TWI689580B - Thermally conductive composite material and its manufacturing method - Google Patents

Thermally conductive composite material and its manufacturing method Download PDF

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TWI689580B
TWI689580B TW107140837A TW107140837A TWI689580B TW I689580 B TWI689580 B TW I689580B TW 107140837 A TW107140837 A TW 107140837A TW 107140837 A TW107140837 A TW 107140837A TW I689580 B TWI689580 B TW I689580B
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fiber
composite material
thermally conductive
thickness
conductive composite
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TW201920592A (en
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延澤優樹
倉田功
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日商日鐵化學材料股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2439/00—Containers; Receptacles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
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  • Human Computer Interaction (AREA)
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  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract

本發明提供一種低成本且可同時實現高剛性與散熱性之導熱性複合材料。本發明係一種具有含連續之強化纖維f的片狀纖維強化樹脂材料2及一體接合於纖維強化樹脂材料2之兩面的金屬箔層3(3a、3b)，厚度(T1)被設為0.07~1mm之導熱性複合材料1，纖維強化樹脂材料2之厚度(t2)被設為0.05mm以上未達1mm，金屬箔層3(3a、3b)之厚度(t3a、t3b)被設為0.009~0.1mm，導熱性複合材料1之拉伸彈性模數為80GPa以上。 The present invention provides a low-cost thermally conductive composite material that can achieve both high rigidity and heat dissipation. The present invention is a sheet-like fiber-reinforced resin material 2 containing continuous reinforcing fibers f and metal foil layers 3 (3a, 3b) integrally joined on both sides of the fiber-reinforced resin material 2, with a thickness (T1) of 0.07~ The thermally conductive composite material 1 of 1 mm, the thickness (t2) of the fiber-reinforced resin material 2 is set to be more than 0.05 mm but less than 1 mm, and the thickness (t3a, t3b) of the metal foil layer 3 (3a, 3b) is set to 0.009 to 0.1 mm, the tensile elastic modulus of the thermally conductive composite material 1 is 80 GPa or more.

Description

導熱性複合材料及其製造方法 Thermally conductive composite material and its manufacturing method

本發明係關於一種作為由智慧型手機、輸入板、可攜式電腦等所代表之資訊終端機器之殼體、殼體箱或移動型數位醫療用片匣或作為其他需要熱對策之電機器殼體等的補強板而使用之高剛性(高彈性)且具有高散熱特性，即導熱性之導熱性複合材料及其製造方法。 The present invention relates to a case, case box or mobile digital medical cassette as an information terminal machine represented by a smart phone, an input board, a portable computer, etc. or as a motor case requiring other heat countermeasures It is a high-rigidity (high-elasticity) and high-heat-dissipation property that is used for reinforcing plates such as bodies, that is, a thermally conductive composite material and its manufacturing method.

現在，例如於智慧型手機、輸入板、可攜式電腦等資訊終端機器中，搭載電池、電路基板等之殼體、殼體箱、一體安裝於該殼體等之殼體表面材料、頂板等為了輕量化而使塑膠系材料成形從而製作之方法成為主流。例如，於圖1示出概略構成之智慧型手機100一般由搭載有電池、電路基板等之薄型箱狀的殼體(或者殼體箱)101，及安裝於殼體(或者殼體箱)101之具備顯示器、觸控面板之蓋體102構成。 At present, for example, in information terminal devices such as smartphones, input boards, and portable computers, a case, a case, a case surface material, a top plate, etc., which are integrally mounted on the case, are equipped with batteries, circuit boards, etc. In order to reduce the weight, the method of forming plastic materials and making them become mainstream. For example, the smartphone 100 shown in FIG. 1 generally has a thin box-shaped case (or case box) 101 mounted with a battery, a circuit board, etc., and mounted on the case (or case box) 101 The cover 102 with a display and a touch panel is formed.

近年來，於上述般之資訊終端機器中，隨著CPU等之處理性能提高，因半導體裝置等之消耗電力增加而引起之電池的大型化與放熱量之增大迫不得已，因此，進一步強烈要求殼體(或者殼體箱)之剛性化及散熱性(導熱性)。 In recent years, in the above-mentioned information terminal equipment, as the processing performance of the CPU and the like has improved, the increase in the size of the battery and the increase in the amount of heat dissipation caused by the increased power consumption of the semiconductor device, etc. Rigidity of body (or case box) and heat dissipation (thermal conductivity).

以往，通常用作散熱構件之石墨片材等具有驚人之導熱率， 但價格極高，另外於剛性之方面存在問題。 In the past, graphite sheets, etc., which are usually used as heat-dissipating members, have an amazing thermal conductivity, but the price is extremely high, and there is also a problem in terms of rigidity.

因此，專利文獻1提出有為了將積體電路所使用之半導體等加熱元件冷卻而使用碳纖維複合材料的混成之散熱板。該散熱板之碳纖維複合材料的導熱率存在異向性，因此於搭載半導體等加熱元件之碳纖維複合體的周圍接合高導熱性金屬而構成，碳纖維複合體之碳纖維係相對於搭載加熱元件之面垂直地單軸配向。 Therefore, Patent Document 1 proposes a heat dissipation plate using a mixed carbon fiber composite material in order to cool a heating element such as a semiconductor used in an integrated circuit. The thermal conductivity of the carbon fiber composite material of the heat dissipation plate has anisotropy, so a high thermal conductivity metal is formed around the carbon fiber composite body mounted with a heating element such as a semiconductor. The carbon fiber of the carbon fiber composite body is perpendicular to the surface on which the heating element is mounted Ground single axis alignment.

又，專利文獻2提出有利用接著劑將鋁平板接著於碳纖維強化塑膠成形品之底面部的導熱性複合成型品作為內置有高性能CPU之電腦的殼體，該碳纖維強化塑膠成形品具有箱形之長纖維顆粒。 In addition, Patent Document 2 proposes a thermally conductive composite molded product in which an aluminum flat plate is adhered to a bottom portion of a carbon fiber-reinforced plastic molded product using an adhesive as a housing of a computer with a built-in high-performance CPU. The carbon fiber-reinforced plastic molded product has a box shape The long fiber particles.

專利文獻1：日本特開2002-57259號公報 Patent Document 1: Japanese Patent Application Publication No. 2002-57259

專利文獻2：日本特開平11-147286號公報 Patent Document 2: Japanese Patent Laid-Open No. 11-147286

亦根據上述專利文獻之記載所理解般，碳纖維強化複合材料所使用之強化纖維即碳纖維，於纖維軸方向上良好地傳遞熱量，但於與纖維軸成直角之方向上幾乎不傳遞熱量。因此，靠近碳纖維強化複合材料之熱源的表面之碳纖維在某種程度上有助於熱擴散，但相對於碳纖維強化複合材料之厚度方向上導熱率差，故遠離表面之內側的碳纖維幾乎不對熱擴散有助益。即，例如瀝青系碳纖維其本身之導熱率為100~600W/mK而顯示極高之數值，但存在如下問題：僅於纖維軸方向上發揮其能力而存在異向性，又，於製成使樹脂含浸於碳纖維中而製作之碳纖維強化複合材料之情形時，樹脂的導熱率之不良產生影響而無法獲得所需之導熱特性等。 As is also understood from the description of the above-mentioned patent documents, carbon fibers, which are reinforcing fibers used in carbon fiber reinforced composite materials, transfer heat well in the direction of the fiber axis, but hardly transfer heat in the direction at right angles to the fiber axis. Therefore, the carbon fibers close to the surface of the heat source of the carbon fiber-reinforced composite material contribute to thermal diffusion to some extent, but the thermal conductivity in the thickness direction of the carbon fiber-reinforced composite material is poor, so the carbon fibers far from the inside of the surface hardly diffuse the heat Helpful. That is, for example, the pitch-based carbon fiber itself has a very high thermal conductivity of 100 to 600 W/mK, which shows an extremely high value, but there is a problem that there is an anisotropy only when its ability is exerted in the direction of the fiber axis. When the carbon fiber reinforced composite material is made by impregnating the carbon fiber with the resin, the poor thermal conductivity of the resin affects and the desired thermal conductivity characteristics cannot be obtained.

又，上述專利文獻1所記載之使用碳纖維複合材料的混成之散熱板例如設成如下構成：於30mm見方、厚度2mm之銅片的中央部嵌入厚度2mm之碳纖維複合體，並於該碳纖維複合體上搭載加熱元件。又，專利文獻2所記載之碳纖維強化塑膠成形品例如將碳纖維強化塑膠成形品之厚度設為1.4mm，長纖維顆粒之重量平均纖維長設為0.38mm，鋁平板之厚度設為0.6mm。 In addition, the mixed heat dissipation plate using the carbon fiber composite material described in Patent Document 1 is, for example, configured as follows: a carbon fiber composite with a thickness of 2 mm is embedded in the center of a 30 mm square copper sheet with a thickness of 2 mm, and the carbon fiber composite It is equipped with heating elements. In addition, the carbon fiber-reinforced plastic molded product described in Patent Document 2 has, for example, a thickness of the carbon fiber-reinforced plastic molded product of 1.4 mm, a weight average fiber length of the long fiber particles of 0.38 mm, and a thickness of the aluminum flat plate of 0.6 mm.

專利文獻1、2所記載之混成之散熱板或者碳纖維強化塑膠成形品無法將其自身用作智慧型手機等之殼體蓋或者用以補強殼體之補強板。 The hybrid heat dissipation plate or carbon fiber reinforced plastic molded product described in Patent Documents 1 and 2 cannot be used as a case cover of a smartphone or the like or a reinforcing plate to reinforce the case.

因此，本發明人等為了改善使用上述習知之碳纖維複合材料的混成之散熱板或者碳纖維強化塑膠成形品之上述問題點，進行了大量研究實驗，結果發現，藉由將成為與放熱體之接觸部的表面設為金屬，並於內側配置高剛性之碳纖維強化複合材料般的纖維強化複合材料，或者於內側配置金屬，於其兩側配置碳纖維強化複合材料般之纖維強化複合材料，並將金屬之厚度及纖維強化複合材料之厚度設計為最佳，藉此可利用作為等向性材料之金屬的導熱性向纖維強化複合材料之纖維軸方向以外的面內方向促進熱擴散而於面內方向及厚度方向均保持良好之散熱特性(導熱率)，並且可確保高剛性。 Therefore, the present inventors conducted a large number of research experiments in order to improve the above-mentioned problems of the mixed heat dissipation plate or carbon fiber reinforced plastic molded product using the above-mentioned conventional carbon fiber composite material, and found that the contact part with the heat radiator The surface is made of metal, and a high-rigidity carbon fiber reinforced composite material-like fiber reinforced composite material is arranged on the inside, or a metal is arranged on the inside, and carbon fiber reinforced composite material-like fiber reinforced composite material is arranged on both sides of the metal. The thickness and the thickness of the fiber-reinforced composite material are optimally designed, so that the thermal conductivity of the metal as an isotropic material can be used to promote heat diffusion in the in-plane direction other than the fiber axis direction of the fiber-reinforced composite material in the in-plane direction and thickness The direction maintains good heat dissipation characteristics (thermal conductivity), and can ensure high rigidity.

即，本發明之目的在於提供一種低成本且可同時實現高剛性與散熱性之導熱性複合材料。 That is, an object of the present invention is to provide a low-cost thermally conductive composite material that can achieve both high rigidity and heat dissipation.

上述目的係利用本發明之導熱性複合材料而達成。簡而言之，根據本發明之第一態樣，提供一種導熱性複合材料，其具有含連續之 強化纖維的片狀纖維強化樹脂材料及一體接合於上述纖維強化樹脂材料之兩面的金屬箔層，厚度被設為0.07~1mm，其特徵在於：上述纖維強化樹脂材料之厚度被設為0.05mm以上，未達1mm，上述金屬箔層之厚度被設為0.009~0.1mm，上述導熱性複合材料之拉伸彈性模數為80GPa以上。根據本發明之第二態樣，提供一種導熱性複合材料，其具有金屬箔層及一體接合於上述金屬箔層的兩面之含連續之強化纖維的片狀纖維強化樹脂材料，厚度被設為0.12~1mm者，其特徵在於：上述纖維強化樹脂材料之厚度被設為0.05mm以上，未達1mm，上述金屬箔層之厚度被設為0.009~0.1mm，上述導熱性複合材料之拉伸彈性模數為80GPa以上。 The above object is achieved by using the thermally conductive composite material of the present invention. In short, according to the first aspect of the present invention, there is provided a thermally conductive composite material having a sheet-shaped fiber-reinforced resin material containing continuous reinforcing fibers and metal foil layers integrally joined on both sides of the fiber-reinforced resin material , The thickness is set to 0.07 ~ 1mm, characterized in that: the thickness of the fiber-reinforced resin material is set to 0.05mm or more, less than 1mm, the thickness of the metal foil layer is set to 0.009 ~ 0.1mm, the thermally conductive composite material The tensile modulus of elasticity is 80 GPa or more. According to a second aspect of the present invention, there is provided a thermally conductive composite material having a metal foil layer and a sheet-like fiber-reinforced resin material containing continuous reinforcing fibers integrally joined to both sides of the metal foil layer, and the thickness is set to 0.12 ~1mm, characterized in that: the thickness of the fiber-reinforced resin material is set to 0.05mm or more, less than 1mm, the thickness of the metal foil layer is set to 0.009~0.1mm, the tensile elastic die of the thermally conductive composite material The number is above 80GPa.

根據上述本發明之第一實施態樣，上述纖維強化樹脂材料以纖維體積含有率計，含有20%以上之瀝青系碳纖維，該瀝青系碳纖維具有100W/mK以上的強化纖維之導熱率及400GPa以上之拉伸彈性模數。 According to the first embodiment of the present invention described above, the fiber-reinforced resin material contains 20% or more of pitch-based carbon fibers in terms of fiber volume content, and the pitch-based carbon fibers have a thermal conductivity of 100 W/mK or more of reinforcing fibers and 400 GPa or more The tensile modulus of elasticity.

根據上述本發明之另一實施態樣，上述纖維強化樹脂材料之強化纖維係瀝青系碳纖維、PAN(polyacrylonitrile，聚丙烯腈)系碳纖維或玻璃纖維或者將上述纖維混合2種以上而成者。 According to another embodiment of the present invention described above, the reinforcing fibers of the fiber-reinforced resin material are pitch-based carbon fibers, PAN (polyacrylonitrile, polyacrylonitrile)-based carbon fibers, or glass fibers, or a mixture of two or more of the foregoing fibers.

根據上述第1及第2本發明之另一實施態樣，上述纖維強化樹脂材料係將連續之上述強化纖維沿一方向拉齊並含浸樹脂而形成，及/或於至少沿2軸方向所織成之織物含浸樹脂而形成。 According to another embodiment of the first and second inventions described above, the fiber-reinforced resin material is formed by straightening the continuous reinforcing fibers in one direction and impregnating the resin, and/or woven in at least two-axis directions The finished fabric is formed by impregnating resin.

根據上述第1及第2本發明之另一實施態樣，上述纖維強化樹脂材料係將連續之上述強化纖維沿一方向拉齊並含浸樹脂而形成之片 材，至少於2軸方向上積層進行製作。 According to another embodiment of the first and second inventions described above, the fiber-reinforced resin material is a sheet formed by continuously aligning the reinforcing fibers in one direction and impregnating the resin, at least in the 2-axis direction Make.

根據上述第1及第2本發明之另一實施態樣，上述金屬箔層由具有50W/mK以上之導熱率之金屬製作。 According to another embodiment of the first and second inventions described above, the metal foil layer is made of a metal having a thermal conductivity of 50 W/mK or more.

根據上述本發明之另一實施態樣，上述導熱性複合材料之厚度為0.12~0.5mm。 According to another embodiment of the present invention, the thickness of the thermally conductive composite material is 0.12 to 0.5 mm.

根據本發明之第三態樣，提供一種於纖維強化樹脂材料之兩面一體化有金屬箔層的導熱性複合材料之製造方法，該導熱性複合材料具有含連續之強化纖維的片狀纖維強化樹脂材料及一體接合於上述纖維強化樹脂材料之兩面的金屬箔層，該導熱性複合材料之厚度被設為0.07~1mm、拉伸彈性模數為80GPa以上，其特徵在於：(a)準備將連續之強化纖維至少沿一方向拉齊排列並含浸樹脂進行半硬化之纖維單位面積重量被設為25~600g/m2、纖維體積含有率被設為20~70%之至少1片預浸體片，及厚度被設為0.009~0.1mm之金屬箔，(b)將上述金屬箔按壓至上述預浸體片之兩面而一體地積層，(c)其後，將上述預浸體片硬化而製成纖維強化樹脂材料。 According to a third aspect of the present invention, there is provided a method for manufacturing a thermally conductive composite material having a metal foil layer integrated on both sides of a fiber-reinforced resin material, the thermally conductive composite material having a sheet-shaped fiber-reinforced resin containing continuous reinforcing fibers The material and the metal foil layers integrally bonded to the two surfaces of the fiber-reinforced resin material, the thickness of the thermally conductive composite material is set to 0.07~1mm, the tensile modulus of elasticity is 80GPa or more, characterized by: (a) ready to be continuous At least one prepreg sheet whose reinforcing fibers are aligned in at least one direction and impregnated with resin for semi-hardening is set to have a basis weight of 25 to 600 g/m 2 and a fiber volume content of 20 to 70% , And a metal foil with a thickness of 0.009 to 0.1 mm, (b) pressing the metal foil on both sides of the prepreg sheet to integrally laminate, (c) thereafter, hardening the prepreg sheet to produce Fiber-reinforced resin material.

根據本發明之第四態樣，提供一種於金屬箔層之兩面一體化有纖維強化樹脂材料的導熱性複合材料之製造方法，該導熱性複合材料具有金屬箔層及一體接合於上述金屬箔層的兩面之含連續之強化纖維的片狀纖維強化樹脂材料，該導熱性複合材料之厚度被設為0.12~1mm，拉伸彈性模數為80GPa以上，其特徵在於：(a)準備將連續之強化纖維至少沿一方向拉齊排列並含浸樹脂進行半硬化之纖維單位面積重量被設為25~600g/m2、纖維體積含有率被設為20 ~70%之至少1片預浸體片、及厚度被設為0.009~0.1mm之金屬箔，(b)將上述預浸體片按壓至上述金屬箔之兩面而一體地積層，(c)其後，將上述預浸體片硬化而製成纖維強化樹脂材料。 According to a fourth aspect of the present invention, there is provided a method for manufacturing a thermally conductive composite material having fiber-reinforced resin materials integrated on both sides of a metal foil layer, the thermally conductive composite material having a metal foil layer and integrally joined to the metal foil layer The sheet-like fiber-reinforced resin material with continuous reinforcing fibers on both sides of the At least one prepreg sheet with reinforcing fibers aligned in at least one direction and impregnated with resin for semi-hardening, with a basis weight of 25 to 600 g/m 2 and a fiber volume content of 20 to 70% And a metal foil with a thickness of 0.009 to 0.1 mm, (b) pressing the prepreg sheet to both sides of the metal foil to integrally laminate, (c) thereafter, curing the prepreg sheet to produce Fiber reinforced resin material.

根據本發明，具備高剛性與散熱性，僅藉由貼附於被補強體便可防止因被補強體之外力所導致之變形而防止裝置內部損壞，且不形成熱斑便可進行擴散。 According to the present invention, it has high rigidity and heat dissipation, and only by attaching to the reinforced body can prevent deformation caused by external force of the reinforced body and prevent internal damage to the device, and can spread without forming hot spots.

1‧‧‧導熱性複合材料 1‧‧‧ Thermal conductive composite material

2‧‧‧纖維強化樹脂材料 2‧‧‧ fiber reinforced resin material

3‧‧‧金屬箔層 3‧‧‧Metal foil layer

10‧‧‧纖維強化片材 10‧‧‧ fiber reinforced sheet

10PG‧‧‧預浸體片 10PG‧‧‧Prepreg

101‧‧‧被補強體 101‧‧‧ Reinforced

圖1係表示智慧型手機之概略構成的立體圖，表示利用本發明之導熱性複合材料補強智慧型手機之殼體或者殼體箱之態樣。 FIG. 1 is a perspective view showing a schematic configuration of a smartphone, showing how the thermally conductive composite material of the present invention is used to reinforce the case or case of the smartphone.

圖2(a)係製成為由本發明之導熱性複合材料所補強之被補強體的智慧型手機之殼體或者殼體箱的概略構成剖面圖，圖2(b)係本發明之導熱性複合材料之一實施例的概略構成放大剖面圖。又，圖2(c)係本發明之導熱性複合材料之另一實施例的概略構成放大剖面圖。 2(a) is a schematic cross-sectional view of a casing or case of a smartphone made of a reinforced body reinforced by the thermally conductive composite material of the present invention, and FIG. 2(b) is a thermally conductive composite of the present invention An enlarged cross-sectional view of a schematic configuration of an embodiment of a material. 2 (c) is an enlarged cross-sectional view of a schematic configuration of another embodiment of the thermally conductive composite material of the present invention.

圖3(a)係表示接合金屬箔層之前的預浸體片(纖維強化樹脂材料)、強化纖維片材之一實施例的立體圖，圖3(b)係說明預浸體片之積層態樣之一例的圖。 FIG. 3(a) is a perspective view showing an embodiment of a prepreg sheet (fiber-reinforced resin material) and a reinforced fiber sheet before joining a metal foil layer, and FIG. 3(b) is a diagram illustrating a laminated state of the prepreg sheet An example of the figure.

圖4(a)、(b)係說明本發明之導熱性複合材料之製造方法的概略構成圖。 4(a) and (b) are schematic configuration diagrams illustrating a method of manufacturing the thermally conductive composite material of the present invention.

圖5(a)及圖5(b)分別係用以說明導熱性複合材料之試驗樣本之尺寸形狀的俯視圖及剖面圖，圖5(c)係用以測試試驗樣本之散熱性之溫度測量方法的圖。 5(a) and 5(b) are a top view and a cross-sectional view for explaining the size and shape of a test sample of a thermally conductive composite material, and FIG. 5(c) is a temperature measurement method for testing the heat dissipation of the test sample Figure.

以下，根據圖式對本發明之導熱性複合材料進而詳細地進行說明。 Hereinafter, the thermally conductive composite material of the present invention will be described in further detail based on the drawings.

實施例1 Example 1

如上述般，圖1表示智慧型手機100之概略構成，表示藉由以本發明之導熱性複合材料1所形成之補強板來補強智慧型手機100之殼體或者殼體箱(即被補強體)101的底板部分101a之態樣。 As described above, FIG. 1 shows a schematic configuration of the smartphone 100, and shows that the case or case of the smartphone 100 is reinforced by the reinforcing plate formed by the thermally conductive composite material 1 of the present invention (that is, the reinforced body ) 101 of the bottom plate portion 101a.

圖2(a)係表示製成由本發明之導熱性複合材料1所補強之被補強體的智慧型手機之殼體或者殼體箱101之概略構成的剖面圖，圖2(b)係本發明之導熱性複合材料1之一實施例的概略構成放大剖面圖。再者，與圖1不同，於圖2(a)中被補強體101之底板部分101a位於上方而被圖示。圖2(c)係其後作為實施例2進行說明的本發明之導熱性複合材料1之另一實施例的概略構成放大剖面圖。 2(a) is a cross-sectional view showing a schematic configuration of a case or case 101 of a smartphone made of a reinforced body reinforced by the thermally conductive composite material 1 of the present invention, and FIG. 2(b) is the present invention An enlarged cross-sectional view of the schematic configuration of an embodiment of the thermally conductive composite material 1. Furthermore, unlike FIG. 1, the bottom plate portion 101 a of the reinforced body 101 in FIG. 2( a) is shown above. FIG. 2(c) is an enlarged cross-sectional view of a schematic configuration of another embodiment of the thermally conductive composite material 1 of the present invention which will be described later as Embodiment 2. FIG.

首先，若參照圖2(b)，則於本實施例中，本發明之導熱性複合材料1具有含連續之強化纖維的片狀纖維強化樹脂材料2及一體接合於該纖維強化樹脂材料2之兩面的金屬箔層3(3a、3b)。根據本發明，若亦參照圖3，則藉由導熱性複合材料1之熱擴散，基本而言，係藉由纖維強化樹脂材料2及金屬箔層3而實現纖維強化樹脂材料2之強化纖維f的纖維軸方向(圖3中為X-X方向)之熱擴散，與強化纖維f之纖維軸方向交叉(正交)的方向(圖3中為Y-Y方向)之熱擴散由金屬箔層3進行。 First, referring to FIG. 2(b), in the present embodiment, the thermally conductive composite material 1 of the present invention has a sheet-shaped fiber-reinforced resin material 2 containing continuous reinforcing fibers and an integrally bonded fiber-reinforced resin material 2 Metal foil layers 3 (3a, 3b) on both sides. According to the present invention, referring also to FIG. 3, the thermal diffusion of the thermally conductive composite material 1 is basically achieved by the fiber-reinforced resin material 2 and the metal foil layer 3 to realize the reinforcing fiber f of the fiber-reinforced resin material 2 The heat diffusion in the fiber axis direction (XX direction in FIG. 3) and the heat diffusion in the direction crossing (orthogonal) with the fiber axis direction of the reinforcing fiber f (in FIG. 3 YY direction) are performed by the metal foil layer 3.

又，導熱性複合材料1所需之散熱性藉由導熱性複合材料1 及各構成構件2、3之厚度設計而達成。即，於本發明中，導熱性複合材料1之厚度方向(圖3中為Z-Z方向)的導熱藉由如下之構成而達成：相對於纖維強化樹脂材料2的強化纖維f正交之方向(圖3中為Y-Y方向)的導熱率之不良難以產生影響之最佳纖維強化樹脂材料2與金屬箔層3之構成。 In addition, the heat dissipation required by the thermally conductive composite material 1 is achieved by the thickness design of the thermally conductive composite material 1 and each constituent member 2 and 3. That is, in the present invention, the heat conduction in the thickness direction of the thermally conductive composite material 1 (the ZZ direction in FIG. 3) is achieved by the following configuration: the direction orthogonal to the reinforcing fiber f of the fiber-reinforced resin material 2 (FIG. (3: YY direction) The structure of the optimal fiber-reinforced resin material 2 and the metal foil layer 3, which is difficult to affect the poor thermal conductivity.

即，若參照表示本發明之一實施例之圖2(b)，則將導熱性複合材料1之厚度(T1)設為1mm以下，通常設為0.07~1mm(0.07mm≦T1≦1mm)。若厚度(T1)超過1mm，則如本實施例般，於將導熱性複合材料1用作作為被補強體之例如智慧型手機的殼體(或者殼體箱)101之補強板之情形時，會過度佔有被補強體101之內空間，為了收容智慧型手機之主要構件，作為被補強體101之智慧型手機之殼體等必然會增大，總重量亦增大，而有損小型化、輕量化。又，若將厚度(T1)設為未達0.07mm，則難以達成本發明目標之作為補強板的高剛性，又，纖維強化樹脂材料2、金屬箔層3會變得極薄而無法利用現有之原材料製作，導致成本增高。較佳將導熱性複合材料1之厚度(T1)設為0.12~0.5mm。 That is, referring to FIG. 2(b) showing an embodiment of the present invention, the thickness (T1) of the thermally conductive composite material 1 is set to 1 mm or less, and is usually set to 0.07 to 1 mm (0.07 mm≦T1≦1 mm). If the thickness (T1) exceeds 1 mm, as in this embodiment, when the thermally conductive composite material 1 is used as a reinforcing plate of a case (or case box) 101 of a smartphone, for example, It will over-occupy the inner space of the reinforced body 101. In order to accommodate the main components of the smartphone, the case of the smartphone as the reinforced body 101 will inevitably increase, and the total weight will also increase, which will damage the miniaturization, Lightweight. Moreover, if the thickness (T1) is less than 0.07 mm, it is difficult to achieve the high rigidity of the reinforcing plate, which is the object of the invention, and the fiber-reinforced resin material 2 and the metal foil layer 3 become extremely thin, making it impossible to use the existing The production of raw materials leads to higher costs. Preferably, the thickness (T1) of the thermally conductive composite material 1 is set to 0.12 to 0.5 mm.

又，根據本發明者等人之實驗研究的結果，可知關於導熱性複合材料1，為了獲得所需之拉伸剛性(拉伸彈性模數×截面面積)而需要將拉伸彈性模數設定為至少大於鋁之拉伸彈性模數(70GPa)的80GPa以上。若拉伸彈性模數未達80GPa，則無法獲得用以補強之充分剛性。 In addition, according to the results of experimental studies by the present inventors and others, it is known that the thermally conductive composite material 1 needs to be set to the tensile elastic modulus in order to obtain the required tensile rigidity (tensile elastic modulus×cross-sectional area). At least 80GPa greater than the tensile modulus of elasticity (70GPa) of aluminum. If the tensile elastic modulus does not reach 80 GPa, sufficient rigidity for reinforcement cannot be obtained.

以下，對本發明之導熱性複合材料1之各構成構件進而詳細地進行說明。 Hereinafter, each constituent member of the thermally conductive composite material 1 of the present invention will be described in further detail.

(纖維強化樹脂材料) (Fiber reinforced resin material)

片狀纖維強化樹脂材料2之厚度(t2)被設為0.05mm以上 未達1mm(0.05mm≦t2<1mm)，若厚度(t2)為1mm以上，則存在導致散熱性惡化之問題，若厚度(t2)未達0.05mm，則難以達成作為補強板之高剛性，又，纖維強化樹脂材料2變得極薄而無法利用現有之原材料製作，導致成本增高等問題。較佳將纖維強化樹脂材料2之厚度(t2)設為0.1~0.46mm。 The thickness (t2) of the sheet-like fiber-reinforced resin material 2 is set to 0.05 mm or more but less than 1 mm (0.05 mm≦t2<1 mm). If the thickness (t2) is 1 mm or more, there is a problem that the heat dissipation is deteriorated. (t2) Less than 0.05 mm, it is difficult to achieve high rigidity as a reinforcing plate, and the fiber-reinforced resin material 2 becomes extremely thin and cannot be manufactured using existing raw materials, resulting in problems such as increased cost. The thickness (t2) of the fiber-reinforced resin material 2 is preferably set to 0.1 to 0.46 mm.

將纖維強化樹脂材料2製成以纖維體積含有率(Vf)計含有20%以上之瀝青系碳纖維的纖維強化複合材料，該瀝青系碳纖維之導熱率設為100W/mK以上、拉伸彈性模數設為400GPa以上。詳細內容於下文中進行敍述，於本發明中，將纖維體積含有率(Vf)設為20~70%，較佳設為40~65%。即根據本實施例，於使用瀝青系碳纖維之情形時，纖維體積含有率20%之纖維強化樹脂材料2的拉伸彈性模數設為400GPa×纖維體積含有率(Vf)20%=80GPa。即，現狀為於纖維強化樹脂材料2使用瀝青系碳纖維作為強化纖維之情形時獲得最大之導熱率(散熱性)及剛性。藉由使用此構成之纖維強化樹脂材料2，可獲得根據本發明之拉伸彈性模數設為80GPa以上的導熱性複合材料1。 The fiber-reinforced resin material 2 is made into a fiber-reinforced composite material containing 20% or more pitch-based carbon fibers in terms of fiber volume content (Vf). The pitch-based carbon fibers have a thermal conductivity of 100 W/mK or more and a tensile modulus of elasticity. Set to 400GPa or more. The details will be described below. In the present invention, the fiber volume content (Vf) is set to 20 to 70%, preferably 40 to 65%. That is, according to the present embodiment, when pitch-based carbon fibers are used, the tensile modulus of elasticity of the fiber-reinforced resin material 2 with a fiber volume content rate of 20% is 400 GPa×fiber volume content rate (Vf) 20%=80 GPa. That is, the current situation is to obtain the maximum thermal conductivity (heat dissipation) and rigidity when the fiber-reinforced resin material 2 uses pitch-based carbon fiber as the reinforcing fiber. By using the fiber-reinforced resin material 2 of this configuration, the thermally conductive composite material 1 having a tensile elastic modulus of 80 GPa or more according to the present invention can be obtained.

纖維強化樹脂材料2係將樹脂R含浸於連續之強化纖維f中進行製作，作為強化纖維f，可最佳地使用碳纖維，尤其如上述般，較佳為瀝青系碳纖維。根據所要求之補強板、即導熱性複合材料1之規格，亦可使用於拉伸彈性模數及導熱率之方面劣於瀝青系碳纖維之PAN系碳纖維。又，根據情形，除使用碳纖維以外，亦可使用於拉伸彈性模數及導熱率之方面更劣於碳纖維之玻璃纖維。當然，亦可將該等纖維混合而使用。 The fiber-reinforced resin material 2 is produced by impregnating the resin R with continuous reinforcing fibers f. As the reinforcing fibers f, carbon fibers can be used optimally, and in particular, as described above, pitch-based carbon fibers are preferred. According to the required specifications of the reinforcing plate, that is, the thermally conductive composite material 1, PAN-based carbon fibers that are inferior to pitch-based carbon fibers in terms of tensile elastic modulus and thermal conductivity can also be used. In addition, depending on the situation, in addition to the use of carbon fibers, glass fibers that are inferior to carbon fibers in terms of tensile modulus of elasticity and thermal conductivity can also be used. Of course, these fibers can also be mixed and used.

此處，若表示可於本發明中使用之強化纖維之拉伸彈性模數 及導熱率，則如表1所示。 Here, the tensile elastic modulus and thermal conductivity of the reinforcing fiber that can be used in the present invention are shown in Table 1.

Figure 107140837-A0101-12-0010-1
Figure 107140837-A0101-12-0010-1

又，可於本發明中使用之纖維強化樹脂材料2如圖3(a)所示，係使用如下方法製成之預浸體片10PG而製作：將樹脂R含浸於將沿纖維軸方向連續之上述般的強化纖維f沿一方向拉齊而構成為片狀之強化纖維片材10S中，並使之半硬化(B階段化)而成。 In addition, as shown in FIG. 3(a), the fiber-reinforced resin material 2 that can be used in the present invention is produced by using a prepreg sheet 10PG made by the following method: impregnating the resin R in a continuous direction along the fiber axis direction The reinforcing fibers f as described above are aligned in one direction to form a sheet-shaped reinforcing fiber sheet 10S, and are semi-hardened (B-staged).

較佳使用預浸體片10PG之纖維單位面積重量為25~600g/m2者，碳纖維之纖維體積含有率(Vf)如上述般設為20%以上。可視需要將預浸體片10PG積層複數片而使用。該預浸體片10PG於硬化後，如上述般形成厚度(t2)為0.05mm以上且未達1mm、較佳為0.1~0.46mm之纖維強化樹脂材料2。 Preferably, the prepreg sheet 10PG has a fiber basis weight of 25 to 600 g/m 2 and the carbon fiber fiber volume content (Vf) is set to 20% or more as described above. A plurality of prepreg sheets 10PG may be stacked and used as necessary. After the prepreg sheet 10PG is hardened, as described above, the fiber-reinforced resin material 2 having a thickness (t2) of 0.05 mm or more and less than 1 mm, preferably 0.1 to 0.46 mm is formed.

於上述說明中，作為將強化纖維f沿一方向拉齊而製作之UD形狀者進行了說明，亦可視需要以強化纖維f相互交叉之方式積層複數片預浸體片10PG而使用。即，可以沿強化纖維f之方向至少2軸方向、根據情形沿3軸、4軸方向配向之方式，積層將強化纖維f沿一方向拉齊所製作之UD形狀之預浸體片10PG而製作。例如，如圖3(b)所示，可將3片強化纖維f於0°方向上配向之預浸體片10PG(0°)、強化纖維f於90°方向上配向之預浸體片10PG(90°)及強化纖維f於0°方向上配向之預浸體片10PG (0°)積層而製作。進而，雖未圖示，但亦可設為使用強化纖維f於+45°方向上配向之預浸體片10PG(+45°)與強化纖維f於-45°方向上配向之預浸體片10PG(-45°)代替上述強化纖維f於90°方向上配向之預浸體片10PG(90°)之3軸構成，或者亦可設為使用上述強化纖維f於90°方向上配向之預浸體片10PG(90°)以外，進而使用強化纖維f於+45°方向上配向之預浸體片10PG(+45°)與強化纖維f於-45°方向上配向之預浸體片10PG(-45°)之4軸構成。 In the above description, the UD shape prepared by straightening the reinforcing fibers f in one direction has been described, and a plurality of prepreg sheets 10PG may be stacked as necessary so that the reinforcing fibers f cross each other. That is, a UD-shaped prepreg sheet 10PG produced by aligning the reinforcing fibers f in one direction by stacking the reinforcing fibers f in one direction can be produced by aligning the reinforcing fibers f in at least the 2-axis direction and, optionally, in the 3-axis and 4-axis directions. . For example, as shown in FIG. 3(b), three prepreg sheets 10PG (0°) in which the reinforcing fibers f are oriented in the direction of 0°, and a prepreg sheet 10PG in which the reinforcing fibers f are oriented in the direction of 90° can be The prepreg sheet 10PG (0°) with (90°) and reinforcing fibers f oriented in the direction of 0° is laminated. Furthermore, although not shown, a prepreg sheet 10PG (+45°) using reinforcing fibers f oriented in the +45° direction and a prepreg sheet using reinforcing fibers f oriented in the -45° direction may also be used 10PG (-45°) replaces the three-axis configuration of the prepreg sheet 10PG (90°) in which the reinforcing fiber f is aligned in the direction of 90°, or it may be a pre-alignment using the reinforcing fiber f in the direction of 90° In addition to the immersion sheet 10PG (90°), a prepreg sheet 10PG (+45°) with reinforcing fibers f oriented in the +45° direction and a prepreg sheet 10PG with reinforcing fibers f oriented in the -45° direction (-45°) 4-axis configuration.

進而，強化纖維片材10S亦可視需要製成為將1種或者多種強化纖維f織成而形成之例如平紋織物、斜紋織物、緞紋織物等織物(布)。進而，亦可將上述UD形狀者與布併用。 Furthermore, the reinforcing fiber sheet 10S may be made into a fabric (cloth) such as a plain weave fabric, a twill fabric, or a satin fabric, which is formed by weaving one or more kinds of reinforcing fibers f, if necessary. Furthermore, the above-mentioned UD shape can also be used together with cloth.

作為含浸樹脂(矩陣樹脂)R，較佳使用環氧樹脂、乙烯酯樹脂、MMA樹脂、不飽和聚酯樹脂或酚樹脂中之任一者。 As the impregnating resin (matrix resin) R, any one of epoxy resin, vinyl ester resin, MMA resin, unsaturated polyester resin or phenol resin is preferably used.

纖維強化樹脂材料2中之強化纖維f如上述般，例如於使用瀝青系碳纖維之情形時，重要的是以纖維體積含有率(Vf)計含有20%以上。通常設為20~70%。若強化纖維f之纖維體積含有率(Vf)未達20%，則存在纖維量少而無法獲得所需之剛性及散熱性之問題，若超過70%，則會產生樹脂不足而無法獲得原本之機械物性等問題。較佳將纖維體積含有率(Vf)設為40~65%之範圍。 The reinforcing fibers f in the fiber-reinforced resin material 2 are as described above. For example, when pitch-based carbon fibers are used, it is important to contain 20% or more in terms of fiber volume content (Vf). Usually set to 20~70%. If the fiber volume content (Vf) of the reinforced fiber f is less than 20%, there is a problem that the amount of fiber is small and the required rigidity and heat dissipation cannot be obtained. If it exceeds 70%, the resin will be insufficient to obtain the original Problems with mechanical properties. The fiber volume content (Vf) is preferably in the range of 40 to 65%.

(金屬箔層) (Metal foil layer)

金屬箔層3(3a、3b)係由鋁或者銅般具有200W/mK以上之導熱率的金屬製作。根據所要求之散熱性之程度，亦可使用劣於該等金屬材料之具有50~200W/mK的導熱率之例如鐵或鎳或黃銅等。進而，亦可由具有50~200W/mK之例如鋁合金等上述各金屬之合金製作。金屬箔 層3a、3b亦可根據導熱性複合材料1之形狀而設為相同之金屬，亦可設為不同之金屬。 The metal foil layer 3 (3a, 3b) is made of metal having a thermal conductivity of 200 W/mK or more like aluminum or copper. Depending on the degree of heat dissipation required, it is also possible to use inferior metal materials such as iron or nickel or brass with a thermal conductivity of 50 to 200 W/mK. Furthermore, it can also be made from alloys of the above metals, such as aluminum alloys, having 50 to 200 W/mK. The metal foil layers 3a and 3b may be the same metal according to the shape of the thermally conductive composite material 1, or may be different metals.

又，金屬箔層3(3a、3b)之厚度(t3a、t3b)分別設為0.009~0.1mm(0.009mm≦t3a、t3b≦0.1mm)，若厚度(t3a、t3b)超過0.1mm，則金屬箔層3(3a、3b)之厚度(t3a、t3b)過厚，不會產生纖維強化樹脂材料2之拉伸彈性模數，從而於剛性之方面不利。又，由於通常金屬箔層3之密度高於纖維強化樹脂材料2，故隨著厚度(t3a、t3b)之增加，導熱性複合材料1之重量會增加。若厚度(t3a、t3b)未達0.009mm，則會產生無法利用現有之原材料製作而導致成本增高之問題。進而，由於材料過薄而會折彎或破損等，操作變得非常困難。較佳金屬箔層3(3a、3b)之厚度(t3a、t3b)分別為0.01~0.05mm。再者，根據導熱性複合材料1之形狀，金屬箔層3a、3b之厚度(t3a、t3b)可相同，又，亦可不同。 In addition, the thickness (t3a, t3b) of the metal foil layer 3 (3a, 3b) is set to 0.009~0.1mm (0.009mm≦t3a, t3b≦0.1mm), if the thickness (t3a, t3b) exceeds 0.1mm, the metal If the thickness (t3a, t3b) of the foil layer 3 (3a, 3b) is too thick, the tensile elastic modulus of the fiber-reinforced resin material 2 will not be generated, which is disadvantageous in terms of rigidity. In addition, since the density of the metal foil layer 3 is generally higher than that of the fiber-reinforced resin material 2, as the thickness (t3a, t3b) increases, the weight of the thermally conductive composite material 1 increases. If the thickness (t3a, t3b) is less than 0.009mm, there will be a problem that the existing raw materials cannot be used to make it, resulting in increased costs. Furthermore, because the material is too thin, it may bend or break, and the operation becomes very difficult. Preferably, the thickness (t3a, t3b) of the metal foil layer 3 (3a, 3b) is 0.01~0.05mm, respectively. Furthermore, depending on the shape of the thermally conductive composite material 1, the thickness (t3a, t3b) of the metal foil layers 3a, 3b may be the same or different.

(製造方法) (Manufacturing method)

根據本發明，金屬箔層3(3a、3b)必需相對於纖維強化樹脂材料2一體成型。即，例如圖4(a)所示，將金屬箔層3(3a、3b)按壓至對強化纖維片材10S含浸樹脂R，尚未完全硬化之所謂預浸體片10PG的兩面並一體積層，視需要進行加熱而將樹脂R硬化。 According to the present invention, the metal foil layer 3 (3a, 3b) must be integrally formed with the fiber-reinforced resin material 2. That is, as shown in FIG. 4(a), for example, the metal foil layer 3 (3a, 3b) is pressed until the reinforcing fiber sheet 10S is impregnated with the resin R, and both sides of the so-called prepreg sheet 10PG that has not been completely hardened are combined into a volume layer. Heating is required to harden the resin R.

若於後接著，即使用接著劑將金屬箔層3(3a、3b)接著於預浸體片材10PG之含浸樹脂R完全硬化、即纖維強化樹脂材料2而製成一體之情形時，則擔心根據接著劑之厚度而接著層散熱性或剛性降低。又，難以進行金屬箔層3之接著前基底處理或確保接著劑塗佈量之均勻性，或者接著前基底處理自身繁雜。進而另外產生貼附之步驟而隨之成本增高。 If the metal foil layer 3 (3a, 3b) is adhered to the prepreg sheet 10PG with the impregnating resin R completely cured, that is, the fiber-reinforced resin material 2 is integrated, then there is concern The heat dissipation or rigidity of the adhesive layer decreases according to the thickness of the adhesive. In addition, it is difficult to perform the pre-substrate treatment of the metal foil layer 3 or to ensure the uniformity of the amount of adhesive applied, or the pre-substrate treatment itself is complicated. In addition, there is a step of attaching and the cost increases accordingly.

(補強方法) (Reinforcement method)

如上述般製作之導熱性複合材料1例如係一體接合於智慧型手機殼體或者殼體箱(被補強體)101等(參照圖1)。 The thermally conductive composite material 1 produced as described above, for example, is integrally joined to a smartphone case or case box (reinforced body) 101, etc. (see FIG. 1 ).

為了簡便地進行作業而準備治具等，例如，藉由接著劑、視情形藉由雙面膠帶等而一體接合於成為預先成型之殼體箱或外殼的頂面部之頂板等。於該情形時，藉由適當設定接著劑之厚度、材質而不會產生散熱性或剛性之降低。又，亦可藉由於智慧型手機殼體或者殼體箱101之成形時設置於成型模具，同時進行壓製成型而一體接合於被補強體101。 In order to easily perform the operation, a jig and the like are prepared, for example, by a bonding agent, a double-sided tape, etc., as the case may be, integrally joined to a top plate that becomes a top surface portion of a pre-molded case or shell. In this case, by appropriately setting the thickness and material of the adhesive, there is no reduction in heat dissipation or rigidity. In addition, it can also be integrally joined to the to-be-reinforced body 101 by being provided in a molding die at the time of molding of the smartphone casing or the casing 101 and performing compression molding at the same time.

作為如上述般獲得之纖維強化塑膠製品之被補強體101，如上述般由其厚度(T1)設為0.07~1mm、拉伸彈性模數設為80GPa以上之具備高剛性與散熱性的補強體(即導熱性複合材料1)所補強，藉此，可有效地防止因外力導致之變形而防止裝置內部損壞，且不形成因收容於裝置內部的放熱源所引起之熱斑而可進行擴散。 As the to-be-reinforced body 101 of the fiber-reinforced plastic product obtained as described above, as described above, the reinforced body having high rigidity and heat dissipation whose thickness (T1) is set to 0.07 to 1 mm and tensile elastic modulus is set to 80 GPa or more (That is, the thermally conductive composite material 1) is reinforced, thereby effectively preventing deformation caused by external force and preventing damage to the inside of the device, and without forming a hot spot caused by a heat source contained inside the device and allowing diffusion.

(實驗例之說明) (Explanation of experimental example)

繼而，為了證實本發明之導熱性複合材料1之作用效果，而製作各種試驗樣本，並對機械強度、散熱性進行性能試驗。於表2、表4中表示於本實驗例中使用之試驗樣本的材料、構成、各尺寸等，於表3、表5中表示試驗結果。 Then, in order to confirm the effect of the thermally conductive composite material 1 of the present invention, various test samples were prepared, and performance tests were conducted on mechanical strength and heat dissipation. Tables 2 and 4 show the materials, composition, and dimensions of the test samples used in this experimental example, and Tables 3 and 5 show the test results.

(1)實驗例1~4 (1) Experimental examples 1~4

(試驗樣本) (Test sample)

於實驗例1中，使用薄板狀之鋁(A5052)單質(金屬單質)。於實驗例2中，使用於瀝青系碳纖維之布(織物)中含浸有樹脂之碳纖維 強化樹脂(CFRP布)。於實驗例3中，使用於玻璃纖維之布(織物)中含浸有樹脂之玻璃纖維強化樹脂(GFRP布)及於將瀝青系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂的碳纖維強化樹脂(CFRP單向)疊合之玻璃-碳纖維接合複合材料(GFRP布-CFRP單向)。於實驗例4中，根據本發明之構成，使用以如下方法製作而成之纖維強化複合材料(金屬箔表層-CFRP單向芯)：將銅箔一體成型於將瀝青系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂之碳纖維強化樹脂(CFRP單向)的兩面。 In Experimental Example 1, a thin plate-shaped aluminum (A5052) element (metal element) was used. In Experimental Example 2, a carbon fiber reinforced resin (CFRP cloth) impregnated with resin in a pitch-based carbon fiber cloth (fabric) was used. In Experimental Example 3, a glass fiber reinforced resin (GFRP cloth) impregnated with resin in a glass fiber cloth (fabric) and a resin impregnated in a unidirectional carbon fiber sheet in which pitch-based carbon fibers are aligned in one direction Carbon fiber reinforced resin (CFRP unidirectional) laminated glass-carbon fiber bonded composite material (GFRP cloth-CFRP unidirectional). In Experimental Example 4, according to the configuration of the present invention, a fiber-reinforced composite material (metal foil surface layer-CFRP unidirectional core) produced by the following method was used: copper foil was integrally formed to align the pitch-based carbon fibers in one direction The unidirectional carbon fiber sheet is impregnated with carbon fiber reinforced resin (CFRP unidirectional) on both sides.

又，於實驗例2、3、4中使用之瀝青系碳纖維係使用單絲平均直徑9μm、收束條數3000條、6000條或12000條之纖維束，即瀝青系碳纖維股(日本Graphite Fiber股份有限公司製造(商品名：GRANOC XN-80)，並使環氧樹脂含浸於纖維中而獲得預浸體。 In addition, the pitch-based carbon fiber used in Experimental Examples 2, 3, and 4 used fiber bundles with an average filament diameter of 9 μm and a number of bundles of 3000, 6000, or 12000, that is, pitch-based carbon fiber strands (Graphite Fiber Co., Ltd., Japan Manufactured by Co., Ltd. (trade name: GRANOC XN-80), and impregnating fibers with epoxy resin to obtain a prepreg.

於實驗例3中使用之玻璃纖維布預浸體係使用三菱麗陽股份有限公司製造(商品名：GHO250-381IM)。纖維單位面積重量如表2所示。 The glass fiber cloth prepreg system used in Experimental Example 3 was manufactured by Mitsubishi Rayon Co., Ltd. (trade name: GHO250-381IM). The fiber basis weight is shown in Table 2.

於實驗例3中，於將玻璃纖維布預浸體與單向碳纖維片材預浸體疊合而製成一體後，進行加熱使樹脂硬化而製作試驗樣本。又，於實驗例4中，將銅箔按壓至單向碳纖維片材預浸體之兩面而積層為一體，並進行加熱使樹脂硬化，製作導熱性複合材料1。 In Experimental Example 3, after the glass fiber cloth prepreg and the unidirectional carbon fiber sheet prepreg were laminated to be integrated, heating was performed to harden the resin to prepare a test sample. Furthermore, in Experimental Example 4, copper foil was pressed against both surfaces of the unidirectional carbon fiber sheet prepreg to be laminated as a whole, and the resin was cured by heating to produce a thermally conductive composite material 1.

所使用之鋁、銅、玻璃纖維、瀝青系碳纖維之機械特性及導熱率如下所述。 The mechanical properties and thermal conductivity of the aluminum, copper, glass fiber, and pitch-based carbon fiber used are as follows.

鋁(A5052)：拉伸彈性模數：70GPa導熱率：138W/mK Aluminum (A5052): Tensile elastic modulus: 70GPa Thermal conductivity: 138W/mK

銅：拉伸彈性模數：110~130GPa 導熱率：398W/mK Copper: Tensile elastic modulus: 110~130GPa Thermal conductivity: 398W/mK

玻璃纖維：拉伸彈性模數：70GPa導熱率：0.5W/mK Glass fiber: Tensile elastic modulus: 70GPa Thermal conductivity: 0.5W/mK

瀝青系碳纖維：拉伸彈性模數：780GPa導熱率：320W/mK Asphalt carbon fiber: Tensile elastic modulus: 780GPa Thermal conductivity: 320W/mK

於實驗例1~4中使用之試驗樣本S如圖5(a)、(b)所示般將長度×寬度設為100mm×50mm，各樣本S之厚度尺寸(總厚度T1，金屬箔層厚t3，纖維強化樹脂材料厚度t2)如表2所示。 As shown in Figs. 5(a) and (b), the test sample S used in Experimental Examples 1 to 4 has a length × width of 100 mm × 50 mm, and the thickness dimension of each sample S (total thickness T1, metal foil layer thickness) t3, the thickness t2 of the fiber-reinforced resin material is shown in Table 2.

(散熱性) (Heat dissipation)

各試驗樣本S之散熱性係如下述般進行測量。 The heat dissipation of each test sample S was measured as follows.

如圖5(c)所示，於試驗樣本、即試驗片S之長邊方向一端(圖5(c)中為左側端)之寬度方向中央部設置加熱器(H)，並利用溫度感測器(TS)對試驗片之至少加熱器設置位置及與設置有加熱器(H)之側為相反側(圖5(c)中為右側端)的溫度測量點進行測量。測量溫度試驗開始時與達到平衡狀態時之溫度。根據溫度測量之結果的散熱性之判斷如下所述。即，若加熱器正下方之點的溫度高，則判斷為溫度未分散至周圍，因此散熱性差。又，於遠離加熱器之試驗片的另一端(圖5(c)中為右側端)之測量點的溫度上升之情形時，判斷為熱量分散至較遠處，因此散熱性良好。 As shown in FIG. 5(c), a heater (H) is provided at the center in the width direction of one end of the test sample S, ie, the long side of the test piece S (the left end in FIG. 5(c)), and temperature sensing is used The device (TS) measures at least the heater installation position of the test piece and the temperature measurement point on the opposite side to the side where the heater (H) is installed (the right end in FIG. 5(c)). Measure the temperature at the beginning of the temperature test and at the equilibrium state. The judgment of heat dissipation based on the result of temperature measurement is as follows. That is, if the temperature at the point directly below the heater is high, it is determined that the temperature is not dispersed to the surroundings, so the heat dissipation is poor. In addition, when the temperature of the measurement point at the other end (the right end in FIG. 5(c)) away from the heater test piece is increased, it is determined that the heat is dispersed farther, so the heat dissipation is good.

散熱性之測量結果如表3所示，實驗例1之樣本的加熱器正下方之溫度於實驗例1~4之中最低，可見熱量擴散至整體之跡象(◎：散熱性非常好)。實驗例2之樣本於實驗例1~4之中為第三，雖與實驗例1 之樣本同樣地熱量擴散至整體，但劣於實驗例1之樣本(△)。實驗例3之樣本之加熱器正下方的溫度於實驗例1~4之中最高，蓄熱而熱量僅沿一方向擴散(×：散熱性不良)。實驗例4之樣本之加熱器正下方的溫度於實驗例1~4之中第二低，可見熱量擴散至整體、熱量擴散至試驗樣本之端部的跡象(◎~○：散熱性良好)。 The measurement results of heat dissipation are shown in Table 3. The temperature directly under the heater of the sample of Experimental Example 1 is the lowest among Experimental Examples 1 to 4, and there are signs of heat spreading to the whole (◎: the heat dissipation is very good). The sample of Experimental Example 2 is the third among Experimental Examples 1 to 4. Although the heat is diffused to the whole as in the sample of Experimental Example 1, it is inferior to the sample of Experimental Example 1 (△). The temperature directly under the heater of the sample of Experimental Example 3 is the highest among Experimental Examples 1 to 4, storing heat and the heat spreads in only one direction (×: poor heat dissipation). The temperature directly under the heater of the sample of Experimental Example 4 was the second lowest among Experimental Examples 1 to 4, and there were signs that the heat spread to the whole and the heat spread to the end of the test sample (◎~○: good heat dissipation).

(拉伸彈性模數、拉伸剛性) (Tensile elastic modulus, tensile rigidity)

拉伸彈性模數(E)、拉伸剛性及重量係藉由計算而求出。拉伸剛性係樣本之拉伸彈性模數(E)與樣本之橫截面積(A)(於本實施例中，A=50mm×T1)之乘積。 The tensile modulus of elasticity (E), tensile rigidity, and weight are calculated by calculation. The tensile rigidity is the product of the tensile elastic modulus (E) of the sample and the cross-sectional area (A) of the sample (in this embodiment, A=50mm×T1).

拉伸彈性模數、拉伸剛性及重量之結果如表3所示。根據表3，藉由本發明而構成之實驗例4的試驗樣本於散熱性及剛性之方面優異，又，亦於重量之方面較實驗例1之鋁單質輕量。 The results of tensile elastic modulus, tensile rigidity and weight are shown in Table 3. According to Table 3, the test sample of Experimental Example 4 constituted by the present invention is excellent in heat dissipation and rigidity, and is also lighter in weight than the aluminum element in Experimental Example 1.

Figure 107140837-A0101-12-0016-2
Figure 107140837-A0101-12-0016-2

Figure 107140837-A0101-12-0017-3
Figure 107140837-A0101-12-0017-3

(2)實驗例5~9 (2) Experimental example 5~9

為了進一步證實本發明之導熱性複合材料1之作用效果，除先前敍述之實驗例1~4之外，變更導熱性複合材料1之厚度(T1)，且儘可能使厚度一致而進行性能試驗。如上述般，於表4中表示於本實驗例中使用之試驗樣本的材料、構成、各尺寸等，於表5中表示試驗結果。 In order to further confirm the function and effect of the thermally conductive composite material 1 of the present invention, in addition to the experimental examples 1 to 4 previously described, the thickness (T1) of the thermally conductive composite material 1 was changed, and the thickness was made as uniform as possible to perform a performance test. As described above, Table 4 shows the material, composition, dimensions, etc. of the test samples used in this experimental example, and Table 5 shows the test results.

(試驗樣本) (Test sample)

於實驗例5中，使用薄板狀之鋁A5052單質(金屬單質)。厚度設為0.48mm。於實驗例6中，使用將於將瀝青系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂之預浸體於X方向與Y方向上積層而獲得之碳纖維強化樹脂(CFRP單向0°/90°板)。於實驗例7中，根據本發明之構成，使用將銅箔一體成型於碳纖維強化樹脂之兩面進行製作而成的纖維強化複合材料(金屬箔表層-瀝青系CFRP單向0°/90°)，該碳纖維強化樹脂係將於將瀝青系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂之預 浸體於X方向與Y方向上積層而獲得。於實驗例8中，使用碳纖維強化樹脂(PAN系CFRP單向0°/90°板)，該碳纖維強化樹脂係將在使PAN系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂之預浸體於X方向與Y方向上積層而獲得。於實驗例9中，根據本發明之構成，使用將銅箔一體成型於碳纖維強化樹脂之兩面進行製作而成之纖維強化複合材料(金屬箔表層-PAN系CFRP單向0°/90°板)，該碳纖維強化樹脂係將在使PAN系碳纖維沿一方向拉齊之單向碳纖維片材中含浸樹脂之預浸體於X方向與Y方向上積層而獲得。 In Experimental Example 5, a thin plate-shaped aluminum A5052 element (metal element) was used. The thickness is set to 0.48 mm. In Experimental Example 6, a carbon fiber-reinforced resin (CFRP unidirectional) obtained by stacking a prepreg impregnated with resin in a unidirectional carbon fiber sheet in which pitch-based carbon fibers are aligned in one direction in the X and Y directions was used 0°/90° plate). In Experimental Example 7, according to the configuration of the present invention, a fiber-reinforced composite material (metal foil surface layer-asphalt-based CFRP unidirectional 0°/90°) produced by integrally molding copper foil on both surfaces of carbon fiber reinforced resin was used, The carbon fiber-reinforced resin is obtained by stacking prepregs impregnated with resin in a unidirectional carbon fiber sheet whose pitch-based carbon fibers are aligned in one direction in the X and Y directions. In Experimental Example 8, a carbon fiber reinforced resin (PAN-based CFRP unidirectional 0°/90° plate) was used. The carbon fiber-reinforced resin system impregnated the unidirectional carbon fiber sheet with the PAN-based carbon fibers aligned in one direction. The prepreg is obtained by stacking in the X direction and the Y direction. In Experimental Example 9, according to the configuration of the present invention, a fiber-reinforced composite material (metal foil surface layer-PAN-based CFRP unidirectional 0°/90° plate) produced by integrally molding copper foil on both sides of carbon fiber reinforced resin was used The carbon fiber-reinforced resin is obtained by stacking prepregs impregnated with resin in a unidirectional carbon fiber sheet in which PAN-based carbon fibers are aligned in one direction in the X and Y directions.

又，關於實驗例5~9中使用之瀝青系碳纖維、鋁、銅，使用各物性與實驗例1~4相同者。於實驗例8、9中使用之PAN系碳纖維係使用三菱麗陽股份有限公司製造(TR380G125等)。所使用之總纖維單位面積重量設為如表4所示。 In addition, regarding the pitch-based carbon fiber, aluminum, and copper used in Experimental Examples 5 to 9, the same physical properties as those of Experimental Examples 1 to 4 were used. The PAN-based carbon fiber used in Experimental Examples 8 and 9 was manufactured by Mitsubishi Rayon Co., Ltd. (TR380G125, etc.). The total fiber basis weight used was set as shown in Table 4.

於實驗例5~9中使用之試驗樣本與實施例1~4同樣地將長度×寬度設為100mm×50mm，各樣本之厚度尺寸(總厚度T1，金屬箔層厚t3，纖維強化樹脂材料厚度t2)如表4所示。 The test samples used in Experimental Examples 5 to 9 are the same as in Examples 1 to 4, with the length × width being 100 mm × 50 mm, the thickness dimensions of each sample (total thickness T1, metal foil layer thickness t3, fiber-reinforced resin material thickness) t2) is shown in Table 4.

(散熱性) (Heat dissipation)

各試驗樣本之散熱性係利用與實驗例1~4相同之方法進行測量。 The heat dissipation of each test sample was measured by the same method as Experimental Examples 1 to 4.

散熱性之測量結果如表5所示，實驗例5之樣本的加熱器正下方之溫度為38.8℃而於實驗例5~9之中最低，可見熱量進而擴散至整體之跡象(◎：散熱性非常好)。實驗例6之樣本的加熱器正下方之溫度為40℃而與實驗例5之鋁為相同程度，熱量擴散之跡象雖為擴散至整體，但劣 於實驗例5之鋁(○：散熱性略好)。實驗例7之樣本的加熱器正下方之溫度為39.8℃，藉由銅箔之效果而熱量擴散之跡象與實驗例5之鋁為相同程度(◎：散熱性非常好)。實驗例8之樣本的加熱器正下方之溫度為93.4℃而顯著蓄熱，熱量幾乎未擴散(×：散熱性不良)。實驗例9之樣本的加熱器正下方之溫度為50℃左右而可見蓄熱，但若與實驗例8之樣本相比，則藉由銅箔之效果而蓄熱得以抑制，可見熱量稍微擴散之跡象(△：散熱性略差)。 The measurement results of heat dissipation are shown in Table 5. The temperature directly under the heater of the sample of Experimental Example 5 is 38.8°C, which is the lowest among Experimental Examples 5 to 9. There are signs of heat spreading to the whole (◎: heat dissipation very good). The temperature directly under the heater of the sample of Experimental Example 6 was 40°C and the same degree as the aluminum of Experimental Example 5. Although the signs of heat diffusion were diffused to the whole, it was inferior to the aluminum of Experimental Example 5 (○: heat dissipation slightly it is good). The temperature directly under the heater of the sample of Experimental Example 7 was 39.8°C, and the signs of heat diffusion by the effect of copper foil were the same as the aluminum of Experimental Example 5 (◎: the heat dissipation was very good). The temperature directly under the heater of the sample of Experimental Example 8 was 93.4°C, and heat was remarkably stored, and the heat was hardly diffused (×: poor heat dissipation). The temperature directly under the heater of the sample of Experimental Example 9 was about 50°C, and heat storage was seen, but if compared with the sample of Experimental Example 8, the heat storage was suppressed by the effect of copper foil, and there was a sign that the heat was slightly diffused ( △: Heat dissipation is slightly poor).

(拉伸彈性模數、拉伸剛性) (Tensile elastic modulus, tensile rigidity)

拉伸彈性模數(E)、拉伸剛性及重量與實驗例1~4同樣，藉由計算而求出。拉伸彈性模數、拉伸剛性及重量之結果如表5所示。根據表5，根據本發明而構成之實驗例7的試驗樣本於散熱性及剛性之方面優異，又，亦於重量之方面較大致相同厚度的實驗例5之鋁單質輕量。 The tensile modulus of elasticity (E), tensile rigidity, and weight are the same as in Experimental Examples 1 to 4 and are calculated by calculation. The results of tensile elastic modulus, tensile rigidity and weight are shown in Table 5. According to Table 5, the test sample of Experimental Example 7 constructed according to the present invention is excellent in heat dissipation and rigidity, and is larger in weight so that the aluminum element of Experimental Example 5 of the same thickness is light and lightweight.

Figure 107140837-A0101-12-0019-4
Figure 107140837-A0101-12-0019-4

Figure 107140837-A0101-12-0020-5
Figure 107140837-A0101-12-0020-5

實施例2 Example 2

於圖2(c)中表示本發明之導熱性複合材料1之第二實施例。根據本實施例，導熱性複合材料1具有金屬箔層3及一體接合於該金屬箔層3之兩面的片狀纖維強化樹脂材料2(2a、2b)。 FIG. 2(c) shows a second embodiment of the thermally conductive composite material 1 of the present invention. According to the present embodiment, the thermally conductive composite material 1 has the metal foil layer 3 and the sheet-like fiber-reinforced resin materials 2 (2a, 2b) integrally joined to both sides of the metal foil layer 3.

本實施例之導熱性複合材料1若與實施例1之導熱性複合材料1進行比較，則係藉由設為將具有高拉伸彈性模數之纖維強化樹脂材料2(2a、2b)配置於金屬箔層3之兩面的構成而相較於散熱性，更重視剛性之類型者。 If the thermally conductive composite material 1 of this example is compared with the thermally conductive composite material 1 of Example 1, the fiber-reinforced resin material 2 (2a, 2b) having a high tensile elastic modulus is arranged in The structure of both sides of the metal foil layer 3 is more rigid than the heat dissipation.

本實施例之導熱性複合材料1於將片狀纖維強化樹脂材料2(2a、2b)一體接合於金屬箔層3的兩面之方面與實施例1之情形不同，作為構成構件之金屬箔層3及片狀纖維強化樹脂材料2(2a、2b)，設為與實 施例1相同之材料構成。因此，針對金屬箔層3及片狀纖維強化樹脂材料2(2a、2b)之說明，援用實施例1之說明而省略詳細說明。 The thermally conductive composite material 1 of this example differs from the case of Example 1 in that the sheet-like fiber-reinforced resin material 2 (2a, 2b) is integrally bonded to both sides of the metal foil layer 3, and the metal foil layer 3 as a constituent member The sheet-like fiber-reinforced resin material 2 (2a, 2b) has the same material structure as in Example 1. Therefore, for the description of the metal foil layer 3 and the sheet-like fiber-reinforced resin material 2 (2a, 2b), the description of Example 1 is used and the detailed description is omitted.

於本實施例中，導熱性複合材料1之厚度(T2)與上述實施例1之情形同樣地設為1mm以下，通常，於本實施例中設為0.12~1mm(0.12mm≦T2≦1mm)。較佳將導熱性複合材料之厚度(T2)設為0.12~0.5mm。 In this embodiment, the thickness (T2) of the thermally conductive composite material 1 is set to 1 mm or less as in the case of the above-mentioned embodiment 1, and generally, it is set to 0.12 to 1 mm (0.12 mm≦T2≦1 mm) in this embodiment . Preferably, the thickness (T2) of the thermally conductive composite material is set to 0.12 to 0.5 mm.

(製造方法) (Manufacturing method)

於本實施例中，金屬箔層3亦必需相對於纖維強化樹脂材料2(2a、2b)一體成型。即，例如圖4(b)所示，將對強化纖維片材10Sa、10Sb含浸樹脂R，尚未完全硬化之所謂預浸體狀態的強化纖維片材(預浸體片)10PG(10PGa、10PGb)按壓至金屬箔層3之兩面而一體地積層，並視需要進行加熱而將樹脂R硬化。 In this embodiment, the metal foil layer 3 must also be formed integrally with the fiber-reinforced resin material 2 (2a, 2b). That is, for example, as shown in FIG. 4(b), the reinforcing fiber sheets 10Sa and 10Sb are impregnated with the resin R, and the reinforcing fiber sheet (prepreg sheet) 10PG (10PGa, 10PGb) in a so-called prepreg state that has not been completely cured. Pressing to both sides of the metal foil layer 3 is integrally laminated, and is heated as necessary to harden the resin R.

亦如實施例1所說明般，若於後接著，即對於金屬箔層3之兩面接著預浸體片10PG(10PGa、10PGb)之含浸樹脂完全硬化，即纖維強化樹脂材料2(2a、2b)而製成一體之情形時，擔心根據接著劑之厚度而於接著層散熱性或剛性降低。 As also described in Example 1, if followed, that is, the impregnated resin of the prepreg sheet 10PG (10PGa, 10PGb) is completely cured on both sides of the metal foil layer 3, that is, the fiber-reinforced resin material 2 (2a, 2b) However, when it is made in one piece, the heat dissipation or rigidity of the adhesive layer may decrease due to the thickness of the adhesive.

(補強方法) (Reinforcement method)

如上述般製作之導熱性複合材料1與實施例1之情形同樣地被一體接合於被補強體101。 The thermally conductive composite material 1 produced as described above is integrally joined to the to-be-reinforced body 101 as in the case of Example 1.

作為如此獲得之纖維強化塑膠製品的被補強體101，如上述般，由其厚度(T2)設為0.12~1mm、拉伸彈性模數設為80GPa以上之具備高剛性與散熱性之補強體(即導熱性複合材料1)所補強，藉此，可有效地防止因外力所導致之變形而防止裝置內部損壞，且不形成因收納於裝置 內部的放熱源所引起之熱斑便可進行擴散。 As the reinforced body 101 of the fiber-reinforced plastic product thus obtained, as described above, the reinforced body with high rigidity and heat dissipation ((2) whose thickness (T2) is set to 0.12 to 1 mm and the tensile modulus of elasticity is set to 80 GPa or more ( That is, the thermally conductive composite material 1) is reinforced, thereby effectively preventing deformation caused by external force and preventing damage to the inside of the device, and spreading without forming a hot spot caused by a heat source stored inside the device.

(實驗例之說明) (Explanation of experimental example)

繼而，為了證實本發明之導熱性複合材料1之作用效果而製作試驗樣本，並對機械強度、散熱性進行性能試驗。於上述表4、表5中將本實驗例表示為實驗例10。於表4中表示於實驗例10中使用之試驗樣本的材料、構成、各尺寸等，於表5中表示試驗結果。 Then, in order to confirm the effect of the thermally conductive composite material 1 of the present invention, test samples were prepared, and performance tests were conducted on mechanical strength and heat dissipation. In the above Tables 4 and 5, this experimental example is shown as Experimental Example 10. Table 4 shows the material, composition, dimensions, etc. of the test samples used in Experimental Example 10, and Table 5 shows the test results.

實驗例10 Experimental Example 10

(試驗樣本) (Test sample)

於實驗例10中，根據本發明之構成，使用以如下方法製作之纖維強化複合材料(金屬箔芯-瀝青系CFRP單向0°/90°板)：將使瀝青系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂之預浸體於X方向與Y方向上積層於銅箔3的兩面並一體化。 In Experimental Example 10, according to the configuration of the present invention, a fiber-reinforced composite material (metal foil core-asphalt-based CFRP unidirectional 0°/90° plate) produced by the following method: the pitch-based carbon fibers are aligned in one direction The prepreg impregnated with resin in the unidirectional carbon fiber sheet is stacked on both sides of the copper foil 3 in the X direction and the Y direction and integrated.

又，於實驗例10中使用之瀝青系碳纖維、銅使用各物性與實驗例1~9相同者。所使用之總纖維單位面積重量設為如表4所示。 The pitch-based carbon fiber and copper used in Experimental Example 10 have the same physical properties as Experimental Examples 1 to 9. The total fiber basis weight used was set as shown in Table 4.

於實驗例10中使用之試驗樣本與實驗例1~9同樣地將長度×寬度設為100mm×50mm，各樣本之厚度尺寸(總厚度T2，金屬箔層厚t3，纖維強化樹脂材料厚度t2)如表4所示。 The test samples used in Experimental Example 10 are the same as Experimental Examples 1 to 9, with the length × width being 100 mm × 50 mm, and the thickness dimensions of each sample (total thickness T2, metal foil layer thickness t3, fiber-reinforced resin material thickness t2) As shown in Table 4.

(散熱性) (Heat dissipation)

試驗樣本之散熱性係利用與實驗例1~9相同之方法而測量。 The heat dissipation of the test sample was measured by the same method as in Experimental Examples 1-9.

散熱性之測量結果如表5所示，實驗例10之樣本的加熱器正下方之溫度為39.4℃，熱量擴散之跡象與上述實驗例7之樣本相比略差 (◎~○：散熱性良好)。 The measurement results of heat dissipation are shown in Table 5. The temperature of the sample directly under the heater of the experimental example 10 is 39.4°C. The signs of heat diffusion are slightly worse than those of the sample of the above experimental example 7 (◎~○: the heat dissipation is good ).

(拉伸彈性模數、拉伸剛性) (Tensile elastic modulus, tensile rigidity)

拉伸彈性模數(E)、拉伸剛性及重量與實驗例1~9同樣，藉由計算而求出。拉伸彈性模數、拉伸剛性及重量之結果如表5所示。根據表5，根據本實施例而構成之實驗例10的試驗樣本於散熱性及剛性之方面優異，又，亦於重量之方面較大致相同厚度的上述實驗例5之鋁單質輕量。 The tensile modulus of elasticity (E), tensile rigidity, and weight are the same as in Experimental Examples 1 to 9, and are calculated by calculation. The results of tensile elastic modulus, tensile rigidity and weight are shown in Table 5. According to Table 5, the test sample of Experimental Example 10 constructed according to this example is excellent in heat dissipation and rigidity, and is larger in weight so that the aluminum element of the above Experimental Example 5 of the same thickness is light and lightweight.

1‧‧‧導熱性複合材料 1‧‧‧ Thermal conductive composite material

2‧‧‧纖維強化樹脂材料 2‧‧‧ fiber reinforced resin material

2a‧‧‧纖維強化樹脂材料 2a‧‧‧ fiber reinforced resin material

2b‧‧‧纖維強化樹脂材料 2b‧‧‧ fiber reinforced resin material

3‧‧‧金屬箔層 3‧‧‧Metal foil layer

3a‧‧‧金屬箔層 3a‧‧‧Metal foil layer

3b‧‧‧金屬箔層 3b‧‧‧Metal foil layer

101‧‧‧被補強體 101‧‧‧ Reinforced

101a‧‧‧底板部分 101a‧‧‧Bottom plate part

T1‧‧‧厚度 T1‧‧‧thickness

T2‧‧‧厚度 T2‧‧‧thickness

t2‧‧‧厚度 t2‧‧‧thickness

t2a‧‧‧厚度 t2a‧‧‧thickness

t2b‧‧‧厚度 t2b‧‧‧thickness

t3‧‧‧厚度 t3‧‧‧thickness

t3a‧‧‧厚度 t3a‧‧‧thickness

t3b‧‧‧厚度 t3b‧‧‧thickness

Claims (12)

一種導熱性複合材料，其具有含連續之強化纖維的片狀纖維強化樹脂材料及一體接合於該纖維強化樹脂材料之兩面的金屬箔層，厚度被設為0.07~1mm，其特徵在於：該纖維強化樹脂材料之厚度被設為0.05mm以上，未達1mm，該金屬箔層之厚度被設為0.009~0.1mm，該導熱性複合材料之拉伸彈性模數為80GPa以上。 A thermally conductive composite material having a sheet-shaped fiber-reinforced resin material containing continuous reinforcing fibers and metal foil layers integrally joined on both sides of the fiber-reinforced resin material, the thickness of which is set to 0.07~1mm, characterized in that the fibers The thickness of the reinforced resin material is set to 0.05 mm or more but less than 1 mm, the thickness of the metal foil layer is set to 0.009 to 0.1 mm, and the tensile elastic modulus of the thermally conductive composite material is 80 GPa or more. 如申請專利範圍第1項之導熱性複合材料，其中，該導熱性複合材料之厚度被設為0.12~1mm，且係作為補強可攜式資訊終端機器之殼體或殼體箱的補強板而使用，該金屬箔層之厚度為0.009~0.05mm。 For example, the thermal conductivity composite material of the first patent application, wherein the thickness of the thermal conductivity composite material is set to 0.12~1mm, and it is used as a reinforcing plate to reinforce the casing or casing of the portable information terminal machine. For use, the thickness of the metal foil layer is 0.009~0.05mm. 一種導熱性複合材料，其具有金屬箔層及一體接合於該金屬箔層的兩面之含連續之強化纖維的片狀纖維強化樹脂材料，厚度被設為0.12~1mm，其特徵在於：該纖維強化樹脂材料之厚度被設為0.05mm以上，未達1mm，該金屬箔層之厚度被設為0.009~0.1mm，該導熱性複合材料之拉伸彈性模數為80GPa以上。 A thermally conductive composite material having a metal foil layer and a sheet-shaped fiber-reinforced resin material containing continuous reinforcing fibers integrally joined to both sides of the metal foil layer, the thickness of which is set to 0.12 to 1 mm, and is characterized in that the fiber is reinforced The thickness of the resin material is set to 0.05 mm or more and less than 1 mm, the thickness of the metal foil layer is set to 0.009 to 0.1 mm, and the tensile elastic modulus of the thermally conductive composite material is 80 GPa or more. 如申請專利範圍第3項之導熱性複合材料，其中，該導熱性複合材料係作為補強可攜式資訊終端機器之殼體或殼體箱的補強板而使用，該金屬箔層之厚度為0.009~0.05mm。 For example, the thermal conductivity composite material of the third patent application, where the thermal conductivity composite material is used as a reinforcing plate for reinforcing the casing or casing of the portable information terminal machine, and the thickness of the metal foil layer is 0.009 ~0.05mm. 如申請專利範圍第1至4項中任一項之導熱性複合材料，其中，該纖維強化樹脂材料以纖維體積含有率計，含有20%以上之瀝青系碳纖維， 該瀝青系碳纖維具有100W/mK以上的強化纖維之導熱率及400GPa以上之拉伸彈性模數。 The thermally conductive composite material according to any one of the items 1 to 4 of the patent application scope, wherein the fiber-reinforced resin material contains more than 20% pitch-based carbon fibers in terms of fiber volume content, The pitch-based carbon fiber has a thermal conductivity of the reinforcing fiber of 100 W/mK or more and a tensile modulus of elasticity of 400 GPa or more. 如申請專利範圍第1至4項中任一項之導熱性複合材料，其中，該纖維強化樹脂材料之強化纖維係瀝青系碳纖維、PAN(polyacrylonitrile，聚丙烯腈)系碳纖維或玻璃纖維或者將該纖維混合2種以上而成者。 The thermally conductive composite material according to any one of claims 1 to 4, wherein the fiber-reinforced resin material's reinforcing fiber is pitch-based carbon fiber, PAN (polyacrylonitrile, polyacrylonitrile)-based carbon fiber or glass fiber or the It is made by mixing two or more fibers. 如申請專利範圍第1至4項中任一項之導熱性複合材料，其中，該纖維強化樹脂材料係將連續之該強化纖維沿一方向拉齊並含浸樹脂而形成，及/或於至少沿2軸方向而織成之織物含浸樹脂而形成。 The thermally conductive composite material according to any one of claims 1 to 4, wherein the fiber-reinforced resin material is formed by continuously aligning the reinforcing fibers in one direction and impregnating the resin, and/or at least along The fabric woven in the 2-axis direction is formed by impregnating resin. 如申請專利範圍第1至4項中任一項之導熱性複合材料，其中，該纖維強化樹脂材料係將連續之該強化纖維沿一方向拉齊並含浸樹脂而形成之片材，至少於2軸方向上積層進行製作。 The thermally conductive composite material according to any one of items 1 to 4 of the patent application, wherein the fiber-reinforced resin material is a sheet formed by continuously aligning the reinforcing fibers in one direction and impregnating the resin, at least 2 Build up in the axial direction. 如申請專利範圍第1至4項中任一項之導熱性複合材料，其中，該金屬箔層由具有50W/mK以上之導熱率之金屬製作。 The thermally conductive composite material according to any one of claims 1 to 4, wherein the metal foil layer is made of a metal having a thermal conductivity of 50 W/mK or more. 如申請專利範圍第1至4項中任一項之導熱性複合材料，其中，該導熱性複合材料之厚度為0.12~0.5mm。 The thermally conductive composite material according to any one of the items 1 to 4 of the patent application range, wherein the thickness of the thermally conductive composite material is 0.12 to 0.5 mm. 如申請專利範圍第2或4項之導熱性複合材料，其中，該纖維強化樹脂材料之厚度為0.1mm以上。 For example, the thermally conductive composite material of claim 2 or 4, wherein the thickness of the fiber-reinforced resin material is 0.1 mm or more. 如申請專利範圍第2或4項之導熱性複合材料，其中，該可攜式資訊終端機器為智慧型手機、輸入板或可攜式電腦。 For example, the thermal conductivity composite material of the second or fourth patent application, wherein the portable information terminal machine is a smart phone, input board or portable computer.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102927A (en) * 1986-08-27 1988-05-07 ゼネラル・エレクトリック・カンパニイ Thermal conductive laminated board consisting of metallic layer and reinforced high-molecular base-material composite material layer and having low thermal expansion coefficient

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4597279B2 (en) * 1998-07-31 2010-12-15 弘治 大石橋 Thermally conductive composite material
JP2001118974A (en) * 1999-10-15 2001-04-27 Mitsubishi Chemicals Corp Heat radiating plate
JP5703542B2 (en) * 2009-03-26 2015-04-22 三菱樹脂株式会社 Carbon fiber reinforced resin sheet and roll wound body thereof
KR20120050835A (en) * 2010-11-11 2012-05-21 삼성전기주식회사 Metal clad laminate and method for manufacturing the same, heat-radiating substrate
JP6003010B2 (en) * 2010-11-18 2016-10-05 三菱レイヨン株式会社 Electromagnetic wave shielding composite material, electronic equipment casing and battery case

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102927A (en) * 1986-08-27 1988-05-07 ゼネラル・エレクトリック・カンパニイ Thermal conductive laminated board consisting of metallic layer and reinforced high-molecular base-material composite material layer and having low thermal expansion coefficient

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