TWI621863B - 基板檢查裝置及基板檢查方法 - Google Patents
基板檢查裝置及基板檢查方法 Download PDFInfo
- Publication number
- TWI621863B TWI621863B TW106105795A TW106105795A TWI621863B TW I621863 B TWI621863 B TW I621863B TW 106105795 A TW106105795 A TW 106105795A TW 106105795 A TW106105795 A TW 106105795A TW I621863 B TWI621863 B TW I621863B
- Authority
- TW
- Taiwan
- Prior art keywords
- measurement
- value
- inspection
- current
- good
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/16—Measuring impedance of element or network through which a current is passing from another source, e.g. cable, power line
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
- G01R31/1263—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP??2016-050233 | 2016-03-14 | ||
JP2016050233A JP6633949B2 (ja) | 2016-03-14 | 2016-03-14 | 基板検査装置及び基板検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201732309A TW201732309A (zh) | 2017-09-16 |
TWI621863B true TWI621863B (zh) | 2018-04-21 |
Family
ID=59871588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106105795A TWI621863B (zh) | 2016-03-14 | 2017-02-21 | 基板檢查裝置及基板檢查方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6633949B2 (ja) |
KR (1) | KR101961536B1 (ja) |
CN (1) | CN107192913B (ja) |
TW (1) | TWI621863B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6965110B2 (ja) * | 2017-11-09 | 2021-11-10 | 日置電機株式会社 | 検査装置および検査方法 |
JP7517680B2 (ja) * | 2020-04-15 | 2024-07-17 | ヤマハファインテック株式会社 | 検査装置、及び検査方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1556926A (zh) * | 2001-09-20 | 2004-12-22 | Oht��ʽ���� | 检查装置及检查方法 |
TWI266885B (en) * | 2001-04-19 | 2006-11-21 | Oht Inc | Inspection apparatus and inspection method |
JP2008151554A (ja) * | 2006-12-15 | 2008-07-03 | Hioki Ee Corp | 測定装置 |
CN101799516A (zh) * | 2010-02-24 | 2010-08-11 | 海洋王照明科技股份有限公司 | 一种电路板检测装置 |
US8497693B2 (en) * | 2007-10-10 | 2013-07-30 | Cascade Microtech, Inc. | Method for testing a test substrate under defined thermal conditions and thermally conditionable prober |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4588945A (en) * | 1983-06-13 | 1986-05-13 | Hewlett-Packard Company | High throughput circuit tester and test technique avoiding overdriving damage |
JP3214415B2 (ja) * | 1997-10-30 | 2001-10-02 | 日本電産リード株式会社 | 基板検査装置および基板検査方法 |
JP3619819B2 (ja) * | 2002-09-06 | 2005-02-16 | 日本電産リード株式会社 | 基板検査装置及び基板検査方法 |
JP2013170917A (ja) * | 2012-02-21 | 2013-09-02 | Nidec-Read Corp | 基板内蔵電子部品の端子判別方法及び端子判別装置 |
JP5953135B2 (ja) * | 2012-06-14 | 2016-07-20 | 日置電機株式会社 | 抵抗測定装置および回路基板検査装置 |
JP6375661B2 (ja) * | 2014-03-26 | 2018-08-22 | 日本電産リード株式会社 | 抵抗測定装置、基板検査装置、検査方法、及び検査用治具のメンテナンス方法 |
-
2016
- 2016-03-14 JP JP2016050233A patent/JP6633949B2/ja active Active
-
2017
- 2017-02-21 TW TW106105795A patent/TWI621863B/zh active
- 2017-03-07 KR KR1020170028662A patent/KR101961536B1/ko active IP Right Grant
- 2017-03-10 CN CN201710144128.9A patent/CN107192913B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI266885B (en) * | 2001-04-19 | 2006-11-21 | Oht Inc | Inspection apparatus and inspection method |
CN1556926A (zh) * | 2001-09-20 | 2004-12-22 | Oht��ʽ���� | 检查装置及检查方法 |
JP2008151554A (ja) * | 2006-12-15 | 2008-07-03 | Hioki Ee Corp | 測定装置 |
US8497693B2 (en) * | 2007-10-10 | 2013-07-30 | Cascade Microtech, Inc. | Method for testing a test substrate under defined thermal conditions and thermally conditionable prober |
CN101799516A (zh) * | 2010-02-24 | 2010-08-11 | 海洋王照明科技股份有限公司 | 一种电路板检测装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101961536B1 (ko) | 2019-03-22 |
JP6633949B2 (ja) | 2020-01-22 |
TW201732309A (zh) | 2017-09-16 |
KR20170106917A (ko) | 2017-09-22 |
CN107192913B (zh) | 2019-11-12 |
JP2017166875A (ja) | 2017-09-21 |
CN107192913A (zh) | 2017-09-22 |
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