TWI597346B - Anisotropic conductive adhesive and connecting structure - Google Patents

Anisotropic conductive adhesive and connecting structure Download PDF

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Publication number
TWI597346B
TWI597346B TW102134261A TW102134261A TWI597346B TW I597346 B TWI597346 B TW I597346B TW 102134261 A TW102134261 A TW 102134261A TW 102134261 A TW102134261 A TW 102134261A TW I597346 B TWI597346 B TW I597346B
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Taiwan
Prior art keywords
particles
anisotropic conductive
conductive adhesive
conductive particles
electronic component
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TW102134261A
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English (en)
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TW201412934A (zh
Inventor
Hidetsugu Namiki
Shiyuki Kanisawa
Akira Ishigami
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Dexerials Corp
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Publication of TWI597346B publication Critical patent/TWI597346B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
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Description

異向性導電接著劑及連接結構體
本技術涉及分散有導電性粒子的異向性導電接著劑、以及使用它的連接結構體，尤其涉及一種能夠散發驅動IC(Integrated Circuit)、LED(Light Emitting Diode)等晶片(元件)所發熱的異向性導電接著劑、以及使用它的連接結構體。
作為在基板上安裝LED元件的工法，銲線工法被使用。除此之外，作為不使用銲線的工法，有建議使用導電膏的工法，而作為不使用導電膏的工法，有建議使用異向性導電接著劑的工法。
另外，用於安裝倒裝晶片(FC：Flip Chip)的LED元件已被開發，作為在基板上安裝該FC安裝用LED元件的工法，可以使用金錫共晶接合。除此之外，作為不使用金錫共晶接合的工法，有建議使用焊膏的焊接工法，而作為不使用焊膏的工法，有建議使用異向性導電接著劑的工法。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本專利特開2005-108635號公報
[專利文獻2]日本專利特開2009-283438號公報
[專利文獻3]日本專利特開2008-041706號公報
[專利文獻4]日本專利特開2007-023221號公報
然而，因異向性導電接著劑之固化物之熱導率約為0.2W/(m‧K)，不能充分地將LED元件產生的熱量釋放至基板側。另外，使用異向性導電接著劑安裝FC，因為僅由電氣連接部分之導電性粒子成為散熱路徑，散熱性差。
因此，最好能提供一種可獲得高散熱性的異向性導電接著劑及連接結構體。
在本技術中，發現藉由摻合在樹脂粒子的表面上形成有導電性金屬層的導電性粒子與平均粒徑小於導電性粒子的導熱性粒子，可達到上述目的。
即，本技術之一種實施形態中的異向性導電接著劑包含：導電性粒子、導熱性粒子、及使導電性粒子和導熱性粒子分散的接著劑成分。導電性粒子含有樹脂粒子及在該樹脂粒子之表面上形成的導電性金屬層。導熱性粒子是平均粒徑小於導電性粒子的金屬粒子，或是含有金屬粒子及在該金屬粒子之表面上形成的絕緣層且平均粒徑小於導電性粒子的絕緣塗層粒子。
另外，本技術之一種實施形態中的連接結構體包含：第1電子部件之端子、第2電子部件之端子、導電性粒子及導熱性粒子。導電 性粒子含有樹脂粒子及在該樹脂粒子之表面上形成的導電性金屬層，且配置在第1電子部件之端子與第2電子部件之端子之間使第1電子部件之端子與第2電子部件之端子電氣連接。導熱性粒子是平均粒徑小於導電性粒子的金屬粒子，或是含有金屬粒子及在該金屬粒子之表面上形成的絕緣層且平均粒徑小於導電性粒子的絕緣塗層粒子，且配置並保持在第1電子部件之端子與第2電子部件之端子之間。
根據本技術之一種實施形態中的異向性導電接著劑或連接結構體，因為在壓接時導電性粒子被按壓成扁平狀，同時導熱性粒子被壓碎使其與兩端子的接觸面積增大，而可獲得高散熱性。
11、101‧‧‧元件基板
12、102‧‧‧第1導電型披覆層
13、103‧‧‧活性層
14、104‧‧‧第2導電型披覆層
15、105‧‧‧鈍化層
21、201‧‧‧基材
22、202‧‧‧第1導電型用電路圖案
23、203‧‧‧第2導電型用電路圖案
31、306‧‧‧導電性粒子
32‧‧‧導熱性粒子
33、305‧‧‧黏合劑
301‧‧‧銲線
302‧‧‧固晶材
303‧‧‧導電膏
304‧‧‧密封樹脂
307‧‧‧金錫合金
圖1是壓接前的對向端子間之示意剖面圖。
圖2是壓接後的對向端子間之示意剖面圖。
圖3是本技術之一種實施形態中的LED安裝體之一實例之示意剖面圖。
圖4是本技術之其他實施形態中的LED安裝體之一實例之示意剖面圖。
圖5是使用銲線工法的LED安裝體之一實例之示意剖面圖。
圖6是使用導電膏的LED安裝體之一實例之示意剖面圖。
圖7是使用異向性導電接著劑的LED安裝體之一實例之示意剖面圖。
圖8是FC安裝用LED由金錫共晶接合安裝的LED安裝體之一實例之示意剖面圖。
圖9是FC安裝用LED由導電膏安裝的LED安裝體之一實例之示意剖 面圖。
圖10是FC安裝用LED由異向性導電接著劑安裝的LED安裝體之一實例之示意剖面圖。
後文將參照附圖按以下的順序詳細闡述本技術之一種實施形態。
1、異向性導電接著劑及其製造方法
2、連接結構體及其製造方法
3、實施例
<1. 異向性導電接著劑及其製造方法>
本技術之一種實施形態中的異向性導電接著劑是在黏合劑(接著劑成分)中分散有於樹脂粒子的表面上形成有導電性金屬層的導電性粒子、及平均粒徑小於該導電性粒子的導熱性粒子之接著劑，其形狀有膏狀、膜狀等，可按使用目的適宜選擇。
圖1及圖2分別是壓接前及壓接後的對向端子間之示意剖面圖。在本技術之一種實施形態中，通過使異向性導電接著劑具有後文所述的構成，可在壓接前使導電性粒子31與導熱性粒子32存在於端子間。隨後在壓接時，因使用樹脂粒子作為芯材的導電性粒子31被按壓成扁平狀而產生反彈，可維持電氣連接的狀態。另外在壓接時，因導熱性粒子32伴隨導電性粒子的扁平變形被壓碎，使其與端子的接觸面積增大，可提高散熱性。此外，作為導熱性粒子32，當使用在高導熱性金屬粒子之表面形成有絕緣 層的絕緣塗層粒子時，因通過按壓絕緣層破裂使金屬部分與端子接觸，可提高散熱性且獲得優異的耐電壓性。
導電性粒子是在環氧樹脂、酚醛樹脂、丙烯酸樹脂、丙烯腈-苯乙烯(AS)樹脂、苯胍(benzoguanamine)樹脂、二乙烯基苯類樹脂、苯乙烯類樹脂的表面覆蓋有Au、Ni、Zn等金屬(導電性金屬層)的金屬塗層樹脂粒子。因金屬塗層樹脂粒子在壓縮時容易變形、壓碎，可增大與配線圖案的接觸面積，另外，可吸收配線圖案之高度的變動。
此外，導電性粒子之平均粒徑較佳為1μm~10μm，更較佳為2μm~6μm。另外，鑑於連接可靠性及絕緣可靠性，導電性粒子的摻合量較佳為對每100質量份的黏合劑摻合1質量份~100質量份的導電性粒子。
導熱性粒子係金屬粒子、或是在金屬粒子之表面形成有絕緣層的絕緣塗層粒子。另外，導熱性粒子之形狀有粒狀、鱗片狀等，可按使用目的適宜選擇。
金屬粒子、及絕緣塗層粒子的金屬粒子較佳具有200W/(m‧K)以上的熱導率。若熱導率不滿200W/(m‧K)，則熱阻變大，散熱性變差。作為具有200W/(m‧K)以上的熱導率的金屬粒子、及絕緣塗層粒子的金屬粒子，可列舉Ag、Au、Cu、Pt等金屬單質或它們的合金等。其中，鑑於LED的取光效率及壓接時容易壓碎，較佳為Ag或以Ag為主要成分的合金。
另外，金屬粒子的摻合量較佳為5體積%~40體積%。若金屬粒子的摻合量太少則不能獲得優異的散熱性，配合量太多則不能獲得 連接可靠性。
此外，絕緣塗層粒子之絕緣層較佳為苯乙烯樹脂、環氧樹脂及丙烯酸樹脂等樹脂，或SiO2、Al2O3、TiO2等無機材料。另外，絕緣塗層粒子之絕緣層之厚度較佳為10nm~1000nm，更較佳為20nm~1000nm，進一步較佳為100nm~800nm。若絕緣層太薄則不能獲得優異的耐電壓性，絕緣層太厚則連接結構體之熱阻變大。
另外，絕緣塗層粒子的摻合量較佳為5體積%~50體積%。若絕緣塗層粒子的摻合量太少則不能獲得優異的散熱性，配合量太多則不能獲得連接可靠性。
另外，導熱性粒子之平均粒徑(D50)較佳為導電性粒子之平均粒徑的5%~80%。相對於導電性粒子若導熱性粒子太小，則壓接時在對向端子之間不能捕捉到導熱性粒子，不能獲得優異的散熱性。另一方面，相對於導電性粒子若導熱性粒子太大，則不能高密度填充導熱性粒子，不能提高異向性導電接著劑之固化物之熱導率。
另外，導熱性粒子較佳為白色或灰色的非彩色。由此，導熱性粒子充當光反射粒子，當使用LED元件時，可獲得高亮度。
黏合劑可以利用在以往的異向性導電接著劑及異向性導電膜中使用的接著劑組成物。作為接著劑組成物，可列舉以脂環式環氧化合物、雜環環氧化合物、氫化環氧化合物等為主要成分的環氧固化類接著劑。
作為脂環式環氧化合物，可較佳列舉在分子中具有兩個以上環氧基者。它們可以是液體狀態也可以是固體狀態。具體可列舉六氫雙酚A縮水甘油醚、3,4-環氧環己基甲基-3',4'-環氧環己基甲酸酯等。其中，鑑 於能確保適合於LED元件安裝等的固化物之光學透射性及具有優異的快速固化性，可較佳使用3,4-環氧環己基甲基-3',4'-環氧環己基甲酸酯。
作為雜環環氧化合物，可列舉具有三嗪環的環氧化合物，可特別較佳列舉1,3,5-三(2,3-環氧丙基)-1,3,5-三嗪-2,4,6-(1H,3H,5H)-三酮。
氫化環氧化合物可以使用上述脂環式環氧化合物及雜環環氧化合物的氫化產物、及其它已知的氫化環氧樹脂。
脂環式環氧化合物、雜環環氧化合物及氫化環氧化合物可以單獨使用，也可以兩種或兩種以上組合使用。另外，只要不損害本技術的效果，這些環氧化合物也可與其他環氧化合物組合使用。例如可列舉：雙酚A、雙酚F、雙酚S、四甲基雙酚A、二芳基雙酚A、對苯二酚、鄰苯二酚、間苯二酚、甲酚、四溴雙酚A、三羥基聯苯、二苯甲酮、雙間苯二酚、雙酚六氟丙酮、四甲基雙酚F、三(羥苯基)甲烷、雙二甲苯酚(bixylenol)、苯酚酚醛清漆、甲酚酚醛清漆等多元酚與環氧氯丙烷反應生成的縮水甘油醚；甘油、新戊二醇、乙二醇、丙二醇、己二醇、聚乙二醇、聚丙二醇等脂族多元醇與環氧氯丙烷反應生成的聚縮水甘油醚；如對-羥基苯甲酸、β-氧代-萘甲酸那樣的羥基羧酸與環氧氯丙烷反應生成的縮水甘油醚酯；從鄰苯二甲酸、甲基鄰苯二甲酸、間苯二甲酸、對苯二甲酸、四氫鄰苯二甲酸、內亞甲基四氫鄰苯二甲酸、內亞甲基六氫鄰苯二甲酸、1,2,4-苯三甲酸、聚合脂肪酸那樣的聚羧酸獲得的聚縮水甘油酯；從胺基苯酚、胺基烷基苯酚獲得的縮水甘油胺基縮水甘油醚；從胺基苯甲酸獲得的縮水甘油胺基縮水甘油酯；從苯胺、甲苯胺、三溴苯胺、伸茬基二胺、二胺基環 己烷、雙胺基甲基環己烷、4,4'-二胺基二苯基甲烷、4,4'-二胺基二苯基碸等獲得的縮水甘油胺；環氧化聚烯烴等已知的環氧樹脂類。
作為固化劑，可列舉酸酐、咪唑化合物、雙氰等。其中，可較佳使用不易使固化物變色的酸酐，特別是脂環式酸酐類固化劑。具體可較佳列舉甲基六氫鄰苯二甲酸酐等。
在接著劑組成物中，當使用脂環式環氧化合物及脂環式酸酐類固化劑時，若脂環式酸酐類固化劑太少則未固化的環氧化合物趨於增多，若太多則因剩餘的固化劑的影響被黏合材料的腐蝕趨於加快，為此，對於每100質量份的脂環式環氧化合物，脂環式酸酐類固化劑的摻合量較佳為80質量份~120質量份，更較佳為95質量份~105質量份。
如此構成的異向性導電接著劑，在壓接時因導電性粒子被按壓成扁平狀且導熱性粒子被壓碎，使其與兩端子的接觸面積增加，可獲得高散熱性及高連接可靠性。
另外，本技術之一種實施形態中的異向性導電接著劑可通過均勻混合接著劑組成物、導電性粒子與導熱性粒子而製成。
<2. 連接結構體及其製造方法>
接下來，使用上述異向性導電接著劑對連接結構體進行說明。在本技術之一種實施形態中的連接結構體中，第1電子部件之端子與第2電子部件之端子通過在樹脂粒子的表面上形成有導電性金屬層的導電性粒子進行電氣連接，其中，在該第1電子部件之端子與該第2電子部件之端子之間，能捕捉(保持)到平均粒徑小於該導電性粒子的導熱性粒子。
本技術之一種實施形態中的電子部件適用於發熱的驅動IC (Integrated Circuit)、LED(Light Emitting Diode)等晶片(元件)。
圖3是LED之安裝體之構成之示意剖面圖。在該LED安裝體中，使用在接著劑成分中分散有上述導電性粒子、平均粒徑小於該導電性粒子的導熱性粒子的異向性導電接著劑，將LED元件(第1電子部件)與基板(第2電子部件)連接。
LED元件例如在由藍寶石形成的元件基板11上，具有例如由n-GaN形成的第1導電型披覆層12、例如由InxAlyGa1-x-yN層形成的活性層13及例如由p-GaN形成的第2導電型披覆層14，具有所謂的雙異質結構體。另外，在第1導電型披覆層12之一部分上具有第1導電型電極12a，在第2導電型披覆層14之一部分上具有第2導電型電極14a。當在LED元件之第1導電型電極12a與第2導電型電極14a之間施加電壓時，藉由載流子在活性層13上集中並再結合以致發光。
在基板中，基材21上具有第1導電型用電路圖案22及第2導電型用電路圖案23，在對應於LED元件之第1導電型電極12a及第2導電型電極14a處分別具有電極22a及電極23a。
異向性導電接著劑與上述相同，在黏合劑33中分散有導電性粒子31、平均粒徑小於導電性粒子31的導熱性粒子32。
如圖3所示，在LED安裝體中，LED元件之端子(電極12a、14a)與基板之端子(電極22a、23a)通過導電性粒子31電氣連接，在LED元件之端子與基板之端子之間，能捕捉到導熱性粒子32。
因此，可有效地將LED元件之活性層13產生的熱量釋放至基板側，防止發光效率降低且可延長LED安裝體之使用壽命。另外，由於 導熱性粒子32是白色或灰色的非彩色，可反射來自活性層13的光，獲得高亮度。
另外，如圖4所示，用於安裝倒裝晶片的LED元件因為通過鈍化層105(參照圖8及圖9)可較大地設計LED元件之端子(電極12a、14a)，以至在LED元件之端子(電極12a、14a)與基板之端子(電路圖案22、23)之間能捕捉到更多的導電性粒子31及導熱性粒子32。因此，可更有效地將LED元件之活性層13產生的熱量釋放至基板側。
接下來，對上述連接結構體之製造方法進行說明。本技術之一種實施形態中的安裝體之製造方法係將在接著劑成分中分散有上述導電性粒子、平均粒徑小於該導電性粒子的導熱性粒子的異向性導電接著劑夾於第1電子部件之端子與第2電子部件之端子之間，且將第1電子部件與第2電子部件加熱加壓。
因此，第1電子部件之端子與第2電子部件之端子通過導電性粒子電氣連接，且可獲得在第1電子部件之端子與第2電子部件之端子之間能捕捉到導熱性粒子的連接結構體。
本技術之一種實施形態中的連接結構體之製造方法，因在壓接時導電性粒子被按壓成扁平狀且導熱性粒子被壓碎，使其與兩端子的接觸面積增加，可獲得高散熱性及高連接可靠性。
再者，作為不使用上述本技術之一種實施形態中的異向性導電接著劑及連接結構體的工法及其問題，如下所述。
作為在基板上安裝LED元件的工法，銲線工法被使用。如圖5所示，銲線工法係將LED元件之電極(第1導電型電極104a及第2導 電型電極102a)面朝上(Face-up)，使用銲線(WB：Wire Bonding)301a、301b對該LED元件與基板進行電氣接合，使用固晶材302對該LED元件與基板進行黏合。
然而，像這種用銲線進行電氣連接的方法，因為有來自電極(第1導電型電極104a及第2導電型電極102a)的銲線之物理斷裂、剝落的風險，要求更高更可靠的技術。再者，固晶材302之固化過程因使用烘箱固化，需要很長的生產時間。
作為不使用銲線的工法，如圖6所示，有將LED元件之電極(第1導電型電極104a及第2導電型電極102a)面朝向基板一側(面朝下、倒裝晶片)，使用以銀膏為代表的導電膏303(303a、303b)對該LED元件與基板進行電氣連接的方法。
但是，因為導電膏303(303a、303b)之黏合力弱，需用密封樹脂304進行加固。再者，密封樹脂304之固化過程因使用烘箱固化，需要很長的生產時間。
作為不使用導電膏的工法，如圖7所示，有將LED元件之電極面朝向基板一側(面朝下、倒裝晶片)，使用在絕緣接著劑黏合劑305中分散有導電性粒子306的異向性導電接著劑對該LED元件與基板進行電氣連接及黏合的方法。因為異向性導電接著劑之黏合過程短，故生產效率好。另外，異向性導電接著劑價格低廉，且具有優異的透明性、黏合性、耐熱性、機械強度、電氣絕緣性等。
此外，用於安裝FC的LED元件已被開發。該FC安裝用LED元件，因為通過鈍化層105可較大地設計電極面積，故可進行無干擾安裝。 另外，通過在發光層下設置反射膜可使取光效率得到提高。
作為在基板上安裝FC安裝用LED元件的工法，如圖8所示，可以使用金錫共晶接合。金錫共晶接合之工法是藉由用金錫合金307形成晶片電極，然後在基板上塗佈助焊劑、搭載晶片並加熱，以使基板與電極共晶接合。但是，像這種焊接工法因由在加熱中發生晶片移動及助焊劑沒有被洗淨而影響可靠性，故產量不好。另外需要高度的安裝技術。
作為不使用金錫共晶的工法，如圖9所示，有使用焊膏對LED元件與基板進行電氣連接的焊接工法。但是，像這種焊接工法因為該膏具有等向性的導電性，故pn電極之間將發生短路導致產量不好。
作為不使用焊膏的工法，如圖10所示，有使用與圖7相同的在絕緣黏合劑中分散有導電性粒子的ACF(Anisotropic conductive film)等異向性導電接著劑對LED元件與基板進行電氣連接及黏合的方法。使用異向性導電接著劑時，pn電極之間被填充有絕緣黏合劑。於是，因不易發生短路可提高產量。另外，由於黏合過程短，故生產效率良好。
然而，LED元件之活性層(交界處(junction))103除了光之外還產生大量的熱量，若發光層溫度(Tj=交界處溫度)達到100℃以上，則LED之發光效率降低，LED之壽命變短。因此，需要一個能有效地釋放活性層103之熱量的結構。
在圖5所示的WB安裝中，由於活性層103處於LED元件之上方，產生的熱量不能有效地傳遞至基板側，故散熱性差。
此外，若如圖6、圖8及圖9所示安裝倒裝晶片，由於活性層103處於基板側，則熱量能有效地傳遞至基板側。如圖6及圖9所示，在 電極之間用導電膏303(303a、303b)接合時，雖可高效率地放熱，但利用導電膏303(303a、303b)進行的連接如上所述連接可靠性差。另外，如圖8所示，即使進行金錫共晶接合，也與上述連接相同、連接可靠性差。
另外，如圖7及圖10所示，不使用導電膏303(303a、303b)藉由使用ACF及ACP(Anisotropic Conductive Paste)等異向性導電接著劑安裝倒裝晶片，可使活性層103配置於基板側附近，有效地將熱量傳遞至基板側。另外，因為黏合力強，可提高連接可靠性。
<3. 實施例>
下文將詳細闡述本技術之實施例，但本技術不限於這些實施例。
<3.1 關於導熱性粒子之類型>
在本實驗中，製作摻合有導熱性粒子的異向性導電接著劑，並製作LED安裝體，然後對導熱性粒子之類型進行了探討。
按照以下的方法進行異向性導電接著劑的製作、異向性導電接著劑之固化物之熱導率的量測、LED安裝體的製作、LED安裝體之散熱性的評價、光學特性的評價及電氣特性的評價。
[異向性導電接著劑的製作]
在環氧固化類接著劑(環氧樹脂(產品名：CEL2021P、大賽璐(Daicel)化學股份公司製造)及酸酐(MeHHPA、產品名：MH700、以新日本理化股份公司的製品為主要成分的黏合劑)中，摻合10質量%的在樹脂粒子之表面具有Au塗層且平均粒徑為5μm的導電性粒子(產品名：AUL705、積水化學工業公司製造)。在該樹脂組成物中摻合導熱性粒子，製成具有導熱性的異向性導電接著劑。
[異向性導電接著劑之固化物之熱導率的量測]
用玻璃板將異向性導電接著劑夾住，使其在150℃、1小時的條件下固化，獲得厚度為1mm的固化物。然後，使用雷射光閃光原理的量測裝置(氙閃光分析儀LFA447、NETZSCH製造)量測固化物之熱導率。
[LED安裝體的製作]
使用異向性導電接著劑將LED晶片(藍色LED、Vf=3.2V(If=20mA))安裝在Au電極基板上。將異向性導電接著劑塗佈於Au電極基板後，對準安裝LED晶片，且在200℃-20秒-1kg/chip的條件下進行加熱壓接。使用凹凸焊接機形成Au凸點後，進行平坦化處理以用作Au電極基板(環氧玻璃基板、導電空間=100μm、Ni/Au鍍層=5.0μm/0.3μm、金凸點=15μm)。
[散熱性的評價]
使用瞬態熱阻量測裝置(CATS電子設計公司製造)量測LED安裝體之熱阻(℃/W)。量測條件為If=200mA(恆定電流控制)。
[光學特性的評價]
使用積分球原理的全光束量測裝置(LE-2100、大塚電子股份公司製造)量測LED安裝體之全光束量(mlm)。量測條件為If=200mA(恆定電流控制)。
[電氣特性的評價]
作為初期Vf值，量測了If=20mA時的Vf值。另外，在85℃、85%RH的環境下，將LED安裝體在If=20mA的條件下點燈500小時(高溫高濕試驗)，量測了If=20mA時的Vf值。連接可靠性如下進行評價：比初期Vf值 上升5%以上即作為“導電NG”，比初期Vf值下降5%以上即作為“絕緣NG”，其他作為“良”。再者，“NG”表示“不良”。
[實施例1]
使用平均粒徑(D50)為1μm的Ag粒子(熱導率：428W/(m‧K))作為導熱性粒子。在上述樹脂組成物中摻合5體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為0.3W/(m‧K)。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為160℃/W，全光束量的量測結果為320mlm，連接可靠性的評價結果為初期是“良”、高溫高濕試驗後是“良”。
[實施例2]
使用平均粒徑(D50)為1μm的Ag粒子(熱導率：428W/(m‧K))作為導熱性粒子。在上述樹脂組成物中摻合20體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為0.4W/(m‧K)。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為130℃/W，全光束量的量測結果為300mlm，連接可靠性的評價結果為初期是“良”、高溫高濕試驗後是“良”。
[實施例3]
使用平均粒徑(D50)為1μm的Ag粒子(熱導率：428W/(m‧K))作為導熱性粒子。在上述樹脂組成物中摻合40體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導 率的量測結果為0.5W/(m‧K)。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為120℃/W，全光束量的量測結果為280mlm，連接可靠性的評價結果為初期是“良”、高溫高濕試驗後是“良”。
[實施例4]
使用在Ag粒子之表面塗有厚100nm的SiO2的平均粒徑(D50)為1μm的絕緣塗層粒子作為導熱性粒子。在上述樹脂組成物中摻合50體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為0.5W/(m‧K)。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為115℃/W，全光束量的量測結果為280mlm，連接可靠性的評價結果為初期是“良”、高溫高濕試驗後是“良”。
[實施例5]
使用平均粒徑(D50)為1.5μm的Ag/Pd合金粒子(熱導率：400W/(m‧K))作為導熱性粒子。在上述樹脂組成物中摻合5體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為0.4W/(m‧K)。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為135℃/W，全光束量的量測結果為300mlm，連接可靠性的評價結果為初期是“良”、高溫高濕試驗後是“良”。
[比較例1]
製作不摻合導熱性粒子的異向性導電接著劑。該異向性導電接著劑之 固化物之熱導率的量測結果為0.2W/(m‧K)。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為200℃/W，全光束量的量測結果為330mlm，連接可靠性的評價結果為初期是“良”、高溫高濕試驗後是“良”。
[比較例2]
使用平均粒徑(D50)為1μm的Ag粒子(熱導率：428W/(m‧K))作為導熱性粒子。在上述樹脂組成物中摻合50體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為0.55W/(m‧K)。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為110℃/W，全光束量的量測結果為250mlm，連接可靠性的評價結果為初期是“良”、高溫高濕試驗後是“絕緣NG”。
[比較例3]
使用平均粒徑(D50)為1.2μm的AlN粒子(熱導率：190W/(m‧K))作為導熱性粒子。在上述樹脂組成物中摻合55體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為1.0W/(m‧K)。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為170℃/W，全光束量的量測結果為250mlm，連接可靠性的評價結果為初期是“良”、高溫高濕試驗後是“導電NG”。
表1表示實施例1~5、及比較例1~3的評價結果。
如比較例1，當不添加導熱性粒子時，異向性導電接著劑之固化物之熱導率為0.2W/(m‧K)，LED安裝體之熱阻為200℃/W，不能獲得優異的散熱性。
另外，如比較例2，當摻合50體積%的Ag粒子時，異向性導電接著劑之固化物之熱導率為0.55W/(m‧K)，LED安裝體之熱阻為110℃/W，獲得了比比較例1優異的散熱性。但是，因為Ag粒子的摻合量多，在對LED安裝體進行高溫高濕試驗後Vf值比初期Vf值下降了5%以上。
此外，如比較例3，當摻合55體積%的AlN粒子時，異向性導電接著劑之固化物之熱導率為1.0W/(m‧K)，然而因AlN的熱導率低，LED安裝體之熱阻為170℃/W。另外，因為AlN粒子的摻合量多、且AlN的電氣絕緣性高，在對LED安裝體進行高溫高濕試驗後Vf值比初期Vf值上升了5%以上。
另一方面，如實施例1~3，當摻合5體積%~40體積%的Ag粒子時，異向性導電接著劑之固化物之熱導率為0.3W/(m‧K)~0.5W/(m‧K)，LED安裝體之熱阻為120℃/W~160℃/W，獲得了比比較例1優異的散熱性。另外，在對LED安裝體進行高溫高濕試驗後，也能獲得高的連接可靠性。
另外，如實施例4，當使用在Ag粒子之表面塗有SiO2的絕緣塗層粒子時，即使摻合50體積%，在對LED安裝體進行高溫高濕試驗後，也能獲得高的連接可靠性。另外，異向性導電接著劑之固化物之熱導率為0.5W/(m‧K)，LED安裝體之熱阻為115℃/W，獲得了比比較例1優異 的散熱性。
另外，如實施例5，當摻合20體積%的Ag/Pd粒子時，異向性導電接著劑之固化物之熱導率為0.4W/(m‧K)，LED安裝體之熱阻為135℃/W，獲得了比比較例1優異的散熱性。另外，在對LED安裝體進行高溫高濕試驗後，也能獲得高的連接可靠性。
<3.2 關於絕緣塗層粒子之絕緣層的厚度>
在本實驗中，製作摻合有將在金屬粒子之表面形成有絕緣層的絕緣塗層粒子作為導電性粒子的異向性導電接著劑(ACP)、製作LED安裝體，對絕緣塗層粒子之絕緣層的厚度進行了探討。
按照與上述<3.1 關於導熱性粒子之類型>相同的方法進行異向性導電接著劑的製作、LED安裝體的製作、異向性導電接著劑之固化物之熱導率的量測、LED安裝體之散熱性的評價、及光學特性的評價。另外，按照以下的方法進行絕緣塗層粒子的製作、及ACP固化物之耐電壓的量測。
[絕緣塗層粒子的製作]
將以苯乙烯為主要成分的樹脂粉末(接著劑層，粒徑為0.2μm)與Ag的金屬粉末(粒徑為1μm)混合後，通過利用物理力使粉末彼此碰撞成膜的成膜裝置(細川密克朗(Hosokawa Micron)製Mechanofusion)，獲得在Ag的金屬粉末之表面形成有約厚100nm的白色絕緣層的金屬。
[ACP固化物之耐電壓的量測]
在呈梳葉狀圖案的配線基板上，塗佈厚度為100nm的ACP固化物。將梳葉的兩極的電壓被施加到500V，有0.5mA電流流過時的電壓作為耐電 壓。對配線間的空間為25μm時的耐電壓、及配線間的空間為100μm時的耐電壓進行量測。
[實施例6]
使用在Ag粒子之表面塗有厚20nm的苯乙烯樹脂的平均粒徑(D50)為1μm的絕緣塗層粒子作為導熱性粒子。在上述樹脂組成物中摻合50體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為0.5W/(m‧K)，當配線間的空間為25μm時的耐電壓的試驗結果為150V，當配線間的空間為100μm時的耐電壓的試驗結果超過500V。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為130℃/W，全光束量的量測結果為300mlm。
[實施例7]
使用在Ag粒子之表面塗有厚100nm的苯乙烯樹脂的平均粒徑(D50)為1μm的絕緣塗層粒子作為導熱性粒子。在上述樹脂組成物中摻合50體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為0.4W/(m‧K)，當配線間的空間為25μm時的耐電壓的試驗結果為210V，當配線間的空間為100μm時的耐電壓的試驗結果超過500V。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為120℃/W，全光束量的量測結果為280mlm。
[實施例8]
使用在Ag粒子之表面塗有厚800nm的苯乙烯樹脂的平均粒徑(D50)為1μm的絕緣塗層粒子作為導熱性粒子。在上述樹脂組成物中摻合50體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導 電接著劑之固化物之熱導率的量測結果為0.5W/(m‧K)，當配線間的空間為25μm時的耐電壓的試驗結果為450V，當配線間的空間為100μm時的耐電壓的試驗結果超過500V。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為115℃/W，全光束量的量測結果為280mlm。
[實施例9]
使用在Ag粒子之表面塗有厚100nm的SiO2的平均粒徑(D50)為1μm的絕緣塗層粒子作為導熱性粒子。與實施例4相同，在上述樹脂組成物中摻合50體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為0.5W/(m‧K)，當配線間的空間為25μm時的耐電壓的試驗結果為230V，當配線間的空間為100μm時的耐電壓的試驗結果超過500V。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為115℃/W，全光束量的量測結果為280mlm。
[實施例10]
使用在Ag/Pd合金粒子之表面塗有厚100nm的苯乙烯樹脂的平均粒徑(D50)為1.5μm的絕緣塗層粒子作為導熱性粒子。在上述樹脂組成物中摻合50體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為0.4W/(m‧K)，當配線間的空間為25μm時的耐電壓的試驗結果為210V，當配線間的空間為100μm時的耐電壓的試驗結果超過500V。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為135℃/W，全光束量的量測結果為280mlm。
[比較例4]
製作不摻合導熱性粒子的異向性導電接著劑。與比較例1相同，該異向性導電接著劑之固化物之熱導率的量測結果為0.2W/(m‧K)，當配線間的空間為25μm時的耐電壓的試驗結果為200V，當配線間的空間為100μm時的耐電壓的試驗結果超過500V。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為200℃/W，全光束量的量測結果為330mlm。
[比較例5]
使用平均粒徑(D50)為1μm的Ag粒子(熱導率：428W/(m‧K))作為導熱性粒子。在上述樹脂組成物中摻合50體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。與比較例2相同，該異向性導電接著劑之固化物之熱導率的量測結果為0.55W/(m‧K)，當配線間的空間為25μm時的耐電壓的試驗結果為100V，當配線間的空間為100μm時的耐電壓的試驗結果為200V。另外，使用該異向性導電接著劑製成的LED安裝體之熱阻的量測結果為110℃/W，全光束量的量測結果為250mlm。
[比較例6]
使用在Ag粒子之表面塗有厚1100nm的苯乙烯樹脂的平均粒徑(D50)為1μm的絕緣塗層粒子作為導熱性粒子。在上述樹脂組成物中摻合50體積%的該導熱性粒子，製成具有導熱性的異向性導電接著劑。該異向性導電接著劑之固化物之熱導率的量測結果為0.4W/(m‧K)，當配線間的空間為25μm時的耐電壓的試驗結果為300V，當配線間的空間為100μm時的耐電壓的試驗結果超過500V。另外，使用該異向性導電接著劑製成的LED 安裝體之熱阻的量測結果為190℃/W，全光束量的量測結果為300mlm。
表2表示實施例6~10、及比較例4~6的評價結果。
如比較例4，當不添加導熱性粒子時，與比較例1相同，異向性導電接著劑之固化物之熱導率為0.2W/(m‧K)，LED安裝體之熱阻為200℃/W，不能獲得優異的散熱性。關於耐電壓，異向性導電接著劑之固化物的配線間的空間為25μm時為200V，配線間的空間為100μm時超過500V，獲得了穩定的絕緣性。
另外，如比較例5，當摻合50體積%的Ag粒子時，與比較例2相同，異向性導電接著劑之固化物之熱導率為0.55W/(m‧K)，LED安裝體之熱阻為110℃/W，獲得了比比較例1優異的散熱性。但是，因為Ag粒子的摻合量多，異向性導電接著劑之固化物的配線間的空間為25μm時的耐電壓為100V，配線間的空間為100μm時的耐電壓為200V，沒有獲得穩定的絕緣性。
另外，如比較例6，當使用在Ag粒子之表面塗有厚1100nm的苯乙烯樹脂的絕緣塗層粒子時，異向性導電接著劑之固化物之熱導率為0.4W/(m‧K)。但是，LED安裝體之熱阻為190℃/W，僅獲得略低於比較例4的值。這可能是因為苯乙烯樹脂的絕緣層厚，熱傳導受到抑制。關於耐電壓，異向性導電接著劑之固化物的配線間的空間為25μm時為300V，配線間的空間為100μm時超過500V，獲得了穩定的絕緣性。
另一方面，如實施例6~8，當苯乙烯樹脂的絕緣層之厚度為20nm~800nm時，異向性導電接著劑之固化物之熱導率為0.4W/(m‧K)~0.5W/(m‧K)，LED安裝體之熱阻為115℃/W~130℃/W，獲得了比比較例1優異的散熱性。另外，異向性導電接著劑之固化物的配線間的空間為25μm時的耐電壓為210V~450V，配線間的空間為100μm 時的耐電壓超過500V，獲得了穩定的絕緣性。
另外，如實施例9，當使用在Ag粒子之表面塗有SiO2的絕緣塗層粒子時，與實施例4相同，異向性導電接著劑之固化物之熱導率為0.5W/(m‧K)，LED安裝體之熱阻為115℃/W，獲得了比比較例1優異的散熱性。另外，異向性導電接著劑之固化物的配線間的空間為25μm時的耐電壓為230V，配線間的空間為100μm時的耐電壓超過500V，獲得了穩定的絕緣性。
另外，如實施例10，當使用在Ag/Pd合金粒子之表面塗有苯乙烯樹脂的絕緣塗層粒子時，異向性導電接著劑之固化物之熱導率為0.4W/(m‧K)，LED安裝體之熱阻為135℃/W，獲得了比比較例1優異的散熱性。另外，異向性導電接著劑之固化物的配線間的空間為25μm時的耐電壓為210V，配線間的空間為100μm時的耐電壓超過500V，獲得了穩定的絕緣性。
另外，本技術也可以採用以下構成。
(1)
異向性導電接著劑包含：導電性粒子、導熱性粒子、及使該導電性粒子和該導熱性粒子分散的接著劑成分，該導電性粒子含有樹脂粒子及在該樹脂粒子之表面上形成的導電性金屬層；該導熱性粒子是平均粒徑小於該導電性粒子的金屬粒子，或是含有金屬粒子及在該金屬粒子之表面上形成的絕緣層且平均粒徑小於該導電性粒子的絕緣塗層粒子。
(2)
(1)中所述的異向性導電接著劑，其中，該金屬粒子具有約200W/ (m‧K)以上的熱導率，該絕緣塗層粒子的該金屬粒子具有約200W/(m‧K)以上的熱導率。
(3)
(1)或(2)中所述的異向性導電接著劑，其中，該金屬粒子含有Ag或以Ag為主要成分的合金，該絕緣塗層粒子的該金屬粒子含有Ag或以Ag為主要成分的合金。
(4)
(1)至(3)中所述的任一異向性導電接著劑，其中，該金屬粒子的含有量約為5體積%~40體積%。
(5)
(1)至(3)中所述的任一異向性導電接著劑，其中，該絕緣層之厚度約為20nm~1000nm。
(6)
(1)至(3)中所述的任一異向性導電接著劑，其中，該絕緣層含有樹脂或無機材料。
(7)
(6)中所述的異向性導電接著劑，其中，該絕緣塗層粒子的含有量約為5體積%~50體積%。
(8)
(1)至(7)中所述的任一異向性導電接著劑，其中，該導熱性粒子之平均粒徑約為該導電性粒子之平均粒徑的5%~80%。
(9)
(1)至(8)中所述的任一異向性導電接著劑，其中，該導熱性粒子為白色或灰色的非彩色。
(10)
連接結構體包含：第1電子部件之端子、第2電子部件之端子、導電性粒子及導熱性粒子，導電性粒子含有樹脂粒子及在該樹脂粒子之表面上形成的導電性金屬層，且配置在第1電子部件之端子與第2電子部件之端子之間使第1電子部件之端子與第2電子部件之端子電氣連接；導熱性粒子是平均粒徑小於導電性粒子的金屬粒子，或是含有金屬粒子及在該金屬粒子之表面上形成的絕緣層且平均粒徑小於導電性粒子的絕緣塗層粒子，且配置並保持在第1電子部件之端子與第2電子部件之端子之間。
(11)
(10)中所述的連接結構體，其中，該第1電子部件為LED元件，該第2電子部件為基板。
(12)
(10)中所述的連接結構體，其中，該導熱性粒子為白色或灰色的非彩色。
本申請案以2012年9月24日於日本專利局申請之日本專利申請案2012-210223為基礎主張優先權，且參照該案之全部內容以引用之方式併入本文中。
凡熟悉本案技術者根據設計要求及其他因素所作之各種修改，組合，子組合及變更，皆應涵蓋於所附申請專利範圍及其均等物之範疇內。
12‧‧‧第1導電型披覆層
12a‧‧‧第1導電型電極
13‧‧‧活性層
14‧‧‧第2導電型披覆層
14a‧‧‧第2導電型電極
21‧‧‧基材
22‧‧‧第1導電型用電路圖案
22a‧‧‧電極
23‧‧‧第2導電型用電路圖案
23a‧‧‧電極
31‧‧‧導電性粒子
32‧‧‧導熱性粒子
33‧‧‧黏合劑

Claims (12)

  1. 一種異向性導電接著劑，其包含：導電性粒子、導熱性粒子、及使該導電性粒子和該導熱性粒子分散的接著劑成分，該導電性粒子含有樹脂粒子及在該樹脂粒子之表面上形成的導電性金屬層；該導熱性粒子是平均粒徑小於該導電性粒子的金屬粒子，或是含有金屬粒子及在該金屬粒子之表面上形成的絕緣層且平均粒徑小於該導電性粒子的絕緣塗層粒子。
  2. 如申請專利範圍第1項之異向性導電接著劑，其中，該金屬粒子具有約200W/(m‧K)以上的熱導率，該絕緣塗層粒子的該金屬粒子具有約200W/(m‧K)以上的熱導率。
  3. 如申請專利範圍第1項之異向性導電接著劑，其中，該金屬粒子含有Ag或以Ag為主要成分的合金，該絕緣塗層粒子的該金屬粒子含有Ag或以Ag為主要成分的合金。
  4. 如申請專利範圍第1項之異向性導電接著劑，其中，該金屬粒子的含有量約為5體積%~40體積%。
  5. 如申請專利範圍第1項之異向性導電接著劑，其中，該絕緣層之厚度約為20nm~1000nm。
  6. 如申請專利範圍第1項之異向性導電接著劑，其中，該絕緣層含有樹脂或無機材料。
  7. 如申請專利範圍第6項之異向性導電接著劑，其中，該絕緣塗層粒子的含有量約為5體積%~50體積%。
  8. 如申請專利範圍第1項之異向性導電接著劑，其中，該導熱性粒子之平均粒徑約為該導電性粒子之平均粒徑的5%~80%。
  9. 如申請專利範圍第1項之異向性導電接著劑，其中，該導熱性粒子為白色或灰色的非彩色。
  10. 一種連接結構體，其包含：第1電子部件之端子、第2電子部件之端子、導電性粒子及導熱性粒子，導電性粒子含有樹脂粒子及在該樹脂粒子之表面上形成的導電性金屬層，且配置在第1電子部件之端子與第2電子部件之端子之間使第1電子部件之端子與第2電子部件之端子電氣連接；導熱性粒子是平均粒徑小於該導電性粒子的金屬粒子，或是含有金屬粒子及在該金屬粒子之表面上形成的絕緣層且平均粒徑小於該導電性粒子的絕緣塗層粒子，且配置並保持在第1電子部件之端子與第2電子部件之端子之間。
  11. 如申請專利範圍第10項之連接結構體，其中，該第1電子部件為LED元件，該第2電子部件為基板。
  12. 如申請專利範圍第10項之連接結構體，其中，該導熱性粒子為白色或灰色的非彩色。
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