112272966B/zh active Active
- 2018-06-27 TW TW112111310A patent/TWI827492B/zh active
- 2018-06-27 TW TW111131169A patent/TWI801309B/zh active
- 2018-06-27 TW TW107122157A patent/TWI768072B/zh active
- 2018-06-27 TW TW112145274A patent/TW202412360A/zh unknown
- 2018-06-27 TW TW111119187A patent/TWI784911B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200400630A (en) * | 2002-04-25 | 2004-01-01 | Seiko Epson Corp | Manufacturing method and manufacturing apparatus of electronic device |
TW201528338A (zh) * | 2013-11-19 | 2015-07-16 | 柔芬新拿科技公司 | 藉由叢發超快雷射脈衝能量轉移在基材上正向沈積之方法及裝置 |
Also Published As
Publication number | Publication date |
---|---|
TW202329505A (zh) | 2023-07-16 |
TW202412360A (zh) | 2024-03-16 |
TW202301723A (zh) | 2023-01-01 |
CN117715492A (zh) | 2024-03-15 |
TWI827492B (zh) | 2023-12-21 |
TWI768072B (zh) | 2022-06-21 |
TW202002358A (zh) | 2020-01-01 |
TW202234729A (zh) | 2022-09-01 |
WO2019244362A1 (ja) | 2019-12-26 |
CN112272966B (zh) | 2024-02-02 |
TWI784911B (zh) | 2022-11-21 |
CN112272966A (zh) | 2021-01-26 |
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