TWI719567B - 粗糙化處理銅箔、附載體之銅箔、覆銅層合板及印刷配線板 - Google Patents
粗糙化處理銅箔、附載體之銅箔、覆銅層合板及印刷配線板 Download PDFInfo
- Publication number
- TWI719567B TWI719567B TW108127478A TW108127478A TWI719567B TW I719567 B TWI719567 B TW I719567B TW 108127478 A TW108127478 A TW 108127478A TW 108127478 A TW108127478 A TW 108127478A TW I719567 B TWI719567 B TW I719567B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- roughened
- carrier
- copper
- layer
- Prior art date
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018152072 | 2018-08-10 | ||
JP2018-152072 | 2018-08-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202009329A TW202009329A (zh) | 2020-03-01 |
TWI719567B true TWI719567B (zh) | 2021-02-21 |
Family
ID=69414103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108127478A TWI719567B (zh) | 2018-08-10 | 2019-08-02 | 粗糙化處理銅箔、附載體之銅箔、覆銅層合板及印刷配線板 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6905157B2 (ja) |
KR (1) | KR102480377B1 (ja) |
CN (1) | CN112424399B (ja) |
MY (1) | MY186454A (ja) |
TW (1) | TWI719567B (ja) |
WO (1) | WO2020031721A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019163962A1 (ja) * | 2018-02-23 | 2019-08-29 | 古河電気工業株式会社 | 電解銅箔、並びに該電解銅箔を用いたリチウムイオン二次電池用負極、リチウムイオン二次電池、銅張積層板及びプリント配線板 |
JP7421208B2 (ja) * | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
CN115038819A (zh) * | 2020-02-04 | 2022-09-09 | 三井金属矿业株式会社 | 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板 |
JP7177956B2 (ja) * | 2020-02-04 | 2022-11-24 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
JP7051988B1 (ja) * | 2020-11-27 | 2022-04-11 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板、及びプリント配線板 |
JP7273883B2 (ja) * | 2021-04-09 | 2023-05-15 | 福田金属箔粉工業株式会社 | 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板 |
JPWO2022244827A1 (ja) | 2021-05-20 | 2022-11-24 | ||
JPWO2022244828A1 (ja) | 2021-05-20 | 2022-11-24 | ||
JPWO2022244826A1 (ja) | 2021-05-20 | 2022-11-24 | ||
CN118019880A (zh) * | 2021-09-30 | 2024-05-10 | 三井金属矿业株式会社 | 粗糙化处理铜箔及覆铜层叠板、以及印刷电路板的制造方法 |
WO2023189839A1 (ja) * | 2022-03-31 | 2023-10-05 | 三井金属鉱業株式会社 | キャリア付金属箔 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005048277A (ja) * | 2003-07-15 | 2005-02-24 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法 |
TW201636457A (zh) * | 2015-01-22 | 2016-10-16 | Mitsui Mining & Smelting Co | 附載體極薄銅箔及其製造方法 |
CN106455341A (zh) * | 2015-08-06 | 2017-02-22 | Jx金属株式会社 | 附载体铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5842077B1 (ja) * | 2015-07-01 | 2016-01-13 | 三井金属鉱業株式会社 | キャリア付銅箔、銅張積層板及びプリント配線板 |
MY177676A (en) * | 2015-07-03 | 2020-09-23 | Mitsui Mining & Smelting Co Ltd | Roughened copper foil, copper-clad laminate and printed wiring board |
WO2017018232A1 (ja) * | 2015-07-29 | 2017-02-02 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
CN109072472B (zh) * | 2016-04-14 | 2020-10-16 | 三井金属矿业株式会社 | 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法 |
KR102268478B1 (ko) * | 2016-12-14 | 2021-06-22 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박 및 동 클래드 적층판 |
JP7177956B2 (ja) * | 2020-02-04 | 2022-11-24 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
-
2019
- 2019-07-25 KR KR1020217000738A patent/KR102480377B1/ko active IP Right Grant
- 2019-07-25 JP JP2020536455A patent/JP6905157B2/ja active Active
- 2019-07-25 MY MYPI2021000356A patent/MY186454A/en unknown
- 2019-07-25 CN CN201980047289.3A patent/CN112424399B/zh active Active
- 2019-07-25 WO PCT/JP2019/029224 patent/WO2020031721A1/ja active Application Filing
- 2019-08-02 TW TW108127478A patent/TWI719567B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005048277A (ja) * | 2003-07-15 | 2005-02-24 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法 |
TW201636457A (zh) * | 2015-01-22 | 2016-10-16 | Mitsui Mining & Smelting Co | 附載體極薄銅箔及其製造方法 |
CN106455341A (zh) * | 2015-08-06 | 2017-02-22 | Jx金属株式会社 | 附载体铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2020031721A1 (ja) | 2020-02-13 |
KR20210019518A (ko) | 2021-02-22 |
CN112424399B (zh) | 2023-07-25 |
KR102480377B1 (ko) | 2022-12-23 |
JP6905157B2 (ja) | 2021-07-21 |
CN112424399A (zh) | 2021-02-26 |
MY186454A (en) | 2021-07-22 |
JPWO2020031721A1 (ja) | 2021-04-30 |
TW202009329A (zh) | 2020-03-01 |
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