TWI468453B - Resin composition and shaped article comprising same - Google Patents

Resin composition and shaped article comprising same Download PDF

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Publication number
TWI468453B
TWI468453B TW99101448A TW99101448A TWI468453B TW I468453 B TWI468453 B TW I468453B TW 99101448 A TW99101448 A TW 99101448A TW 99101448 A TW99101448 A TW 99101448A TW I468453 B TWI468453 B TW I468453B
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resin composition
compound
resin
thermoplastic resin
allyl
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TW99101448A
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Chinese (zh)
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TW201035204A (en
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Akira Ito
Yuya Masai
Mikio Furukawa
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Unitika Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C08L77/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids

Description

樹脂組成物及其所構成之成形體Resin composition and formed body thereof

本發明係有關一種樹脂組成物及其所構成之成形體，特別是有關一種具備成形時之熔融流動性之樹脂組成物及其所構成之成形體。The present invention relates to a resin composition and a molded body thereof, and more particularly to a resin composition having melt fluidity at the time of molding and a molded body formed therefor.

做為成形用之原料使用之習知之熱塑性樹脂，可舉例如：聚丙烯(PP)、ABS(丙烯腈－丁二烯－苯乙烯)、聚醯胺(PA6、PA66等)、聚酯(PET(聚對酞酸乙二酯)、PBT(聚對酞酸丁二酯)等)、聚碳酸酯(PC)、液晶聚酯(LCP)、聚苯硫醚(PPS)等。此等樹脂已廣泛使用於各種電子機器、電子零件、機械零件等領域中。此等熱塑性樹脂係經藉由調配滑石或玻璃纖維等強化用填充材而改善強度或耐熱性，且經藉由調配具有特定機能之填充材而賦予各種機能。The conventional thermoplastic resin used as a raw material for molding may, for example, be polypropylene (PP), ABS (acrylonitrile-butadiene-styrene), polyamine (PA6, PA66, etc.), polyester (PET). (polyethylene terephthalate), PBT (polybutylene terephthalate), polycarbonate (PC), liquid crystal polyester (LCP), polyphenylene sulfide (PPS), and the like. These resins have been widely used in various fields such as electronic equipment, electronic parts, and mechanical parts. These thermoplastic resins are improved in strength or heat resistance by blending a reinforcing filler such as talc or glass fiber, and are provided with various functions by blending a filler having a specific function.

PDA、行動電話、個人電腦等行動電子機器之外殼，至今係一直使用成形品之表面外觀和低翹曲性優良之聚碳酸酯樹脂或ABS樹脂等非晶性熱塑性樹脂。近年來，隨著電子機器小型化、輕量化，也逐漸要求外殼為薄化成形品。為了達成該目的，至今係逐漸在前述聚碳酸酯樹脂或ABS樹脂中調配滑石或玻璃纖維等做為強化材。然而，在此等強化樹脂組成物中，雖外殼等之強度會隨著增加該強化材之調配量而提高，但樹脂之流動性則會隨之降低。因此，難以將特別是如外殼之薄且複雜形狀之製品進行成形。In the outer casing of a mobile electronic device such as a PDA, a mobile phone, or a personal computer, an amorphous thermoplastic resin such as a polycarbonate resin or an ABS resin excellent in surface appearance and low warpage of the molded article has been used. In recent years, with the miniaturization and weight reduction of electronic equipment, the outer casing has been gradually required to be a thin molded product. In order to achieve this object, talc or glass fiber has been gradually blended into the above-mentioned polycarbonate resin or ABS resin as a reinforcing material. However, in such a reinforced resin composition, although the strength of the outer shell or the like increases as the amount of the reinforced material is increased, the fluidity of the resin decreases. Therefore, it is difficult to shape an article such as a thin and complicated shape such as a casing.

另一方面，在最近之電子機器方面，隨著其高性能化、小型化及輕量化，有效地使各種電子零件中所產生之熱散逸至外部之熱對策成為非常重要的課題。因此，要求改良做為該電子機器之構成材料之樹脂成形材料之散熱性的聲浪逐漸變大。用以改良樹脂成形材料之散熱性之習知手段，已知有調配導熱率高的填充材料(氮化硼、氮化鋁、氮化矽、氧化鋁、氧化鎂、氧化鋅、碳化矽、石墨等)之手法。例如：在JP62-131033A中記載有一種在熱塑性樹脂中填充石墨粉末而成之導熱性樹脂成形品，在JP2001-151905A中記載有一種在聚苯硫醚樹脂中填充氧化鎂或氧化鋁而成之樹脂製散熱板。然而，為了得到高導熱性樹脂組成物，必須大量添加填充材。於是，成形加工性因此而顯著降低，而有樹脂組成物之用途受限之問題。On the other hand, in recent electronic devices, with the increase in performance, miniaturization, and weight reduction, it has become an important issue to effectively prevent heat generated in various electronic components from being dissipated to the outside. Therefore, it is required to improve the heat radiation of the resin molding material which is a constituent material of the electronic device. A conventional method for improving the heat dissipation property of a resin molding material is known to have a filler material having a high thermal conductivity (boron nitride, aluminum nitride, tantalum nitride, aluminum oxide, magnesium oxide, zinc oxide, tantalum carbide, graphite). Etc.). For example, JP-A-62-131033A discloses a thermally conductive resin molded article in which a graphite resin is filled with a thermoplastic resin, and JP 2001-151905 A discloses a method in which a polyphenylene sulfide resin is filled with magnesium oxide or aluminum oxide. Resin heat sink. However, in order to obtain a highly thermally conductive resin composition, a large amount of filler must be added. As a result, the formability is remarkably lowered, and the use of the resin composition is limited.

改善如此大量添加有填充材之樹脂組成物之加工性之手法，已知有添加可塑劑。然而，若添加可塑劑，則有樹脂組成物之強度會顯著降低，並且可塑劑在熔融混練時揮發之問題。也有可塑劑會滲出(bleedout)之問題。It is known to add a plasticizer to improve the processability of the resin composition in which the filler is added in a large amount. However, if a plasticizer is added, the strength of the resin composition is remarkably lowered, and the plasticizer is volatilized during melt-kneading. There are also problems with plasticizers that can bleed out.

於是，本發明之課題在於提供一種進行射出成形時等加工時之熔融流動性優良的樹脂組成物及其所構成之成形體。Then, an object of the present invention is to provide a resin composition which is excellent in melt fluidity during processing such as injection molding, and a molded body formed therefor.

本發明之要旨係如下述。The gist of the present invention is as follows.

(1)　一種樹脂組成物，係含有熱塑性樹脂(A)、填充材(B)、及預定量之熔融黏度降低劑(C)，其中，前述預定量之熔融黏度降低劑(C)係下述(a)及(b)之任一者：(a)熔融黏度降低劑(C)係多官能性烯丙基化合物(C1)，且相對於熱塑性樹脂(A)與填充材(B)之合計100質量份，多官能性烯丙基化合物(C1)之含量係3至20質量份；(b)熔融黏度降低劑(C)係二聚酸系熱塑性樹脂(C2)，且相對於熱塑性樹脂(A)與填充材(B)之合計100體積份，二聚酸系(dimmer acid-base)熱塑性樹脂(C2)之含量係10至45體積份。(1) A resin composition comprising a thermoplastic resin (A), a filler (B), and a predetermined amount of a melt viscosity reducing agent (C), wherein the predetermined amount of the melt viscosity reducing agent (C) is as follows (a) and (b): (a) the melt viscosity reducing agent (C) is a polyfunctional allyl compound (C1) and is based on the total of the thermoplastic resin (A) and the filler (B) 100 parts by mass, the content of the polyfunctional allyl compound (C1) is 3 to 20 parts by mass; (b) the melt viscosity reducing agent (C) is a dimer acid-based thermoplastic resin (C2), and is relative to the thermoplastic resin ( A) 100 parts by volume in total with the filler (B), and the content of the dimmer acid-base thermoplastic resin (C2) is 10 to 45 parts by volume.

(2)如(1)之樹脂組成物，其中，多官能性烯丙基化合物(C1)係在骨架中具有異氰脲酸酯之化合物。(2) A resin composition according to (1), wherein the polyfunctional allyl compound (C1) is a compound having an isocyanurate in a skeleton.

(3)如(1)之樹脂組成物，其中，多官能性烯丙基化合物(C1)係由下述式(i)所示之一級胺化合物(D)、與具有烯丙基及環氧丙基(glycidyl)之多官能性化合物(E)反應而得之烯丙基化合物：R-(NH2 )n (i)在此，n=1至4，R表示芳香族系或脂肪族系之取代基。(3) The resin composition of (1), wherein the polyfunctional allyl compound (C1) is a one-stage amine compound (D) represented by the following formula (i), and has an allyl group and an epoxy group. An allyl compound obtained by reacting a polyfunctional compound (E) of glycidyl: R-(NH 2 ) n (i) Here, n = 1 to 4, and R represents an aromatic or aliphatic system Substituent.

(4)如(3)之樹脂組成物，其中，具有烯丙基及環氧丙基之多官能性化合物(E)係在骨架中具有異氰脲酸酯之化合物。(4) A resin composition according to (3), wherein the polyfunctional compound (E) having an allyl group and a glycidyl group is a compound having an isocyanurate in a skeleton.

(5)如(2)或(4)之樹脂組成物，其中，在骨架中具有異氰脲酸酯之化合物係單環氧丙基二烯丙基異氰脲酸酯。(5) A resin composition according to (2) or (4), wherein the compound having an isocyanurate in the skeleton is monoepoxypropyl diallyl isocyanurate.

(6)　如(1)之樹脂組成物，其中，二聚酸系熱塑性樹脂(C2)係聚醯胺樹脂及/或聚酯樹脂。(6) The resin composition of (1), wherein the dimer acid-based thermoplastic resin (C2) is a polyamide resin and/or a polyester resin.

(7)　如(1)至(6)中任一項之樹脂組成物，其中，填充材(B)係具有10W/(m‧K)以上之導熱率之導熱性填充材(B1)。(7) The resin composition according to any one of (1) to (6), wherein the filler (B) is a thermally conductive filler (B1) having a thermal conductivity of 10 W/(m‧K) or more.

(8)　如(7)之樹脂組成物，其中，熱塑性樹脂(A)與導熱性填充材(B1)之體積比(A/B1)係20/80至95/5。(8) The resin composition of (7), wherein the volume ratio (A/B1) of the thermoplastic resin (A) to the thermally conductive filler (B1) is 20/80 to 95/5.

(9)　如(7)或(8)之樹脂組成物，其中，導熱性填充材(B1)係從平均粒徑為1至300μm之鱗片狀石墨、平均纖維徑為1至30μm且平均纖維長為1至20mm之石墨化碳纖維、具有六方晶系結晶構造之平均粒徑為1至200μm之鱗片狀氮化硼、平均粒徑為0.5至150μm之氧化鋁、平均粒徑為0.5至150μm之氧化鎂、平均粒徑為0.5至150μm之碳酸鎂、及平均粒徑為0.5至150μm之氧化鋅中選出之至少一種。(9) The resin composition of (7) or (8), wherein the thermally conductive filler (B1) is a flaky graphite having an average particle diameter of from 1 to 300 μm, an average fiber diameter of from 1 to 30 μm, and an average fiber length Graphitized carbon fiber of 1 to 20 mm, scaly boron nitride having an average particle diameter of 1 to 200 μm having a hexagonal crystal structure, alumina having an average particle diameter of 0.5 to 150 μm, and oxidation of an average particle diameter of 0.5 to 150 μm At least one selected from the group consisting of magnesium, magnesium carbonate having an average particle diameter of 0.5 to 150 μm, and zinc oxide having an average particle diameter of 0.5 to 150 μm.

(10)如(1)至(9)中任一項之樹脂組成物，其中，熱塑性樹脂(A)係聚醯胺樹脂。(10) The resin composition according to any one of (1) to (9) wherein the thermoplastic resin (A) is a polyamide resin.

(11)一種成形體，係將上述(1)至(10)中任一項之樹脂組成物成形而成者。(11) A molded article obtained by molding the resin composition according to any one of the above (1) to (10).

(12)一種成形體，係將上述(1)至(10)中任一項之樹脂組成物成形後照射放射線而成者。(12) A molded article obtained by molding the resin composition according to any one of the above (1) to (10) and irradiating the radiation.

根據本發明，可提供一種樹脂組成物及由其所得之成形體，該樹脂組成物由於含有預定量之熔融黏度降低劑(C)，故加工時之熔融流動性優良。According to the present invention, it is possible to provide a resin composition and a molded body obtained therefrom, which resin composition has a melt fluidity at the time of processing because it contains a predetermined amount of the melt viscosity reducing agent (C).

特別是，可提供一種樹脂組成物及其所構成之成形體，該樹脂組成物係當熔融黏度降低劑(C)為多官能性烯丙基化合物(C1)時，由於多官能性烯丙基化合物(C1)係在一分子中具有多個烯丙基，因此以習知方法使烯丙基與樹脂進行交聯即可強化成形品之機械特性，故機械特性優良且加工時之熔融流動性優良者。In particular, it is possible to provide a resin composition which is a polyfunctional allyl group when the melt viscosity reducing agent (C) is a polyfunctional allyl compound (C1), and a molded body thereof. Since the compound (C1) has a plurality of allyl groups in one molecule, the allyl group and the resin are crosslinked by a conventional method to enhance the mechanical properties of the molded article, so that the mechanical properties are excellent and the melt fluidity during processing is improved. Excellent.

以下，詳細說明本發明。Hereinafter, the present invention will be described in detail.

本發明中可使用之熱塑性樹脂(A)係無特別限定，可舉例如：聚乙烯、聚丙烯、乙烯－丙烯共聚物等乙烯-α-烯烴共聚物、聚甲基戊烯、聚氯乙烯、聚偏二氯乙烯、聚乙酸乙烯酯、乙烯－乙酸乙烯酯共聚物、聚乙烯醇、聚乙烯縮醛(polyvinyl acetal)、氟樹脂(聚偏二氟乙烯、聚四氟乙烯等)、聚對酞酸乙二酯、聚對酞酸丁二酯、聚萘二甲酸乙二酯、聚乳酸、聚苯乙烯、聚丙烯腈、苯乙烯－丙烯腈共聚物、ABS樹脂、聚苯醚(PPE)、改質PPE、聚醯胺、聚醯亞胺、聚醯胺醯亞胺、聚醚醯亞胺、聚甲基丙烯酸甲酯等聚甲基丙烯酸酯、聚丙烯酸類、聚碳酸酯、聚芳酸酯(polyarylate)、聚苯硫醚、聚碸(polysulfone)、聚醚碸、聚醚腈、聚醚酮、聚酮、液晶聚合物等。其中，在成形性、耐藥品性、經濟性之觀點上，以聚醯胺為佳，此外，在成形性、耐熱性、機械強度之觀點上，以液晶聚合物為佳。The thermoplastic resin (A) which can be used in the invention is not particularly limited, and examples thereof include an ethylene-α-olefin copolymer such as polyethylene, polypropylene, and an ethylene-propylene copolymer, polymethylpentene, and polyvinyl chloride. Polyvinylidene chloride, polyvinyl acetate, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyvinyl acetal, fluororesin (polyvinylidene fluoride, polytetrafluoroethylene, etc.), poly pair Ethylene phthalate, polybutylene terephthalate, polyethylene naphthalate, polylactic acid, polystyrene, polyacrylonitrile, styrene-acrylonitrile copolymer, ABS resin, polyphenylene ether (PPE) , modified PPE, polyamine, polyimine, polyamidimide, polyether phthalimide, polymethyl methacrylate and other polymethacrylate, polyacrylic acid, polycarbonate, polyfang Polyarylate, polyphenylene sulfide, polysulfone, polyether oxime, polyether nitrile, polyether ketone, polyketone, liquid crystal polymer, and the like. Among them, polyamine is preferable in terms of moldability, chemical resistance, and economy, and a liquid crystal polymer is preferable from the viewpoint of moldability, heat resistance, and mechanical strength.

本發明中可使用之聚醯胺樹脂可舉例如：由內醯胺或胺基羧酸進行聚合、或由二胺與羧酸進行聚縮合而得之均聚醯胺及共聚醯胺、以及此等之混合物。The polyamine resin which can be used in the present invention may, for example, be a homopolyamine or a copolymerized decylamine obtained by polymerization of an indoleamine or an aminocarboxylic acid or a polycondensation of a diamine and a carboxylic acid, and a mixture of such.

聚醯胺樹脂之較佳例可舉例如：聚己醯胺(耐綸6)、聚己二醯丁二胺(polytetramethylene adipamide)(耐綸46)、聚己二醯己二胺(耐綸66)、聚己醯胺/聚己二醯己二胺共聚物(耐綸6/66)、聚十一烷醯胺(polyundecamide)(耐綸11)、聚己醯胺/聚十一烷醯胺共聚物(耐綸6/11)、聚十二烷醯胺(耐綸12)、聚己醯胺/聚十二烷醯胺共聚物(耐綸6/12)、聚癸二醯己二胺(耐綸610)、聚十二烷二醯己二胺(耐綸612)、聚己二醯十一烷二胺(耐綸116)、聚間酞醯己二胺(耐綸6I)、聚對酞醯己二胺(耐綸6T)、聚對酞醯己二胺/聚間酞醯己二胺共聚物(耐綸6T/6I)、聚己醯胺/聚對酞醯己二胺共聚物(耐綸6/6T)、聚己醯胺/聚間酞醯己二胺共聚物(耐綸6/6I)、聚己二醯己二胺/聚對酞醯己二胺共聚物(耐綸66/6T)、聚己二醯己二胺/聚間酞醯己二胺共聚物(耐綸66/6I)、聚對酞醯三甲基己二胺(耐綸TMDT)、聚雙(4-胺基環己基)甲烷十二烷醯胺(耐綸PACM12)、聚雙(3-甲基-4-胺基環己基)甲烷十二烷醯胺(耐綸二甲基PACM12)、聚己二醯間苯二甲胺(polymetaxylylene adipamide)(耐綸MXD6)、聚對酞醯十一烷二胺(耐綸11T)、及此等之混合物或共聚物等。其中，在成形性、經濟性之觀點上，以耐綸6、耐綸66為佳。Preferable examples of the polyamide resin include, for example, polyhexylamine (Nylon 6), polytetramethylene adipamide (Nylon 46), and polyhexamethylenediamine (Nylon 66). ), polyhexylamine/polyhexamethylenediamine copolymer (Nylon 6/66), polyundecamide (Nylon 11), polyhexylamine/polyundecylamine Copolymer (Nylon 6/11), Polydodecane decylamine (Nylon 12), Polyhexylamine/Polydodecyl decylamine Copolymer (Nylon 6/12), Polyfluorene hexamethylenediamine (Nylon 610), Polydodecane Dihexamethylenediamine (Nylon 612), Polyhexadidecanediamine (Nylon 116), Poly-m-D-hexanediamine (Nylon 6I), Poly酞醯Hexane diamine (Nylon 6T), poly-p-hexane diamine/poly-m-hexanediamine copolymer (Nylon 6T/6I), polyhexylamine/poly-p-hexane adipamide copolymerization (Nylon 6/6T), polyhexylamine/poly-m-hexanediamine copolymer (Nylon 6/6I), polyhexamethylenediamine/poly-p-hexanediamine copolymer (resistant Polyamide 66/6T), polyhexamethylenediamine/poly-m-hexanediamine copolymer (Nylon 66/6I), poly-p-trimethylhexamethylenediamine (NylonTMDT), poly-double ( 4-aminocyclohexyl)methane dodecane Indoleamine (Nylon PACM12), polybis(3-methyl-4-aminocyclohexyl)methanedodecylamine (Nylon dimethyl PACM12), polymetaxylylene adipamide (Nylon MXD6), polyparaxyl undecanediamine (Nylon 11T), and mixtures or copolymers thereof. Among them, in terms of formability and economy, nylon 6 and nylon 66 are preferred.

本發明中可使用之所謂液晶聚合物，係指具有可形成光學異向性熔融相的性質之熔融加工性聚合物。如此之液晶聚合物係在熔融狀態下具有聚合物分子鏈會因受到剪切應力而採取規則的平行排列之性質。如此之聚合物分子係一般為細長、扁平且沿著分子長軸之剛性相當高，並且通常具有呈現同軸或平行之任一者之關係的複數個鏈伸長鍵。例如：全芳香族系或半芳香族系之聚酯、聚酯醯亞胺、聚酯醯胺、或此等之混合物等。The term "liquid crystal polymer" which can be used in the present invention means a melt-processable polymer having a property of forming an optically anisotropic molten phase. Such a liquid crystal polymer has a property of having a regular parallel arrangement of polymer molecular chains in a molten state due to shear stress. Such polymer molecular systems are generally elongated, flat and relatively rigid along the long axis of the molecule, and typically have a plurality of chain extension bonds that exhibit either a coaxial or a parallel relationship. For example, a wholly aromatic or semi-aromatic polyester, a polyester phthalimide, a polyester decylamine, or a mixture thereof.

液晶聚合物之較佳例可舉例如：液晶聚酯、液晶聚酯醯胺、液晶聚酯碳酸酯、液晶聚酯彈性體等。其中，在成形性之觀點上，以液晶聚酯為佳。Preferable examples of the liquid crystal polymer include liquid crystal polyester, liquid crystal polyester decylamine, liquid crystal polyester carbonate, liquid crystal polyester elastomer, and the like. Among them, liquid crystal polyester is preferred from the viewpoint of formability.

液晶聚酯可舉例如：形成由從芳香族氧羰基單元、芳香族二氧基單元、芳香族二羰基單元、伸乙基二氧基單元等中選出之構造單元所構成之異向性熔融相的聚酯。The liquid crystal polyester may, for example, form an anisotropic molten phase composed of a structural unit selected from an aromatic oxycarbonyl unit, an aromatic dioxy unit, an aromatic dicarbonyl unit, and an extended ethylene dioxy unit. Polyester.

本發明之樹脂組成物係含有填充材(B)。本發明中所使用之填充材(B)係無特別限定，其代表例可舉例如：為了改善機械性質或熱性質等之目的而使用者；和為了賦予導電性、導熱性、磁性、壓電性、電磁波吸收、阻燃性、紫外線吸收等機能之目的而使用者等。填充材(B)之形態可舉例如：球狀、粉狀、纖維狀、針狀、鱗狀、鱗片狀、鬚狀、微線圈狀、奈米管狀等。The resin composition of the present invention contains a filler (B). The filler (B) used in the present invention is not particularly limited, and examples thereof include a user for the purpose of improving mechanical properties or thermal properties, and the like, and for imparting conductivity, thermal conductivity, magnetic properties, and piezoelectricity. Users, such as sex, electromagnetic wave absorption, flame retardancy, ultraviolet absorption, etc. Examples of the filler (B) include a spherical shape, a powder shape, a fibrous shape, a needle shape, a scaly shape, a scale shape, a whisker shape, a micro coil shape, and a nanotube shape.

填充材(B)之具體例可舉例如：乙炔黑、科琴碳黑(Ketjen black)、碳奈米管、碳奈米纖維、金屬粉(銀、銅、鋁、鈦、鎳、錫、鐵、不鏽鋼等)、導電性氧化鋅、氧化錫、氧化銦、各種鐵氧體(ferrite)、磁性氧化鐵、氧化鋁、氧化鎂、氧化鋅、碳酸鎂、碳化矽、氮化鋁、氮化硼、氮化矽、碳、石墨、鈦酸鋇、鈦酸鋯酸鉛、鈦酸鉀、硬矽鈣石(xonotlite)、雲母、滑石、蒙脫石(montmorillonite)、水滑石(hydrotacite)、碳酸鈣、碳酸鋅、矽灰石(wollastonite)、硫酸鋇、二硫化鉬、氟乙烯(例如鐵氟龍(Teflon)(註冊商標))粉、氧化矽、玻璃珠(glass beads)、玻璃球(glass balloon)、氧化鈦、氫氧化鋁、氫氧化鎂、三氧化銻、硼酸、硼酸鋅、氧化鈰、氧化鈣、矽膠、海泡石(sepiolite)、活性碳、沸石(zeolite)、鎢、氧化鋯、纖維素微粒子、木粉、豆渣、穀殼、玻璃纖維、碳纖維、石墨化碳纖維、芳醯胺(aramid)纖維、金屬纖維、不鏽鋼纖維、氧化矽纖維、氧化矽/氧化鋁纖維、氧化鋯纖維、氮化矽纖維、硼纖維、鈦酸鉀纖維、洋麻(kenaf)或麻等天然纖維等。Specific examples of the filler (B) include, for example, acetylene black, Ketjen black, carbon nanotubes, carbon nanofibers, metal powders (silver, copper, aluminum, titanium, nickel, tin, iron). , stainless steel, etc.), conductive zinc oxide, tin oxide, indium oxide, various ferrite, magnetic iron oxide, aluminum oxide, magnesium oxide, zinc oxide, magnesium carbonate, tantalum carbide, aluminum nitride, boron nitride , tantalum nitride, carbon, graphite, barium titanate, lead zirconate titanate, potassium titanate, xonotlite, mica, talc, montmorillonite, hydrotacite, calcium carbonate , zinc carbonate, wollastonite, barium sulfate, molybdenum disulfide, vinyl fluoride (such as Teflon (registered trademark)) powder, cerium oxide, glass beads, glass balloons ), titanium oxide, aluminum hydroxide, magnesium hydroxide, antimony trioxide, boric acid, zinc borate, antimony oxide, calcium oxide, tannin, sepiolite, activated carbon, zeolite, tungsten, zirconia, Cellulose microparticles, wood flour, bean dregs, chaff, fiberglass, carbon fiber, graphitized carbon fiber, aromatic Natural fibers such as aramid fiber, metal fiber, stainless steel fiber, yttria fiber, yttria/alumina fiber, zirconia fiber, tantalum nitride fiber, boron fiber, potassium titanate fiber, kenaf or hemp Wait.

在本發明之樹脂組成物中，熱塑性樹脂(A)與填充材(B)(包含後述之導熱性填充材(B1))之體積比(A/B)以20/80至95/5為佳、以30/70至90/10較佳、以30/70至60/40特佳。若填充材(B)之調配量未達5體積%，則有時無法得到充分的調配填充材之效果，若調配量超過80體積%，則由於流動性顯著降低，故成形加工時之負載過高，而有時操作性降低。In the resin composition of the present invention, the volume ratio (A/B) of the thermoplastic resin (A) to the filler (B) (including the thermally conductive filler (B1) described later) is preferably 20/80 to 95/5. It is preferably 30/70 to 90/10, and particularly preferably 30/70 to 60/40. When the blending amount of the filler (B) is less than 5% by volume, the effect of sufficiently blending the filler may not be obtained. If the blending amount exceeds 80% by volume, the fluidity is remarkably lowered, so that the load during molding is excessively affected. High, and sometimes operability is reduced.

在本發明中，為了對樹脂組成物賦予導熱性，填充材(B)可使用具有10W/(m‧K)以上之導熱率之導熱性填充材(B1)。導熱性填充材(B1)可使用導電性填充材、絕緣性填充材之任一者。導熱性填充材(B1)之導熱率可使用其燒結物進行測定。導熱性填充材(B1)之具體例(以下在括弧內標示導熱率之代表值[單位：W/(m‧K))]可舉例如：氧化鋁(36)、氧化鎂(60)、氧化鋅(25)、碳酸鎂(15)、碳化矽(160)、氮化鋁(170)、氮化硼(210)、氮化矽(40)、碳(10至數百)、石墨(10至數百)等無機系填充材；銀(427)、銅(398)、鋁(237)、鈦(22)、鎳(90)、錫(68)、鐵(84)、不鏽鋼(15)等金屬系填充材等。此等除了可使用1種，也可併用2種以上。In the present invention, in order to impart thermal conductivity to the resin composition, the filler (B) may be a thermally conductive filler (B1) having a thermal conductivity of 10 W/(m‧K) or more. As the thermally conductive filler (B1), any of a conductive filler and an insulating filler can be used. The thermal conductivity of the thermally conductive filler (B1) can be measured using the sintered product. Specific examples of the thermal conductive filler (B1) (hereinafter, representative values of thermal conductivity (in units of W/(m‧K)) are indicated in parentheses), for example, alumina (36), magnesium oxide (60), and oxidation. Zinc (25), magnesium carbonate (15), niobium carbide (160), aluminum nitride (170), boron nitride (210), tantalum nitride (40), carbon (10 to hundreds), graphite (10 to Inorganic fillers such as hundreds of); metals such as silver (427), copper (398), aluminum (237), titanium (22), nickel (90), tin (68), iron (84), and stainless steel (15) It is a filler and the like. These may be used alone or in combination of two or more.

導熱性填充材(B1)之平均粒徑係，除了後述之特定者以外，以0.5至300μm為佳、以1至150μm較佳。由於若平均粒徑未達0.5μm，則因分散不良而容易產生凝聚塊，因此無法得到均勻的成形品，而使機械物性降低、或導熱性產生不均，故不佳。由於若平均粒徑超過300μm，則有時難以高濃度地填充在樹脂中、或成形品表面變粗糙，故不佳。The average particle diameter of the thermally conductive filler (B1) is preferably from 0.5 to 300 μm, preferably from 1 to 150 μm, in addition to the specific ones described later. When the average particle diameter is less than 0.5 μm, aggregation is likely to occur due to poor dispersion, and thus a uniform molded article cannot be obtained, and mechanical properties are lowered or unevenness in thermal conductivity is caused, which is not preferable. When the average particle diameter exceeds 300 μm, it may be difficult to fill the resin in a high concentration or the surface of the molded article may become rough, which is not preferable.

在本發明中，因調配在熱塑性樹脂(A)中時之導熱效率高，故上述例示之填充材中以使用石墨、氮化硼作為導熱性填充材(B1)為佳。此外，在經濟性之觀點上，以使用氧化鋁、氧化鎂、碳酸鎂、氧化鋅為佳。In the present invention, since the heat transfer efficiency in the thermoplastic resin (A) is high, it is preferable to use graphite or boron nitride as the heat conductive filler (B1) in the above-exemplified filler. Further, from the viewpoint of economy, it is preferred to use alumina, magnesia, magnesium carbonate or zinc oxide.

本發明中可使用之石墨系填充材之形態可舉例如：球狀、粉狀、纖維狀、針狀、鱗片狀、鬚狀、微線圈狀、奈米管狀等。其中，由於調配在熱塑性樹脂(A)中時可提高導熱效率，故以鱗片狀石墨、石墨化碳纖維特佳。The form of the graphite-based filler which can be used in the present invention may be, for example, a spherical shape, a powder form, a fibrous form, a needle shape, a scale shape, a whisker shape, a micro coil shape, or a nanotube shape. Among them, scaly graphite and graphitized carbon fiber are particularly preferable since the heat transfer efficiency can be improved when blended in the thermoplastic resin (A).

鱗片狀石墨之平均粒徑以1至300μm為佳、以5至150μm更佳。若平均粒徑未達1μm，則因分散不良而容易產生凝聚塊，因此無法得到均勻的成形品，而有時機械物性降低、或導熱性產生不均。若平均粒徑超過300μm，則有時難以高濃度地填充在樹脂組成物中、或成形品表面變粗糙。The average particle diameter of the flaky graphite is preferably from 1 to 300 μm, more preferably from 5 to 150 μm. When the average particle diameter is less than 1 μm, agglomerates tend to be generated due to poor dispersion, and thus a uniform molded article cannot be obtained, and mechanical properties may be lowered or thermal conductivity may be uneven. When the average particle diameter exceeds 300 μm, it may be difficult to fill the resin composition at a high concentration or the surface of the molded article may become rough.

石墨化碳纖維以瀝青(pitch)系之碳纖維為佳，瀝青系之碳纖維以例如JP2003－49327A中所記載之瀝青系碳纖維為佳，其中尤以經由以介相(mesophase)瀝青做為原料在1000至3000℃之高溫進行煅燒而促進石墨化之瀝青系碳纖維較佳。石墨化之程度係無特別限制，但長度方向之導熱率會隨著接近石墨纖維而增加。在本發明中，石墨化碳纖維之長度方向之導熱率通常為100W/(m‧K)以上，且以500W/(m‧K)以上為佳。The graphitized carbon fiber is preferably a pitch-based carbon fiber, and the pitch-based carbon fiber is preferably a pitch-based carbon fiber as described in, for example, JP 2003-49327 A, wherein a mesophase pitch is used as a raw material at 1000 to A pitch-based carbon fiber which is calcined at a high temperature of 3000 ° C to promote graphitization is preferred. The degree of graphitization is not particularly limited, but the thermal conductivity in the longitudinal direction increases as it approaches the graphite fiber. In the present invention, the thermal conductivity of the graphitized carbon fibers in the longitudinal direction is usually 100 W/(m‧K) or more, and preferably 500 W/(m ‧ K) or more.

石墨化碳纖維之平均纖維徑以1至30μm為佳、以5至20μm更佳。若平均纖維徑未達1μm，則無法得到充分的導熱率，若平均纖維徑超過30μm，則有時成形性等會降低。The average fiber diameter of the graphitized carbon fibers is preferably from 1 to 30 μm, more preferably from 5 to 20 μm. When the average fiber diameter is less than 1 μm, sufficient thermal conductivity cannot be obtained, and when the average fiber diameter exceeds 30 μm, moldability and the like may be lowered.

石墨化碳纖維之平均纖維長以1至20mm為佳、以3至15mm更佳。若平均纖維長未達1mm，則無法得到充分的導熱率。平均纖維長越長，則不僅導熱率越高，彎曲強度和彎曲彈性率也越大。然而，若平均纖維長超過20mm，則流動性會大幅降低，而在成形性等之觀點上為不佳。The average fiber length of the graphitized carbon fibers is preferably from 1 to 20 mm, more preferably from 3 to 15 mm. If the average fiber length is less than 1 mm, sufficient thermal conductivity cannot be obtained. The longer the average fiber length, the higher the thermal conductivity, and the greater the bending strength and the bending elastic modulus. However, when the average fiber length exceeds 20 mm, the fluidity is drastically lowered, and it is not preferable from the viewpoint of formability and the like.

石墨化碳纖維之市售物可舉例如：日本石墨纖維公司製之商品名「GRANOC」、和三菱化學產資公司製之商品名「DIALEAD」等。The commercially available product of the graphitized carbon fiber is, for example, the product name "GRANOC" manufactured by Nippon Graphite Co., Ltd., and the trade name "DIALEAD" manufactured by Mitsubishi Chemical Corporation.

本發明中可使用之氮化硼之形態可舉例如：球狀、粉狀、纖維狀、針狀、鱗片狀、鬚狀、微線圈狀、奈米管狀等。因在製作成成形體時容易定向於面方向，結果可提高導熱率，因此以鱗片狀為佳。因含有氮化硼，而可在不降低樹脂組成物之絕緣性之情形下提高導熱性。The form of boron nitride which can be used in the present invention may be, for example, a spherical shape, a powder form, a fibrous form, a needle shape, a scale shape, a whisker shape, a micro coil shape, or a nanotube shape. Since it is easy to be oriented in the plane direction when the molded body is produced, as a result, the thermal conductivity can be improved, so that it is preferably in the form of scales. Since boron nitride is contained, thermal conductivity can be improved without lowering the insulating properties of the resin composition.

氮化硼之平均粒徑以1至200μm為佳、以5至100μm更佳。若平均粒徑未達1μm，則因分散不良而容易產生凝聚塊，因此無法得到均勻的成形品，而有時機械物性降低、或導熱性產生不均。若平均粒徑超過200μm，則有時難以高濃度地填充在樹脂組成物中、或成形品表面變粗糙。The average particle diameter of boron nitride is preferably from 1 to 200 μm, more preferably from 5 to 100 μm. When the average particle diameter is less than 1 μm, agglomerates tend to be generated due to poor dispersion, and thus a uniform molded article cannot be obtained, and mechanical properties may be lowered or thermal conductivity may be uneven. When the average particle diameter exceeds 200 μm, it may be difficult to fill the resin composition at a high concentration or the surface of the molded article may become rough.

氮化硼之結晶系係並無特別限定。可使用六方晶系、立方晶系、其他任何的結晶構造之氮化硼。其中，由於導熱率大，故以具有六方晶系結晶構造之氮化硼為佳。The crystal system of boron nitride is not particularly limited. Boron nitride in a hexagonal system, a cubic system, or any other crystal structure can be used. Among them, since the thermal conductivity is large, boron nitride having a hexagonal crystal structure is preferred.

本發明中可使用之氧化鋁、氧化鎂、碳酸鎂、氧化鋅之形態可舉例如：球狀、纖維狀、紡錘狀、棒狀、針狀、筒狀、柱狀等。因在調配於熱塑性樹脂(A)中時可抑制樹脂之流動性降低，因此以球狀為佳。因含有氧化鋁、氧化鎂、碳酸鎂，而可在不降低樹脂組成物之絕緣性之情形下提高導熱性。Examples of the form of alumina, magnesia, magnesium carbonate, and zinc oxide which can be used in the present invention include a spherical shape, a fibrous shape, a spindle shape, a rod shape, a needle shape, a cylindrical shape, and a columnar shape. Since the fluidity of the resin can be suppressed from being lowered when formulated in the thermoplastic resin (A), it is preferably spherical. Since aluminum oxide, magnesium oxide, and magnesium carbonate are contained, thermal conductivity can be improved without lowering the insulating properties of the resin composition.

氧化鋁、氧化鎂、碳酸鎂、氧化鋅之平均粒徑以0.5至150μm為佳、以1至100μm更佳。若平均粒徑未達0.5μm，則因分散不良而容易產生凝聚塊，因此無法得到均勻的成形品，而有時機械物性降低、或導熱性產生不均。若平均粒徑超過150μm，則有時難以高濃度地填充在樹脂組成物中、或成形品表面變粗糙。The average particle diameter of alumina, magnesia, magnesium carbonate, and zinc oxide is preferably from 0.5 to 150 μm, more preferably from 1 to 100 μm. When the average particle diameter is less than 0.5 μm, agglomerates tend to be generated due to poor dispersion, and thus a uniform molded article cannot be obtained, and mechanical properties may be lowered or thermal conductivity may be uneven. When the average particle diameter exceeds 150 μm, it may be difficult to fill the resin composition at a high concentration or the surface of the molded article may become rough.

為了提高與熱塑性樹脂(A)之密著性，本發明中所使用之填充材(B)也可為經耦合劑實施表面處理者。耦合劑之例子可舉例如矽烷系耦合劑、鈦系耦合劑，例如：γ-胺基丙基三甲氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基三甲氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基二甲氧基甲基矽烷等胺基矽烷系耦合劑；γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基三乙氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷等環氧矽烷系耦合劑；和異丙基三硬脂醯基鈦酸酯、異丙基三(十二烷基苯磺醯基)酞酸酯、四異丙基雙(二辛基亞磷酸基)酞酸酯(Tetraisopropyl bis(dioctylphosphito)titanate)等鈦系耦合劑等。此等可單獨使用，也可併用。In order to improve the adhesion to the thermoplastic resin (A), the filler (B) used in the present invention may be a surface treatment agent by a coupling agent. Examples of the coupling agent include, for example, a decane-based coupling agent, a titanium-based coupling agent, for example, γ-aminopropyltrimethoxydecane, and N-β-(aminoethyl)-γ-aminopropyltrimethoxy. An amine decane-based coupling agent such as decane or N-β-(aminoethyl)-γ-aminopropyldimethoxymethyl decane; γ-glycidoxypropyltrimethoxydecane, γ- An epoxy decane-based coupling agent such as glycidoxypropyltriethoxydecane or β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane; and isopropyltristearate titanic acid Titanium coupling agents such as ester, isopropyl tris(dodecylbenzenesulfonyl) phthalate, tetraisopropyl bis(dioctylphosphino)titanate, etc. . These can be used alone or in combination.

本發明之樹脂組成物係含有預定量之熔融黏度降低劑(C)。本發明中所使用之熔融黏度降低劑(C)係多官能性烯丙基化合物(C1)與二聚酸系熱塑性樹脂(C2)之任一者。The resin composition of the present invention contains a predetermined amount of a melt viscosity reducing agent (C). The melt viscosity reducing agent (C) used in the present invention is any one of a polyfunctional allyl compound (C1) and a dimer acid thermoplastic resin (C2).

多官能性烯丙基化合物(C1)係無特別限定，但在樹脂組成物之熔融加工溫度下必須為液狀。此外，多官能性烯丙基化合物(C1)係可降低所添加之樹脂之熔融黏度，因此也可有效地發揮做為可塑劑之作用。The polyfunctional allyl compound (C1) is not particularly limited, but must be liquid at the melt processing temperature of the resin composition. Further, since the polyfunctional allyl compound (C1) can lower the melt viscosity of the added resin, it can also effectively function as a plasticizer.

多官能性烯丙基化合物(C1)之具體例可舉例如：三烯丙基異氰脲酸酯、單環氧丙基二烯丙基異氰脲酸酯、二環氧丙基單烯丙基異氰脲酸酯、三(甲基烯丙基)異氰脲酸酯、單環氧丙基二(甲基烯丙基)異氰脲酸酯、二環氧丙基單(甲基烯丙基)異氰脲酸酯、三烯丙基氰脲酸酯、單環氧丙基二烯丙基氰脲酸酯、二環氧丙基單烯丙基氰脲酸酯、三(甲基烯丙基)氰脲酸酯、單環氧丙基二(甲基烯丙基)氰脲酸酯、二環氧丙基單(甲基烯丙基)氰脲酸酯、烯丙基環氧丙基胺、二烯丙基單環氧丙基胺、單烯丙基二環氧丙基胺、單環氧丙基二(甲基烯丙基)胺、二環氧丙基單(甲基烯丙基)胺、氯菌酸環氧丙酯烯丙酯、己二酸烯丙酯環氧丙酯、碳酸烯丙酯環氧丙酯、氯化烯丙基環氧丙基二甲基銨、富馬酸烯丙酯環氧丙酯、間酞酸烯丙酯環氧丙酯、丙二酸烯丙酯環氧丙酯、草酸烯丙酯環氧丙酯、酞酸烯丙酯環氧丙酯、烯丙基環氧丙基丙基異氰脲酸酯、癸二酸烯丙酯環氧丙酯、琥珀酸烯丙酯環氧丙酯、對酞酸烯丙酯環氧丙酯、酒石酸烯丙酯環氧丙酯(allyl glycidyl tartrate)、酞酸環氧丙酯甲基烯丙酯等。此等化合物中尤以在骨架中具有異氰脲酸酯之化合物為佳，特別是在處理性、經濟性之觀點上，以三烯丙基異氰脲酸酯、單環氧丙基二烯丙基異氰脲酸酯為更佳。Specific examples of the polyfunctional allyl compound (C1) include, for example, triallyl isocyanurate, monoepoxypropyl diallyl isocyanurate, and diepoxypropyl monoallyl. Isoisocyanurate, tris(methallyl)isocyanurate, monoepoxypropyl bis(methylallyl)isocyanurate,diepoxypropyl mono(methylene) Propyl)isocyanurate, triallyl cyanurate, monoepoxypropyldiallyl cyanurate, diepoxypropyl monoallyl cyanurate, tris(methyl) Allyl) cyanurate, monoepoxypropyl bis(methylallyl) cyanurate, diepoxypropyl mono(methylallyl) cyanurate, allyl epoxy Propylamine, diallyl monoepoxypropylamine, monoallyl digoxypropylamine, monoepoxypropyl bis(methylallyl)amine, diepoxypropyl mono(methyl) Allyl)amine, allyl chlorohydrin allylate, allyl adipate propyl acrylate, allyl carbonate propyl propyl ester, allyl propylene propyl dimethyl ammonium chloride , allyl fumarate propyl acrylate, allyl phthalate propyl acrylate, allyl malonate propyl acrylate, allyl oxalate Oxypropyl propyl ester, allyl citrate, propyl acrylate, allyl propylene propyl isocyanurate, allyl phthalate, propyl acrylate, allyl succinate, propyl propyl ester, P-propyl acrylate, allyl glycidyl tartrate, glycidyl phthalate, methyl allyl ester, and the like. Among these compounds, a compound having an isocyanurate in the skeleton is preferred, and in particular, in terms of handleability and economy, triallyl isocyanurate or monoepoxypropyldiene is preferred. More preferably, propyl isocyanurate is preferred.

此外，多官能性烯丙基化合物(C1)係除了上述化合物以外，還可使用由下述式(i)所示之一級胺化合物(D)、與具有烯丙基及環氧丙基之多官能性化合物(E)反應而得之烯丙基化合物：Further, the polyfunctional allyl compound (C1) may be used in addition to the above compounds, and may be one of the amine compounds (D) represented by the following formula (i), and having an allyl group and an epoxypropyl group. The allyl compound obtained by reacting the functional compound (E):

R－(NH2 )n 　(i)R-(NH 2 ) n (i)

在此，n=1至4，R表示芳香族系或脂肪族系之1至4取代基。Here, n = 1 to 4, and R represents a 1 to 4 substituent of an aromatic or aliphatic system.

式(i)所示之一級胺化合物(D)係以n=2之二胺類為佳。n=2之二胺類之具體例可舉例如：乙二胺、己二胺、1,4-二胺基環己烷、1,3-二胺基環己烷、4,4’-二胺基二環己基甲烷、1,3-雙(胺基甲基)環己烷、1,4-雙(胺基甲基)環己烷、4,4’-二胺基二環己基丙烷、雙(4-胺基環己基)碸、4,4’-二胺基二環己基醚、2,2’-二甲基-4,4’-二胺基二環己烷、2,2’-雙(三氟甲基)-4,4’-二胺基二環己烷、2,2’-雙(三氯甲基)-4,4’-二胺基二環己烷、2,2’-雙(三溴甲基)-4,4’-二胺基二環己烷、2,2’-二氟-4,4’-二胺基二環己烷、2,2’-二氯-4,4’-二胺基二環己烷、2,2’-二溴-4,4’-二胺基二環己烷、4,4’-二胺基二環己烷、2,2-雙(4-胺基環己基)-1,1,1,3,3,3-六氟丙烷、2,3-二胺基雙環[2.2.1]庚烷、2,5-二胺基雙環[2.2.1]庚烷、2,6-二胺基雙環[2.2.1]庚烷、2,7-二胺基雙環[2.2.1]庚烷、2,5-雙(胺基甲基)-雙環[2.2.1]庚烷、2,6-雙(胺基甲基)-雙環[2.2.1]庚烷、2,3-雙(胺基甲基)-雙環[2.2.1]庚烷、二伸乙三胺、二伸丙三胺、三伸乙四胺、1,2-雙(胺基甲基)苯、1,3-雙(胺基甲基)苯、1,4-雙(胺基甲基)苯、2,2’-二甲基-4,4-二胺基聯苯、2,2’-雙(三氟甲基)-4,4’-二胺基聯苯、2,2’-雙(三氯甲基)-4,4’-二胺基聯苯、2,2’-雙(三溴甲基)-4,4’-二胺基聯苯、2,2’-二氟-4,4’-二胺基聯苯、2,2’-二氯-4,4’-二胺基聯苯、2,2’-二溴-4,4’-二胺基聯苯、4,4’-二胺基聯苯、4,4’-二胺基二苯甲酮、9,9-雙(4-胺基苯基)茀、9,9-雙(4-胺基-2-氟苯基)茀、9,9-雙(4-胺基-2-溴苯基)茀、9,9-雙(4-胺基-2-氯苯基)茀、9,9-雙(4-胺基-3-氟苯基)茀、9,9-雙(4-胺基-3-溴苯基)薄、9,9-雙(4-胺基-3-氯苯基)茀、9,9-雙(4-胺基-2-三氟甲基苯基)薄、9,9-雙(4-胺基-3-三氟甲基苯基)茀、雙(4-胺基苯基)碸、1,4-二胺基苯、1,3-二胺基苯、4,4’-二胺基二苯基醚、4,4’-二胺基二苯基甲烷、4,4’-二胺基二苯基丙烷、2,2-雙(4-胺基苯基)-1,1,1,3,3,3-六氟丙烷、3,4’-二胺基二苯基醚等。The one-stage amine compound (D) represented by the formula (i) is preferably a diamine of n=2. Specific examples of the diamine having n = 2 may, for example, be ethylenediamine, hexamethylenediamine, 1,4-diaminocyclohexane, 1,3-diaminocyclohexane, 4,4'-di Aminodicyclohexylmethane, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 4,4'-diaminodicyclohexylpropane, Bis(4-aminocyclohexyl)anthracene, 4,4'-diaminodicyclohexyl ether, 2,2'-dimethyl-4,4'-diaminodicyclohexane, 2,2' - bis(trifluoromethyl)-4,4'-diaminodicyclohexane, 2,2'-bis(trichloromethyl)-4,4'-diaminodicyclohexane, 2, 2'-bis(tribromomethyl)-4,4'-diaminodicyclohexane, 2,2'-difluoro-4,4'-diaminodicyclohexane, 2,2'- Dichloro-4,4'-diaminodicyclohexane, 2,2'-dibromo-4,4'-diaminodicyclohexane, 4,4'-diaminodicyclohexane, 2,2-bis(4-aminocyclohexyl)-1,1,1,3,3,3-hexafluoropropane, 2,3-diaminobicyclo[2.2.1]heptane, 2,5- Diaminobicyclo[2.2.1]heptane, 2,6-diaminobicyclo[2.2.1]heptane, 2,7-diaminobicyclo[2.2.1]heptane, 2,5-bis ( Aminomethyl)-bicyclo[2.2.1]heptane, 2,6-bis(aminomethyl)-bicyclo[2.2.1]heptane, 2,3-bis(amino group A )-bicyclo[2.2.1]heptane, diethylenetriamine, dipropylenetriamine, triamethylenetetramine, 1,2-bis(aminomethyl)benzene, 1,3-bis(amino) Methyl)benzene, 1,4-bis(aminomethyl)benzene, 2,2'-dimethyl-4,4-diaminobiphenyl, 2,2'-bis(trifluoromethyl)- 4,4'-diaminobiphenyl, 2,2'-bis(trichloromethyl)-4,4'-diaminobiphenyl, 2,2'-bis(tribromomethyl)-4, 4'-diaminobiphenyl, 2,2'-difluoro-4,4'-diaminobiphenyl, 2,2'-dichloro-4,4'-diaminobiphenyl, 2,2 '-Dibromo-4,4'-diaminobiphenyl, 4,4'-diaminobiphenyl, 4,4'-diaminobenzophenone, 9,9-bis(4-amino group Phenyl)anthracene, 9,9-bis(4-amino-2-fluorophenyl)anthracene, 9,9-bis(4-amino-2-bromophenyl)anthracene, 9,9-bis (4) -amino-2-chlorophenyl)anthracene, 9,9-bis(4-amino-3-fluorophenyl)anthracene, 9,9-bis(4-amino-3-bromophenyl) thin, 9,9-bis(4-amino-3-chlorophenyl)anthracene, 9,9-bis(4-amino-2-trifluoromethylphenyl) thin, 9,9-bis(4-amine Benzyl-3-trifluoromethylphenyl)anthracene, bis(4-aminophenyl)anthracene, 1,4-diaminobenzene, 1,3-diaminobenzene, 4,4'-diamino Diphenyl ether, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl Propane, 2,2-bis(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 3,4'-diaminodiphenyl ether, and the like.

式(i)所示之一級胺化合物(D)中之n=1之單胺類之具體例可舉例如：甲胺、二甲胺、乙胺、二乙胺、正丙胺、二正丙胺、異丙胺、正丁胺、異丁胺、二級丁胺、三級丁胺、二正丁胺、單戊胺、二戊胺、乙基丁基胺、正己胺、二正己胺、環己胺、十二烷胺、十六烷胺、十八烷胺、苯胺、鄰甲苯胺(o-toluidine)、間甲苯胺、對甲苯胺、2,3-二甲苯胺(2,3-xylidine)、2,6-二甲苯胺、3,4-二甲苯胺、3,5-二甲苯胺、鄰氯苯胺、間氯苯胺、對氯苯胺、鄰溴苯胺、間溴苯胺、對溴苯胺、鄰硝基苯胺、間硝基苯胺、對硝基苯胺、鄰胺基苯酚(o-aminophenol)、間胺基苯酚、對胺基苯酚、鄰甲氧基苯胺(o-anisidine)、間甲氧基苯胺、對甲氧基苯胺、鄰乙氧基苯胺(o-phenetidine)、間乙氧基苯胺、對乙氧基苯胺、鄰胺基苯甲醛、間胺基苯甲醛、對胺基苯甲醛、鄰胺基苯甲腈、間胺基苯甲腈、對胺基苯甲腈、2-胺基聯苯、3-胺基聯苯、4-胺基聯苯、2-胺基苯基苯基醚、3-胺基苯基苯基醚、4-胺基苯基苯基醚、2-胺基二苯甲酮、3-胺基二苯甲酮、4-胺基二苯甲酮、2-胺基苯基苯基硫醚、3-胺基苯基苯基硫醚、4-胺基苯基苯基硫醚、2-胺基苯基苯基碸、3-胺基苯基苯基碸、4-胺基苯基苯基碸、α-萘胺、β-萘胺、1-胺基-2-萘酚、2-胺基-1-萘酚、4-胺基-1-萘酚、5-胺基-1-萘酚、5-胺基-2-萘酚、7-胺基-2-萘酚、8-胺基-1-萘酚、8-胺基-2-萘酚、1-胺基蒽、2-胺基蒽、9-胺基蒽等。Specific examples of the monoamine of n=1 in the one-step amine compound (D) represented by the formula (i) include, for example, methylamine, dimethylamine, ethylamine, diethylamine, n-propylamine, di-n-propylamine, Isopropylamine, n-butylamine, isobutylamine, secondary butylamine, tertiary butylamine, di-n-butylamine, monoamylamine, diamylamine, ethylbutylamine, n-hexylamine, di-n-hexylamine, cyclohexylamine , dodecylamine, hexadecylamine, octadecylamine, aniline, o-toluidine, m-toluidine, p-toluidine, 2,3-xylidine, 2,6-xylyleneamine, 3,4-dimethylaniline, 3,5-dimethylaniline, o-chloroaniline, m-chloroaniline, p-chloroaniline, o-bromoaniline, m-bromoaniline, p-bromoaniline, o-nitrite Aniline, m-nitroaniline, p-nitroaniline, o-aminophenol, m-aminophenol, p-aminophenol, o-anisidine, m-anisidine, P-methoxyaniline, o-phenetidine, m-ethoxyaniline, p-ethoxyaniline, o-aminobenzaldehyde, m-aminobenzaldehyde, p-aminobenzaldehyde, ortho-amino group Benzoonitrile, m-aminobenzonitrile, p-amino Nitrile, 2-aminobiphenyl, 3-aminobiphenyl, 4-aminobiphenyl, 2-aminophenylphenyl ether, 3-aminophenylphenyl ether, 4-aminophenyl Phenyl ether, 2-aminobenzophenone, 3-aminobenzophenone, 4-aminobenzophenone, 2-aminophenyl phenyl sulfide, 3-aminophenyl phenyl Thioether, 4-aminophenylphenyl sulfide, 2-aminophenylphenylhydrazine, 3-aminophenylphenylhydrazine, 4-aminophenylphenylhydrazine, α-naphthylamine, β -naphthylamine, 1-amino-2-naphthol, 2-amino-1-naphthol, 4-amino-1-naphthol, 5-amino-1-naphthol, 5-amino-2 -naphthol, 7-amino-2-naphthol, 8-amino-1-naphthol, 8-amino-2-naphthol, 1-aminoindole, 2-aminopurine, 9-amino group Hey.

式(i)所示之一級胺化合物(D)中之n=3之三胺類之具體例可舉例如：1,3,5-三胺基苯、參(3-胺基苯基)胺、參(4-胺基苯基)胺、參(3-胺基苯基)苯、參(4-胺基苯基)苯、1,3,5-參(3-胺基苯氧基)苯、1,3,5-參(4-胺基苯氧基)苯、1,3,5-參(4-胺基苯氧基)三等。Specific examples of the triamine having n = 3 in the one-step amine compound (D) represented by the formula (i) include, for example, 1,3,5-triaminobenzene and stilbene (3-aminophenyl)amine. , ginseng (4-aminophenyl)amine, ginseng (3-aminophenyl)benzene, ginseng (4-aminophenyl)benzene, 1,3,5-gin (3-aminophenoxy) Benzene, 1,3,5-gin (4-aminophenoxy)benzene, 1,3,5-gin (4-aminophenoxy) three Wait.

式(i)所示之一級胺化合物(D)中之n=4之四胺類之具體例可舉例如：1,2,4,5-四胺基苯、3,3’,4,4’-四胺基聯苯、3,3’,4,4’-四胺基二苯基碸、3,3’,4,4’-四胺基二苯基硫醚、2,3,6,7-四胺基萘、1,2,5,6-四胺基萘等。Specific examples of the tetraamine having n = 4 in the one-step amine compound (D) represented by the formula (i) include, for example, 1,2,4,5-tetraaminobenzene, 3,3', 4, 4 '-Tetraaminobiphenyl, 3,3',4,4'-tetraaminodiphenylanthracene, 3,3',4,4'-tetraaminodiphenyl sulfide, 2,3,6 , 7-tetraaminonaphthalene, 1,2,5,6-tetraaminonaphthalene, and the like.

也可為了調整各種特性等之目的而併用此等中之複數種胺。It is also possible to use a plurality of amines in these in order to adjust various characteristics and the like.

使與上述一級胺化合物(D)反應之具有烯丙基及環氧丙基之多官能性化合物(E)，只要為具有烯丙基及環氧丙基兩者之單體性化合物，則無特別限定。多官能性化合物(E)可舉例如：單環氧丙基二烯丙基異氰脲酸酯、二環氧丙基單烯丙基異氰脲酸酯、單環氧丙基二(甲基烯丙基)異氰脲酸酯、二環氧丙基單(甲基烯丙基)異氰脲酸酯、單環氧丙基二烯丙基氰脲酸酯、二環氧丙基單烯丙基氰脲酸酯、單環氧丙基二(甲基烯丙基)氰脲酸酯、二環氧丙基單(甲基烯丙基)氰脲酸酯、烯丙基環氧丙基胺、二烯丙基單環氧丙基胺、單烯丙基二環氧丙基胺、單環氧丙基二(甲基烯丙基)胺、二環氧丙基單(甲基烯丙基)胺、氯菌酸環氧丙酯烯丙酯、己二酸烯丙酯環氧丙酯、碳酸烯丙酯環氧丙酯、氯化烯丙基環氧丙基二甲基銨、富馬酸烯丙酯環氧丙酯、間酞酸烯丙酯環氧丙酯、丙二酸烯丙酯環氧丙酯、草酸烯丙酯環氧丙酯、酞酸烯丙酯環氧丙酯、烯丙基環氧丙基丙基異氰脲酸酯、癸二酸烯丙酯環氧丙酯、琥珀酸烯丙酯環氧丙酯、對酞酸烯丙酯環氧丙酯、酒石酸烯丙酯環氧丙酯、酞酸環氧丙酯甲基烯丙酯等。The polyfunctional compound (E) having an allyl group and a glycidyl group which is reacted with the above primary amine compound (D), as long as it is a monomeric compound having both an allyl group and a glycidyl group, Specially limited. The polyfunctional compound (E) may, for example, be monopropylene propylene diallyl isocyanurate, diepoxypropyl monoallyl isocyanurate or monoepoxypropyl di(methyl). Allyl)isocyanurate, diepoxypropyl mono(methylallyl)isocyanurate, monoepoxypropyldiallyl cyanurate, diglycidyl monoene Propyl cyanurate, monoepoxypropyl bis(methylallyl) cyanurate, diepoxypropyl mono(methylallyl) cyanurate, allyloxypropyl Amine, diallyl monoepoxypropylamine, monoallyl digoxypropylamine, monoepoxypropyl bis(methylallyl)amine, diepoxypropyl mono(methylallyl Amine, propyl propyl acrylate, allyl acrylate, propyl acrylate, allyl carbonate, propyl propyl acetate, allyl propylene dimethyl dimethyl ammonium chloride, rich Allyl methacrylate, propyl propyl acrylate, propyl propyl acrylate, propylene propyl acrylate, propyl propyl oxalate, allyl decyl epoxide Allyl-glycidylpropyl isocyanurate, allyl sebacate, propyl acrylate, allyl succinate, glycidyl ester Allyl terephthalic acid diglycidyl ester, glycidyl methacrylate, allyl tartrate, phthalate, glycidyl methacrylate and allyl methyl.

此等化合物中，多官能性化合物(E)係以在骨架中具有異氰脲酸酯之化合物為佳，特別是以單環氧丙基二烯丙基異氰脲酸酯為佳。Among these compounds, the polyfunctional compound (E) is preferably a compound having an isocyanurate in the skeleton, and particularly preferably a monoepoxypropyl diallyl isocyanurate.

經由將上述之一級胺化合物(D)與具有烯丙基及環氧丙基之多官能性化合物(E)混合並加熱，而藉由熱使胺與環氧丙基進行加成反應，即可得到在1分子中具有多個烯丙基之化合物。進行反應時之一級胺化合物(D)與多官能性化合物(E)之調配比，只要相對於一級胺化合物(D)1當量，使環氧丙基成為1至2當量即可。由於當一級胺化合物(D)為脂肪族系時，胺之親核性強，故可相對於1個胺使2個環氧丙基進行加成反應。換言之，例如相對於脂肪族二胺1莫耳，使環氧丙基以4莫耳量進行反應。當一級胺化合物(D)為芳香族系時，胺之親核性較弱，而有時無法使2個環氧丙基進行加成反應。換言之，例如相對於芳香族二胺1莫耳，使環氧丙基以大約2莫耳量進行反應。By mixing and heating the above-mentioned one-stage amine compound (D) with a polyfunctional compound (E) having an allyl group and a glycidyl group, an amine and a glycidyl group are subjected to an addition reaction by heat. A compound having a plurality of allyl groups in one molecule is obtained. The compounding ratio of the monovalent amine compound (D) to the polyfunctional compound (E) at the time of the reaction may be 1 to 2 equivalents based on 1 equivalent of the primary amine compound (D). When the primary amine compound (D) is an aliphatic system, the amine has a strong nucleophilicity, so that two epoxypropyl groups can be subjected to an addition reaction with respect to one amine. In other words, for example, the epoxy propyl group is reacted in an amount of 4 moles relative to the aliphatic diamine 1 mole. When the primary amine compound (D) is an aromatic system, the amine has a weak nucleophilicity, and sometimes it is impossible to carry out an addition reaction of two epoxypropyl groups. In other words, for example, the epoxy propyl group is reacted in an amount of about 2 moles relative to the aromatic diamine 1 mole.

使一級胺化合物(D)與多官能性化合物(E)反應之方法係並無特別限定，例如：可如上述經由將一級胺化合物(D)與多官能性化合物(E)以預定量混合並使其加熱熔融，而簡便地進行上述反應。此時，也可依需要而使用適當的反應溶劑。用以進行反應之加熱溫度，通常只要設定在80至200℃之範圍即可。進行反應時之氣體環境係無特別限定，只要在大氣中進行反應即可。惟，當因氧氣所致之氧化會造成問題時，只要以氮氣等惰性氣體來將氣體環境置換即可。The method of reacting the primary amine compound (D) with the polyfunctional compound (E) is not particularly limited, and for example, the primary amine compound (D) and the polyfunctional compound (E) may be mixed in a predetermined amount as described above. The above reaction is simply carried out by heating and melting. At this time, an appropriate reaction solvent can also be used as needed. The heating temperature for carrying out the reaction is usually set to be in the range of 80 to 200 °C. The gas atmosphere at the time of the reaction is not particularly limited, and it is only required to carry out the reaction in the atmosphere. However, when the oxidation due to oxygen causes a problem, the gas atmosphere may be replaced by an inert gas such as nitrogen.

如此所得之反應生成物由於沸點高，故在進行熔融加工時不容易揮發，而可有效做為交聯助劑、末端封閉劑等使用。此外，因在1分子中具有多個烯丙基，所以可以習知方法使烯丙基與樹脂進行交聯，而可有效率地將樹脂強化。Since the reaction product thus obtained has a high boiling point, it is not easily volatilized during melt processing, and can be effectively used as a crosslinking assistant or a terminal blocking agent. Further, since a plurality of allyl groups are contained in one molecule, the allyl group and the resin can be crosslinked by a conventional method, and the resin can be efficiently strengthened.

在本發明之樹脂組成物中，相對於熱塑性樹脂(A)與填充材(B)之合計100質量份，多官能性烯丙基化合物(C1)之添加量必須為3至20質量份，且以4至15質量份為佳。當添加量未達3質量份時，有時無法得到充分的熔融流動性。相反地，當超過20質量份時，熔融黏度過度降低，而在熔融混練時有無法顆粒化之情形、或有所得之成形體之物性大幅降低之情形。In the resin composition of the present invention, the polyfunctional allylic compound (C1) must be added in an amount of 3 to 20 parts by mass based on 100 parts by mass of the total of the thermoplastic resin (A) and the filler (B), and It is preferably 4 to 15 parts by mass. When the amount added is less than 3 parts by mass, sufficient melt fluidity may not be obtained. On the other hand, when it exceeds 20 parts by mass, the melt viscosity is excessively lowered, and in the case of melt kneading, there is a case where granulation cannot be performed, or the physical properties of the obtained molded body are largely lowered.

多官能性烯丙基化合物(C1)因在1分子中具有多個烯丙基，所以可依照習知方法，經由與交聯劑併用、或與電子束或γ射線等之放射線照射處理併用，而使熱塑性樹脂(A)進行交聯。其中，從可在成形為所需之形狀後在短時間內進行處理之觀點來看，以藉由電子束或γ射線進行交聯為佳。由於γ射線係穿透性較電子束更強而可均勻照射，故以使用γ射線進行交聯較佳。電子束照射可使用習知之電子加速器等，γ射線照射可使用習知之藉由鈷60輻射源等發出γ射線之照射裝置。電子束之照射量以1至300kGy為佳、以50至100kGy較佳。當進行γ射線照射時，照射量以10至100kGy為佳、以20至40kGy較佳。由於若放射線之照射量超過上述上限值，則會因樹脂分解而強度降低，故不佳。此外，由於若未達上述下限值，則無法發揮交聯所產生之效果，故不佳。照射環境係通常在空氣存在下即可，可依所需而在氮氣環境下或真空中進行照射。Since the polyfunctional allyl compound (C1) has a plurality of allyl groups in one molecule, it can be used in combination with a crosslinking agent or a radiation treatment such as an electron beam or a gamma ray according to a conventional method. The thermoplastic resin (A) is crosslinked. Among them, it is preferred to carry out crosslinking by electron beam or gamma ray from the viewpoint of being processed in a short time after being formed into a desired shape. Since the γ-ray system is more transparent than the electron beam and can be uniformly irradiated, it is preferable to carry out crosslinking by using γ-rays. As the electron beam irradiation, a conventional electron accelerator or the like can be used. For the gamma ray irradiation, a conventional gamma ray irradiation device by a cobalt 60 radiation source or the like can be used. The irradiation amount of the electron beam is preferably from 1 to 300 kGy, more preferably from 50 to 100 kGy. When gamma ray irradiation is performed, the irradiation amount is preferably 10 to 100 kGy, and more preferably 20 to 40 kGy. When the amount of irradiation of the radiation exceeds the above upper limit value, the strength of the resin is decomposed and the strength is lowered, which is not preferable. Further, if the lower limit value is not reached, the effect of cross-linking cannot be exhibited, which is not preferable. The irradiation environment is usually in the presence of air, and can be irradiated under a nitrogen atmosphere or in a vacuum as needed.

說明二聚酸系熱塑性樹脂(C2)。在本發明中，所謂二聚酸系熱塑性樹脂(C2)，係指以包含做為大豆油、桐油、松油等脂肪酸之二聚物之二聚酸、或是可生成其醯胺之衍生物、或可生成其酯之衍生物的二羧酸做為主要酸成分，並且將該酸成分與二胺、二醇等成分進行聚縮合而得之熱塑性樹脂。二聚酸之主成分係二聚物，但除此之外也可含有單體或三聚物等。此外，包含做為脂肪酸之二聚物之二聚酸、或是可生成其醯胺之衍生物、或可生成其酯之衍生物的二羧酸，也可為經氫化者。The dimer acid-based thermoplastic resin (C2) will be described. In the present invention, the dimer acid-based thermoplastic resin (C2) means a dimer acid containing a dimer of a fatty acid such as soybean oil, tung oil or pine oil, or a derivative capable of producing a guanamine thereof. Or a dicarboxylic acid which can form a derivative of the ester as a main acid component, and a thermoplastic resin obtained by polycondensing the acid component with a component such as a diamine or a diol. The main component of the dimer acid is a dimer, but may contain a monomer or a trimer or the like. Further, the dicarboxylic acid which is a dimer of a fatty acid, or a derivative which can form a guanamine thereof, or a derivative which can form an ester thereof, may also be a hydrogenated product.

二聚酸系熱塑性樹脂(C2)係熔融黏度較熱塑性樹脂(A)更低，添加該熱塑性樹脂即可降低樹脂之熔融黏度，因此可有效地發揮做為可塑劑之作用。而且，二聚酸系熱塑性樹脂(C2)係一種樹脂，並且分解溫度高，且在進行熔融加工時不會揮發，故有效地發揮做為可塑劑之作用。並且，在即使添加該熱塑性樹脂，機械強度之降低也少，並且不會滲出之觀點上為有效。The dimer acid-based thermoplastic resin (C2) has a lower melt viscosity than the thermoplastic resin (A), and the addition of the thermoplastic resin lowers the melt viscosity of the resin, so that it can effectively function as a plasticizer. Further, the dimer acid-based thermoplastic resin (C2) is a resin and has a high decomposition temperature and does not volatilize during melt processing, so that it functions effectively as a plasticizer. Further, even if the thermoplastic resin is added, the decrease in mechanical strength is small and it is effective from the viewpoint of not oozing out.

二聚酸系熱塑性樹脂(C2)係無特別限定，可舉例如：聚醯胺、聚酯等。其中，在處理性、經濟性之觀點上，以聚醯胺為佳。The dimer acid-based thermoplastic resin (C2) is not particularly limited, and examples thereof include polyamine and polyester. Among them, polyamine is preferred from the viewpoint of handling property and economy.

二聚酸系聚醯胺係並無特別限定，可舉例如：由包含二聚酸或是可生成其醯胺的衍生物之二羧酸成分與二胺所構成之聚醯胺樹脂等。可舉例如：做為大豆油、桐油、松油等脂肪酸之二聚物之二聚酸與例如如乙二胺、二伸乙三胺等烷基多胺類等的反應生成物。The dimer acid-based polyamine is not particularly limited, and examples thereof include a polyamine resin composed of a dicarboxylic acid component or a diamine containing a derivative of a dimer acid or a guanamine. For example, a reaction product of a dimer of a dimer of a fatty acid such as soybean oil, tung oil or pine oil with an alkyl polyamine such as ethylenediamine or diethylenetriamine may be mentioned.

二聚酸系聚酯係並無特別限定，可舉例如：由包含二聚酸或是可生成其酯的衍生物之二羧酸成分與二醇所構成之聚酯樹脂等。可舉例如：做為大豆油、桐油、松油等脂肪酸之二聚物之二聚酸與例如如乙二醇或1,4-丁二醇等二醇成分與對酞酸、間酞酸等的反應生成物。The dimer acid-based polyester is not particularly limited, and examples thereof include a polyester resin composed of a dicarboxylic acid component or a diol containing a derivative of a dimer acid or a derivative thereof. For example, a dimer acid which is a dimer of a fatty acid such as soybean oil, tung oil or pine oil, and a diol component such as ethylene glycol or 1,4-butanediol, and p-citric acid, meta-citric acid, etc. Reaction product.

二聚酸系聚醯胺與二聚酸系聚酯可分別個別使用，也可將兩者混合使用。The dimer acid polyamine and the dimer acid polyester may be used singly or in combination.

在本發明之樹脂組成物中，相對於熱塑性樹脂(A)與填充材(B)之合計100體積份，二聚酸系熱塑性樹脂(C2)之添加量必須為10至45體積份，且以10至25體積份為佳。若二聚酸系熱塑性樹脂(C2)之調配量未達10體積份，則有時無法得到充分的調配二聚酸系熱塑性樹脂(C2)之效果。相反地，若調配量超過45體積份，則有時機械物性顯著降低、或在熔融混練時無法顆粒化。In the resin composition of the present invention, the dimer acid-based thermoplastic resin (C2) must be added in an amount of 10 to 45 parts by volume based on 100 parts by total of the total of the thermoplastic resin (A) and the filler (B), and 10 to 25 parts by volume is preferred. When the amount of the dimer acid-based thermoplastic resin (C2) is less than 10 parts by volume, the effect of sufficiently blending the dimer acid-based thermoplastic resin (C2) may not be obtained. On the other hand, when the blending amount exceeds 45 parts by volume, the mechanical properties may be remarkably lowered or may not be granulated during melt kneading.

在本發明之樹脂組成物中，在不會大幅損害其特性之範圍內，可添加顏料、熱安定劑、抗氧化劑、耐候劑、阻燃劑、潤滑劑、離型劑、抗靜電劑、晶核劑、相溶化劑等。熱安定劑和抗氧化劑可舉例如：受阻酚(hindered phenol)類、磷化合物、受阻胺、硫化合物、銅化合物、鹼金屬之鹵化物等。阻燃劑可舉例如：水合金屬化合物(氫氧化鋁、氫氧化鎂等)、含氮化合物(三聚氰胺系、胍(guanidine)系)、磷系阻燃劑、鹵素系阻燃劑、無機系阻燃劑等。晶核劑可舉例如：山梨糖醇酐化合物、苯甲酸及該化合物之金屬鹽、磷酸酯金屬鹽、松香化合物等。相溶化劑可舉例如：離子聚合物系相溶化劑、唑啉系相溶化劑、彈性體系相溶化劑、反應性相溶化劑、共聚物系相溶化劑等。此等添加劑可使用1種、或併用2種以上。在本發明之樹脂組成物中混合此等之方法係無特別限定。In the resin composition of the present invention, a pigment, a heat stabilizer, an antioxidant, a weathering agent, a flame retardant, a lubricant, a release agent, an antistatic agent, and a crystal may be added within a range that does not greatly impair the properties thereof. Nucleating agents, compatibilizing agents, and the like. Examples of the heat stabilizer and the antioxidant include hindered phenols, phosphorus compounds, hindered amines, sulfur compounds, copper compounds, and halides of alkali metals. Examples of the flame retardant include a hydrated metal compound (such as aluminum hydroxide or magnesium hydroxide), a nitrogen-containing compound (melamine-based or guanidine), a phosphorus-based flame retardant, a halogen-based flame retardant, and an inorganic hindrance. Burning agent, etc. The crystal nucleating agent may, for example, be a sorbitan compound, benzoic acid, a metal salt of the compound, a phosphate metal salt or a rosin compound. The compatibilizing agent may, for example, be an ionic polymer-based solvent, An oxazoline-based phase melting agent, an elastomeric phase melting agent, a reactive phase melting agent, a copolymer-based phase melting agent, and the like. These additives may be used alone or in combination of two or more. The method of mixing these in the resin composition of the present invention is not particularly limited.

本發明之樹脂組成物可經由使用一般的擠壓機，例如單軸擠壓機、雙軸擠壓機、輥混練機、布氏塑譜儀(Brabender)等，將熱塑性樹脂(A)、填充材(B)、及多官能性烯丙基化合物(C1)或二聚酸系熱塑性樹脂(C2)、以及依需要而添加之各種添加物予以熔融混練來製造。此時，併用靜態混合機或動態混合機也為有效。為了使混練狀態良好，以使用雙軸擠壓機為佳。填充材(B)、與多官能性烯丙基化合物(C1)或二聚酸系熱塑性樹脂(C2)係並無特別限定，可在擠壓機中從進料斗或使用側面進料機(side feeder)來添加。The resin composition of the present invention can be filled with a thermoplastic resin (A) by using a general extruder such as a uniaxial extruder, a twin-screw extruder, a roll kneader, a Brookfield spectrometer or the like. The material (B), the polyfunctional allylic compound (C1), the dimer acid-based thermoplastic resin (C2), and various additives added as needed are melt-kneaded and produced. At this time, it is also effective to use a static mixer or a dynamic mixer. In order to make the kneading state good, it is preferable to use a twin-screw extruder. The filler (B), the polyfunctional allylate compound (C1) or the dimer acid-based thermoplastic resin (C2) are not particularly limited, and can be used in an extruder from a feed hopper or a side feeder (side) Feeder) to add.

本發明之樹脂組成物可使用射出成形、壓縮成形、擠壓成形、轉移成形、薄片成形等習知之熔融成形手法來成形為所需之形狀，而製作成成形體。在將樹脂組成物成形為所需之形狀後，如上述般照射放射線，即可使樹脂進行交聯。The resin composition of the present invention can be formed into a molded body by molding into a desired shape by a conventional melt forming method such as injection molding, compression molding, extrusion molding, transfer molding, or sheet molding. After the resin composition is formed into a desired shape, the resin is crosslinked by irradiating the radiation as described above.

在本發明中，將調配具有10W/(m‧K)以上之導熱率之導熱性填充材(B1)而成之樹脂組成物成形而得之成形體之具體例可舉例如：用於半導體元件或電阻等之密封材料、連接器、插座、繼電器零件、線圈架(coil bobbin)、光學讀取頭、振盪器、電腦相關零件等電/電子零件；VTR(錄影機)、電視、熨斗、空調、立體音響、吸塵器、冰箱、電鍋、照明器具等家庭電器製品零件；散熱片、散熱器(heat sink)、風扇等用以將電子零件所產生之熱散逸至外部之散熱構件；燈座、反射燈、燈罩等照明器具零件；光碟(compact disc)、雷射磁碟(laser disc)、揚聲器(speaker)等音響製品零件；光學電纜用套圈、行動電話、固定電話、傳真機、數據機等通訊機器零件；分離鉤、加熱器支架(heater holder)等影印機、印刷機相關零件；葉輪(impeller)、風扇齒輪、齒輪、軸承、馬達零件及外殼等機械零件；汽車用機構零件、引擎零件、機艙內零件、電子零件、內部零件等汽車零件；微波調理用鍋、耐熱餐具等調理用器具；飛機、太空梭、太空機器用零件；感測器類零件等。In the present invention, a specific example of a molded article obtained by molding a resin composition obtained by disposing a thermally conductive filler (B1) having a thermal conductivity of 10 W/(m‧K) or more can be used, for example, for a semiconductor device. Or electric resistance/electronic parts such as resistors, connectors, sockets, relay parts, coil bobbins, optical pickups, oscillators, computer-related parts, etc.; VTR (Video Recorder), TV, iron, air conditioner Household appliances such as stereos, vacuum cleaners, refrigerators, electric cookers, lighting fixtures, heat sinks, heat sinks, fans, etc., which dissipate heat generated by electronic components to external heat-dissipating components; Lighting fixtures such as reflector lamps and lampshades; audio components such as compact discs, laser discs, and speakers; optical cable ferrules, mobile phones, landlines, fax machines, and data modems Such as communication equipment parts; separation hooks, heater holders and other photocopiers, printing machine related parts; impeller, fan gear, gears, bearings, motor parts and casings, etc. Automotive parts, engine parts, engine parts, electronic parts, internal parts, and other automotive parts; microwave conditioning pots, heat-resistant tableware and other conditioning equipment; aircraft, space shuttle, space machine parts; sensor parts, etc. .

(實施例)(Example)

以下，依據實施例具體說明本發明。惟，本發明並不受此等實施例所限定。Hereinafter, the present invention will be specifically described based on examples. However, the invention is not limited by the examples.

在以下之實施例及比較例中，各種物性值之測試方法係如下述。In the following examples and comparative examples, the test methods for various physical property values are as follows.

[1]MFR(Melt Flow Rate，熔融流動率)：[1]MFR (Melt Flow Rate):

對熱塑性樹脂組成物之顆粒，使用下降式流動測試機(東洋精機製作所公司製)，測定在預定載重、預定溫度之MFR值。此時之孔口(orifice)係使用直徑1mm×長度10mm者。The particles of the thermoplastic resin composition were measured for MFR at a predetermined load and a predetermined temperature using a descending flow tester (manufactured by Toyo Seiki Seisakusho Co., Ltd.). At this time, the orifice is used in a diameter of 1 mm × a length of 10 mm.

[2]彎曲強度、彎曲彈性率：[2] Bending strength, bending modulus:

依據ASTM規格D－790中所記載之方法進行測定。The measurement was carried out in accordance with the method described in ASTM specification D-790.

[3]衝擊強度：[3] Impact strength:

依據ASTM規格D－256中所記載之方法，使用附缺口(notch)之試驗片測定艾氏衝擊強度(Izod impact strength)。Izod impact strength was measured using a notched test piece according to the method described in ASTM specification D-256.

[4]導熱率：[4] Thermal conductivity:

導熱率λ係藉由下述方法求出熱擴散率α、密度ρ、比熱Cp後，以下式算出其乘積。The thermal conductivity λ is obtained by the following method, and the product of the thermal diffusivity α, the density ρ, and the specific heat Cp is calculated by the following equation.

λ=αρCpλ=αρCp

λ：導熱率(W/(m‧K))λ: thermal conductivity (W/(m‧K))

α：熱擴散率(m2 /sec)α: thermal diffusivity (m 2 /sec)

ρ：密度(g/m3 )ρ: density (g/m 3 )

Cp：比熱(J/g‧K)Cp: specific heat (J/g‧K)

熱擴散率α係對於[2]中所製得之彎曲試驗片之樹脂流動方向，使用雷射閃光法熱常數測定裝置TC－7000(ULVAC理工公司製)，以雷射閃光法進行測定。密度ρ係使用電子比重計ED－120T(MIRAGE貿易公司製)進行測定。比熱Cp係使用示差掃描熱量計DSC－7(PerkinElmer公司製)，在升溫速度10℃/分鐘之條件下進行測定。The thermal diffusivity α was measured by a laser flash method using a laser flash thermal constant measuring device TC-7000 (manufactured by ULVAC Corporation) for the resin flow direction of the bending test piece obtained in [2]. The density ρ was measured using an electronic hydrometer ED-120T (manufactured by MIRAGE Trading Co., Ltd.). The specific heat Cp was measured using a differential scanning calorimeter DSC-7 (manufactured by PerkinElmer Co., Ltd.) under the conditions of a temperature increase rate of 10 ° C /min.

[5]成形性：[5] Formability:

將供試樹脂組成物充分乾燥後，使用射出成形機(東芝機械公司製：EC－100型)，射出成形為寬度13mm、長度130mm、厚度0.8mm之條狀樣品。對所得之成形片之狀態，以下述所示之基準進行3階段之評估。After the test resin composition was sufficiently dried, an injection molding machine (manufactured by Toshiba Machine Co., Ltd.: EC-100 type) was used, and a strip sample having a width of 13 mm, a length of 130 mm, and a thickness of 0.8 mm was injection molded. The state of the obtained formed piece was evaluated in three stages on the basis of the following criteria.

良好：外觀上無問題，且已成形為預定大小。Good: no problem in appearance and has been shaped to a predetermined size.

稍差：雖已成形為預定大小，但成形片表面之平滑性不良。Slightly poor: Although it has been formed into a predetermined size, the smoothness of the surface of the formed sheet is poor.

不良：流動性不良，且無法成形為預定大小。Poor: Poor fluidity and cannot be formed into a predetermined size.

實施例與比較例中所使用之原料係如下述所示。The raw materials used in the examples and comparative examples are as follows.

(1)熱塑性樹脂(A)(1) Thermoplastic resin (A)

● PA6A：由無規聚合所得之聚醯胺6(相對黏度2.6，密度1.13g/cm3 )● PA6A: Polyamide 6 obtained by random polymerization (relative viscosity 2.6, density 1.13g/cm 3 )

● PA6B：由無規聚合所得之聚醯胺6(相對黏度1.9，密度1.13g/cm3 )● PA6B: Polyamide 6 obtained by random polymerization (relative viscosity 1.9, density 1.13 g/cm 3 )

● PA66：由己二胺與己二酸進行聚合所得之聚醯胺66(相對黏度2.8，密度1.14g/cm3 )● PA66: Polyamide 66 obtained by polymerization of hexamethylenediamine and adipic acid (relative viscosity 2.8, density 1.14g/cm 3 )

● LCP：液晶聚酯(由尼帝佳公司製　RODRUN LC－5000，密度1.41g/cm3 )● LCP: Liquid crystal polyester (RODRUN LC-5000 made by Nedica, density 1.41g/cm 3 )

● PA12：聚醯胺12(阿爾公司(社)製　Rilsan AMN，相對黏度2.3，密度1.01g/cm)● PA12: Polyamide 12 (Al company ( Rilsan AMN, relative viscosity 2.3, density 1.01g/cm)

● PP：聚丙烯(日本波麗普羅公司(日本社)製　MA1B，密度0.9g/cm)● PP: Polypropylene (Japan Polypo (Japan) Company MA1B, density 0.9g/cm)

● PLA：聚乳酸(NatureWorks公司製，重量平均分子量(MW)=190,000，密度1.25g/cm)● PLA: Polylactic acid (manufactured by NatureWorks, weight average molecular weight (MW) = 190,000, density 1.25 g/cm)

(2)填充材(B)(2) filler (B)

● GrA：鱗片狀石墨(日本石墨工業公司製，平均粒徑40μm，導熱率100W/(m‧K)，密度2.25g/cm)● GrA: scaly graphite (manufactured by Nippon Graphite Co., Ltd., average particle size 40 μm, thermal conductivity 100 W/(m‧K), density 2.25 g/cm)

● GrB：鱗片狀石墨(日本石墨工業公司製，平均粒徑130μm，導熱率100W/(m‧K)，密度2.25g/cm)● GrB: scaly graphite (manufactured by Nippon Graphite Co., Ltd., average particle size 130 μm, thermal conductivity 100 W/(m‧K), density 2.25 g/cm)

● GrCF：石墨化碳纖維(日本石墨纖維公司製，平均纖維徑9μm，平均纖維長3mm，密度2.2g/cm)● GrCF: Graphitized carbon fiber (manufactured by Japan Graphite Fiber Co., Ltd., average fiber diameter 9 μm, average fiber length 3 mm, density 2.2 g/cm)

● BN：六方晶系鱗片狀氮化硼(電氣化學工業公司製，平均粒徑15μm，密度2.26g/cm)● BN: hexagonal scaly boron nitride (manufactured by Electric Chemical Industry Co., Ltd., average particle size 15 μm, density 2.26 g/cm)

● ALOA：氧化鋁(電氣化學工業公司製，平均粒徑10μm，，導熱率38W/(m‧K)，密度3.97g/cm)● ALOA: Alumina (manufactured by Electric Chemical Industry Co., Ltd., average particle size 10 μm, thermal conductivity 38 W/(m‧K), density 3.97 g/cm)

●ALOB：氧化鋁(電氣化學工業公司製，平均粒徑50μm，導熱率38W/(m．K)，密度3.97g/cm3 )●ALOB: Alumina (manufactured by Electric Chemical Industry Co., Ltd., average particle size 50 μm, thermal conductivity 38 W/(m.K), density 3.97 g/cm 3 )

●TC：滑石(日本滑石公司製K-1，平均粒徑8μm，密度2.7g/cm3 )●TC: talc (K-1 made by Japan Talc Co., Ltd., average particle size 8 μm, density 2.7 g/cm 3 )

●MgO：氧化鎂(神島化學公司製，平均粒徑5μm，導熱率50W/(m．K)，密度3.58g/cm3 )●MgO: Magnesium oxide (manufactured by Shendao Chemical Co., Ltd., average particle size 5 μm, thermal conductivity 50 W/(m.K), density 3.58 g/cm 3 )

●MgCO：碳酸鎂(神島化學公司製，平均粒徑10μm，導熱率15W/(m．K)，密度3.05g/cm3 )●MgCO: magnesium carbonate (manufactured by Shendao Chemical Co., Ltd., average particle size 10 μm, thermal conductivity 15 W/(m.K), density 3.05 g/cm 3 )

●ZnO：氧化鋅(堺化學工業公司製，平均粒徑10μm，導熱率25W/(m．K)，密度5.78g/cm3 )●ZnO: zinc oxide (manufactured by Sigma Chemical Industry Co., Ltd., average particle size 10 μm, thermal conductivity 25 W/(m.K), density 5.78 g/cm 3 )

●AF：共聚(對伸苯基-3,4’-氧二伸苯基對酞醯胺)纖維(帝人TECHNO PRODUCTS公司製，平均纖維徑12μm，平均纖維長3mm，密度1.39g/cm3 )●AF: Copolymer (p-phenylene-3,4'-oxydiphenylene p-nonylamine) fiber (manufactured by Teijin TECHNO PRODUCTS, average fiber diameter 12 μm, average fiber length 3 mm, density 1.39 g/cm 3 )

●GF：玻璃纖維(Owens Corning公司製，平均纖維徑10μm，平均纖維長3mm，密度2.50g/cm3 )● GF: glass fiber (manufactured by Owens Corning Co., Ltd., average fiber diameter 10 μm, average fiber length 3 mm, density 2.50 g/cm 3 )

(3)多官能性烯丙基化合物(C1)(3) Polyfunctional allyl compound (C1)

●TAIC：三烯丙基異氰脲酸酯(日本化成公司製TAIC，液體，沸點150℃)●TAIC: triallyl isocyanurate (TAIC made by Nippon Kasei Co., Ltd., liquid, boiling point 150 ° C)

●DAMGIC：單環氧丙基二烯丙基異氰脲酸酯(四國化成公司製DA-MGIC，固體，融點40℃，由TGA測定所測得之質量減少5%之溫度為178℃)●DAMGIC: monoepoxypropyl diallyl isocyanurate (DA-MGIC manufactured by Shikoku Kasei Co., Ltd., solid, melting point 40 ° C, the temperature measured by TGA is reduced by 5% and the temperature is 178 ° C )

●C11：●C11:

使用1,3-雙(胺基甲基)苯(MXDA)做為一級胺化合物(D)，使用單環氧丙基二烯丙基異氰脲酸酯(DAMGIC)做為多官能性化合物(E)，以相對於1當量MXDA使DAMGIC成為2當量之方式量取後加入圓底燒瓶中，並一面攪拌一面在80℃加熱30分鐘。並且，在180℃加熱30分鐘，而得到無色透明的液狀物。將所得之液狀物緩緩冷卻至室溫後，將此時所生成之固形物粉碎，而得到多官能性烯丙基化合物(C11)之白色粉末。Use 1,3-bis(aminomethyl)benzene (MXDA) as the primary amine compound (D) and monopropylene propylene diallyl isocyanurate (DAMGIC) as the polyfunctional compound ( E), the DAMGIC was measured to be equivalent to 1 equivalent of MXDA, and then added to a round bottom flask, and heated at 80 ° C for 30 minutes while stirring. Further, it was heated at 180 ° C for 30 minutes to obtain a colorless transparent liquid. After the obtained liquid was gradually cooled to room temperature, the solid matter formed at this time was pulverized to obtain a white powder of a polyfunctional allyl compound (C11).

使用TGA裝置(PerkinElmer公司製TGA－7)，在氮氣置換環境中，使5mg之樣品以升溫速度20℃/分鐘之速度從室溫升溫至600℃，測定樣品之質量變化。所得之粉末之由TGA測定所測得之質量減少5%之溫度為375℃。MXDA之由TGA測定所測得之質量減少5%之溫度為52℃。所得之粉末之融點在55至70℃之範圍。Using a TGA apparatus (TGA-7 manufactured by PerkinElmer Co., Ltd.), a sample of 5 mg was heated from room temperature to 600 ° C at a temperature increase rate of 20 ° C/min in a nitrogen-substitution atmosphere, and the mass change of the sample was measured. The temperature of the resulting powder which was reduced by 5% by mass measured by TGA was 375 °C. The temperature at which MXDA was reduced by 5% as measured by TGA measurement was 52 °C. The resulting powder has a melting point in the range of 55 to 70 °C.

● C12：● C12:

以相對於1當量MXDA使DAMGIC成為1當量之方式量取。除此之外，其餘與C11時同樣地進行合成，而得到無色透明的液狀物。將所得之液狀物緩緩冷卻至室溫後，將固化之固形物粉碎，而得到多官能性烯丙基化合物(C12)之白色粉末。The DAMGIC was measured in an amount of 1 equivalent based on 1 equivalent of MXDA. Except for this, the same synthesis as in the case of C11 was carried out to obtain a colorless and transparent liquid. After the obtained liquid was gradually cooled to room temperature, the solidified solid was pulverized to obtain a white powder of a polyfunctional allyl compound (C12).

所得之粉末之由TGA測定所測得之質量減少5%之溫度為335℃。所得之粉末之融點在50至60℃之範圍。The temperature of the resulting powder which was reduced by 5% by mass measured by TGA was 335 °C. The resulting powder has a melting point in the range of 50 to 60 °C.

● C13：● C13:

使用己二胺(HMDA)做為一級胺化合物(D)。除此之外，其餘與C11時同樣地進行合成，而得到無色透明的液狀物。將所得之液狀物緩緩冷卻至室溫後，將此時所生成之固形物粉碎，而得到多官能性烯丙基化合物(C13)之白色粉末。Hexanediamine (HMDA) was used as the primary amine compound (D). Except for this, the same synthesis as in the case of C11 was carried out to obtain a colorless and transparent liquid. After the obtained liquid was gradually cooled to room temperature, the solid matter formed at this time was pulverized to obtain a white powder of a polyfunctional allyl compound (C13).

所得之粉末之由TGA測定所測得之質量減少5%之溫度為356℃。HMDA之由TGA測定所測得之質量減少5%之溫度為76℃。所得之粉末之融點在35至45℃之範圍。The temperature of the obtained powder which was reduced by 5% by mass measured by TGA was 356 °C. The temperature at which 5% of the mass measured by TGA was reduced by HMDA was 76 °C. The resulting powder has a melting point in the range of 35 to 45 °C.

(4)二聚酸系熱塑性樹脂(C2)(4) Dimer acid thermoplastic resin (C2) ●　製造例1(C21)● Manufacturing Example 1 (C21)

將二聚酸(築野食品工業公司製，未氫化)/1,3-雙(胺基甲基)苯=46.5/53.5(莫耳比)之比例之原料饋入反應槽中，並在240℃使其反應2小時。反應結束後取出並切割，而得到二聚酸系聚醯胺樹脂顆粒。所得之顆粒之在230℃、21.18N之熔融流動率(MFR)為1800g/min。Raw material of the ratio of dimer acid (made by Chikuno Food Industry Co., Ltd., unhydrogenated) / 1,3-bis(aminomethyl)benzene = 46.5/53.5 (mole ratio) is fed into the reaction tank, and at 240 The reaction was allowed to proceed for 2 hours at °C. After the completion of the reaction, the mixture was taken out and cut to obtain dimer acid-based polyamide resin particles. The obtained pellet had a melt flow rate (MFR) of 1800 g/min at 230 ° C and 21.18 N.

●　製造例2(C22)● Manufacturing Example 2 (C22)

將二聚酸(築野食品工業公司製，未氫化)/65.3%己二胺水溶液/己內醯胺=10.3/7.3/82.4(莫耳比)之比例之原料饋入反應槽中，並在250℃使其反應2小時。反應結束後取出並切割，而得到二聚酸系聚醯胺樹脂顆粒。所得之顆粒之在230℃、21.18N之熔融流動率(MFR)為1300g/min。Raw material of dimer acid (made by Chikuno Food Industry Co., Ltd., unhydrogenated) / 65.3% aqueous solution of hexamethylenediamine / caprolactam = 10.3/7.3/82.4 (mole ratio) is fed into the reaction tank, and The reaction was allowed to proceed at 250 ° C for 2 hours. After the completion of the reaction, the mixture was taken out and cut to obtain dimer acid-based polyamide resin particles. The obtained pellet had a melt flow rate (MFR) of 1300 g/min at 230 ° C and 21.18 N.

●　製造例3(C23)● Manufacturing Example 3 (C23)

將二聚酸(築野食品工業公司製，未氫化)/對酞酸/1,4-丁二醇=13.2/26.8/60(莫耳比)之比例之原料饋入反應槽中，並在240℃進行酯化反應，接著依慣用方法，添加鈦觸媒並在240℃進行聚縮合反應3小時。反應結束後取出並切割，而得到二聚酸系聚酯樹脂顆粒。所得之顆粒之在200℃、21.18N之熔融流動率(MFR)為800g/min。Raw material of dimer acid (made by Chikuno Food Industry Co., Ltd., unhydrogenated) / citric acid / 1,4-butanediol = 13.2/26.8 / 60 (mole ratio) is fed into the reaction tank, and The esterification reaction was carried out at 240 ° C, followed by a conventional method of adding a titanium catalyst and conducting a polycondensation reaction at 240 ° C for 3 hours. After the completion of the reaction, the mixture was taken out and cut to obtain dimer acid-based polyester resin particles. The obtained pellet had a melt flow rate (MFR) of 200 g/min at 200 ° C and 21.18 N.

(5)可塑劑(5) Plasticizer

● HB：對羥基苯甲酸烷基酯(花王公司製EXCEPARL HD－PB，液體，由TGA測定所測得之質量減少5%之溫度為285℃)● HB: alkyl paraben (EXCEPARL HD-PB manufactured by Kao Corporation, liquid, temperature reduced by 5% by TGA measurement is 285 ° C)

(實施例1)(Example 1)

將聚醯胺6樹脂(PA6A)30質量份、與多官能性烯丙基化合物(C12)5質量份供給至雙軸擠壓機(東芝機械公司製，TEM26SS，螺桿直徑26mm)之主進料斗，並在260℃使其熔融。在中途，從側面進料機供給玻璃纖維(GF)70質量份，並充分進行熔融混練。然後，擠壓成繩股(strand)狀並使其冷卻固化後，切割成顆粒狀，而得到樹脂組成物。30 parts by mass of the polyamide 6 resin (PA6A) and 5 parts by mass of the polyfunctional allylic compound (C12) were supplied to a main hopper of a biaxial extruder (manufactured by Toshiba Machine Co., Ltd., TEM26SS, screw diameter: 26 mm). And melt it at 260 °C. In the middle, 70 parts by mass of glass fiber (GF) was supplied from the side feeder, and the melt kneading was sufficiently performed. Then, it was extruded into a strand shape and allowed to cool and solidify, and then cut into pellets to obtain a resin composition.

將此樹脂組成物充分乾燥後，使用射出成形機(東芝機械公司製，EC－100型)，在汽缸(cylinder)溫度270℃、模具溫度100℃、射出時間20秒、冷卻時間10秒之條件下射出成形為上述之條狀樣品。After the resin composition was sufficiently dried, an injection molding machine (manufactured by Toshiba Machine Co., Ltd., model EC-100) was used, and the cylinder temperature was 270 ° C, the mold temperature was 100 ° C, the injection time was 20 seconds, and the cooling time was 10 seconds. The lower shot is formed into the above strip sample.

其評估結果如表1所示。在進行混練及射出成形操作時，未觀測到有揮發氣體產生。The evaluation results are shown in Table 1. No volatilization gas was observed during the kneading and injection molding operations.

(比較例1)(Comparative Example 1)

相較於實施例1，變更成不添加多官能性烯丙基化合物(C1)。除此之外，其餘與實施例1同樣進行，而得到樹脂組成物，將該樹脂組成物進行射出成形，並進行成形性之評估。其評估結果如表1所示。在進行混練及射出成形操作時，未觀測到有揮發氣體產生。Compared to Example 1, it was changed to not add a polyfunctional allyl compound (C1). Otherwise, the same procedure as in Example 1 was carried out to obtain a resin composition, and the resin composition was subjected to injection molding, and the moldability was evaluated. The evaluation results are shown in Table 1. No volatilization gas was observed during the kneading and injection molding operations.

(實施例2至8、比較例2至7)(Examples 2 to 8 and Comparative Examples 2 to 7)

與實施例1相比，將熱塑性樹脂(A)、填充材(B)、多官能性烯丙基化合物(C1)分別變更為如表1所示之種類與量。除此之外，其餘與實施例1同樣進行，而得到樹脂組成物。並且，將該樹脂組成物進行射出成形，並進行成形性之評估。從中途開始藉由側面進料機供給纖維狀填充劑，並由主進料斗供給除此之外之填充材，從混練機中途使用泵來注入液體之三烯丙基異氰脲酸酯(TAIC)後，實施熔融混練。The thermoplastic resin (A), the filler (B), and the polyfunctional allyl compound (C1) were changed to the types and amounts shown in Table 1 as compared with Example 1. Otherwise, the same procedure as in Example 1 was carried out to obtain a resin composition. Then, the resin composition was subjected to injection molding, and the moldability was evaluated. From the middle of the process, the fibrous filler is supplied by the side feeder, and the other filler is supplied from the main hopper, and the pump is used to inject the liquid triallyl isocyanurate (TAIC) from the middle of the kneading machine. After that, melt kneading is carried out.

整理其評估結果如表1所示。再者，實施例4及6係在進行混練及射出成形操作時產生大量的揮發氣體，導致三烯丙基異氰脲酸酯在所得之成形體之表面滲出。The results of the evaluation are summarized in Table 1. Further, in Examples 4 and 6, a large amount of volatile gas was generated during the kneading and injection molding operations, and the triallyl isocyanurate was oozing out on the surface of the obtained molded body.

由表1明顯得知，在實施例1至8中，由於多官能性烯丙基化合物(C1)發揮做為可塑劑之機能，故成形性良好，相對地，在比較例1至7中，由於未調配可塑劑、或調配量過少，故在相同的成形溫度無法得到良好的成形片。As is apparent from Table 1, in Examples 1 to 8, since the polyfunctional allyl compound (C1) functions as a plasticizer, the formability is good, and in Comparative Examples 1 to 7, Since the plasticizer is not blended or the blending amount is too small, a good formed sheet cannot be obtained at the same molding temperature.

(實施例9)(Example 9)

將聚醯胺6樹脂(PA6B)41質量份、做為導熱性填充材(B1)之鱗片狀石墨(GrA)59質量份、與單環氧丙基二烯丙基異氰脲酸酯(DAMGIC)4質量份供給至與實施例1中所使用者相同的雙軸擠壓機之主進料斗，並在250℃進行熔融混練。然後，擠壓成繩股狀並使其冷卻固化後，切割成顆粒狀，而得到樹脂組成物。41 parts by mass of polyamine 6 resin (PA6B), 59 parts by mass of flaky graphite (GrA) as thermal conductive filler (B1), and monoepoxypropyl diallyl isocyanurate (DAMGIC) 4 parts by mass was supplied to the main hopper of the same twin-screw extruder as the user of Example 1, and melt-kneading was carried out at 250 °C. Then, it was extruded into a strand shape and cooled and solidified, and then cut into pellets to obtain a resin composition.

將所得之樹脂組成物充分乾燥後，在250℃、載重100kg之條件下測定MFR後，結果為100g/10min。After the obtained resin composition was sufficiently dried, MFR was measured at 250 ° C under a load of 100 kg, and it was 100 g/10 min.

接著，使用與實施例1中所使用者相同的射出成形機，在汽缸溫度260℃、模具溫度100℃、射出時間20秒、冷卻時間10秒之條件下，將此樹脂組成物進行射出成形，而得到評估用之成形體。再者，在進行混練及射出成形操作時，未觀測到有揮發氣體產生。Next, using the same injection molding machine as that of the user in Example 1, the resin composition was injection molded under the conditions of a cylinder temperature of 260 ° C, a mold temperature of 100 ° C, an ejection time of 20 seconds, and a cooling time of 10 seconds. The molded body for evaluation is obtained. Further, when the kneading and injection molding operations were performed, no volatilized gas was observed.

其評估結果如表2所示。The evaluation results are shown in Table 2.

(實施例10至27，比較例8至18)(Examples 10 to 27, Comparative Examples 8 to 18)

與實施例9相比，將熱塑性樹脂(A)、導熱性填充材(B1)、多官能性烯丙基化合物(C1)、其他填充材、其他可塑劑分別變更為如表2所示之種類與量。除此之外，其餘與實施例9同樣進行，而得到樹脂組成物。將此樹脂組成 物進行射出成形，並測定各種物性。此時，從中途開始藉由側面進料機供給纖維狀填充劑，由主進料斗供給除此之外之填充材。從混練機中途使用泵來注入液體之三烯丙基異氰脲酸酯(TAIC)後，實施熔融混練。The thermoplastic resin (A), the thermally conductive filler (B1), the polyfunctional allyl compound (C1), other fillers, and other plasticizers were changed to the types shown in Table 2, respectively, as compared with Example 9. With quantity. Otherwise, the same procedure as in Example 9 was carried out to obtain a resin composition. Composition of this resin The material was injection molded and various physical properties were measured. At this time, the fibrous filler is supplied from the side feeder from the middle, and the other filler is supplied from the main hopper. Melt kneading was carried out by injecting a liquid triallyl isocyanurate (TAIC) from a pump in the middle of the kneading machine.

實施例16及21係在進行混練及射出成形操作時產生大量的揮發氣體。實施例16係三烯丙基異氰脲酸酯在所得之成形體之表面滲出。Examples 16 and 21 produced a large amount of volatile gas during the kneading and injection molding operations. Example 16 is a triallyl isocyanurate exudation on the surface of the obtained shaped body.

對實施例10、12、14、16、17、19、比較例8、11、14中所得之成形體照射以鈷60做為輻射源之γ射線30kGy後，進行強度測定，並比較照射γ射線前後之物性。The molded bodies obtained in Examples 10, 12, 14, 16, 17, 19, and Comparative Examples 8, 11, and 14 were irradiated with γ ray of 30 kGy using cobalt 60 as a radiation source, and then the intensity was measured, and the gamma ray was compared. Physical properties before and after.

綜合實施例9至27、比較例8至18之評估結果示於表2。The evaluation results of Synthesis Examples 9 to 27 and Comparative Examples 8 to 18 are shown in Table 2.

[表2][Table 2]

實施例9至27由於多官能性烯丙基化合物(C1)發揮做為可塑劑之機能，故MFR值大而成形性優良。相對地，比較例8至13及比較例15至17由於未調配做為可塑劑之多官能性烯丙基化合物(C1)或調配量過少，故相較於多官能性烯丙基化合物(C1)之調配量為適當量且其他條件相同的各實施例，MFR值較小，而成形性較差。In Examples 9 to 27, since the polyfunctional allyl compound (C1) functions as a plasticizer, the MFR value is large and the formability is excellent. In contrast, Comparative Examples 8 to 13 and Comparative Examples 15 to 17 were compared with the polyfunctional allyl compound (C1) because the polyfunctional allylic compound (C1) was not formulated as a plasticizer or the amount of the compound was too small. In each of the examples in which the amount of the compound is an appropriate amount and the other conditions are the same, the MFR value is small and the formability is poor.

特別是，實施例21至26及比較例15至17皆為調配有大量的填充材(B)者，但實施例21至26係因調配預定量之多官能性烯丙基化合物(C1)，而可較比較例15至17更使成形溫度降低。比較例14係調配市售之可塑劑者，因而雖然MFR值高而成形性優良，但成形體之機械性能較實施例者更差。比較例18由於多官能性烯丙基化合物(C1)之調配量過多，故熔融黏度過低，在進行熔融混練時無法擠壓成繩股狀並使其冷卻固化，而無法製作射出成形用之顆粒。In particular, Examples 21 to 26 and Comparative Examples 15 to 17 were all formulated with a large amount of filler (B), but Examples 21 to 26 were formulated with a predetermined amount of polyfunctional allylic compound (C1), Further, the forming temperature was lowered as compared with Comparative Examples 15 to 17. In Comparative Example 14, since a commercially available plasticizer was blended, although the MFR value was high and the moldability was excellent, the mechanical properties of the molded body were worse than those of the examples. In Comparative Example 18, since the amount of the polyfunctional allylic compound (C1) was too large, the melt viscosity was too low, and when it was melt-kneaded, it could not be extruded into a strand shape, and it was cooled and solidified, and it was impossible to produce an injection molding. Particles.

實施例10、12、14、16、17、19由於調配有多官能性烯丙基化合物(C1)，故聚醯胺樹脂會藉由照射γ射線而進行交聯，使彎曲強度提高。另一方面，比較例8、11、14由於未調配多官能性烯丙基化合物，故未觀察到因照射γ射線所造成之強度提高。In Examples 10, 12, 14, 16, 17, and 19, since the polyfunctional allyl compound (C1) was blended, the polyamide resin was crosslinked by irradiation with γ rays to improve the bending strength. On the other hand, in Comparative Examples 8, 11, and 14, since the polyfunctional allylic compound was not formulated, no increase in strength due to irradiation with γ-rays was observed.

(實施例28)(Embodiment 28)

將聚醯胺6樹脂(PA6A)35體積%、與二聚酸系熱塑性樹脂(C21)15體積%供給至與實施例1中所使用者相同的雙軸擠壓機之主進料斗，並在260℃使其熔融。在中途，從側面進料機供給玻璃纖維(GF)50體積%，並充分進行熔融混練後，將熔融混練物擠壓成繩股狀並使其冷卻固化。然後，切割成顆粒狀，而得到樹脂組成物。35 wt% of polyamine 6 resin (PA6A) and 15% by volume of dimer acid-based thermoplastic resin (C21) were supplied to the main hopper of the same biaxial extruder as the user of Example 1, and It was melted at 260 °C. In the middle, 50% by volume of glass fiber (GF) was supplied from the side feeder, and after sufficient melt-kneading, the melt-kneaded product was extruded into a strand shape and cooled and solidified. Then, it was cut into pellets to obtain a resin composition.

將所得之樹脂組成物充分乾燥後，使用與實施例1中所使用者相同的射出成形機，在與實施例1相同的條件下，射出成形為上述之條狀樣品。After the obtained resin composition was sufficiently dried, it was injection-molded into the above-described strip sample under the same conditions as in Example 1 using the same injection molding machine as that of the user of Example 1.

其評估結果如表3所示。在進行混練及射出成形操作時，未觀測到有揮發氣體產生。The evaluation results are shown in Table 3. No volatilization gas was observed during the kneading and injection molding operations.

(比較例19)(Comparative Example 19)

與實施例28相比，未添加二聚酸系熱塑性樹脂(C2)。除此之外，其餘與實施例28同樣進行，而得到樹脂組成物。將所得之樹脂組成物進行射出成形，並進行成形性之評估。其評估結果如表3所示。在進行混練及射出成形操作時，未觀測到有揮發氣體產生。No dimer acid-based thermoplastic resin (C2) was added as compared with Example 28. Otherwise, the same procedure as in Example 28 was carried out to obtain a resin composition. The obtained resin composition was subjected to injection molding, and the formability was evaluated. The evaluation results are shown in Table 3. No volatilization gas was observed during the kneading and injection molding operations.

(實施例29至37，比較例20至26)(Examples 29 to 37, Comparative Examples 20 to 26)

與實施例28相比，將熱塑性樹脂(A)、填充材(B)、二聚酸系熱塑性樹脂(C2)分別變更為如表3所示之種類與量。除此之外，其餘與實施例28同樣進行，而得到樹脂組成物。此時，從中途開始藉由側面進料機供給纖維狀填充劑，並由主進料斗供給除此之外之填充材後，實施熔融混練。將所得之樹脂組成物進行射出成形，並進行成形性之評估。整理其評估結果如表3。The thermoplastic resin (A), the filler (B), and the dimer acid-based thermoplastic resin (C2) were changed to the types and amounts shown in Table 3, respectively, as compared with Example 28. Otherwise, the same procedure as in Example 28 was carried out to obtain a resin composition. At this time, the fibrous filler is supplied from the side feeder from the middle, and the other filler is supplied from the main hopper, and then melt-kneading is performed. The obtained resin composition was subjected to injection molding, and the formability was evaluated. The results of the evaluation are summarized in Table 3.

由表3可得知，在實施例28至37由於調配有二聚酸系熱塑性樹脂(C2)，故成形性良好。相對地，比較例19至26由於未調配二聚酸系熱塑性樹脂(C2)、或調配量過少，故在與實施例28至37相同的成形條件下，成形片表面之平滑性差、或無法得到預定大小之成形片。As is clear from Table 3, in Examples 28 to 37, since the dimer acid-based thermoplastic resin (C2) was blended, the moldability was good. On the other hand, in Comparative Examples 19 to 26, since the dimer acid-based thermoplastic resin (C2) was not blended or the blending amount was too small, the smoothness of the surface of the formed sheet was poor or could not be obtained under the same molding conditions as in Examples 28 to 37. A shaped piece of a predetermined size.

(實施例38)(Example 38)

將聚醯胺6樹脂(PA6A)50體積%、做為導熱性填充材(B1)之鱗片狀石墨(GrA)40體積%、與二聚酸系熱塑性樹脂(C21)10體積%供給至與實施例1中所使用者相同的雙軸擠壓機之主進料斗，並在260℃進行熔融混練。然後，將熔融混練物擠壓成繩股狀並使其冷卻固化後，切割成顆粒狀，而得到樹脂組成物。50% by volume of polyamine 6 resin (PA6A), 40% by volume of flaky graphite (GrA) as thermal conductive filler (B1), and 10% by volume of dimer acid-based thermoplastic resin (C21) were supplied and implemented. The main feed hopper of the same twin-screw extruder as in Example 1 was melt-kneaded at 260 °C. Then, the melt kneaded product was extruded into a strand shape, cooled and solidified, and then cut into pellets to obtain a resin composition.

將所得之樹脂組成物充分乾燥後，在270℃、載重100kg之條件下測定MFR後，結果為158g/10min。After the obtained resin composition was sufficiently dried, MFR was measured at 270 ° C under a load of 100 kg, and the result was 158 g/10 min.

使用與實施例1中所使用者相同的射出成形機，以汽缸溫度270℃、模具溫度80℃、射出時間20秒、冷卻時間10秒將此樹脂組成物進行射出成形，而射出成形為上述之條狀樣品。Using the same injection molding machine as that of the user of Example 1, the resin composition was injection-molded at a cylinder temperature of 270 ° C, a mold temperature of 80 ° C, an injection time of 20 seconds, and a cooling time of 10 seconds, and the injection molding was carried out as described above. Strip sample.

其評估結果如表4所示。在進行混練及射出成形操作時，未觀測到有揮發氣體產生。The evaluation results are shown in Table 4. No volatilization gas was observed during the kneading and injection molding operations.

(實施例39至56，比較例27至40)(Examples 39 to 56, Comparative Examples 27 to 40)

與實施例38相比，將熱塑性樹脂(A)、導熱性填充材(B1)、二聚酸系熱塑性樹脂(C2)、其他填充材、其他可塑劑分別變更為如表4所示之種類與量。除此之外，其餘與實施例38同樣進行，而得到樹脂組成物。將此樹脂組成物進行射出成形，並測定各種物性。此時，從中途開始藉由側面進料機供給纖維狀填充劑，並由主進料斗供給除此之外之填充材後，實施熔融混練。The thermoplastic resin (A), the thermally conductive filler (B1), the dimer acid-based thermoplastic resin (C2), other fillers, and other plasticizers were changed to the types shown in Table 4, respectively, as compared with Example 38. the amount. Otherwise, the same procedure as in Example 38 was carried out to obtain a resin composition. This resin composition was injection-molded, and various physical properties were measured. At this time, the fibrous filler is supplied from the side feeder from the middle, and the other filler is supplied from the main hopper, and then melt-kneading is performed.

實施例38至46、比較例27至34之評估結果如表4所示，實施例47至56、比較例35至40之評估結果如表5。The evaluation results of Examples 38 to 46 and Comparative Examples 27 to 34 are shown in Table 4, and the evaluation results of Examples 47 to 56 and Comparative Examples 35 to 40 are shown in Table 5.

實施例38至56由於二聚酸系熱塑性樹脂(C2)發揮做為可塑劑之機能，故MFR值大而成形性優良。相對地，比較例27至30及比較例32至40由於未調配二聚酸系熱塑性樹脂(C2)或調配量過少，故相較於二聚酸系熱塑性樹脂(C2)之調配量為適當量且其他條件相同的各實施例，MFR值較小，而成形性較差。特別是，實施例44至46及比較例32至34皆為調配有大量的填充材(B)者，但實施例44至46係因調配預定量之二聚酸系熱塑性樹脂(C2)，而可較比較例32至34更使成形溫度降低。比較例31係調配市售之可塑劑者。此時，雖然MFR值高而成形性優良，但在進行熔融混練時可塑劑揮發，且成形體之機械性能較實施例更差。In Examples 38 to 56, since the dimer acid-based thermoplastic resin (C2) functions as a plasticizer, the MFR value is large and the formability is excellent. On the other hand, in Comparative Examples 27 to 30 and Comparative Examples 32 to 40, since the dimer acid-based thermoplastic resin (C2) was not blended or the blending amount was too small, the amount of the dimer acid-based thermoplastic resin (C2) was appropriately adjusted. In other embodiments, the other conditions are the same, the MFR value is small, and the formability is poor. In particular, Examples 44 to 46 and Comparative Examples 32 to 34 were all formulated with a large amount of filler (B), but Examples 44 to 46 were formulated with a predetermined amount of dimer acid-based thermoplastic resin (C2). The forming temperature can be lowered more than Comparative Examples 32 to 34. Comparative Example 31 was formulated with a commercially available plasticizer. At this time, although the MFR value is high and the moldability is excellent, the plasticizer volatilizes during melt-kneading, and the mechanical properties of the molded body are worse than those of the examples.

Claims (12)

一種樹脂組成物，係含有熱塑性樹脂(A)、填充材(B)、及預定量之熔融黏度降低劑(C)，前述預定量之熔融黏度降低劑(C)係下述(a)及(b)之任一者：(a)熔融黏度降低劑(C)係多官能性烯丙基化合物(C1)，且相對於熱塑性樹脂(A)與填充材(B)之合計100質量份，多官能性烯丙基化合物(C1)之含量係3至20質量份；(b)熔融黏度降低劑(C)係二聚酸系熱塑性樹脂(C2)，且相對於熱塑性樹脂(A)與填充材(B)之合計100體積份，二聚酸系熱塑性樹脂(C2)之含量係10至45體積份。 A resin composition comprising a thermoplastic resin (A), a filler (B), and a predetermined amount of a melt viscosity reducing agent (C), wherein the predetermined amount of the melt viscosity reducing agent (C) is as follows (a) and ( (b) Any one of (a) the melt viscosity reducing agent (C) is a polyfunctional allyl compound (C1), and is 100 parts by mass or more based on the total of the thermoplastic resin (A) and the filler (B). The content of the functional allyl compound (C1) is 3 to 20 parts by mass; (b) the melt viscosity reducing agent (C) is a dimer acid-based thermoplastic resin (C2), and is relative to the thermoplastic resin (A) and the filler. The total amount of the (B) is 100 parts by volume, and the content of the dimer acid-based thermoplastic resin (C2) is 10 to 45 parts by volume. 如申請專利範圍第1項之樹脂組成物，其中，多官能性烯丙基化合物(C1)係在骨架中具有異氰脲酸酯之化合物。 The resin composition of claim 1, wherein the polyfunctional allyl compound (C1) is a compound having an isocyanurate in the skeleton. 如申請專利範圍第1項之樹脂組成物，其中，多官能性烯丙基化合物(C1)係由下述式(i)所示之一級胺化合物(D)、與具有烯丙基及環氧丙基之多官能性化合物(E)反應而得之烯丙基化合物：R-(NH2 )n (i)在此，n=1至4，R表示芳香族系或脂肪族系之取代基。The resin composition of claim 1, wherein the polyfunctional allyl compound (C1) is a one-stage amine compound (D) represented by the following formula (i), and has an allyl group and an epoxy group. An allyl compound obtained by reacting a polyfunctional compound (E) of propyl: R-(NH 2 ) n (i) Here, n = 1 to 4, and R represents an aromatic or aliphatic substituent. . 如申請專利範圍第3項之樹脂組成物，其中，具有烯丙基及環氧丙基之多官能性化合物(E)係在骨架中具有異氰脲酸酯之化合物。 The resin composition of claim 3, wherein the polyfunctional compound (E) having an allyl group and a glycidyl group is a compound having an isocyanurate in a skeleton. 如申請專利範圍第2項或第4項之樹脂組成物，其中， 在骨架中具有異氰脲酸酯之化合物係單環氧丙基二烯丙基異氰脲酸酯。 For example, the resin composition of claim 2 or 4, wherein The compound having isocyanurate in the skeleton is monoepoxypropyl diallyl isocyanurate. 如申請專利範圍第1項之樹脂組成物，其中，二聚酸系熱塑性樹脂(C2)係聚醯胺樹脂及/或聚酯樹脂。 The resin composition of the first aspect of the invention, wherein the dimer acid-based thermoplastic resin (C2) is a polyamide resin and/or a polyester resin. 如申請專利範圍第1項之樹脂組成物，其中，填充材(B)係具有10W/(m．K)以上之導熱率之導熱性填充材(B1)。 The resin composition of the first aspect of the invention, wherein the filler (B) is a thermally conductive filler (B1) having a thermal conductivity of 10 W/(m.K) or more. 如申請專利範圍第7項之樹脂組成物，其中，熱塑性樹脂(A)與導熱性填充材(B1)之體積比(A/B1)係20/80至95/5。 The resin composition of claim 7, wherein the volume ratio (A/B1) of the thermoplastic resin (A) to the thermally conductive filler (B1) is 20/80 to 95/5. 如申請專利範圍第7項之樹脂組成物，其中，導熱性填充材(B1)係從平均粒徑為1至300μm之鱗片狀石墨、平均纖維徑為1至30μm且平均纖維長為1至20mm之石墨化碳纖維、具有六方晶系結晶構造之平均粒徑為1至200μm之鱗片狀氮化硼、平均粒徑為0.5至150μm之氧化鋁、平均粒徑為0.5至150μm之氧化鎂、平均粒徑為0.5至150μm之碳酸鎂、及平均粒徑為0.5至150μm之氧化鋅中選出之至少一種。 The resin composition of claim 7, wherein the thermally conductive filler (B1) is a flaky graphite having an average particle diameter of from 1 to 300 μm, an average fiber diameter of from 1 to 30 μm, and an average fiber length of from 1 to 20 mm. Graphitized carbon fiber, scaly boron nitride having a hexagonal crystal structure having an average particle diameter of 1 to 200 μm, alumina having an average particle diameter of 0.5 to 150 μm, magnesium oxide having an average particle diameter of 0.5 to 150 μm, and an average particle size At least one selected from the group consisting of magnesium carbonate having a diameter of 0.5 to 150 μm and zinc oxide having an average particle diameter of 0.5 to 150 μm. 如申請專利範圍第1項之樹脂組成物，其中，熱塑性樹脂(A)係聚醯胺樹脂。 The resin composition of claim 1, wherein the thermoplastic resin (A) is a polyamide resin. 一種成形體，係將申請專利範圍第1項至第10項中任一項之樹脂組成物成形而得者。 A molded article obtained by molding the resin composition according to any one of claims 1 to 10. 一種成形體，係將申請專利範圍第1項至第10項中任一項之樹脂組成物成形後照射放射線而得者。A molded article obtained by molding a resin composition according to any one of claims 1 to 10 and irradiating radiation.
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