TWI624885B - Tape for electronic device packaging - Google Patents
Tape for electronic device packaging Download PDFInfo
- Publication number
- TWI624885B TWI624885B TW106108773A TW106108773A TWI624885B TW I624885 B TWI624885 B TW I624885B TW 106108773 A TW106108773 A TW 106108773A TW 106108773 A TW106108773 A TW 106108773A TW I624885 B TWI624885 B TW I624885B
- Authority
- TW
- Taiwan
- Prior art keywords
- tape
- metal layer
- electronic device
- adhesive
- adhesive layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packages (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016072251A JP6429824B2 (ja) | 2016-03-31 | 2016-03-31 | 電子デバイスパッケージ用テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201737369A TW201737369A (zh) | 2017-10-16 |
TWI624885B true TWI624885B (zh) | 2018-05-21 |
Family
ID=59963823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106108773A TWI624885B (zh) | 2016-03-31 | 2017-03-16 | Tape for electronic device packaging |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6429824B2 (ja) |
KR (1) | KR20180129789A (ja) |
CN (1) | CN108885980B (ja) |
MY (1) | MY187765A (ja) |
SG (1) | SG11201807407SA (ja) |
TW (1) | TWI624885B (ja) |
WO (1) | WO2017168827A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6440657B2 (ja) * | 2016-07-27 | 2018-12-19 | 古河電気工業株式会社 | 電子デバイス用テープ |
JP6535118B1 (ja) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | 半導体加工用テープ |
KR102112771B1 (ko) * | 2018-03-28 | 2020-05-19 | 후루카와 덴키 고교 가부시키가이샤 | 반도체 가공용 테이프 |
KR20210138263A (ko) * | 2020-05-12 | 2021-11-19 | 삼성전자주식회사 | 반도체 칩 실장용 테이프 및 상기 테이프를 이용한 반도체 패키지 제조 방법 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201244931A (en) * | 2010-12-17 | 2012-11-16 | 3M Innovative Properties Co | A heat-sealing film and a cover tape for packaging electronic components |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4954569B2 (ja) * | 2006-02-16 | 2012-06-20 | 日東電工株式会社 | 半導体装置の製造方法 |
JP4157898B2 (ja) * | 2006-10-02 | 2008-10-01 | 株式会社神戸製鋼所 | プレス打ち抜き性に優れた電気電子部品用銅合金板 |
JP2008124141A (ja) * | 2006-11-09 | 2008-05-29 | Shin Etsu Chem Co Ltd | ダイシング・ダイボンド用接着フィルム |
JP2010120239A (ja) * | 2008-11-19 | 2010-06-03 | Nippon Steel Chem Co Ltd | 金属張積層体およびその製造方法 |
JPWO2011065252A1 (ja) * | 2009-11-30 | 2013-04-11 | 電気化学工業株式会社 | 粘着シート及び電子部品 |
JP6418756B2 (ja) * | 2013-02-28 | 2018-11-07 | 善治 堀田 | アルミニウム合金導体の製造方法及びアルミニウム合金導体を用いた電線の製造方法 |
US10418601B2 (en) * | 2014-07-22 | 2019-09-17 | Nippon Steel Corporation | Steel foil for power storage device container, power storage device container, power storage device, and manufacturing method of steel foil for power storage device container |
-
2016
- 2016-03-31 JP JP2016072251A patent/JP6429824B2/ja active Active
- 2016-11-25 WO PCT/JP2016/084926 patent/WO2017168827A1/ja active Application Filing
- 2016-11-25 CN CN201680083855.2A patent/CN108885980B/zh active Active
- 2016-11-25 SG SG11201807407SA patent/SG11201807407SA/en unknown
- 2016-11-25 KR KR1020187027717A patent/KR20180129789A/ko not_active Application Discontinuation
- 2016-11-25 MY MYPI2018702989A patent/MY187765A/en unknown
-
2017
- 2017-03-16 TW TW106108773A patent/TWI624885B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201244931A (en) * | 2010-12-17 | 2012-11-16 | 3M Innovative Properties Co | A heat-sealing film and a cover tape for packaging electronic components |
Also Published As
Publication number | Publication date |
---|---|
MY187765A (en) | 2021-10-20 |
WO2017168827A1 (ja) | 2017-10-05 |
KR20180129789A (ko) | 2018-12-05 |
JP6429824B2 (ja) | 2018-11-28 |
JP2017183641A (ja) | 2017-10-05 |
CN108885980A (zh) | 2018-11-23 |
CN108885980B (zh) | 2023-04-07 |
SG11201807407SA (en) | 2018-09-27 |
TW201737369A (zh) | 2017-10-16 |
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