TWI472495B - Breaking device - Google Patents

Breaking device Download PDF

Info

Publication number
TWI472495B
TWI472495B TW100145926A TW100145926A TWI472495B TW I472495 B TWI472495 B TW I472495B TW 100145926 A TW100145926 A TW 100145926A TW 100145926 A TW100145926 A TW 100145926A TW I472495 B TWI472495 B TW I472495B
Authority
TW
Taiwan
Prior art keywords
rod body
brittle material
material substrate
breaking
skirts
Prior art date
Application number
TW100145926A
Other languages
English (en)
Chinese (zh)
Other versions
TW201242918A (en
Inventor
Kiyoshi Takamatsu
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201242918A publication Critical patent/TW201242918A/zh
Application granted granted Critical
Publication of TWI472495B publication Critical patent/TWI472495B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/04—Severing by squeezing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
TW100145926A 2011-04-06 2011-12-13 Breaking device TWI472495B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011084778A JP5210409B2 (ja) 2011-04-06 2011-04-06 ブレイク装置

Publications (2)

Publication Number Publication Date
TW201242918A TW201242918A (en) 2012-11-01
TWI472495B true TWI472495B (zh) 2015-02-11

Family

ID=46985987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100145926A TWI472495B (zh) 2011-04-06 2011-12-13 Breaking device

Country Status (4)

Country Link
JP (1) JP5210409B2 (ja)
KR (1) KR101323675B1 (ja)
CN (1) CN102729346B (ja)
TW (1) TWI472495B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI690401B (zh) * 2015-06-02 2020-04-11 日商三星鑽石工業股份有限公司 裂斷裝置、裂斷系統及裂斷單元

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5831119B2 (ja) * 2011-10-17 2015-12-09 日本電気硝子株式会社 ガラス基板割断装置、ガラス基板割断方法及びガラス基板作製方法
TWI491572B (zh) * 2013-09-06 2015-07-11 Taiwan Mitsuboshi Diamond Ind Co Ltd 玻璃基板分斷裝置及方法
JP6243699B2 (ja) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
JP6289949B2 (ja) * 2014-03-18 2018-03-07 三星ダイヤモンド工業株式会社 ブレイク装置
JP6290010B2 (ja) * 2014-06-09 2018-03-07 株式会社ディスコ ウェーハの分割方法
JP2016184650A (ja) * 2015-03-26 2016-10-20 三星ダイヤモンド工業株式会社 ブレイク装置
JP6569330B2 (ja) * 2015-06-29 2019-09-04 三星ダイヤモンド工業株式会社 ブレーク装置
JP6665020B2 (ja) * 2016-05-10 2020-03-13 株式会社ディスコ 分割工具、および分割工具の使用方法
JP2019038238A (ja) * 2017-08-29 2019-03-14 三星ダイヤモンド工業株式会社 ブレイク装置
JP2019038237A (ja) 2017-08-29 2019-03-14 三星ダイヤモンド工業株式会社 ブレイク装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1496799A (zh) * 2002-10-11 2004-05-19 三星钻石工业股份有限公司 脆性材料基板的切断方法、其装置及加工装置
JP2011025410A (ja) * 2009-07-21 2011-02-10 Mitsuboshi Diamond Industrial Co Ltd ブレイクバー及びブレイク方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53101186A (en) * 1977-02-15 1978-09-04 Matsushita Electric Works Ltd Splitting device
JP4187364B2 (ja) 1998-09-16 2008-11-26 Ｈｏｙａ株式会社 板状ガラス母材の切断方法、プリフォームの製造方法、および板状ガラス母材切断装置
JP2002018797A (ja) * 2000-06-29 2002-01-22 Nisshinbo Ind Inc 脆性材料製基板の割断方法及びその装置
JP3787489B2 (ja) * 2000-10-02 2006-06-21 三星ダイヤモンド工業株式会社 脆性基板のブレイク方法及び装置
JP4768114B2 (ja) * 2000-11-24 2011-09-07 Ｎｅｃ液晶テクノロジー株式会社 液晶表示パネル切断装置及び液晶表示パネル切断方法
JP2006245263A (ja) * 2005-03-03 2006-09-14 Sony Corp 基板ブレイク装置および基板ブレイク方法ならびに半導体装置
US8276796B2 (en) * 2005-05-30 2012-10-02 Mitsuboshi Diamond Industrial Co., Ltd. Device and method for cutting off substrate of fragile material
JP5376282B2 (ja) * 2008-03-25 2013-12-25 日本電気硝子株式会社 ガラス板折割方法及びガラス板折割装置
JP5193141B2 (ja) * 2009-07-21 2013-05-08 三星ダイヤモンド工業株式会社 ブレイクユニット及びブレイク方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1496799A (zh) * 2002-10-11 2004-05-19 三星钻石工业股份有限公司 脆性材料基板的切断方法、其装置及加工装置
JP2011025410A (ja) * 2009-07-21 2011-02-10 Mitsuboshi Diamond Industrial Co Ltd ブレイクバー及びブレイク方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI690401B (zh) * 2015-06-02 2020-04-11 日商三星鑽石工業股份有限公司 裂斷裝置、裂斷系統及裂斷單元

Also Published As

Publication number Publication date
KR101323675B1 (ko) 2013-10-30
TW201242918A (en) 2012-11-01
JP5210409B2 (ja) 2013-06-12
CN102729346A (zh) 2012-10-17
KR20120114150A (ko) 2012-10-16
CN102729346B (zh) 2015-01-28
JP2012218247A (ja) 2012-11-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees