SG2013065842A - Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine - Google Patents
Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machineInfo
- Publication number
- SG2013065842A SG2013065842A SG2013065842A SG2013065842A SG2013065842A SG 2013065842 A SG2013065842 A SG 2013065842A SG 2013065842 A SG2013065842 A SG 2013065842A SG 2013065842 A SG2013065842 A SG 2013065842A SG 2013065842 A SG2013065842 A SG 2013065842A
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- same
- grinding machine
- shaped workpiece
- thin disk
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012195611A JP6033614B2 (ja) | 2012-09-05 | 2012-09-05 | 薄肉円板状工作物のキャリア装置およびその製造方法、ならびに両面研削装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG2013065842A true SG2013065842A (en) | 2014-04-28 |
Family
ID=49003679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013065842A SG2013065842A (en) | 2012-09-05 | 2013-09-02 | Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2705930B1 (ja) |
JP (1) | JP6033614B2 (ja) |
KR (1) | KR102093680B1 (ja) |
SG (1) | SG2013065842A (ja) |
TW (1) | TWI632987B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6197580B2 (ja) * | 2013-10-29 | 2017-09-20 | 株式会社Sumco | キャリアプレート及びワークの両面研磨装置 |
CN104493689B (zh) | 2014-12-16 | 2017-01-11 | 天津大学 | 双盘直槽圆柱形零件表面研磨盘 |
CN114406853A (zh) * | 2022-02-17 | 2022-04-29 | 安徽申容压力容器有限公司 | 基于多维旋转的储气罐端盖加工用夹持机构 |
CN115070604B (zh) * | 2022-06-09 | 2023-09-29 | 西安奕斯伟材料科技股份有限公司 | 双面研磨装置和双面研磨方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS555222Y2 (ja) * | 1976-05-19 | 1980-02-06 | ||
US6296553B1 (en) * | 1997-04-02 | 2001-10-02 | Nippei Toyama Corporation | Grinding method, surface grinder, workpiece support, mechanism and work rest |
JP3207787B2 (ja) * | 1997-04-04 | 2001-09-10 | 株式会社日平トヤマ | ウエハの加工方法及び平面研削盤及びワーク支持部材 |
JPH11221760A (ja) * | 1998-02-06 | 1999-08-17 | Nippei Toyama Corp | 被加工材の割れ発生予知方法及びこれを利用したウエハの加工方法並びに研削盤 |
JPH11333707A (ja) * | 1998-05-26 | 1999-12-07 | Toshiba Ceramics Co Ltd | キャリア |
JP2000288921A (ja) * | 1999-03-31 | 2000-10-17 | Hoya Corp | 研磨用キャリア及び研磨方法並びに情報記録媒体用基板の製造方法 |
JP2003071704A (ja) * | 2001-08-29 | 2003-03-12 | Nippei Toyama Corp | ウェーハ回転用駆動プレート |
JP2003124167A (ja) * | 2001-10-10 | 2003-04-25 | Sumitomo Heavy Ind Ltd | ウエハ支持部材及びこれを用いる両頭研削装置 |
US6899595B2 (en) * | 2002-03-29 | 2005-05-31 | Maurice J. Moriarty | Seal assembly manufacturing methods and seal assemblies manufactured thereby |
JP4881798B2 (ja) * | 2007-06-20 | 2012-02-22 | 清水建設株式会社 | 部材の接合方法およびパネル構造 |
JP2009178780A (ja) * | 2008-01-29 | 2009-08-13 | Seiko Instruments Inc | キャリア、ウエハ研磨装置、ウエハ研磨方法、圧電振動子の製造方法、圧電振動子、発振器、電子機器及び電波時計 |
-
2012
- 2012-09-05 JP JP2012195611A patent/JP6033614B2/ja active Active
-
2013
- 2013-08-20 EP EP13181047.5A patent/EP2705930B1/en active Active
- 2013-08-22 TW TW102130043A patent/TWI632987B/zh active
- 2013-09-02 SG SG2013065842A patent/SG2013065842A/en unknown
- 2013-09-04 KR KR1020130106217A patent/KR102093680B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI632987B (zh) | 2018-08-21 |
EP2705930B1 (en) | 2022-02-16 |
EP2705930A2 (en) | 2014-03-12 |
KR20140031816A (ko) | 2014-03-13 |
KR102093680B1 (ko) | 2020-03-26 |
TW201417951A (zh) | 2014-05-16 |
EP2705930A3 (en) | 2014-08-13 |
JP6033614B2 (ja) | 2016-11-30 |
JP2014050901A (ja) | 2014-03-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2957613A4 (en) | POLISHING COMPOSITION, PRODUCTION METHOD FOR POLISHING COMPOSITION AND PRODUCTION METHOD FOR POLISHED ARTICLES | |
EP2834040A4 (en) | GRINDING PART, METHOD FOR PRODUCING THE GRINDING PART AND GRINDING MATERIAL | |
EP3013526A4 (en) | Abrasive particles, method of making abrasive particles, and abrasive articles | |
SG11201405091TA (en) | Polishing agent, polishing agent set, and substrate polishing method | |
EP2851937A4 (en) | POLISHING COMPOSITION, POLISHING METHOD THEREFOR AND METHOD FOR PRODUCING A SUBSTRATE | |
SG11201501334RA (en) | Polishing agent, polishing agent set and method for polishing base | |
SG10201605368UA (en) | NOVEL β-LACTAMASE INHIBITOR AND PROCESS FOR PREPARING THE SAME | |
EP2872292A4 (en) | ABRASIVE STAMP AND METHOD OF ABRASION OF GLASS, CERAMIC AND METALLIC MATERIAL | |
EP2868780A4 (en) | DIAMOND MONOCRYSTAL AND MANUFACTURING METHOD THEREFOR, AND MONOCRYSTALLINE DIAMOND TOOL | |
EP2703919B8 (en) | Machining process and apparatus for machining | |
HK1200759A1 (en) | Fixed-abrasive-grain wire-saw, method for manufacturing same, and method for cutting workpiece using same | |
EP2857476A4 (en) | PROCESS FOR PRODUCING ALUMINUM ABRASIVE GRAINS FOR ABRASIVE MATERIAL, AND ABRASIVE ALUMINUM GRAINS FOR THE PRODUCTION OF SAID ABRASIVE MATERIAL | |
EP2884525A4 (en) | DIAMOND SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING THEREOF | |
SG11201607115QA (en) | Manufacturing method of carrier for double-side polishing apparatus,carrier for double-side polishing apparatus, and double-side polishing method | |
SG11201405381WA (en) | Abrasive composition and method for producing semiconductor substrate | |
SG10201407353UA (en) | Substrate holder, polishing apparatus, polishing method, and retaining ring | |
EP2853350A4 (en) | POLISHING PAD AND METHOD FOR MANUFACTURING THE SAME | |
SG11201600902WA (en) | Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate | |
EP2839936A4 (en) | SHARPENED TOOL, MANUFACTURING METHOD AND PLASMA DEVICE FOR PRODUCING THEREOF | |
HUE039648T2 (hu) | Eljárás és berendezés munkadarabok elektrokémiai megmunkálására | |
EP3083145A4 (en) | Abrasive, abrasive article and the method for preparing the same | |
SG2013084256A (en) | Process for polishing a semiconductor wafer, comprising the simultaneous polishing of a front side and of a reverse side of a substrate wafer | |
SG11201406456XA (en) | Outer periphery polishing apparatus for disk-shaped workpiece | |
SG11201407086TA (en) | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | |
GB201215469D0 (en) | Diamond constructions, tools comprising same and method for making same |