TWI759440B - Solder bonding apparatus - Google Patents

Solder bonding apparatus Download PDF

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TWI759440B
TWI759440B TW107107529A TW107107529A TWI759440B TW I759440 B TWI759440 B TW I759440B TW 107107529 A TW107107529 A TW 107107529A TW 107107529 A TW107107529 A TW 107107529A TW I759440 B TWI759440 B TW I759440B
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substrate
soft
ferrites
electronic components
electrode
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TW107107529A
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Chinese (zh)
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TW201838750A (en
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田嶋久容
杉山和弘
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日商萬達修查股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/06—Control, e.g. of temperature, of power
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • General Induction Heating (AREA)

Abstract

The subject of the present invention is to provide a solder bonding apparatus comprising: a transport means (12) for transporting a substrate (11) on which an electronic component (C) is provided; and a heating means for melting a solder which is interposed between an electrode (13) and an electronic components such that the electronic components are bonded to the electrodes by the solder. The heating means comprises a coil (20) having a space portion inside thereof, and a plurality of ferrites (30) arranged in the space portion of the coil along the conveying direction of the substrate, an adjustment mechanism (40) for respectively adjusting the spacing between each ferrite and an electrode formed on the substrate; and a power source (50) for applying an alternating voltage to the coil to inductively heat the electrode formed on the substrate.

Description

軟焊料接合裝置Soft Solder Bonding Device

本發明關於一種軟焊料接合裝置，其利用感應加熱，用軟焊料將電子元件接合到形成在基板上的電極上。The present invention relates to a solder bonding apparatus which utilizes induction heating to bond electronic components to electrodes formed on a substrate with soft solder.

先前的軟焊料接合裝置利用迴銲方式進行接合，即對置有電子元件的基板進行加熱，直到達到可讓軟焊料熔融的溫度。因此，軟焊料接合對象區域以外的部分也會過度受熱，電子元件和基板等承受的熱載荷就會增大。Conventional soft solder bonding apparatuses use a reflow method for bonding, that is, heating a substrate on which electronic components are placed until it reaches a temperature at which the soft solder is melted. Therefore, the portion other than the area to be joined by the soft solder is also overheated, and the thermal load on electronic components, substrates, and the like increases.

近年來，伴隨著電子設備的小型化、輕量化，封裝微小電子元件的基板一般採用軟性電路板，但為了削減軟性電路板的成本，先前的聚醯亞胺樹脂正逐漸被聚酯和聚乙烯等樹脂所取代。In recent years, with the miniaturization and weight reduction of electronic devices, flexible circuit boards are generally used as substrates for packaging tiny electronic components. However, in order to reduce the cost of flexible circuit boards, the previous polyimide resins are gradually being replaced by polyester and polyethylene replaced by resin.

然而，聚酯等廉價樹脂的熔點比聚醯亞胺樹脂低。因此，在用軟焊料接合時，存在以下問題：如果軟性電路板被加熱到高於耐熱溫度的溫度，基板就會變形。However, inexpensive resins such as polyester have lower melting points than polyimide resins. Therefore, when bonding with soft solder, there is a problem that if the flexible wiring board is heated to a temperature higher than the heat-resistant temperature, the substrate is deformed.

對於上述問題，在專利文獻1中公開了一種方法，其利用感應加熱，局部性地對軟焊料接合的對象部位進行加熱。該方法為，在使發熱體抵接到基板上的狀態下，將利用感應加熱而被加熱的發熱體的熱量，經由與軟焊料抵接的基板的電極，傳遞給軟焊料，由此使軟焊料熔融。 〔專利文獻〕 [專利文獻1]日本特開2009-95873號公報With regard to the above-mentioned problems, Patent Document 1 discloses a method of locally heating a target site to be soldered by induction heating. In this method, the heat of the heating element heated by induction heating is transferred to the soft solder via the electrodes of the substrate in contact with the soft solder in a state where the heating element is in contact with the board, thereby making the soft solder Solder melted. [Patent Document] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-95873

〔發明所欲解決之問題〕[Problems to be Solved by Invention]

然而，因為在專利文獻1中公開的方法中，是將利用感應加熱而被加熱的發熱體的熱量藉由熱傳導傳遞給與軟焊料抵接的基板的電極，所以加熱效率差。又因為，利用感應加熱而被加熱的發熱體對與軟焊料抵接的基板的電極附近的部分也進行多餘的加熱，所以基板有可能變形。此外，因為在將微小電子元件封裝到基板上時，軟焊料接合的對象部位較小，所以當使發熱體抵接到基板上時，難以準確地抵接到軟焊料接合的對象部位上。However, in the method disclosed in Patent Document 1, since the heat of the heating element heated by induction heating is transferred to the electrodes of the substrate in contact with the soft solder by thermal conduction, the heating efficiency is poor. Furthermore, since the heating element heated by induction heating also excessively heats the portion near the electrodes of the substrate in contact with the soft solder, the substrate may be deformed. In addition, when the microelectronic components are packaged on the substrate, since the target portion for solder bonding is small, when the heating element is brought into contact with the substrate, it is difficult to accurately abut the target portion for solder bonding.

本發明正是鑑於上述問題而完成的，其主要目的是提供一種軟焊料接合裝置，其利用感應加熱，用軟焊料將電子元件接合到形成在基板上的電極上，該軟焊料接合裝置能抑制基板被加熱，並且，即使是微小的電子元件，也能夠容易地用軟焊料進行接合，加熱效率高。而且，本發明提供的軟焊料接合裝置能夠一邊輸送置有電子元件的基板，一邊用軟焊料將電子元件接合到形成在基板上的電極上，從而以良好的生產率用軟焊料對電子元件進行接合。 〔解決問題之技術手段〕The present invention has been made in view of the above-mentioned problems, and its main object is to provide a soft-solder bonding apparatus that uses induction heating to bond electronic components to electrodes formed on a substrate with soft solder, which is capable of suppressing The substrate is heated, and even small electronic components can be easily joined with soft solder, and the heating efficiency is high. Furthermore, the soft solder bonding apparatus provided by the present invention can bond the electronic components to the electrodes formed on the substrate with the soft solder while conveying the board on which the electronic components are placed, so that the electronic components can be joined with the soft solder with good productivity. . [Technical means to solve problems]

本發明所關係之軟焊料接合裝置，其一邊輸送置有電子元件的基板，一邊用軟焊料將電子元件接合到形成在基板上的電極上，該軟焊料接合裝置具有：輸送手段，其用於輸送置有電子元件的基板；以及加熱手段，其使夾在電極與電子元件之間的軟焊料熔融，而用軟焊料將電子元件接合到電極上。加熱手段具有：線圈，其在俯視時的內側具有空間部；複數個鐵氧體，其沿基板的輸送方向排列在線圈的空間部中；調整機構，其對各鐵氧體與形成在基板上的電極之間的間距分別進行調整；以及電源，其對線圈施加交流電壓而對形成在基板上的電極進行感應加熱。 〔發明之效果〕The soft solder bonding apparatus according to the present invention is used for bonding the electronic components to the electrodes formed on the board with soft solder while conveying the board on which the electronic components are placed, and the soft solder bonding apparatus has: conveying means for conveying the substrate on which the electronic components are placed; and heating means for melting the soft solder sandwiched between the electrodes and the electronic components, and bonding the electronic components to the electrodes with the soft solder. The heating means includes a coil having a space portion on the inner side of the plan view; a plurality of ferrites arranged in the space portion of the coil along the conveyance direction of the substrate; The spacing between the electrodes is adjusted respectively; and a power supply applies an alternating voltage to the coil to inductively heat the electrodes formed on the substrate. [Effect of invention]

根據本發明，能夠提供一種軟焊料接合裝置，其利用感應加熱，用軟焊料將電子元件接合到形成在基板上的電極上，該軟焊料接合裝置能抑制基板被加熱，並且，即使是微小的電子元件，也能夠容易地用軟焊料進行接合，加熱效率高。而且，本發明提供的軟焊料接合裝置能夠一邊輸送置有電子元件的基板，一邊用軟焊料將電子元件接合到形成在基板上的電極上，從而以良好的生產率用軟焊料對電子元件進行接合。According to the present invention, it is possible to provide a soft-solder bonding apparatus that bonds an electronic component to an electrode formed on a substrate with a soft solder using induction heating, which can suppress the heating of the substrate, and which can suppress the heating of the substrate, and which can suppress the heating of the substrate even if it is small. Electronic components can also be easily joined with soft solder, and the heating efficiency is high. Furthermore, the soft solder bonding apparatus provided by the present invention can bond the electronic components to the electrodes formed on the substrate with the soft solder while conveying the board on which the electronic components are placed, so that the electronic components can be joined with the soft solder with good productivity. .

本申請的申請人在PCT/JP2016/076332之申請說明書中公開了下述軟焊料接合裝置：將線圈佈置到基板的軟焊料接合對象部位（電極）的上方，並在線圈的內側佈置鄰近於軟焊料接合對象部位的鐵氧體，向線圈供給電流，來對軟焊料接合對象部位進行感應加熱，由此用軟焊料進行接合。In the application specification of PCT/JP2016/076332, the applicant of the present application discloses the following soft solder bonding device: the coil is arranged above the solder bonding object part (electrode) of the substrate, and the inner side of the coil is arranged adjacent to the soft solder The ferrite at the part to be soldered is joined by the soft solder by supplying a current to the coil to inductively heat the part to be joined by the soft solder.

藉由上述申請說明書中公開的軟焊料接合裝置，能夠經由鐵氧體傳遞在線圈內側產生的磁通，以使該磁通集中到軟焊料接合對象部位，且不會衰減。因此，能夠高效率地用軟焊料進行接合。此外，藉由使鐵氧體的頂端與軟焊料接合對象部位的大小一致，就能夠將感應加熱的範圍限定到軟焊料接合對象部位。這樣一來，即使是微小的電子元件，也能夠容易地用軟焊料進行接合。此外，因為是利用感應加熱直接對軟焊料接合對象部位（電極）進行加熱，而不是利用來自發熱體的熱傳導進行加熱，所以能夠抑制基板被加熱。這樣一來，即使使用耐熱性較低的軟性電路板，也能夠抑制基板的熱變形。According to the solder bonding apparatus disclosed in the above application specification, the magnetic flux generated inside the coil can be transmitted through the ferrite, so that the magnetic flux can be concentrated at the part to be joined by the solder without being attenuated. Therefore, it is possible to efficiently join with the soft solder. In addition, by making the size of the tip of the ferrite and the solder bonding target portion the same, the range of induction heating can be limited to the solder bonding target portion. In this way, even small electronic components can be easily joined by soft solder. In addition, since the solder bonding target portion (electrode) is directly heated by induction heating, not by heat conduction from the heating element, it is possible to suppress heating of the substrate. In this way, even if a flexible wiring board with low heat resistance is used, thermal deformation of the substrate can be suppressed.

本申請的發明人在上述軟焊料接合裝置的基礎上，經過進一步探討研究，結果發現了下述軟焊料接合裝置：其一邊輸送置有電子元件的基板，一邊用軟焊料將電子元件接合到形成在基板上的電極上，生產率優異。由此完成了本發明。The inventors of the present application have further studied and studied on the basis of the above-mentioned solder bonding apparatus, and as a result, have found a soft solder bonding apparatus in which, while conveying a substrate on which electronic components are placed, the electronic components are bonded to a forming apparatus with soft solder. On the electrodes on the substrate, the productivity is excellent. Thus, the present invention has been completed.

以下根據圖式對本發明的實施方式進行詳細說明。需要說明的是，本發明不限於以下實施方式。並且，在能發揮本發明之效果的範圍內，可以根據情況適當地對本發明進行變更。Hereinafter, embodiments of the present invention will be described in detail based on the drawings. In addition, this invention is not limited to the following embodiment. In addition, the present invention can be appropriately changed according to the circumstances within the range in which the effects of the present invention can be exhibited.

圖1示意性地顯示本發明的一實施方式中的軟焊料接合裝置的構成。需要說明的是，本實施方式中的軟焊料接合裝置是下述軟焊料接合裝置：其一邊輸送置有電子元件的基板，一邊用軟焊料將電子元件接合到形成在基板上的電極上。FIG. 1 schematically shows the configuration of a solder bonding apparatus according to an embodiment of the present invention. It should be noted that the solder bonding apparatus in the present embodiment is a solder bonding apparatus for bonding electronic components to electrodes formed on the substrate with solder while conveying the substrate on which the electronic components are placed.

如圖1所示，本實施方式中的軟焊料接合裝置10具有：輸送手段12，其用於輸送置有電子元件C的基板11；以及加熱手段，其使夾在電極（未圖示）與電子元件C之間的軟焊料（未圖示）熔融，而用軟焊料將電子元件C接合到電極上。As shown in FIG. 1 , the solder bonding apparatus 10 in the present embodiment includes: conveying means 12 for conveying the substrate 11 on which the electronic components C are placed; and heating means for sandwiching electrodes (not shown) and Soft solder (not shown) between the electronic components C is melted, and the electronic components C are joined to the electrodes with the soft solder.

加熱手段具有：線圈20，其在俯視時（z方向）的內側具有空間部21；以及複數個鐵氧體30，其沿基板11的輸送方向A排列在線圈20的空間部21中。此處，各鐵氧體30與形成在基板11上的電極之間的間距利用調整機構40分別進行調整。該間隔的調整例如可以用為每個鐵氧體30設置的致動器（例如，電動缸、線性滑軌等）41來進行。輸送手段12沿箭頭A的方向（x方向）輸送基板11，基板11從線圈20和鐵氧體30的下方通過。線圈20的兩端部經由導線51與電源50相連，藉由向線圈20施加交流電壓，形成在位於鐵氧體30下方的基板11上的電極就被感應加熱。The heating means includes a coil 20 having a space 21 inside the coil 20 in plan view (z direction), and a plurality of ferrites 30 arranged in the space 21 of the coil 20 along the conveyance direction A of the substrate 11 . Here, the pitches between the respective ferrites 30 and the electrodes formed on the substrate 11 are adjusted by the adjustment mechanism 40, respectively. The adjustment of this interval can be performed, for example, with an actuator (eg, electric cylinder, linear slide, etc.) 41 provided for each ferrite 30 . The conveyance means 12 conveys the substrate 11 in the direction of the arrow A (x direction), and the substrate 11 passes under the coil 20 and the ferrite 30 . Both ends of the coil 20 are connected to a power source 50 via wires 51, and by applying an AC voltage to the coil 20, electrodes formed on the substrate 11 under the ferrite 30 are heated by induction.

圖2說明在本實施方式中，利用感應加熱，用軟焊料將電子元件接合到形成在基板11上的電極上之方法。此處，顯示的例子為：向形成在基板11上的電極13供給軟焊料14後，用軟焊料將具有端子（未圖示）的電子元件（例如，晶片電容、晶片電阻等）C接合到上面。FIG. 2 illustrates a method of bonding electronic components to electrodes formed on the substrate 11 with soft solder by using induction heating in this embodiment. Here, an example is shown in which, after supplying the soft solder 14 to the electrodes 13 formed on the substrate 11, the electronic components (for example, chip capacitors, chip resistors, etc.) C having terminals (not shown) are bonded to the electrodes 13 with soft solder. above.

如圖2所示，各鐵氧體30的端部30a與軟焊料接合對象部位即電極13的大小一致，呈逐漸變細的形狀。向線圈20施加交流電壓後，線圈20周圍就會產生磁通Φ。在線圈20內側產生的磁通Φ沿著佈置在線圈20內側的鐵氧體30，從鐵氧體30的端部30a，垂直（z方向）射向形成在基板11上的電極13。這樣一來，電極13就被感應加熱。電極13利用感應加熱被加熱而產生的熱量傳遞給軟焊料14，由此使軟焊料14熔融，這樣一來，電子元件C的端子15就被軟焊料接合到電極13上。As shown in FIG. 2 , the end portion 30 a of each ferrite 30 has the same size as that of the electrode 13 , which is a portion to be joined with solder, and has a tapered shape. When an AC voltage is applied to the coil 20 , a magnetic flux Φ is generated around the coil 20 . The magnetic flux Φ generated inside the coil 20 is radiated perpendicularly (z direction) to the electrode 13 formed on the substrate 11 from the end 30 a of the ferrite 30 along the ferrite 30 arranged inside the coil 20 . In this way, the electrodes 13 are heated inductively. The electrode 13 is heated by induction heating and is transferred to the soft solder 14 to melt the soft solder 14 , whereby the terminal 15 of the electronic component C is joined to the electrode 13 by the soft solder.

藉由本實施方式中的軟焊料接合裝置，能夠經由鐵氧體30傳遞在線圈20內側產生的磁通Φ，以使磁通Φ集中到電極（軟焊料接合對象部位）13，且不會衰減，因此能夠高效率地用軟焊料進行接合。藉由使鐵氧體30的端部30a與電極13的大小一致，就能夠將感應加熱的範圍限定到電極13。這樣一來，即使是微小的電子元件C，也能夠容易地用軟焊料進行接合。此外，因為是利用感應加熱直接對電極13進行加熱，所以能夠抑制基板11被加熱。這樣一來，即使使用耐熱性較低的軟性電路板，也能夠抑制基板11的熱變形。With the solder bonding apparatus in this embodiment, the magnetic flux Φ generated inside the coil 20 can be transmitted through the ferrite 30 so that the magnetic flux Φ is concentrated on the electrode (the part to be bonded by the solder) 13 without being attenuated, Therefore, it is possible to efficiently join with the soft solder. By making the size of the end portion 30 a of the ferrite 30 match the size of the electrode 13 , the range of induction heating can be limited to the electrode 13 . In this way, even the minute electronic components C can be easily joined by soft solder. In addition, since the electrode 13 is directly heated by induction heating, the substrate 11 can be suppressed from being heated. In this way, even if a flexible wiring board with low heat resistance is used, thermal deformation of the substrate 11 can be suppressed.

而且，在本實施方式中，因為在線圈20的空間部21中，沿基板11的輸送方向A佈置有複數個鐵氧體30，所以藉由將置有複數個電子元件C的基板11輸送到複數個鐵氧體30的下方，就能夠將複數個電子元件C用軟焊料連續地接合到形成在基板11上的電極上。這樣一來，就能夠以良好的生產率用軟焊料將電子元件C接合到形成在基板11上的電極上。Furthermore, in the present embodiment, since the plurality of ferrites 30 are arranged in the space portion 21 of the coil 20 along the conveyance direction A of the substrate 11 , the substrate 11 on which the plurality of electronic components C are placed is conveyed to the Below the plurality of ferrites 30, the plurality of electronic components C can be continuously bonded to the electrodes formed on the substrate 11 with soft solder. In this way, the electronic component C can be bonded to the electrodes formed on the substrate 11 with the soft solder with good productivity.

本實施方式中的軟焊料接合裝置能一邊連續地輸送基板11，一邊用軟焊料局部性地將電子元件C進行接合，從而能夠使軟焊料的加熱時間与先前的迴銲方式（通常是以分鐘為單位的時間）相比變得非常短（通常是以秒為單位的時間）。The solder bonding apparatus in the present embodiment can locally bond the electronic components C with the solder while continuously conveying the substrate 11 , so that the heating time of the solder can be made the same as that of the conventional reflow method (usually minutes time in seconds) becomes very short (usually time in seconds).

本實施方式中的軟焊料接合裝置具有調整機構40，調整機構40預先對各鐵氧體30與形成在基板11上的電極之間的間距進行調整，以使位於線圈20內側的複數個電極中，利用感應加熱而被加熱的各電極的溫度沿輸送方向A具有規定的溫度曲線。The soft-solder bonding apparatus in the present embodiment includes an adjustment mechanism 40 that adjusts the distance between each ferrite 30 and the electrodes formed on the substrate 11 in advance so that the plurality of electrodes located inside the coil 20 are among the plurality of electrodes. , the temperature of each electrode heated by induction heating has a predetermined temperature profile along the conveyance direction A.

圖3（a）、圖3（b）顯示隨著鐵氧體30的端部30a與基板11上的電極13之間的間距D的變化，利用感應加熱而被加熱的電極13的溫度變化情況。如圖2所示，磁通Φ從鐵氧體30的端部30a射到電極13處，磁通Φ和鐵氧體30的端部30a與基板11上的電極13之間的間距D的二次方成正比衰減。因此，因為利用感應加熱而被加熱的電極13的加熱量與磁通Φ成正比，所以如圖3（b）所示，電極13的溫度變化和鐵氧體30的端部30a與基板11上的電極13之間的間距D的二次方基本成反比。因此，藉由調整各鐵氧體30與形成在基板11上的電極13之間的間距D，就能夠沿輸送方向A對利用感應加熱而被加熱的各電極13的溫度精確地進行設定。FIGS. 3( a ) and 3 ( b ) show the temperature change of the electrode 13 heated by induction heating as the distance D between the end portion 30 a of the ferrite 30 and the electrode 13 on the substrate 11 changes. . As shown in FIG. 2 , the magnetic flux Φ is emitted from the end 30 a of the ferrite 30 to the electrode 13 , and the magnetic flux Φ is equal to the distance D between the end 30 a of the ferrite 30 and the electrode 13 on the substrate 11 . The power is proportional to the attenuation. Therefore, since the heating amount of the electrode 13 heated by induction heating is proportional to the magnetic flux Φ, as shown in FIG. The square of the distance D between the electrodes 13 is substantially inversely proportional. Therefore, by adjusting the distance D between each ferrite 30 and the electrode 13 formed on the substrate 11, the temperature of each electrode 13 heated by induction heating can be accurately set along the conveyance direction A.

圖4（a）~（e）以時間序列顯示將置有複數個電子元件C的基板11輸送到沿基板11的輸送方向A排列的複數個鐵氧體30下方的過程中，時刻t=t0 ～t4 之狀態。需要說明的是，此處，電子元件C具有兩個端子，這兩個端子沿基板11的輸送方向A排列。FIGS. 4( a ) to ( e ) show in time series the process of conveying the substrate 11 on which the plurality of electronic components C are placed to under the plurality of ferrites 30 arranged in the conveying direction A of the substrate 11 , time t=t The state from 0 to t4. In addition, here, the electronic component C has two terminals, and these two terminals are arranged along the conveyance direction A of the board|substrate 11. FIG.

圖5是示意性地顯示位於輸送方向A最前列的電子元件C1 處即輸送方向A側的電極的溫度隨時間變化的情況的曲線圖。在圖5所示的曲線圖中，電極的溫度變化如下：溫度從時刻t=t0 開始上升，在P1 所示的期間內維持一定的溫度T1 ，之後溫度再次上升，在P2 所示的期間內維持一定的溫度T2 ，之後溫度下降。即，各鐵氧體30與形成在基板11上的電極之間的間距預先經過調整，以使電極的溫度按照圖5顯示的溫度變化情況變化。5 is a graph schematically showing how the temperature of the electrode located at the frontmost row in the conveyance direction A , that is, the electrode on the conveyance direction A side, changes with time. In the graph shown in Fig. 5, the temperature of the electrode changes as follows: the temperature starts to rise from time t=t 0 , maintains a constant temperature T 1 during the period indicated by P 1 , and then the temperature rises again, at P 2 The constant temperature T 2 is maintained for the indicated period, and then the temperature decreases. That is, the distance between each ferrite 30 and the electrode formed on the substrate 11 is adjusted in advance so that the temperature of the electrode changes according to the temperature change shown in FIG. 5 .

較佳地，例如為了防止「立碑現象」（tombstone），預先將各鐵氧體30與形成在基板11上的電極之間的間距進行調整，以使輸送方向A側的電極的溫度與另一電極的溫度分別按照圖5顯示的溫度變化情況變化。此時，溫度T1 被設為助焊劑的活化溫度，溫度T2 被設為可使軟焊料熔融的加熱溫度。較佳地，當輸送方向A側的電極的溫度上升到T2時，另一電極的溫度上升到T1 。Preferably, for example, in order to prevent a "tombstone phenomenon", the distance between each ferrite 30 and the electrode formed on the substrate 11 is adjusted in advance so that the temperature of the electrode on the side of the conveying direction A and the temperature of the other electrode are adjusted in advance. The temperature of an electrode varies according to the temperature variation shown in FIG. 5 . At this time, the temperature T1 is set to the activation temperature of the flux, and the temperature T2 is set to the heating temperature at which the soft solder can be melted. Preferably, when the temperature of the electrode on the side of the conveying direction A rises to T2, the temperature of the other electrode rises to T1.

需要說明的是，圖5所示的曲線圖顯示位於輸送方向A最前列的電子元件C1 處的電極的溫度隨時間變化的情況，但在某一時刻，基板11上的各電極的溫度沿輸送方向A都具有與圖5所示的溫度變化相似的溫度曲線。It should be noted that the graph shown in FIG. 5 shows that the temperature of the electrodes at the electronic component C1 located at the forefront of the conveying direction A changes with time, but at a certain time, the temperature of each electrode on the substrate 11 increases along the The conveying directions A all have temperature profiles similar to the temperature changes shown in FIG. 5 .

如上述說明的那樣，本發明中的軟焊料接合裝置能夠經由鐵氧體30將在線圈20內側產生的磁通傳遞給基板11上的電極13，且不會衰減，因此能夠高效率地用軟焊料進行接合。藉由使鐵氧體30的頂端與電極13的大小一致，就能夠將感應加熱的範圍限定到電極13。這樣一來，即使是微小的電子元件，也能夠容易地用軟焊料進行接合。此外，因為是利用感應加熱直接對電極13進行加熱，而不是利用來自發熱體的熱傳導進行加熱，所以能夠抑制基板11被加熱。這樣一來，即使使用耐熱性較低的軟性電路板，也能夠抑制基板11的熱變形。As described above, the soft solder bonding apparatus of the present invention can transmit the magnetic flux generated inside the coil 20 to the electrode 13 on the substrate 11 via the ferrite 30 without attenuating it. Solder for bonding. By making the size of the tip of the ferrite 30 match the size of the electrode 13 , the range of induction heating can be limited to the electrode 13 . In this way, even small electronic components can be easily joined by soft solder. In addition, since the electrode 13 is directly heated by induction heating, not by heat conduction from the heating element, the substrate 11 can be suppressed from being heated. In this way, even if a flexible wiring board with low heat resistance is used, thermal deformation of the substrate 11 can be suppressed.

而且，藉由將置有複數個電子元件C的基板11輸送到沿基板11的輸送方向A排列的複數個鐵氧體30的下方，就能夠將複數個電子元件C用軟焊料連續地接合到形成在基板11上的電極13上。這樣一來，就能夠以良好的生產率用軟焊料將電子元件C接合到形成在基板11上的電極13上。並且，藉由對各鐵氧體30與形成在基板11上的電極13之間的間距分別進行調整，能夠使位於線圈20內側的複數個電極13中，利用感應加熱而被加熱的各電極13的溫度沿輸送方向A具有規定的溫度曲線。這樣一來，就能夠防止例如起因於電子元件的兩個端子處的軟焊料之熔融時間差的「立碑現象」。Furthermore, by conveying the substrate 11 on which the plurality of electronic components C are placed under the plurality of ferrites 30 arranged in the conveyance direction A of the substrate 11, the plurality of electronic components C can be continuously bonded to the The electrodes 13 are formed on the substrate 11 . In this way, the electronic component C can be bonded to the electrodes 13 formed on the substrate 11 with the soft solder with good productivity. In addition, by adjusting the pitches between the ferrites 30 and the electrodes 13 formed on the substrate 11 , the electrodes 13 which are heated by induction heating among the plurality of electrodes 13 located inside the coil 20 can be adjusted. The temperature along the conveying direction A has a prescribed temperature profile. In this way, it is possible to prevent, for example, the "tombstone phenomenon" caused by the difference in melting time of the solder at the two terminals of the electronic component.

在本實施方式中，鐵氧體30只要是磁導率較高的鐵氧體即可，磁導率較高是指能夠傳遞在線圈20內側產生的磁通，以使該磁通集中到軟焊料接合對象部位（電極），且不會衰減。例如，鐵氧體30可以採用軟磁鐵氧體。軟磁鐵氧體是以氧化鐵為主要成分的軟質磁性材料，電阻較大，基本不會讓電流通過。因此，在感應加熱之際，在軟磁鐵氧體中難以產生渦電流。其結果是，在進行感應加熱之際，能夠避免軟磁鐵氧體本身發熱，因此即使軟磁鐵氧體鄰近軟焊料接合對象部位（電極），也能夠使基板11受熱量的影響較小。In the present embodiment, the ferrite 30 may be a ferrite with high magnetic permeability, and high magnetic permeability means that the magnetic flux generated inside the coil 20 can be transmitted so that the magnetic flux can be concentrated to the soft Solder joins the target part (electrode) without decay. For example, soft ferrite may be used as the ferrite 30 . Soft ferrite is a soft magnetic material with iron oxide as the main component, which has a large resistance and basically does not allow current to pass through. Therefore, it is difficult to generate eddy currents in the soft ferrite during induction heating. As a result, since the soft ferrite itself can be prevented from heating during induction heating, the substrate 11 can be less affected by the heat even if the soft ferrite is adjacent to the part (electrode) to be joined by the soft solder.

在本實施方式中，調整機構40對各鐵氧體30與形成在基板11上的電極之間的間距分別進行調整，如圖1所示，調整機構40還可以具有記憶部43和控制部42。其中，記憶部43中存儲有已將各鐵氧體30與形成在基板11上的電極之間的間距設定為規定值之資料，控制部42根據記憶部43中存儲的資料，自動對各鐵氧體30與形成在基板11上的電極13之間的間距進行調整。In the present embodiment, the adjustment mechanism 40 adjusts the distances between the ferrites 30 and the electrodes formed on the substrate 11 respectively. As shown in FIG. 1 , the adjustment mechanism 40 may further include a memory portion 43 and a control portion 42 . . Among them, the memory unit 43 stores data in which the distance between each ferrite 30 and the electrodes formed on the substrate 11 has been set to a predetermined value, and the control unit 42 automatically adjusts each ferrite based on the data stored in the memory unit 43 The distance between the oxygen body 30 and the electrode 13 formed on the substrate 11 is adjusted.

記憶部43中存儲有已設定好的各鐵氧體30與形成在基板11上的電極13之間的間距之資料，該設定保證利用感應加熱而被加熱的各電極13的溫度沿輸送方向A具有規定的溫度曲線。控制部42根據記憶部43中存儲的資料，自動對各鐵氧體30與形成在基板11上的電極13之間的間距進行調整。The memory section 43 stores the data of the set distance between each ferrite 30 and the electrode 13 formed on the substrate 11, and the setting ensures that the temperature of each electrode 13 heated by induction heating is along the conveying direction A. Has a specified temperature profile. The control unit 42 automatically adjusts the distance between each of the ferrites 30 and the electrodes 13 formed on the substrate 11 based on the data stored in the memory unit 43 .

最佳的溫度曲線隨所使用的軟焊料的種類、電子元件C的種類、排列情況等條件而變化。因此，預先取得適合各條件之最佳的溫度曲線，並對各鐵氧體30與形成在基板11上的電極13之間的間距進行設定以保證電極13的溫度具有最佳的溫度曲線，將該間距之資料存儲到記憶部43中，由此就能夠實現軟焊料接合的自動化。The optimum temperature profile varies with conditions such as the type of soft solder used, the type of electronic component C, and the arrangement. Therefore, an optimal temperature curve suitable for each condition is obtained in advance, and the distance between each ferrite 30 and the electrode 13 formed on the substrate 11 is set to ensure that the temperature of the electrode 13 has an optimal temperature curve. The data of this pitch is stored in the memory part 43, and automation of the solder bonding can thereby be realized.

如圖1所示，在本實施方式中，還可以在以基板11為基準時與佈置有線圈20的一側相反的一側且與複數個鐵氧體30相對的位置，設置與基板11平行的鐵氧體板31。這樣一來，沿線圈20一側的鐵氧體30通過的磁通，就穿過基板11傳遞給鐵氧體板31，從而能夠使在線圈20中產生的磁通更可靠地射到軟焊料接合對象部位（電極）。其結果是，能夠更可靠地用軟焊料接合電子元件C。需要說明的是，也可以將棒狀的鐵氧體佈置到與鐵氧體30相對的位置，來取代鐵氧體板31。As shown in FIG. 1 , in this embodiment, the position opposite to the side on which the coils 20 are arranged and facing the plurality of ferrites 30 may be arranged parallel to the substrate 11 in the present embodiment. ferrite plate 31. In this way, the magnetic flux passing along the ferrite 30 on the side of the coil 20 is transmitted to the ferrite plate 31 through the substrate 11, so that the magnetic flux generated in the coil 20 can be more reliably emitted to the soft solder Parts to be joined (electrodes). As a result, the electronic component C can be more reliably joined with the soft solder. It should be noted that instead of the ferrite plate 31 , a rod-shaped ferrite may be arranged at a position facing the ferrite 30 .

在本實施方式中，基板11只要由絕緣性材料構成即可，其種類沒有特別限定。例如，基板11可以採用表面形成有電路佈線的電路板、兩面形成有電極焊墊（pad）的內插板（interposer）等。電子元件C只要是具有端子的部件即可，其種類沒有特別限定。例如，電子元件可以採用晶片電容、晶片電阻、LED元件、半導體元件、LSI等。In the present embodiment, as long as the substrate 11 is made of an insulating material, the type thereof is not particularly limited. For example, as the substrate 11 , a circuit board having circuit wirings formed on its surface, an interposer having electrode pads formed on both surfaces, or the like can be used. The type of the electronic component C is not particularly limited as long as it has a terminal. For example, chip capacitors, chip resistors, LED elements, semiconductor elements, LSIs, and the like can be used as electronic components.

在本實施方式中，軟焊料接合對象部位即電極13具有可利用感應加熱而局部性地被加熱的面積較佳。電極13的面積在0.25mm×0.25mm以上較佳。當電極13的面積較小時，還可以鄰接著電極13設置輔助加熱用之金屬墊。In the present embodiment, it is preferable that the electrode 13 which is the part to be joined by the soft solder has an area that can be locally heated by induction heating. The area of the electrode 13 is preferably not less than 0.25 mm×0.25 mm. When the area of the electrode 13 is small, a metal pad for auxiliary heating can also be arranged adjacent to the electrode 13 .

在本實施方式中，線圈20只要俯視時與基板11平行且在內側具有空間部即可，其形狀等沒有特別限定。還可以使線圈20為管狀，讓冷媒在其內部循環。In the present embodiment, as long as the coil 20 is parallel to the substrate 11 in plan view and has a space portion inside, its shape and the like are not particularly limited. It is also possible to make the coil 20 in a tubular shape and to circulate the refrigerant in the coil 20 .

（變形例）(Variation)

在本發明中，複數個鐵氧體30沿基板11的輸送方向A排列，其排列情況與要封裝到基板11上的電子元件C的排列情況一致。例如，在圖1中顯示的例子是，與基板11上排成一列的電子元件C一致，鐵氧體30也排成一列。此時，鐵氧體30的端部的大小即為包括電子元件C的軟焊料接合對象部位（電極）之大小。In the present invention, a plurality of ferrites 30 are arranged along the conveying direction A of the substrate 11 , and their arrangement is consistent with the arrangement of the electronic components C to be packaged on the substrate 11 . For example, in the example shown in FIG. 1 , the ferrites 30 are also arranged in a row in accordance with the electronic components C arranged in a row on the substrate 11 . At this time, the size of the end portion of the ferrite 30 is the size of the portion (electrode) to be soldered including the electronic component C. As shown in FIG.

但如圖6（a）、圖6（b）所示，當電子元件C排成兩列且這兩列彼此鄰近（例如間距在2~3mm以內）時，鐵氧體30的大小也可以是包括並排兩個電子元件的軟焊料接合對象部位（電極）之大小。此時，如圖6（a）所示，鐵氧體30呈帯狀形狀，沿與基板11的輸送方向A垂直的方向（y方向）延伸。並且，此時，對於並排兩個電子元件C，利用感應加熱同時用軟焊料進行接合。需要說明的是，在圖6（b）中省略了鐵氧體30。However, as shown in FIGS. 6( a ) and 6 ( b ), when the electronic components C are arranged in two rows and the two rows are adjacent to each other (for example, the distance is within 2-3 mm), the size of the ferrite 30 can also be The size of the solder joint object (electrode) including two side-by-side electronic components. At this time, as shown in FIG. 6( a ), the ferrite 30 has a band-like shape and extends in a direction (y direction) perpendicular to the conveyance direction A of the substrate 11 . In addition, at this time, the two electronic components C side by side are joined by soft solder by induction heating. In addition, in FIG.6(b), the ferrite 30 is abbreviate|omitted.

圖7顯示的例子是，在基板11上，電子元件C沿基板11的輸送方向排成複數列（圖7中為4列）。此時，可以給包括並排的電子元件Ca的列、包括並排的電子元件Cb的列，分別設置線圈20A、20B。需要說明的是，在圖7中省略了鐵氧體，其形狀為如圖6（a）所示的形狀即可。FIG. 7 shows an example in which the electronic components C are arranged in plural rows (four rows in FIG. 7 ) on the substrate 11 along the conveyance direction of the substrate 11 . At this time, the coils 20A and 20B may be provided for the row including the parallel electronic components Ca and the row including the parallel electronic components Cb, respectively. In addition, in FIG. 7, a ferrite is abbreviate|omitted, and the shape shown to FIG.6(a) should just be a shape.

當然，在本實施方式中，鐵氧體30的形狀和排列方式不限於圖1、圖6（a）、圖6（b）和圖7所示的情況，可以根據要封裝到基板11上的電子元件C的種類、大小、排列方式等適當地進行變更。Of course, in this embodiment, the shape and arrangement of the ferrites 30 are not limited to those shown in FIG. 1 , FIG. 6( a ), FIG. 6( b ) and FIG. The type, size, arrangement, and the like of the electronic components C are appropriately changed.

需要說明的是，鐵氧體30的長度在30~40mm之範圍內較佳。鐵氧體30為盡可能接近線圈20之內側尺寸的形狀較佳。It should be noted that the length of the ferrite 30 is preferably in the range of 30 to 40 mm. The shape of the ferrite 30 is preferably as close to the inner dimension of the coil 20 as possible.

以上透過較佳的實施方式對本發明進行了說明，但上述記載並非限定事項，當然也可以做出各種變更。例如，在上述實施方式中，使鐵氧體30呈靠近基板11一側的端部30a逐漸變細的形狀，但其形狀並沒有特別限定。例如，可以對鐵氧體30的端部30a的一對對邊或兩對對邊進行倒角加工。也可以不讓靠近基板11一側的端部30a呈逐漸變細的形狀。As mentioned above, although this invention was demonstrated based on preferable embodiment, the said description is not a limitation matter, Of course, various changes can be added. For example, in the above-described embodiment, the ferrite 30 has a tapered shape at the end 30a on the side closer to the substrate 11, but the shape is not particularly limited. For example, a pair of opposite sides or two pairs of opposite sides of the end portion 30a of the ferrite 30 may be chamfered. The end portion 30a on the side closer to the substrate 11 may not be tapered.

在上述實施方式中，是根據存儲在記憶部43中的資料，自動對各鐵氧體30與形成在基板11上的電極之間的間距進行調整，但也可以準備已預先將各鐵氧體30與形成在基板11上的電極之間的間距調整好的單元，根據要封裝到基板11上的電子元件C的大小和排列方式，更換整個單元。In the above-described embodiment, the distance between each ferrite 30 and the electrode formed on the substrate 11 is automatically adjusted based on the data stored in the memory unit 43, but each ferrite may be prepared in advance. 30 and the electrodes formed on the substrate 11 whose spacing is adjusted, the entire unit is replaced according to the size and arrangement of the electronic components C to be packaged on the substrate 11 .

在上述實施方式中，為了防止起因於電子元件的兩個端子處的軟焊料之熔融時間差的「立碑現象」，將各鐵氧體30與形成在基板11上的電極之間的間距進行了調整，以使利用感應加熱而被加熱的各電極的溫度具有規定的溫度曲線，但本發明不限於上述目的。例如，也可以進行調整，以使各電極的溫度具有類似於先前的迴銲方式中的溫度曲線之溫度曲線。In the above-described embodiment, in order to prevent the "tombstone phenomenon" caused by the difference in melting time of the soft solder at the two terminals of the electronic component, the distance between each ferrite 30 and the electrode formed on the substrate 11 is adjusted to The temperature of each electrode heated by induction heating is adjusted so that the temperature of each electrode has a predetermined temperature profile, but the present invention is not limited to the above object. For example, it is also possible to adjust the temperature of each electrode to have a temperature profile similar to that in the previous reflow method.

10‧‧‧軟焊料接合裝置11‧‧‧基板12‧‧‧輸送手段13‧‧‧電極14‧‧‧軟焊料15‧‧‧端子20‧‧‧線圈21‧‧‧空間部30‧‧‧鐵氧體31‧‧‧鐵氧體板40‧‧‧調整機構42‧‧‧控制部43‧‧‧記憶部50‧‧‧電源51‧‧‧導線10‧‧‧Solder Bonding Device 11‧‧‧Substrate 12‧‧‧Conveying Means 13‧‧‧Electrode 14‧‧‧Solder Solder 15‧‧‧Terminal 20‧‧‧Coil 21‧‧‧Space 30‧‧‧ Ferrite 31‧‧‧Ferrite plate 40‧‧‧Adjustment mechanism 42‧‧‧Control part 43‧‧‧Memory part 50‧‧‧Power supply 51‧‧‧Wire

圖1示意性地顯示本發明的一實施方式中的軟焊料接合裝置的構成。 圖2說明利用感應加熱，用軟焊料將電子元件接合到形成在基板上的電極上之方法。 圖3（a）顯示鐵氧體與基板上的電極之間的間距，圖3（b）顯示該間距與利用感應加熱而被加熱的電極的溫度之間的關係。 圖4（a）~圖4（e）以時間序列顯示將置有複數個電子元件的基板輸送到沿基板的輸送方向排列的複數個鐵氧體下方的過程中的狀態。 圖5是示意性地顯示電極的溫度隨時間變化的情況的曲線圖，該電極是位於輸送方向最前列的電子元件用軟焊料所接合的電極。 圖6（a）和圖6（b）顯示本發明的變形例中的電子元件的排列情況和線圈的佈置情況。 圖7顯示本發明的變形例中的電子元件的排列情況和線圈的佈置情況。FIG. 1 schematically shows the configuration of a solder bonding apparatus according to an embodiment of the present invention. FIG. 2 illustrates a method of bonding electronic components with soft solder to electrodes formed on a substrate using induction heating. Fig. 3(a) shows the spacing between the ferrite and the electrodes on the substrate, and Fig. 3(b) shows the relationship between the spacing and the temperature of the electrode heated by induction heating. FIGS. 4( a ) to 4( e ) show, in time series, the state in the process of conveying the substrate on which the plurality of electronic components are placed under the plurality of ferrites arranged in the conveying direction of the substrate. FIG. 5 is a graph schematically showing a time-dependent change in the temperature of an electrode to which the solder for electronic components located at the forefront in the conveyance direction is joined. FIGS. 6( a ) and 6 ( b ) show the arrangement of electronic components and the arrangement of coils in the modification of the present invention. FIG. 7 shows the arrangement of electronic components and the arrangement of coils in the modification of the present invention.

10‧‧‧軟焊料接合裝置 10‧‧‧Soft Solder Bonding Device

11‧‧‧基板 11‧‧‧Substrate

12‧‧‧輸送手段 12‧‧‧Conveying means

20‧‧‧線圈 20‧‧‧coil

21‧‧‧空間部 21‧‧‧Space Department

30‧‧‧鐵氧體 30‧‧‧Ferrite

31‧‧‧鐵氧體板 31‧‧‧Ferrite plate

40‧‧‧調整機構 40‧‧‧Adjustment mechanism

41‧‧‧致動器 41‧‧‧Actuators

42‧‧‧控制部 42‧‧‧Control Department

43‧‧‧記憶部 43‧‧‧Memory Department

50‧‧‧電源 50‧‧‧Power

51‧‧‧導線 51‧‧‧Wire

A‧‧‧輸送方向 A‧‧‧Conveying direction

C‧‧‧電子元件 C‧‧‧Electronic Components

Claims (9)

一種軟焊料接合裝置，其一邊輸送置有電子元件的基板，一邊用軟焊料將所述電子元件接合到形成在所述基板上的電極上，其特徵在於， 所述軟焊料接合裝置具有： 輸送手段，其用於輸送置有電子元件的所述基板；以及 加熱手段，其使夾在所述電極與所述電子元件之間的軟焊料熔融，而用軟焊料將所述電子元件接合到所述電極上， 所述加熱手段具有： 線圈，其在俯視時的內側具有空間部； 複數個鐵氧體，其沿所述基板的輸送方向排列在所述線圈的空間部中； 調整機構，其對各所述鐵氧體與形成在所述基板上的電極之間的間距分別進行調整；以及 電源，其對所述線圈施加交流電壓而對形成在基板上的所述電極進行感應加熱。A soft-solder bonding apparatus for bonding a board on which electronic components are placed while bonding the electronic components to electrodes formed on the board with soft solder, wherein the soft-solder bonding apparatus includes: a feeding means for conveying the substrate on which electronic components are placed; and heating means for melting the soft solder sandwiched between the electrodes and the electronic components, and bonding the electronic components to the electronic components with the soft solder On the electrode, the heating means includes: a coil having a space portion on the inner side in a plan view; a plurality of ferrites arranged in the space portion of the coil along the conveyance direction of the substrate; and an adjustment mechanism The pitches between each of the ferrites and the electrodes formed on the substrate are adjusted, respectively; and a power supply applies an AC voltage to the coils to inductively heat the electrodes formed on the substrate. 如請求項1所述的軟焊料接合裝置，其中， 所述鐵氧體由軟磁鐵氧體構成。The soft solder bonding apparatus according to claim 1, wherein the ferrite is made of soft ferrite. 如請求項1或2所述的軟焊料接合裝置，其中， 所述調整機構預先對各所述鐵氧體與形成在所述基板上的電極之間的間距進行調整，以使當交流電壓施加到所述線圈上之後，位於所述線圈的內側的複數個電極中，利用感應加熱而被加熱的各所述電極的溫度沿輸送方向具有規定的溫度曲線。The soft-solder bonding device according to claim 1 or 2, wherein the adjustment means adjusts the distance between each of the ferrites and the electrodes formed on the substrate in advance so that when an AC voltage is applied After reaching the coil, among the plurality of electrodes located inside the coil, the temperature of each electrode heated by induction heating has a predetermined temperature profile in the conveying direction. 如請求項1或2所述的軟焊料接合裝置，其中， 預先對各所述鐵氧體與形成在所述基板上的電極之間的間距進行調整，以使所述基板上的位於輸送方向側的電極的溫度比位於與輸送方向相反一側的電極的溫度高。The soft solder bonding apparatus according to claim 1 or 2, wherein the distance between each of the ferrites and the electrodes formed on the substrate is adjusted in advance so that the distance between the ferrites and the electrodes formed on the substrate is located in the conveying direction. The temperature of the electrode on the side is higher than that of the electrode on the opposite side of the conveying direction. 如請求項1或2所述的軟焊料接合裝置，其中， 所述調整機構還具有： 記憶部，其用於存儲已將各所述鐵氧體與形成在所述基板上的電極之間的間距設定為規定值之資料；以及 控制部，其根據所述記憶部中存儲的資料，自動對各所述鐵氧體與形成在所述基板上的電極之間的間距進行調整。The soft-solder bonding apparatus according to claim 1 or 2, wherein the adjustment mechanism further includes: a memory section for storing the information between each of the ferrites and the electrodes formed on the substrate. data for setting the spacing to a predetermined value; and a control unit that automatically adjusts the spacing between each of the ferrites and the electrodes formed on the substrate based on the data stored in the memory unit. 如請求項5所述的軟焊料接合裝置，其中， 所述記憶部中存儲有已設定好的各所述鐵氧體與形成在所述基板上的電極之間的間距之資料，該設定保證利用感應加熱而被加熱的各所述電極的溫度沿輸送方向具有規定的溫度曲線， 所述控制部根據所述記憶部中存儲的所述資料，自動對各所述鐵氧體與形成在所述基板上的電極之間的間距進行調整。The soft-solder bonding apparatus according to claim 5, wherein the memory section stores data on the distances between the ferrites and the electrodes formed on the substrate that have been set, and the setting ensures that The temperature of each of the electrodes heated by induction heating has a predetermined temperature profile along the conveying direction, and the control unit automatically associates each of the ferrites with the respective ferrites formed in the conveying direction based on the data stored in the memory unit. The spacing between the electrodes on the substrate is adjusted. 如請求項1或2所述的軟焊料接合裝置，其中， 所述基板由絕緣性材料構成， 所述電極具有可利用感應加熱而局部性地被加熱的面積。The solder bonding apparatus according to claim 1 or 2, wherein the substrate is made of an insulating material, and the electrode has an area that can be locally heated by induction heating. 如請求項1所述的軟焊料接合裝置，其中， 所述鐵氧體呈靠近所述基板一側的端部逐漸變細的形狀。The soft-solder bonding device according to claim 1, wherein the ferrite has a shape in which the end portion on the side closer to the substrate is tapered. 如請求項1所述的軟焊料接合裝置，其中， 所述加熱手段還具有與所述基板平行的鐵氧體板，所述鐵氧體板佈置在以所述基板為基準時與佈置有所述線圈的一側相反的一側且與複數個所述鐵氧體相對的位置。The soft-solder bonding apparatus according to claim 1, wherein the heating means further includes a ferrite plate parallel to the substrate, and the ferrite plate is arranged to be different from the arrangement when the substrate is used as a reference A position opposite to one side of the coil and opposite to the plurality of ferrites.
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