TWI472495B - Breaking device - Google Patents
Breaking device Download PDFInfo
- Publication number
- TWI472495B TWI472495B TW100145926A TW100145926A TWI472495B TW I472495 B TWI472495 B TW I472495B TW 100145926 A TW100145926 A TW 100145926A TW 100145926 A TW100145926 A TW 100145926A TW I472495 B TWI472495 B TW I472495B
- Authority
- TW
- Taiwan
- Prior art keywords
- rod body
- brittle material
- material substrate
- breaking
- skirts
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 55
- 239000000463 material Substances 0.000 claims description 41
- 238000002788 crimping Methods 0.000 claims 1
- 238000009751 slip forming Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- 230000005489 elastic deformation Effects 0.000 description 5
- 229920001875 Ebonite Polymers 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000143476 Bidens Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/04—Severing by squeezing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011084778A JP5210409B2 (ja) | 2011-04-06 | 2011-04-06 | ブレイク装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201242918A TW201242918A (en) | 2012-11-01 |
TWI472495B true TWI472495B (zh) | 2015-02-11 |
Family
ID=46985987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100145926A TWI472495B (zh) | 2011-04-06 | 2011-12-13 | Breaking device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5210409B2 (ja) |
KR (1) | KR101323675B1 (ja) |
CN (1) | CN102729346B (ja) |
TW (1) | TWI472495B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI690401B (zh) * | 2015-06-02 | 2020-04-11 | 日商三星鑽石工業股份有限公司 | 裂斷裝置、裂斷系統及裂斷單元 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5831119B2 (ja) * | 2011-10-17 | 2015-12-09 | 日本電気硝子株式会社 | ガラス基板割断装置、ガラス基板割断方法及びガラス基板作製方法 |
TWI491572B (zh) * | 2013-09-06 | 2015-07-11 | Taiwan Mitsuboshi Diamond Ind Co Ltd | 玻璃基板分斷裝置及方法 |
JP6243699B2 (ja) * | 2013-10-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断装置 |
JP6289949B2 (ja) * | 2014-03-18 | 2018-03-07 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP6290010B2 (ja) * | 2014-06-09 | 2018-03-07 | 株式会社ディスコ | ウェーハの分割方法 |
JP2016184650A (ja) * | 2015-03-26 | 2016-10-20 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP6569330B2 (ja) * | 2015-06-29 | 2019-09-04 | 三星ダイヤモンド工業株式会社 | ブレーク装置 |
JP6665020B2 (ja) * | 2016-05-10 | 2020-03-13 | 株式会社ディスコ | 分割工具、および分割工具の使用方法 |
JP2019038238A (ja) * | 2017-08-29 | 2019-03-14 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP2019038237A (ja) | 2017-08-29 | 2019-03-14 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1496799A (zh) * | 2002-10-11 | 2004-05-19 | 三星钻石工业股份有限公司 | 脆性材料基板的切断方法、其装置及加工装置 |
JP2011025410A (ja) * | 2009-07-21 | 2011-02-10 | Mitsuboshi Diamond Industrial Co Ltd | ブレイクバー及びブレイク方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53101186A (en) * | 1977-02-15 | 1978-09-04 | Matsushita Electric Works Ltd | Splitting device |
JP4187364B2 (ja) | 1998-09-16 | 2008-11-26 | Hoya株式会社 | 板状ガラス母材の切断方法、プリフォームの製造方法、および板状ガラス母材切断装置 |
JP2002018797A (ja) * | 2000-06-29 | 2002-01-22 | Nisshinbo Ind Inc | 脆性材料製基板の割断方法及びその装置 |
JP3787489B2 (ja) * | 2000-10-02 | 2006-06-21 | 三星ダイヤモンド工業株式会社 | 脆性基板のブレイク方法及び装置 |
JP4768114B2 (ja) * | 2000-11-24 | 2011-09-07 | Nec液晶テクノロジー株式会社 | 液晶表示パネル切断装置及び液晶表示パネル切断方法 |
JP2006245263A (ja) * | 2005-03-03 | 2006-09-14 | Sony Corp | 基板ブレイク装置および基板ブレイク方法ならびに半導体装置 |
US8276796B2 (en) * | 2005-05-30 | 2012-10-02 | Mitsuboshi Diamond Industrial Co., Ltd. | Device and method for cutting off substrate of fragile material |
JP5376282B2 (ja) * | 2008-03-25 | 2013-12-25 | 日本電気硝子株式会社 | ガラス板折割方法及びガラス板折割装置 |
JP5193141B2 (ja) * | 2009-07-21 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | ブレイクユニット及びブレイク方法 |
-
2011
- 2011-04-06 JP JP2011084778A patent/JP5210409B2/ja active Active
- 2011-12-13 TW TW100145926A patent/TWI472495B/zh not_active IP Right Cessation
-
2012
- 2012-01-25 KR KR1020120007160A patent/KR101323675B1/ko active IP Right Grant
- 2012-03-07 CN CN201210062923.0A patent/CN102729346B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1496799A (zh) * | 2002-10-11 | 2004-05-19 | 三星钻石工业股份有限公司 | 脆性材料基板的切断方法、其装置及加工装置 |
JP2011025410A (ja) * | 2009-07-21 | 2011-02-10 | Mitsuboshi Diamond Industrial Co Ltd | ブレイクバー及びブレイク方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI690401B (zh) * | 2015-06-02 | 2020-04-11 | 日商三星鑽石工業股份有限公司 | 裂斷裝置、裂斷系統及裂斷單元 |
Also Published As
Publication number | Publication date |
---|---|
KR101323675B1 (ko) | 2013-10-30 |
TW201242918A (en) | 2012-11-01 |
JP5210409B2 (ja) | 2013-06-12 |
CN102729346A (zh) | 2012-10-17 |
KR20120114150A (ko) | 2012-10-16 |
CN102729346B (zh) | 2015-01-28 |
JP2012218247A (ja) | 2012-11-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |