TWI560764B - Pick up device and pick up method of semiconductor die - Google Patents

Pick up device and pick up method of semiconductor die

Info

Publication number
TWI560764B
TWI560764B TW104101196A TW104101196A TWI560764B TW I560764 B TWI560764 B TW I560764B TW 104101196 A TW104101196 A TW 104101196A TW 104101196 A TW104101196 A TW 104101196A TW I560764 B TWI560764 B TW I560764B
Authority
TW
Taiwan
Prior art keywords
pick
semiconductor die
die
semiconductor
Prior art date
Application number
TW104101196A
Other languages
English (en)
Chinese (zh)
Other versions
TW201533794A (zh
Inventor
Kazuaki Nagano
Yoshifumi Katayama
Hiroki Toyoda
Takeshi Ishizuka
Shinsuke Fukumoto
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW201533794A publication Critical patent/TW201533794A/zh
Application granted granted Critical
Publication of TWI560764B publication Critical patent/TWI560764B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
TW104101196A 2014-02-24 2015-01-14 Pick up device and pick up method of semiconductor die TWI560764B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014033351 2014-02-24
JP2014225729A JP6349496B2 (ja) 2014-02-24 2014-11-06 半導体ダイのピックアップ装置及びピックアップ方法

Publications (2)

Publication Number Publication Date
TW201533794A TW201533794A (zh) 2015-09-01
TWI560764B true TWI560764B (en) 2016-12-01

Family

ID=53877914

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104101196A TWI560764B (en) 2014-02-24 2015-01-14 Pick up device and pick up method of semiconductor die

Country Status (6)

Country Link
JP (1) JP6349496B2 (ko)
KR (1) KR102043120B1 (ko)
CN (1) CN105900225B (ko)
SG (1) SG11201607050YA (ko)
TW (1) TWI560764B (ko)
WO (1) WO2015125385A1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6707396B2 (ja) * 2016-05-11 2020-06-10 株式会社ディスコ 切削装置
JP6621771B2 (ja) * 2017-01-25 2019-12-18 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
CN106768991B (zh) * 2017-03-10 2020-04-07 东莞市凯格精机股份有限公司 一种精细检测吸嘴工作状态的方法
EP3651561B1 (en) * 2017-07-04 2022-02-09 Fuji Corporation Component mounting device
KR102037967B1 (ko) * 2018-05-30 2019-10-29 세메스 주식회사 다이 본딩 방법
TWI745710B (zh) * 2018-07-06 2021-11-11 日商新川股份有限公司 半導體晶粒的拾取系統
TWI716925B (zh) * 2018-07-06 2021-01-21 日商新川股份有限公司 半導體晶粒的拾取系統
JP6627001B1 (ja) * 2019-01-21 2019-12-25 株式会社東京精密 ウェーハ剥離洗浄装置
JP7237655B2 (ja) * 2019-03-01 2023-03-13 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP7135959B2 (ja) * 2019-03-22 2022-09-13 株式会社デンソー ピックアップ装置
JP7274902B2 (ja) * 2019-03-25 2023-05-17 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
KR102202080B1 (ko) * 2019-07-02 2021-01-12 세메스 주식회사 콜릿 교체 방법과 다이 이송 방법 및 다이 본딩 방법
JP7377654B2 (ja) * 2019-09-17 2023-11-10 ファスフォードテクノロジ株式会社 ダイボンディング装置、剥離ユニット、コレットおよび半導体装置の製造方法
CN115312430A (zh) * 2022-08-23 2022-11-08 深圳市易达凯电子有限公司 一种绝缘栅双极晶体管芯片生产专用封装设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201001614A (en) * 2008-06-30 2010-01-01 Shinkawa Kk Semiconductor die pickup apparatus and semiconductor die pickup method
TW201001566A (en) * 2008-06-24 2010-01-01 Powertech Technology Inc Jig and method for picking up a die
TW201033100A (en) * 2009-03-05 2010-09-16 Shinkawa Kk Apparatus and method for picking up semiconductor die

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945339A (ko) 1972-09-08 1974-04-30
JPS62210635A (ja) * 1986-03-12 1987-09-16 Hitachi Yonezawa Denshi Kk 物体の分離方法及び装置
JP2004226250A (ja) * 2003-01-23 2004-08-12 Mitsubishi Electric Corp 光ファイバー式変位センサーおよびそれを用いた変位制御装置
JP2004228513A (ja) * 2003-01-27 2004-08-12 Matsushita Electric Ind Co Ltd 電子部品の搬送装置
KR100817068B1 (ko) * 2006-10-24 2008-03-27 삼성전자주식회사 박형의 반도체 칩 픽업 장치 및 방법
US20090075459A1 (en) * 2007-09-06 2009-03-19 Kabushiki Kaisha Shinkawa Apparatus and method for picking-up semiconductor dies
JP2009064937A (ja) * 2007-09-06 2009-03-26 Shinkawa Ltd 半導体ダイのピックアップ装置及びピックアップ方法
KR101394390B1 (ko) * 2008-07-24 2014-05-14 세메스 주식회사 반도체 소자를 픽업하기 위한 장치
US8141612B2 (en) * 2009-04-02 2012-03-27 Asm Assembly Automation Ltd Device for thin die detachment and pick-up
US8092645B2 (en) * 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
JP4927979B2 (ja) * 2010-09-28 2012-05-09 株式会社新川 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
JP2012156517A (ja) * 2012-03-05 2012-08-16 Renesas Electronics Corp 半導体集積回路装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201001566A (en) * 2008-06-24 2010-01-01 Powertech Technology Inc Jig and method for picking up a die
TW201001614A (en) * 2008-06-30 2010-01-01 Shinkawa Kk Semiconductor die pickup apparatus and semiconductor die pickup method
TW201033100A (en) * 2009-03-05 2010-09-16 Shinkawa Kk Apparatus and method for picking up semiconductor die

Also Published As

Publication number Publication date
CN105900225B (zh) 2019-01-22
JP2015173250A (ja) 2015-10-01
TW201533794A (zh) 2015-09-01
KR102043120B1 (ko) 2019-11-12
JP6349496B2 (ja) 2018-07-04
CN105900225A (zh) 2016-08-24
SG11201607050YA (en) 2016-10-28
WO2015125385A1 (ja) 2015-08-27
KR20150145255A (ko) 2015-12-29

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