TWI789473B - 工件的加工裝置 - Google Patents

工件的加工裝置 Download PDF

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TWI789473B
TWI789473B TW107146652A TW107146652A TWI789473B TW I789473 B TWI789473 B TW I789473B TW 107146652 A TW107146652 A TW 107146652A TW 107146652 A TW107146652 A TW 107146652A TW I789473 B TWI789473 B TW I789473B
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resin
workpiece
grinding
cassette
thickness
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TW201931459A (zh
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渡邊真也
山端一郎
鈴木克彥
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日商迪思科股份有限公司
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Abstract

[課題]在將樹脂覆蓋在工件的情況中，可將所覆蓋的樹脂的厚度控制為期望的厚度，且將樹脂膜高精確度地平坦化。[解決手段]一種工件的加工裝置1，將樹脂覆蓋在工件W的正面Wa，該工件W的正面Wa係在多條分割預定線S所劃分的區域上形成元件D，該區域形成為格子狀；工件的加工裝置包含：卡匣載置台53、54，係載置容納多個工件W的卡匣51、52；樹脂覆蓋單元2，係將樹脂覆蓋在工件W的正面Wa；樹脂硬化單元4，係對覆蓋的樹脂施加外部刺激而使樹脂硬化；樹脂研削單元6，係以旋轉的研削磨石641研削硬化的樹脂並使其平坦化；以及搬送機構，係在各單元之間搬送工件W。

Description

工件的加工裝置
本發明係關於一種工件的加工裝置，特別是關於一種能將樹脂覆蓋在工件之工件的加工裝置。
在半導體元件的製造程序中，係在工件的正面格子狀地形成有多條分割預定線，並在由分割預定線劃分的各區域形成IC、LSI等元件。這些工件係背面藉由研削磨石來研削而薄化至預定厚度後，藉由研削裝置等沿著分割預定線分割來製造各個半導體元件晶片。
接著，在研削背面而將工件薄化時，取代研削加工用的保護膠膜黏貼在工件的正面而保護元件，而有如後述的方法（例如參照專利文獻1）：以藉由紫外線等硬化的樹脂覆蓋工件的正面而形成樹脂膜，且藉此樹脂膜來保護工件的正面的元件。
[習知技術文獻] [專利文獻] [專利文獻1]日本特開2009-043931號公報。
[發明所欲解決的課題] 可是，在藉由旋轉塗佈等來將液狀樹脂覆蓋在工件的正面的情況，因為液狀樹脂的控制實為困難，所以在工件的正面上將覆蓋樹脂的厚度控制為均一的期望的厚度相當困難，此外，將覆蓋樹脂的露出面高精確度地來平坦化亦是困難的。且在覆蓋樹脂的厚度無法成為期望的厚度的情況下、或在覆蓋樹脂的露出面無法良好精確地平坦化的情況下，對工件施以研削加工時會造成工件的厚度精確度下降。
因此，本發明目的在於供給一種工件的加工裝置，在藉由旋轉塗佈等將樹脂覆蓋在工件而形成樹脂膜的情況中，能將覆蓋的樹脂膜的厚度作成期望的厚度，且能將樹脂膜的露出面高精確度地平坦化。
[解決課題的技術手段] 若根據本發明，係提供一種工件的加工裝置，將樹脂覆蓋在工件的正面，該工件的正面係在多條分割預定線所劃分的各區域上形成元件，該各區域形成為格子狀；工件的加工裝置具備：卡匣載置手段，係載置容納多個工件的卡匣；樹脂覆蓋手段，係將樹脂覆蓋在工件的正面；樹脂硬化手段，係對覆蓋的樹脂施加外部刺激而使該樹脂硬化；樹脂研削手段，係以旋轉的研削磨石研削硬化的樹脂並使其平坦化；以及搬送手段，係在該卡匣載置手段、該樹脂覆蓋手段、該樹脂硬化手段以及該樹脂研削手段之間搬送工件。
較佳地，該樹脂覆蓋手段，係藉由旋轉塗佈法將樹脂覆蓋在工件的正面。
較佳地，本發明的工件的加工裝置，係測量研削後的樹脂的厚度，並將測量的樹脂的厚度傳達至：研削工件的背面並將工件薄化至預定厚度之後續步驟的研削裝置。
[發明功效] 若根據本發明，可以只在工件的加工裝置內來將覆蓋的樹脂膜的厚度作成所要的厚度，且能將樹脂膜的露出面高精確度地平坦化。
更進一步，測量研削後的樹脂的厚度，並將測量的樹脂的厚度傳達至：研削工件的背面並將工件薄化至預定厚度之後續步驟的研削裝置，藉此在後續步驟的研削裝置中可提升工件研削後的精研厚度的精確度。
圖1所示之本發明的加工裝置1係為：可以將樹脂覆蓋在工件W的正面Wa，並以研削磨石641研削覆蓋的樹脂之加工裝置。在加工裝置1的基座10的前方側（-Y方向側），配設有第一卡匣51與第二卡匣52；其中，該第一卡匣51係在其內部形成有多層的欄架且能將樹脂覆蓋前的工件W以多層架狀地收納，該第二卡匣52係在其內部形成有多層的欄架且能將研削覆蓋樹脂後的工件W以多層架狀地收納。而第一卡匣51係載置於配設在基座10的第一卡匣載置手段53，第二卡匣52則載置於配設在基座10的第二卡匣載置手段54。
在第一卡匣51內以多層架狀收納的工件W，係例如是以矽為基材且外形為圓形板狀的半導體晶圓，在圖1中，於朝向上側的正面Wa係形成有垂直交叉的多條分割預定線S，在由分割預定線S劃分為格子狀的各區域則分別形成有IC等的元件D。又，工件W亦可用矽以外的砷化鎵、藍寶石、氮化鎵或炭化矽等構成，其外形亦可非圓形，亦可例如形成為矩形狀。向加工裝置1供給工件W，係藉由將第一卡匣51載置於第一卡匣載置手段53來有效率地進行；其中，該第一卡匣51在內部收納有多片工件W。
因為第一卡匣載置手段53與第二卡匣載置手段54為相同的構成，所以以下只針對第一卡匣載置手段53的構成說明。第一卡匣載置手段53例如具備載置有第一卡匣51的卡匣台531，該卡匣台531藉由未圖示的升降梯在上下方向移動。
在卡匣台531的上面的四個角落，例如配設有外形為俯視呈大致L字型之未圖示的卡匣定位構件。以第一卡匣51的下面側的角部分卡合卡匣定位構件的方式，使第一卡匣51載置於卡匣台531的上面，藉此往水平面方向的移動被限制而不會偏移。
在第一卡匣51與第二卡匣52的附近，配設有具有如後述功能的第一搬送機械81：將樹脂覆蓋前的工件W從第一卡匣51搬出，且將覆蓋樹脂加以研削後的工件W搬入至第二卡匣52。第一搬送機械81為多個手臂與迴旋各手臂的迴旋手段連結而構成的多關節狀的機械，且在前端具備能吸引保持工件W的機械810。機械810可為接觸工件W並將吸引力傳達至工件W的類型，或是利用柏努利原理能以非接觸方式吸引保持工件W的類型的任一者。
在第一搬送機械81的可動區域，配設有對位手段14與清洗裝置15；其中，該對位手段14係將樹脂覆蓋前的工件W對位在預定的位置，而該清洗裝置15係清洗研削覆蓋樹脂後的工件W。 對位手段14一邊將第一搬送機械81所搬入至台座140的工件W維持在同一圓周上的位置，一邊以各接觸銷141推壓工件的外周緣來修正位置並做定心；其中，該各接觸銷141以縮徑的方式移動。 清洗裝置15例如是片葉式的旋塗清洗裝置，其能將第一搬送機械81搬送來的研削覆蓋樹脂後的工件W以未圖示的清洗台保持，並能藉由對保持的工件W的樹脂噴射清洗水而逐片清洗（去除來自樹脂的研削屑等）。又，清洗裝置15亦可為能將工件W多片同時清洗的批次式清洗裝置。
在對位手段14的附近配設有第二搬送機械82，在清洗裝置15的附近則配設有第三搬送機械83。第二搬送機械82將以對位手段14做定心的樹脂覆蓋前的工件W搬送至後述的樹脂覆蓋手段2的旋轉台20。又，第二搬送機械82還將呈以下狀態的工件W從旋轉台20上搬送至後述的保持台30，該狀態為：在樹脂硬化手段4中，具備被UV照射並硬化的樹脂膜之狀態。
第二搬送機械82例如是具備：吸附墊820，外形係為圓板狀，且其下面成為吸附保持工件W的吸附面；手臂821，係在水平方向延伸，且在其前端下面固定有吸附墊820；以及手臂移動手段822，係連接手臂821，並在Z軸方向的軸心周圍將手臂821往水平方向迴旋。手臂821亦可例如呈藉由手臂移動手段822而能在Z軸方向上下移動。
第三搬送機械83，係將硬化的樹脂被圖1所示的樹脂研削手段6研削後的工件W從保持台30搬送至清洗裝置15的清洗台。第三搬送機械83的構成因為相同於第二搬送機械82，所以省略說明。
樹脂覆蓋手段2為配設在基座10上的第二搬送機械82的可動範圍且將樹脂覆蓋在工件W的正面Wa，該樹脂覆蓋手段2例如是旋轉塗佈機（旋轉式塗佈手段），且具備：旋轉台20，係以由多孔構件構成的保持面20a吸引保持工件W；以及噴嘴21，係對保持在旋轉台20的工件W的正面Wa供給液狀樹脂。又，旋轉台20係被未圖示的殼體包圍住周圍，且呈在樹脂覆蓋中時液狀樹脂不會飛散至周圍的構成。
噴嘴21例如是直立設置在旋轉台20側旁，且外形呈側視為大致L字型。形成在噴嘴21的前端部分的供給口，係朝向旋轉台20的保持面20a開口。噴嘴21係呈在Z軸方向的軸心周圍可迴旋，且能將供給口從旋轉台20的上方移動至退開位置。噴嘴21供給的液狀樹脂，例如是具備藉由預定波長的紫外線來照射而能硬化的性質。又，液狀樹脂亦可例如具備硬化後呈非水溶性的性質。
旋轉台20係被蓋體23包圍住周圍。在旋轉台20的下方配設有由馬達與旋轉軸等形成的旋轉手段24（參照圖2），旋轉台20藉由旋轉手段24呈在Z軸方向的軸心周圍為可旋轉。又，旋轉台20藉由第四搬送機構84而呈能與蓋體23一同在Y軸方向去返移動（往復移動）；其中，該第四搬送機構84為配設在蓋體23的下方的樹脂硬化進給搬送手段。
在基座10上的樹脂覆蓋手段2的後方側（+Y方向側），配設有樹脂硬化手段4，該樹脂硬化手段4係將覆蓋在工件W的正面Wa的樹脂施加外部刺激（在本實施形態中為對樹脂的UV照射）而使樹脂硬化。該樹脂硬化手段4例如是包含具箱狀外形的UV照射室40。圖1所示的UV照射室40的前側壁40a，係其下部側缺口為大致長方形狀並形成有搬入出口40b，藉由旋轉台20通過此搬入出口40b，旋轉台20係容納至UV照射室40內。前側壁40a的搬入出口40b則藉由未圖示的捲門而呈可開閉。
舉例而言，在UV照射室40內的上方，配置有多個能將預定波長的紫外線朝向下方照射的低壓水銀UV燈或LED照明等的紫外光（UV）光源。保持覆蓋有樹脂的工件W的旋轉台20被容納至UV照射室40內後，紫外光係從紫外光光源朝向位在下方的工件W的正面Wa照射。藉此覆蓋在正面Wa的樹脂會硬化，而形成保護工件W的正面Wa的樹脂膜。 又，例如旋轉台20亦可由玻璃等的透明構件來構成，亦可在UV照射室40內，在旋轉台20的下方配設有紫外光光源。在此情況，紫外光係穿透透明的旋轉台20從下方照射至覆蓋樹脂。 樹脂硬化手段4的構成並非限定為本實施形態中的例子。舉例而言，在藉由樹脂覆蓋手段2覆蓋於工件W的正面Wa的樹脂膜係由加熱而硬化的熱硬化型的樹脂所形成時，則樹脂硬化手段4可在外殼內部，係具備加熱器或紅外線燈，並可呈對覆蓋的樹脂膜施加熱而使其硬化的構成。
如圖1所示，從基座10的-X方向側的區域的中間到裝置後方，保持台30係呈在Y軸方向為可移動。保持台30例如是其外形為圓形，並以上面300（保持面300）吸引保持工件W；其中，上面由多孔構件等所形成，且連通未圖示的吸引源。保持台30係被蓋體31a圍繞，並在Z軸方向的軸心周圍為可旋轉，且藉由配設在伸縮蓋體31b的下方的未圖示的Y軸方向移動手段，而呈在Y軸方向能去返移動；其中，伸縮蓋體連結蓋體31a與蓋體31a。
在基座10上的後方側係直立設置有柱體17，配設在柱體17的前面且研削進給樹脂研削手段6的研削進給手段7係具備：滾珠螺桿70，係具有Z軸方向的軸心；一對的導軌71，係與滾珠螺桿70平行配設；馬達72，係連結滾珠螺桿70且轉動滾珠螺桿70；以及升降板73，係內部的螺帽螺合滾珠螺桿70，且側部滑接導軌71。其中，研削進給手段係隨著馬達72旋轉滾珠螺桿70，升降板73會被一對的導軌71導引做升降。升降板73係支撐樹脂研削手段6，藉由升降板73的升降，樹脂研削手段6亦做升降。
樹脂研削手段6具備：旋轉軸60，其軸方向係為垂直方向；外殼61，係可旋轉地支撐旋轉軸60；馬達62，係旋轉驅動旋轉軸60；架體63，係組裝在旋轉軸60的下端；以及研削輪64，係可拆裝地連接架體63。其中，在研削輪64的底面，係環狀地配設有大致直方體形狀的多個研削磨石641。研削磨石641係以預定的黏合劑固接鑽石磨粒等而成形。
舉例而言，在旋轉軸60的內部，連通研削水供給源且成為研削水的通道的未圖示的流路，係貫通旋轉軸60的軸方向來成形，流路係在研削輪64的底面中朝向研削磨石641以能噴出研削水的方式來開口。
如圖1所示，在保持台30的移動路徑的上方，配設有厚度測量手段19，該厚度測量手段19，係測量保持台30保持的研削加工後的樹脂的厚度。厚度測量手段19例如是反射型的光移位感測器，並具備投光元件與受光元件；其中，投光元件用以對覆蓋工件W的正面Wa且被研削的樹脂照射測量光，受光元件用以檢測從投光元件照射至樹脂而反射的反射光。
厚度測量手段19係對定位在厚度測量手段19的下方的工件W上的樹脂以投光元件照射測量光，並以受光元件接收反射光。然後，計算受光元件接收的如後述反射光的光路差，基於該計算值由三角測量的原理等測量覆蓋的樹脂的厚度：在樹脂的上面反射的反射光、以及穿透樹脂後在樹脂的下面反射的反射光。又，在計算上述光路差時雖需樹脂的折射率，惟樹脂覆蓋手段2所覆蓋的樹脂的折射率係為已知參數，故能毫無問題地進行計算。
又，厚度測量手段19亦可配設在圖1所示位置以外的位置，其形態亦非限定為本實施形態者。厚度測量手段19亦可例如呈具備接觸式的一對高度測量手段（高度量規）的構成。亦即，厚度測量手段19係具備測量保持台30的保持面300的高度用的第一高度測量手段與測量保持在保持台30的工件W的樹脂上面之高度的第二高度測量手段，其中，第一高度測量手段與第二高度測量手段係在其各前端具備在上下方向做升降且接觸各測量面的接觸器，並將各自的接觸器相對於各測量面，在以適當的力推壓的狀態進行高度測量。像這樣的接觸式的厚度測量手段，係計算第二高度測量手段所測量的工件W的研削後的樹脂上面的高度與第一高度測量手段所測量的保持台30的保持面300的高度的差。該差的值係為工件W的厚度與覆蓋的樹脂的厚度的和，且由於工件W的厚度為已知，因此厚度測量手段19能計算覆蓋的樹脂的厚度。
加工裝置1例如具備進行裝置全體的控制的控制手段9。控制手段9係由依照控制程式做演算處理的CPU與記憶體等的記憶元件所形成，並藉由未圖示的配線連接研削進給手段7或樹脂研削手段6等。然後，在控制手段9的控制之下，如後述的研削裝置各構成的以下動作則被控制：在樹脂研削手段6中研削輪64的旋轉動作、以及在研削進給手段7中之樹脂研削手段6於Z軸方向的研削進給動作等。
以下，針對如後述情況的加工裝置1的動作說明：使用加工裝置1將期望的厚度的樹脂膜覆蓋在工件W的正面Wa。 首先，藉由第一搬送機械81，從第一卡匣51內之例如最下層的欄架中吸引保持並搬出一片工件W（作為第一片的工件W）。接著，第一搬送機械81將工件W置於對位手段14的台座140上，之後，第一搬送機械81從工件W離開。然後，各接觸銷141以縮徑的方式移動並推壓工件W的外周緣而修正其位置，將工件W的中心對位於台座140的中心。
在對位手段14上做工件W的中心位置對位後，各接觸銷141往擴徑方向移動。然後，定心狀態的工件W由第二搬送機械82吸附後搬出。吸附保持工件W的第二搬送機械82係迴旋移動，將工件W搬送並載置於旋轉台20的保持面20a上。工件W以正面Wa朝向上側的狀態吸引保持在旋轉台20的保持面20a上後，第二搬送機械82從工件W離開並從旋轉台20上退開。
接著，噴嘴21係迴旋移動，如圖2所示，其供給口例如定位在工件W的正面Wa的中心上方。然後，從噴嘴21將液狀樹脂滴下至吸引保持在旋轉台20上的工件W的正面Wa的中心部，同時旋轉台20被旋轉手段24旋轉。則滴下的液狀樹脂藉由離心力，從工件W的正面Wa的中心側朝向外周側擴散，從而樹脂覆蓋工件W的正面Wa全部。 像這樣，在本實施形態中樹脂覆蓋手段2，係藉由旋轉塗佈法將樹脂覆蓋在工件W的正面Wa，惟本發明並非限定為此者。舉例而言，樹脂覆蓋手段2亦可例如為藉由灌封或噴霧噴射將樹脂覆蓋在工件W的正面Wa者。
預定量的樹脂供給至工件W的正面Wa，且預定厚度的樹脂膜覆蓋在正面Wa後，則停止從噴嘴21滴下液狀樹脂。又，樹脂膜的厚度係考慮以圖1所示的樹脂研削手段6研削的分量的厚度而決定。接著，旋轉台20藉由配設在圖1所示的蓋體23的下方的第四搬送機構84，往+Y方向移動而被搬送至樹脂硬化手段4的UV照射室40。UV照射室40的未圖示的捲門開啟且旋轉台20通過搬入出口40b被搬入至UV照射室40內後，捲門則關閉。在UV照射室40內，係對吸引保持在旋轉台20的工件W的樹脂膜藉由照射預定波長的UV，從而樹脂膜J（參照圖3）會硬化。
UV對工件W的樹脂膜J照射預定時間後，旋轉台20藉由第四搬送機構84往-Y方向移動，並從樹脂硬化手段4被搬出。旋轉台20定位在第二搬送機械82的可動區域內後，工件W係由第二搬送機械82吸附而從旋轉台20上搬出。舉例而言，吸附保持工件W的樹脂膜J的第二搬送機械82係迴旋移動，將工件W搬送並以樹脂膜J朝向上側的狀態載置於保持台30的保持面300上。工件W吸引保持在保持台30的保持面300上後，第二搬送機械82從工件W離開。
保持工件W的保持台30係在+Y方向移動到樹脂研削手段6之下，如圖3所示，研削輪64的旋轉中心係相對於工件W的旋轉中心往+Y方向偏移預定的距離，而研削磨石641的旋轉軌道則以通過工件W的旋轉中心的方式定位。隨著由圖1所示的馬達62旋轉驅動旋轉軸60，則研削輪64會旋轉。又，樹脂研削手段6係藉由圖3所示的研削進給手段7往-Z方向進給，且藉由旋轉的研削輪64的研削磨石641抵接硬化的樹脂膜J的上面而進行研削加工。又，由於隨著保持台30旋轉，保持在保持面300上的工件W亦會旋轉，因此樹脂膜J的上面全部會被研削而變平坦。舉例而言，在研削加工中，係使研削水通過旋轉軸60中的流路而對研削磨石641與樹脂膜J的接觸部位做供給，從而冷卻、清洗接觸部位。
以研削磨石641研削預定量樹脂膜J後，研削進給手段7係使樹脂研削手段6上升而從工件W離開。更進一步，在旋轉停止的保持台30上，藉由厚度測量手段19測量研削後的樹脂膜J的厚度，且厚度測量手段19將關於工件W（第一片的工件W）的厚度的資訊傳送至控制手段9的記憶體，從而控制手段9儲存該資訊。
吸引保持由厚度測量手段19所測量厚度的工件W的保持台30係往-Y方向移動並定位在第三搬送機械83的可動區域內，接著工件W被第三搬送機械83吸附而從保持台30搬出。然後，吸附保持工件W的樹脂膜J的第三搬送機械83係迴旋移動，將工件W搬入至清洗裝置15。
在清洗裝置15中清洗工件W的樹脂膜J的被研削面後，第一搬送機械81將工件W從清洗裝置15搬出，將工件W搬入至第二卡匣52之例如是最下層的欄架。然後，控制手段9將先前儲存的第一片的工件W的樹脂膜J的厚度與容納第一片的工件W的第二卡匣52內的欄架的層數（最下層）建立關連性並儲存。
像這樣，本發明的加工裝置1因為具備如後述者，所以能單獨在本發明的加工裝置1內將覆蓋的樹脂膜J的厚度作成期望的厚度，且能將樹脂膜J的露出面（被研削面）高精確度地平坦化：第一卡匣載置手段53，係載置容納多個工件W的第一卡匣51；第二卡匣載置手段54，係載置容納多個工件W的第二卡匣52；樹脂覆蓋手段2，係將樹脂覆蓋在工件W的正面Wa；樹脂硬化手段4，係對覆蓋的樹脂施加外部刺激（在本實施形態中為UV的照射）而使樹脂硬化；樹脂研削手段6，係以旋轉的研削磨石641研削硬化的樹脂並使其平坦化；以及在各手段之間搬送工件之第一搬送機械81、第二搬送機械82、第三搬送機械83、第四搬送機構84，。
以下，相同於在上述第一片的工件W形成控制厚度的樹脂膜J，藉由第一搬送機械81將容納在第一卡匣51的工件W從下方的欄架依序搬出，並進行樹脂的覆蓋、覆蓋的樹脂膜的硬化、樹脂膜的研削加工以及樹脂膜的清洗，再將覆蓋有樹脂膜的工件W依序容納至第二卡匣52，例如是從下方的欄架依序來容納。又，藉由控制手段9，將第二卡匣52內的各欄架的層數與容納在該層數的欄架的工件W的樹脂膜的厚度值建立關連性並儲存。
像這樣，當對於第一卡匣51內例如全部的工件W來進行樹脂的覆蓋、覆蓋的樹脂膜的硬化、樹脂膜的研削加工以及樹脂膜的清洗，且覆蓋有樹脂的工件W容納至第二卡匣52之全部的各欄架，則第二卡匣52係藉由未圖示的搬送手段等搬送至後續步驟的研削裝置。 研削裝置係於後續步驟中以保持台吸引保持工件W的樹脂膜側，並以旋轉的研削輪研削以保持台保持的工件W的背面Wb，而將工件W薄化至期望的厚度。舉例而言，加工裝置1的控制手段9係藉由配線電性連接至後續步驟的研削裝置，並將先前儲存的第二卡匣52內的各欄架的層數號之資訊、以及容納在各層數號的欄架的各工件W的樹脂膜的厚度值之資訊，傳達至研削裝置的控制手段。因此，在後續步驟的研削裝置中，使用傳達的工件W的樹脂膜的厚度資訊等，因為能進行研削手段的研削進給位置的適當設定等，所以能提升工件W研削後的精研厚度的精確度。
又，本發明的加工裝置1並非限定為上述實施形態者，又，關於附加圖式所表示的裝置的各構成形狀等亦非限定為此，在能發揮本發明功效的範圍內可以做適當變更。 舉例而言，第一搬送機械81、第二搬送機械82及第三搬送機械83，係在本實施形態中為以吸引力吸引保持工件W的搬送手段，惟亦可例如是如後述的邊緣夾緊型的搬送手段：以在徑方向可縮徑的多個保持爪來保持工件W的外周緣並搬送。
1‧‧‧加工裝置10‧‧‧基座17‧‧‧柱體19‧‧‧厚度測量手段14‧‧‧對位手段15‧‧‧清洗裝置2‧‧‧樹脂覆蓋手段20‧‧‧旋轉台21‧‧‧噴嘴24‧‧‧旋轉手段30‧‧‧保持台300‧‧‧保持面4‧‧‧樹脂硬化手段40‧‧‧UV照射室7‧‧‧研削進給手段70‧‧‧滾珠螺桿71‧‧‧一對的導軌72‧‧‧馬達73‧‧‧升降板51‧‧‧第一卡匣53‧‧‧第一卡匣載置手段531‧‧‧卡匣台52‧‧‧第二卡匣54‧‧‧第二卡匣載置手段6‧‧‧樹脂研削手段60‧‧‧旋轉軸61‧‧‧外殼62‧‧‧馬達63‧‧‧架體64‧‧‧研削輪641‧‧‧研削磨石81‧‧‧第一搬送機械82‧‧‧第二搬送機械83‧‧‧第三搬送機械84‧‧‧第四搬送機構9‧‧‧控制手段W‧‧‧工件Wa‧‧‧工件的正面Wb‧‧‧工件的背面1A‧‧‧後續步驟的研削裝置
圖1係表示加工裝置一例子的立體圖。 圖2係表示以樹脂覆蓋手段將樹脂覆蓋在工件的正面的狀態的立體圖。 圖3係表示以旋轉的研削磨石研削硬化的樹脂而使其平坦化的狀態的剖面圖。
1‧‧‧加工裝置
1A‧‧‧後續步驟的研削裝置
2‧‧‧樹脂覆蓋手段
4‧‧‧樹脂硬化手段
6‧‧‧樹脂研削手段
7‧‧‧研削進給手段
9‧‧‧控制手段
10‧‧‧基座
14‧‧‧對位手段
15‧‧‧清洗裝置
17‧‧‧柱體
19‧‧‧厚度測量手段
20‧‧‧旋轉台
20a‧‧‧保持面
21‧‧‧噴嘴
23‧‧‧蓋體
30‧‧‧保持台
31a‧‧‧蓋體
31b‧‧‧伸縮蓋體
40‧‧‧UV照射室
40a‧‧‧前側壁
40b‧‧‧搬入出口
51‧‧‧第一卡匣
52‧‧‧第二卡匣
53‧‧‧第一卡匣載置手段
54‧‧‧第二卡匣載置手段
60‧‧‧旋轉軸
61‧‧‧外殼
62‧‧‧馬達
63‧‧‧架體
64‧‧‧研削輪
641‧‧‧研削磨石
70‧‧‧滾珠螺桿
71‧‧‧一對的導軌
72‧‧‧馬達
73‧‧‧升降板
81‧‧‧第一搬送機械
82‧‧‧第二搬送機械
83‧‧‧第三搬送機械
84‧‧‧第四搬送機構
140‧‧‧台座
141‧‧‧接觸銷
300‧‧‧保持面
531‧‧‧卡匣台
810‧‧‧機械
820‧‧‧吸附墊
821‧‧‧手臂
822‧‧‧手臂移動手段
D‧‧‧元件
S‧‧‧分割預定線
W‧‧‧工件
Wa‧‧‧工件的正面
Wb‧‧‧工件的背面

Claims (2)

  1. 一種工件的加工裝置，將樹脂覆蓋在工件的正面，該工件的正面係在多條分割預定線所劃分的各區域上形成元件，該各區域形成為格子狀；該工件的加工裝置具備：卡匣載置手段，係載置具備多層的欄架且容納多個工件的卡匣；樹脂覆蓋手段，係將樹脂覆蓋在工件的正面；樹脂硬化手段，係對覆蓋的該樹脂施加外部刺激而使該樹脂硬化；樹脂研削手段，係以旋轉的研削磨石研削硬化的該樹脂的膜並使其平坦化；厚度測量手段，係測量研削加工後的樹脂的膜的厚度；搬送手段，係在該卡匣載置手段、該樹脂覆蓋手段、該樹脂硬化手段及該樹脂研削手段之間搬送工件；以及控制手段，係進行裝置全體的控制，其中，該厚度測量手段測量研削後的該樹脂的膜的厚度，該控制手段儲存關於所測量的該樹脂的膜的厚度的資訊，覆蓋有該樹脂的膜的工件藉由該搬送手段而被搬入該卡匣，並且，該控制手段將所儲存的工件的該樹脂的膜的厚度與容納工件的該卡匣的該欄架的層數號建立關聯性並儲存，在該卡匣被搬送至研削工件的背面並將工件薄化至預定厚度之後續步驟的研削裝置時，該控制手段將所儲存的該卡匣的該欄架的層數號與容納於該層數號的該欄架之工件的該樹脂的膜的厚度值的資訊傳達至該研削裝置。
  2. 如申請專利範圍第1項所述之工件的加工裝置，其中，該樹脂覆蓋手段係藉由旋轉塗佈法將該樹脂覆蓋在工件的正面。
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