TWI643826B - Breaking device and breaking method - Google Patents
Breaking device and breaking method Download PDFInfo
- Publication number
- TWI643826B TWI643826B TW104100584A TW104100584A TWI643826B TW I643826 B TWI643826 B TW I643826B TW 104100584 A TW104100584 A TW 104100584A TW 104100584 A TW104100584 A TW 104100584A TW I643826 B TWI643826 B TW I643826B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- support member
- breaking
- belt
- brittle material
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014054695A JP6289949B2 (ja) | 2014-03-18 | 2014-03-18 | ブレイク装置 |
JP2014-054695 | 2014-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201536701A TW201536701A (zh) | 2015-10-01 |
TWI643826B true TWI643826B (zh) | 2018-12-11 |
Family
ID=54112041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104100584A TWI643826B (zh) | 2014-03-18 | 2015-01-08 | Breaking device and breaking method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6289949B2 (ja) |
KR (1) | KR20150108737A (ja) |
CN (1) | CN104924469B (ja) |
TW (1) | TWI643826B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102122427B1 (ko) * | 2019-01-09 | 2020-06-12 | 한국미쯔보시다이아몬드공업(주) | 단재 제거 장치 |
WO2022186188A1 (ja) | 2021-03-02 | 2022-09-09 | 株式会社Ihi | ワーク切断装置及びワーク切断方法 |
CN115990950A (zh) * | 2023-01-09 | 2023-04-21 | 四川虹科创新科技有限公司 | 玻璃产线清边装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1269770A (zh) * | 1998-08-28 | 2000-10-11 | 坂东机工株式会社 | 玻璃板的折断机械 |
JP2010128407A (ja) * | 2008-12-01 | 2010-06-10 | Seiko Epson Corp | 基板の分割方法および基板の分割装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4227811B2 (ja) * | 2003-01-15 | 2009-02-18 | 日本特殊陶業株式会社 | セラミック配線基板の製造方法およびセラミック焼成品の分割装置 |
JP5277943B2 (ja) * | 2007-12-26 | 2013-08-28 | 三菱マテリアル株式会社 | 分割体の製造装置及び製造方法 |
JP5330845B2 (ja) * | 2009-01-30 | 2013-10-30 | 三星ダイヤモンド工業株式会社 | 基板ブレーク装置 |
KR101020682B1 (ko) * | 2009-05-06 | 2011-03-11 | 세메스 주식회사 | 기판 브레이크 장치 |
JP5365390B2 (ja) * | 2009-07-21 | 2013-12-11 | 三星ダイヤモンド工業株式会社 | ブレイクユニット及びブレイク方法 |
JP5210409B2 (ja) * | 2011-04-06 | 2013-06-12 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP2012197225A (ja) * | 2012-06-04 | 2012-10-18 | Bando Kiko Co Ltd | ガラス板の加工装置 |
-
2014
- 2014-03-18 JP JP2014054695A patent/JP6289949B2/ja not_active Expired - Fee Related
-
2015
- 2015-01-08 TW TW104100584A patent/TWI643826B/zh not_active IP Right Cessation
- 2015-01-09 KR KR1020150003649A patent/KR20150108737A/ko not_active Application Discontinuation
- 2015-01-27 CN CN201510040925.3A patent/CN104924469B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1269770A (zh) * | 1998-08-28 | 2000-10-11 | 坂东机工株式会社 | 玻璃板的折断机械 |
JP2010128407A (ja) * | 2008-12-01 | 2010-06-10 | Seiko Epson Corp | 基板の分割方法および基板の分割装置 |
Also Published As
Publication number | Publication date |
---|---|
CN104924469B (zh) | 2017-11-21 |
JP2015174209A (ja) | 2015-10-05 |
JP6289949B2 (ja) | 2018-03-07 |
TW201536701A (zh) | 2015-10-01 |
KR20150108737A (ko) | 2015-09-30 |
CN104924469A (zh) | 2015-09-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |