TWI494226B - Adhesive tape for semiconductor wafer protection - Google Patents
Adhesive tape for semiconductor wafer protection Download PDFInfo
- Publication number
- TWI494226B TWI494226B TW103114978A TW103114978A TWI494226B TW I494226 B TWI494226 B TW I494226B TW 103114978 A TW103114978 A TW 103114978A TW 103114978 A TW103114978 A TW 103114978A TW I494226 B TWI494226 B TW I494226B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor wafer
- adhesive tape
- wafer
- adhesive
- film layer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Engineering & Computer Science (AREA)
- Dicing (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013093424A JP5603453B1 (ja) | 2013-04-26 | 2013-04-26 | 半導体ウェハ保護用粘着テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201500218A TW201500218A (zh) | 2015-01-01 |
TWI494226B true TWI494226B (zh) | 2015-08-01 |
Family
ID=51791891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103114978A TWI494226B (zh) | 2013-04-26 | 2014-04-25 | Adhesive tape for semiconductor wafer protection |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5603453B1 (ja) |
KR (1) | KR101554458B1 (ja) |
CN (1) | CN105103273B (ja) |
TW (1) | TWI494226B (ja) |
WO (1) | WO2014175321A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102587310B1 (ko) * | 2015-11-04 | 2023-10-10 | 린텍 가부시키가이샤 | 경화성 수지 필름 및 제1 보호막 형성용 시트 |
JP6575874B2 (ja) * | 2016-03-09 | 2019-09-18 | パナソニックIpマネジメント株式会社 | 素子チップの製造方法 |
CN109041580A (zh) * | 2016-03-30 | 2018-12-18 | 琳得科株式会社 | 膜状粘接剂、半导体加工用片及半导体装置的制造方法 |
MY180133A (en) * | 2016-05-12 | 2020-11-23 | Sumitomo Bakelite Co | Pressure-sensitive adhesive tape for semiconductor substrate fabrication |
JP6651257B2 (ja) * | 2016-06-03 | 2020-02-19 | 株式会社ディスコ | 被加工物の検査方法、検査装置、レーザー加工装置、及び拡張装置 |
US11594441B2 (en) * | 2021-04-09 | 2023-02-28 | Applied Materials, Inc. | Handling for high resistivity substrates |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050244631A1 (en) * | 2004-04-28 | 2005-11-03 | Mitsui Chemicals, Inc. | Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same |
JP2008218930A (ja) * | 2007-03-07 | 2008-09-18 | Furukawa Electric Co Ltd:The | エネルギー線硬化型チップ保護用フィルム |
JP2010225643A (ja) * | 2009-03-19 | 2010-10-07 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
TW201246285A (en) * | 2011-03-30 | 2012-11-16 | Sumitomo Bakelite Co | Adhesive tape for processing semiconductor wafer or the like |
TW201245388A (en) * | 2011-02-04 | 2012-11-16 | Hitachi Chemical Co Ltd | Adhesive tape |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI310230B (en) * | 2003-01-22 | 2009-05-21 | Lintec Corp | Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work |
TWI304835B (en) * | 2003-06-10 | 2009-01-01 | Hitachi Chemical Co Ltd | Film adhesive and manufacturing method thereof,adhesive sheet and semiconductor device |
JPWO2005112091A1 (ja) * | 2004-05-18 | 2008-03-27 | 日立化成工業株式会社 | 粘接着シート並びにそれを用いた半導体装置及びその製造方法 |
JP5314308B2 (ja) * | 2008-03-25 | 2013-10-16 | リンテック株式会社 | レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法 |
JP5805367B2 (ja) * | 2009-01-30 | 2015-11-04 | 日東電工株式会社 | ダイシングテープ一体型ウエハ裏面保護フィルム |
JP5503357B2 (ja) * | 2009-03-23 | 2014-05-28 | 古河電気工業株式会社 | ダイシングテープ、ダイシングテープの硬化阻害防止方法及び一括封止された半導体基板のダイシング方法 |
TW201043674A (en) * | 2009-04-17 | 2010-12-16 | Furukawa Electric Co Ltd | Adhesive thin film and wafer processing tape |
JP5603757B2 (ja) * | 2009-12-04 | 2014-10-08 | リンテック株式会社 | レーザーダイシング用粘着シート及び半導体装置の製造方法 |
-
2013
- 2013-04-26 JP JP2013093424A patent/JP5603453B1/ja active Active
-
2014
- 2014-04-23 KR KR1020157016150A patent/KR101554458B1/ko active IP Right Grant
- 2014-04-23 CN CN201480009464.7A patent/CN105103273B/zh active Active
- 2014-04-23 WO PCT/JP2014/061401 patent/WO2014175321A1/ja active Application Filing
- 2014-04-25 TW TW103114978A patent/TWI494226B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050244631A1 (en) * | 2004-04-28 | 2005-11-03 | Mitsui Chemicals, Inc. | Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same |
JP2008218930A (ja) * | 2007-03-07 | 2008-09-18 | Furukawa Electric Co Ltd:The | エネルギー線硬化型チップ保護用フィルム |
JP2010225643A (ja) * | 2009-03-19 | 2010-10-07 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
TW201245388A (en) * | 2011-02-04 | 2012-11-16 | Hitachi Chemical Co Ltd | Adhesive tape |
TW201246285A (en) * | 2011-03-30 | 2012-11-16 | Sumitomo Bakelite Co | Adhesive tape for processing semiconductor wafer or the like |
Also Published As
Publication number | Publication date |
---|---|
KR101554458B1 (ko) | 2015-09-18 |
CN105103273B (zh) | 2017-04-05 |
CN105103273A (zh) | 2015-11-25 |
KR20150076263A (ko) | 2015-07-06 |
TW201500218A (zh) | 2015-01-01 |
JP2014216517A (ja) | 2014-11-17 |
JP5603453B1 (ja) | 2014-10-08 |
WO2014175321A1 (ja) | 2014-10-30 |
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