TW202107645A - Circuit board and mounting method - Google Patents

Circuit board and mounting method Download PDF

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Publication number
TW202107645A
TW202107645A TW109119860A TW109119860A TW202107645A TW 202107645 A TW202107645 A TW 202107645A TW 109119860 A TW109119860 A TW 109119860A TW 109119860 A TW109119860 A TW 109119860A TW 202107645 A TW202107645 A TW 202107645A
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Taiwan
Prior art keywords
circuit
heat
solder
conductive pad
terminal
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TW109119860A
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Chinese (zh)
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杉山和弘
佐藤彰
福田光樹
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日商萬達修查股份有限公司
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Publication of TW202107645A publication Critical patent/TW202107645A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Provided is soldering technology with which it is possible to mount an electronic component having a small metal terminal area to a sheet-shaped circuit board. An electronic component mounting structure is formed by soldering an electronic component (e.g., an LED) 20 to a circuit board 10. The circuit board 10 is provided with: a non-heat-resistant sheet 11; a circuit provided on one side of the non-heat-resistant sheet 11; a circuit-side terminal 12 provided to the circuit; and an electroconductive pad 40 provided at a position, corresponding to the circuit-side terminal 12, on the other side of the non-heat-resistant sheet 11. The circuit-side terminal 12 generates heat by electromagnetic induction heating. The heat generated by the electroconductive pad 40 is transmitted through the non-heat-resistant sheet 11 and the circuit-side terminal 12. A shortage in the amount of heat generated by the circuit-side terminal 12 is compensated through indirect heating by the electroconductive pad 40, whereby heat generation solder 30 is caused to melt.

Description

電路基板及封裝方法Circuit substrate and packaging method

本發明是關於片狀的電路基板及在這個電路基板的封裝方法。The present invention relates to a sheet-shaped circuit substrate and a method of packaging the circuit substrate.

在電子機器，在將半導體等電子部件封裝於電路基板時，以焊料接合。焊料接合是將焊料配置於接合對象間之後，藉由焊料受到加熱而熔融來進行。關於加熱，一般是使用回流爐(加熱爐)。In electronic equipment, when packaging electronic components such as semiconductors on a circuit board, they are joined with solder. Solder bonding is performed by arranging the solder between the joining objects and then melting the solder by heating it. Regarding heating, a reflow furnace (heating furnace) is generally used.

近年來，伴隨著電子機器的小型、輕量化，使用可撓式基板作為封裝細微的電子部件的基板。為了降低可撓式基板的成本，亦有使用聚酯、聚乙烯等的非耐熱性樹脂(低熔點樹脂)來取代以往的聚醯亞胺樹脂的情況。In recent years, as electronic devices have become smaller and lighter in weight, flexible substrates have been used as substrates for packaging fine electronic components. In order to reduce the cost of flexible substrates, non-heat-resistant resins (low melting point resins) such as polyester and polyethylene may be used instead of conventional polyimide resins.

在利用回流爐的焊料接合，有由非耐熱性樹脂構成的基板發生熱變形之虞。In solder bonding using a reflow furnace, a substrate made of a non-heat-resistant resin may be thermally deformed.

作為在設於非耐熱性片的電路基板的電子部件封裝方法，有人提出使用電磁感應加熱的技術(例如，專利文獻1)。As a method of packaging electronic parts on a circuit board provided on a non-heat-resistant sheet, a technique using electromagnetic induction heating has been proposed (for example, Patent Document 1).

第18圖是關於電磁感應加熱的基本原理的概念圖。電磁感應加熱裝置是由感應線圈、電源及控制裝置構成。Figure 18 is a conceptual diagram of the basic principles of electromagnetic induction heating. The electromagnetic induction heating device is composed of an induction coil, a power supply and a control device.

一旦交流電在感應線圈流動，便發生強度變化的磁力線。一旦在其附近放置通電的物質(具體而言為接合對象，通常是由金屬形成)，受到變化的磁力線的影響，在金屬中會有渦電流流動。由於通常在金屬會有電阻，電流一旦在金屬流動，會發生焦耳熱(Joule heat)，金屬就自發性發熱。此現象稱為感應加熱。Once the alternating current flows in the induction coil, magnetic lines of force with varying intensity occur. Once a energized substance (specifically, a joining object, usually formed of metal) is placed near it, eddy currents will flow in the metal under the influence of changing magnetic lines of force. Since there is usually resistance in metal, once current flows in the metal, Joule heat will occur, and the metal will generate heat spontaneously. This phenomenon is called induction heating.

由電磁感應造成的發熱量Q以下式表示。Q=(V2 /R)×t [V=施加電壓；R=電阻；t=時間]。The calorific value Q caused by electromagnetic induction is expressed by the following formula. Q=(V 2 /R)×t [V=applied voltage; R=resistance; t=time].

由於以電磁感應加熱則只有金屬發熱，少有周邊的樹脂部分受到熱損傷之虞。又，亦幾乎不會對電子部件有熱影響，少有電子部件受到熱損傷之虞。Since only metal heats up by electromagnetic induction heating, there is little risk of thermal damage to the surrounding resin part. In addition, there is almost no thermal effect on the electronic components, and there is little risk of thermal damage to the electronic components.

由於以電磁感應加熱則只有金屬發熱，可以以少量的能量且在短時間接合。一次的接合所需的時間為數秒至十數秒。Since only metal heats up with electromagnetic induction heating, it can be joined in a short time with a small amount of energy. The time required for one bonding is several seconds to ten seconds.

由於以電磁感應加熱則若在一樣磁場內會得到既定的焦耳熱，故接合精度高。又若在一樣磁場內，可以一次作複數項的接合。Since electromagnetic induction heating is used to obtain a predetermined Joule heat in the same magnetic field, the bonding accuracy is high. In the same magnetic field, multiple items can be joined at once.

以電磁感應加熱，容易藉由控制裝置控制電源輸出量及輸出時間。其結果，亦容易控制加熱溫度及加熱時間。可以設定所需的溫度曲線。With electromagnetic induction heating, it is easy to control the power output and output time by the control device. As a result, it is also easy to control the heating temperature and heating time. You can set the desired temperature profile.

電路基板側的金屬端子發熱，熱量會傳導至焊料，將焊料熔融。The metal terminals on the circuit board side generate heat, and the heat is conducted to the solder, melting the solder.

以電磁感應加熱，亦容易進行使磁力集中之類的磁力控制(例如，專利文獻2)。藉此，即使有非接合對象的金屬存在於接合對象附近，可以不將非接合對象金屬加熱而選擇性地將接合對象金屬加熱。With electromagnetic induction heating, magnetic force control such as concentrating magnetic force is also easy (for example, Patent Document 2). Thereby, even if there is a non-joining target metal in the vicinity of the joining target, the non-joining target metal can be selectively heated without heating the non-joining target metal.

根據以上，藉由根據電磁感應加熱的焊料接合，可以因應電子機器、電子部件等的小型化。 [先行技術文獻] [專利文獻]Based on the above, solder bonding by electromagnetic induction heating can cope with the miniaturization of electronic devices, electronic components, and the like. [Advanced Technical Literature] [Patent Literature]

[專利文獻1]     日本特許第6481085號公報 [專利文獻2]     日本特開2018-148136號公報[Patent Document 1] Japanese Patent No. 6481085 [Patent Document 2] Japanese Patent Application Publication No. 2018-148136

[發明所欲解決的問題][The problem to be solved by the invention]

如上所述，電子機器、電子部件等有小型化的傾向。而根據電磁感應加熱的焊料接合，可以因應小型化傾向。As described above, electronic devices, electronic components, etc. tend to be downsized. The solder joint by electromagnetic induction heating can cope with the trend of miniaturization.

然而，一旦更進一步小型化，發熱對象之金屬端子的面積亦變得狹小。特別是，在既定的面積配置多數的電子部件的情況、電子部件具有多數的端子的情況等，金屬端子面積會變得更狹小。其結果，電阻R變大而變得無法確保發熱量(上述理論式的分母變大)。However, once the size is further reduced, the area of the metal terminal of the heat-generating object also becomes smaller. In particular, when a large number of electronic components are arranged in a predetermined area, or when an electronic component has a large number of terminals, the area of the metal terminal becomes smaller. As a result, the resistance R becomes large and it becomes impossible to ensure the heat generation amount (the denominator of the above-mentioned theoretical formula becomes large).

若根據上述理論式，藉由使施加電壓V增加或使施加時間t增加，則可以確保發熱量Q。According to the above theoretical formula, by increasing the applied voltage V or increasing the application time t, the calorific value Q can be ensured.

另一方面，若以試作模型試著實際驗證，一旦金屬端子面積為1mm×1mm左右以下，則散見接合不良等的缺陷。藉由電磁感應加熱，就算是可以高精度地調整施加電壓、施加時間等，調整施加電壓、施加時間等在消除缺陷方面仍有其限度。On the other hand, if the prototype is used for actual verification, once the area of the metal terminal is about 1mm×1mm or less, defects such as poor joining will be scattered. With electromagnetic induction heating, even if the applied voltage and application time can be adjusted with high accuracy, the adjustment of the applied voltage, application time, etc. still has its limits in eliminating defects.

另外，本案發明人成功試行金屬端子面積250μm×250μm左右的電子部件的封裝。在將來，金屬端子面積50μm×50μm左右的電子部件的封裝也有可能見到。In addition, the inventor of the present case successfully tried the packaging of electronic components with a metal terminal area of about 250 μm×250 μm. In the future, packaging of electronic components with a metal terminal area of about 50 μm×50 μm may also be seen.

本發明是為了解決上述問題，以提供即使在金屬端子面積狹小的情況仍能夠因應的接合技術為目的。 [用以解決問題的手段]The present invention is to solve the above-mentioned problems, and aims to provide a bonding technology that can cope with the small area of the metal terminal. [Means to solve the problem]

關於解決上述問題之本發明的電路基板，藉由電磁感應加熱以焊料接合電子部件。電路基板具備非耐熱性片、設於上述非耐熱性片的一面側的電路、設於上述電路的電路側端子以及設於上述非耐熱性片的另一面側之對應於上述電路側端子的位置之導電性墊。Regarding the circuit board of the present invention that solves the above-mentioned problems, electronic components are joined with solder by electromagnetic induction heating. The circuit board includes a non-heat-resistant sheet, a circuit provided on one side of the non-heat-resistant sheet, a circuit-side terminal provided on the circuit, and a position corresponding to the circuit-side terminal provided on the other side of the non-heat-resistant sheet The conductive pad.

藉此，根據上述導電性墊的間接加熱(準直接加熱)，補足電路端子的發熱不足，將焊料熔融。此時，對非耐熱片的熱影響有限。Thereby, according to the indirect heating (quasi-direct heating) of the conductive pad, the insufficient heat generation of the circuit terminal is supplemented, and the solder is melted. At this time, the thermal influence on the non-heat-resistant sheet is limited.

在上發明，較佳為可以排列複數個上述電子部件。In the above invention, it is preferable that a plurality of the above-mentioned electronic components can be arranged.

例如，可適用於片狀顯示器。另外，由於在既定排列多數的電子部件，各端子的面積變狹小。根據本發明，即使是金屬端子面積狹小的情況仍可以以焊料接合。For example, it can be applied to a chip display. In addition, since a large number of electronic components are arranged in a predetermined arrangement, the area of each terminal becomes narrow. According to the present invention, even when the area of the metal terminal is small, it is possible to join with solder.

在上發明，較佳為以對應於一個電子部件的複數個電路側端子為一個單位，而上述導電性墊設於上述每一個單位。In the above invention, it is preferable that a plurality of circuit-side terminals corresponding to one electronic component is used as a unit, and the conductive pad is provided in each unit.

藉此，即使是金屬端子面積狹小的情況仍可以以焊料接合。Thereby, even if the area of the metal terminal is small, it is possible to join with solder.

在上發明，較佳為以對應於一個電子部件的三個以上的電路側端子為一個單位。In the above invention, it is preferable to use three or more circuit-side terminals corresponding to one electronic component as a unit.

由於電子部件具有多數的端子，各端子的面積變狹小。根據本發明，即使是金屬端子面積狹小的情況仍可以以焊料接合。Since the electronic component has a large number of terminals, the area of each terminal becomes narrow. According to the present invention, even when the area of the metal terminal is small, it is possible to join with solder.

在上發明，較佳為上述電路側端子的尺寸為1mm×1mm以下。In the above invention, it is preferable that the size of the circuit-side terminal is 1 mm×1 mm or less.

端子尺寸成為1mm×1mm以下的情況，散見發熱量不足等的缺陷。根據本發明，即使是金屬端子面積狹小的情況仍可以以焊料接合。When the terminal size becomes 1mm×1mm or less, defects such as insufficient heat generation are dissipated. According to the present invention, even when the area of the metal terminal is small, it is possible to join with solder.

在上發明，較佳為上述導電性墊的尺寸包含上述一個單位。In the above invention, it is preferable that the size of the conductive pad includes the above one unit.

藉此，根據上述導電性墊的間接加熱，確實地補足電路端子的發熱不足，將焊料熔融。Thereby, according to the indirect heating of the above-mentioned conductive pad, the insufficient heat generation of the circuit terminal is surely compensated, and the solder is melted.

在上發明，較佳為上述導電性墊為圓形或多邊形。以五邊以上為佳。In the above invention, it is preferable that the conductive pad is circular or polygonal. It is better to have more than five sides.

藉此，上述導電性墊有效率地進行間接加熱。由於避免徒勞的發熱，可以抑制對片材的熱影響。Thereby, the above-mentioned conductive pad is efficiently indirectly heated. Since futile heat generation is avoided, the thermal influence on the sheet can be suppressed.

解決上述問題的本發明為將電子部件以焊料接合於上述電路基板的封裝方法。使電子部件的端子隔著焊料，與上述電路側端子對向；在上述非耐熱性片的另一面側，藉由上述電磁感應加熱而使上述導電性墊發熱；以及經由上述非耐熱性片及前記回路端子，將上述導電性墊所發之熱傳導至焊料，使焊料熔融。The present invention that solves the above-mentioned problems is a packaging method in which an electronic component is soldered to the above-mentioned circuit board. The terminals of the electronic components are opposed to the circuit-side terminals with solder interposed therebetween; on the other side of the non-heat-resistant sheet, the conductive pad is heated by the electromagnetic induction heating; and via the non-heat-resistant sheet and The circuit terminal mentioned above conducts the heat generated by the conductive pad to the solder to melt the solder.

藉此，根據上述導電性墊的間接加熱，補足電路端子的發熱不足，將焊料熔融。Thereby, according to the indirect heating of the conductive pad, the insufficient heat generation of the circuit terminal is supplemented, and the solder is melted.

在解決上述問題的本發明的片狀顯示器，上述電子部件為內臟控制部的全彩LED。片狀顯示器是藉由排列上述LED而形成。In the sheet-like display of the present invention that solves the above-mentioned problems, the above-mentioned electronic component is a full-color LED of the internal organs control unit. The chip display is formed by arranging the above-mentioned LEDs.

在片狀顯示器，由於在既定面積排列多數的電子部件，還由於LED具有多數的端子，各端子的面積變狹小。根據本發明，即使是金屬端子面積狹小的情況仍可以以焊料接合。 [發明功效]In chip displays, since a large number of electronic components are arranged in a predetermined area, and because LEDs have a large number of terminals, the area of each terminal becomes narrow. According to the present invention, even when the area of the metal terminal is small, it is possible to join with solder. [Efficacy of invention]

根據本發明的焊料接合技術，可以將具有狹小的金屬端子面積的電子部件封裝於片狀電路基板。According to the solder bonding technology of the present invention, an electronic component having a narrow metal terminal area can be packaged on a chip circuit board.

[用以實施發明的形態][Form to implement the invention]

＜封裝結構＞ 第1圖是關於本實施形態的LED封裝結構的示意剖面圖。LED封裝結構是將電子部件(例如LED)20以焊料接合於電路基板10而形成。＜Package structure＞ Fig. 1 is a schematic cross-sectional view of the LED package structure of this embodiment. The LED package structure is formed by bonding an electronic component (for example, LED) 20 to the circuit board 10 with solder.

LED 20，是例如內臟控制部的全彩LED，具有六個端子21。伴隨著LED 20的小型化，還有端子數成為多數，藉此端子21的面積亦狹小化。在本實施形態使用的LED的尺寸為例如2mm×2mm左右，端子尺寸為例如500μm×500μm左右。The LED 20 is, for example, a full-color LED of the internal organs control unit, and has six terminals 21. Along with the miniaturization of the LED 20, the number of terminals has also increased, thereby reducing the area of the terminal 21. The size of the LED used in this embodiment is, for example, about 2 mm×2 mm, and the terminal size is, for example, about 500 μm×500 μm.

第2圖是關於本實施形態的電路基板10的主要部分平面圖，第3圖是關於本實施形態的電路基板10的全體平面圖。FIG. 2 is a plan view of the main part of the circuit board 10 of this embodiment, and FIG. 3 is a plan view of the whole of the circuit board 10 of this embodiment.

在電路基板10，電路是在片材11的單面佈線而形成。片材11可以是聚醯胺-醯亞胺、聚醯亞胺等的耐熱性樹脂，但若是ABS樹脂、丙烯酸酯、聚碳酸酯、聚酯、聚丁二酯、聚氨酯等的非耐熱性樹脂，則會顯著發揮本案特有的功效(細節後述)。亦可以紙、布等取代非耐熱樹脂。在本實施形態，是使用一般使用的PET(聚對苯二甲酸乙二酯)。In the circuit board 10, the circuit is formed by wiring on one side of the sheet 11. The sheet 11 may be a heat-resistant resin such as polyamide-imide, polyimide, etc., but if it is a non-heat-resistant resin such as ABS resin, acrylate, polycarbonate, polyester, polybutylene, polyurethane, etc. , It will significantly exert the unique effects of this case (details will be described later). It is also possible to replace non-heat-resistant resins with paper, cloth, etc. In this embodiment, PET (polyethylene terephthalate) which is generally used is used.

另外，難以對耐熱性樹脂及非耐熱性樹脂嚴密定義，但是PET的玻璃轉移點為80℃左右、熔點為260℃左右，另一方面，聚醯胺-醯亞胺的熔點為300℃左右，據此，在本案在超過300℃發生熱變形等的影響的情況，歸為非耐熱性。In addition, it is difficult to rigorously define heat-resistant resins and non-heat-resistant resins, but the glass transition point of PET is about 80°C and the melting point is about 260°C. On the other hand, the melting point of polyamide-imide is about 300°C. According to this, in this case, when the influence of thermal deformation or the like occurs at a temperature exceeding 300°C, it is classified as non-heat resistant.

片材11的厚度並未特別限定，但若考慮作為可撓式基板使用的情況，以50~300μm左右為佳。The thickness of the sheet 11 is not particularly limited, but considering the use as a flexible substrate, it is preferably about 50 to 300 μm.

電路是由配線與端子12構成。端子12是配線的末端，以與電子部件側端子21對應的方式配置。在圖式的例子，配置六個電路側端子12。The circuit is composed of wires and terminals 12. The terminal 12 is the end of the wiring, and is arranged to correspond to the terminal 21 on the electronic component side. In the example of the figure, six circuit-side terminals 12 are arranged.

配線及端子12是由導電性材料形成。一般而言，為包含金、銀、銅、鋁、鎳、鉻等的金屬類材料。配線及端子12是藉由一般性的習知手法(印刷、蝕刻、金屬蒸鍍、鍍覆、銀鹽等)而形成。The wiring and the terminal 12 are formed of a conductive material. Generally speaking, it is a metal material containing gold, silver, copper, aluminum, nickel, chromium, and the like. The wiring and the terminal 12 are formed by common conventional methods (printing, etching, metal vapor deposition, plating, silver salt, etc.).

另外，在完全不期待端子12自身的發熱(細節在第6圖等的說明後述)的情況，亦可以是導電性聚合物、導電性碳等。又，配線在與端子12的尺寸比較之下為夠細而未貢獻於電磁感應加熱，故以下將說明適當省略。In addition, when heat generation of the terminal 12 itself is not expected at all (details will be described later in the description of Fig. 6 and the like), a conductive polymer, conductive carbon, or the like may be used. In addition, the wiring is thin enough in comparison with the size of the terminal 12 and does not contribute to electromagnetic induction heating, so the following description will be omitted appropriately.

端子12的尺寸未特別限定，但若成為面積1mm×1mm左右以下，以習知方法會散見缺陷，故以將面積1mm×1mm左右以下設為本案對象為佳。另外，在第2圖與第3圖的例子，端子12的尺寸為面積400μm×600μm左右。The size of the terminal 12 is not particularly limited, but if the area is about 1mm×1mm or less, defects will be scattered by the conventional method, so it is better to set the area about 1mm×1mm or less as the object of this case. In addition, in the examples shown in FIGS. 2 and 3, the size of the terminal 12 is approximately 400 μm×600 μm in area.

電路側端子12與電子部件側端子21，是隔著焊料30而接合。藉此，將LED 20封裝於電路基板10。The circuit-side terminal 12 and the electronic component-side terminal 21 are joined via solder 30. In this way, the LED 20 is packaged on the circuit board 10.

本實施形態具有導電性墊40作為特徵性的構成。導電性墊40在片材11的另一面側，設置在對應於電路側端子12的位置。另外，在第2圖及第3圖，片材11為半透明，若從電路側端子12側觀看，可以透過片材11而辨識導電性墊40。The present embodiment has a conductive pad 40 as a characteristic configuration. The conductive pad 40 is provided on the other surface side of the sheet 11 at a position corresponding to the circuit-side terminal 12. In addition, in FIGS. 2 and 3, the sheet 11 is translucent, and when viewed from the circuit-side terminal 12 side, the conductive pad 40 can be recognized through the sheet 11.

在本實施形態，以六個電子部件側端子21為一個單位，以對應於電子部件側端子21的六個電路側端子12為一個單位。導電性墊40是對應於一個單位(六個電路側端子12)。In this embodiment, the six electronic component-side terminals 21 are taken as a unit, and the six circuit-side terminals 12 corresponding to the electronic component-side terminals 21 are taken as a unit. The conductive pad 40 corresponds to one unit (six circuit-side terminals 12).

導電性墊40具有包含一個單位(六個電路側端子12)的尺寸。導電性墊40為圓形，亦可與圓形不同而設為多邊形。另外，在第2圖及第3圖的例子中，導電性墊40的尺寸為直徑3mm左右。不過，若徒勞加大，則有對片材11造成損傷之虞。The conductive pad 40 has a size including one unit (six circuit-side terminals 12). The conductive pad 40 has a circular shape, and may be a polygonal shape different from the circular shape. In addition, in the examples of FIGS. 2 and 3, the size of the conductive pad 40 is about 3 mm in diameter. However, if the uselessness increases, the sheet 11 may be damaged.

導電性墊40是由包含金、銀、銅、鋁、鎳、鉻等的金屬類材料形成。又，導電性墊40是藉由與配線、電路側端子12等同樣的手法形成。The conductive pad 40 is formed of a metal material containing gold, silver, copper, aluminum, nickel, chromium, and the like. In addition, the conductive pad 40 is formed by the same method as the wiring, the circuit-side terminal 12, and the like.

＜封裝方法＞ 針對將LED 20封裝於電路基板10的方法作說明。電路側端子12與電子部件側端子21的接合方法並未限定，但特別以焊料接合為佳。焊料接合方法並未限定，但特別以電磁感應加熱法為佳。以下，針對藉由電磁感應加熱的焊料接合作說明。＜Packaging method＞ The method of packaging the LED 20 on the circuit board 10 will be described. The method of joining the circuit-side terminal 12 and the electronic component-side terminal 21 is not limited, but solder joining is particularly preferable. The solder joining method is not limited, but the electromagnetic induction heating method is particularly preferred. Hereinafter, the description will be given to the solder joints heated by electromagnetic induction.

電磁感應加熱裝置，是由感應線圈導線、電源與控制部構成(請參考第18圖)。The electromagnetic induction heating device is composed of induction coil wire, power supply and control unit (please refer to Figure 18).

一旦交流電流在線圈導線流動，就發生強度變化的磁力線。一旦在其附近放置通電的物質(在本案為金屬端子)，受到此變化的磁力線的影響，在金屬之中會有渦電流流動。由於通常在金屬會有電阻，電流一旦在金屬流動，會發生焦耳熱，金屬就自發性發熱。此現象稱為感應加熱。Once the alternating current flows in the coil wire, a magnetic field line of intensity changes occurs. Once a energized substance (a metal terminal in this case) is placed near it, eddy current will flow in the metal under the influence of the changing magnetic field lines. Since there is usually resistance in metal, once current flows in the metal, Joule heating will occur, and the metal will generate heat spontaneously. This phenomenon is called induction heating.

在電路側端子12設置焊料30，隔著焊料30將電子部件側端子21配置於對向位置。將電磁感應加熱裝置配置於導電性墊40側(與電子部件封裝為相反側)，並使電磁感應加熱裝置作動。另外，對電子部件無影響的情況，亦可將電磁感應加熱裝置配置於電子部件封裝側。The solder 30 is provided on the circuit side terminal 12, and the electronic component side terminal 21 is arrange|positioned at the opposing position with the solder 30 interposed. The electromagnetic induction heating device is arranged on the side of the conductive pad 40 (the side opposite to the electronic component package), and the electromagnetic induction heating device is operated. In addition, if there is no influence on the electronic component, the electromagnetic induction heating device may be arranged on the electronic component packaging side.

在本實施形態，端子12面積狹小，無法確保充分的發熱量。相對於此，導電性墊40與端子12相比具有充分的面積，而確實地發熱。In this embodiment, the area of the terminal 12 is small, and sufficient heat generation cannot be ensured. In contrast, the conductive pad 40 has a sufficient area compared to the terminal 12, and generates heat reliably.

在導電性墊40發生的熱量，一部分在片材11面上擴散，但是大部分是從片材11傳導至電路側端子12，進一步傳導至焊料30。Part of the heat generated in the conductive pad 40 is diffused on the surface of the sheet 11, but most of the heat is conducted from the sheet 11 to the circuit-side terminal 12 and further to the solder 30.

藉此，焊料熔融，將電路側端子12與電子部件側端子21接合。Thereby, the solder melts, and the circuit-side terminal 12 and the electronic component-side terminal 21 are joined.

焊料30的種類並未限定，可使用一般性的焊料。例如從高溫焊料(例如，SnAgCu類焊料，熔點220℃左右)到低溫焊料(例如，SnBi焊料，熔點140℃左右)都可使用。在本實施形態，由於可抑制在不影響片材11的熱變形的範圍(細節後述)，可積極性地使用高溫焊料。The type of solder 30 is not limited, and general solder can be used. For example, it can be used from high temperature solder (for example, SnAgCu type solder, with a melting point of about 220°C) to low temperature solder (for example, SnBi solder, with a melting point of about 140°C). In this embodiment, since it is possible to suppress the thermal deformation of the sheet 11 in a range (details will be described later), high-temperature solder can be actively used.

＜對製品的適用例＞ 在第3圖中的電路基板10，縱橫排列著複數個單位(六個電路側端子12)。對應於各單位，封裝內臟控制部的全彩LED 20。另外，如果在固定的範圍可以形成一樣磁場內，可以一次作複數個焊料接合。＜Examples of application to products＞ In the circuit board 10 in FIG. 3, a plurality of units (six circuit-side terminals 12) are arranged vertically and horizontally. Corresponding to each unit, the full-color LED 20 of the internal organs control unit is packaged. In addition, if the same magnetic field can be formed in a fixed range, a plurality of solder joints can be made at a time.

在電路基板10，藉由排列複數個內臟控制部的全彩LED 20，可以形成片狀顯示器。On the circuit board 10, a sheet display can be formed by arranging a plurality of full-color LEDs 20 of the internal organ control section.

第4圖為片狀顯示器的概念圖。由於片材11具有可撓性，顯示器亦為柔軟可變形。Figure 4 is a conceptual diagram of a chip display. Since the sheet 11 is flexible, the display is also flexible and deformable.

內臟控制部的全彩LED，在一個電子部件內具有RGB三個元件與控制部。控制部基於來自外部的指令訊號，選擇性地作RGB發光。The full-color LED of the internal organs control unit has three RGB components and a control unit in one electronic component. The control unit selectively emits RGB light based on the command signal from the outside.

外部的主控制部控制傳送到各內臟控制部的全彩LED的訊號，複數個LED發揮作為彩色顯示器的功能。例如，排列640×480個LED，發揮作為顯示器的功能。不一定要一片的片材，例如亦可以排列10片×10片之排列有64×48個LED的片材。The external main control unit controls the signals of the full-color LEDs sent to the internal organs control units, and multiple LEDs function as color displays. For example, 640×480 LEDs are arranged to function as a display. It is not necessary to have a single sheet, and for example, 10 sheets×10 sheets with 64×48 LEDs arranged in a row may be arranged.

另外，藉由在既定面積排列多數的電子部件、再加上電子部件具有多數的端子，各端子的面積變狹小。因此，適用本案技術。In addition, by arranging a large number of electronic components in a predetermined area and the electronic components have a large number of terminals, the area of each terminal becomes narrow. Therefore, the technology of this case is applied.

第4圖為顯示片狀顯示器的適用例的概念圖。由於片狀顯示器具有可撓性，例如可捲繞於地下街的支柱等，發揮作為數位看板(digital signage)的功能。Figure 4 is a conceptual diagram showing an application example of a chip display. Since the sheet display has flexibility, for example, it can be wound around the pillars of an underground shopping mall, and functions as a digital signage.

由於片狀顯示器具有透光性，例如一旦貼於鬧區的陳列櫥窗(show window)，可以提高引起購買慾的效果。例如，LED非發光時，與一般的陳列櫥窗同樣可以辨識店內的商品。欲對行人促銷商品的情況、不讓行人見到店內的狀況的情況等，使LED發光。LED具有充分的輝度，即使在白天仍發揮作為片狀顯示器的功能。Since the sheet-shaped display is light-transmissive, for example, once it is attached to a show window in a busy area, the effect of arousing the desire to buy can be improved. For example, when the LED is not luminous, the products in the store can be identified like a general showcase. If you want to promote products to pedestrians, or prevent pedestrians from seeing the situation in the store, let the LED light up. LED has sufficient brightness, even in the daytime, it still functions as a chip display.

＜達成本案發明的經過＞ 第6圖是關於習知方法的簡單說明圖。針對習知方法作簡單說明，同時針對從習知方法到達成本案發明的經過作說明。＜The process of the invention of the Dacheng project＞ Figure 6 is a simple explanatory diagram of the conventional method. A brief description of the conventional method is given, and an explanation of the process from the conventional method to the invention of the case is also given.

在習知方法，不需要導電性墊40。又，電路側端子12與電子部件側端子21的尺寸充分大於面積1mm×1mm左右。又，電子部件側端子21的端子數，多為陽極與陰極二處。在這一點，亦確保有充分的面積。In the conventional method, the conductive pad 40 is not required. In addition, the dimensions of the circuit-side terminal 12 and the electronic component-side terminal 21 are sufficiently larger than the area by about 1 mm×1 mm. In addition, the number of terminals on the electronic component side terminal 21 is mostly two locations, anode and cathode. At this point, also ensure that there is a sufficient area.

將電磁感應加熱裝置配置在與電子部件封裝為相反側，使電磁感應加熱作動。藉此，電路側端子12確實發熱。在電路側端子12發生的熱的大部分傳導至焊料30，焊料30熔融。The electromagnetic induction heating device is arranged on the side opposite to the electronic component package, and the electromagnetic induction heating is activated. Thereby, the circuit-side terminal 12 surely generates heat. Most of the heat generated in the circuit-side terminal 12 is conducted to the solder 30, and the solder 30 is melted.

此時，在電路側端子12發生的熱的一部分在片材11面上擴散，但是與傳導至焊料30的熱量比較，為可以忽視的程度。亦即，幾乎可以忽視熱對片材11的影響，片材11並未熱變形。另外，當然片材11本身未發熱。At this time, part of the heat generated in the circuit-side terminal 12 is diffused on the surface of the sheet 11, but it is a negligible level compared with the heat conducted to the solder 30. That is, the influence of heat on the sheet 11 can be almost ignored, and the sheet 11 is not thermally deformed. In addition, of course, the sheet 11 itself does not generate heat.

相對於此，端子12的尺寸若成為面積1mm×1mm左右以下，則散見發熱量不足造成的缺陷。在本發明，其特徵在於，間接利用在導電性墊40的發熱，補足發熱量不足。On the other hand, if the size of the terminal 12 is less than or equal to 1 mm×1 mm in area, defects due to insufficient heat generation are dissipated. The present invention is characterized in that the heat generated by the conductive pad 40 is indirectly used to make up for insufficient heat generation.

然而，在熱傳時，由於許多熱量經過片材11，對於片材11的熱影響無法預估。亦即，片材11的熱變形之虞是最大的顧慮事項。因此，本案發明人反覆試誤，基於其結果，確定片材11的熱變形幾乎不會發生。However, during heat transfer, since a lot of heat passes through the sheet 11, the thermal influence on the sheet 11 cannot be estimated. That is, the risk of thermal deformation of the sheet 11 is the biggest concern. Therefore, the inventor of the present case repeated trial and error, and based on the result, determined that the thermal deformation of the sheet 11 hardly occurs.

＜本案原理推測＞ 亦即，在導電性墊40發生的熱，有效率地傳達至焊料30。用於片材11的熱變形的熱為可以忽視的程度。基於上述試誤的結果，針對本案原理作推測。＜Conjecture of the principle of this case＞ That is, the heat generated in the conductive pad 40 is efficiently transferred to the solder 30. The heat used for the thermal deformation of the sheet 11 is a negligible degree. Based on the results of the above trial and error, speculations are made on the principle of the case.

(推測1)本來，與習知技術比較，端子12、21的尺寸小，焊料30的需要量亦少。因此，焊料熔融所需要的熱量亦少。即使熱經過片材11，供應於片材11的熱的絕對量少。(Presumption 1) Originally, compared with the conventional technology, the size of the terminals 12 and 21 is small, and the required amount of the solder 30 is also small. Therefore, the amount of heat required to melt the solder is also small. Even if heat passes through the sheet 11, the absolute amount of heat supplied to the sheet 11 is small.

還有，即使電路側端子12的發熱量不足以使焊料熔融，還是有某種程度的量的發熱。因此，從導電性墊40間接供應的熱量補足不夠使焊料熔融的量即可。在這一點，供應於片材11的熱的絕對量少即可。Also, even if the heat generation amount of the circuit-side terminal 12 is not enough to melt the solder, there is still a certain amount of heat generation. Therefore, the amount of heat supplied indirectly from the conductive pad 40 may not be sufficient to melt the solder. At this point, the absolute amount of heat supplied to the sheet 11 may be small.

供應於片材11的熱的絕對量少的結果，片材11不會熱變形。As a result of the small absolute amount of heat supplied to the sheet 11, the sheet 11 is not thermally deformed.

(推測2)公認熱會選擇在熱傳導率高的物質移動。特別是，在數秒(具體而言，高溫區為1~2秒)的加熱，未成為熱平衡的狀態，推測熱傳導率的差異的影響大。一般而言，金屬的熱傳導率高於樹脂的熱傳導率，樹脂的熱傳導率高於空氣的熱傳導率。(Presumption 2) It is generally accepted that heat will move in materials with high thermal conductivity. In particular, heating for several seconds (specifically, 1 to 2 seconds in the high-temperature region) does not become a state of thermal equilibrium, and it is estimated that the difference in thermal conductivity has a large influence. Generally speaking, the thermal conductivity of metal is higher than that of resin, and the thermal conductivity of resin is higher than that of air.

第7圖為片材11內的熱路徑的概念圖。由於第7圖對應於第1圖，將符號省略。假定導電性墊40導電性墊40為均質發熱，在片材圖示下表面側為均質地在片材11傳導。另一方面，在片材圖示上表面側，熱傳導率高的端子12與熱傳導率低的空氣混雜。熱會選擇熱傳導率高的端子12而傳導。亦即，在片材11內的熱傳導發生不均。FIG. 7 is a conceptual diagram of the heat path in the sheet 11. Since Figure 7 corresponds to Figure 1, the symbols are omitted. It is assumed that the conductive pad 40 generates heat uniformly, and conducts uniformly through the sheet 11 on the lower surface side of the sheet material diagram. On the other hand, on the upper surface side of the sheet material diagram, the terminal 12 having a high thermal conductivity is mixed with air having a low thermal conductivity. The heat is conducted by selecting the terminal 12 with high thermal conductivity. That is, the heat conduction in the sheet 11 is uneven.

第8圖為顯示熱傳導不均的平面圖。另外，由於第8圖對應於第2圖，將符號省略。而在電子部件側端子21，為了防止短路，確保端子間距離。對應於此，在電路側端子12，亦確保端子間距離。在圖式的例子，即使是最窄的端子間距離，仍確保與端子12的寬度相當(至少一半以上)的間隔。Figure 8 is a plan view showing uneven heat conduction. In addition, since Fig. 8 corresponds to Fig. 2, the symbols are omitted. On the electronic component side terminal 21, in order to prevent short circuits, the distance between the terminals is ensured. Corresponding to this, in the circuit-side terminal 12, the distance between the terminals is also secured. In the example of the figure, even if the distance between the terminals is the narrowest, an interval equivalent to (at least half of) the width of the terminals 12 is still ensured.

熱傳導集中於端子12相當位置，假使即使這個區域軟化，往其以外的區域的熱傳導少，而難以軟化。將軟化區域表為S(soft)、非軟化區域表為H(hard)。The heat conduction is concentrated at a position corresponding to the terminal 12, and even if this area is softened, the heat conduction to the other areas is small and it is difficult to soften. The softened area table is S (soft), and the non-softened area table is H (hard).

軟化區域S被非軟化區域H圍繞。假使片材有一部分軟化，即使分子活躍而愈開始活動，仍被周圍拘束。藉此在片材全體，熱變形受到抑制。The softened area S is surrounded by the non-softened area H. If a part of the sheet is softened, even if the molecules become more active and begin to move, they are still restrained by the surroundings. This suppresses thermal deformation in the entire sheet.

(推測3)第9圖及第10圖為導電性墊40的溫度曲線。在第9圖，加上關於焊料熔融的資訊。在第10圖，加上關於片材軟化的資訊。另外，由於比較的對象不同，第9圖及第10圖為概念圖。(Assumption 3) FIG. 9 and FIG. 10 are temperature profiles of the conductive pad 40. In Figure 9, add information about solder melting. In Figure 10, add information about sheet softening. In addition, since the objects of comparison are different, Figures 9 and 10 are conceptual drawings.

在第9圖，從導電性墊40供應使焊料成為熔點以上的熱t1秒(例如1~3秒左右)。假定供應熱量Q1全部傳導至焊料30，若為焊料熔融所需能量以上，焊料30則熔融。如在推測1所述，焊料熔融所需熱量少，施加時間短即可。In FIG. 9, heat for making the solder equal to or higher than the melting point is supplied from the conductive pad 40 for t1 second (for example, about 1 to 3 seconds). Assuming that all the supplied heat Q1 is conducted to the solder 30, if it is more than the energy required to melt the solder, the solder 30 will melt. As described in Presumption 1, the amount of heat required to melt the solder is small and the application time is short.

在第10圖，從導電性墊40供應使樹脂成為玻璃轉移點以上的熱t2秒(例如4~10秒左右)。假定供應熱量Q2全部傳導至片材11，若為片材11熱變形所需能量以上，片材11則熱變形。然而，由於施加時間短，t2亦短，熱量Q2亦少。不足以使片材11熱變形。In Fig. 10, heat is supplied from the conductive pad 40 for t2 seconds (for example, about 4 to 10 seconds) to make the resin become the glass transition point or higher. Assuming that all the supplied heat Q2 is conducted to the sheet 11, if the energy required for the thermal deformation of the sheet 11 is more than that, the sheet 11 is thermally deformed. However, due to the short application time, t2 is also short, and the heat Q2 is also small. It is not enough to thermally deform the sheet 11.

又，相對於焊料在非常短時間(瞬間)熔融，樹脂即使成為玻璃轉移點以上，不會立即軟化而使分子開始活躍運動，從軟化開始到熱變形有時間延遲。在上述溫度曲線(峰值尖銳)，在進一步軟化而組織流動之前，未達玻璃轉移點。In addition, compared to the solder melting in a very short time (instantaneous), even if the resin becomes higher than the glass transition point, it does not immediately soften and the molecules start active movement, and there is a time delay from the start of softening to thermal deformation. In the above-mentioned temperature profile (sharp peak), the glass transition point is not reached before further softening and tissue flow.

關於上述電磁感應加熱的溫度曲線，有貢獻於抑制片材11的熱變形的可能性。Regarding the above-mentioned temperature profile of electromagnetic induction heating, there is a possibility of contributing to suppressing the thermal deformation of the sheet 11.

＜功效＞ 藉由來自導電性墊40的間接加熱(準直接加熱)，即使電路側端子12狹小(例如面積1mm×1mm左右以下)，仍可以確實地焊料接合。此時雖有片材11熱變形的顧慮，已確認並無問題。亦即，對於片材11的熱的影響可以忽視。＜Efficacy＞ By indirect heating (quasi-direct heating) from the conductive pad 40, even if the circuit-side terminal 12 is narrow (for example, the area is about 1 mm×1 mm or less), it is possible to reliably solder joint. Although there is a concern about thermal deformation of the sheet 11 at this time, it has been confirmed that there is no problem. That is, the influence of the heat on the sheet 11 can be ignored.

其結果，可以在片材11使用非耐熱性材料、可以在焊料30使用高溫焊料等，本案封裝方法所受限制少。As a result, a non-heat-resistant material can be used for the sheet 11, a high-temperature solder can be used for the solder 30, and the like, and the packaging method in this case is less restricted.

另外，對於電子部件的熱影響亦幾乎沒有，亦維持習知技術的功效。In addition, there is almost no thermal effect on electronic components, and the efficacy of the conventional technology is maintained.

＜變形例＞ 本發明並未受限於上述實施形態，在本案發明的技術思想的範圍，可以作各種變形。以下，針對數個變形例作說明。<Modifications> The present invention is not limited to the above-mentioned embodiments, and various modifications can be made within the scope of the technical idea of the present invention. Hereinafter, several modified examples will be described.

(變形例1)第11圖示關於變形例1的LED封裝結構的示意剖面圖。第12圖是關於變形例1的電路基板10的主要部分的平面圖。(Modification 1) The eleventh figure shows a schematic cross-sectional view of the LED package structure of Modification 1. FIG. 12 is a plan view of the main part of the circuit board 10 of Modification 1. As shown in FIG.

在上述實施形態，對應於一個單位(六個電路側端子12)而設置導電性墊40；在變形例1，對應於四個單位(六個電路側端子12)而設置導電性墊40。以虛線顯示對應於一個電子部件的一個單位。In the above embodiment, the conductive pad 40 is provided corresponding to one unit (six circuit-side terminals 12); in Modification 1, the conductive pad 40 is provided corresponding to four units (six circuit-side terminals 12). One unit corresponding to one electronic part is shown with a dotted line.

伴隨著電子部件20更加小型化，電路側端子12的面積亦變得更狹小。又，對應於一個單位的導電性墊40的面積亦變的狹小，而有無法充分確保發熱量之虞。例如，將電子部件20的尺寸設為1mm×1mm左右，將端子尺寸設為250μm×250μm左右，若適用上述實施形態的比例的例子，導電性墊40的直徑成為1.5mm左右。As the electronic component 20 becomes smaller, the area of the circuit-side terminal 12 also becomes smaller. In addition, the area of the conductive pad 40 corresponding to one unit also becomes narrow, and there is a possibility that the amount of heat generation cannot be sufficiently ensured. For example, if the size of the electronic component 20 is about 1 mm×1 mm, and the size of the terminal is about 250 μm×250 μm, the diameter of the conductive pad 40 is about 1.5 mm if the example of the ratio of the above-mentioned embodiment is applied.

在變形例1，設為對應於四個單位的導電性墊40之下，確保導電性墊40的面積而確保發熱量。藉此，可以作確實的焊料接合。在圖式的例子，將導電性墊40的尺寸設定為直徑2.5~3mm左右。In Modification 1, the area of the conductive pad 40 is secured under the conductive pad 40 corresponding to four units, and the heat generation amount is secured. With this, reliable solder joints can be made. In the example of the drawing, the size of the conductive pad 40 is set to a diameter of approximately 2.5 to 3 mm.

(變形例2) 第13圖是關於變形例2的BGA封裝結構的示意剖面圖。第14圖是關於變形例2的電路基板10的主要部分的平面圖。(Modification 2) FIG. 13 is a schematic cross-sectional view of the BGA package structure of Modification 2. FIG. 14 is a plan view of the main part of the circuit board 10 of Modification Example 2. As shown in FIG.

在上述實施形態，對應於一個單位(六個電路側端子12)設置一個導電性墊40；但是在變形例2，對應於一個單位設置七個導電性墊40。以虛線顯示對應於一個BGA的一個單位。In the above embodiment, one conductive pad 40 is provided corresponding to one unit (six circuit-side terminals 12); however, in Modification 2, seven conductive pads 40 are provided corresponding to one unit. One unit corresponding to one BGA is shown with a dotted line.

球閘陣列(BGA)20是電子部件的一種，是具有將焊料球排列成柵格狀的電極形狀的封裝基板。在圖式的例子，BGA 20具有32個端子21。對應於此，在電路基板10，在每一個單位設置有三十二個端子12。The ball gate array (BGA) 20 is a type of electronic component, and is a package substrate having an electrode shape in which solder balls are arranged in a grid. In the example of the figure, the BGA 20 has 32 terminals 21. Corresponding to this, in the circuit board 10, thirty-two terminals 12 are provided per unit.

BGA 20具有多數的端子21的結果，電路側端子12的面積變得更狹小。另一方面，對應於一個單位而設置一個導電性墊40，會有發熱量過多之虞。As a result of the BGA 20 having a large number of terminals 21, the area of the circuit-side terminal 12 becomes narrower. On the other hand, providing one conductive pad 40 corresponding to one unit may generate excessive heat.

在變形例2，在對應於一個單位設置七個導電性墊40之下，不會有多餘發熱而確保適切的發熱量。藉此，不會使片材損傷，可以確實作焊料接合。In Modification 2, under the arrangement of seven conductive pads 40 corresponding to one unit, there is no excessive heat generation and proper heat generation is ensured. Thereby, the sheet material is not damaged, and it is possible to reliably perform solder bonding.

在變形例2，例如將BGA 20的尺寸設為5mm×5mm~ 10mm×10mm左右，將端子尺寸設為500μm×500μm，將導電性墊40的尺寸設為直徑2mm左右。In Modification 2, for example, the size of the BGA 20 is about 5 mm×5 mm to 10 mm×10 mm, the terminal size is 500 μm×500 μm, and the size of the conductive pad 40 is about 2 mm in diameter.

另外，亦可將本案封裝方法適用於晶片尺寸封裝(CSP)。In addition, the packaging method of this case can also be applied to chip scale packaging (CSP).

(變形例3) 第15圖是關於變形例3的FPC封裝結構的示意圖。第16圖是關於變形例3的FPC10、20的主要部分的斜視圖。第17圖是關於變形例3的FPC10、20的主要部分的剖面圖。(Modification 3) FIG. 15 is a schematic diagram of the FPC package structure of Modification 3. Fig. 16 is a perspective view of the main parts of FPCs 10 and 20 of Modification 3. FIG. 17 is a cross-sectional view of the main parts of FPCs 10 and 20 of Modification Example 3. FIG.

在上述實施形態，已針對對電子部件20的電路基板10的封裝作說明，若將FPC10解釋為電路基板、將FPC20解釋為廣義的電子部件，FPC10、20彼此亦同樣可以接合。In the above embodiment, the packaging of the circuit board 10 of the electronic component 20 has been described. If the FPC 10 is interpreted as a circuit board and the FPC 20 is interpreted as an electronic component in a broad sense, the FPCs 10 and 20 can also be joined to each other in the same way.

FPC(可撓式印刷電路)接合於電子部件。此時，由於集中多數的配線，端子間隔變窄，一個端子的寬度變窄。其結果，關於習知技術的電磁感應加熱，有無法確保充分的發熱量之虞。FPC (flexible printed circuit) is bonded to electronic components. At this time, due to the concentration of a large number of wires, the terminal interval becomes narrow, and the width of one terminal becomes narrow. As a result, the conventional electromagnetic induction heating may not ensure sufficient heat generation.

在變形例3，在FPC10的背面端部設置導電性墊40而間接加熱之下，確保發熱量。藉此，可以作確實的焊料接合。In Modification 3, the conductive pad 40 is provided at the end of the back surface of the FPC 10 and the heat generation is ensured under indirect heating. With this, reliable solder joints can be made.

(變形例4) 雖然為關於焊料接合，但亦可適用於焊料接合以外。例如，本案封裝方法可適用於熱固型接著劑硬化。(Modification 4) Although it is about solder bonding, it can also be applied to other than solder bonding. For example, the packaging method in this case can be applied to the curing of thermosetting adhesives.

具體而言，對於塑膠框體與金屬部件成為一體的成型品，在背面設置導電性墊40，同時在金屬部件塗佈熱固型接著劑，藉由電磁感應加熱使導電性墊40發熱，使熱固型接著劑反應。Specifically, for a molded product in which a plastic frame and a metal component are integrated, a conductive pad 40 is provided on the back surface, and a thermosetting adhesive is applied to the metal component, and the conductive pad 40 is heated by electromagnetic induction heating to make Thermosetting adhesive reaction.

10:電路基板 11:片材 12:電路側端子 20:電子部件 21:電子部件側端子 30:焊料 40:導電性墊10: Circuit board 11: sheet 12: Circuit side terminal 20: Electronic components 21: Electronic component side terminal 30: Solder 40: Conductive pad

第1圖是關於本實施形態的LED封裝結構的剖面圖。 第2圖是關於本實施形態的電路基板主要部分的平面圖。 第3圖是關於本實施形態的電路基板全體的平面圖。 第4圖是本實施形態的適用例。 第5圖是本實施形態的適用例。 第6圖是電磁感應加熱(習知例)。 第7圖是本發明的原理說明(軟化不均)的剖面圖。 第8圖是本發明的原理說明(軟化不均)的平面圖。 第9圖是本發明的原理說明的溫度曲線。 第10圖是本發明的原理說明的溫度曲線。 第11圖是關於變形例1的LED封裝結構的剖面圖。 第12圖是關於變形例1的電路基板主要部分的平面圖。 第13圖是關於變形例2的BGA封裝結構的剖面圖。 第14圖是關於變形例2的電路基板主要部分的平面圖。 第15圖是關於變形例3的FPC接合示意的斜視圖。 第16圖是關於變形例3的FPC接合主要部分的斜視圖。 第17圖是關於變形例3的FPC接合主要部分的剖面圖。 第16圖是電磁感應的基本原理。Fig. 1 is a cross-sectional view of the LED package structure of this embodiment. Fig. 2 is a plan view of the main part of the circuit board of this embodiment. Fig. 3 is a plan view of the entire circuit board of this embodiment. Figure 4 is an application example of this embodiment. Figure 5 is an application example of this embodiment. Figure 6 is electromagnetic induction heating (a conventional example). Fig. 7 is a cross-sectional view illustrating the principle of the present invention (uneven softening). Fig. 8 is a plan view illustrating the principle of the present invention (uneven softening). Figure 9 is a temperature profile explaining the principle of the present invention. Figure 10 is a temperature profile explaining the principle of the present invention. FIG. 11 is a cross-sectional view of the LED package structure of Modification Example 1. FIG. FIG. 12 is a plan view of the main part of the circuit board of Modification Example 1. FIG. FIG. 13 is a cross-sectional view of the BGA package structure of Modification Example 2. FIG. 14 is a plan view of the main part of the circuit board of Modification Example 2. FIG. FIG. 15 is a perspective view schematically showing the FPC bonding of Modification Example 3. FIG. Fig. 16 is a perspective view of the main part of the FPC joining of Modification 3. FIG. 17 is a cross-sectional view of the main part of the FPC bonding of Modification Example 3. FIG. Figure 16 shows the basic principle of electromagnetic induction.

10:電路基板 10: Circuit board

11:片材 11: sheet

12:電路側端子 12: Circuit side terminal

20:電子部件 20: Electronic components

21:電子部件側端子 21: Electronic component side terminal

30:焊料 30: Solder

40:導電性墊 40: Conductive pad

Claims (9)

一種電路基板，為藉由電磁感應加熱以焊料接合電子部件的電路基板，其特徵在於包括： 由熱塑性樹脂構成的非耐熱性片； 電路，設於上述非耐熱性片的一面側； 電路側端子，設於上述電路；以及 導電性墊，設於上述非耐熱性片的另一面側之對應於上述電路側端子的位置；其中 上述電路側端子的尺寸為1mm×1mm以下； 上述導電性墊大於上述電路端子；以及 藉由上述電磁感應加熱而上述導電性墊所發之熱經由上述非耐熱性片及上述電路側端子傳導至焊料。A circuit substrate is a circuit substrate that uses solder to join electronic components by electromagnetic induction heating, and is characterized in that it includes: Non-heat-resistant sheet made of thermoplastic resin; The circuit is arranged on one side of the above non-heat-resistant sheet; The circuit-side terminal is provided in the above-mentioned circuit; and A conductive pad is provided on the other side of the non-heat-resistant sheet at a position corresponding to the circuit-side terminal; wherein The size of the above-mentioned circuit-side terminal is 1mm×1mm or less; The conductive pad is larger than the circuit terminal; and The heat generated by the conductive pad by the electromagnetic induction heating is conducted to the solder via the non-heat-resistant sheet and the circuit-side terminal. 如請求項1之電路基板，其中可排列複數個上述電子部件。Such as the circuit board of claim 1, in which a plurality of the above-mentioned electronic components can be arranged. 如請求項1或2之電路基板，其中 以對應於一個電子部件的複數個電路側端子為一個單位；以及 上述導電性墊設於上述每一個單位。Such as the circuit board of claim 1 or 2, where Take a plurality of circuit-side terminals corresponding to one electronic component as a unit; and The conductive pad is provided in each unit. 如請求項1至3任一項之電路基板，其中以對應於一個電子部件的三個以上的電路側端子為一個單位。The circuit board according to any one of claims 1 to 3, wherein three or more circuit-side terminals corresponding to one electronic component are used as a unit. 如請求項3或4之電路基板，其中上述導電性墊的尺寸包含上述一個單位。The circuit board of claim 3 or 4, wherein the size of the conductive pad includes the above one unit. 如請求項1至5任一項之電路基板，其中上述導電性墊為圓形或多邊形。The circuit substrate according to any one of claims 1 to 5, wherein the conductive pad is circular or polygonal. 一種封裝方法，為將電子部件以焊料接合於如請求項1之電路基板的封裝方法，其特徵在於： 使電子部件的端子隔著焊料，與上述電路側端子對向； 在上述非耐熱性片的另一面側，藉由上述電磁感應加熱而使上述導電性墊發熱；以及 經由上述非耐熱性片及前記回路端子，將上述導電性墊所發之熱傳導至焊料，使焊料熔融。A packaging method, which is a packaging method in which an electronic component is soldered to a circuit substrate as claimed in claim 1, characterized in that: Make the terminals of the electronic components face the above-mentioned circuit-side terminals through the solder; On the other side of the non-heat-resistant sheet, the conductive pad is heated by the electromagnetic induction heating; and The heat generated by the conductive pad is transferred to the solder through the non-heat-resistant sheet and the aforementioned circuit terminal, and the solder is melted. 一種片狀顯示器，其特徵在於： 如請求項2之電子部件為內建控制部的全彩LED；以及 藉由排列上述LED而形成。A chip display, which is characterized in: If the electronic component of claim 2 is a full-color LED with a built-in control unit; and It is formed by arranging the above-mentioned LEDs. 一種封裝構造，藉由焊料接合而在如請求項1之電路基板封裝電子部件。A package structure in which electronic components are packaged on the circuit substrate of claim 1 by solder bonding.
TW109119860A 2019-06-14 2020-06-12 Circuit board and mounting method TW202107645A (en)

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