SG11201607050YA - Semiconductor die pickup apparatus and semiconductor die pickup method - Google Patents

Semiconductor die pickup apparatus and semiconductor die pickup method

Info

Publication number
SG11201607050YA
SG11201607050YA SG11201607050YA SG11201607050YA SG11201607050YA SG 11201607050Y A SG11201607050Y A SG 11201607050YA SG 11201607050Y A SG11201607050Y A SG 11201607050YA SG 11201607050Y A SG11201607050Y A SG 11201607050YA SG 11201607050Y A SG11201607050Y A SG 11201607050YA
Authority
SG
Singapore
Prior art keywords
semiconductor die
die pickup
pickup apparatus
pickup method
semiconductor
Prior art date
Application number
SG11201607050YA
Inventor
Kazuaki Nagano
Yoshifumi Katayama
Hiroki Toyoda
Takeshi Ishizuka
Shinsuke Fukumoto
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201607050YA publication Critical patent/SG11201607050YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
SG11201607050YA 2014-02-24 2014-12-12 Semiconductor die pickup apparatus and semiconductor die pickup method SG11201607050YA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014033351 2014-02-24
JP2014225729A JP6349496B2 (en) 2014-02-24 2014-11-06 Semiconductor die pickup apparatus and pickup method
PCT/JP2014/082965 WO2015125385A1 (en) 2014-02-24 2014-12-12 Semiconductor die pickup apparatus and semiconductor die pickup method

Publications (1)

Publication Number Publication Date
SG11201607050YA true SG11201607050YA (en) 2016-10-28

Family

ID=53877914

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201607050YA SG11201607050YA (en) 2014-02-24 2014-12-12 Semiconductor die pickup apparatus and semiconductor die pickup method

Country Status (6)

Country Link
JP (1) JP6349496B2 (en)
KR (1) KR102043120B1 (en)
CN (1) CN105900225B (en)
SG (1) SG11201607050YA (en)
TW (1) TWI560764B (en)
WO (1) WO2015125385A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6707396B2 (en) * 2016-05-11 2020-06-10 株式会社ディスコ Cutting equipment
JP6621771B2 (en) * 2017-01-25 2019-12-18 ファスフォードテクノロジ株式会社 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
CN106768991B (en) * 2017-03-10 2020-04-07 东莞市凯格精机股份有限公司 Method for finely detecting working state of suction nozzle
EP3651561B1 (en) * 2017-07-04 2022-02-09 Fuji Corporation Component mounting device
KR102037967B1 (en) * 2018-05-30 2019-10-29 세메스 주식회사 Die bonding method
TWI745710B (en) * 2018-07-06 2021-11-11 日商新川股份有限公司 Pickup system for semiconductor die
TWI716925B (en) * 2018-07-06 2021-01-21 日商新川股份有限公司 Pickup system for semiconductor die
JP6627001B1 (en) * 2019-01-21 2019-12-25 株式会社東京精密 Wafer peeling cleaning equipment
JP7237655B2 (en) * 2019-03-01 2023-03-13 ファスフォードテクノロジ株式会社 Semiconductor manufacturing equipment and semiconductor device manufacturing method
JP7135959B2 (en) * 2019-03-22 2022-09-13 株式会社デンソー pickup device
JP7274902B2 (en) * 2019-03-25 2023-05-17 ファスフォードテクノロジ株式会社 Semiconductor manufacturing equipment and semiconductor device manufacturing method
KR102202080B1 (en) * 2019-07-02 2021-01-12 세메스 주식회사 Collet exchange method, die transfer method and die bonding method
JP7377654B2 (en) * 2019-09-17 2023-11-10 ファスフォードテクノロジ株式会社 Die bonding equipment, peeling unit, collet and semiconductor device manufacturing method
CN115312430A (en) * 2022-08-23 2022-11-08 深圳市易达凯电子有限公司 Packaging equipment special for production of insulated gate bipolar transistor chip

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945339A (en) 1972-09-08 1974-04-30
JPS62210635A (en) * 1986-03-12 1987-09-16 Hitachi Yonezawa Denshi Kk Method and apparatus for isolating article
JP2004226250A (en) * 2003-01-23 2004-08-12 Mitsubishi Electric Corp Optical fiber type displacement sensor, and displacement controller using the same
JP2004228513A (en) * 2003-01-27 2004-08-12 Matsushita Electric Ind Co Ltd Conveying device for electronic component
KR100817068B1 (en) * 2006-10-24 2008-03-27 삼성전자주식회사 Thinn semiconductor chip pick-up apparatus and method
US20090075459A1 (en) * 2007-09-06 2009-03-19 Kabushiki Kaisha Shinkawa Apparatus and method for picking-up semiconductor dies
JP2009064937A (en) * 2007-09-06 2009-03-26 Shinkawa Ltd Pickup device of semiconductor die and pickup method
TW201001566A (en) * 2008-06-24 2010-01-01 Powertech Technology Inc Jig and method for picking up a die
JP4215818B1 (en) * 2008-06-30 2009-01-28 株式会社新川 Semiconductor die pickup apparatus and pickup method
KR101394390B1 (en) * 2008-07-24 2014-05-14 세메스 주식회사 Apparatus for picking up a semiconductor device
JP4397429B1 (en) * 2009-03-05 2010-01-13 株式会社新川 Semiconductor die pickup apparatus and pickup method
US8141612B2 (en) * 2009-04-02 2012-03-27 Asm Assembly Automation Ltd Device for thin die detachment and pick-up
US8092645B2 (en) * 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
JP4927979B2 (en) * 2010-09-28 2012-05-09 株式会社新川 Semiconductor die pick-up device and semiconductor die pick-up method using the device
JP2012156517A (en) * 2012-03-05 2012-08-16 Renesas Electronics Corp Manufacturing method of semiconductor integrated circuit device

Also Published As

Publication number Publication date
CN105900225B (en) 2019-01-22
JP2015173250A (en) 2015-10-01
TW201533794A (en) 2015-09-01
KR102043120B1 (en) 2019-11-12
TWI560764B (en) 2016-12-01
JP6349496B2 (en) 2018-07-04
CN105900225A (en) 2016-08-24
WO2015125385A1 (en) 2015-08-27
KR20150145255A (en) 2015-12-29

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