JP2008132508A - Soldering device - Google Patents

Soldering device Download PDF

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JP2008132508A
JP2008132508A JP2006319304A JP2006319304A JP2008132508A JP 2008132508 A JP2008132508 A JP 2008132508A JP 2006319304 A JP2006319304 A JP 2006319304A JP 2006319304 A JP2006319304 A JP 2006319304A JP 2008132508 A JP2008132508 A JP 2008132508A
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solder
heat
susceptor
joining member
conductive sheet
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Tatsuya Kagaya
達也 加賀屋
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Toyota Motor Corp
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Toyota Motor Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that the molten state of solder is varied and joint surfaces are not soldered uniformly since the temperature in each part of a workpiece placed on a susceptor is not uniform in a soldering device utilizing conventional induction heating. <P>SOLUTION: A soldering device 10 with which a heat radiating plate 2 and a circuit board 3 are soldered by melting the solder 4 of a soldering body 1 which is composed by interposing the solder 4 between the heat radiating plate 2 and the circuit board 3 by utilizing the induction heating is provided with: an induction coil 11 for generating an AC magnetic field by making an AC current flow; the susceptor 17 which is arranged in the induction coil 11 and generates heat when being exposed to the AC magnetic field; and a heat conduction sheet 18 which is installed on the susceptor 17 and on which the soldering body 1 is placed when the heat radiating plate 2 and the circuit board 3 are soldered. An opening part 18a is formed in the approximately center part of the heat conduction sheet 18 and the heat conduction sheet 18 supports the soldering body 1 with the opening edge parts 18b, 18b of the opening part 18a. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、誘導加熱現象を利用して、第１の接合部材と第２の接合部材との間にはんだを介在させて構成されるはんだ接合体のはんだを溶融させ、前記第１の接合部材と第２の接合部材とをはんだ接合するはんだ接合装置に関する。   The present invention uses the induction heating phenomenon to melt the solder of a solder joint formed by interposing solder between the first joining member and the second joining member, and the first joining member And a second joining member.

近年、半導体素子が実装された回路基板と、前記回路基板に生じた熱を放熱させる放熱板とをはんだ接合する場合等、第１の接合部材と第２の接合部材とをはんだにより接合してはんだ接合体を構成する場合に、誘導加熱現象を利用して第１の接合部材と第２の接合部材との間に介在させたはんだを溶融し、溶融したはんだにより第１の接合部材と第２の接合部材とをはんだ接合することが行われている。
ここで、誘導加熱現象とは、誘導コイルに交流電流を通電することによって交流磁場を発生させ、交流磁場内に存在する磁性体または導体に交流電流を発生させ、その交流電流によって磁性体または導体を発熱させる現象をいう。 In recent years, when soldering a circuit board on which a semiconductor element is mounted and a heat radiating plate that dissipates heat generated in the circuit board, the first joining member and the second joining member are joined by solder. When configuring the solder joint, the solder interposed between the first joint member and the second joint member is melted using the induction heating phenomenon, and the first joint member and the second joint are melted by the melted solder. 2 joining members are solder-joined.
Here, the induction heating phenomenon means that an AC magnetic field is generated by energizing an induction coil with an AC current, an AC current is generated in a magnetic body or conductor existing in the AC magnetic field, and the magnetic body or conductor is generated by the AC current. Is a phenomenon that generates heat.

前述のように、誘導加熱現象を用いてはんだ接合を行う装置としては、例えば特許文献１に示すように、はんだを載置している半導体基板の上部に平面上の誘導コイルを配置し、この誘導コイルが発生する交流磁場により半導体基板上のはんだを溶融して、該半導体基板と電子部品とをはんだ接合する装置が知られている。
特開平７−１７１６７７号公報 As described above, as an apparatus for performing solder bonding using the induction heating phenomenon, for example, as shown in Patent Document 1, a planar induction coil is arranged on the top of a semiconductor substrate on which solder is placed, and this An apparatus is known in which solder on a semiconductor substrate is melted by an alternating magnetic field generated by an induction coil, and the semiconductor substrate and an electronic component are soldered.
JP-A-7-171777

前述のように、誘導加熱現象を利用してはんだ接合を行うはんだ接合装置においては、はんだ接合の対象となるワークを搬送する搬送キャリア側に、交流磁場に曝されると発熱するサセプタを配置し、該サセプタ上にワークを載置して、サセプタを介してワークの加熱を行うように構成している。
しかし、はんだ接合を行うワーク（第１の接合部材および第２の接合部材）がＩＧＢＴやパワーＭＯＳ等を搭載したパワーモジュールであった場合、該パワーモジュールは下端面に放熱板を供えており、はんだ接合時には該放熱板が前記サセプタと接することとなっている。 As described above, in a solder joining apparatus that performs soldering using induction heating, a susceptor that generates heat when exposed to an alternating magnetic field is disposed on the carrier side that transports a workpiece to be soldered. The workpiece is placed on the susceptor, and the workpiece is heated via the susceptor.
However, when the work (first joining member and second joining member) to be soldered is a power module equipped with an IGBT, a power MOS or the like, the power module is provided with a heat sink on the lower end surface, At the time of soldering, the heat sink is in contact with the susceptor.

一般的にパワーモジュールは、放熱グリスを塗布した放熱板の下面を冷却器に接合させて、回路基板に実装される半導体素子の発熱を前記冷却器に放熱するように構成されているため、前記放熱板と冷却器とを密着させることが重要である。
従って、前記放熱板を予め下に凸の反り形状に形成しておき、該放熱板の両端を冷却器に固定することで、放熱板と冷却器とが全体的に密着するようにしている。 Generally, the power module is configured to join the lower surface of the heat radiating plate coated with heat radiating grease to the cooler, and to radiate the heat generated by the semiconductor element mounted on the circuit board to the cooler. It is important to bring the heat sink and the cooler into close contact.
Therefore, the heat radiating plate is previously formed in a downwardly warped shape, and both ends of the heat radiating plate are fixed to the cooler so that the heat radiating plate and the cooler are in close contact with each other.

このように、パワーモジュールの放熱板は下に凸の反り形状に形成されているので、平板状部材にて構成される前記サセプタ上に放熱板を載置すると、放熱板のサセプタとの接触部位が、該放熱板の中央部（最も下方に突出している部分）のみに偏ったり、サセプタ上に載置した放熱板の姿勢が不安定になったりして、はんだ接合時にパワーモジュールの各部の温度が不均一となり、はんだの溶融度合いにばらつきが生じることとなる。
例えば、放熱板がサセプタと接触している中央部のはんだが高温に加熱されて融け易くなり、端部のはんだがあまり高温に加熱されなくて融けにくくなるため、部位によってはんだの溶融状態がばらつき、回路基板と放熱板との接合面が均一にはんだ接合されなかったり、はんだ接合部にボイドが発生したりする。
そこで、本発明においては、前記サセプタとの接触面が下に凸の反り形状に形成されているワークに対しても、均一な加熱を行うことができるはんだ接合装置を提供するものである。 Thus, since the heat dissipation plate of the power module is formed in a downwardly warped shape, when the heat dissipation plate is placed on the susceptor configured by a flat plate member, the contact portion of the heat dissipation plate with the susceptor However, the temperature of each part of the power module at the time of soldering may be biased only at the center of the heat sink (the part that protrudes most downward) or the posture of the heat sink placed on the susceptor may become unstable. Becomes non-uniform, and the degree of melting of the solder varies.
For example, the solder at the center where the heat sink is in contact with the susceptor is heated to a high temperature and is easily melted, and the solder at the end is not heated to a very high temperature and is difficult to melt. The joint surface between the circuit board and the heat radiating plate may not be soldered uniformly, or voids may be generated at the solder joints.
Therefore, the present invention provides a solder joint apparatus capable of performing uniform heating even on a workpiece having a contact surface with the susceptor formed in a downwardly warped shape.

上記課題を解決するはんだ接合装置は、以下の特徴を有する。
即ち、請求項１記載のごとく、誘導加熱現象を利用して、第１の接合部材と第２の接合部材との間にはんだを介在させて構成されるはんだ接合体のはんだを溶融させ、前記第１の接合部材と第２の接合部材とをはんだ接合するはんだ接合装置であって、交流電流を通電することによって交流磁場を発生させ、内側に貫通空間を有する誘導コイルと、前記誘導コイルの貫通空間内に配置され、交流磁場に曝されると発熱するサセプタと、前記サセプタ上に設置され、前記第１の接合部材と第２の接合部材とのはんだ接合時に前記はんだ接合体が載置される熱伝導シートとを備え、前記熱伝導シートの略中央部には開口部が形成され、前記熱伝導シートは、前記はんだ接合体を前記開口部の縁部にて支持する。
これにより、熱伝導シートに設置される前記はんだ接合体（第１の接合部材または第２の接合部材）の下面が平坦でなく、下に凸となる反り形状等の反り形状を有していたとしても、該はんだ接合体を略均一に加熱することができ、さらには第１の接合部材と第２の接合部材との間に介在させたはんだをも全体的に均一に加熱することができて、各部でのはんだの溶融状態のばらつきを抑えることができる。
従って、接合後のはんだにボイドが発生することを防止できるとともに、第１の接合部材と第２の接合部材との接合面を均一にはんだ接合することができる。 A solder bonding apparatus that solves the above problems has the following characteristics.
That is, as described in claim 1, using the induction heating phenomenon, the solder of the solder joined body constituted by interposing solder between the first joining member and the second joining member is melted, A solder joining apparatus for solder joining a first joining member and a second joining member, wherein an alternating current is generated by passing an alternating current, an induction coil having a through space inside, and the induction coil A susceptor that is disposed in the through space and generates heat when exposed to an alternating magnetic field, and is placed on the susceptor, and the solder joint is placed at the time of solder joining between the first joint member and the second joint member An opening is formed in a substantially central portion of the heat conductive sheet, and the heat conductive sheet supports the solder joint body at an edge of the opening.
Thereby, the lower surface of the solder joined body (the first joining member or the second joining member) installed on the heat conductive sheet is not flat, and has a warped shape such as a warped shape that protrudes downward. However, the solder joined body can be heated substantially uniformly, and further, the solder interposed between the first joining member and the second joining member can be heated uniformly as a whole. Thus, variation in the molten state of the solder in each part can be suppressed.
Therefore, voids can be prevented from occurring in the solder after joining, and the joining surfaces of the first joining member and the second joining member can be soldered uniformly.

また、請求項２記載のごとく、前記熱伝導シートは、該熱伝導シートに載置されたはんだ接合体の前記開口部に位置する部分の下面と、前記サセプタとの間に間隙が形成されるだけの厚みを有する。
これにより、熱伝導シートに載置したはんだ接合体（第１の接合部材または第２の接合部材）の下面が直接サセプタに接触することがなく、該放熱板が局部的に高温に加熱されることを防止して、放熱板の加熱温度の均一化を図ることが可能となる。 According to a second aspect of the present invention, in the heat conductive sheet, a gap is formed between a lower surface of a portion located in the opening of the solder joint body placed on the heat conductive sheet and the susceptor. It has only a thickness.
Thereby, the lower surface of the solder joined body (the first joining member or the second joining member) placed on the heat conductive sheet does not directly contact the susceptor, and the heat sink is locally heated to a high temperature. This can be prevented and the heating temperature of the heat sink can be made uniform.

また、請求項３記載のごとく、前記はんだ接合体における第１の接合部材および第２の接合部材の何れか一方は、半導体素子が実装された回路基板であり、何れか他方は前記回路基板に生じた熱を放熱させるための放熱板であり、前記放熱板が前記熱伝導シートの開口部の縁部に支持される。
これにより、該放熱板が下に凸の反り形状を有している部材であっても、加熱時における放熱板の姿勢を安定させることができ、放熱板を均一に加熱して、回路基板と放熱板とを均一にはんだ接合することが可能となる。
また、反りの大きさが異なった放熱板を前記熱伝導シートに載置した場合でも、サセプタから熱伝導シートを通じての放熱板への熱の伝達度合いが殆ど変わることがなく、様々な反りの大きさの放熱板２に対して均一な加熱を行うことが可能となる Further, as described in claim 3, any one of the first joining member and the second joining member in the solder joined body is a circuit board on which a semiconductor element is mounted, and either one is placed on the circuit board. It is a heat radiating plate for radiating the generated heat, and the heat radiating plate is supported by the edge of the opening of the heat conductive sheet.
Thereby, even if the heat sink is a member having a downwardly warped shape, the posture of the heat sink can be stabilized during heating, and the heat sink can be heated uniformly to It is possible to solder the heat sink uniformly.
Even when heat sinks with different warp sizes are placed on the heat conductive sheet, the degree of heat transfer from the susceptor to the heat sink through the heat conductive sheet is hardly changed, and there are various warp sizes. It becomes possible to uniformly heat the heat sink 2

本発明によれば、はんだ接合体を略均一に加熱することができ、さらには第１の接合部材と第２の接合部材との間に介在させたはんだをも全体的に均一に加熱することができて、各部でのはんだの溶融状態のばらつきを抑えることができる。
これにより、接合後のはんだにボイドが発生することを防止できるとともに、第１の接合部材と第２の接合部材との接合面を均一にはんだ接合することが可能となる。 According to the present invention, the solder joined body can be heated substantially uniformly, and further, the solder interposed between the first joining member and the second joining member can also be uniformly heated as a whole. It is possible to suppress the variation in the molten state of the solder in each part.
Thereby, it is possible to prevent voids from being generated in the solder after joining, and to uniformly solder the joining surfaces of the first joining member and the second joining member.

次に、本発明を実施するための形態を、添付の図面を用いて説明する。   Next, modes for carrying out the present invention will be described with reference to the accompanying drawings.

図１〜図３に示すはんだ接合装置１０は、誘導加熱現象を利用して、第１の接合部材となる放熱板２と、第２の接合部材となり半導体素子が実装された回路基板３との間にはんだ４を介在させて構成されるはんだ接合体１のはんだ４を溶融させ、前記放熱板２と回路基板３とをはんだ接合するはんだ接合装置である。   The solder bonding apparatus 10 shown in FIGS. 1 to 3 uses an induction heating phenomenon to provide a heat sink 2 that is a first bonding member and a circuit board 3 that is a second bonding member and on which a semiconductor element is mounted. In this solder joining apparatus, the heat sink 2 and the circuit board 3 are soldered together by melting the solder 4 of the solder joined body 1 having the solder 4 interposed therebetween.

なお、本例において、はんだ接合体１とは、第１の接合部材となる放熱板２と、第２の接合部材となる回路基板３との間にはんだ４を介在させたものをいうが、このはんだ接合体１には、はんだ４が溶融する前で前記放熱板２と回路基板３とがはんだ４により未だ接合されていない状態のもの、およびはんだ４が溶融され前記放熱板２と回路基板３とがはんだ４により接合された状態のものの、両方を含むものである。   In addition, in this example, the solder joined body 1 refers to one in which the solder 4 is interposed between the heat radiating plate 2 serving as the first joining member and the circuit board 3 serving as the second joining member. In this solder joint 1, the heat sink 2 and the circuit board 3 are not yet joined by the solder 4 before the solder 4 is melted, and the solder 4 is melted and the heat sink 2 and the circuit board are melted. 3 and 3 are joined together by the solder 4.

前記はんだ接合装置１０は、前記放熱板２と回路基板３との間にペレット状のはんだ４を介在させた状態のはんだ接合体１を搬送するコンベア１２、前記コンベア１２の周囲を囲むように配置される誘導コイル１１、はんだ接合体１の温度を計測する温度計測器１４、および前記誘導コイル１１や温度計測記１４等を制御するコントローラ１３を備えている。
前記コンベア１２、誘導コイル１１、および温度計測器１４等は、リフロー炉の真空チャンバ内に収容されている。 The solder bonding apparatus 10 is arranged so as to surround a conveyor 12 that conveys a solder bonded body 1 in a state in which pellet-shaped solder 4 is interposed between the heat sink 2 and the circuit board 3, and the conveyor 12. An induction coil 11, a temperature measuring device 14 for measuring the temperature of the solder joint 1, and a controller 13 for controlling the induction coil 11, the temperature measurement note 14, and the like.
The conveyor 12, the induction coil 11, the temperature measuring instrument 14, and the like are accommodated in a vacuum chamber of a reflow furnace.

なお、誘導コイル１１は、コンベア１２によるはんだ接合体１の搬送方向において、該ハンダ接合体１の長さよりも広い範囲に配置されている。
また、誘導コイル１１に囲まれた内側の空間は、コンベア１２上に載置されたはんだ接合体１が搬送されるのに十分な大きさに形成されている。 The induction coil 11 is arranged in a range wider than the length of the solder joint 1 in the conveying direction of the solder joint 1 by the conveyor 12.
Further, the inner space surrounded by the induction coil 11 is formed in a size sufficient for the solder joint 1 placed on the conveyor 12 to be conveyed.

前記はんだ接合体１は、キャリア１６等を介してコンベア１２上に配置されている。
つまり、前記コンベア１２上には前記キャリア１６が載置されており、該キャリア１６上にはサセプタ１７が載置されている。そして、該サセプタ１７上には、熱伝導シート１８を介してはんだ接合体１が載置されている。
前記熱伝導シート１８は、前記サセプタ１７に立設される位置決めピン、高温用接着材、またはビス等により、前記サセプタ１７に対して固定されている。 The solder joint 1 is disposed on the conveyor 12 via a carrier 16 or the like.
That is, the carrier 16 is placed on the conveyor 12, and the susceptor 17 is placed on the carrier 16. On the susceptor 17, the solder joined body 1 is placed via a heat conductive sheet 18.
The heat conductive sheet 18 is fixed to the susceptor 17 by a positioning pin, a high-temperature adhesive, a screw, or the like standing on the susceptor 17.

ここで、前記サセプタ１７は、交流磁場に曝されると電流が流れて発熱する部材であり、例えば磁性材料にて構成されている。
また、はんだ接合体１が載置されるキャリア１６は、例えば複数が連結された状態でコンベア１２上を搬送されている。 Here, the susceptor 17 is a member that generates heat when it is exposed to an alternating magnetic field, and is made of, for example, a magnetic material.
Moreover, the carrier 16 on which the solder joined body 1 is placed is conveyed on the conveyor 12 in a state where a plurality of carriers 16 are connected, for example.

図４、図５に示すように、前記熱伝導シート１８は、例えば、高熱伝導率および柔軟性（可撓性）を有するグラファイトをシート状に形成した部材にて構成されており、その略中央部には略矩形の開口部１８ａが形成されている。
前記開口部１８ａは、略対向する一対の開口縁部１８ｂ・１８ｂ、および略対向する一対の開口縁部１８ｃ・１８ｃを有しており、前記放熱板２は、一方の対向する開口縁部１８ｂ・１８ｂにより支持されるように熱伝導シート１８に載置される。 As shown in FIGS. 4 and 5, the heat conductive sheet 18 is composed of, for example, a member in which graphite having a high thermal conductivity and flexibility (flexibility) is formed in a sheet shape, and substantially in the center. A substantially rectangular opening 18a is formed in the part.
The opening portion 18a has a pair of opening edge portions 18b and 18b that are substantially opposed to each other, and a pair of opening edge portions 18c and 18c that are substantially opposite to each other. -It mounts on the heat conductive sheet 18 so that it may be supported by 18b.

つまり、放熱板２の図４における左右方向の長さは、前記開口部１８ａの一対の開口縁部１８ｂ・１８ｂの間隔よりも長く形成され、該放熱板２の図４における上下方向の長さは、前記開口部１８ａの一対の開口縁部１８ｃ・１８ｃの間隔よりも短く形成されており、放熱板２は下に凸の反り形状を有しているので、熱伝導シート１８上に載置された放熱板２は一対の開口縁部１８ｂ・１８ｂにて支持されて、該開口縁部１８ｂ・１８ｂ間に位置する放熱板２の下面は熱伝導シート１８の上面よりも下方に位置し、開口縁部１８ｂ・１８ｂよりも左右外側に位置する放熱板２の下面は熱伝導シート１８の上面よりも上方に位置することとなる。   That is, the length of the heat sink 2 in the left-right direction in FIG. 4 is formed longer than the distance between the pair of opening edges 18b and 18b of the opening 18a, and the length of the heat sink 2 in the vertical direction in FIG. Is formed shorter than the distance between the pair of opening edges 18c and 18c of the opening 18a, and the heat radiating plate 2 has a downwardly warped shape, so that it is placed on the heat conductive sheet 18. The heat sink 2 is supported by a pair of opening edges 18b and 18b, and the lower surface of the heat sink 2 located between the opening edges 18b and 18b is located below the upper surface of the heat conductive sheet 18, The lower surface of the heat radiating plate 2 positioned on the left and right outer sides of the opening edge portions 18b and 18b is positioned higher than the upper surface of the heat conductive sheet 18.

そして、前記熱伝導シート１８の厚みは、載置した放熱板２の開口部１８ａに位置する部分の下面と熱伝導シート１８の下面（すなわち前記サセプタ１７の上面）との間に所定の隙間ｄが形成されるだけの厚みを有するように設定して、熱伝導シート１８に載置した放熱板２が直接サセプタ１７に接触しないようにしている。   The thickness of the heat conductive sheet 18 is set at a predetermined gap d between the lower surface of the portion located in the opening 18a of the mounted heat sink 2 and the lower surface of the heat conductive sheet 18 (that is, the upper surface of the susceptor 17). In order to prevent the heat sink 2 placed on the heat conductive sheet 18 from directly contacting the susceptor 17.

このように構成されるはんだ接合装置１０においては、前記はんだ接合体１が誘導コイル１１に囲まれる空間の内部へ搬送されると、コントローラ１３により誘導コイル１１に交流電流が通電される。
誘導コイル１１には、通電された交流電流によって交流磁場が発生する。誘導コイル１１に発生した交流磁場は、誘導コイル１１に囲まれた空間の内部に配置されるサセプタ１７に作用して誘導加熱現象を生じさせ、該サセプタ１７が発熱する。
ここで、誘導加熱現象とは、交流電流を通電した誘導コイルによって交流磁場を発生させ、交流磁場内に存在する磁性材または導体に交流電流を発生させ、その交流電流によって磁性材を発熱させる現象をいう。 In the solder bonding apparatus 10 configured as described above, when the solder bonded body 1 is conveyed into the space surrounded by the induction coil 11, an alternating current is supplied to the induction coil 11 by the controller 13.
An induction magnetic field is generated in the induction coil 11 by the supplied alternating current. The alternating magnetic field generated in the induction coil 11 acts on the susceptor 17 disposed inside the space surrounded by the induction coil 11 to cause an induction heating phenomenon, and the susceptor 17 generates heat.
Here, the induction heating phenomenon is a phenomenon in which an alternating magnetic field is generated by an induction coil energized with an alternating current, an alternating current is generated in a magnetic material or conductor existing in the alternating magnetic field, and the magnetic material is heated by the alternating current. Say.

前述のごとく、誘導コイル１１からの交流電流による誘導加熱現象によりサセプタ１７が加熱され、加熱されたサセプタ１７により、該サセプタ１７上に載置された熱伝導シート１８が加熱される。さらに、加熱された熱伝導シート１８により、該熱伝導シート１８上に載置された放熱板２を通じてはんだ接合体１が加熱されはんだ４が溶融する。
また、はんだ４の加熱温度は温度計測器１４により計測されており、計測された温度に基づいて、誘導コイル１１に流す電流量をコントローラ１３により制御している。 As described above, the susceptor 17 is heated by the induction heating phenomenon caused by the alternating current from the induction coil 11, and the heat conductive sheet 18 placed on the susceptor 17 is heated by the heated susceptor 17. Furthermore, the solder joint 1 is heated by the heated heat conductive sheet 18 through the heat radiating plate 2 placed on the heat conductive sheet 18 and the solder 4 is melted.
Moreover, the heating temperature of the solder 4 is measured by the temperature measuring instrument 14, and the amount of current flowing through the induction coil 11 is controlled by the controller 13 based on the measured temperature.

このように、誘導加熱現象によりはんだ接合体１を加熱する場合、該はんだ接合体１の放熱板２は、熱伝導シート１８と一対の開口縁部１８ｂ・１８ｂのみで接触しているので、サセプタ１７からの熱は、前記開口縁部１８ｂ・１８ｂを通じて放熱板２へ伝達されていく。
図６に示すように、放熱板２に伝達されたサセプタ１７からの熱は、放熱板２の前記開口縁部１８ｂ・１８ｂとの接触部分を中心として放熱板２の各部へ伝播していき、該放熱板２２が全体的に加熱されることとなる。 Thus, when heating the solder joint 1 by induction heating phenomenon, the heat radiating plate 2 of the solder joint 1 is in contact with the heat conductive sheet 18 only by the pair of opening edges 18b and 18b. The heat from 17 is transmitted to the heat sink 2 through the opening edge portions 18b and 18b.
As shown in FIG. 6, the heat from the susceptor 17 transmitted to the heat radiating plate 2 propagates to each part of the heat radiating plate 2 around the contact portion with the opening edge portions 18b and 18b of the heat radiating plate 2, The heat radiating plate 22 is heated as a whole.

ここで、図７に、本はんだ接合装置１０にて加熱された放熱板２の温度分布（図７（ａ）と、従来のように下に凸の反り形状を有する放熱板を平板状部材にて構成される（開口部が形成されない）サセプタ上に載置して加熱した場合の放熱板２の温度分布（図７（ｂ）とを示す。
なお、図７（ａ）、図７（ｂ）における分布温度は、Ｈ２が最も高い温度を示しており、Ｈ２＞Ｈ１＞Ｍ＞Ｌ１＞Ｌ２の順に低くなっている。 Here, in FIG. 7, the temperature distribution of the heat radiating plate 2 heated by the solder bonding apparatus 10 (FIG. 7 (a) and a heat radiating plate having a downwardly curved warp shape as in the past is used as a flat plate member. FIG. 7B shows the temperature distribution of the heat sink 2 when it is placed and heated on a susceptor configured (no opening is formed).
In addition, as for the distribution temperature in Fig.7 (a) and FIG.7 (b), H2 has shown the highest temperature, and becomes low in order of H2>H1>M>L1> L2.

図７（ａ）によれば、本はんだ接合装置１０により加熱されるはんだ接合体１の放熱板２における温度は、前記開口縁部１８ｂ・１８ｂとの接触部分が最も高く、その接触部分から離れるに従って低くなるような分布となっているが、放熱板２内における温度差は小さい。
つまり、図７（ａ）において最も高い分布温度はＨ１であり、最も低い分布温度はＬ１であって、放熱板２内の各部における温度勾配は小さく、該放熱板２は略均一に加熱されている。 According to FIG. 7A, the temperature of the heat sink 2 of the solder joined body 1 heated by the solder joining apparatus 10 is highest at the contact portions with the opening edge portions 18b and 18b, and is separated from the contact portions. However, the temperature difference in the heat sink 2 is small.
That is, in FIG. 7A, the highest distribution temperature is H1, the lowest distribution temperature is L1, the temperature gradient in each part in the heat sink 2 is small, and the heat sink 2 is heated substantially uniformly. Yes.

これに対し、図７（ｂ）によれば、従来のように下に凸の反り形状を有する放熱板を平板状部材にて構成されるサセプタ上に載置して加熱した場合の放熱板２の温度は、該放熱板２がサセプタに対して点接触的に接触している中心部が最も高く、その中心部から周辺部へ向うに従って序々に低くなっていくような分布となっていて、放熱板２内における温度差は大きい。
つまり。図７（ｂ）において最も高い分布温度はＨ２であり、最も低い分布温度はＬ２であって、放熱板２内の各部における温度勾配は大きく、該放熱板２は不均一に加熱されている。 On the other hand, according to FIG.7 (b), the heat sink 2 at the time of mounting and heat-radiating the heat sink which has a convex convex shape downward on the susceptor comprised with a flat plate-shaped member like the past. The temperature of the heat sink 2 is the highest at the center where the heat sink 2 is in point contact with the susceptor, and the distribution gradually decreases from the center toward the periphery. The temperature difference in the heat sink 2 is large.
In other words. In FIG. 7B, the highest distribution temperature is H2, and the lowest distribution temperature is L2. The temperature gradient in each part in the heat radiating plate 2 is large, and the heat radiating plate 2 is heated unevenly.

このように、開口部１８ａを備えた熱伝導シート１８を介してサセプタ１７からの熱を放熱板２へ伝達することで、下に凸の反り形状を有した放熱板２を略均一に加熱することができるので、放熱板２と回路基板３との間に介在させたはんだ４をも全体的に均一に加熱することができて、各部でのはんだ４の溶融状態のばらつきを抑えることができる。
これにより、接合後のはんだ４にボイドが発生することを防止できるとともに、回路基板３と放熱板２との接合面を均一にはんだ接合することができる。 In this way, by transferring the heat from the susceptor 17 to the heat radiating plate 2 through the heat conductive sheet 18 having the opening 18a, the heat radiating plate 2 having a downwardly warped shape is heated substantially uniformly. Therefore, the solder 4 interposed between the heat radiating plate 2 and the circuit board 3 can also be heated uniformly as a whole, and variations in the molten state of the solder 4 in each part can be suppressed. .
Thereby, it is possible to prevent the voids from being generated in the solder 4 after joining, and to uniformly solder the joining surfaces of the circuit board 3 and the heat sink 2.

特に、前記開口部１８ａを備えた熱伝導シート１８は、載置した放熱板２の開口部１８ａに位置する部分の下面と前記サセプタ１７の上面との間に所定の隙間ｄが形成されるだけの厚みを有するように形成しているので、熱伝導シート１８に載置した放熱板２の中央部が直接サセプタ１７に接触することがなく、該放熱板２が局部的に高温に加熱されることを防止して、放熱板２の加熱温度の均一化を図ることが可能となっている。   In particular, in the heat conductive sheet 18 provided with the opening 18 a, only a predetermined gap d is formed between the lower surface of the portion located in the opening 18 a of the mounted heat sink 2 and the upper surface of the susceptor 17. Therefore, the central portion of the heat sink 2 placed on the heat conductive sheet 18 does not directly contact the susceptor 17, and the heat sink 2 is locally heated to a high temperature. This can be prevented and the heating temperature of the heat radiating plate 2 can be made uniform.

また、前記熱伝導シート１８は、開口部１８ａの略対向する一対の開口縁部１８ｂ・１８ｂにて２箇所で放熱板２を支持しているので、該放熱板２が下に凸の反り形状を有している部材であっても、加熱時における放熱板２の姿勢を安定させることができ、放熱板２を均一に加熱して、回路基板３と放熱板２とを均一にはんだ接合することが可能となる。
また、反りの大きさが異なった放熱板２を前記熱伝導シート１８に載置した場合でも、サセプタ１７から熱伝導シート１８を通じての放熱板２への熱の伝達度合いが殆ど変わることがなく、様々な反りの大きさの放熱板２に対して均一な加熱を行うことが可能となる。 Moreover, since the said heat conductive sheet 18 is supporting the heat sink 2 in two places by a pair of opening edge part 18b * 18b which the opening part 18a opposes substantially, this heat sink plate 2 is a convex warpage shape downward. Even if it is a member which has, it can stabilize the attitude | position of the heat sink 2 at the time of a heating, heats the heat sink 2 uniformly, and solders the circuit board 3 and the heat sink 2 uniformly. It becomes possible.
Further, even when the heat radiating plate 2 having different warp sizes is placed on the heat conductive sheet 18, the degree of heat transfer from the susceptor 17 to the heat radiating plate 2 through the heat conductive sheet 18 is hardly changed. It becomes possible to uniformly heat the heat sink 2 having various warping sizes.

はんだ接合装置を示す斜視図である。It is a perspective view which shows a soldering apparatus. はんだ接合装置を示す平面図である。It is a top view which shows a soldering apparatus. はんだ接合装置を示す正面断面図である。It is front sectional drawing which shows a soldering apparatus. 熱伝導シートを示す平面図である。It is a top view which shows a heat conductive sheet. 熱伝導シート上にはんだ接合体（放熱板）を載置した状態を示す側面断面図である。It is side surface sectional drawing which shows the state which mounted the solder joined body (heat sink) on the heat conductive sheet. 熱伝導シート上に載置した放熱板における熱の伝播状態を示す平面図である。It is a top view which shows the propagation state of the heat in the heat sink mounted on the heat conductive sheet. （ａ）は本はんだ接合装置にて加熱した放熱板の温度分布を示す図であり、（ｂ）は従来のはんだ接合装置にて加熱した放熱板の温度分布を示す図である。(A) is a figure which shows the temperature distribution of the heat sink heated by this soldering apparatus, (b) is a figure which shows the temperature distribution of the heat sink heated by the conventional soldering apparatus.

符号の説明Explanation of symbols

１ はんだ接合体
２ 放熱板
３ 回路基板
４ はんだ
１０ はんだ接合装置
１１ 誘導コイル
１２ コンベア
１６ キャリア
１７ サセプタ
１８ 熱伝導シート
１８ａ 開口部
１８ｂ・１８ｃ 開口縁部 DESCRIPTION OF SYMBOLS 1 Solder joined body 2 Heat sink 3 Circuit board 4 Solder 10 Solder joining apparatus 11 Induction coil 12 Conveyor 16 Carrier 17 Susceptor 18 Thermal conductive sheet 18a Opening 18b and 18c Opening edge

Claims (3)

誘導加熱現象を利用して、第１の接合部材と第２の接合部材との間にはんだを介在させて構成されるはんだ接合体のはんだを溶融させ、前記第１の接合部材と第２の接合部材とをはんだ接合するはんだ接合装置であって、
交流電流を通電することによって交流磁場を発生させ、内側に貫通空間を有する誘導コイルと、
前記誘導コイルの貫通空間内に配置され、交流磁場に曝されると発熱するサセプタと、
前記サセプタ上に設置され、前記第１の接合部材と第２の接合部材とのはんだ接合時に前記はんだ接合体が載置される熱伝導シートとを備え、
前記熱伝導シートの略中央部には開口部が形成され、
前記熱伝導シートは、前記はんだ接合体を前記開口部の縁部にて支持する、
ことを特徴とするはんだ接合装置。 Using the induction heating phenomenon, the solder of the solder joined body constituted by interposing solder between the first joining member and the second joining member is melted, and the first joining member and the second joining member are melted. A solder joining apparatus for solder joining a joining member,
An induction coil that generates an alternating magnetic field by energizing an alternating current and has a through space inside;
A susceptor that is disposed in the through space of the induction coil and generates heat when exposed to an alternating magnetic field;
A heat conductive sheet that is installed on the susceptor and on which the solder joint is placed during solder joining of the first joining member and the second joining member;
An opening is formed in a substantially central portion of the heat conductive sheet,
The heat conductive sheet supports the solder joined body at an edge of the opening.
A solder joint device characterized by that. 前記熱伝導シートは、該熱伝導シートに載置されたはんだ接合体の前記開口部に位置する部分の下面と、前記サセプタとの間に間隙が形成されるだけの厚みを有する、
ことを特徴とする請求項１に記載のはんだ接合装置。 The thermal conductive sheet has a thickness such that a gap is formed between the lower surface of the portion located in the opening of the solder joint body placed on the thermal conductive sheet and the susceptor.
The solder joint apparatus according to claim 1, wherein 前記はんだ接合体における第１の接合部材および第２の接合部材の何れか一方は、半導体素子が実装された回路基板であり、何れか他方は前記回路基板に生じた熱を放熱させるための放熱板であり、
前記放熱板が前記熱伝導シートの開口部の縁部に支持される、
ことを特徴とする請求項１または請求項２に記載のはんだ接合装置。

Either one of the first joining member and the second joining member in the solder joined body is a circuit board on which a semiconductor element is mounted, and the other is heat radiation for dissipating heat generated in the circuit board. Board,
The heat radiating plate is supported on the edge of the opening of the heat conductive sheet,
The solder joint device according to claim 1 or 2, wherein the solder joint device is provided.

JP2006319304A 2006-11-27 2006-11-27 Soldering device Pending JP2008132508A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010166059A (en) * 2009-01-19 2010-07-29 Samsung Electronics Co Ltd Reflow device and reflow method
JP7394243B1 (en) 2023-02-02 2023-12-07 株式会社オリジン Heating device and method for manufacturing soldered objects

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276588A (en) * 1985-09-28 1987-04-08 三菱電機株式会社 Hybrid integrated circuit device
JP2002050657A (en) * 2000-08-02 2002-02-15 Ngk Insulators Ltd Ceramic heater

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276588A (en) * 1985-09-28 1987-04-08 三菱電機株式会社 Hybrid integrated circuit device
JP2002050657A (en) * 2000-08-02 2002-02-15 Ngk Insulators Ltd Ceramic heater

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010166059A (en) * 2009-01-19 2010-07-29 Samsung Electronics Co Ltd Reflow device and reflow method
JP7394243B1 (en) 2023-02-02 2023-12-07 株式会社オリジン Heating device and method for manufacturing soldered objects

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