EP2705930A3 - Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine - Google Patents

Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine Download PDF

Info

Publication number
EP2705930A3
EP2705930A3 EP13181047.5A EP13181047A EP2705930A3 EP 2705930 A3 EP2705930 A3 EP 2705930A3 EP 13181047 A EP13181047 A EP 13181047A EP 2705930 A3 EP2705930 A3 EP 2705930A3
Authority
EP
European Patent Office
Prior art keywords
workpiece
thin disk
shaped workpiece
main body
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13181047.5A
Other languages
German (de)
French (fr)
Other versions
EP2705930B1 (en
EP2705930A2 (en
Inventor
Atsushi Sibanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Machine Systems Corp
Original Assignee
Koyo Machine Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Machine Industries Co Ltd filed Critical Koyo Machine Industries Co Ltd
Publication of EP2705930A2 publication Critical patent/EP2705930A2/en
Publication of EP2705930A3 publication Critical patent/EP2705930A3/en
Application granted granted Critical
Publication of EP2705930B1 publication Critical patent/EP2705930B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

A carrier apparatus (6) simple and inexpensive in structure, and capable of assuring machining at high efficiency and high precision, in machining of a surface of a thin disk-shaped workpiece (W). In an apparatus for grinding the surface of a workpiece (W) while supporting and rotating a thin disk-shaped workpiece (W), the carrier apparatus (6) constitutes a workpiece rotation supporting device (5) for rotating and driving while positioning and supporting the circular outer circumference of the workpiece (W), and comprises an annular carrier main body (31) having a circular inner peripheral edge (31a) surrounding closely the whole circumference of the workpiece (W), and a notch trigger (32) having a pointed end engaging part (32b) to be engaged with a notch (Wn) in the workpiece (W), being formed as an integral piece, in which the notch trigger (32) is a separate part from the carrier main body (31), so as to be exchangeable and joined and fixed integrally, and the pointed end engaging part (32b) has a mounting structure of projecting inward in a radial direction from a part of the circular inner peripheral edge (31a) of the carrier main body (31).
EP13181047.5A 2012-09-05 2013-08-20 Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine Active EP2705930B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012195611A JP6033614B2 (en) 2012-09-05 2012-09-05 Thin-walled disk-shaped workpiece carrier device, manufacturing method thereof, and double-side grinding device

Publications (3)

Publication Number Publication Date
EP2705930A2 EP2705930A2 (en) 2014-03-12
EP2705930A3 true EP2705930A3 (en) 2014-08-13
EP2705930B1 EP2705930B1 (en) 2022-02-16

Family

ID=49003679

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13181047.5A Active EP2705930B1 (en) 2012-09-05 2013-08-20 Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine

Country Status (5)

Country Link
EP (1) EP2705930B1 (en)
JP (1) JP6033614B2 (en)
KR (1) KR102093680B1 (en)
SG (1) SG2013065842A (en)
TW (1) TWI632987B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6197580B2 (en) * 2013-10-29 2017-09-20 株式会社Sumco Double-side polishing machine for carrier plate and workpiece
CN104493689B (en) 2014-12-16 2017-01-11 天津大学 Double-disc straight-groove grinding disc for surfaces of cylindrical parts
CN114406853A (en) * 2022-02-17 2022-04-29 安徽申容压力容器有限公司 Clamping mechanism for processing end cover of gas storage tank based on multidimensional rotation
CN115070604B (en) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 Double-sided polishing apparatus and double-sided polishing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11333707A (en) * 1998-05-26 1999-12-07 Toshiba Ceramics Co Ltd Carrier
JP2000288921A (en) * 1999-03-31 2000-10-17 Hoya Corp Polishing carrier, polishing method and manufacture of information recording medium substrate
JP2003071704A (en) * 2001-08-29 2003-03-12 Nippei Toyama Corp Drive plate for rotating wafer
JP2003124167A (en) * 2001-10-10 2003-04-25 Sumitomo Heavy Ind Ltd Wafer support member and double-ended grinding device using the same
JP2009178780A (en) * 2008-01-29 2009-08-13 Seiko Instruments Inc Carrier, device and method of grinding wafer, piezoelectric transducer and its manufacturing method, oscillator, electric instrument and atomic clock

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555222Y2 (en) * 1976-05-19 1980-02-06
US6296553B1 (en) * 1997-04-02 2001-10-02 Nippei Toyama Corporation Grinding method, surface grinder, workpiece support, mechanism and work rest
JP3207787B2 (en) * 1997-04-04 2001-09-10 株式会社日平トヤマ Wafer processing method, surface grinder and work support member
JPH11221760A (en) * 1998-02-06 1999-08-17 Nippei Toyama Corp Cracking occurrance predicting method of workpiece, wafer working method utilizing the same, and grinder
US6899595B2 (en) * 2002-03-29 2005-05-31 Maurice J. Moriarty Seal assembly manufacturing methods and seal assemblies manufactured thereby
JP4881798B2 (en) * 2007-06-20 2012-02-22 清水建設株式会社 Member joining method and panel structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11333707A (en) * 1998-05-26 1999-12-07 Toshiba Ceramics Co Ltd Carrier
JP2000288921A (en) * 1999-03-31 2000-10-17 Hoya Corp Polishing carrier, polishing method and manufacture of information recording medium substrate
JP2003071704A (en) * 2001-08-29 2003-03-12 Nippei Toyama Corp Drive plate for rotating wafer
JP2003124167A (en) * 2001-10-10 2003-04-25 Sumitomo Heavy Ind Ltd Wafer support member and double-ended grinding device using the same
JP2009178780A (en) * 2008-01-29 2009-08-13 Seiko Instruments Inc Carrier, device and method of grinding wafer, piezoelectric transducer and its manufacturing method, oscillator, electric instrument and atomic clock

Also Published As

Publication number Publication date
TWI632987B (en) 2018-08-21
SG2013065842A (en) 2014-04-28
EP2705930B1 (en) 2022-02-16
EP2705930A2 (en) 2014-03-12
KR20140031816A (en) 2014-03-13
KR102093680B1 (en) 2020-03-26
TW201417951A (en) 2014-05-16
JP6033614B2 (en) 2016-11-30
JP2014050901A (en) 2014-03-20

Similar Documents

Publication Publication Date Title
EP2705930A3 (en) Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine
MX2015001303A (en) Machine for machining pipe ends, having a centering device for centering a tubular workpiece in relation to an axis of rotation.
CN105097613B (en) The chuck table of cutting apparatus
CN104354017A (en) Circumferential drilling hole positioning device for round workpiece
CN203470720U (en) Punching machine with automatic feeding and discharging devices
EP2762272A3 (en) Wafer polishing apparatus and method
CN204094516U (en) A kind of can the turning attachment of the multiple bearing pin circle end face of fast turning
EP2388093A3 (en) Tailstock device for a lathe
EP2728611A3 (en) Positioning jig and method of adjusting position
CN103447851A (en) Turning deformation prevention clamp for annular thin-wall parts
MY191928A (en) Apparatus and method for cutoff machining sintered magnet
CN102601655A (en) Fixture for clamping disc-shaped workpieces
GB201112165D0 (en) Machine tools and methods of operation therefor
CN202640134U (en) Gap-type arbitrary scale-division structure for polishing machine
JP2015100865A (en) Grinding device
CN202606865U (en) Spherical machining tool
JP2013146826A (en) Flange mechanism
CN103659341A (en) Cylinder clamp capable of adjusting radial angle in intermittent mode
CN204195285U (en) A kind of round piece circumference drilling-hole positioning device
CN204277773U (en) The electric magnetic no-core clamp that a kind of vertical grinder uses
JP2014100771A (en) Tail stock
CN203045381U (en) Thin-arm sleeve processing apparatus
CN201872012U (en) High-accuracy signal disc grinding device
EP2567788A3 (en) Positioning assembly of a hand rivet nut tool
WO2014079883A3 (en) Machine assembly, production machine with machine assembly, use and method for producing rotation components

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: B24B 37/08 20120101AFI20140708BHEP

Ipc: B24B 37/28 20120101ALI20140708BHEP

17P Request for examination filed

Effective date: 20150212

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20180628

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20210629

GRAJ Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted

Free format text: ORIGINAL CODE: EPIDOSDIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTC Intention to grant announced (deleted)
INTG Intention to grant announced

Effective date: 20211207

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602013080901

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1468594

Country of ref document: AT

Kind code of ref document: T

Effective date: 20220315

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20220216

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1468594

Country of ref document: AT

Kind code of ref document: T

Effective date: 20220216

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220616

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220516

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220516

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220517

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220616

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602013080901

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20221117

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

REG Reference to a national code

Ref country code: DE

Ref legal event code: R081

Ref document number: 602013080901

Country of ref document: DE

Owner name: JTEKT MACHINE SYSTEMS CORPORATION, YAO-SHI, JP

Free format text: FORMER OWNER: KOYO MACHINE INDUSTRIES CO., LTD., YAO-SHI, OSAKA, JP

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20220820

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220820

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220831

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220831

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20220831

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220820

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220831

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220831

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220820

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20230627

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20130820

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220216