TWI466744B - Electroplated diamond wire manufacturing equipment - Google Patents
Electroplated diamond wire manufacturing equipment Download PDFInfo
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- TWI466744B TWI466744B TW101138118A TW101138118A TWI466744B TW I466744 B TWI466744 B TW I466744B TW 101138118 A TW101138118 A TW 101138118A TW 101138118 A TW101138118 A TW 101138118A TW I466744 B TWI466744 B TW I466744B
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Description
硬脆材料具有硬度高、高脆性、耐磨耗性、耐高溫及抗氧化性，以機械性質而言是很硬但非常脆，範疇包括了各種礦物、玻璃、矽晶棒(單晶/多晶)、石英晶體、水晶、人造寶石晶體、精密陶瓷-----等，以藍寶石材料而言莫式硬度高達9，為僅次於鑽石之超高硬度材料，此電鍍鑽石線可應用於硬脆材料的加工，主要是用來晶體切割及晶棒切片之用。Hard and brittle materials have high hardness, high brittleness, wear resistance, high temperature resistance and oxidation resistance. They are very hard but very brittle in terms of mechanical properties. The category includes various minerals, glass and twin rods (single crystal/multiple Crystal), quartz crystal, crystal, artificial gemstone crystal, precision ceramic -----, etc., with sapphire material, the Mohs hardness is up to 9, which is the ultra-high hardness material after diamond. This electroplated diamond wire can be applied. The processing of hard and brittle materials is mainly used for crystal cutting and ingot slicing.
根據日本專利編號特開2010-052070及中華民國專利公開編號I291389這兩篇專利中，內文中敘述有關固定磨粒線的生產流程，第1圖是根據先前技術所描述之流程圖，生產程序經過鹼脫脂槽(3)→酸洗槽(4)→水洗槽(5)→前處理槽(6)→電鍍槽(7)→水洗槽(8)，生產機台設備為水平連續式設計，金屬線(2)從送出機(1)到捲繞機(9)，中間過程由滾輪幫忙傳輸，金屬線芯行走的方向為水平方向，專利文中提到，磨粒被固定於金屬線上的方式為，在電鍍槽直接利用電鍍法的方式，將與鍍敷層相同金屬成分(鎳)被覆磨粒(鑽石)而成之鎳被覆鑽石磨粒固定於金屬線上。According to the two patents of Japanese Patent No. 2010-052070 and the Republic of China Patent Publication No. I291389, the production flow of the fixed abrasive grain line is described in the text, and the first drawing is a flow chart according to the prior art, and the production procedure is Alkali degreasing tank (3) → pickling tank (4) → washing tank (5) → pretreatment tank (6) → plating tank (7) → washing tank (8), production machine equipment is horizontal continuous design, metal The line (2) is sent from the feeder (1) to the winding machine (9). The intermediate process is facilitated by the roller. The direction in which the metal core travels is horizontal. As mentioned in the patent, the way the abrasive grains are fixed on the metal wire is The nickel-coated diamond abrasive grains obtained by coating the abrasive grains (diamonds) with the same metal component (nickel) as the plating layer are fixed to the metal wires by electroplating.
本發明垂直複合電鍍設備，屬於垂直式設計，可連續式生產，屬於多功能性槽體設計，此設備提供更容易去製備電鍍鑽石線，使用此設備可以高速且穩定地生產，為高密度且均勻分散的電鍍鑽石線，且線體具有晶體切割、晶棒切片之能力。The vertical composite electroplating device of the invention belongs to a vertical design and can be continuously produced, and belongs to a multifunctional tank design. The device provides an easier preparation of an electroplated diamond wire, and the device can be produced at a high speed and stably, and is high-density and Uniformly dispersed electroplated diamond wire, and the wire body has the ability of crystal cutting and ingot slicing.
本發明的垂直電鍍複合設備由下列幾個組件所構成：The vertical electroplating composite device of the present invention is composed of the following components:
1.磁化裝置Magnetizing device
2.防漏裝置2. Leakproof device
3.鑽石吸附區域3. Diamond adsorption area
4.鑽石溶液注入裝置4. Diamond solution injection device
5.鑽石循環槽5. Diamond circulation tank
6.電鍍包覆區域6. Electroplated coated area
7.金屬線傳輸裝置7. Metal wire transmission device
以下將針對上述發明組件之功能加以詳細說明The functions of the above inventive components will be described in detail below.
1.磁化裝置：使用磁化裝置將金屬線磁化，讓金屬線芯本體(含表面)具有磁性，裝置可使用電磁鐵或永久磁鐵，並無特別限制使用何種磁化裝置，在功能上只要能使金屬線具磁性即可。1. Magnetization device: The magnetization device is used to magnetize the metal wire to make the metal wire core body (including the surface) magnetic, and the device can use an electromagnet or a permanent magnet, and there is no particular limitation on which magnetization device is used, and only functionally The metal wire can be magnetic.
2.防漏裝置：位於主結構最下方，相鄰鑽石吸附區域而設置，在鑽石吸附區域底部有設置一個防止藥液滲漏的裝置，僅可讓金屬線通過，藥液不會滲漏，多出來的空隙由膠封住，可使用矽膠、AB膠等，並無特別限制使用何種膠，功能上只要能填補多出來的空隙即可。2. Leakproof device: located at the bottom of the main structure, adjacent to the diamond adsorption area. There is a device for preventing leakage of chemical liquid at the bottom of the diamond adsorption area. Only the metal wire can pass, and the liquid will not leak. The extra gap is sealed by glue. You can use silicone rubber, AB glue, etc., and there is no special restriction on which glue to use. As long as it can fill the extra gap.
3.鑽石吸附區域：位於設備主結構下半部，內含具高磁性的鑽石磨粒與電鍍藥液，可提供適合鑽石吸附在金屬線上的附著環境。3. Diamond adsorption area: located in the lower part of the main structure of the equipment, containing high-magnetism diamond abrasive grains and electroplating liquid, which can provide an environment suitable for the adsorption of diamonds on the metal wire.
4.鑽石溶液注入裝置：位於設備主結構的中間，經由管路的傳輸，可將鑽石循環槽中的鑽石溶液，輸送到設備中間的鑽石溶液注入裝置，經由注入孔注入，利用重力的方式，由上往下沈降，在鑽石溶液注入裝置與鑽石吸附區域間均勻的分佈(位置分佈於機構的中間到下半部)。4. Diamond solution injection device: located in the middle of the main structure of the equipment, through the pipeline transmission, the diamond solution in the diamond circulation tank can be transported to the diamond solution injection device in the middle of the equipment, injected through the injection hole, using gravity, Settling from top to bottom, a uniform distribution between the diamond solution injection device and the diamond adsorption zone (position distributed in the middle to the lower half of the mechanism).
5.鑽石循環槽(具鑽石溶液攪拌循環、鑽石與電鍍液添加及槽液加熱之功能)：相鄰著設備主結構而設置，利用攪拌能將鑽石磨粒均勻的分散於電鍍藥液中，經由管路的傳輸，可將 鑽石循環槽中的鑽石溶液(鑽石磨粒與電鍍藥液混合液)，輸送至設備中間的鑽石溶液注入裝置，並可額外添加槽中所消耗的鑽石磨粒與電鍍藥液，並透過管路與泵浦的運作，可供應及回收設備主體結構內的鑽石磨粒與電鍍藥液，且具加熱之功能，可維持此循環槽與主結構槽內的溫度，在一定的範圍內。5. Diamond circulation tank (with diamond solution stirring cycle, diamond and plating solution addition and bath heating function): It is set adjacent to the main structure of the equipment, and the diamond abrasive particles are evenly dispersed in the plating solution by stirring. Through the pipeline, it can be Diamond solution in the diamond circulation tank (mixture of diamond abrasive particles and plating solution), transported to the diamond solution injection device in the middle of the device, and additional diamond abrasive particles and plating solution consumed in the tank, and through the pipeline With the operation of the pump, the diamond abrasive grains and the electroplating liquid in the main structure of the equipment can be supplied and recovered, and the heating function can maintain the temperature in the circulation tank and the main structure tank within a certain range.
6.電鍍包覆區域：內含陽極裝置與電鍍藥液，透過電鍍的機制，同時對金屬線施以鎳金屬披覆，並且將線上所吸附的鑽石電鍍包覆固定在金屬線上。6. Electroplating coating area: containing the anode device and the electroplating liquid, through the mechanism of electroplating, simultaneously applying nickel metal to the metal wire, and plating and coating the diamond adsorbed on the wire on the metal wire.
7.金屬線傳輸裝置：相鄰著設備主結構而設置，進主結構前傳輸裝置為金屬材質，傳輸裝置經通電可導電，並無特別限制為何種金屬材質，一般可選用導電率良好之材質，例如金、銀、銅等材質，重點為傳輸裝置經通電可導電，出主結構後傳輸裝置為抗藥液腐蝕材質，並無特別限制為何種材質，一般可選用鐵氟龍等材質，前後的傳輸裝置皆有張力裝置控制著，但其共同之功能為傳輸金屬線至下一製程。7. Metal wire transmission device: It is arranged adjacent to the main structure of the device. Before the main structure, the transmission device is made of metal. The transmission device can be electrically conductive through electricity. There is no special restriction on the metal material. Generally, a material with good conductivity can be selected. For example, gold, silver, copper and other materials, the focus is on the transmission device can be electrically conductive, the transmission device is resistant to chemical liquid corrosion after the main structure, and there is no special restriction on the material. Generally, Teflon and other materials can be used. The transmission devices are all controlled by tension devices, but their common function is to transfer metal wires to the next process.
金屬線由供線機到打底鎳槽，金屬線行走方向都是走水平連續式，但金屬線走到鑚石吸附及鎳電鍍槽時，金屬線行走方向變成為垂直方向，金屬線行走方向開始由上往下走，進入垂直複合電鍍設備，金屬線進入機構內的磁化裝置磁化，此時金屬線芯本體已具有磁性，方向再由下方垂直往上行走，依序進入防漏裝置與鑽石吸附區域，經由管路的傳輸，將鑽石循環槽的鑽石溶液輸送到設備中間的鑽石溶液注入裝置，經由注入孔注入鑽石溶液，利用重力的方式，由上往下沈降，在鑽石溶液注入裝置與鑽石吸附區域間均勻的分佈(分佈位置在機構的中間到下半部)，由於線芯經過磁化，利用磁力相吸的原理(用磁力作為吸附動力)，具有高磁性的鑽石可均勻分散的吸附在線的四周，當線芯走至機構中的電鍍包覆區域，位於機構的上半部，電鍍包覆區域內裝置有陽極，行走在金屬傳輸傳置的金屬線當陰極(當被鍍物)，分別接著電源 供應器正負極，可進行電鍍的程序，施以電鍍的工法，同時對金屬線施以鎳金屬披覆，並且將線上所吸附的鑽石電鍍包覆固定在金屬線上。The wire runs from the wire feeder to the bottom nickel slot. The metal wire travels in a horizontal continuous direction. However, when the wire goes to the meteorite adsorption and nickel plating tank, the metal wire travel direction becomes vertical, and the wire travel direction. Beginning from the top to the bottom, entering the vertical composite plating equipment, the metal wire enters the magnetization device in the mechanism to magnetize. At this time, the metal wire core body has magnetic force, and the direction is further vertically moved upward from below, and sequentially enters the leakage preventing device and the diamond. The adsorption area, through the pipeline transmission, transports the diamond solution of the diamond circulation tank to the diamond solution injection device in the middle of the device, injects the diamond solution through the injection hole, and settles from the top to the bottom by gravity, in the diamond solution injection device and Uniform distribution of diamond adsorption zones (distribution position in the middle to the lower half of the mechanism), due to the magnetization of the core, the principle of magnetic attraction (using magnetic force as the adsorption power), the diamond with high magnetic properties can be uniformly dispersed. Around the line, when the core goes to the plating area in the mechanism, it is located in the upper part of the mechanism, and the device in the plating area is yang. Extremely, the metal wire that travels in the metal transmission is the cathode (when the object is plated), and then the power source The positive and negative electrodes of the supplier can be electroplated, and the plating method is applied. At the same time, the metal wire is coated with nickel metal, and the diamond adsorbed on the wire is plated and fixed on the metal wire.
此設備屬於垂直複合式設計，在機台的能力上兼具多樣功能性，此設備不僅將鑽石吸附住，並且將鑽石電鍍包覆起來，經過電鍍的程序，線上所附著的鑽石經過滾輪傳輸完全不會脫落，具佔地面積小，節省機台建置成本，生產長度不受高度限制，比水平連續式設備而言產出大幅增加。由於設備槽體設計不需太大，可節省藥水的損耗。This equipment is a vertical composite design, which has a variety of functions in the machine's ability. This equipment not only absorbs the diamond, but also encapsulates the diamond. After the electroplating process, the diamond attached to the line is completely transported by the roller. It does not fall off, has a small footprint, saves the cost of machine construction, and the production length is not limited by height. The output is greatly increased compared with horizontal continuous equipment. Since the design of the device tank is not too large, the loss of the syrup can be saved.
接下來將參照第2圖與第3圖更清楚地描述依據本發明某些具體實施例的電鍍鑽石線製造設備，其中在每一圖中，相同的元件被賦予相同的元件號碼，且不重複說明。Next, an electroplated diamond wire manufacturing apparatus according to some embodiments of the present invention will be more clearly described with reference to FIGS. 2 and 3, in which the same elements are given the same component numbers and are not repeated in each of the drawings. Description.
本實施例1所使用的金屬線，只要是能加以做為電鍍之功能的金屬線都可用於本實施例，並無特定限制為何種材質的金屬線，可為長尺度的鋼琴線、鎢線、銅線、鉬線等金屬線，本實施例1中所使用的金屬線芯直徑為0.12mm。The metal wire used in the first embodiment can be used in the present embodiment as long as it can be used as a plating function, and the metal wire which is not particularly limited to which material can be used is a long-length piano wire or a tungsten wire. A metal wire such as a copper wire or a molybdenum wire, and the metal wire core used in the first embodiment has a diameter of 0.12 mm.
本實施例1所選的鑽石磨粒粒徑分佈於5~10μm，鑽石磨粒表面披覆薄薄一層的金屬鎳(目的：在電鍍程序時，通電時讓鑽石具有導電性)，再將鑽石表面通磁讓鑽石具有磁性(目的：讓鑽石具有磁性容易吸附在金屬線上)，鑽石表面處理技術有CVD法、PVD法、電鍍法、浸漬法-----等，在本發明不去探討鑽石表面處理的技術，這關係到每家的生產技術。The diamond abrasive particles selected in the first embodiment have a particle size distribution of 5 to 10 μm, and the surface of the diamond abrasive grains is coated with a thin layer of metallic nickel (purpose: in the electroplating process, the diamond is electrically conductive when energized), and then the diamond The surface magnetic flux makes the diamond magnetic (the purpose is to make the diamond magnetically easy to adsorb on the metal wire), and the diamond surface treatment technology includes CVD method, PVD method, electroplating method, dipping method, etc., etc., which is not discussed in the present invention. Diamond surface treatment technology, which is related to each production technology.
熱脫脂槽使用含有介面活性劑的鹼性清潔劑，目的是清除金屬線表層上的油脂(污)，每一家所生產清潔劑的成份及操作條件不盡相同，至於要選擇何種性質的清潔劑(酸性或鹼性)？只要在功能上能去除金屬線上的油漬就可以。The thermal degreasing tank uses an alkaline cleaner containing a surfactant to remove grease (soil) on the surface of the wire. The composition and operating conditions of each cleaner are different. As for the nature of cleaning. Agent (acidic or alkaline)? As long as it can functionally remove the oil stains on the metal wire.
酸洗槽(表面蝕刻槽)：使用鹽酸來酸洗金屬線的表面，目的 是清除金屬線上的輕氧化物及表面粗化，讓金屬線在電鍍前具有良好的表面品質。Pickling tank (surface etching tank): use hydrochloric acid to pickle the surface of the metal wire, the purpose It is to remove the light oxide and surface roughening on the metal wire, so that the metal wire has good surface quality before plating.
打底鎳槽：預先在金屬線表面的鍍上一層鎳，目的是增加金屬線與後續製程的電鍍鎳兩者間相互的結合力，使用含有氯化鎳的電鍍液成分操作。Nickel bath: A layer of nickel is pre-plated on the surface of the metal wire to increase the bonding force between the metal wire and the electroplated nickel of the subsequent process, and is operated using a plating solution containing nickel chloride.
鑚石吸附及鎳電鍍槽：目的是利用磁力相吸的原理，讓具有高磁性的鑽石可均勻分散的吸附在金屬線上，再透過電鍍的機制，將所吸附於金屬線的鑽石電鍍包覆起來，在實施例1中所使用的電鍍藥液，我們選擇的是胺基磺酸鎳系列的藥水操作，胺基磺酸鎳廣泛用來作為金屬化孔電鍍和印製插頭接觸片上的襯底鍍層。增加鍍層抗磨性，改進表面物性的處理，減低孔隙度，且具有極為優越的延展性。Vermiculite adsorption and nickel plating tank: The purpose is to use the principle of magnetic attraction, so that the diamond with high magnetic properties can be uniformly dispersed and adsorbed on the metal wire, and then the diamond adsorbed on the metal wire is electroplated and coated by the mechanism of electroplating. In the electroplating solution used in Example 1, we chose the syrup operation of the nickel sulfonate series, and the nickel sulfonate was widely used as the substrate plating on the metallized hole plating and the printed plug contact sheet. . Increased coating wear resistance, improved surface physical properties, reduced porosity, and extremely superior ductility.
水洗槽功用：位置在各藥水槽中間，例如在熱脫脂槽(13)與酸洗槽(15)中間配置一個水洗槽(14)，主要的目的用來清洗上一個藥水槽殘留在線上的藥水，以避免污染到下一個藥水槽，且為讓金屬線表面保持良好的電鍍品質，建議使用純水，水洗槽(16)、(19)及(21)功能與上述之功能一樣。The function of the washing tank: the position is in the middle of each medicine tank, for example, a water washing tank (14) is arranged between the hot degreasing tank (13) and the pickling tank (15), and the main purpose is to clean the remaining potion on the previous medicine tank. In order to avoid contamination to the next tank, and to maintain good plating quality on the surface of the wire, it is recommended to use pure water. The functions of the washing tanks (16), (19) and (21) are the same as those described above.
藉由圖2所示從供線機(10)送出直徑0.12mm的金屬線(11)，經由傳輸滾輪(12)帶動進入脫脂槽(13)，目的為清除金屬線(11)表層上的油脂(污)，再經由傳輸滾輪(12)依序進入下列步驟→水洗槽(14)清洗金屬線(11)上殘留的鹼性脫脂劑→酸洗槽(15)清除金屬線(11)上的輕氧化物及表面粗化→水洗槽(16)清洗金屬線(11)上殘留的鹽酸→打底鎳槽(17)在金屬線(11)上的預鍍一層鎳(槽體內裝置有陽極，陽極當正極，行走在導電滾輪(18)的金屬線(11)當陰極(當被鍍物)，分別接著電源供應器正負極，可進行電鍍的程序→水洗槽(19)清洗金屬線(11)上殘留的電鍍藥液→金屬線(11)行走方向開始由上垂直往下，準備進入鑚石吸附及鎳電鍍槽(20)，鑚石吸附及鎳電鍍槽所使用的垂直複合電鍍設備，設備機構組件請參照第3圖，金屬線進入機構內的磁化裝置(201)，經過磁化裝置(201) 後，此時金屬線(11)具有磁性→行走方向再由下方垂直往上依序進入防漏裝置(202)，位於機構的最下方→鑽石吸附區域(203)，位於機構的下半部，經由管路的傳輸，將鑽石循環槽(204)內的鑽石溶液輸送到設備中間的鑽石溶液注入裝置(205)(透過此步驟，可連續供應鑽石溶液到鑽石溶液注入裝置(205))，經由鑽石溶液注入裝置的單孔注入孔(205a)，單孔注入孔(205a)設計請參照第4圖，可將具磁性的鑽石溶液，在鑽石溶液注入裝置(205)與鑽石吸附區域間(203)均勻的分佈，利用磁性相吸的原理，具有高磁性的鑽石可均勻分散的吸附在線的四周→金屬線(11)繼續往上垂直行走進入電鍍包覆區域(206)，位於機構的上半部，內含陽極裝置(206a)與電鍍藥液，陽極裝置(206a)當正極，行走在金屬線傳輸傳置(207)的金屬線(11)當陰極(當被鍍物)，分別接著電源供應器正負極，可進行電鍍的程序，透過電鍍的機制，同時對金屬線施以鎳金屬披覆，並且將線上所吸附的鑽石電鍍包覆固定在金屬線上→水洗槽(21)清洗金屬線(11)上殘留的電鍍藥液→烘乾槽(22)將金屬線(11)上殘留的藥水去除→收線機(23)將所生產好的電鍍鑽石線收起。A metal wire (11) having a diameter of 0.12 mm is fed from the wire feeder (10) as shown in Fig. 2, and is driven into the degreasing tank (13) via the transfer roller (12) for the purpose of removing grease on the surface of the wire (11). (stain), and then through the transfer roller (12) sequentially into the following steps → washing tank (14) cleaning the residual degreaser on the metal wire (11) → pickling tank (15) to remove the metal wire (11) Light oxide and surface roughening→washing tank (16) cleaning the residual hydrochloric acid on the metal wire (11)→priming nickel tank (17) pre-plated nickel on the metal wire (11) (the anode is installed in the tank, When the anode is the positive electrode, the metal wire (11) of the conductive roller (18) is used as the cathode (when the object to be plated), and then the positive and negative poles of the power supply, respectively, and the plating process can be performed → the washing tank (19) cleans the metal wire (11) ) The remaining electroplating solution → metal wire (11) travels from the top to the bottom, ready to enter the vermiculite adsorption and nickel plating bath (20), the vermiculite adsorption and the vertical composite plating equipment used in the nickel plating bath. Refer to Figure 3 for the equipment mechanism components. The magnet wire enters the magnetizer (201) in the mechanism and passes through the magnetizer (201). After that, the metal wire (11) has a magnetic→walking direction and then enters the leakage preventing device (202) sequentially from the bottom to the top, and is located at the lowermost portion of the mechanism→the diamond adsorption region (203), which is located in the lower half of the mechanism. The diamond solution in the diamond circulation tank (204) is conveyed to the diamond solution injection device (205) in the middle of the device via the pipeline (through this step, the diamond solution can be continuously supplied to the diamond solution injection device (205)) via The single hole injection hole (205a) of the diamond solution injection device and the single hole injection hole (205a) are designed according to Fig. 4, and the magnetic diamond solution can be placed between the diamond solution injection device (205) and the diamond adsorption region (203). Uniform distribution, using the principle of magnetic attraction, diamonds with high magnetic properties can be uniformly dispersed around the wire line → the metal wire (11) continues to walk vertically into the plating cladding area (206), located in the upper part of the mechanism a portion containing an anode device (206a) and an electroplating solution, the anode device (206a) as a positive electrode, a metal wire (11) that travels on the wire transfer (207) as a cathode (when the object to be plated), respectively, a power source Supply positive and negative, can be electroplated The program, through the electroplating mechanism, simultaneously applies a nickel metal coating to the metal wire, and electroplates the diamond adsorbed on the wire to the metal wire→washing tank (21) to clean the plating solution remaining on the metal wire (11) → The drying tank (22) removes the residual syrup on the metal wire (11) → the wire take-up machine (23) retracts the produced electroplated diamond wire.
經本實施例1所生產的電鍍鑽石線請參照第5圖，最後金屬線(24)與鑽石磨粒(25)披覆著金屬鎳層(26)，為高密度且均勻分散的電鍍鑽石線，且線體具有晶體切割、晶棒切片之能力。Referring to Figure 5, the electroplated diamond wire produced in the first embodiment, the metal wire (24) and the diamond abrasive grain (25) are covered with a metallic nickel layer (26), which is a high-density and uniformly dispersed electroplated diamond wire. And the wire body has the ability of crystal cutting and ingot slicing.
實施例2使用金屬線線芯直徑0.35mm與本發明實施例1之做為電鍍之功能效果相同。The second embodiment uses the metal wire core diameter of 0.35 mm to have the same functional effect as the electroplating of the first embodiment of the present invention.
實施例3使用金屬線線芯直徑含0.8mm以下與本發明實施例1之做為電鍍之功能效果相同。The use of the metal wire core diameter of 0.8 mm or less in the embodiment 3 is the same as that of the first embodiment of the present invention.
實施例4使用鑽石粒徑10~20μm(表面披覆著薄薄一層的金屬鎳，鑽石表面有磁性)與本發明實施例1之鑽石磨粒吸附在金屬線上效果相同。In Example 4, the use of a diamond having a particle size of 10 to 20 μm (the surface is coated with a thin layer of metallic nickel, the surface of the diamond is magnetic) has the same effect as the diamond abrasive particles of the first embodiment of the present invention adsorbed on the metal wire.
實施例5使用鑽石粒徑含100μm以下(表面披覆著薄薄一層的金屬鎳，鑽石表面有磁性)與本發明實施例1之鑽石磨粒吸 附在金屬線上效果相同。Example 5 uses a diamond particle size of 100 μm or less (the surface is covered with a thin layer of metallic nickel, the surface of the diamond is magnetic) and the diamond abrasive grain of the first embodiment of the present invention Attached to the metal wire has the same effect.
實施例6鑽石表面所披覆著薄薄一層的金屬鎳，所增重的金屬鎳重量含75%以下與本發明實施例1之鑽石電鍍包覆固定在金屬線上之能力效果相同。The surface of the diamond of the embodiment 6 is covered with a thin layer of metallic nickel, and the weight of the weightened metallic nickel is 75% or less. The effect of the diamond plating coating of the first embodiment of the present invention is the same on the metal wire.
實施例7電鍍藥液使用含鎳離子成分的系列藥液與本發明實施例1之施以鎳金屬披覆效果相同。In the electroplating solution of Example 7, the series of chemical solutions containing the nickel ion component was the same as the nickel metal coating effect of the first embodiment of the present invention.
實施例8鑽石循環槽與設備中間鑽石溶液注入裝置間的管路傳輸，不管是單管或者多管傳輸與本發明實施例1之鑽石循環效果相同。The pipe transfer between the diamond circulation tank and the middle diamond solution injection device of the apparatus, whether single or multi-tube transfer, has the same effect as the diamond cycle of the first embodiment of the present invention.
實施例9設備中間的鑽石溶液注入裝置，注入裝置的注入孔設計，為多孔注入(205b)請參照第4圖，比本發明實施例1之鑽石分散效果更好。In the embodiment 9, the diamond solution injection device in the middle of the device, the injection hole design of the injection device, and the porous injection (205b), refer to FIG. 4, which is better than the diamond dispersion effect of the first embodiment of the present invention.
實施例10設備中間的鑽石溶液注入裝置，注入裝置含有葉片旋轉的裝置(205c)請參照第4圖，與本發明實施例9之多孔注入效果相同。The diamond solution injection device in the middle of the apparatus of the embodiment 10, the injection device including the device for rotating the blade (205c), please refer to Fig. 4, which is the same as the porous injection effect of the embodiment 9 of the present invention.
實施例11可在機構中電鍍包覆區域之後再多加一個電鍍包覆區域，與本發明實施例1之對金屬線施以鎳金屬披覆以及將鑽石包覆固定於金屬線效果相同。In the embodiment 11, an electroplated coating region can be further added after plating the cladding region in the mechanism, and the effect of applying the nickel metal coating to the metal wire of the first embodiment of the invention and fixing the diamond to the metal wire is the same.
1‧‧‧送出機1‧‧‧ delivery machine
2‧‧‧金屬線2‧‧‧Metal wire
3‧‧‧鹼脫脂槽3‧‧‧ Alkaline degreasing tank
4‧‧‧鋼琴線4‧‧‧ piano line
5,8,14,16,19,21‧‧‧水洗槽5,8,14,16,19,21‧‧‧washing tank
6‧‧‧前處理槽6‧‧‧Pretreatment tank
7‧‧‧電鍍槽7‧‧‧ plating bath
9‧‧‧捲線機9‧‧‧Winding machine
10‧‧‧供線機10‧‧‧Wire feeder
11‧‧‧金屬線11‧‧‧Metal wire
12‧‧‧傳輸滾輪12‧‧‧Transfer wheel
13‧‧‧脫脂槽13‧‧‧ Degreasing tank
15‧‧‧酸洗槽15‧‧‧ Pickling tank
17‧‧‧打底鎳槽17‧‧‧Bottom nickel tank
18‧‧‧導電滾輪18‧‧‧Electrical roller
20‧‧‧鑚石吸附及鎳電鍍槽20‧‧‧Vermiculite adsorption and nickel plating bath
22‧‧‧烘乾22‧‧‧Drying
23‧‧‧收線機23‧‧‧Wire machine
201‧‧‧磁化裝置201‧‧‧Magnetization device
202‧‧‧防漏裝置202‧‧‧ leakproof device
203‧‧‧鑽石吸附區域203‧‧‧Diamond adsorption area
204‧‧‧鑽石循環槽204‧‧‧Diamond Circulation Slot
205‧‧‧鑽石溶液注入裝置205‧‧‧Diamond solution injection device
24‧‧‧金屬線24‧‧‧Metal wire
25‧‧‧鑽石磨粒25‧‧‧Diamond Abrasives
26‧‧‧金屬鎳層26‧‧‧Metal nickel layer
205a‧‧‧單孔注入205a‧‧‧ single hole injection
205b‧‧‧多孔注入205b‧‧‧Porous injection
205c‧‧‧葉片旋轉的裝置205c‧‧‧Rolling device
206‧‧‧電鍍包覆區域206‧‧‧Electroplating area
206a‧‧‧陽極裝置206a‧‧‧Anode device
207‧‧‧金屬線傳輸裝置207‧‧‧Metal wire transmission device
第1圖是根據先前技術所描述生產固定磨粒線之流程圖。Figure 1 is a flow diagram for producing a fixed abrasive grain line as described in the prior art.
圖2生產本發明生產固定磨粒式電鍍鑽石線之流程圖。Figure 2 is a flow chart showing the production of a fixed abrasive-type electroplated diamond wire of the present invention.
圖3本發明垂直複合電鍍設備裝置機構組件圖。Fig. 3 is a structural diagram of the mechanism of the vertical composite plating apparatus of the present invention.
圖4經本發明垂直複合電鍍設備生產的電鍍鑽石線Figure 4 is an electroplated diamond line produced by the vertical composite plating apparatus of the present invention.
圖5鑽石溶液注入裝置注入孔及旋轉裝置設計圖。Fig. 5 is a plan view of the injection hole and the rotating device of the diamond solution injection device.
201‧‧‧磁化裝置201‧‧‧Magnetization device
202‧‧‧防漏裝置202‧‧‧ leakproof device
203‧‧‧鑽石吸附區域203‧‧‧Diamond adsorption area
204‧‧‧鑽石循環槽204‧‧‧Diamond Circulation Slot
205‧‧‧鑽石溶液注入裝置205‧‧‧Diamond solution injection device
206‧‧‧電鍍包覆區域206‧‧‧Electroplating area
206a‧‧‧陽極裝置206a‧‧‧Anode device
207‧‧‧金屬線傳輸裝置207‧‧‧Metal wire transmission device
Claims (13)
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|---|---|---|---|
| TW101138118A TWI466744B (en) | 2012-10-16 | 2012-10-16 | Electroplated diamond wire manufacturing equipment |
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