TWI757443B - Solder bonding apparatus - Google Patents

Solder bonding apparatus Download PDF

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TWI757443B
TWI757443B TW107107530A TW107107530A TWI757443B TW I757443 B TWI757443 B TW I757443B TW 107107530 A TW107107530 A TW 107107530A TW 107107530 A TW107107530 A TW 107107530A TW I757443 B TWI757443 B TW I757443B
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substrate
electrodes
coil
ferrites
electrode
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TW107107530A
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TW201842997A (en
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田嶋久容
杉山和弘
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日商萬達修查股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/06—Control, e.g. of temperature, of power
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • General Induction Heating (AREA)

Abstract

The subject of the present invention is to provide a solder bonding apparatus comprising: a heating means for bonding an electronic component to an electrode by using a solder. The heating means comprises a coil (20) having a space portion inside thereof, and a plurality of ferrites (30) arranged in the space portion of the coil, an adjustment mechanism (40) for respectively adjusting the spacing between each ferrite and an electrode formed on the substrate; and a power source (50) for applying an alternating voltage to the coil to inductively heat the electrode formed on the substrate. Through adjustment of distance between each ferrite and an electrode in advance, the electrodes, among the multiple electrodes disposed in the inner of a coil, that were heated will reach a homogenous temperature as same as each other.

Description

軟焊料接合裝置Soft Solder Bonding Device

本發明關於一種軟焊料接合裝置，其利用感應加熱，用軟焊料將電子元件接合到形成在基板上的電極上。The present invention relates to a solder bonding apparatus which utilizes induction heating to bond electronic components to electrodes formed on a substrate with soft solder.

先前的軟焊料接合裝置利用迴銲方式進行接合，即對置有電子元件的基板進行加熱，直到達到可讓軟焊料熔融的溫度。因此，軟焊料接合對象區域以外的部分也會過度受熱，電子元件和基板等承受的熱載荷就會增大。Conventional soft solder bonding apparatuses use a reflow method for bonding, that is, heating a substrate on which electronic components are placed until it reaches a temperature at which the soft solder is melted. Therefore, the portion other than the area to be joined by the soft solder is also overheated, and the thermal load on electronic components, substrates, and the like increases.

近年來，伴隨著電子設備的小型化、輕量化，封裝微小電子元件的基板一般採用軟性電路板，但為了削減軟性電路板的成本，先前的聚醯亞胺樹脂正逐漸被聚酯和聚乙烯等樹脂所取代。In recent years, with the miniaturization and weight reduction of electronic devices, flexible circuit boards are generally used as substrates for packaging tiny electronic components. However, in order to reduce the cost of flexible circuit boards, the previous polyimide resins are gradually being replaced by polyester and polyethylene replaced by resin.

然而，聚酯等廉價樹脂的熔點比聚醯亞胺樹脂低。因此，在用軟焊料接合時，存在以下問題：如果軟性電路板被加熱到高於耐熱溫度的溫度，基板就會變形。However, inexpensive resins such as polyester have lower melting points than polyimide resins. Therefore, when bonding with soft solder, there is a problem that if the flexible wiring board is heated to a temperature higher than the heat-resistant temperature, the substrate is deformed.

對於上述問題，在專利文獻1中公開了一種方法，其利用感應加熱，局部性地對軟焊料接合的對象部位進行加熱。該方法為，在使發熱體抵接到基板上的狀態下，將利用感應加熱而被加熱的發熱體的熱量，經由與軟焊料抵接的基板的電極，傳遞給軟焊料，由此使軟焊料熔融。 〔專利文獻〕 [專利文獻1]日本特開2009-95873號公報With regard to the above-mentioned problems, Patent Document 1 discloses a method of locally heating a target site to be soldered by induction heating. In this method, the heat of the heating element heated by induction heating is transferred to the soft solder via the electrodes of the substrate in contact with the soft solder in a state where the heating element is in contact with the board, thereby making the soft solder Solder melted. [Patent Document] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-95873

〔發明所欲解決之問題〕[Problems to be Solved by Invention]

然而，因為在專利文獻1中公開的方法中，是將利用感應加熱而被加熱的發熱體的熱量藉由熱傳導傳遞給與軟焊料抵接的基板的電極，所以加熱效率差。又因為，利用感應加熱而被加熱的發熱體對與軟焊料抵接的基板的電極附近的部分也進行多餘的加熱，所以基板有可能變形。此外，因為在將微小電子元件封裝到基板上時，軟焊料接合的對象部位較小，所以當使發熱體抵接到基板上時，難以準確地抵接到軟焊料接合的對象部位上。However, in the method disclosed in Patent Document 1, since the heat of the heating element heated by induction heating is transferred to the electrodes of the substrate in contact with the soft solder by thermal conduction, the heating efficiency is poor. Furthermore, since the heating element heated by induction heating also excessively heats the portion near the electrodes of the substrate in contact with the soft solder, the substrate may be deformed. In addition, when the microelectronic components are packaged on the substrate, since the target portion for solder bonding is small, when the heating element is brought into contact with the substrate, it is difficult to accurately abut the target portion for solder bonding.

本發明正是鑑於上述問題而完成的，其主要目的是提供一種軟焊料接合裝置，其利用感應加熱，用軟焊料將電子元件接合到形成在基板上的電極上，該軟焊料接合裝置能抑制基板被加熱，並且，即使是微小的電子元件，也能夠容易地用軟焊料進行接合，加熱效率高。而且，本發明提供的軟焊料接合裝置在基板上置有不同種類的電子元件的情況下，也能夠以適當的加熱量用軟焊料同時對不同種類的電子元件進行接合。本發明提供的軟焊料接合裝置還能夠以良好的均一性用軟焊料同時對複數個電子元件進行接合。 〔解決問題之技術手段〕The present invention has been made in view of the above-mentioned problems, and its main object is to provide a soft solder bonding apparatus that uses induction heating to bond electronic components to electrodes formed on a substrate with soft solder, which is capable of suppressing The substrate is heated, and even small electronic components can be easily joined with soft solder, and the heating efficiency is high. Furthermore, the soft solder bonding apparatus provided by the present invention can simultaneously bond different types of electronic components with soft solder with an appropriate heating amount even when different types of electronic components are placed on the substrate. The soft solder bonding apparatus provided by the present invention can also bond a plurality of electronic components with soft solder with good uniformity at the same time. [Technical means to solve problems]

本發明所關係之軟焊料接合裝置是用軟焊料將電子元件接合到形成在基板上的電極上之軟焊料接合裝置，其具有加熱手段，該加熱手段使夾在電極與電子元件之間的軟焊料熔融，而用軟焊料將電子元件接合到電極上。加熱手段具有：線圈，其在俯視時的內側具有空間部；複數個鐵氧體，其佈置在線圈的空間部中；調整機構，其對各鐵氧體與形成在基板上的電極之間的間距分別進行調整；以及電源，其對線圈施加交流電壓而對形成在基板上的電極進行感應加熱。預先對各鐵氧體與形成在基板上的電極之間的間距進行調整，以使當交流電壓施加到線圈上之後，位於線圈的內側的複數個電極中，利用感應加熱而被加熱的各電極會達到相同的溫度。The solder bonding apparatus to which the present invention relates is a solder bonding apparatus for bonding an electronic component to an electrode formed on a substrate by using a soft solder, and has heating means for causing a soft solder interposed between the electrode and the electronic component. The solder melts and the electronic components are joined to the electrodes with soft solder. The heating means includes: a coil having a space portion on the inner side in a plan view; a plurality of ferrites arranged in the space portion of the coil; The pitches are individually adjusted; and a power supply applies an alternating voltage to the coils to inductively heat electrodes formed on the substrate. The distance between each ferrite and the electrode formed on the substrate is adjusted in advance so that when an AC voltage is applied to the coil, each electrode is heated by induction heating among the plurality of electrodes located inside the coil. will reach the same temperature.

本發明所關係之另一軟焊料接合裝置是用軟焊料將電子元件接合到形成在基板上的電極上之軟焊料接合裝置，其具有加熱手段，該加熱手段使夾在電極與電子元件之間的軟焊料熔融，而用軟焊料將電子元件接合到電極上。加熱手段具有：線圈，其在俯視時的內側具有空間部；複數個鐵氧體，其佈置在線圈的空間部中；以及電源，其對線圈施加交流電壓而對形成在基板上的電極進行感應加熱。預先對各鐵氧體的靠近基板一側的端面的面積進行調整，以使當交流電壓施加到線圈上之後，位於線圈的內側的複數個電極中，利用感應加熱而被加熱的各電極會達到相同的溫度。 〔發明之效果〕Another soft solder bonding apparatus to which the present invention relates is a soft solder bonding apparatus for bonding electronic components with soft solder to electrodes formed on a substrate, which has heating means for sandwiching between the electrodes and the electronic components The soft solder is melted, and the electronic components are bonded to the electrodes with the soft solder. The heating means includes: a coil having a space on the inner side in a plan view; a plurality of ferrites arranged in the space of the coil; and a power source that applies an alternating voltage to the coil to induce electrodes formed on the substrate heating. The area of the end face on the substrate side of each ferrite is adjusted in advance so that when an AC voltage is applied to the coil, each electrode heated by induction heating of the plurality of electrodes located inside the coil reaches the size of the coil. the same temperature. [Effect of invention]

根據本發明，能夠提供一種軟焊料接合裝置，其利用感應加熱，用軟焊料將電子元件接合到形成在基板上的電極上，該軟焊料接合裝置能抑制基板被加熱，並且，即使是微小的電子元件，也能夠容易地用軟焊料進行接合，加熱效率高。而且，本發明提供的軟焊料接合裝置在基板上置有不同種類的電子元件的情況下，能夠以適當的加熱量用軟焊料同時對不同種類的電子元件進行高精度的接合。本發明提供的軟焊料接合裝置還能夠以良好的均一性用軟焊料同時對複數個電子元件進行接合。According to the present invention, it is possible to provide a soft-solder bonding apparatus that bonds an electronic component to an electrode formed on a substrate with a soft solder using induction heating, which can suppress the heating of the substrate, and which can suppress the heating of the substrate, and which can suppress the heating of the substrate even if it is small. Electronic components can also be easily joined with soft solder, and the heating efficiency is high. Furthermore, the soft solder bonding apparatus provided by the present invention can simultaneously perform high-precision bonding of different types of electronic components with soft solder with an appropriate heating amount when different types of electronic components are placed on the substrate. The soft solder bonding apparatus provided by the present invention can also bond a plurality of electronic components with soft solder with good uniformity at the same time.

本申請的申請人在PCT/JP2016/072056、PCT/2016/076332之申請說明書中公開了下述軟焊料接合裝置：其透過軟焊料將電子元件接合到形成在絕緣性基板上的電極上，在置有電子元件的規定區域的上方或下方，佈置具有圍住該規定區域之形狀的線圈，向線圈供給電流，在線圈內對置有電子元件的電極進行感應加熱，由此用軟焊料進行接合。The applicant of the present application discloses, in the application specifications of PCT/JP2016/072056 and PCT/2016/076332, the following soft solder bonding apparatus for bonding electronic components to electrodes formed on an insulating substrate through soft solder, Above or below a predetermined area where electronic components are placed, a coil having a shape surrounding the predetermined area is arranged, current is supplied to the coil, and electrodes on which electronic components are placed are induction-heated in the coil, thereby bonding with soft solder .

圖1（a）、圖1（b）示意性地顯示上述申請說明書中公開的軟焊料接合裝置的構成。FIGS. 1( a ) and 1 ( b ) schematically show the configuration of the solder bonding apparatus disclosed in the above application specification.

如圖1（a）所示，基板11上置有複數個電子元件C，在置有電子元件C的區域A的上方，佈置有具有圍住該區域A之形狀的線圈20。如圖1（b）所示，當交流電壓施加到線圈20上時，在線圈20內側產生的磁通Φ，就會垂直射向形成在基板11上的電極13，這樣一來，電極13就被感應加熱。電極13利用感應加熱被加熱而產生的熱量傳遞給軟焊料14，由此使軟焊料14熔融，這樣一來，電子元件C就被軟焊料接合到電極13上。As shown in FIG. 1( a ), a plurality of electronic components C are placed on the substrate 11 , and above the region A where the electronic components C are placed, a coil 20 having a shape surrounding the region A is arranged. As shown in FIG. 1( b ), when an AC voltage is applied to the coil 20 , the magnetic flux Φ generated inside the coil 20 will be perpendicular to the electrode 13 formed on the substrate 11 , so that the electrode 13 will heated by induction. The heat generated by the electrode 13 being heated by induction heating is transferred to the soft solder 14, whereby the soft solder 14 is melted, and the electronic component C is joined to the electrode 13 by the soft solder.

根據上述構成，能夠將感應加熱的範圍限定到線圈20內的置有電子元件C的電極13。這樣一來，因為是利用感應加熱直接對軟焊料接合的對象部位即電極13進行加熱，而不是利用來自發熱體的熱傳導進行加熱，所以能夠抑制基板11被加熱。其結果是，即使使用耐熱性較低的軟性電路板，也能夠抑制基板11的熱變形。並且，因為不必使發熱體直接與軟焊料接合的對象部位抵接，所以即使是微小的電子元件，也能夠容易地用軟焊料進行接合。According to the above configuration, the range of induction heating can be limited to the electrode 13 in which the electronic component C is placed in the coil 20 . In this way, the substrate 11 can be suppressed from being heated because the electrode 13 , which is an object to be soldered, is directly heated by induction heating instead of by heat conduction from the heating element. As a result, even if a flexible wiring board with low heat resistance is used, thermal deformation of the substrate 11 can be suppressed. Furthermore, since it is not necessary to directly abut the heating element with the target portion to be joined with the solder, even a minute electronic component can be easily joined with the solder.

置有電子元件C的電極13的大小可能隨電子元件C的種類和大小而變化。因此，區域A內的置有電子元件C的電極13由於在線圈20內側產生的磁通Φ而被感應加熱，其加熱量隨電極13的大小而變化，即隨電子元件C的種類和大小而變化。其結果是，當基板11上存在種類和大小不同的電子元件C時，對置有電子元件C的電極13的加熱量就會不同。因此，因為從被感應加熱的電極13傳遞給軟焊料14的熱量不同，所以對於種類和大小不同的電子元件，用軟焊料接合時可能會產生偏差。The size of the electrode 13 on which the electronic component C is placed may vary depending on the type and size of the electronic component C. As shown in FIG. Therefore, the electrode 13 on which the electronic component C is placed in the area A is inductively heated due to the magnetic flux Φ generated inside the coil 20, and the heating amount varies with the size of the electrode 13, that is, with the type and size of the electronic component C. Variety. As a result, when electronic components C of different types and sizes are present on the substrate 11, the amount of heating of the electrodes 13 facing the electronic components C varies. Therefore, since the amount of heat transferred from the induction-heated electrode 13 to the soft solder 14 is different, there is a possibility that the bonding of electronic components with different types and sizes by the soft solder may vary.

此外，即使電子元件C的種類和大小相同，在線圈20內側產生的磁通Φ也不一定相同。線圈20的形狀也會導致在線圈20內側產生的磁通Φ的分佈情況不同。例如，如果基板11由軟性電路板構成，則基板的翹曲和彎曲等會導致射到電極13處的磁通Φ產生偏差。因此，對置有電子元件C的電極13的加熱量有時會不同。其結果是，因為從被感應加熱的電極13傳遞給軟焊料14的熱量不同，所以對於種類和大小不同的電子元件，用軟焊料接合時可能會產生偏差。In addition, even if the type and size of the electronic components C are the same, the magnetic flux Φ generated inside the coil 20 is not necessarily the same. The shape of the coil 20 also results in a different distribution of the magnetic flux Φ generated inside the coil 20 . For example, if the substrate 11 is formed of a flexible circuit board, warpage and bending of the substrate may cause variations in the magnetic flux Φ incident on the electrode 13 . Therefore, the heating amount of the electrode 13 facing the electronic component C may vary. As a result, since the amount of heat transferred from the induction-heated electrodes 13 to the soft solder 14 is different, there is a possibility that the bonding of electronic components with different types and sizes by the soft solder may vary.

本發明正是為了消除此等不良現象而完成的，本發明提供一種軟焊料接合裝置，即使在基板上置有不同種類的電子元件的情況下，也能夠以適當的加熱量用軟焊料同時對不同種類的電子元件進行接合。並且，即使在線圈20內側產生的磁通Φ有偏差，本發明提供的軟焊料接合裝置也能夠以良好的均一性用軟焊料同時對複數個電子元件進行接合。The present invention has been accomplished in order to eliminate such inconveniences, and the present invention provides a soft solder bonding apparatus capable of simultaneously bonding with soft solder with an appropriate heating amount even when different types of electronic components are placed on a substrate. Different kinds of electronic components are joined. Furthermore, even if the magnetic flux Φ generated inside the coil 20 varies, the solder bonding apparatus provided by the present invention can simultaneously bond a plurality of electronic components with solder with good uniformity.

以下根據圖式對本發明的實施方式進行詳細說明。需要說明的是，本發明不限於以下實施方式。並且，在能發揮本發明之效果的範圍內，可以根據情況適當地對本發明進行變更。Hereinafter, embodiments of the present invention will be described in detail based on the drawings. In addition, this invention is not limited to the following embodiment. In addition, the present invention can be appropriately changed according to the circumstances within the range in which the effects of the present invention can be exhibited.

圖2示意性地顯示本發明的一實施方式中的軟焊料接合裝置的構成。FIG. 2 schematically shows the configuration of the solder bonding apparatus according to the embodiment of the present invention.

如圖2所示，本實施方式中的軟焊料接合裝置10是用軟焊料將電子元件C接合到形成在基板11上的電極（未圖示）上之軟焊料接合裝置，其具有加熱手段，加熱手段使夾在電極與電子元件C之間的軟焊料（未圖示）熔融，而用軟焊料將電子元件C接合到電極上。As shown in FIG. 2 , the solder bonding apparatus 10 in this embodiment is a solder bonding apparatus for bonding the electronic component C to the electrodes (not shown) formed on the substrate 11 with soft solder, and has heating means, The heating means melts the soft solder (not shown) sandwiched between the electrodes and the electronic component C, and joins the electronic component C to the electrode with the soft solder.

加熱手段具有：線圈20，其在俯視時（z方向）的內側具有空間部21；以及複數個鐵氧體30，其佈置在線圈20的空間部21中。此處，各鐵氧體30與形成在基板11上的電極之間的間距利用調整機構40分別進行控制。該間隔的調整例如可以用為每個鐵氧體30設置的致動器（例如，電動缸、線性滑軌等）41來進行。線圈20的兩端部經由導線51與電源50相連，藉由向線圈20施加交流電壓，形成在位於鐵氧體30下方的基板11上的電極就被感應加熱。The heating means includes a coil 20 having a space portion 21 on the inner side in plan view (z direction), and a plurality of ferrites 30 arranged in the space portion 21 of the coil 20 . Here, the pitches between the ferrites 30 and the electrodes formed on the substrate 11 are individually controlled by the adjustment mechanism 40 . The adjustment of this interval can be performed, for example, with an actuator (eg, electric cylinder, linear slide, etc.) 41 provided for each ferrite 30 . Both ends of the coil 20 are connected to a power source 50 via wires 51, and by applying an AC voltage to the coil 20, electrodes formed on the substrate 11 under the ferrite 30 are heated by induction.

圖3說明在本實施方式中，利用感應加熱，用軟焊料將電子元件接合到形成在基板11上的電極上之方法。此處，顯示的例子為：向形成在基板11上的電極13供給軟焊料14後，用軟焊料將具有端子（未圖示）的電子元件（例如，晶片電容、晶片電阻等）C接合到上面。FIG. 3 illustrates a method of bonding electronic components to electrodes formed on the substrate 11 with soft solder by using induction heating in this embodiment. Here, an example is shown in which, after supplying the soft solder 14 to the electrodes 13 formed on the substrate 11, the electronic components (for example, chip capacitors, chip resistors, etc.) C having terminals (not shown) are bonded to the electrodes 13 with soft solder. above.

如圖3所示，各鐵氧體30的端部31與軟焊料接合的對象部位即電極13的大小一致，呈逐漸變細的形狀。向線圈20施加交流電壓後，線圈20周圍就會產生磁通Φ。在線圈20內側產生的磁通Φ沿著佈置在線圈20內側的鐵氧體30，從鐵氧體30的端部31，垂直射向形成在基板11上的電極13。這樣一來，電極13就被感應加熱。電極13利用感應加熱被加熱而產生的熱量傳遞給軟焊料14，由此使軟焊料14熔融，這樣一來，電子元件C的端子就被軟焊料接合到電極13上。As shown in FIG. 3 , the end portion 31 of each ferrite 30 and the electrode 13 which is the target portion to which the solder is joined are uniform in size, and have a tapered shape. When an AC voltage is applied to the coil 20 , a magnetic flux Φ is generated around the coil 20 . The magnetic flux Φ generated inside the coil 20 is perpendicular to the electrode 13 formed on the substrate 11 from the end 31 of the ferrite 30 along the ferrite 30 arranged inside the coil 20 . In this way, the electrodes 13 are heated inductively. The electrode 13 is heated by induction heating and is transferred to the soft solder 14, thereby melting the soft solder 14, whereby the terminal of the electronic component C is joined to the electrode 13 by the soft solder.

藉由本實施方式中的軟焊料接合裝置，能夠經由鐵氧體30傳遞在線圈20內側產生的磁通Φ，以使磁通Φ集中到電極13，且不會衰減，因此能夠高效率地用軟焊料進行接合。藉由使鐵氧體30的端部31與電極13的大小一致，就能夠將感應加熱的範圍限定到電極13。這樣一來，即使是微小的電子元件C，也能夠容易地用軟焊料進行接合。此外，因為是利用感應加熱直接對電極13進行加熱，所以能夠抑制基板11被加熱。這樣一來，即使使用耐熱性較低的軟性電路板，也能夠抑制基板11的熱變形。With the soft solder bonding device in this embodiment, the magnetic flux Φ generated inside the coil 20 can be transmitted through the ferrite 30 so that the magnetic flux Φ can be concentrated on the electrode 13 without being attenuated. Solder for bonding. By making the size of the end portion 31 of the ferrite 30 match the size of the electrode 13 , the range of induction heating can be limited to the electrode 13 . In this way, even the minute electronic components C can be easily joined by soft solder. In addition, since the electrode 13 is directly heated by induction heating, the substrate 11 can be suppressed from being heated. In this way, even if a flexible wiring board with low heat resistance is used, thermal deformation of the substrate 11 can be suppressed.

如上述，當基板11上存在種類和大小不同的電子元件C時，對置有電子元件C的電極13的加熱量就會不同。因此，因為從被感應加熱的電極13傳遞給軟焊料14的熱量不同，所以對於種類和大小不同的電子元件C，用軟焊料接合時可能會產生偏差。As described above, when the electronic components C of different types and sizes are present on the substrate 11, the amount of heating of the electrodes 13 facing the electronic components C varies. Therefore, since the amount of heat transferred from the induction-heated electrodes 13 to the soft solder 14 is different, there is a possibility that the bonding of the electronic components C with different types and sizes by the soft solder may vary.

此外，即使電子元件C的種類和大小相同，在線圈20內側產生的磁通Φ也不一定相同。基板11的翹曲和彎曲等也會導致射到電極13處磁通Φ產生偏差。因此，因為從被感應加熱的電極13傳遞給軟焊料14的熱量不同，所以用軟焊料接合時可能會產生偏差。In addition, even if the type and size of the electronic components C are the same, the magnetic flux Φ generated inside the coil 20 is not necessarily the same. The warpage and bending of the substrate 11 also cause deviation of the magnetic flux Φ incident on the electrode 13 . Therefore, since the amount of heat transferred from the electrode 13 heated by induction to the soft solder 14 is different, there is a possibility that the bonding with the soft solder may vary.

為了消除上述不良現象，本實施方式中的軟焊料接合裝置具有調整機構40，調整機構40預先對各鐵氧體30與形成在基板11上的電極13之間的間距進行調整，以使當交流電壓施加到線圈20上之後，位於線圈20內側的複數個電極13中，利用感應加熱而被加熱的各電極13會達到相同的溫度。In order to eliminate the above-mentioned inconveniences, the solder bonding apparatus in this embodiment has an adjustment mechanism 40 that adjusts the distance between each ferrite 30 and the electrode 13 formed on the substrate 11 in advance so that the After a voltage is applied to the coil 20, among the plurality of electrodes 13 located inside the coil 20, each electrode 13 heated by induction heating reaches the same temperature.

圖4（a）、圖4（b）顯示隨著鐵氧體30的端部31與基板11上的電極13之間的間距D的變化，利用感應加熱而被加熱的電極13的溫度變化情況。如圖3所示，磁通Φ從鐵氧體30的端部31射到電極13處，磁通Φ和鐵氧體30的端部31與基板11上的電極13之間的間距D的二次方成正比衰減。因此，因為利用感應加熱而被加熱的電極13的加熱量與磁通Φ成正比，所以如圖4（b）所示，電極13的溫度變化和鐵氧體30的端部31與基板11上的電極13之間的間距D的二次方基本成反比。因此，藉由調整各鐵氧體30與形成在基板11上的電極13之間的間距D，就能夠將利用感應加熱而被加熱的各電極13控制到相同的溫度。FIGS. 4( a ) and 4 ( b ) show the temperature change of the electrode 13 heated by induction heating as the distance D between the end portion 31 of the ferrite 30 and the electrode 13 on the substrate 11 changes. . As shown in FIG. 3 , the magnetic flux Φ is emitted from the end 31 of the ferrite 30 to the electrode 13 , and the magnetic flux Φ is equal to the distance D between the end 31 of the ferrite 30 and the electrode 13 on the substrate 11 . The power is proportional to the attenuation. Therefore, since the heating amount of the electrode 13 heated by induction heating is proportional to the magnetic flux Φ, as shown in FIG. The square of the distance D between the electrodes 13 is substantially inversely proportional. Therefore, by adjusting the distance D between each ferrite 30 and the electrode 13 formed on the substrate 11, each electrode 13 heated by induction heating can be controlled to the same temperature.

圖5顯示當基板11上置有大小不同的兩個電子元件Ca、Cb時，對鐵氧體30A、30B與形成在基板11上的電極13A、13B之間的間距D1 、D2 進行調整的方法。需要說明的是，此處，根據電子元件Ca、Cb的大小，使電極13A的面積大於電極13B的面積。當要利用感應加熱將電極13A，13B加熱到相同的溫度時，因為與面積較大的電極13A相比，面積較小的電極13B被射到的磁通Φ少，對電極13B的加熱量小，所以在不彌補磁通Φ的情況下就需要藉由增大磁通密度來增大加熱量。因此，只要使鐵氧體30B與電極13B之間的間距D2 比鐵氧體30A與電極13A之間的間距D1小即可。這樣一來，能夠將利用感應加熱而被加熱的電極13A、13B的加熱量調整為適當的量，因此能夠將電極13A、13B控制到相同的溫度。5 shows the adjustment of the distances D 1 and D 2 between the ferrites 30A and 30B and the electrodes 13A and 13B formed on the substrate 11 when two electronic components Ca and Cb of different sizes are placed on the substrate 11 . Methods. In addition, here, the area of the electrode 13A is made larger than the area of the electrode 13B according to the size of the electronic components Ca and Cb. When the electrodes 13A and 13B are heated to the same temperature by induction heating, the amount of heating to the electrode 13B is small because the electrode 13B with a smaller area has less magnetic flux Φ injected than the electrode 13A with a larger area. , so it is necessary to increase the heating amount by increasing the magnetic flux density without making up the magnetic flux Φ. Therefore, the distance D2 between the ferrite 30B and the electrode 13B may be made smaller than the distance D1 between the ferrite 30A and the electrode 13A. In this way, since the heating amount of the electrodes 13A and 13B heated by induction heating can be adjusted to an appropriate amount, the electrodes 13A and 13B can be controlled to the same temperature.

當在線圈20內側產生的磁通Φ不同時，輸送溫度測量用基板（在被加熱的電極13A、13B等上裝有溫度感測器的基板），預先測定出溫度曲線等，並根據該溫度曲線，對各鐵氧體30與基板11上的電極13之間的間距D進行調整，由此能夠將利用感應加熱而被加熱的各電極13控制到相同的溫度。When the magnetic flux Φ generated inside the coil 20 is different, the substrate for temperature measurement (the substrate on which the temperature sensor is mounted on the heated electrodes 13A, 13B, etc.) is conveyed, and the temperature curve and the like are measured in advance, and based on the temperature By adjusting the distance D between each ferrite 30 and the electrode 13 on the substrate 11, each electrode 13 heated by induction heating can be controlled to the same temperature.

當基板11發生翹曲和彎曲等時，也是預先測定出處於翹曲和彎曲等狀態的基板11與各鐵氧體30之間的間距的偏差，並根據該偏差對各鐵氧體30與基板11上的電極13之間的間距D進行調整，由此能夠將利用感應加熱而被加熱的各電極13控制到相同的溫度。When the substrate 11 is warped, bent, etc., the deviation of the distance between the substrate 11 and the ferrites 30 in the warped and bent state is also measured in advance, and the ferrites 30 and the substrate are compared according to the deviation. By adjusting the distance D between the electrodes 13 on the 11, each electrode 13 heated by induction heating can be controlled to the same temperature.

如上述說明的那樣，本發明中的軟焊料接合裝置10藉由在線圈20的空間部中佈置複數個鐵氧體30，就能夠經由鐵氧體30傳遞在線圈20內側產生的磁通，以使磁通集中到基板11上的電極13，且不會衰減，因此能夠高效率地用軟焊料進行接合。藉由使鐵氧體30的頂端與電極13的大小一致，就能夠將感應加熱的範圍限定到電極13。這樣一來，因為是利用感應加熱直接對軟焊料接合的對象部位即電極13進行加熱，而不是利用來自發熱體的熱傳導進行加熱，所以能夠抑制基板11被加熱。其結果是，即使使用耐熱性較低的軟性電路板，也能夠抑制基板11的熱變形。並且，因為不必使發熱體直接與軟焊料接合的對象部位抵接，所以即使是微小的電子元件，也能夠容易地用軟焊料進行接合。As described above, in the solder bonding apparatus 10 of the present invention, by arranging the plurality of ferrites 30 in the space portion of the coil 20 , the magnetic flux generated inside the coil 20 can be transmitted through the ferrites 30 to Since the magnetic flux is concentrated on the electrodes 13 on the substrate 11 without being attenuated, it is possible to efficiently join with the soft solder. By making the size of the tip of the ferrite 30 match the size of the electrode 13 , the range of induction heating can be limited to the electrode 13 . In this way, the substrate 11 can be suppressed from being heated because the electrode 13 , which is an object to be soldered, is directly heated by induction heating instead of by heat conduction from the heating element. As a result, even if a flexible wiring board with low heat resistance is used, thermal deformation of the substrate 11 can be suppressed. Furthermore, since it is not necessary to directly abut the heating element with the target portion to be joined with the solder, even a minute electronic component can be easily joined with the solder.

而且，當基板11上置有不同種類的電子元件C時，也能夠藉由對各鐵氧體30與形成在基板11上的電極13之間的間距分別進行調整，而將位於線圈20內側的複數個電極13中，利用感應加熱而被加熱的各電極13控制到相同的溫度。這樣一來，就能夠以適當的加熱量用軟焊料同時對不同種類的電子元件C進行接合。Furthermore, when different types of electronic components C are placed on the substrate 11 , the distances between the ferrites 30 and the electrodes 13 formed on the substrate 11 can be adjusted respectively, so that the inner side of the coil 20 can be adjusted. Among the plurality of electrodes 13, each electrode 13 heated by induction heating is controlled to the same temperature. In this way, different types of electronic components C can be joined at the same time with the soft solder with an appropriate heating amount.

當線圈20內側產生的磁通Φ不同時，也能夠藉由對各鐵氧體30與形成在基板11上的電極13之間的間距分別進行調整，而將位於線圈20內側的複數個電極13中，利用感應加熱而被加熱的各電極13控制到相同的溫度。這樣一來，就能夠以良好的均一性用軟焊料同時對複數個電子元件進行接合。When the magnetic flux Φ generated inside the coil 20 is different, the distances between the ferrites 30 and the electrodes 13 formed on the substrate 11 can be adjusted respectively, so that a plurality of electrodes 13 located inside the coil 20 can be adjusted. In the above, each electrode 13 heated by induction heating is controlled to the same temperature. In this way, a plurality of electronic components can be joined at the same time with the soft solder with good uniformity.

當基板11發生翹曲和彎曲等時，也能夠藉由對各鐵氧體30與形成在基板11上的電極13之間的間距分別進行調整，而將位於線圈20內側的複數個電極13中，利用感應加熱而被加熱的各電極13控制到相同的溫度。這樣一來，就能夠以良好的均一性用軟焊料同時對複數個電子元件進行接合。Even when the substrate 11 is warped, bent, or the like, by adjusting the distances between the ferrites 30 and the electrodes 13 formed on the substrate 11, the plurality of electrodes 13 located inside the coil 20 can be adjusted. , each electrode 13 heated by induction heating is controlled to the same temperature. In this way, a plurality of electronic components can be joined at the same time with the soft solder with good uniformity.

在本實施方式中，鐵氧體30只要是磁導率較高的鐵氧體即可，磁導率較高是指能夠將在線圈20內側產生的磁通傳遞給軟焊料接合的對象部位即電極13，且不會衰減。例如，鐵氧體30可以採用軟磁鐵氧體。軟磁鐵氧體是以氧化鐵為主要成分的軟質磁性材料，電阻較大，基本不會讓電流通過。因此，在感應加熱之際，在軟磁鐵氧體中難以產生渦電流。其結果是，在進行感應加熱之際，能夠避免軟磁鐵氧體本身發熱，因此即使軟磁鐵氧體鄰近電極13，也能夠使基板11受熱量的影響較小。In the present embodiment, the ferrite 30 may be a ferrite with high magnetic permeability, and the high magnetic permeability means that the magnetic flux generated inside the coil 20 can be transmitted to the target part of the solder joint, that is, electrode 13, and will not decay. For example, soft ferrite may be used as the ferrite 30 . Soft ferrite is a soft magnetic material with iron oxide as the main component, which has a large resistance and basically does not allow current to pass through. Therefore, it is difficult to generate eddy currents in the soft ferrite during induction heating. As a result, since the soft ferrite itself can be prevented from heating during induction heating, even if the soft ferrite is adjacent to the electrode 13, the substrate 11 can be less affected by the heat.

在本實施方式中，調整機構40對各鐵氧體30與形成在基板11上的電極13之間的間距分別進行調整，如圖2所示，調整機構40還可以具有記憶部43和控制部42。其中，記憶部43中存儲有已將各鐵氧體30與形成在基板11上的電極13之間的間距設定為規定值之資料，控制部42根據記憶部43中存儲的資料，自動對各鐵氧體30與形成在基板11上的電極13之間的間距進行調整。In this embodiment, the adjustment mechanism 40 adjusts the distances between the ferrites 30 and the electrodes 13 formed on the substrate 11 respectively. As shown in FIG. 2 , the adjustment mechanism 40 may further include a memory portion 43 and a control portion. 42. Among them, the memory unit 43 stores data in which the distance between each ferrite 30 and the electrode 13 formed on the substrate 11 has been set to a predetermined value, and the control unit 42 automatically adjusts each The distance between the ferrite 30 and the electrode 13 formed on the substrate 11 is adjusted.

記憶部43中存儲有已設定好的各鐵氧體30與形成在基板11上的電極13之間的間距之資料，該設定保證利用感應加熱而被加熱的各電極13會達到相同的溫度。控制部42根據記憶部43中存儲的資料，自動對各鐵氧體30與形成在基板11上的電極13之間的間距進行調整。The memory section 43 stores the set data of the distances between the ferrites 30 and the electrodes 13 formed on the substrate 11 , and the setting ensures that the electrodes 13 heated by induction heating will reach the same temperature. The control unit 42 automatically adjusts the distance between each of the ferrites 30 and the electrodes 13 formed on the substrate 11 based on the data stored in the memory unit 43 .

對位於線圈20內側的各電極13的適當的加熱量隨各電極13的面積、用軟焊料接合到各電極13上的電子元件的種類和大小、基板11的翹曲程度和彎曲程度等而變化。因此，預先取得適合各條件之適當的加熱量，並將設定好的各鐵氧體30與基板11上的電極13之間的間距之資料存儲到記憶部43中，由此實現軟焊料接合的自動化。其中，該設定保證利用感應加熱而被加熱的各電極13會達到相同的溫度。The appropriate amount of heating to each electrode 13 located inside the coil 20 varies depending on the area of each electrode 13, the type and size of electronic components bonded to each electrode 13 with solder, the degree of warpage and the degree of curvature of the substrate 11, and the like . Therefore, an appropriate heating amount suitable for each condition is obtained in advance, and the set data of the distance between each ferrite 30 and the electrode 13 on the substrate 11 are stored in the memory portion 43, thereby realizing the soft solder bonding. automation. Here, this setting ensures that the electrodes 13 heated by induction heating will reach the same temperature.

如圖2所示，在本實施方式中，還可以在以基板11為基準時與佈置有線圈20的一側相反的一側且與複數個鐵氧體30相對的位置，設置與基板11平行的鐵氧體板32。這樣一來，沿線圈20一側的鐵氧體30通過的磁通，就穿過基板11傳遞給鐵氧體板32，從而能夠使在線圈20中產生的磁通更可靠地射到電極13處。其結果是，能夠更可靠地用軟焊料接合電子元件C。需要說明的是，也可以將棒狀的鐵氧體佈置到與鐵氧體30相對的位置，來取代鐵氧體板32。As shown in FIG. 2 , in this embodiment, the position opposite to the side on which the coils 20 are arranged and opposite to the plurality of ferrites 30 may be arranged parallel to the substrate 11 in the present embodiment. ferrite plate 32. In this way, the magnetic flux passing along the ferrite 30 on the side of the coil 20 is transmitted to the ferrite plate 32 through the substrate 11 , so that the magnetic flux generated in the coil 20 can be more reliably radiated to the electrode 13 place. As a result, the electronic component C can be more reliably joined with the soft solder. It should be noted that instead of the ferrite plate 32 , a rod-shaped ferrite may be arranged at a position facing the ferrite 30 .

在本實施方式中，基板11只要由絕緣性材料構成即可，其種類沒有特別限定。例如，基板11可以採用表面形成有電路佈線的電路板、兩面形成有電極焊墊（pad）的內插板（interposer）等。電子元件C只要是具有端子的部件即可，其種類沒有特別限定。例如，電子元件可以採用晶片電容、晶片電阻、LED元件、半導體元件、LSI等。In the present embodiment, as long as the substrate 11 is made of an insulating material, the type thereof is not particularly limited. For example, as the substrate 11 , a circuit board having circuit wirings formed on its surface, an interposer having electrode pads formed on both surfaces, or the like can be used. The type of the electronic component C is not particularly limited as long as it has a terminal. For example, chip capacitors, chip resistors, LED elements, semiconductor elements, LSIs, and the like can be used as electronic components.

在本實施方式中，軟焊料接合的對象部位即電極13具有可利用感應加熱而局部性地被加熱的面積較佳。電極13的面積在0.25mm×0.25mm以上較佳。當電極13的面積較小時，還可以鄰接著電極13設置輔助加熱用之金屬墊。In the present embodiment, it is preferable that the electrode 13, which is an object to be joined with solder, has an area that can be locally heated by induction heating. The area of the electrode 13 is preferably not less than 0.25 mm×0.25 mm. When the area of the electrode 13 is small, a metal pad for auxiliary heating can also be arranged adjacent to the electrode 13 .

在本實施方式中，線圈20只要俯視時與基板11平行且在內側具有空間部即可，其形狀等沒有特別限定。還可以使線圈20為管狀，讓冷媒在其內部循環。In the present embodiment, as long as the coil 20 is parallel to the substrate 11 in plan view and has a space portion inside, its shape and the like are not particularly limited. It is also possible to make the coil 20 in a tubular shape and to circulate the refrigerant in the coil 20 .

（變形例1）(Variation 1)

本實施方式中的軟焊料接合裝置構成為：在置有電子元件C的區域的上方，佈置有具有圍住該區域之形狀的線圈20。例如，圖2顯示的例子是，軟焊料接合裝置10構成為：電子元件C排成一列，在置有電子元件C的區域的上方，佈置有具有圍住該區域之形狀的線圈20。但還存在下述情況：在基板11上置有複數列電子元件C，用軟焊料同時對上述電子元件C進行接合。The solder bonding apparatus in the present embodiment is configured such that, above the region where the electronic component C is placed, the coil 20 having a shape surrounding the region is arranged. For example, FIG. 2 shows an example in which the solder bonding apparatus 10 is configured such that the electronic components C are arranged in a row, and above the region where the electronic components C are placed, the coil 20 having a shape surrounding the region is arranged. However, there are also cases in which a plurality of rows of electronic components C are placed on the substrate 11, and the electronic components C are simultaneously joined with soft solder.

圖6示意性地顯示對應於上述情況之軟焊料接合裝置的構成。如圖6所示，基板11上置有兩列電子元件C，在置有電子元件C的區域的上方，佈置有具有圍住該區域之形狀的線圈20。在線圈20的空間部21中，佈置有排成兩列的複數個鐵氧體30。FIG. 6 schematically shows the constitution of the solder bonding apparatus corresponding to the above-mentioned case. As shown in FIG. 6 , two rows of electronic components C are placed on the substrate 11 , and above the region where the electronic components C are placed, a coil 20 having a shape surrounding the region is arranged. In the space portion 21 of the coil 20, a plurality of ferrites 30 are arranged in two rows.

根據上述構成，當基板11上置有不同種類的電子元件C時，也能夠藉由對各鐵氧體30與形成在基板11上的電極之間的間距分別進行調整，而將位於線圈20內側的複數個電極中，利用感應加熱而被加熱的各電極控制到相同的溫度。這樣一來，就能夠以適當的加熱量用軟焊料同時對不同種類的電子元件C進行接合。According to the above configuration, even when different types of electronic components C are placed on the substrate 11 , the distance between the ferrites 30 and the electrodes formed on the substrate 11 can be adjusted respectively, so that the electronic components C located inside the coil 20 can be adjusted. Among the plurality of electrodes, each electrode heated by induction heating is controlled to the same temperature. In this way, different types of electronic components C can be joined at the same time with the soft solder with an appropriate heating amount.

當基板11上置有排成複數列的電子元件C並用軟焊料同時對電子元件C進行接合時，線圈20圍住的區域的面積也變大。因此，在線圈20內側產生的磁通Φ的均勻性可能會下降。或者，翹曲和彎曲等對基板11的影響可能變大。在上述情況下，也能夠藉由在線圈20的空間部21中佈置排成複數列的鐵氧體30，而將對線圈20內側的複數個電極的加熱量調整到適當的加熱量。這樣一來，能夠將利用感應加熱而被加熱的各電極13控制到相同的溫度，因此能夠用軟焊料以良好的均一性同時對複數個電子元件C進行接合。When the electronic components C arranged in a plurality of rows are placed on the substrate 11 and the electronic components C are simultaneously joined with soft solder, the area of the area surrounded by the coil 20 also increases. Therefore, the uniformity of the magnetic flux Φ generated inside the coil 20 may decrease. Alternatively, the influence of warpage, bending, etc. on the substrate 11 may become large. Even in the above-mentioned case, the heating amount of the plurality of electrodes inside the coil 20 can be adjusted to an appropriate heating amount by arranging the ferrites 30 arranged in plural rows in the space portion 21 of the coil 20 . In this way, each electrode 13 heated by induction heating can be controlled to the same temperature, so that a plurality of electronic components C can be joined at the same time with the soft solder with good uniformity.

需要說明的是，在圖6所示的軟焊料接合裝置的變形例中，顯示的例子是在線圈20的空間部21中佈置排成兩列的鐵氧體30，不過當然也可以佈置排成三列以上的鐵氧體30。It should be noted that, in the modification of the solder bonding apparatus shown in FIG. 6 , the example shown is that the ferrites 30 are arranged in two rows in the space portion 21 of the coil 20 , but of course, the ferrites 30 may be arranged in a row. Three or more rows of ferrites 30 .

鐵氧體30的形狀和排列方式沒有特別限定，可以根據要封裝到基板上11上的電子元件C的種類、大小和排列方式等，適當地進行變更。The shape and arrangement of the ferrites 30 are not particularly limited, and may be appropriately changed according to the type, size, arrangement, and the like of the electronic components C to be packaged on the substrate 11 .

需要說明的是，鐵氧體30的長度在30~40mm之範圍內較佳。鐵氧體30為盡可能接近線圈20之內側尺寸的形狀較佳。It should be noted that the length of the ferrite 30 is preferably in the range of 30 to 40 mm. The shape of the ferrite 30 is preferably as close to the inner dimension of the coil 20 as possible.

（變形例2）(Variation 2)

在本發明中的軟焊料接合裝置中，在線圈20內側產生的磁通Φ沿著佈置在線圈20內側的鐵氧體30，從鐵氧體30的端部31，垂直射向形成在基板11上的電極13。這樣一來，電極13利用感應加熱而被加熱，但該加熱量和鐵氧體30與基板11上的電極之間的間距D的二次方成正比衰減。圖2顯示的軟焊料接合裝置便利用了該性質，藉由對各鐵氧體30與形成在基板11上的電極之間的間距進行調整，而將位於線圈20內側的複數個電極中，利用感應加熱而被加熱的各電極控制到相同的溫度。In the soft solder bonding apparatus of the present invention, the magnetic flux Φ generated inside the coil 20 is perpendicular to the substrate 11 formed from the end 31 of the ferrite 30 along the ferrite 30 arranged inside the coil 20 . on the electrode 13. In this way, the electrodes 13 are heated by induction heating, but the heating amount is attenuated in proportion to the square of the distance D between the ferrite 30 and the electrodes on the substrate 11 . The soft solder bonding apparatus shown in FIG. 2 utilizes this property, and by adjusting the distance between each ferrite 30 and the electrodes formed on the substrate 11, among the plurality of electrodes located inside the coil 20, the use of Each electrode heated by induction heating is controlled to the same temperature.

如圖5所示，因為與面積較小的晶片Cb相對而設的鐵氧體30B的端面的面積大於電極13B的面積，所以從鐵氧體30的端部31射出的磁通Φ還會射到晶片Cb以外的區域。因此，如果在晶片Cb附近有其他晶片或導電物等，則它們也會利用感應加熱而被加熱，因此不佳。所以為了避免上述影響，配合晶片的大小來改變鐵氧體30的端面的面積較佳。As shown in FIG. 5 , since the area of the end face of the ferrite 30B provided to face the wafer Cb having a smaller area is larger than the area of the electrode 13B, the magnetic flux Φ emitted from the end 31 of the ferrite 30 is also emitted. to areas other than wafer Cb. Therefore, if there are other wafers, conductive objects, etc. in the vicinity of the wafer Cb, they are also heated by induction heating, which is not preferable. Therefore, in order to avoid the above effects, it is better to change the area of the end face of the ferrite 30 according to the size of the wafer.

與圖5所示的情況相同，圖7顯示的也是在基板11上置有大小不同的兩個電子元件Ca、Cb的情況。此處，根據電子元件Ca、Cb的大小，使電極13A的面積大於電極13B的面積。與晶片Ca、Cb相對而設的鐵氧體30A、30B的端面31A、31B的面積分別改成與電極13A、13B相同的面積。Similar to the case shown in FIG. 5 , FIG. 7 also shows a case where two electronic components Ca and Cb of different sizes are placed on the substrate 11 . Here, depending on the size of the electronic components Ca and Cb, the area of the electrode 13A is made larger than the area of the electrode 13B. The areas of the end faces 31A and 31B of the ferrites 30A and 30B provided to face the wafers Ca and Cb are changed to the same areas as those of the electrodes 13A and 13B, respectively.

另一方面，如果鐵氧體30A、30B的端面31A、31B的面積不同，從鐵氧體30A、30B的端面31A、31B射到電極13A、13B處的磁通Φ的密度就會不同。又因為面積較大的電極13A的電阻值小於面積較小的電極13B的電阻值，所以電極13A上產生的渦電流大於電極13B上產生的渦電流。由於上述要因，對電極13A、13B的加熱量就會不同，所以需要調整對電極13A、13B的加熱量，以使利用感應加熱而被加熱的電極13A、13B會達到相同的溫度。On the other hand, when the areas of the end faces 31A and 31B of the ferrites 30A and 30B are different, the density of the magnetic flux Φ emitted from the end faces 31A and 31B of the ferrites 30A and 30B to the electrodes 13A and 13B is different. Since the resistance value of the electrode 13A with a larger area is smaller than that of the electrode 13B with a smaller area, the eddy current generated on the electrode 13A is larger than the eddy current generated on the electrode 13B. Due to the above factors, the heating amounts of the counter electrodes 13A and 13B are different. Therefore, it is necessary to adjust the heating amounts of the counter electrodes 13A and 13B so that the electrodes 13A and 13B heated by induction heating reach the same temperature.

圖7顯示的是對電極13A的加熱量大於對電極13B的加熱量之情況，在此情況下，只要將鐵氧體30B與電極13B之間的間距D2 調整到比鐵氧體30A與電極13A之間的間距D1 小即可。這樣一來，能夠將利用感應加熱而被加熱的電極13A、13B的加熱量調整為適當的量，因此能夠將電極13A、13B控制到相同的溫度。需要說明的是，當對電極13B的加熱量大於對電極13A的加熱量時，將鐵氧體30A與電極13A之間的間距D1 調整到比鐵氧體30B與電極13B之間的間距D2 小即可。FIG. 7 shows the case where the heating amount of the counter electrode 13A is greater than the heating amount of the counter electrode 13B. In this case, as long as the distance D 2 between the ferrite 30B and the electrode 13B is adjusted to be smaller than the ferrite 30A and the electrode The distance D1 between 13A can be as small as possible. In this way, since the heating amount of the electrodes 13A and 13B heated by induction heating can be adjusted to an appropriate amount, the electrodes 13A and 13B can be controlled to the same temperature. It should be noted that when the heating amount of the counter electrode 13B is greater than the heating amount of the counter electrode 13A, the distance D 1 between the ferrite 30A and the electrode 13A is adjusted to be smaller than the distance D between the ferrite 30B and the electrode 13B 2 hours is enough.

以上透過較佳的實施方式對本發明進行了說明，但上述記載並非限定事項，當然也可以做出各種變更。例如，在上述實施方式中，使鐵氧體30呈靠近基板11一側的端部31逐漸變細的形狀，但其形狀並沒有特別限定。例如，可以對鐵氧體30的端部31的一對對邊或兩對對邊進行倒角加工。也可以不讓靠近基板11一側的端部31呈逐漸變細的形狀。As mentioned above, although this invention was demonstrated based on preferable embodiment, the said description is not a limitation matter, Of course, various changes can be added. For example, in the above-described embodiment, the ferrite 30 has a shape in which the end portion 31 on the side closer to the substrate 11 is tapered, but the shape is not particularly limited. For example, a pair of opposite sides or two pairs of opposite sides of the end portion 31 of the ferrite 30 may be chamfered. The end portion 31 on the side close to the substrate 11 may not have a tapered shape.

在上述實施方式中，是根據存儲在記憶部43中的資料，自動對各鐵氧體30與形成在基板11上的電極13之間的間距進行調整，但也可以準備已預先將各鐵氧體30與形成在基板11上的電極13之間的間距調整好的單元，根據要封裝到基板11上的電子元件C的種類、大小和排列方式等，更換整個單元。In the above-described embodiment, the distance between each ferrite 30 and the electrode 13 formed on the substrate 11 is automatically adjusted based on the data stored in the memory unit 43, but it is also possible to prepare the The unit in which the distance between the body 30 and the electrodes 13 formed on the substrate 11 has been adjusted is replaced according to the type, size and arrangement of the electronic components C to be packaged on the substrate 11 .

10‧‧‧軟焊料接合裝置11‧‧‧基板12‧‧‧輸送手段13‧‧‧電極14‧‧‧軟焊料15‧‧‧端子20‧‧‧線圈21‧‧‧空間部30‧‧‧鐵氧體31‧‧‧鐵氧體的端面32‧‧‧鐵氧體板40‧‧‧調整機構42‧‧‧控制部43‧‧‧記憶部50‧‧‧電源51‧‧‧導線10‧‧‧Solder Bonding Device 11‧‧‧Substrate 12‧‧‧Conveying Means 13‧‧‧Electrode 14‧‧‧Solder Solder 15‧‧‧Terminal 20‧‧‧Coil 21‧‧‧Space 30‧‧‧ Ferrite 31‧‧‧End face of ferrite 32‧‧‧Ferrite plate 40‧‧‧Adjustment mechanism 42‧‧‧Control part 43‧‧‧Memory part 50‧‧‧Power supply 51‧‧‧Wire

圖1（a）、圖1（b）示意性地顯示作為本發明之前提的軟焊料接合裝置的構成。 圖2示意性地顯示本發明的一實施方式中的軟焊料接合裝置的構成。 圖3說明在本發明的一實施方式中，利用感應加熱，用軟焊料將電子元件接合到形成在基板上的電極上之方法。 圖4（a）、圖4（b）顯示隨著鐵氧體30的端部與基板上的電極之間的間距的變化，利用感應加熱而被加熱的電極的溫度變化情況。 圖5顯示在本發明的一實施方式中，當基板上置有兩個大小不同的電子元件時，對鐵氧體與形成在基板上的電極之間的間距進行調整的方法之例。 圖6示意性地顯示本發明的變形例中的軟焊料接合裝置的構成。 圖7示意性地顯示本發明的變形例中的軟焊料接合裝置的構成。FIGS. 1( a ) and 1 ( b ) schematically show the configuration of the solder bonding apparatus that is the premise of the present invention. FIG. 2 schematically shows the configuration of the solder bonding apparatus according to the embodiment of the present invention. FIG. 3 illustrates a method of bonding electronic components to electrodes formed on a substrate with soft solder using induction heating in one embodiment of the present invention. FIGS. 4( a ) and 4 ( b ) show changes in the temperature of the electrodes heated by induction heating as the distance between the ends of the ferrite 30 and the electrodes on the substrate changes. 5 shows an example of a method of adjusting the distance between the ferrite and the electrodes formed on the substrate when two electronic components of different sizes are placed on the substrate in one embodiment of the present invention. FIG. 6 schematically shows the configuration of a solder bonding apparatus in a modification of the present invention. FIG. 7 schematically shows the configuration of a solder bonding apparatus in a modification of the present invention.

10‧‧‧軟焊料接合裝置 10‧‧‧Soft Solder Bonding Device

11‧‧‧基板 11‧‧‧Substrate

20‧‧‧線圈 20‧‧‧coil

21‧‧‧空間部 21‧‧‧Space Department

30‧‧‧鐵氧體 30‧‧‧Ferrite

32‧‧‧鐵氧體板 32‧‧‧Ferrite plate

40‧‧‧調整機構 40‧‧‧Adjustment mechanism

41‧‧‧致動器 41‧‧‧Actuators

42‧‧‧控制部 42‧‧‧Control Department

43‧‧‧記憶部 43‧‧‧Memory Department

50‧‧‧電源 50‧‧‧Power

51‧‧‧導線 51‧‧‧Wire

C‧‧‧電子元件 C‧‧‧Electronic Components

Claims (8)

一種軟焊料接合裝置，用於用軟焊料將電子元件接合到形成在基板上的電極上，其特徵在於，所述軟焊料接合裝置具有加熱手段，該加熱手段使夾在所述電極與所述電子元件之間的軟焊料熔融，而用軟焊料將所述電子元件接合到所述電極上，所述加熱手段具有：線圈，其在俯視時的內側具有空間部；複數個鐵氧體，其佈置在所述線圈的空間部中；調整機構，其對各所述鐵氧體與形成在所述基板上的電極之間的間距分別進行調整；電源，其對所述線圈施加交流電壓而對形成在所述基板上的所述電極進行感應加熱；以及與所述基板平行的鐵氧體板，所述鐵氧體板佈置在以所述基板為基準時與佈置有所述線圈的一側相反的一側且與複數個所述鐵氧體相對的位置；其中所述調整機構預先對各所述鐵氧體與形成在所述基板上的電極之間的間距進行調整，以使當交流電壓施加到所述線圈上之後，位於所述線圈的內側的複數個電極中，利用感應加熱而被加熱的各所述電極會達到相同的溫度。 A soft solder bonding apparatus for bonding electronic components to electrodes formed on a substrate with soft solder, characterized in that the soft solder bonding apparatus has heating means for causing the electrodes to be sandwiched between the electrodes and the electrodes. The solder between the electronic components is melted, and the electronic components are bonded to the electrodes with the solder, and the heating means includes a coil having a space on the inner side in a plan view, and a plurality of ferrites. arranged in the space portion of the coil; an adjustment mechanism for adjusting the distance between each of the ferrites and the electrodes formed on the substrate, respectively; and a power supply for applying an alternating voltage to the coil to the electrodes formed on the substrate perform induction heating; and a ferrite plate parallel to the substrate, the ferrite plate being arranged on the side where the coil is arranged with the substrate as a reference The opposite side and the position opposite to a plurality of the ferrites; wherein the adjustment mechanism adjusts the distance between each of the ferrites and the electrodes formed on the substrate in advance, so that when the alternating current After a voltage is applied to the coil, among the plurality of electrodes located inside the coil, each of the electrodes heated by induction heating reaches the same temperature. 如請求項1所述的軟焊料接合裝置，其中，所述鐵氧體由軟磁鐵氧體構成。 The soft solder bonding apparatus according to claim 1, wherein the ferrite is formed of soft ferrite. 如請求項1或2所述的軟焊料接合裝置，其中， 根據各所述電極的面積，或者根據用軟焊料接合到各所述電極上的各電子元件的種類或大小，預先對各所述鐵氧體與形成在所述基板上的電極之間的間距進行調整。 The soft solder bonding device according to claim 1 or 2, wherein, The distance between each of the ferrites and the electrodes formed on the substrate is determined in advance according to the area of each of the electrodes, or according to the type or size of each electronic component bonded to each of the electrodes with soft solder. make adjustments. 如請求項1所述的軟焊料接合裝置，其中，根據所述線圈的形狀，或者根據所述基板的翹曲程度或彎曲程度，預先對各所述鐵氧體與形成在所述基板上的電極之間的間距進行調整。 The soft solder bonding apparatus according to claim 1, wherein each of the ferrites and the ferrites formed on the substrate are preliminarily aligned according to the shape of the coil or according to the degree of warpage or the degree of bending of the substrate. The spacing between electrodes can be adjusted. 如請求項1所述的軟焊料接合裝置，其中，所述調整機構還具有：記憶部，其用於存儲已將各所述鐵氧體與形成在所述基板上的電極之間的間距設定為規定值之資料；以及控制部，其根據所述記憶部中存儲的資料，自動對各所述鐵氧體與形成在所述基板上的電極之間的間距進行調整。 The soft solder bonding apparatus according to claim 1, wherein the adjustment mechanism further includes a memory section for storing the setting of the distance between each of the ferrites and the electrodes formed on the substrate data having a predetermined value; and a control unit that automatically adjusts the distance between each of the ferrites and the electrodes formed on the substrate based on the data stored in the memory unit. 如請求項5所述的軟焊料接合裝置，其中，所述記憶部中存儲有已設定好的下述資料：根據各所述電極的面積，或者根據用軟焊料接合到各所述電極上的各電子元件的種類、大小或佈置位置，或者根據所述線圈的形狀，或者根據所述基板的翹曲程度或彎曲程度，將各所述鐵氧體與形成在所述基板上的電極之間的間距設定為規定值，所述控制部根據所述記憶部中存儲的所述資料，自動對各所述鐵氧體與形成在所述基板上的電極之間的間距進行調整。 The soft solder bonding apparatus according to claim 5, wherein the memory unit stores the following data which have been set according to the area of each of the electrodes, or according to the amount of the solder bonded to each of the electrodes. The type, size, or arrangement position of each electronic component, or depending on the shape of the coil, or depending on the degree of warpage or curvature of the substrate, are placed between each of the ferrites and the electrodes formed on the substrate. The distance between the ferrites is set to a predetermined value, and the control unit automatically adjusts the distance between each of the ferrites and the electrodes formed on the substrate according to the data stored in the memory unit. 如請求項1所述的軟焊料接合裝置，其中，所述基板由絕緣性材料構成，所述電極具有可利用感應加熱而局部性地被加熱的面積。 The solder bonding apparatus according to claim 1, wherein the substrate is made of an insulating material, and the electrode has an area that can be locally heated by induction heating. 如請求項1所述的軟焊料接合裝置，其中，所述鐵氧體呈靠近所述基板一側的端部逐漸變細的形狀。The soft-solder bonding device according to claim 1, wherein the ferrite has a shape in which the end portion on the side closer to the substrate is tapered.
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