KR20180129789A - 전자 디바이스 패키지용 테이프 - Google Patents
전자 디바이스 패키지용 테이프 Download PDFInfo
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- KR20180129789A KR20180129789A KR1020187027717A KR20187027717A KR20180129789A KR 20180129789 A KR20180129789 A KR 20180129789A KR 1020187027717 A KR1020187027717 A KR 1020187027717A KR 20187027717 A KR20187027717 A KR 20187027717A KR 20180129789 A KR20180129789 A KR 20180129789A
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- South Korea
- Prior art keywords
- tape
- metal layer
- adhesive layer
- electronic device
- device package
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packages (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2016-072251 | 2016-03-31 | ||
| JP2016072251A JP6429824B2 (ja) | 2016-03-31 | 2016-03-31 | 電子デバイスパッケージ用テープ |
| PCT/JP2016/084926 WO2017168827A1 (ja) | 2016-03-31 | 2016-11-25 | 電子デバイスパッケージ用テープ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20180129789A true KR20180129789A (ko) | 2018-12-05 |
Family
ID=59963823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187027717A KR20180129789A (ko) | 2016-03-31 | 2016-11-25 | 전자 디바이스 패키지용 테이프 |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6429824B2 (ja) |
| KR (1) | KR20180129789A (ja) |
| CN (1) | CN108885980B (ja) |
| MY (1) | MY187765A (ja) |
| SG (1) | SG11201807407SA (ja) |
| TW (1) | TWI624885B (ja) |
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| JP6440657B2 (ja) * | 2016-07-27 | 2018-12-19 | 古河電気工業株式会社 | 電子デバイス用テープ |
| JP6535118B1 (ja) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | 半導体加工用テープ |
| KR102112771B1 (ko) * | 2018-03-28 | 2020-05-19 | 후루카와 덴키 고교 가부시키가이샤 | 반도체 가공용 테이프 |
| KR20210138263A (ko) * | 2020-05-12 | 2021-11-19 | 삼성전자주식회사 | 반도체 칩 실장용 테이프 및 상기 테이프를 이용한 반도체 패키지 제조 방법 |
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| JP4954569B2 (ja) * | 2006-02-16 | 2012-06-20 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP4157898B2 (ja) * | 2006-10-02 | 2008-10-01 | 株式会社神戸製鋼所 | プレス打ち抜き性に優れた電気電子部品用銅合金板 |
| JP2008124141A (ja) * | 2006-11-09 | 2008-05-29 | Shin Etsu Chem Co Ltd | ダイシング・ダイボンド用接着フィルム |
| JP2010120239A (ja) * | 2008-11-19 | 2010-06-03 | Nippon Steel Chem Co Ltd | 金属張積層体およびその製造方法 |
| JPWO2011065252A1 (ja) * | 2009-11-30 | 2013-04-11 | 電気化学工業株式会社 | 粘着シート及び電子部品 |
| JP5762556B2 (ja) * | 2010-12-17 | 2015-08-12 | スリーエム イノベイティブ プロパティズ カンパニー | ヒートシール、及び電子部品をパッケージングするためのカバーテープ |
| JP6418756B2 (ja) * | 2013-02-28 | 2018-11-07 | 善治 堀田 | アルミニウム合金導体の製造方法及びアルミニウム合金導体を用いた電線の製造方法 |
| US10418601B2 (en) * | 2014-07-22 | 2019-09-17 | Nippon Steel Corporation | Steel foil for power storage device container, power storage device container, power storage device, and manufacturing method of steel foil for power storage device container |
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- 2016-11-25 WO PCT/JP2016/084926 patent/WO2017168827A1/ja active Application Filing
- 2016-11-25 CN CN201680083855.2A patent/CN108885980B/zh active Active
- 2016-11-25 SG SG11201807407SA patent/SG11201807407SA/en unknown
- 2016-11-25 KR KR1020187027717A patent/KR20180129789A/ko not_active Application Discontinuation
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2017
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|---|---|
| MY187765A (en) | 2021-10-20 |
| WO2017168827A1 (ja) | 2017-10-05 |
| JP6429824B2 (ja) | 2018-11-28 |
| JP2017183641A (ja) | 2017-10-05 |
| CN108885980A (zh) | 2018-11-23 |
| CN108885980B (zh) | 2023-04-07 |
| SG11201807407SA (en) | 2018-09-27 |
| TW201737369A (zh) | 2017-10-16 |
| TWI624885B (zh) | 2018-05-21 |
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