JP6349496B2 - 半導体ダイのピックアップ装置及びピックアップ方法 - Google Patents

半導体ダイのピックアップ装置及びピックアップ方法 Download PDF

Info

Publication number: JP6349496B2
Authority: JP; Japan
Prior art keywords: pressure; semiconductor die; suction; opening; lid
Prior art date: 2014-02-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2014225729A

Other languages

English (en)

Japanese (ja)

Other versions

JP2015173250A (ja

Inventor

一昭長野

善文片山

宏樹豊田

武石塚

眞介福本

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Shinkawa Ltd

Original Assignee

Shinkawa Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-02-24

Filing date

2014-11-06

Publication date

2018-07-04

2014-11-06 Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd

2014-11-06 Priority to JP2014225729A priority Critical patent/JP6349496B2/ja

2014-12-12 Priority to CN201480072889.2A priority patent/CN105900225B/zh

2014-12-12 Priority to KR1020157033050A priority patent/KR102043120B1/ko

2014-12-12 Priority to PCT/JP2014/082965 priority patent/WO2015125385A1/ja

2014-12-12 Priority to SG11201607050YA priority patent/SG11201607050YA/en

2015-01-14 Priority to TW104101196A priority patent/TWI560764B/zh

2015-10-01 Publication of JP2015173250A publication Critical patent/JP2015173250A/ja

2018-07-04 Application granted granted Critical

2018-07-04 Publication of JP6349496B2 publication Critical patent/JP6349496B2/ja

Status Active legal-status Critical Current

2034-11-06 Anticipated expiration legal-status Critical

Links

239000004065 semiconductor Substances 0.000 title claims description 273
238000000034 method Methods 0.000 title claims description 56
238000006073 displacement reaction Methods 0.000 claims description 42
238000001179 sorption measurement Methods 0.000 claims description 34
238000001514 detection method Methods 0.000 claims description 24
238000000926 separation method Methods 0.000 claims description 10
239000013307 optical fiber Substances 0.000 claims description 6
230000002093 peripheral effect Effects 0.000 description 12
230000007423 decrease Effects 0.000 description 7
238000002834 transmittance Methods 0.000 description 4
238000005520 cutting process Methods 0.000 description 3
230000000694 effects Effects 0.000 description 2
239000002184 metal Substances 0.000 description 2
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
239000012790 adhesive layer Substances 0.000 description 1
238000013459 approach Methods 0.000 description 1
230000001174 ascending effect Effects 0.000 description 1
230000000903 blocking effect Effects 0.000 description 1
238000004891 communication Methods 0.000 description 1
238000004299 exfoliation Methods 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Die Bonding (AREA)

JP2014225729A 2014-02-24 2014-11-06 半導体ダイのピックアップ装置及びピックアップ方法 Active JP6349496B2 (ja)

Priority Applications (6)

Application Number	Priority Date	Filing Date	Title
JP2014225729A JP6349496B2 (ja)	2014-02-24	2014-11-06	半導体ダイのピックアップ装置及びピックアップ方法
CN201480072889.2A CN105900225B (zh)	2014-02-24	2014-12-12	半导体晶粒的拾取装置以及拾取方法
KR1020157033050A KR102043120B1 (ko)	2014-02-24	2014-12-12	반도체 다이의 픽업 장치 및 픽업 방법
PCT/JP2014/082965 WO2015125385A1 (ja)	2014-02-24	2014-12-12	半導体ダイのピックアップ装置及びピックアップ方法
SG11201607050YA SG11201607050YA (en)	2014-02-24	2014-12-12	Semiconductor die pickup apparatus and semiconductor die pickup method
TW104101196A TWI560764B (en)	2014-02-24	2015-01-14	Pick up device and pick up method of semiconductor die

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2014033351		2014-02-24
JP2014033351		2014-02-24
JP2014225729A JP6349496B2 (ja)	2014-02-24	2014-11-06	半導体ダイのピックアップ装置及びピックアップ方法

Publications (2)

Publication Number	Publication Date
JP2015173250A JP2015173250A (ja)	2015-10-01
JP6349496B2 true JP6349496B2 (ja)	2018-07-04

Family

ID=53877914

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2014225729A Active JP6349496B2 (ja)	2014-02-24	2014-11-06	半導体ダイのピックアップ装置及びピックアップ方法

Country Status (6)

Country	Link
JP (1)	JP6349496B2 (ko)
KR (1)	KR102043120B1 (ko)
CN (1)	CN105900225B (ko)
SG (1)	SG11201607050YA (ko)
TW (1)	TWI560764B (ko)
WO (1)	WO2015125385A1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6707396B2 (ja) *	2016-05-11	2020-06-10	株式会社ディスコ	切削装置
JP6621771B2 (ja) *	2017-01-25	2019-12-18	ファスフォードテクノロジ株式会社	半導体製造装置および半導体装置の製造方法
CN106768991B (zh) *	2017-03-10	2020-04-07	东莞市凯格精机股份有限公司	一种精细检测吸嘴工作状态的方法
EP3651561B1 (en) *	2017-07-04	2022-02-09	Fuji Corporation	Component mounting device
KR102037967B1 (ko) *	2018-05-30	2019-10-29	세메스 주식회사	다이 본딩 방법
TWI745710B (zh) *	2018-07-06	2021-11-11	日商新川股份有限公司	半導體晶粒的拾取系統
TWI716925B (zh) *	2018-07-06	2021-01-21	日商新川股份有限公司	半導體晶粒的拾取系統
JP6627001B1 (ja) *	2019-01-21	2019-12-25	株式会社東京精密	ウェーハ剥離洗浄装置
JP7237655B2 (ja) *	2019-03-01	2023-03-13	ファスフォードテクノロジ株式会社	半導体製造装置および半導体装置の製造方法
JP7135959B2 (ja) *	2019-03-22	2022-09-13	株式会社デンソー	ピックアップ装置
JP7274902B2 (ja) *	2019-03-25	2023-05-17	ファスフォードテクノロジ株式会社	半導体製造装置および半導体装置の製造方法
KR102202080B1 (ko) *	2019-07-02	2021-01-12	세메스 주식회사	콜릿 교체 방법과 다이 이송 방법 및 다이 본딩 방법
JP7377654B2 (ja) *	2019-09-17	2023-11-10	ファスフォードテクノロジ株式会社	ダイボンディング装置、剥離ユニット、コレットおよび半導体装置の製造方法
CN115312430A (zh) *	2022-08-23	2022-11-08	深圳市易达凯电子有限公司	一种绝缘栅双极晶体管芯片生产专用封装设备

Family Cites Families (15)

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Publication number	Priority date	Publication date	Assignee	Title
JPS4945339A (ko)	1972-09-08	1974-04-30
JPS62210635A (ja) *	1986-03-12	1987-09-16	Hitachi Yonezawa Denshi Kk	物体の分離方法及び装置
JP2004226250A (ja) *	2003-01-23	2004-08-12	Mitsubishi Electric Corp	光ファイバー式変位センサーおよびそれを用いた変位制御装置
JP2004228513A (ja) *	2003-01-27	2004-08-12	Matsushita Electric Ind Co Ltd	電子部品の搬送装置
KR100817068B1 (ko) *	2006-10-24	2008-03-27	삼성전자주식회사	박형의 반도체 칩 픽업 장치 및 방법
US20090075459A1 (en) *	2007-09-06	2009-03-19	Kabushiki Kaisha Shinkawa	Apparatus and method for picking-up semiconductor dies
JP2009064937A (ja) *	2007-09-06	2009-03-26	Shinkawa Ltd	半導体ダイのピックアップ装置及びピックアップ方法
TW201001566A (en) *	2008-06-24	2010-01-01	Powertech Technology Inc	Jig and method for picking up a die
JP4215818B1 (ja) *	2008-06-30	2009-01-28	株式会社新川	半導体ダイのピックアップ装置及びピックアップ方法
KR101394390B1 (ko) *	2008-07-24	2014-05-14	세메스 주식회사	반도체 소자를 픽업하기 위한 장치
JP4397429B1 (ja) *	2009-03-05	2010-01-13	株式会社新川	半導体ダイのピックアップ装置及びピックアップ方法
US8141612B2 (en) *	2009-04-02	2012-03-27	Asm Assembly Automation Ltd	Device for thin die detachment and pick-up
US8092645B2 (en) *	2010-02-05	2012-01-10	Asm Assembly Automation Ltd	Control and monitoring system for thin die detachment and pick-up
JP4927979B2 (ja) *	2010-09-28	2012-05-09	株式会社新川	半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
JP2012156517A (ja) *	2012-03-05	2012-08-16	Renesas Electronics Corp	半導体集積回路装置の製造方法

2014
- 2014-11-06 JP JP2014225729A patent/JP6349496B2/ja active Active
- 2014-12-12 KR KR1020157033050A patent/KR102043120B1/ko active IP Right Grant
- 2014-12-12 SG SG11201607050YA patent/SG11201607050YA/en unknown
- 2014-12-12 WO PCT/JP2014/082965 patent/WO2015125385A1/ja active Application Filing
- 2014-12-12 CN CN201480072889.2A patent/CN105900225B/zh active Active
2015
- 2015-01-14 TW TW104101196A patent/TWI560764B/zh active

Also Published As

Publication number	Publication date
CN105900225B (zh)	2019-01-22
JP2015173250A (ja)	2015-10-01
TW201533794A (zh)	2015-09-01
KR102043120B1 (ko)	2019-11-12
TWI560764B (en)	2016-12-01
CN105900225A (zh)	2016-08-24
SG11201607050YA (en)	2016-10-28
WO2015125385A1 (ja)	2015-08-27
KR20150145255A (ko)	2015-12-29

Legal Events

Date	Code	Title	Description
2016-11-30	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161130
2017-08-29	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170829
2017-10-26	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171026
2017-12-19	TRDD	Decision of grant or rejection written
2017-12-26	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171226
2018-02-01	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180129
2018-06-15	R150	Certificate of patent or registration of utility model	Ref document number: 6349496 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150
2023-06-15	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
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Publication	Publication Date	Title
JP6349496B2 (ja)	2018-07-04	半導体ダイのピックアップ装置及びピックアップ方法
JP5717910B1 (ja)	2015-05-13	半導体ダイのピックアップ装置及びピックアップ方法
JP4215818B1 (ja)	2009-01-28	半導体ダイのピックアップ装置及びピックアップ方法
JP4397429B1 (ja)	2010-01-13	半導体ダイのピックアップ装置及びピックアップ方法
JP4927979B2 (ja)	2012-05-09	半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
KR100978360B1 (ko)	2010-08-26	반도체 다이의 픽업 장치 및 픽업 방법
JP5657019B2 (ja)	2015-01-21	光ディスク取り出し装置及び方法
KR100979474B1 (ko)	2010-09-02	반도체 다이의 픽업 장치 및 픽업 방법
JP4198745B1 (ja)	2008-12-17	半導体ダイのピックアップ装置及びピックアップ方法
JP4924316B2 (ja)	2012-04-25	半導体製造装置及び半導体製造方法
WO2008053673A1 (fr)	2008-05-08	Dispositif de collecte de puce à semiconducteur
WO2022176076A1 (ja)	2022-08-25	半導体ダイのピックアップ装置及びピックアップ方法
JP5284040B2 (ja)	2013-09-11	チップ剥離方法、チップ剥離装置、および半導体装置製造方法
KR20150130095A (ko)	2015-11-23	반도체 다이 픽업 장치 및 방법
JP2013065731A (ja)	2013-04-11	ダイボンダ及びボンディング方法