TWI632987B - 薄盤形工作件之載體裝置及其製造方法與雙邊硏磨機 - Google Patents

薄盤形工作件之載體裝置及其製造方法與雙邊硏磨機 Download PDF

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Publication number
TWI632987B
TWI632987B TW102130043A TW102130043A TWI632987B TW I632987 B TWI632987 B TW I632987B TW 102130043 A TW102130043 A TW 102130043A TW 102130043 A TW102130043 A TW 102130043A TW I632987 B TWI632987 B TW I632987B
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TW
Taiwan
Prior art keywords
work piece
trigger
notch
carrier body
carrier
Prior art date
Application number
TW102130043A
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English (en)
Chinese (zh)
Other versions
TW201417951A (zh
Inventor
芝中篤志
Original Assignee
光洋機械工業股份有限公司
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Application filed by 光洋機械工業股份有限公司 filed Critical 光洋機械工業股份有限公司
Publication of TW201417951A publication Critical patent/TW201417951A/zh
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Publication of TWI632987B publication Critical patent/TWI632987B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW102130043A 2012-09-05 2013-08-22 薄盤形工作件之載體裝置及其製造方法與雙邊硏磨機 TWI632987B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012195611A JP6033614B2 (ja) 2012-09-05 2012-09-05 薄肉円板状工作物のキャリア装置およびその製造方法、ならびに両面研削装置
JP2012-195611 2012-09-05

Publications (2)

Publication Number Publication Date
TW201417951A TW201417951A (zh) 2014-05-16
TWI632987B true TWI632987B (zh) 2018-08-21

Family

ID=49003679

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102130043A TWI632987B (zh) 2012-09-05 2013-08-22 薄盤形工作件之載體裝置及其製造方法與雙邊硏磨機

Country Status (5)

Country Link
EP (1) EP2705930B1 (ja)
JP (1) JP6033614B2 (ja)
KR (1) KR102093680B1 (ja)
SG (1) SG2013065842A (ja)
TW (1) TWI632987B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6197580B2 (ja) * 2013-10-29 2017-09-20 株式会社Sumco キャリアプレート及びワークの両面研磨装置
CN104493689B (zh) 2014-12-16 2017-01-11 天津大学 双盘直槽圆柱形零件表面研磨盘
CN114406853A (zh) * 2022-02-17 2022-04-29 安徽申容压力容器有限公司 基于多维旋转的储气罐端盖加工用夹持机构
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW431943B (en) * 1997-04-02 2001-05-01 Nippei Toyama Corp Grinding method, surface grinder, workpiece support mechanism, and work rest

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555222Y2 (ja) * 1976-05-19 1980-02-06
JP3207787B2 (ja) * 1997-04-04 2001-09-10 株式会社日平トヤマ ウエハの加工方法及び平面研削盤及びワーク支持部材
JPH11221760A (ja) * 1998-02-06 1999-08-17 Nippei Toyama Corp 被加工材の割れ発生予知方法及びこれを利用したウエハの加工方法並びに研削盤
JPH11333707A (ja) * 1998-05-26 1999-12-07 Toshiba Ceramics Co Ltd キャリア
JP2000288921A (ja) * 1999-03-31 2000-10-17 Hoya Corp 研磨用キャリア及び研磨方法並びに情報記録媒体用基板の製造方法
JP2003071704A (ja) * 2001-08-29 2003-03-12 Nippei Toyama Corp ウェーハ回転用駆動プレート
JP2003124167A (ja) * 2001-10-10 2003-04-25 Sumitomo Heavy Ind Ltd ウエハ支持部材及びこれを用いる両頭研削装置
US6899595B2 (en) * 2002-03-29 2005-05-31 Maurice J. Moriarty Seal assembly manufacturing methods and seal assemblies manufactured thereby
JP4881798B2 (ja) * 2007-06-20 2012-02-22 清水建設株式会社 部材の接合方法およびパネル構造
JP2009178780A (ja) * 2008-01-29 2009-08-13 Seiko Instruments Inc キャリア、ウエハ研磨装置、ウエハ研磨方法、圧電振動子の製造方法、圧電振動子、発振器、電子機器及び電波時計

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW431943B (en) * 1997-04-02 2001-05-01 Nippei Toyama Corp Grinding method, surface grinder, workpiece support mechanism, and work rest

Also Published As

Publication number Publication date
SG2013065842A (en) 2014-04-28
EP2705930B1 (en) 2022-02-16
EP2705930A2 (en) 2014-03-12
KR20140031816A (ko) 2014-03-13
KR102093680B1 (ko) 2020-03-26
TW201417951A (zh) 2014-05-16
EP2705930A3 (en) 2014-08-13
JP6033614B2 (ja) 2016-11-30
JP2014050901A (ja) 2014-03-20

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