JP2001118974A - Heat radiating plate - Google Patents
Heat radiating plateInfo
- Publication number
- JP2001118974A JP2001118974A JP29350299A JP29350299A JP2001118974A JP 2001118974 A JP2001118974 A JP 2001118974A JP 29350299 A JP29350299 A JP 29350299A JP 29350299 A JP29350299 A JP 29350299A JP 2001118974 A JP2001118974 A JP 2001118974A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- radiating plate
- usually
- thermal conductivity
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、放熱板に関するもので
あり、詳しくは炭素繊維強化プラスチックを用いた高熱
伝導性の放熱板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator plate, and more particularly to a radiator plate having high thermal conductivity using carbon fiber reinforced plastic.
【０００２】[0002]
【従来の技術】現在、パソコン、ビデオなどのＯＡ機器
や電化製品の軽量小型化にともない、製品内部で発生す
る熱を効率よく外部へ放熱するために、発熱部の固定板
などに放熱性の良い（熱伝導率が高い）板が使用されて
いる。しかし、ＯＡ機器や電化製品の軽量小型化、軽薄
化に伴い、内部に使用されているあらゆる部品の小型軽
薄化が要求されるようになっている。特にノート型パソ
コンでは高性能化と共に軽薄化が要求されており、熱伝
導性が良く、軽量化、薄膜化した放熱板が求められてい
る。2. Description of the Related Art At present, as OA equipment such as personal computers and videos and electric appliances are reduced in size and weight, heat generated inside the products is efficiently radiated to the outside. Good (high thermal conductivity) plates are used. However, as OA equipment and electric appliances are reduced in size and weight, all components used therein are required to be reduced in size and weight. In particular, notebook personal computers are required to have high performance and light weight, and a heat radiation plate having good thermal conductivity, light weight, and thin film is required.
【０００３】従来、パソコンのＩＣチップを固定するＣ
ＳＰ（Chip Sized Package）などの放熱板の材料として
は、主に熱伝導率を高くするためには銅が、また軽量化
するためにはアルミニウムが使用されている。Conventionally, a C for fixing an IC chip of a personal computer is used.
As a material of a heat radiating plate such as an SP (Chip Sized Package), copper is mainly used to increase the thermal conductivity, and aluminum is used to reduce the weight.
【０００４】[0004]
【発明が解決しようとする課題】熱伝導性を高くし、軽
量化を達成するため、さらにできるだけ厚みを薄くする
ためにＣＳＰとしてはより薄いものが要求されている。
現在、このような理由から銅、アルミニウムをできるだ
け薄く加工しＣＳＰを製造しているが、薄くすることに
より板の強度が低くなり、変形しやすくなる。その結
果、生産時の歩留まりが低下し、また検査する人件費な
どのコストかかっている。In order to increase the thermal conductivity and reduce the weight, and to make the thickness as small as possible, a thinner CSP is required.
At present, CSP is manufactured by processing copper and aluminum as thinly as possible for such a reason. However, by reducing the thickness, the strength of the plate is reduced and the plate is easily deformed. As a result, the yield at the time of production is reduced, and costs such as labor costs for inspection are required.
【０００５】[0005]
【問題を解決するための手段】本発明者らは、ノート型
パソコンなどの電気、機械製品をより軽薄化させること
が可能な、熱伝導性が良く、軽量化、薄膜化した放熱板
について鋭意検討した結果、本発明に到達した。即ち、
本発明の要旨は、面方向の熱伝導率が１０〜６００Ｗ／
ｍ・Ｋ、厚みが０．２ｍｍ以下である炭素繊維強化プラ
スチック（以下、ＣＦＲＰと略称する）からなることを
特徴とする放熱板に存する。Means for Solving the Problems The present inventors have keenly focused on a heat-dissipating, light-weight, thin-film radiating plate that can reduce the weight of electric and mechanical products such as notebook personal computers. As a result of the study, the present invention has been reached. That is,
The gist of the present invention is that the thermal conductivity in the plane direction is 10 to 600 W /
The heat radiation plate is characterized by being made of carbon fiber reinforced plastic (hereinafter abbreviated as CFRP) having a m · K of 0.2 mm or less.
【０００６】[0006]
【発明の実施の形態】以下、本発明を詳細に説明する。
本発明の放熱板は、ＣＦＲＰからなることを特徴とし、
面方向の熱伝導率が１０〜６００Ｗ／ｍ・Ｋ、好ましく
は１００〜６００Ｗ／ｍ・Ｋである。また、厚み方向の
熱伝導率としては通常０．５〜２０Ｗ／ｍ・Ｋ、好まし
くは１０〜２０Ｗ／ｍ・Ｋである。更に、放熱板の厚み
は、通常０．２ｍｍ以下、好ましくは０．１ｍｍ以下で
ある。厚みの下限は特に限定されないが、強度の点から
通常０．０５ｍｍ以上であることが好ましい。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
The radiator plate of the present invention is made of CFRP,
The thermal conductivity in the plane direction is 10 to 600 W / m · K, preferably 100 to 600 W / m · K. Further, the thermal conductivity in the thickness direction is usually 0.5 to 20 W / m · K, preferably 10 to 20 W / m · K. Further, the thickness of the heat sink is generally 0.2 mm or less, preferably 0.1 mm or less. The lower limit of the thickness is not particularly limited, but is preferably 0.05 mm or more from the viewpoint of strength.
【０００７】放熱板の引張強度は、通常５０ｋｇ／ｍｍ
2以上、好ましくは６０ｋｇ／ｍｍ2以上、特に好ましく
は７０ｋｇ／ｍｍ2以上である。引張強度の上限は特に
限定されないが、通常４００ｋｇ／ｍｍ2程度である。
放熱板の圧縮強度は、通常１０ｋｇ／ｍｍ2以上、好ま
しくは１５ｋｇ／ｍｍ2以上である。圧縮強度の上限は
特に限定されないが、通常１５０ｋｇ／ｍｍ2程度であ
る。放熱板の引張弾性率は、通常１０ｔ／ｍｍ2以上、
好ましくは１５ｔ／ｍｍ2以上である。引張弾性率の上
限は特に限定されないが、通常８０ｔ／ｍｍ2程度であ
る。放熱板の圧縮弾性率は、通常１０ｔ／ｍｍ2以上、
好ましくは１５ｔ／ｍｍ2以上である。圧縮弾性率の上
限は特に限定されないが、通常８０ｔ／ｍｍ2程度であ
る。放熱板の比重は、通常２．００〜２．３０ｇ／ｃｍ
3、好ましくは２．００〜２．２５ｇ／ｃｍ3、特に好ま
しくは２．００〜２．２０ｇ／ｃｍ3である。[0007] The tensile strength of the heat sink is usually 50 kg / mm.
It is at least 2 , preferably at least 60 kg / mm 2 , particularly preferably at least 70 kg / mm 2 . The upper limit of the tensile strength is not particularly limited, but is usually about 400 kg / mm 2 .
The compressive strength of the heat sink is usually 10 kg / mm 2 or more, preferably 15 kg / mm 2 or more. The upper limit of the compressive strength is not particularly limited, but is usually about 150 kg / mm 2 . The tensile modulus of the heat sink is usually 10 t / mm 2 or more,
Preferably it is 15 t / mm 2 or more. The upper limit of the tensile modulus is not particularly limited, but is usually about 80 t / mm 2 . The compression elastic modulus of the heat sink is usually 10 t / mm 2 or more,
Preferably it is 15 t / mm 2 or more. The upper limit of the compression modulus is not particularly limited, but is usually about 80 t / mm 2 . The specific gravity of the heat sink is usually 2.00 to 2.30 g / cm.
3 , preferably 2.00 to 2.25 g / cm 3 , particularly preferably 2.00 to 2.20 g / cm 3 .
【０００８】上記のような性能を達成するために、本発
明の放熱板を構成するＣＦＲＰの原料として以下のよう
な炭素繊維を用いる。本発明で用いる炭素繊維として
は、ポリアクリロニトリル（ＰＡＮ）系炭素繊維、ピッ
チ系炭素繊維が用いられるが、特にピッチ系炭素繊維が
好ましい。炭素繊維の繊維軸方向の引張弾性率は通常６
０ｔ／ｍｍ2以上、好ましくは７０ｔ／ｍｍ2以上、特に
好ましくは８０ｔ／ｍｍ2以上である。引張弾性率の上
限は特に限定されないが、通常９５ｔ／ｍｍ2程度であ
る。また、繊維方向の熱伝導率は、通常１００Ｗ／ｍＫ
以上、好ましくは２００Ｗ／ｍＫ以上である。熱伝導率
の上限は特に限定されないが、通常１１００Ｗ／ｍＫ程
度である。In order to achieve the above-described performance, the following carbon fibers are used as a raw material of CFRP constituting the heat sink of the present invention. As the carbon fibers used in the present invention, polyacrylonitrile (PAN) -based carbon fibers and pitch-based carbon fibers are used, and pitch-based carbon fibers are particularly preferable. The tensile modulus of carbon fiber in the fiber axis direction is usually 6
0t / mm 2 or more, preferably 70 t / mm 2 or more, particularly preferably 80t / mm 2 or more. The upper limit of the tensile modulus is not particularly limited, but is usually about 95 t / mm 2 . The thermal conductivity in the fiber direction is usually 100 W / mK.
Above, preferably 200 W / mK or more. The upper limit of the thermal conductivity is not particularly limited, but is usually about 1100 W / mK.
【０００９】該炭素繊維を構成するフィラメント数は通
常６０００本以下、好ましくは３０００本以下、特に好
ましくは１０００本以下である。また、フィラメント数
の下限は特に限定されないが、生産性、ハンドリング性
の点から通常５００本以上である。また、該炭素繊維を
構成するフィラメントの直径は、通常５〜２０μｍ、好
ましくは５〜１５μｍ、特に好ましくは５〜１０μｍで
ある。The number of filaments constituting the carbon fiber is usually 6000 or less, preferably 3000 or less, particularly preferably 1000 or less. The lower limit of the number of filaments is not particularly limited, but is usually 500 or more from the viewpoint of productivity and handleability. The diameter of the filament constituting the carbon fiber is usually 5 to 20 μm, preferably 5 to 15 μm, and particularly preferably 5 to 10 μm.
【００１０】ＣＦＲＰのマトリックス樹脂としては、通
常公知の熱硬化性樹脂、熱可塑性樹脂を用いることがで
きるが、例えば、ポリエステル樹脂、シリコーン系樹
脂、エポキシ樹脂を用いることができる。なお、必要に
応じてガラス繊維、ケブラー繊維、天然繊維等の炭素繊
維以外の繊維を補強材として添加してもよい。ＣＦＲＰ
の繊維含有体積率は、応じて適宜選択すればよく特に限
定されないが、通常４０〜７０％、好ましくは５０〜６
０％である。As the matrix resin of CFRP, generally known thermosetting resins and thermoplastic resins can be used. For example, polyester resins, silicone resins and epoxy resins can be used. In addition, fibers other than carbon fibers, such as glass fibers, Kevlar fibers, and natural fibers, may be added as a reinforcing material as needed. CFRP
The fiber content volume ratio of is not particularly limited as long as it is appropriately selected depending on the case, but is usually 40 to 70%, preferably 50 to 6
0%.
【００１１】本発明の放熱板の形状は用途に応じて適宜
選択すればよく、また大きさも用途に応じて適宜選択す
ればよいが、通常縦１００ｍｍ以下×横１００ｍｍ以下
である。本発明の放熱板は、炭素繊維の１方向プリプレ
グ、または熱伝導率、強度などの必要に応じて製作した
編み物（編み方は限定しない）に、ＣＦＲＰ用のマトリ
ックスを適量塗布し、加熱、成形することにより得られ
る。さらに、用途による放熱板要求事項（厚み、炭素繊
維含有率）に応じて、オートクレープ、加圧成形機など
で通常０〜１００ｋｇ／ｃｍ2で加圧成形するとより薄
いＣＦＲＰ放熱板を得ることができる。The shape of the heat radiating plate of the present invention may be appropriately selected according to the application, and the size may be appropriately selected according to the application, and is usually 100 mm or less in length × 100 mm or less in width. The heat radiating plate of the present invention is obtained by applying an appropriate amount of a matrix for CFRP to a unidirectional prepreg of carbon fiber or a knitted fabric (the knitting method is not limited) manufactured as required for heat conductivity, strength, etc., and heating and molding. It is obtained by doing. Furthermore, depending on the requirements of the radiator plate (thickness, carbon fiber content) depending on the application, a thinner CFRP radiator plate can be obtained by press-forming usually at 0 to 100 kg / cm 2 using an autoclave, a pressing machine, or the like. it can.
【００１２】[0012]
【実施例】以下、実施例により本発明を更に詳細に説明
するが、本発明はその要旨を越えない限り以下の実施例
により限定させるものではない。 実施例１ フィラメント本数１０００本、糸径７μｍ、目付が６７
ｇ／ｍ、引張強度が４０２ｋｇ／ｍｍ2、引張弾性率が
８０．４ｔ／ｍｍ2、繊維軸方向の熱伝導率が２００Ｗ
／ｍＫであるピッチ系炭素繊維をクロスの織物（平織
り）に成形し、プリプレグに加工した後、マトリックス
としてエポキシ樹脂を２２重量％（対プリプレグ重量）
塗布、添着した後、オートクレープを用いて１２５℃、
７ｋｇ／ｃｍ 2で加圧成形した。成形されたＣＦＲＰ放
熱板は、サイズ３０×３０ｍｍ、面方向の熱伝導率１３
０Ｗ／ｍ・Ｋ、厚み０．１００ｍｍであった。また、引
張強度は７２、４Ｋｇ／ｍｍ2、圧縮強度は１８、８Ｋ
ｇ／ｍｍ2、引張弾性率１６、６ｔ／ｍｍ2、圧縮弾性率
１７、４ｔ／ｍｍ2、比重２、１５ｇ／ｃｍ3、繊維含有
体積率は５０％であった。パソコンＩＣチップ用のＣＳ
Ｐに使用するのに十分な熱伝導率、強度があり生産工程
においても、変形することがなく、安定してパソコンを
生産することができた。 比較例１ パソコンＩＣチップ用放熱板を銅を主原料として製作し
た。製作した放熱板はサイズ３０×３０ｍｍ、厚み０．
２ｍｍであり、目的の熱伝導率は達成できたが、強度不
足により生産工程において、変形しやすくトラブルが多
発した。 比較例２ パソコンＩＣチップ用放熱板をアルミニウムを主原料と
して製作した。製作した放熱板はサイズ３０×３０ｍ
ｍ、厚み０．２ｍｍであった。強度不足により生産工程
において、変形しやすくトラブルが多発した。The present invention will be described in more detail with reference to the following examples.
However, the present invention does not exceed the gist of the present invention.
It is not intended to be limited by. Example 1 The number of filaments was 1,000, the yarn diameter was 7 μm, and the basis weight was 67.
g / m, tensile strength is 402 kg / mmTwo, Tensile modulus
80.4t / mmTwo, The thermal conductivity in the fiber axis direction is 200W
/ MK pitch-based carbon fiber into a cloth woven fabric (plain weave
) And processed into prepreg, then the matrix
22% by weight of epoxy resin (based on prepreg)
After application and attachment, 125 ° C.
7kg / cm TwoAnd press molded. Molded CFRP release
The hot plate has a size of 30 × 30 mm and a heat conductivity of 13 in the plane direction.
It was 0 W / mK and the thickness was 0.100 mm. Also, pull
Tensile strength is 72, 4Kg / mmTwo, Compression strength is 18.8K
g / mmTwo, Tensile modulus of elasticity 16, 6 t / mmTwo, Compression modulus
17, 4t / mmTwo, Specific gravity 2, 15 g / cmThree, Containing fiber
The volume ratio was 50%. CS for PC IC chip
Production process with sufficient thermal conductivity and strength to be used for P
Even without deforming, stable PC
Could be produced. Comparative Example 1 A heat sink for a PC IC chip was manufactured using copper as a main raw material.
Was. The manufactured heat sink has a size of 30 x 30 mm and a thickness of 0.3 mm.
2 mm, the target thermal conductivity was achieved, but the strength was
Legs easily deform in the production process due to feet
Emitted. Comparative Example 2 A heat sink for a PC IC chip was made mainly of aluminum.
And made it. The manufactured heat sink is 30 x 30m in size
m and thickness 0.2 mm. Production process due to insufficient strength
, It was easily deformed and troubles occurred frequently.
【００１３】[0013]
【発明の効果】本発明は、ノート型パソコンなどの電
気、機械製品をより軽薄化させることが可能な、熱伝導
性が良く、軽量化、薄膜化した放熱板を提供することが
できるため、工業上非常に有用である。As described above, the present invention can provide a heat-dissipating plate having good thermal conductivity, lighter weight, and thinner thickness, which can make electric and mechanical products such as a notebook computer lighter and thinner. Very useful in industry.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F072 AA02 AA07 AA08 AB10 AB17 AB30 AD23 AD37 AD47 AG03 AH21 AK02 AK14 AL11 5F036 AA01 BA23 BB08 BD21 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F072 AA02 AA07 AA08 AB10 AB17 AB30 AD23 AD37 AD47 AG03 AH21 AK02 AK14 AL11 5F036 AA01 BA23 BB08 BD21
Claims (7)
・Ｋ、厚みが０．２ｍｍ以下である炭素繊維強化プラス
チックからなることを特徴とする放熱板。1. A thermal conductivity in a plane direction of 10 to 600 W / m.
K, a heat sink characterized by being made of carbon fiber reinforced plastic having a thickness of 0.2 mm or less.
請求項１に記載の放熱板。2. The heat sink according to claim 1, wherein the heat sink has a tensile strength of 50 kg / mm 2 or more.
請求項１または２に記載の放熱板。3. The heat sink according to claim 1, wherein the heat sink has a compressive strength of 10 kg / mm 2 or more.
請求項１〜３のいずれか一項に記載の放熱板。4. The heat radiating plate according to claim 1, which has a tensile elastic modulus of 10 t / mm 2 or more.
請求項１〜４のいずれか一項に記載の放熱板。5. The heat sink according to claim 1, which has a compression modulus of 10 t / mm 2 or more.
ある請求項１〜５のいずれか一項に記載の放熱板。6. The heat radiating plate according to claim 1, having a specific gravity of 2.00 to 2.30 g / cm 3 .
０ｔ／ｍｍ2以上である請求項１〜６のいずれか一項に
記載の放熱板。7. The carbon fiber has a tensile modulus of elasticity of 6 in the fiber axis direction.
Heat radiating plate according to any one of claims 1 to 6 is 0t / mm 2 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29350299A JP2001118974A (en) | 1999-10-15 | 1999-10-15 | Heat radiating plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29350299A JP2001118974A (en) | 1999-10-15 | 1999-10-15 | Heat radiating plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001118974A true JP2001118974A (en) | 2001-04-27 |
Family
ID=17795581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29350299A Pending JP2001118974A (en) | 1999-10-15 | 1999-10-15 | Heat radiating plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001118974A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7235918B2 (en) * | 2003-06-11 | 2007-06-26 | Cool Options, Inc. | Thermally-conductive plastic articles having light reflecting surfaces |
| JP2009043851A (en) * | 2007-08-07 | 2009-02-26 | Toshiba Corp | Semiconductor package |
| JP2010229238A (en) * | 2009-03-26 | 2010-10-14 | Mitsubishi Plastics Inc | Carbon fiber-reinforced resin sheet, and roll-wound rolled body thereof |
| WO2015119064A1 (en) * | 2014-02-10 | 2015-08-13 | 新日鉄住金マテリアルズ株式会社 | Thermally conductive composite material, and manufacturing method therefor |
| CN110945647A (en) * | 2017-07-24 | 2020-03-31 | 积水化学工业株式会社 | Heat conducting fin |
-
1999
- 1999-10-15 JP JP29350299A patent/JP2001118974A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7235918B2 (en) * | 2003-06-11 | 2007-06-26 | Cool Options, Inc. | Thermally-conductive plastic articles having light reflecting surfaces |
| JP2009043851A (en) * | 2007-08-07 | 2009-02-26 | Toshiba Corp | Semiconductor package |
| JP4504401B2 (en) * | 2007-08-07 | 2010-07-14 | 株式会社東芝 | Semiconductor package |
| US7868450B2 (en) | 2007-08-07 | 2011-01-11 | Kabushiki Kaisha Toshiba | Semiconductor package |
| JP2010229238A (en) * | 2009-03-26 | 2010-10-14 | Mitsubishi Plastics Inc | Carbon fiber-reinforced resin sheet, and roll-wound rolled body thereof |
| WO2015119064A1 (en) * | 2014-02-10 | 2015-08-13 | 新日鉄住金マテリアルズ株式会社 | Thermally conductive composite material, and manufacturing method therefor |
| JPWO2015119064A1 (en) * | 2014-02-10 | 2017-03-23 | 新日鉄住金マテリアルズ株式会社 | Thermally conductive composite and method for producing the same |
| CN110945647A (en) * | 2017-07-24 | 2020-03-31 | 积水化学工业株式会社 | Heat conducting fin |
| CN110945647B (en) * | 2017-07-24 | 2021-08-24 | 积水化学工业株式会社 | Heat conducting fin |
| US11456229B2 (en) | 2017-07-24 | 2022-09-27 | Sekisui Chemical Co., Ltd. | Thermally conductive sheet |
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