TWI494226B - Adhesive tape for semiconductor wafer protection - Google Patents

Adhesive tape for semiconductor wafer protection Download PDF

Info

Publication number
TWI494226B
TWI494226B TW103114978A TW103114978A TWI494226B TW I494226 B TWI494226 B TW I494226B TW 103114978 A TW103114978 A TW 103114978A TW 103114978 A TW103114978 A TW 103114978A TW I494226 B TWI494226 B TW I494226B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
adhesive tape
wafer
adhesive
film layer
Prior art date
Application number
TW103114978A
Other languages
English (en)
Chinese (zh)
Other versions
TW201500218A (zh
Inventor
Masato Okura
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW201500218A publication Critical patent/TW201500218A/zh
Application granted granted Critical
Publication of TWI494226B publication Critical patent/TWI494226B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Engineering & Computer Science (AREA)
  • Dicing (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW103114978A 2013-04-26 2014-04-25 Adhesive tape for semiconductor wafer protection TWI494226B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013093424A JP5603453B1 (ja) 2013-04-26 2013-04-26 半導体ウェハ保護用粘着テープ

Publications (2)

Publication Number Publication Date
TW201500218A TW201500218A (zh) 2015-01-01
TWI494226B true TWI494226B (zh) 2015-08-01

Family

ID=51791891

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103114978A TWI494226B (zh) 2013-04-26 2014-04-25 Adhesive tape for semiconductor wafer protection

Country Status (5)

Country Link
JP (1) JP5603453B1 (ja)
KR (1) KR101554458B1 (ja)
CN (1) CN105103273B (ja)
TW (1) TWI494226B (ja)
WO (1) WO2014175321A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102587310B1 (ko) * 2015-11-04 2023-10-10 린텍 가부시키가이샤 경화성 수지 필름 및 제1 보호막 형성용 시트
JP6575874B2 (ja) * 2016-03-09 2019-09-18 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
CN109041580A (zh) * 2016-03-30 2018-12-18 琳得科株式会社 膜状粘接剂、半导体加工用片及半导体装置的制造方法
MY180133A (en) * 2016-05-12 2020-11-23 Sumitomo Bakelite Co Pressure-sensitive adhesive tape for semiconductor substrate fabrication
JP6651257B2 (ja) * 2016-06-03 2020-02-19 株式会社ディスコ 被加工物の検査方法、検査装置、レーザー加工装置、及び拡張装置
US11594441B2 (en) * 2021-04-09 2023-02-28 Applied Materials, Inc. Handling for high resistivity substrates

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050244631A1 (en) * 2004-04-28 2005-11-03 Mitsui Chemicals, Inc. Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same
JP2008218930A (ja) * 2007-03-07 2008-09-18 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP2010225643A (ja) * 2009-03-19 2010-10-07 Furukawa Electric Co Ltd:The ウエハ加工用テープ
TW201246285A (en) * 2011-03-30 2012-11-16 Sumitomo Bakelite Co Adhesive tape for processing semiconductor wafer or the like
TW201245388A (en) * 2011-02-04 2012-11-16 Hitachi Chemical Co Ltd Adhesive tape

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI310230B (en) * 2003-01-22 2009-05-21 Lintec Corp Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
TWI304835B (en) * 2003-06-10 2009-01-01 Hitachi Chemical Co Ltd Film adhesive and manufacturing method thereof,adhesive sheet and semiconductor device
JPWO2005112091A1 (ja) * 2004-05-18 2008-03-27 日立化成工業株式会社 粘接着シート並びにそれを用いた半導体装置及びその製造方法
JP5314308B2 (ja) * 2008-03-25 2013-10-16 リンテック株式会社 レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法
JP5805367B2 (ja) * 2009-01-30 2015-11-04 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP5503357B2 (ja) * 2009-03-23 2014-05-28 古河電気工業株式会社 ダイシングテープ、ダイシングテープの硬化阻害防止方法及び一括封止された半導体基板のダイシング方法
TW201043674A (en) * 2009-04-17 2010-12-16 Furukawa Electric Co Ltd Adhesive thin film and wafer processing tape
JP5603757B2 (ja) * 2009-12-04 2014-10-08 リンテック株式会社 レーザーダイシング用粘着シート及び半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050244631A1 (en) * 2004-04-28 2005-11-03 Mitsui Chemicals, Inc. Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same
JP2008218930A (ja) * 2007-03-07 2008-09-18 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP2010225643A (ja) * 2009-03-19 2010-10-07 Furukawa Electric Co Ltd:The ウエハ加工用テープ
TW201245388A (en) * 2011-02-04 2012-11-16 Hitachi Chemical Co Ltd Adhesive tape
TW201246285A (en) * 2011-03-30 2012-11-16 Sumitomo Bakelite Co Adhesive tape for processing semiconductor wafer or the like

Also Published As

Publication number Publication date
KR101554458B1 (ko) 2015-09-18
CN105103273B (zh) 2017-04-05
CN105103273A (zh) 2015-11-25
KR20150076263A (ko) 2015-07-06
TW201500218A (zh) 2015-01-01
JP2014216517A (ja) 2014-11-17
JP5603453B1 (ja) 2014-10-08
WO2014175321A1 (ja) 2014-10-30

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