TWI743603B - 組裝裝置及半導體裝置的製造方法 - Google Patents

組裝裝置及半導體裝置的製造方法 Download PDF

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Publication number: TWI743603B
Authority: TW; Taiwan
Prior art keywords: die; aforementioned; lighting; assembly; head
Prior art date: 2019-02-14

Application number

TW108143657A

Other languages

English (en)

Chinese (zh)

Other versions

TW202101099A (zh

Inventor

酒井一信

石川雄大

Original Assignee

日商捷進科技有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-02-14

Filing date

2019-11-29

Publication date

2021-10-21

2019-11-29 Application filed by 日商捷進科技有限公司 filed Critical 日商捷進科技有限公司

2021-01-01 Publication of TW202101099A publication Critical patent/TW202101099A/zh

2021-10-21 Application granted granted Critical

2021-10-21 Publication of TWI743603B publication Critical patent/TWI743603B/zh

Links

239000004065 semiconductor Substances 0.000 title claims description 8
238000004519 manufacturing process Methods 0.000 title claims description 7
238000003384 imaging method Methods 0.000 claims abstract description 58
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238000012937 correction Methods 0.000 claims description 34
230000033001 locomotion Effects 0.000 claims description 20
238000005286 illumination Methods 0.000 claims description 19
238000000034 method Methods 0.000 claims description 17
230000008569 process Effects 0.000 claims description 12
239000013078 crystal Substances 0.000 claims description 9
230000001678 irradiating effect Effects 0.000 claims 3
230000032258 transport Effects 0.000 claims 2
238000010586 diagram Methods 0.000 description 39
238000012545 processing Methods 0.000 description 17
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238000012986 modification Methods 0.000 description 9
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238000004020 luminiscence type Methods 0.000 description 5
230000000694 effects Effects 0.000 description 4
241000309551 Arthraxon hispidus Species 0.000 description 3
230000006870 function Effects 0.000 description 3
230000003068 static effect Effects 0.000 description 3
238000012935 Averaging Methods 0.000 description 2
230000005540 biological transmission Effects 0.000 description 2
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238000006073 displacement reaction Methods 0.000 description 2
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238000001514 detection method Methods 0.000 description 1
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238000012544 monitoring process Methods 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/03—Combinations of cameras with lighting apparatus; Flash units
- G03B15/04—Combinations of cameras with non-electronic flash apparatus; Non-electronic flash units
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/03—Combinations of cameras with lighting apparatus; Flash units
- G03B15/05—Combinations of cameras with electronic flash apparatus; Electronic flash units
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B7/00—Control of exposure by setting shutters, diaphragms or filters, separately or conjointly
- G03B7/16—Control of exposure by setting shutters, diaphragms or filters, separately or conjointly in accordance with both the intensity of the flash source and the distance of the flash source from the object, e.g. in accordance with the "guide number" of the flash bulb and the focusing of the camera
- G03B7/17—Selection of modes in flash units by exposure control arrangements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/73—Circuitry for compensating brightness variation in the scene by influencing the exposure time

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Signal Processing (AREA)
Multimedia (AREA)
Studio Devices (AREA)
Supply And Installment Of Electrical Components (AREA)
Wire Bonding (AREA)
Die Bonding (AREA)
Stroboscope Apparatuses (AREA)

TW108143657A 2019-02-14 2019-11-29 組裝裝置及半導體裝置的製造方法 TWI743603B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2019-024945		2019-02-14
JP2019024945A JP2020136361A (ja)	2019-02-14	2019-02-14	実装装置および半導体装置の製造方法

Publications (2)

Publication Number	Publication Date
TW202101099A TW202101099A (zh)	2021-01-01
TWI743603B true TWI743603B (zh)	2021-10-21

Family

ID=72072968

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW108143657A TWI743603B (zh)	2019-02-14	2019-11-29	組裝裝置及半導體裝置的製造方法

Country Status (4)

Country	Link
JP (2)	JP2020136361A (ja)
KR (1)	KR102384806B1 (ja)
CN (2)	CN111564375B (ja)
TW (1)	TWI743603B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
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JP7498630B2 (ja)	2020-09-11	2024-06-12	ファスフォードテクノロジ株式会社	ダイボンディング装置および半導体装置の製造方法

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2019
- 2019-02-14 JP JP2019024945A patent/JP2020136361A/ja active Pending
- 2019-11-29 TW TW108143657A patent/TWI743603B/zh active
2020
- 2020-01-10 CN CN202010026273.9A patent/CN111564375B/zh active Active
- 2020-01-10 CN CN202410252907.0A patent/CN118156153A/zh active Pending
- 2020-01-30 KR KR1020200010827A patent/KR102384806B1/ko active IP Right Grant
2023
- 2023-12-08 JP JP2023207335A patent/JP2024019446A/ja active Pending

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Also Published As

Publication number	Publication date
JP2020136361A (ja)	2020-08-31
TW202101099A (zh)	2021-01-01
KR102384806B1 (ko)	2022-04-08
CN118156153A (zh)	2024-06-07
JP2024019446A (ja)	2024-02-09
KR20200099471A (ko)	2020-08-24
CN111564375A (zh)	2020-08-21
CN111564375B (zh)	2024-04-02

Publication	Publication Date	Title
JP2024019446A (ja)	2024-02-09	実装装置および半導体装置の製造方法
TW202008494A (zh)	2020-02-16	搬運機構、電子零件製造裝置及電子零件的製造方法
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JP6836938B2 (ja)	2021-03-03	ダイボンディング装置および半導体装置の製造方法
TWI798619B (zh)	2023-04-11	晶粒接合裝置及半導體裝置之製造方法
JP6110167B2 (ja)	2017-04-05	ダイ認識手段及びダイ認識方法並びにダイボンダ
JP6940207B2 (ja)	2021-09-22	電子部品実装装置
JPH09321494A (ja)	1997-12-12	表面実装機の照明装置
TWI818620B (zh)	2023-10-11	黏晶裝置及半導體裝置的製造方法
JP5977579B2 (ja)	2016-08-24	基板作業装置
JP3815637B2 (ja)	2006-08-30	部品搭載装置
JP3914055B2 (ja)	2007-05-16	部材載装機器
JP3778676B2 (ja)	2006-05-24	部品搭載装置
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JP3932500B2 (ja)	2007-06-20	マウント検査装置
JP3781233B2 (ja)	2006-05-31	部品搭載装置
JP2000286452A (ja)	2000-10-13	発光素子の発光中心検出方法
JP2022145998A (ja)	2022-10-05	ダイボンディング装置および半導体装置の製造方法
JP2008270719A (ja)	2008-11-06	実装機およびその部品撮像方法
JP2002176295A (ja)	2002-06-21	部品実装装置
JPH0442600A (ja)	1992-02-13	フラットパッケージ型電子部品の位置認識方法
JP2005005613A (ja)	2005-01-06	発光素子の位置決め方法および装置ならびに発光素子利用装置の製造方法および装置