TWI561313B - Liquid processing device, liquid processing method, and storage medium - Google Patents

Liquid processing device, liquid processing method, and storage medium

Info

Publication number
TWI561313B
TWI561313B TW103119936A TW103119936A TWI561313B TW I561313 B TWI561313 B TW I561313B TW 103119936 A TW103119936 A TW 103119936A TW 103119936 A TW103119936 A TW 103119936A TW I561313 B TWI561313 B TW I561313B
Authority
TW
Taiwan
Prior art keywords
liquid processing
storage medium
processing device
processing method
liquid
Prior art date
Application number
TW103119936A
Other languages
English (en)
Other versions
TW201511845A (zh
Inventor
Naofumi Kishita
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201511845A publication Critical patent/TW201511845A/zh
Application granted granted Critical
Publication of TWI561313B publication Critical patent/TWI561313B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
TW103119936A 2013-06-12 2014-06-09 Liquid processing device, liquid processing method, and storage medium TWI561313B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013123922A JP5939204B2 (ja) 2013-06-12 2013-06-12 液処理装置

Publications (2)

Publication Number Publication Date
TW201511845A TW201511845A (zh) 2015-04-01
TWI561313B true TWI561313B (en) 2016-12-11

Family

ID=52019451

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103119936A TWI561313B (en) 2013-06-12 2014-06-09 Liquid processing device, liquid processing method, and storage medium

Country Status (4)

Country Link
US (1) US9899244B2 (zh)
JP (1) JP5939204B2 (zh)
KR (1) KR101732459B1 (zh)
TW (1) TWI561313B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6344277B2 (ja) * 2015-03-19 2018-06-20 東京エレクトロン株式会社 液処理装置
JP6680096B2 (ja) 2016-06-13 2020-04-15 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP6786162B2 (ja) * 2016-12-20 2020-11-18 東京応化工業株式会社 塗布装置、及び塗布方法
JP6925872B2 (ja) * 2017-05-31 2021-08-25 東京エレクトロン株式会社 基板液処理装置、処理液供給方法及び記憶媒体
JP7365220B2 (ja) 2019-12-12 2023-10-19 東京エレクトロン株式会社 液処理装置及び処理液の温度調整方法
KR102677969B1 (ko) * 2020-12-30 2024-06-26 세메스 주식회사 노즐 대기 포트와 이를 포함하는 기판 처리 장치 및 이를 이용한 노즐 세정 방법
JP2022124070A (ja) * 2021-02-15 2022-08-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、筒状ガードの加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6270579B1 (en) * 1999-10-29 2001-08-07 Advanced Micro Devices, Inc. Nozzle arm movement for resist development
TW200724247A (en) * 2005-12-27 2007-07-01 Dainippon Screen Mfg Substrate processing apparatus and substrate processing method
JP2010034210A (ja) * 2008-07-28 2010-02-12 Sokudo Co Ltd 基板処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2006A (en) * 1841-03-16 Clamp for crimping leather
JP2815064B2 (ja) * 1988-05-27 1998-10-27 東京エレクトロン 株式会社 半導体ウエハに液を塗布する塗布装置及び塗布方法
US5002008A (en) * 1988-05-27 1991-03-26 Tokyo Electron Limited Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state
JPH05267148A (ja) * 1992-03-23 1993-10-15 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JP2007136257A (ja) * 2005-11-14 2007-06-07 Seiko Epson Corp 液滴吐出装置
JP4900397B2 (ja) 2009-01-29 2012-03-21 東京エレクトロン株式会社 液処理装置
JP5195673B2 (ja) 2009-07-06 2013-05-08 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5251941B2 (ja) 2010-09-01 2013-07-31 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6270579B1 (en) * 1999-10-29 2001-08-07 Advanced Micro Devices, Inc. Nozzle arm movement for resist development
TW200724247A (en) * 2005-12-27 2007-07-01 Dainippon Screen Mfg Substrate processing apparatus and substrate processing method
JP2010034210A (ja) * 2008-07-28 2010-02-12 Sokudo Co Ltd 基板処理装置

Also Published As

Publication number Publication date
TW201511845A (zh) 2015-04-01
JP5939204B2 (ja) 2016-06-22
KR101732459B1 (ko) 2017-05-04
KR20140145086A (ko) 2014-12-22
US9899244B2 (en) 2018-02-20
US20140370199A1 (en) 2014-12-18
JP2014241382A (ja) 2014-12-25

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