TWI748796B - 電性測試座 - Google Patents

電性測試座 Download PDF

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Publication number
TWI748796B
TWI748796B TW109144048A TW109144048A TWI748796B TW I748796 B TWI748796 B TW I748796B TW 109144048 A TW109144048 A TW 109144048A TW 109144048 A TW109144048 A TW 109144048A TW I748796 B TWI748796 B TW I748796B
Authority
TW
Taiwan
Prior art keywords
conductive
elastic substance
test element
sheet
electrical test
Prior art date
Application number
TW109144048A
Other languages
English (en)
Chinese (zh)
Other versions
TW202127040A (zh
Inventor
鄭永倍
Original Assignee
南韓商Ｉｓｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商Ｉｓｃ股份有限公司 filed Critical 南韓商Ｉｓｃ股份有限公司
Publication of TW202127040A publication Critical patent/TW202127040A/zh
Application granted granted Critical
Publication of TWI748796B publication Critical patent/TWI748796B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW109144048A 2019-03-25 2020-12-14 電性測試座 TWI748796B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20190033728 2019-03-25
KR1020190172112A KR102175797B1 (ko) 2019-03-25 2019-12-20 검사용 소켓
KR10-2019-0172112 2019-12-20

Publications (2)

Publication Number Publication Date
TW202127040A TW202127040A (zh) 2021-07-16
TWI748796B true TWI748796B (zh) 2021-12-01

Family

ID=72884443

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109144048A TWI748796B (zh) 2019-03-25 2020-12-14 電性測試座

Country Status (4)

Country Link
KR (1) KR102175797B1 (ko)
CN (1) CN115087875A (ko)
TW (1) TWI748796B (ko)
WO (1) WO2021125679A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102175797B1 (ko) * 2019-03-25 2020-11-06 주식회사 아이에스시 검사용 소켓
KR102615617B1 (ko) * 2021-01-08 2023-12-20 리노공업주식회사 검사소켓 및 그의 제조방법
KR102639525B1 (ko) * 2021-06-22 2024-02-22 주식회사 아이에스시 테스트 소켓
KR102594175B1 (ko) * 2021-08-17 2023-10-26 미르텍알앤디 주식회사 반도체 테스트 소켓 및 그 제조 방법
KR102597274B1 (ko) * 2021-08-27 2023-11-02 주식회사 티에스이 신호 전송 커넥터
US11994554B2 (en) * 2021-08-27 2024-05-28 Tse Co., Ltd. Test apparatus for semiconductor package
KR102597496B1 (ko) * 2021-09-07 2023-11-02 주식회사 아이에스시 전기접속용 소켓

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1894589A (zh) * 2003-12-18 2007-01-10 Jsr株式会社 各向异性导电性连接器和电路装置的检查方法
CN1989606A (zh) * 2004-08-31 2007-06-27 Jsr株式会社 晶片检验用各向异性导电性连接器及其制造方法和其应用
TW200821586A (en) * 2006-07-10 2008-05-16 Tokyo Electron Ltd Probe card
JP4288783B2 (ja) * 1999-09-24 2009-07-01 Ｊｓｒ株式会社 異方導電性シートおよび回路装置の電気的検査装置
WO2009147929A1 (ja) * 2008-06-02 2009-12-10 株式会社アドバンテスト プローブ、電子部品試験装置及びプローブの製造方法
KR101606284B1 (ko) * 2014-10-29 2016-03-25 주식회사 아이에스시 관통 홀이 형성된 다공성 절연시트를 갖는 전기적 접속체 및 테스트 소켓

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000304808A (ja) 1999-04-23 2000-11-02 Matsushita Electric Ind Co Ltd 半導体装置の検査装置
KR100970571B1 (ko) * 2008-06-24 2010-07-16 이용준 반도체 소자 테스트용 콘택터 및 그 제조방법
KR101204939B1 (ko) * 2009-08-27 2012-11-26 주식회사 아이에스시 검사용 시트 및 그 검사용 시트의 제조방법
KR101573450B1 (ko) 2014-07-17 2015-12-11 주식회사 아이에스시 테스트용 소켓
KR101667929B1 (ko) * 2015-03-31 2016-10-20 (주)티에스이 실리콘 러버 소켓
KR101976702B1 (ko) * 2017-08-31 2019-05-09 주식회사 아이에스시 탄소나노튜브가 포함된 검사용 소켓
KR102175797B1 (ko) * 2019-03-25 2020-11-06 주식회사 아이에스시 검사용 소켓

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4288783B2 (ja) * 1999-09-24 2009-07-01 Ｊｓｒ株式会社 異方導電性シートおよび回路装置の電気的検査装置
CN1894589A (zh) * 2003-12-18 2007-01-10 Jsr株式会社 各向异性导电性连接器和电路装置的检查方法
CN1989606A (zh) * 2004-08-31 2007-06-27 Jsr株式会社 晶片检验用各向异性导电性连接器及其制造方法和其应用
TW200821586A (en) * 2006-07-10 2008-05-16 Tokyo Electron Ltd Probe card
WO2009147929A1 (ja) * 2008-06-02 2009-12-10 株式会社アドバンテスト プローブ、電子部品試験装置及びプローブの製造方法
TWI418797B (zh) * 2008-06-02 2013-12-11 Advantest Corp A probe, an electronic component testing device, and a method of manufacturing the probe
KR101606284B1 (ko) * 2014-10-29 2016-03-25 주식회사 아이에스시 관통 홀이 형성된 다공성 절연시트를 갖는 전기적 접속체 및 테스트 소켓

Also Published As

Publication number Publication date
CN115087875A (zh) 2022-09-20
TW202127040A (zh) 2021-07-16
KR20200115036A (ko) 2020-10-07
WO2021125679A1 (ko) 2021-06-24
KR102175797B1 (ko) 2020-11-06

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