TWI537404B - Oxide sintered body, oxide sputtering target, and method for producing conductive oxide film and oxide sintered body - Google Patents

Oxide sintered body, oxide sputtering target, and method for producing conductive oxide film and oxide sintered body Download PDF

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Publication number
TWI537404B
TWI537404B TW104127113A TW104127113A TWI537404B TW I537404 B TWI537404 B TW I537404B TW 104127113 A TW104127113 A TW 104127113A TW 104127113 A TW104127113 A TW 104127113A TW I537404 B TWI537404 B TW I537404B
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TW
Taiwan
Prior art keywords
film
sintered body
oxide
sputtering
powder
Prior art date
Application number
TW104127113A
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English (en)
Chinese (zh)
Other versions
TW201614084A (en
Inventor
Atsushi Nara
Original Assignee
Jx Nippon Mining & Metals Corp
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Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201614084A publication Critical patent/TW201614084A/zh
Application granted granted Critical
Publication of TWI537404B publication Critical patent/TWI537404B/zh

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    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64Burning or sintering processes
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64Burning or sintering processes
    • C04B35/645Pressure sintering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9646Optical properties
    • C04B2235/9653Translucent or transparent ceramics other than alumina

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Compositions Of Oxide Ceramics (AREA)
TW104127113A 2014-10-06 2015-08-20 Oxide sintered body, oxide sputtering target, and method for producing conductive oxide film and oxide sintered body TWI537404B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014205403 2014-10-06
JP2015012019A JP5876172B1 (ja) 2014-10-06 2015-01-26 酸化物焼結体、酸化物スパッタリングターゲット及び導電性酸化物薄膜並びに酸化物焼結体の製造方法

Publications (2)

Publication Number Publication Date
TW201614084A TW201614084A (en) 2016-04-16
TWI537404B true TWI537404B (zh) 2016-06-11

Family

ID=55434716

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104127113A TWI537404B (zh) 2014-10-06 2015-08-20 Oxide sintered body, oxide sputtering target, and method for producing conductive oxide film and oxide sintered body

Country Status (4)

Country Link
JP (1) JP5876172B1 (ko)
KR (1) KR101668963B1 (ko)
CN (2) CN109437856A (ko)
TW (1) TWI537404B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7086080B2 (ja) * 2017-08-08 2022-06-17 三井金属鉱業株式会社 酸化物焼結体およびスパッタリングターゲット
JP2019131866A (ja) * 2018-01-31 2019-08-08 住友金属鉱山株式会社 酸化物スパッタ膜、酸化物スパッタ膜の製造方法、酸化物焼結体及び透明樹脂基板
TWI819633B (zh) * 2022-05-31 2023-10-21 光洋應用材料科技股份有限公司 氧化銦鈦鋅濺鍍靶材、其薄膜及其製法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3746094B2 (ja) * 1995-06-28 2006-02-15 出光興産株式会社 ターゲットおよびその製造方法
US7141186B2 (en) * 2002-10-29 2006-11-28 Sumitomo Metal Mining Co., Ltd. Oxide sintered body and sputtering target, and manufacturing method for transparent conductive oxide film as electrode
JP4933756B2 (ja) * 2005-09-01 2012-05-16 出光興産株式会社 スパッタリングターゲット
JP4994068B2 (ja) 2006-08-09 2012-08-08 出光興産株式会社 酸化物導電性材料及びその製造方法
CN102216237B (zh) * 2008-11-20 2015-05-13 出光兴产株式会社 ZnO-SnO2-In2O3类氧化物烧结体及非晶质透明导电膜
KR20190044123A (ko) * 2011-05-10 2019-04-29 이데미쓰 고산 가부시키가이샤 In₂O₃-SnO₂-ZnO계 스퍼터링 타겟
JP2013220805A (ja) 2012-04-19 2013-10-28 Toyota Boshoku Corp 車室の吹出口構造
JP2014111818A (ja) * 2012-11-09 2014-06-19 Idemitsu Kosan Co Ltd スパッタリングターゲット、酸化物半導体薄膜及びそれらの製造方法
TW201422835A (zh) * 2012-12-03 2014-06-16 Solar Applied Mat Tech Corp 濺鍍靶材及導電金屬氧化物薄膜

Also Published As

Publication number Publication date
TW201614084A (en) 2016-04-16
KR101668963B1 (ko) 2016-10-24
KR20160041013A (ko) 2016-04-15
CN109437856A (zh) 2019-03-08
CN105481352A (zh) 2016-04-13
JP5876172B1 (ja) 2016-03-02
JP2016074579A (ja) 2016-05-12

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