MY187765A - Tape for electronic device packaging - Google Patents
Tape for electronic device packagingInfo
- Publication number
- MY187765A MY187765A MYPI2018702989A MYPI2018702989A MY187765A MY 187765 A MY187765 A MY 187765A MY PI2018702989 A MYPI2018702989 A MY PI2018702989A MY PI2018702989 A MYPI2018702989 A MY PI2018702989A MY 187765 A MY187765 A MY 187765A
- Authority
- MY
- Malaysia
- Prior art keywords
- tape
- pressure
- electronic device
- adhesive layer
- sensitive adhesive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packages (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Provided is a tape for electronic device packaging, which can suppress the generation of pin marks occurring as a result of deformation of the metal layer caused by the pressure applied by pins of a pick-up apparatus when an adhesive layer-attached metal layer is picked up from a pressure-sensitive adhesive tape, and can suppress the generation of voids between the adhesive layer and an adherend. The tape for electronic device packaging 1 of the invention includes a pressure-sensitive adhesive tape 5 having a base film 51 and a pressure-sensitive adhesive layer 52; and a laminate of an adhesive layer 4 and a metal layer 3 provided by laminating on a surface of the pressure-sensitive adhesive layer 52, the surface being on the opposite side of the base film 51, in which the metal layer 3 has a tensile strength of 350 MPa or higher.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016072251A JP6429824B2 (en) | 2016-03-31 | 2016-03-31 | Electronic device packaging tape |
Publications (1)
Publication Number | Publication Date |
---|---|
MY187765A true MY187765A (en) | 2021-10-20 |
Family
ID=59963823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018702989A MY187765A (en) | 2016-03-31 | 2016-11-25 | Tape for electronic device packaging |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6429824B2 (en) |
KR (1) | KR20180129789A (en) |
CN (1) | CN108885980B (en) |
MY (1) | MY187765A (en) |
SG (1) | SG11201807407SA (en) |
TW (1) | TWI624885B (en) |
WO (1) | WO2017168827A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6440657B2 (en) * | 2016-07-27 | 2018-12-19 | 古河電気工業株式会社 | Tape for electronic devices |
JP6535118B1 (en) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
KR102112771B1 (en) * | 2018-03-28 | 2020-05-19 | 후루카와 덴키 고교 가부시키가이샤 | Semiconductor processing tape |
KR20210138263A (en) * | 2020-05-12 | 2021-11-19 | 삼성전자주식회사 | A semiconductor chip mounting tape and a method of manufacturing semiconductor package using the tape |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4954569B2 (en) * | 2006-02-16 | 2012-06-20 | 日東電工株式会社 | Manufacturing method of semiconductor device |
JP4157898B2 (en) * | 2006-10-02 | 2008-10-01 | 株式会社神戸製鋼所 | Copper alloy sheet for electrical and electronic parts with excellent press punchability |
JP2008124141A (en) * | 2006-11-09 | 2008-05-29 | Shin Etsu Chem Co Ltd | Adhesive film for dicing/die bond |
JP2010120239A (en) * | 2008-11-19 | 2010-06-03 | Nippon Steel Chem Co Ltd | Metal-clad laminate and its production method |
JPWO2011065252A1 (en) * | 2009-11-30 | 2013-04-11 | 電気化学工業株式会社 | Adhesive sheet and electronic parts |
JP5762556B2 (en) * | 2010-12-17 | 2015-08-12 | スリーエム イノベイティブ プロパティズ カンパニー | Cover tape for packaging heat seals and electronic components |
JP6418756B2 (en) * | 2013-02-28 | 2018-11-07 | 善治 堀田 | Method for producing aluminum alloy conductor and method for producing electric wire using aluminum alloy conductor |
US10418601B2 (en) * | 2014-07-22 | 2019-09-17 | Nippon Steel Corporation | Steel foil for power storage device container, power storage device container, power storage device, and manufacturing method of steel foil for power storage device container |
-
2016
- 2016-03-31 JP JP2016072251A patent/JP6429824B2/en active Active
- 2016-11-25 WO PCT/JP2016/084926 patent/WO2017168827A1/en active Application Filing
- 2016-11-25 CN CN201680083855.2A patent/CN108885980B/en active Active
- 2016-11-25 SG SG11201807407SA patent/SG11201807407SA/en unknown
- 2016-11-25 KR KR1020187027717A patent/KR20180129789A/en not_active Application Discontinuation
- 2016-11-25 MY MYPI2018702989A patent/MY187765A/en unknown
-
2017
- 2017-03-16 TW TW106108773A patent/TWI624885B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2017168827A1 (en) | 2017-10-05 |
KR20180129789A (en) | 2018-12-05 |
JP6429824B2 (en) | 2018-11-28 |
JP2017183641A (en) | 2017-10-05 |
CN108885980A (en) | 2018-11-23 |
CN108885980B (en) | 2023-04-07 |
SG11201807407SA (en) | 2018-09-27 |
TW201737369A (en) | 2017-10-16 |
TWI624885B (en) | 2018-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY189136A (en) | Tape for electronic device packaging | |
MY187765A (en) | Tape for electronic device packaging | |
MY190282A (en) | Tape for electronic device packaging | |
MY184452A (en) | Tape for electronic device packaging | |
MY191606A (en) | Sheet for semiconductor processing | |
SG11201807052WA (en) | Surface protective film | |
PH12017500284A1 (en) | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating | |
MY192601A (en) | Tape for electronic device packaging | |
SG11201902926YA (en) | Adhesive tape for semiconductor processing, and semiconductor device manufacturing method | |
SG11201807645SA (en) | Supporting sheet and composite sheet for protective film formation | |
MX2016003928A (en) | Flexible abrasive article and method of using the same. | |
MY156758A (en) | Multilayer adhesive sheet and method for manufacturing electronic component | |
EP2712908A3 (en) | Phosphor adhesive sheet, optical semiconductor element-phosphor layer pressure-sensitive adhesive body, and optical semiconductor device | |
MX2023007233A (en) | Multilayer tape. | |
MX2016015582A (en) | Label, method for manufacturing label, method for using label, and body with label. | |
SG11201708735SA (en) | Tape for semiconductor processing | |
PH12018500851B1 (en) | First protective film forming sheet | |
PH12018502253A1 (en) | Pressure-sensitive adhesive tape for semiconductor substrate fabrication | |
PH12016501335A1 (en) | Composite sheet for protective-film formation | |
SG11201808212XA (en) | Film adhesive, semiconductor processing sheet, and method for manufacturing semiconductor apparatus | |
MY183013A (en) | Sheet for semiconductor processing | |
MY187016A (en) | First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip | |
MX2016004011A (en) | Articles and methods comprising polyacrylate primer with nitrogen-containing polymer. | |
MY168172A (en) | Adhesive sheet manufacturing semiconductor device and manufacturing method of semiconductor device | |
MX2019014947A (en) | Multilayer film, laminate, airbag, and method of manufacturing laminate. |